Optical module

Abstract

The application discloses an optical module, comprising: a first shell and a second shell, the first shell and the second shell surround to form a containing space, the containing space is used for containing a circuit board, a boss is arranged in the second shell, and the boss is located in the containing space, an adhesive is arranged on the boss, and the adhesive is used for fixedly connecting the circuit board and the second shell. The optical module does not need to additionally increase a jig, and the jig does not need to be maintained, so that equipment investment and maintenance cost can be reduced, the positioning precision of the jig can be avoided from being affected due to long-term use and abrasion, and the production rhythm can be avoided from being affected due to additional time required for installation and adjustment of the jig, so that the production efficiency can be improved. In addition, the jig is only suitable for a specific model, and the jig needs to be redeveloped when product design is changed, so that the development period is affected, and the boss can be compatible with circuit boards of different size specifications, and the production line flexibility is improved.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, specifically to an optical module. Background Technology

[0002] Optical modules are core components of optical communication systems, used for photoelectric signal conversion, and are widely used in data centers, 5G communications, fiber optic access, and other fields. As market demands change and technology continuously evolves, different assembly processes have emerged for optical modules. Among these, the COH (Chips On Housing) process is an important one. The COH process directly places the circuit board within the housing for the coupling of optoelectronic components. The COH process ensures that the coupled components maintain good functionality during handling and storage, and effectively reduces the technological difficulty of the optical coupling step. However, the COH process requires the circuit board to remain in a fixed position during coupling to ensure the stability of the coupling and subsequent processes.

[0003] In existing technologies, fixtures are used to fix the circuit board to the housing. However, fixtures not only increase equipment investment and maintenance costs, but also affect positioning accuracy due to wear and tear after long-term use. Furthermore, the installation and adjustment of fixtures require additional time, thereby reducing production efficiency. Utility Model Content

[0004] This application provides an optical module that can not only reduce equipment costs and ensure positioning accuracy, but also improve production efficiency.

[0005] This application provides an optical module, including: a first housing and a second housing, the first housing and the second housing surrounding to form a receiving space for accommodating a circuit board, the second housing having a boss located within the receiving space, and an adhesive on the boss for fixing the circuit board to the second housing.

[0006] In some embodiments, the boss has a dispensing portion and an overflow portion located outside the dispensing portion. The adhesive is disposed between the dispensing portion and the circuit board. The overflow portion has a groove recessed into the boss, which is used to accommodate the adhesive overflowing from the dispensing portion.

[0007] In some embodiments, the excess adhesive portion is disposed around the dispensing portion.

[0008] In some embodiments, a support member is provided inside the first housing. The support member is located on the side of the circuit board away from the boss, and the support member and the boss cooperate to fix the circuit board in the receiving space.

[0009] In some embodiments, the support member is fixedly connected to the side of the first housing facing the circuit board; and / or,

[0010] The support component is fixedly connected to the side of the circuit board facing the first housing.

[0011] In some embodiments, the support member includes a first support member and a second support member connected to each other. The first support member is disposed adjacent to the first housing, and the second support member is disposed adjacent to the circuit board. The first support member is pressed onto the second support member, and at least one of the first support member and the second support member is an elastomer.

[0012] In some embodiments, the first support member and the first housing are integrally formed, the second support member is an elastic body, and the first support member, the second support member and the circuit board are stacked.

[0013] In some embodiments, the first support member is provided with a receiving groove, and the second support member is fixed in the receiving groove.

[0014] In some embodiments, the boss and the second housing are integrally formed.

[0015] In some embodiments, the circuit board is provided with a heat-resistant layer at least at the position corresponding to the boss, and the heat distortion temperature of the heat-resistant layer is higher than the curing temperature of the adhesive.

[0016] Beneficial Effects: Compared with the prior art, the optical module provided in this application embodiment has a boss on the second housing. By applying adhesive to the boss, the circuit board can be fixed to the second housing, ensuring the stability of the circuit board's position and thus ensuring the quality of optoelectronic component coupling. This not only eliminates the need for additional fixtures but also eliminates the need for fixture maintenance, thereby reducing equipment investment and maintenance costs. It also prevents the fixture from affecting positioning accuracy due to wear and tear over long-term use, and avoids the additional time required for fixture installation and adjustment, which affects production cycle time, thus improving production efficiency. In addition, fixtures are only applicable to specific models, and new fixtures need to be developed when the product design changes, affecting the development cycle. The boss, on the other hand, is compatible with circuit boards of different sizes and specifications, improving production line flexibility. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a three-dimensional structural schematic diagram of one embodiment of the optical module of this application;

[0019] Figure 2 yes Figure 1 The diagram shows the exploded structure of the optical module.

