Wafer centering device

Abstract

The utility model relates to wafer thinning technical field, specifically disclose wafer centering device. The device is used for processing the wafer with the edge having the mark position, including base module, movable module, camera piece and handling module, movable module is along first direction and is arranged in base module, and movable module includes wafer carrying platform, and wafer carrying platform is used for placing wafer, and wafer carrying platform can rotate around working axis, and working axis extends along vertical direction and passes through the center point of wafer carrying platform, camera piece is located above wafer carrying platform, and camera piece is used for obtaining the position information and the orientation information of mark position of wafer, handling module can carry wafer along second direction, and handling module can take and place wafer to wafer carrying platform. The device changes the positioning mode when wafer is centered, avoids the situation that wafer is subjected to extrusion, and reduces the risk of wafer damage.

Description

Technical Field

[0001] This utility model relates to the field of wafer thinning technology, and in particular to a wafer alignment device. Background Technology

[0002] A wafer is a silicon chip used in the fabrication of silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. Various circuit element structures can be fabricated on silicon wafers to create IC products with specific electrical functions. The raw material for wafers is silicon, while the Earth's crust has an inexhaustible supply of silicon dioxide. Silica ore is refined in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polycrystalline silicon.

[0003] During wafer placement, multiple processing steps are required, necessitating the transfer of wafers between different process stations using wafer transfer mechanisms. However, conventional wafer transfer mechanisms often lack sufficient precision in positioning the wafer's center point on the wafer carrier. This can lead to strong wafer swaying due to centrifugal instability as the wafer assembler rotates, resulting in uneven coating thickness on the wafer surface. Furthermore, there is a risk of the wafer being thrown off or even breaking, leading to material loss.

[0004] Therefore, high positional accuracy is required during wafer transfer, necessitating the use of wafer alignment devices to adjust the wafer's position.

[0005] like Figure 1 and Figure 2 As shown, the alignment and positioning operation of existing wafer alignment devices relies on the circular shape of the wafer and is usually achieved through mechanical limiting. The wafer alignment device has a wafer carrier platform 1, a first wafer gripper 2, a second wafer gripper 3, and a wafer gripper drive device 4. When the wafer is transferred to the wafer carrier platform 1, its position cannot be guaranteed due to mechanical transfer errors and sliding errors during placement. At this time, the first wafer gripper 2 and the second wafer gripper 3 move closer to each other under the drive of the wafer gripper drive device 4, limiting the wafer into the groove of the wafer gripper, achieving precise wafer positioning, and then waiting for the wafer transfer mechanism to remove the wafer. The wafer gripper drive device 4 can be driven by a cylinder or a motor. However, regardless of whether it is a cylinder or a motor, the first wafer gripper 2 and the second wafer gripper 3 will inevitably come into contact with and squeeze the wafer during the wafer positioning process, posing a risk of wafer wear, scratches, and breakage. Utility Model Content

[0006] The purpose of this invention is to provide a wafer alignment device that changes the positioning method of the wafer during alignment operations, avoids the wafer being squeezed, and reduces the risk of wafer damage.

[0007] To achieve this objective, the present invention adopts the following technical solution:

[0008] A wafer alignment device is used to position a wafer, the wafer having marked edges. The wafer alignment device includes a base module, a movable module, a camera, and a transport module. The movable module is movably mounted on the base module along a first direction. The movable module includes a wafer carrier platform for placing the wafer and is rotatable about a working axis extending vertically and passing through the center point of the wafer carrier platform. The camera is located above the wafer carrier platform and is used to acquire the position information of the wafer and the orientation information of the marked edges. The transport module can transport the wafer along a second direction and can pick up and place the wafer onto the wafer carrier platform. The first direction and the second direction are both horizontal and perpendicular to each other.

[0009] As an optional technical solution for the wafer alignment device, the base module includes a substrate, a mounting base plate, and a leveling screw. The movable module is movably connected to the mounting base plate, the mounting base plate overlaps the substrate, and the leveling screw connects the mounting base plate and the substrate, and is threadedly connected to one of the mounting base plate and the substrate. The leveling screw is used to adjust the gap between the mounting base plate and the substrate at the location where the leveling screw is set.

