Etching device
By setting up a liquid flow tank and a liquid flow generator on the etching unit, uniform flow of the etching solution is achieved, solving the problem of uneven etching, improving the performance and quality of silicon wafers, and reducing equipment costs.
CN224473681UActive Publication Date: 2026-07-07TIANJIN AIKO SOLAR ENERGY TECH CO LTD +5
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Patent Information
- Application Number
- CN202520700959.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-11
- Publication Date
- 2026-07-07
- Estimated Expiration
- 2035-04-11
AI Technical Summary
Technical Problem
In existing etching equipment, fluctuations in the surface of the etching solution cause uneven etching of silicon wafers, affecting their performance and quality.
Method used
A liquid flow tank is set on the etching unit, and the etching solution flows in from the supply port and out from the drain port through the liquid flow generator to form a uniform flow, ensuring stable contact between the lower surface of the silicon wafer and the etching solution.
Benefits of technology
It improves etching uniformity, reduces over-etching rate, enhances silicon wafer performance and quality, simplifies device structure, reduces equipment cost and manufacturing difficulty, and facilitates industrial production.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model relates to the technical field of solar cells, in particular to an etching device, which comprises an etching unit, an etching unit, an etching unit, an etching unit, an etching unit, an etching unit and an etching unit, the etching unit comprises a base body, the base body is provided with a liquid flowing groove, and the liquid flowing groove is provided with a liquid supply port used for supplying etching liquid and a liquid discharge port used for discharging the etching liquid; and the liquid flow generating device is configured to enable etching liquid to form liquid flow, and the flowing direction of the liquid flow is that the liquid flow flows into the liquid flowing groove from the at least one liquid supply port and flows out of the liquid flowing groove from the at least one liquid discharge port. Compared with the prior art, the contact interface between the etching liquid and the silicon wafer is more uniform and stable, the etching uniformity can be effectively improved, the over-etching rate is reduced, the etching effect is improved, and the performance and the quality of the processed silicon wafer can be further improved. Meanwhile, the whole structure is simpler, the requirement for production precision of the device is low, the equipment cost and the manufacturing difficulty are effectively reduced, and industrial production is facilitated.
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