A lithography system and semiconductor manufacturing equipment
By adding a wafer imaging system to the spin coater and developer in the photolithography system, automated imaging of wafers before and after photolithography is achieved, solving the problems of low efficiency and insufficient accuracy in the detection of photolithography anomalies in the existing technology, and improving detection efficiency and accuracy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG ICSPROUT SEMICONDUCTOR CO LTD
- Filing Date
- 2025-07-24
- Publication Date
- 2026-07-03
AI Technical Summary
Existing photolithography anomaly detection methods rely on manual operation, which is risky, inefficient, and cannot cover all wafers. Furthermore, AOI detection capabilities are limited, time-consuming, and labor-intensive, posing a risk that abnormal wafers may flow into subsequent processes.
A wafer imaging system, including a stage and camera, is added to the spin coater and developer of the photolithography system to take pictures of the wafer before and after photolithography, acquire images before and after photolithography, and assist in anomaly detection.
It improves the efficiency and accuracy of lithography anomaly detection, reduces the risk of defective wafers flowing into subsequent processes, simplifies the detection process, and reduces the need for manual intervention.
Smart Images
Figure CN224457220U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor equipment, specifically to a lithography system and semiconductor manufacturing equipment. Background Technology
[0002] Photolithography is a core process in semiconductor manufacturing. Through steps such as photoresist coating, mask alignment, exposure, and development, circuit patterns are transferred onto a silicon wafer. However, various abnormal problems may occur during the photolithography process. Therefore, it is necessary to perform photolithography anomaly detection on the wafer. Photolithography anomaly detection refers to the inspection of the wafer after the photolithography process to determine whether there are any abnormalities.
[0003] Against this backdrop, how to provide a lithography system to assist in the detection of lithography anomalies and improve detection efficiency has become an urgent problem to be solved by those skilled in the art. Utility Model Content
[0004] In view of this, embodiments of this application provide a lithography system and semiconductor manufacturing equipment that can assist in the detection of lithography anomalies and improve detection efficiency.
[0005] To achieve the above objectives, the embodiments of this application provide the following technical solutions.
[0006] In a first aspect, embodiments of this application provide a photolithography system, including:
[0007] A photolithography machine is used to expose wafers coated with photoresist.
[0008] A photoresist coating and developing machine is used to coat photoresist on the surface of a wafer and perform developing treatment; the photoresist coating and developing machine includes: a multi-functional module unit; the multi-functional module unit includes: a wafer imaging system located in the wafer imaging area of the photoresist coating and developing machine, used to photograph the wafer before and after photolithography.
[0009] The wafer camera system includes:
[0010] A photographic stage is used to hold wafers before and after wafer photolithography. Before wafer photolithography, a robotic arm transfers the wafer from the spin coater to the photographic stage. After wafer photolithography, the robotic arm transfers the lithographic wafer from the spin coater to the photographic stage.
[0011] The camera is used to take pictures of the wafer carried by the photographic stage before and after wafer photolithography, obtaining pre-lithography and post-lithography images of the wafer. These images are used to identify whether there are any photolithography abnormalities on the wafer.
[0012] Optionally, the wafer camera system further includes:
[0013] The sensor installed in the camera is used to control the camera to take pictures.
[0014] Optionally, the camera is positioned above the photographing platform, and the position of the camera corresponds to the center of the photographing platform.
[0015] Optionally, the wafer camera system further includes:
[0016] A fill light is used to provide supplemental lighting when the camera takes pictures.
[0017] Optionally, the number of fill lights is one or more, and the fill lights are arranged above the photographing platform and located on one side of the photographing platform.
[0018] Optionally, the photolithography system further includes:
[0019] A conveyor system is used to transfer wafers between a photolithography machine and a photoresist coating and developing machine.
[0020] The robotic arm is used to transport wafers in a spin coater and developer. The robotic arm is connected to the conveying system. It transfers the wafers to be taken out of the spin coater and developer before photolithography to the imaging stage, transfers the wafers to be taken after photolithography before photolithography to the conveying system, and sends the wafers back from the conveying system after photolithography into the spin coater and developer and transfers them to the imaging stage.
[0021] Optionally, the spin coater further includes: a wafer cassette for storing wafers; the robotic arm is also used to remove wafers from the wafer cassette.