[0010] As an optional technical solution for the wafer alignment device, the active module further includes a rotary drive assembly, which includes a drive component and a reducer; the output end of the drive component is connected to the input end of the reducer, and the output end of the reducer is connected to the wafer carrier platform.

[0011] As an optional technical solution for the wafer alignment device, the moving module further includes a translation drive assembly, which includes a lead screw and a nut; the lead screw is rotatably mounted on the base module along its own axis; the nut is threadedly connected to the lead screw and fixedly connected to the reducer.

[0012] As an optional technical solution for the wafer alignment device, the base module also includes an adapter plate, which is connected to the housing of the reducer, and the lead screw is rotatably mounted on the adapter plate along its own axis.

[0013] As an optional technical solution for the wafer alignment device, the base module is equipped with a wafer detection sensor, which is used to detect whether a wafer is being carried on the wafer carrier platform.

[0014] As an optional technical solution for the wafer alignment device, the base module is provided with a brightness enhancement plate, which is used to enhance the brightness of the wafer carrier platform.

[0015] As an optional technical solution for the wafer alignment device, a guide groove is provided through the mounting base plate, through which the movable module passes. The guide groove is used to limit the movement path of the movable module.

[0016] As an optional technical solution for the wafer alignment device, the wafer carrier platform includes a vacuum chuck with an adsorption carrier surface at its top. The adsorption carrier surface is located in a horizontal plane, and the vacuum chuck can adsorb the wafer located on the adsorption carrier surface.

[0017] As an optional technical solution for the wafer alignment device, the wafer carrier platform further includes a ventilation shaft. The vacuum chuck has a gas chamber, and the top of the vacuum chuck is provided with a suction hole that connects the gas chamber to the external environment. One end of the ventilation shaft is connected to the bottom end of the vacuum chuck, and the other end is provided with a connecting connector. The connecting connector is used to connect a vacuum pump. The vacuum pump is connected to the gas chamber through the ventilation shaft. The vacuum pump is used to input a vacuum negative pressure or positive pressure and adsorb the wafer through the suction hole.

[0018] The beneficial effects of this utility model are:

[0019] This wafer alignment device incorporates a camera to acquire the wafer's position and the orientation of its markers, mitigating the impact of transmission errors and achieving accurate wafer positioning. The moving module has a relative base module movement function, enabling selective positioning, precise rotation, and displacement of the wafer in a first direction. The wafer carrier platform has rotational capabilities and the ability to selectively position the wafer, while the transport module can transport the wafer along a second direction. During wafer positioning, the camera acquires the wafer's current position in real time; the moving module is controlled to move along the first direction to achieve wafer positioning in that direction; the wafer carrier platform is controlled to rotate around its working axis to achieve phase angle positioning of the wafer's markers; the transport module transports the wafer along the second direction, and during this process, it compensates for the wafer's position in the second direction, ultimately ensuring the wafer is precisely moved to the processing position. The above structure changes the way the wafer is positioned during alignment operations. When positioning the wafer, the movement of the wafer carrier platform is directly controlled. When the wafer carrier platform moves the wafer, no external components will squeeze the wafer, thus avoiding the situation where the wafer is squeezed and reducing the risk of wafer damage. Attached Figure Description

[0020] Figure 1 This is a top view of an existing wafer alignment device;

[0021] Figure 2 This is a side view of an existing wafer alignment device;

[0022] Figure 3 This is a top view of an existing wafer with flat edges;

[0023] Figure 4 This is a top view of an existing wafer with a Notch port;

[0024] Figure 5 This is a top view of the wafer alignment device provided in this embodiment of the present invention;

[0025] Figure 6 This is a side view of the wafer alignment device provided in an embodiment of the present invention;

[0026] Figure 7 This is a top view of the wafer alignment device and the wafer in the first state provided in this embodiment of the present invention;

[0027] Figure 8 This is a top view of the wafer alignment device and the wafer in the second state provided in this embodiment of the present invention;

[0028] Figure 9 This is a top view of the wafer alignment device and the wafer in the third state provided in this embodiment of the present invention;

[0029] Figure 10 This is a top view of the wafer alignment device and the wafer in the fourth state provided in this embodiment of the present invention.