[0020] Figure 3 yes Figure 2 A magnified schematic diagram of the partial structure at point A in the middle;

[0021] Figure 4 This is a three-dimensional structural schematic diagram of another embodiment of the optical module of this application;

[0022] Figure 5 yes Figure 4 The diagram shows the exploded structure of the optical module.

[0023] Figure 6 This is a schematic diagram of the planar structure of an embodiment of the optical module of this application;

[0024] Figure 7 It is along Figure 6 Schematic diagram of the cross section of line AA;

[0025] Figure 8 yes Figure 7 A magnified schematic diagram of the structure at point B in the middle.

[0026] Explanation of reference numerals in the attached figures:

[0027] 100. Optical module; 1. Housing; 11. First housing; 111. Support member; 1111. First support member; 1112. Second support member; 1113. Receiving groove; 112. First mounting hole; 12. Second housing; 121. Boss; 122. Dispensing part; 123. Overflow part; 124. Bottom wall; 125. Side wall; 126. Second mounting hole; 127. Positioning post; 13. Accommodating space; 2. Circuit board; 21. First surface; 22. Second surface; 23. Positioning port. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "up," "down," "left," and "right" generally refer to up, down, left, and right in the actual use or working state of the device, specifically the drawing directions in the accompanying drawings.

[0029] In this application, unless otherwise expressly specified and limited, the terms "connected," "linked," "stacked," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0030] This application provides an optical module, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.

[0031] Reference Figure 1 and Figure 2 An embodiment of this application provides an optical module 100. The optical module 100 includes a housing 1, a circuit board 2, and an optoelectronic component (not shown). The housing 1 includes a first housing 11 and a second housing 12. The first housing 11 and the second housing 12 enclose a receiving space 13. The circuit board 2 and the optoelectronic component are mounted within the receiving space 13. The optoelectronic component is electrically connected to the circuit board 2. The circuit board 2 has a first surface 21 and a second surface 22 oppositely disposed (e.g., ...). Figure 8 (As shown). The first surface 21 faces the first housing 11, and the second surface 22 faces the second housing 12. The optoelectronic component can be disposed on the first surface 21 and / or the second surface 22 of the circuit board 2.

[0032] During the assembly of the optical module 100, the circuit board 2 needs to be fixed to one of the first housing 11 and the second housing 12 firstly, then the optoelectronic component is coupled to the circuit board 2 to form an assembly, achieving electrical connection between the optoelectronic component and the circuit board 2, and finally the optoelectronic component and the circuit board 2 are installed in the first housing 11 and the second housing 12. In this embodiment, the circuit board 2 is first fixed to the second housing 12, then the optoelectronic component is coupled to the circuit board 2, and finally the first housing 11 and the second housing 12 are connected.

[0033] Please refer to the details as well. Figure 3A boss 121 is provided inside the second housing 12, and the boss 121 is located within the receiving space 13. The boss 121 can be integrally formed with the second housing 12. An adhesive (not shown) is provided on the boss 121. The adhesive is, for example, glue. The adhesive fixes the circuit board 2 to the second housing 12, that is, the circuit board 2 is fixedly connected to the second housing 12 by the adhesive. The adhesive is used to fix the second side 22 of the circuit board 2 to the second housing 12, that is, the circuit board 2 is fixed to the second housing 12 by the adhesive on the boss 121, thus ensuring the stability of the position of the circuit board 2. When the optoelectronic component is coupled to the circuit board 2, the position of the circuit board 2 can remain unchanged, thereby ensuring the quality of the optoelectronic component coupling. Compared to fixing the circuit board 2 to the second housing 12 using a fixture, fixing the circuit board 2 to the second housing 12 using adhesive not only eliminates the need for additional fixtures but also eliminates the need for fixture maintenance, thereby reducing equipment investment and maintenance costs. It also prevents long-term fixture wear from affecting positioning accuracy and avoids production cycle disruptions caused by the extra time required for fixture installation and adjustment, thus improving production efficiency. Furthermore, fixtures are only suitable for specific models, requiring new fixture development when product design changes, impacting the development cycle. The boss 121, however, is compatible with circuit boards 2 of different sizes and specifications, enhancing production line flexibility.

[0034] The number of bosses 121 can be one or more. In this embodiment, there are four bosses 121. The four bosses 121 are spaced apart from each other. The four bosses 121 are distributed near the edge of the circuit board 2.