[0022] Optionally, the robotic arm is a box station robotic arm.
[0023] Optionally, the multifunctional module further includes:
[0024] The photoresist coating unit is used to coat the wafer with photoresist for exposure processing in the photolithography machine;
[0025] The developing unit is used to develop wafers that have undergone exposure processing.
[0026] Secondly, embodiments of this application provide a semiconductor manufacturing apparatus, including a lithography system, the lithography system being as described in the first aspect above.
[0027] As can be seen, the photolithography system provided in this application includes: a photolithography machine for exposing a wafer coated with photoresist; and a spin coater / developer for coating photoresist on the wafer surface and performing development. The spin coater / developer includes: a multi-functional module unit; the multi-functional module unit includes: a wafer imaging system located in the wafer imaging area of the spin coater / developer for photographing the wafer before and after photolithography; the wafer imaging system includes: an imaging stage for carrying the wafer before and after photolithography; wherein, before photolithography, a robotic arm transfers the wafer from the spin coater / developer to the imaging stage, and after photolithography, the robotic arm feeds the wafer into the spin coater / developer. After photolithography, the wafer in the photolithography machine is transferred to a photographic stage. A camera is used to take pictures of the wafer on the photographic stage before and after photolithography, obtaining pre-lithography and post-lithography images of the wafer. These images are used to identify whether there are photolithography abnormalities on the wafer. In other words, the photolithography system provided in this application adds a wafer imaging system to the multi-functional module unit of the photolithography machine, which is used to take pictures of the wafer before and after photolithography, thereby obtaining pre-lithography and post-lithography images of the wafer for identifying whether there are abnormalities on the wafer. Therefore, the photolithography system provided in this application can assist in the detection of photolithography abnormalities and improve detection efficiency. Attached Figure Description
[0028] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0029] Figure 1 This is an example diagram of an optional structure of the wafer camera system shown in the embodiments of this application;
[0030] Figure 2 This is an example diagram of another optional structure of the wafer camera system shown in the embodiments of this application. Detailed Implementation
[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0032] As described in the background section, various abnormalities may occur during the photolithography process. Currently, photolithography anomaly detection mainly employs OM (Optical Microscope) inspection, which uses an optical microscope to observe macroscopic defects on the wafer surface, such as photoresist residue, abnormal development, and particle contamination. Once an anomaly is detected, the wafer with the anomaly is directly sent for rework, i.e., a rework process. Specifically, this involves photoresist stripping, cleaning, and re-performing the photolithography process on the abnormal wafer. After the rework process is completed, the wafer is manually inspected again using an OM to determine whether the anomaly was caused by the photolithography process.
[0033] During this process, OM inspection is generally carried out by MFG (Manufacturing) randomly selecting a portion of wafers (e.g., three wafers) for inspection. Therefore, there is still a certain risk that abnormal wafers may flow out of the photolithography process and enter the subsequent processes.
[0034] It can be seen that although the current OM anomaly detection method can detect anomalies on wafers, it mainly relies on manual operation, which is risky. Secondly, clarifying that the anomaly is not caused by the lithography process is time-consuming and too cumbersome, affecting work efficiency. That is, it is necessary to analyze and investigate to confirm whether the anomaly is caused by the lithography process itself, and finally determine whether the anomaly is the responsibility of the lithography process. Finally, this detection method cannot detect anomalies on all wafers, has low accuracy, and results in a high probability of risky wafers being released.
[0035] Another anomaly detection approach is to use AOI (Automated Optical Inspection), which analyzes wafer surface defects (such as particles, scratches, and missing patterns) through optical imaging and algorithms, while increasing the sampling ratio of AOI inspection. Although this approach can achieve wafer anomaly detection, it is still unable to cover all wafers due to limitations in production capacity and cost. This means that some wafers will still enter the subsequent processes without inspection, posing a risk. Furthermore, AOI inspection capabilities are limited (e.g., limited recognition rate of certain subsurface defects) and are greatly affected by environmental interference, resulting in a high failure rate and being time-consuming and labor-intensive.