[0030] Figure 1 and Figure 2 middle:

[0031] 1. Wafer carrier platform; 2. First wafer gripper; 3. Second wafer gripper; 4. Wafer gripper drive device;

[0032] Figures 3 to 10 middle:

[0033] Y, first direction; X, second direction;

[0034] 51. Mounting base plate; 52. Leveling screws; 53. Wafer inspection sensor; 54. Zero-position sensor; 55. Wafer carrier platform; 56. Brightness enhancement plate; 57. Substrate; 58. Reducer; 59. Drive unit; 510. Connecting connector; 511. Adapter plate; 512. Translation drive assembly; 513. Vent shaft; 514. Camera unit;

[0035] 6. Target point; 7. Wafer; 8. Trajectory line; 9. Marker bit. Detailed Implementation

[0036] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0037] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions. Moreover, "above," "on top of," and "over" the first feature in relation to the second feature includes the first feature directly above and diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "under," and "below" the first feature in relation to the second feature includes the first feature directly below and diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0038] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0039] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0040] like Figure 3 and Figure 4 As shown, in the prior art, based on considerations of the wafer 7 manufacturing process, a marker bit 9 is set on the edge of wafer 7. The marker bit 9 is usually set to... Figure 3 Flat edge or Figure 4 The Notch port in the middle. Combined with... Figure 3and Figure 4 It is easy to see that the positioning of wafer 7 is affected by three parameters: the coordinates in the first direction Y, the coordinates in the second direction X, and the phase angle of the marker 9. The phase angle of the marker 9 is the angle between the marker 9 and the X-axis.

[0041] like Figures 5 to 10 As shown, this embodiment provides a wafer alignment device for positioning a wafer 7. The edge of the wafer 7 has a marking position 9. The wafer alignment device includes a base module, a movable module, a camera 514, and a transport module. The movable module is movably disposed on the base module along the first direction Y. The movable module includes a wafer carrier platform 55, which is used to place the wafer 7. The wafer carrier platform 55 can rotate around a working axis, which extends vertically and passes through the center point of the wafer carrier platform 55. The camera 514 is located above the wafer carrier platform 55 and is used to acquire the position information of the wafer 7 and the orientation information of the marking position 9. The transport module can transport the wafer 7 along the second direction X and can pick up and place the wafer 7 onto the wafer carrier platform 55. The first direction Y and the second direction X are both horizontal and perpendicular to each other.

[0042] This wafer alignment device, by introducing a camera 514, acquires the position information of wafer 7 and the orientation information of marker 9, avoiding the influence of transmission error factors and achieving accurate positioning of wafer 7. The moving module has a relative base module movement function, enabling selective positioning, precise rotation, and displacement of wafer 7 in the first direction Y. The wafer carrier platform 55 has rotation function and the ability to selectively position wafer 7, and the transport module can transport wafer 7 along the second direction X. When positioning wafer 7, the camera 514 can acquire the current position of wafer 7 in real time; control the moving module to move along the first direction Y to achieve positioning of wafer 7 in the first direction Y; control the wafer carrier platform 55 to rotate around the working axis to achieve positioning of the phase angle of marker 9 on wafer 7; the transport module transports wafer 7 along the second direction X, and the transport module can compensate for the position of wafer 7 in the second direction X when transporting along the second direction X, ultimately enabling wafer 7 to be accurately moved to the processing position. The above structure changes the positioning method of wafer 7 during centering operation. When positioning wafer 7, the wafer carrier platform 55 is directly controlled to move. When the wafer carrier platform 55 moves wafer 7, no external components will squeeze wafer 7, avoiding the situation where wafer 7 is squeezed and reducing the risk of wafer 7 being damaged.