[0035] Reference Figure 2 The second housing 12 has a bottom wall 124 and a side wall 125. A boss 121 is disposed on the bottom wall 124 of the second housing 12. The boss 121 extends from the bottom wall 124 of the second housing 12 towards the circuit board 2. Furthermore, the boss 121 is disposed at the junction of the bottom wall 124 and the side wall 125 of the second housing 12. The boss 121 can be connected to both the bottom wall 124 and the side wall 125 of the second housing 12 simultaneously. This can improve the structural strength of the boss 121 and the second housing 12. The boss 121 not only supports the circuit board 2, providing a certain space between the circuit board 2 and the second housing 12 for the placement of other components, but also allows it to be closer to the top of the side wall 125 for easier dispensing.

[0036] A heat-resistant layer (not shown) is provided at the position corresponding to the boss 121 on the circuit board 2. The heat distortion temperature of the heat-resistant layer is higher than the curing temperature of the adhesive. When it is necessary to remove the circuit board 2 from the second housing 12, the position of the boss 121 can be heated. The adhesive will soften first, while the heat-resistant layer will not deform, thus facilitating the removal of the circuit board 2 from the second housing 12 without damaging the circuit board 2 or the components on it. The heat-resistant layer is, for example, a copper layer or a ceramic coating. The copper layer not only has a high heat resistance temperature but also good thermal conductivity, which can accelerate the softening speed of the adhesive, thereby speeding up the removal process. Preferably, the heat-resistant layer is exposed from the second side 22 of the circuit board 2, that is, the heat-resistant layer can directly contact the adhesive to further accelerate the softening speed of the adhesive.

[0037] Please refer to the above as well. Figure 4 and Figure 5 When the first housing 11 is the upper housing 1 of the optical module 100, the second housing 12 can be used as the lower housing 1 of the optical module 100. When the first housing 11 is the lower housing 1 of the optical module 100, the second housing 12 can be used as the upper housing 1 of the optical module 100. Figure 1 and Figure 2 This illustrates the configuration where the first housing 11 of the optical module 100 is on top and the second housing 12 is on the bottom. Figure 4 and Figure 5 The illustration shows the optical module 100 with its first housing 11 at the bottom and its second housing 12 at the top. In this application, the illustration will be based on the example of the first housing 11 being the upper housing 1 of the optical module 100 and the second housing 12 being the lower housing 1 of the optical module 100.

[0038] The first housing 11 and the second housing 12 are detachably connected, for example, by snap-fit ​​or screw locking. The first housing 11 has a first mounting hole 112, and the second housing 12 has a corresponding second mounting hole 126. Screws (not shown) can be used to mount the first housing 11 to the first mounting hole 112 and the second housing 126, thus securing the first housing 11 to the second housing 12. The first mounting hole 112 can be a non-through hole. The first mounting hole 112 is located on the inner surface of the first housing 11, ensuring the aesthetic appearance of the outer surface of the first housing 11. The second mounting hole 126 can be a through hole, allowing one end of a screw to pass through the second mounting hole 126 and be fixed to the first mounting hole 112.

[0039] Reference Figure 1 and Figure 2The first housing 11 and / or the second housing 12 are provided with positioning posts 127. The circuit board 2 is correspondingly provided with a positioning opening 23. The positioning posts 127 and the positioning opening 23 cooperate to restrict the movement of the circuit board 2. For example, the movement of the circuit board 2 in the horizontal direction can be restricted. As an example, the positioning post 127 is provided in the second housing 12. When the circuit board 2 is mounted in the second housing 12, the positioning post 127 and the positioning opening 23 not only restrict the movement of the circuit board 2 in the horizontal direction but also have a guiding function to ensure the accuracy of the circuit board 2's mounting position. The positioning post 127 can be coaxially arranged with the second mounting hole 126, which, while ensuring performance, reduces the area occupied by the positioning post 127 and the second mounting hole 126, thereby improving the space utilization efficiency of the housing 1.

[0040] In one specific implementation, refer to Figure 2 and Figure 3 The boss 121 has a dispensing portion 122 and an overflow portion 123 located outside the dispensing portion 122. The adhesive is disposed between the dispensing portion 122 and the circuit board 2. The overflow portion 123 has a groove recessed into the boss 121, which is used to receive the adhesive overflowing from the dispensing portion 122.

[0041] Specifically, the dispensing part 122 can be disposed at the end of the boss 121 facing the circuit board 2, that is, the boss 121 has an end face facing the circuit board 2. This makes the dispensing part 122 closer to the top of the side wall 125, which facilitates the dispensing operation.