[0036] In view of this, embodiments of this application provide a photolithography system and semiconductor manufacturing equipment, which can assist in the detection of photolithography anomalies and improve detection efficiency. The photolithography system includes: a photolithography machine for exposing a wafer coated with photoresist; and a spin coater / developer for coating photoresist on the wafer surface and performing development processing. The spin coater / developer includes: a multi-functional module; the multi-functional module includes: a wafer imaging system located in the wafer imaging area of the spin coater / developer, for photographing the wafer before and after photolithography.
[0037] The lithography machine is the core equipment in the lithography process, responsible for exposure and other steps. It uses a light source to transfer the pattern on the photomask onto the photoresist. The spin coater and developer completes all lithography processes except exposure, including coating, baking, developing, and cleaning.
[0038] The photoresist coating and developing machine includes a multi-purpose block (MPB), which can achieve flexible integration and rapid switching of multiple process functions through modular design. For example, in an optional implementation, the multi-purpose block may include: a photoresist coating unit for coating the wafer with photoresist for exposure processing in the photolithography machine; and a developing unit for developing the exposed wafer.
[0039] In this embodiment of the application, in order to assist in the detection of lithography anomalies, a wafer imaging system is added to the multifunctional module. The multifunctional module includes a wafer imaging system located in the wafer imaging area of the spin coater and developer, which is used to take pictures of the wafer before and after lithography.
[0040] Figure 1 This is an example diagram of an optional structure of the wafer camera system shown in the embodiments of this application. Figure 2 This is an example diagram of another optional structure of the wafer camera system shown in the embodiments of this application, wherein, Figure 2 for Figure 1 This diagram shows the wafer placed on the stage in the wafer imaging system.
[0041] like Figure 1 and Figure 2As shown, the wafer imaging system may include: a photographing stage 100 for carrying the wafer before and after wafer photolithography; wherein, before wafer photolithography, a robotic arm transfers the wafer from the spin coater to the photographing stage, and after wafer photolithography, the robotic arm transfers the wafer after photolithography from the spin coater to the photographing stage; and a camera 200 for taking pictures of the wafer carried on the photographing stage before and after wafer photolithography, obtaining pre-photolithography and post-photolithography images of the wafer, which are used to identify whether there are photolithography abnormalities on the wafer.
[0042] In an optional implementation, the wafer camera system further includes a sensor (not shown in the figure) disposed on the camera 200 for controlling the camera to take pictures.
[0043] In this embodiment, by setting a sensor in the camera, the camera can be controlled to take pictures when a wafer is placed on the photography stage.
[0044] In an optional embodiment, the camera 200 can be positioned above the imaging stage 100, and the position of the camera 200 corresponds to the center position of the imaging stage 100; thereby enabling the wafer image obtained by taking the picture to fully reflect the state of the wafer.
[0045] In another alternative embodiment, the camera 200 may be positioned above the photographing platform 100 and located on one side of the photographing platform 100.
[0046] Furthermore, continue to refer to Figure 1 and Figure 2 The wafer camera system also includes a supplementary light 300, which is used to provide supplementary lighting when the camera takes pictures, so as to avoid the wafer image being unclear due to insufficient ambient light.
[0047] In an optional implementation, the number of fill lights 300 can be one or more, and the fill lights 300 are disposed above the photographing platform 100 and located on one side of the photographing platform 100.
[0048] In practice, the number of fill lights can be set according to the ambient lighting conditions, as long as the image captured by the camera clearly reflects the state of the wafer.
[0049] Furthermore, in this embodiment, the lithography system may further include: a conveying system for conveying wafers between the lithography machine and the spin coater / developer; the robotic arm is a robotic arm for handling wafers in the spin coater / developer, the robotic arm can be connected to the conveying system to transfer the wafers to be taken out of the spin coater / developer before lithography to the imaging stage, to transfer the wafers to be taken after lithography before lithography to the conveying system, and to send the wafers to be taken back by the conveying system after lithography into the spin coater / developer and transfer them to the imaging stage.
[0050] In this embodiment of the application, the spin coater may further include: a wafer cassette for storing wafers; the robotic arm is also used to remove wafers from the wafer cassette.
[0051] In an optional implementation, the robotic arm can be a cassette block robotics arm (CRA).