[0043] By combining the design of the camera 514, the active module, and the wafer carrier platform 55, the position information of the wafer 7 and the marker 9 can be accurately acquired, and the position of the wafer 7 and the orientation of the marker 9 on the wafer 7 can be flexibly adjusted to complete the precise alignment operation of the wafer 7. This improves the accuracy and efficiency of wafer 7 alignment and reduces the difficulty of operation. Furthermore, the design of the handling module facilitates displacement compensation of the wafer 7 in the second direction X, enabling the output of the corresponding wafer 7 according to the expected coordinates in the first direction Y, the second direction X, and the phase angle of the marker 9. The camera 514, positioned above the wafer carrier platform 55, ensures a clear viewing angle, facilitating accurate observation and identification of the wafer 7 and the marker 9, and improving the accuracy of wafer 7 positioning. It also enables high-definition, high-precision positioning of the wafer 7 to obtain clear images of the wafer 7, ensuring the accuracy and reliability of the entire processing process. Furthermore, since both the first direction Y and the second direction X are located in the horizontal plane, precise movement of wafer 7 within the horizontal plane is achieved. This results in a compact structure and convenient operation of the wafer alignment device, characterized by high precision, high efficiency, and high stability, significantly improving the flexibility of the wafer alignment device. These improvements enable the wafer alignment device to complete the alignment operation of wafer 7 based on adsorption positioning, and to perform directional decomposition and compensation for its errors, thereby improving the positioning accuracy of wafer 7 and expanding the compensation range for wafer 7 offset. Simultaneously, the above structural design simplifies the structure of the wafer alignment device, improves overall working efficiency and reliability, ensures the convenience of alignment operations, and enhances the overall stability and efficiency of operation.

[0044] In this embodiment, the wafer carrier platform 55 includes a vacuum chuck with an adsorption carrier surface at its top. The adsorption carrier surface is located in a horizontal plane, and the vacuum chuck can adsorb the wafer 7 located on the adsorption carrier surface.

[0045] The wafer carrier platform 55 employs a vacuum chuck design to ensure the stability and reliability of the wafer 7 during processing. The top adsorption surface of the vacuum chuck is positioned within a horizontal plane, allowing the wafer 7 to be stably adsorbed within this plane. This ensures the stability and flatness of the wafer 7 during transport, facilitating smooth handling. In other embodiments of this example, a porous ceramic chuck is used instead of a vacuum chuck.

[0046] Furthermore, the wafer carrier platform 55 also includes a ventilation shaft 513. The vacuum chuck has a gas chamber and a suction hole at the top of the vacuum chuck, which connects the gas chamber to the external environment. One end of the ventilation shaft 513 is connected to the bottom of the vacuum chuck, and the other end is provided with a connector 510. The connector 510 is used to connect a vacuum pump. The vacuum pump is connected to the gas chamber through the ventilation shaft 513. The vacuum pump is used to input vacuum negative pressure or positive pressure and adsorb the wafer 7 through the suction hole.

[0047] The design of the ventilation shaft 513 and the connecting joint 510 enables the connection between the vacuum suction cup and the air extraction equipment, realizes the positive and negative pressure control of the vacuum suction cup, achieves the purpose of adsorbing and releasing the wafer 7, and improves the stability and reliability of the wafer 7.

[0048] In this embodiment, the connecting joint 510 is a rotary joint. In other embodiments of this embodiment, the connecting joint 510 is a swivel joint.

[0049] See Figures 6 to 10 In this embodiment, the base module includes a base plate 57, a mounting base plate 51, and a leveling screw 52. The movable module is movably connected to the mounting base plate 51. The mounting base plate 51 overlaps the base plate 57. The leveling screw 52 connects the mounting base plate 51 and the base plate 57 and is threadedly connected to one of the mounting base plate 51 and the base plate 57. The leveling screw 52 is used to adjust the gap between the mounting base plate 51 and the base plate 57 at the location where the leveling screw 52 is set. Specifically, the base plate 57 is fixed in position relative to the ground.

[0050] The base module's substrate 57 and mounting base plate 51 are designed together with leveling screws 52 to allow the movable module to be movably connected. The gap between the mounting base plate 51 and the substrate 57 can be adjusted by the leveling screws 52, so that the wafer carrier platform 55 can be level with the ground. This achieves the stability and level adjustment of the wafer alignment device, enabling the wafer alignment device to adapt to different ground conditions. It provides a reliable foundation for the alignment of wafer 7, thereby ensuring the overall stability and accuracy of the wafer alignment device.

[0051] Furthermore, a wafer detection sensor 53 is provided on the upper surface of the mounting base plate 51. The wafer detection sensor 53 is used to detect whether a wafer 7 is being carried on the wafer carrier platform 55.