[0042] The dispensing portion 122 is, for example, a recess, and the shape of the recess is, for example, a quadrilateral. Adhesive is filled into the dispensing portion 122 by dispensing. The adhesive can contact the second surface 22 of the circuit board 2 and fix the circuit board 2 to the second housing 12. This ensures the stability of the position of the circuit board 2.

[0043] The area of ​​the dispensing portion 122 can occupy 20%-50% of the end face area of ​​the boss 121 facing the circuit board 2. This ensures the structural strength of the boss 121 while ensuring that the dispensing portion 122 and the circuit board 2 have sufficient contact area with the adhesive, thereby ensuring the reliability of the bonding and thus ensuring the stability of the position of the circuit board 2.

[0044] The dispensing part 122 is located near the middle area of ​​the boss 121, which ensures the structural strength of the boss 121 while maximizing the area of ​​the dispensing part 122.

[0045] Reference Figure 2 and Figure 3An overflow adhesive portion 123 is provided around the dispensing portion 122. The area of ​​the overflow adhesive portion 123 can occupy 30%-50% of the end face area of ​​the boss 121 facing the circuit board 2. The overflow adhesive portion 123 not only prevents the adhesive from overflowing to other areas of the circuit board 2 and affecting the performance of surrounding electronic components, but also allows the adhesive overflowing to the overflow adhesive portion 123 to come into contact with the circuit board 2, which can further increase the contact area between the adhesive and the circuit board 2, thereby enhancing the bonding effect.

[0046] The center of the dispensing part 122 and the center of the overflow part 123 are close to or coincide with each other, so as to ensure the structural strength of the boss 121 while maximizing the area of ​​the overflow part 123.

[0047] As an example, the length of the dispensing portion 122 is 1.5 mm, the width of the dispensing portion 122 is 0.8 mm, and the depth of the dispensing portion 122 is 0.2 mm. The length of the overflow portion 123 is 1.7 mm, the width of the overflow portion 123 is 1.0 mm, and the depth of the overflow portion 123 is 0.03 mm. The dimensions of the dispensing portion 122 and the overflow portion 123 can be set according to the actual situation.

[0048] Reference Figure 2 and Figure 5 A support member 111 may be provided inside the first housing 11. The support member 111 is located on the side of the circuit board 2 opposite to the dispensing part 122. That is, the support member 111 is located between the first surface 21 of the circuit board 2 and the first housing 11, and the support member 111 supports the circuit board 2 between the first housing 11 and the first housing 11. The support member 111 and the boss 121 cooperate to fix the circuit board 2 in the receiving space 13. When the first housing 11 and the second housing 12 are connected to each other, the support member 111 can apply a pressing force to the circuit board 2 in the direction of the second housing 12. This can restrict the movement of the circuit board 2, for example, it can restrict the movement of the circuit board 2 in the vertical direction, and at the same time, it can make the adhesion between the circuit board 2 and the adhesive more stable and improve the adhesion effect. The number of support members 111 is preferably the same as the number of dispensing parts 122, and they are arranged in a one-to-one correspondence.

[0049] The center of the support member 111 is close to or coincides with the center of the dispensing part 122. This allows the adhesive and the corresponding position of the circuit board 2 to be subjected to more uniform and stable force, which is beneficial for pressing firmly and ensuring the bonding effect of the adhesive. In this embodiment, the centers of the support member 111, the dispensing part 122, and the boss 121 are arranged to coincide, that is, the centers of the support member 111, the dispensing part 122, and the boss 121 are coaxially arranged.

[0050] The support component 111 can be an integral structure or a split structure.

[0051] When the support member 111 is an integral structure, one end of the support member 111 can be fixedly connected to the first housing 11 or the circuit board 2, and the other end of the support member 111 can abut against the first housing 11 or the circuit board 2. Specifically, the support member 111 can be fixedly connected to the side of the first housing 11 facing the circuit board 2. When the first housing 11 is connected to the second housing 12, the other end of the support member 111 can abut against the first surface 21 of the circuit board 2. The support member 111 can also be fixedly connected to the side of the circuit board 2 facing the first housing 11, that is, the support member 111 is fixed to the first surface 21 of the circuit board 2. When the first housing 11 is connected to the second housing 12, the other end of the support member 111 can abut against the side of the first housing 11 facing the circuit board 2.