[0052] As can be seen, the photolithography system provided in this application includes: a photolithography machine for exposing a wafer coated with photoresist; and a spin coater / developer for coating photoresist on the wafer surface and performing development. The spin coater / developer includes: a multi-functional module unit; the multi-functional module unit includes: a wafer imaging system located in the wafer imaging area of the spin coater / developer for photographing the wafer before and after photolithography; the wafer imaging system includes: an imaging stage for carrying the wafer before and after photolithography; wherein, before photolithography, a robotic arm transfers the wafer from the spin coater / developer to the imaging stage, and after photolithography, the robotic arm feeds the wafer into the spin coater / developer. After photolithography, the wafer in the photolithography machine is transferred to a photographic stage. A camera is used to take pictures of the wafer on the photographic stage before and after photolithography, obtaining pre-lithography and post-lithography images of the wafer. These images are used to identify whether there are photolithography abnormalities on the wafer. In other words, the photolithography system provided in this application adds a wafer imaging system to the multi-functional module unit of the photolithography machine, which is used to take pictures of the wafer before and after photolithography, thereby obtaining pre-lithography and post-lithography images of the wafer for identifying whether there are abnormalities on the wafer. Therefore, the photolithography system provided in this application can assist in the detection of photolithography abnormalities and improve detection efficiency.
[0053] This application also provides a semiconductor manufacturing apparatus, including a photolithography system, which is the same as the photolithography system described in the foregoing embodiments.
[0054] The foregoing describes multiple embodiment schemes provided by the embodiments of this application. The optional methods described in each embodiment scheme can be combined and cross-referenced with each other without conflict, thereby extending to a variety of possible embodiment schemes. These can all be considered as the embodiment schemes disclosed and published by the embodiments of this application.
[0055] While the embodiments disclosed above are described in this application, this application is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of this application; therefore, the scope of protection of this application should be determined by the scope defined in the claims.
Claims
1. A lithographic system, characterized by, At least including: A photolithography machine is used to expose wafers coated with photoresist. A photoresist coating and developing machine is used to coat photoresist onto the surface of a wafer and to perform the developing process. The spin coater includes a multi-functional module; the multi-functional module includes a wafer imaging system located in the wafer imaging area of the spin coater, used to photograph the wafer before and after photolithography. The wafer camera system includes: A photographic stage is used to hold wafers before and after wafer photolithography. Before wafer photolithography, a robotic arm transfers the wafer from the spin coater to the photographic stage. After wafer photolithography, the robotic arm transfers the lithographic wafer from the spin coater to the photographic stage. The camera is used to take pictures of the wafer carried by the photographic stage before and after wafer photolithography, obtaining pre-lithography and post-lithography images of the wafer. These images are used to identify whether there are any photolithography abnormalities on the wafer.
2. The photolithography system according to claim 1, characterized in that, The wafer camera system also includes: The sensor installed in the camera is used to control the camera to take pictures.
3. The photolithography system according to claim 2, characterized in that, The camera is positioned above the photographing platform, and its position corresponds to the center of the photographing platform.
4. The photolithography system according to claim 1, characterized in that, The wafer camera system also includes: A fill light is used to provide supplemental lighting when the camera takes pictures.
5. The photolithography system according to claim 4, characterized in that, The number of fill lights is one or more, and the fill lights are positioned above the photographing platform and on one side of the photographing platform.
6. The photolithography system according to claim 1, characterized in that, The photolithography system also includes: A conveyor system is used to transfer wafers between a photolithography machine and a photoresist coating and developing machine. The robotic arm is used to transport wafers in a spin coater and developer. The robotic arm is connected to the conveying system. It transfers the wafers to be taken out of the spin coater and developer before photolithography to the imaging stage, transfers the wafers to be taken after photolithography before photolithography to the conveying system, and sends the wafers back from the conveying system after photolithography into the spin coater and developer and transfers them to the imaging stage.
7. The photolithography system according to claim 6, characterized in that, The spin coater further includes: a wafer cassette for storing wafers; the robotic arm is also used to remove wafers from the wafer cassette.
8. The photolithography system according to claim 7, characterized in that, The robotic arm is a box station robotic arm.
9. The photolithography system according to claim 1, characterized in that, The multifunctional module also includes: The photoresist coating unit is used to coat the wafer with photoresist for exposure processing in the photolithography machine; The developing unit is used to develop wafers that have undergone exposure processing.
10. A semiconductor manufacturing apparatus, characterized in that, Including the lithography system as described in any one of claims 1-9.