[0052] By setting up a wafer detection sensor 53, it is possible to monitor in real time whether the wafer carrier platform 55 is carrying a wafer 7, thereby realizing real-time monitoring and feedback of the operating status of the wafer alignment device, improving the safety of operation and the degree of automation of the equipment, and realizing the automated and intelligent design of the wafer alignment device.

[0053] For example, a zero-position sensor 54 is provided on the upper surface of the mounting base plate 51. The zero-position sensor 54 is used to detect the circumferential zero position of the wafer carrier platform 55.

[0054] In this embodiment, a brightness enhancement plate 56 is provided on the base module, which is used to enhance the brightness of the wafer carrier platform 55.

[0055] The design of the light-enhancing plate 56 can concentrate light onto the wafer carrier platform 55, enhancing the lighting effect and providing sufficient brightness for the camera 514 to capture images. This enhances the lighting conditions of the wafer carrier platform 55, which is beneficial for the camera 514 to accurately identify the edge of the wafer 7 and the marker position 9. It also helps to improve the accuracy and clarity of the position information of the wafer 7 and the orientation information of the marker position 9 obtained by the camera 514, ensuring the accuracy of alignment.

[0056] In this embodiment, a guide groove is provided on the mounting base plate 51, through which the movable module passes. The guide groove is used to restrict the movement path of the movable module.

[0057] The guide slot design restricts the movement path of the movable module, ensuring stability and accuracy during wafer 7 handling and guaranteeing the reliability and stability of the wafer alignment device. It also facilitates the installation and maintenance of the movable module.

[0058] In this embodiment, the active module further includes a rotary drive assembly, which includes a drive element 59 and a reducer 58; the output end of the drive element 59 is connected to the input end of the reducer 58, and the output end of the reducer 58 is connected to the wafer carrier platform 55. Specifically, the drive element 59 is a motor.

[0059] By introducing a rotary drive assembly, the drive unit 59 is connected to the wafer carrier platform 55 through the output end of the reducer 58, which can precisely control the rotation speed and angle of the wafer carrier platform 55, thereby realizing the automatic rotation function of the wafer carrier platform 55. This is beneficial for accurately controlling the position and orientation of the wafer 7, thus meeting the alignment requirements at different angles and improving the accuracy and convenience of operation.

[0060] Furthermore, the active module also includes a translation drive assembly 512, which includes a lead screw and a nut; the lead screw is rotatably mounted on the base module along its own axis; the nut is threadedly connected to the lead screw and fixedly connected to the reducer 58.

[0061] The design of the translation drive assembly 512 enables the movable module to precisely transport the wafer 7 along the first direction Y, improving the flexibility and positioning accuracy of the wafer alignment device. Furthermore, the translation drive assembly 512, through the cooperation of a lead screw and nut, achieves horizontal movement of the movable module along the first direction Y, making the driving process smoother and more reliable, ensuring that the wafer 7 can be accurately moved to the designated position, and improving operational flexibility and convenience.

[0062] For example, the base module also includes an adapter plate 511, which is connected to the housing of the reducer 58, and the lead screw is rotatably mounted on the adapter plate 511 along its own axis.

[0063] The design of the adapter plate 511, translation drive assembly 512, and rotary drive assembly connects the housing of the reducer 58 to the base module, enabling the lead screw to be rotatably mounted on the base module along its own axis. The adapter plate 511 enhances the connection strength between the reducer 58 and the base module, improving the structural stability of the wafer alignment device. Simultaneously, the adapter plate 511 provides a stable mounting base for the lead screw, simplifying the installation process and facilitating subsequent maintenance. This makes the operation of the translation drive assembly 512 more stable and reliable, improving the accuracy and efficiency of wafer alignment, and enhancing the reliability and service life of the entire wafer alignment device.

[0064] Specifically, the reducer 58 is connected to the adapter plate 511; the vent shaft 513 passes through the reducer 58. In other embodiments of this example, the rotary drive assembly includes a rotary cylinder, the output end of which is connected to the wafer carrier platform 55.