[0052] At least a portion of the support member 111 may be an elastomer. The elastomer may be made of an elastic material (such as silicone or polyurethane) or an elastic structure (such as a spring sheet). The elastomer can absorb assembly tolerances through compression deformation, and the compression of the elastomer generates a continuous pressing force, which can limit the movement of the circuit board 2 and ensure the stability of the position of the circuit board 2.

[0053] Please refer to the above as well. Figures 6 to 8 When the support member 111 is a split structure, it may include a first support member 1111 and a second support member 1112 connected to each other. The first support member 1111 is disposed adjacent to the first housing 11. In this embodiment, one end of the first support member 1111 is fixedly connected to the first housing 11, and the other end of the first support member 1111 faces the circuit board 2. The second support member 1112 is disposed adjacent to the circuit board 2. In this embodiment, one end of the second support member 1112 is fixedly connected to the circuit board 2, and the other end of the second support member 1112 faces the first housing 11. The first support member 1111 and the second support member 1112 are correspondingly disposed, and the first support member 1111 can be pressed onto the second support member 1112. At least one of the first support member 1111 and the second support member 1112 is an elastic body. As an example, the first support member 1111 has a rigid structure. The first support member 1111 and the first housing 11 may be an integrally formed structure. The second support member 1112 is an elastic body. The second support member 1112 can be attached to the circuit board 2 by means of bonding or other methods. When the first housing 11 is connected to the second housing 12, the first support member 1111 can press against the second support member 1112. The second support member 1112 can absorb assembly tolerances through compression deformation, and the compression of the second support member 1112 generates a continuous pressing force. This can limit the movement of the circuit board 2 and ensure the stability of the circuit board 2's position.

[0054] Reference Figure 5 and Figure 8The first support member 1111 is provided with a receiving groove 1113, and the second support member 1112 is fixed in the receiving groove 1113. The receiving groove 1113 is located on the end face of the first support member 1111 facing the second support member 1112. The receiving groove 1113 not only guides the second support member 1112, thereby ensuring accurate alignment of the first support member 1111 and the second support member 1112, but also positions the second support member 1112, preventing it from falling off the first support member 1111, thereby ensuring the stability of the position of the second support member 1112.

[0055] The above provides a detailed description of an optical module provided by this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. An optical module, characterized in that, include: A first housing (11) and a second housing (12) are provided, the first housing (11) and the second housing (12) forming a receiving space (13) for accommodating a circuit board (2). A boss (121) is provided in the second housing (12), and the boss (121) is located in the receiving space (13). An adhesive is provided on the boss (121), and the adhesive fixes the circuit board (2) to the second housing (12).

2. The optical module according to claim 1, characterized by The boss (121) is provided with a dispensing part (122) and an overflow part (123) located outside the dispensing part (122). The adhesive is disposed between the dispensing part (122) and the circuit board (2). The overflow part (123) has a groove recessed into the boss (121) for accommodating the adhesive overflowing from the dispensing part (122).

3. The optical module according to claim 2, characterized in that, The overflow section (123) is arranged around the dispensing section (122).

4. The optical module according to claim 1, characterized in that, A support member (111) is provided inside the first housing (11). The support member (111) is located on the side of the circuit board (2) away from the boss (121), and the support member (111) and the boss (121) cooperate to fix the circuit board (2) in the accommodating space (13).

5. The optical module according to claim 4, characterized in that, The support member (111) is fixedly connected to the side of the first housing (11) facing the circuit board (2); and / or, The support member (111) is fixedly connected to the side of the circuit board (2) facing the first housing (11).

6. The optical module according to claim 4, characterized in that, The support member (111) includes a first support member (1111) and a second support member (1112) connected to each other. The first support member (1111) is disposed adjacent to the first housing (11), and the second support member (1112) is disposed adjacent to the circuit board (2). The first support member (1111) is pressed onto the second support member (1112). At least one of the first support member (1111) and the second support member (1112) is an elastic body.

7. The optical module according to claim 6, characterized in that, The first support member (1111) and the first housing (11) are integrally formed, the second support member (1112) is an elastic body, and the first support member (1111), the second support member (1112) and the circuit board (2) are stacked.

8. The optical module according to claim 6, characterized in that, The first support member (1111) is provided with a receiving groove (1113), and the second support member (1112) is fixed in the receiving groove (1113).

9. The optical module according to claim 1, characterized in that, The boss (121) and the second housing (12) are integrally formed.

10. The optical module according to claim 1, characterized in that, The circuit board (2) has a heat-resistant layer at least at the position corresponding to the boss (121), and the heat-resistant layer has a heat distortion temperature higher than the curing temperature of the adhesive.

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