[0065] This embodiment also provides a wafer alignment method applied to the above-described wafer alignment apparatus to output a wafer 7 located at a target position and having a target orientation. The wafer alignment method includes the following steps:

[0066] S1: Set the target point 6 and the target orientation angle, and determine the position of the trajectory line 8 and the target point 6. The trajectory line 8 extends along the second direction X and passes through the target point 6. The position of the target point 6 is the center position of the wafer 7 when it is located at the target position. The angle between the orientation of the mark 9 on the wafer 7 with the target orientation and the second direction X is the target orientation angle.

[0067] S2: Move wafer 7 onto wafer carrier platform 55.

[0068] S3: Determine the initial center position and initial orientation angle of wafer 7, wherein the initial center position is the current center position of wafer 7, and the initial orientation angle is the angle between the orientation of the current mark 9 on wafer 7 and the second direction X.

[0069] S4: Calculate the working rotation angle based on the target orientation angle and the initial orientation angle, and control the wafer carrier platform 55 to rotate the working rotation angle so that the wafer 7 has the target orientation.

[0070] S5: Compare the position of target point 6 with the current center position of wafer 7, calculate the first offset distance between target point 6 and the initial center position in the first direction Y, and control the wafer carrier platform 55 to move the first offset distance along the first direction Y, so that the center of wafer 7 moves to the trajectory line 8.

[0071] S6: Compare the position of target point 6 with the center position of the current wafer 7, and calculate the second offset distance between target point 6 and the center of the current wafer 7 in the second direction X.

[0072] S7: Use the second offset distance as a compensation value for moving wafer 7 in the second direction X, and move wafer 7 to the target position accordingly.

[0073] This wafer alignment method, by setting a target point 6 and a target orientation angle, and determining the trajectory line 8, precisely grasps the target parameters for the wafer 7 alignment operation, improving the alignment efficiency and accuracy of wafer 7. The working rotation angle is calculated based on the target orientation angle and the initial orientation angle, and the wafer carrier platform 55 is controlled to rotate, enabling wafer 7 to quickly and accurately reach the target orientation, thereby shortening the process flow time and improving work efficiency. By comparing the position of the target point 6 with the current center position, the offset distance in the first direction Y and the second direction X can be calculated, and the position of wafer 7 in the first direction Y can be adjusted accordingly, achieving precise adjustment of the wafer 7's position and ensuring that wafer 7 moves accurately onto the trajectory line 8. After wafer 7 is released, based on the difference between target point 6 and the current position of wafer 7, the offset distance in the second direction X is used as the compensation value for the transport module to transport wafer 7, achieving precise transfer of wafer 7 to the target position. By separating and processing the position error and phase angle error of wafer 7, and ensuring that the processing actions do not affect each other, higher positioning accuracy is achieved. Combined with the collaborative operation of the transport module and the moving module, precise movement and positioning of wafer 7 in multiple directions are completed, improving the overall efficiency of wafer 7 alignment. The above method improves the efficiency of wafer 7 alignment and reduces the risk of inaccurate wafer 7 position due to human operation or equipment errors. The above wafer alignment method can achieve high-precision positioning of wafer 7, accurately outputting wafer 7 located at the target position and with the target orientation. By determining parameters such as target point 6, target orientation angle, and trajectory line 8, as well as the orientation of the mark 9 on wafer 7 and the angle with the second direction X, wafer 7 can be accurately moved to the target position with a precise target orientation using steps such as transport, rotation, and movement. This method enables precise control and positioning of wafer 7, improving the accuracy and efficiency of wafer 7 alignment. It completes high-precision, high-efficiency, and high-safety alignment operations for wafer 7, achieving automated and efficient operation and providing important technical support for modern semiconductor manufacturing.

[0074] Specifically, after S2 is completed, the wafer alignment device and wafer 7 are in the first state, such as... Figure 6 As shown; after S3 is completed, the wafer alignment device and wafer 7 are in the second state, as shown. Figure 7 As shown; after S4 is completed, the wafer alignment device and wafer 7 are in the third state, as... Figure 8 As shown; after S5 is completed, the wafer alignment device and wafer 7 are in the fourth state, as shown. Figure 9 As shown.

[0075] In this embodiment, transporting wafer 7 to the target location includes: S71: obtaining a preset distance for transporting wafer 7 along the second direction X. S72: compensating the second offset distance to the preset distance to obtain the actual distance for transporting wafer 7 along the second direction X. S73: transporting wafer 7 to the target location along the second direction X according to the actual distance.

[0076] By calculating the working rotation angle, the wafer carrier platform 55 is rotated by the corresponding angle to ensure that the wafer 7 has the required target orientation. This step enables precise control of the orientation of the wafer 7, meets the requirements of subsequent processes, ensures the stability and accuracy of the wafer 7 during handling, and reduces problems caused by orientation deviations.

[0077] For example, target point 6 is the center point of wafer carrier platform 55.

[0078] By setting target point 6 as the center point of the wafer carrier platform 55, wafer 7 can be quickly positioned to the target location with high accuracy and reliability. This setting ensures the positioning accuracy of wafer 7 in its initial state, providing a good foundation for subsequent alignment processes and further improving the overall system stability and reliability. These limitations simplify operation, improve work efficiency, and enhance the alignment accuracy of wafer 7. Simultaneously, automated control reduces operational difficulty, improves work efficiency, and provides strong technical support for wafer 7 processing and handling.

[0079] By comparing the target point 6 with the current center position of wafer 7, a second offset distance in the second direction X is calculated. This second offset distance is then used as a compensation value for moving wafer 7 in the corresponding direction, and the position of wafer 7 is adjusted accordingly. This calculation and adjustment method enables precise movement of wafer 7 on the horizontal plane, improving the accuracy and stability of wafer 7 alignment, and allowing wafer 7 to reach the target position more accurately.

[0080] In this embodiment, in step S3, the camera 514 is used to photograph the wafer 7 and confirm the position of the marker 9 in order to obtain the initial center position and the initial orientation angle.

[0081] By capturing images of wafer 7 with camera 514 and confirming the position of marker 9, the initial center position and initial orientation angle of wafer 7 are automatically acquired, improving work efficiency and accuracy. This provides initial data for subsequent wafer 7 adjustments. The combination of image processing by camera 514 and mechanical adjustment results in a larger adjustment margin and stronger adaptability to wafer 7 position errors.

[0082] By obtaining a preset distance for transporting wafer 7 along the second direction X and compensating for the second offset distance into the preset distance, the actual transport distance is obtained. Then, wafer 7 is transported to the target position according to the actual distance. This compensation mechanism can eliminate errors, achieve precise adjustment of the wafer 7 position, ensure that wafer 7 can accurately reach the target position, improve the accuracy and efficiency of wafer 7 transport, and reduce errors in the transport process.

[0083] For example, in step S5, the current center position of wafer 7 is obtained using the following method: S51: Obtain the current boundary information of wafer 7. S52: Obtain the current center position of wafer 7 based on the current boundary information.

[0084] The camera 514 is used to photograph wafer 7 and confirm the position of marker 9 to obtain the initial center position and initial orientation angle of wafer 7. This method enables fast and accurate data acquisition and processing, making the positioning of wafer 7 more accurate. It also simplifies the operation process, improves work efficiency, reduces positioning errors, and improves the stability and reliability of alignment, providing accurate basic data for subsequent processing steps.

[0085] By acquiring the current boundary information of wafer 7 in S5 and obtaining the current center position based on the current boundary information, this method can monitor and adjust the position of wafer 7 in real time and accurately, improving the accuracy and efficiency of alignment and ensuring the precision and stability of the wafer 7 alignment process.

[0086] In this embodiment, in step S7, a transport device is used to transport the wafer 7 to the target location.

[0087] By using a handling device to move wafer 7 to the target location, efficient and rapid wafer 7 movement can be achieved, realizing automated and efficient operation, reducing the burden of manual operation, and improving overall alignment efficiency and safety.

[0088] For example, after step S2, the following step is included: S21: Positioning wafer 7 using a vacuum chuck. After step S6, the following step is included: S61: Releasing wafer 7 using a vacuum chuck.

[0089] By using a vacuum chuck to position wafer 7 and perform adsorption and release during transport, wafer 7 can be stably adsorbed and positioned, ensuring its stability and safety during handling and movement, thus improving operational safety and reliability. Simultaneously, the vacuum chuck's release function facilitates the removal of wafer 7 from the support platform, enhancing operational flexibility and convenience.

[0090] The aforementioned wafer alignment device uses the wafer alignment method described above to control the movement of the wafer carrier platform 55. By using the wafer alignment method described above to control the movement of the wafer carrier platform 55, the wafer alignment device can achieve high-precision wafer 7 alignment operations, which helps to improve the automation and intelligence of the wafer alignment device, realize automatic positioning and movement of the wafer 7, thereby optimizing the work quality and efficiency of the wafer 7 alignment operation, and reducing the difficulty and cost of the alignment operation.

[0091] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A wafer alignment device for positioning a wafer (7), wherein the edge of the wafer (7) has markings (9), characterized in that, The wafer alignment device includes: Base module; An active module is movable along a first direction (Y) and disposed on the base module. The active module includes a wafer carrier platform (55), which is used to place the wafer (7). The wafer carrier platform (55) is rotatable around a working axis, which extends vertically and passes through the center point of the wafer carrier platform (55). A camera (514) is located above the wafer carrier platform (55). The camera (514) is used to acquire the position information of the wafer (7) and the orientation information of the marker (9). The transport module is capable of transporting the wafer (7) along the second direction (X) and can pick up and place the wafer (7) onto the wafer carrier platform (55), wherein the first direction (Y) and the second direction (X) are both horizontal and perpendicular to each other.

2. The wafer alignment device according to claim 1, characterized in that, The base module includes a base plate (57), a mounting base plate (51), and a leveling screw (52). The movable module is movably connected to the mounting base plate (51). The mounting base plate (51) overlaps the base plate (57). The leveling screw (52) connects the mounting base plate (51) and the base plate (57) and is threadedly connected to one of the mounting base plate (51) and the base plate (57). The leveling screw (52) is used to adjust the gap between the mounting base plate (51) and the base plate (57) at the location where the leveling screw (52) is set.

3. The wafer alignment device according to claim 1, characterized in that, The activity module further includes a rotation drive component, which includes: Drive unit (59); The output end of the drive unit (59) is connected to the input end of the speed reducer (58), and the output end of the speed reducer (58) is connected to the wafer carrier platform (55).

4. The wafer alignment device according to claim 3, characterized in that, The activity module further includes a translation drive component (512), which includes: The lead screw is rotatably mounted on the base module along its own axis; The nut is threaded to the lead screw and is fixedly connected to the reducer (58).

5. The wafer alignment device according to claim 4, characterized in that, The base module also includes an adapter plate (511), which is connected to the housing of the reducer (58), and the lead screw is rotatably mounted on the adapter plate (511) along its own axis.

6. The wafer alignment device according to claim 1, characterized in that, The base module is equipped with a wafer detection sensor (53), which is used to detect whether a wafer (7) is carried on the wafer carrier platform (55).

7. The wafer alignment device according to claim 1, characterized in that, The base module is provided with a light-enhancing plate (56), which is used to enhance the light of the wafer carrier platform (55).

8. The wafer alignment device according to claim 2, characterized in that, A guide groove is provided on the mounting base plate (51), through which the movable module passes. The guide groove is used to restrict the movement path of the movable module.

9. The wafer alignment device according to claim 1, characterized in that, The wafer carrier platform (55) includes a vacuum chuck with an adsorption carrier surface at the top. The adsorption carrier surface is located in a horizontal plane, and the vacuum chuck can adsorb the wafer (7) located on the adsorption carrier surface.

10. The wafer alignment apparatus according to claim 9, characterized in that, The wafer carrier platform (55) also includes a ventilation shaft (513). The vacuum chuck has a gas chamber and a suction hole at the top of the vacuum chuck. The suction hole connects the gas chamber to the external environment. One end of the ventilation shaft (513) is connected to the bottom of the vacuum chuck, and the other end is provided with a connector (510). The connector (510) is used to connect a vacuum pump. The vacuum pump is connected to the gas chamber through the ventilation shaft (513). The vacuum pump is used to input vacuum negative pressure or positive pressure and adsorb the wafer (7) through the suction hole.

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