High-power load heat dissipation structure

Abstract

The utility model discloses high -power load heat radiation structure, including extension assembly, be provided with cable assembly and load on the extension assembly, the extension assembly includes the box body and lid body that constitute by heat conduction plate, the lid body covers and is set up in the open end of box body, the bottom end interval distribution of box body has a plurality of mounting holes, a plurality of load one -to -one corresponding installation in mounting hole, the contact surface of load with box body still is provided with heat conduction coating layer. The utility model discloses through setting extension assembly, will connector, load and so on key components integration in the structure that the box body and lid body of heat conduction constitute, and the load is embedded through bottom mounting hole and is coated with the heat -conducting silicone grease between the contact surface of box body, effectively reduced the interface thermal resistance, has built the efficient heat conduction path from the load heat source to external environment, has improved the heat dissipation capacity of system significantly, prevents the performance decline or device damage because of local overheating.

Description

Technical Field

[0001] This utility model belongs to the field of radio frequency connector technology, and particularly relates to heat dissipation structure for high-power loads. Background Technology

[0002] In the field of RF connectors and high-power electronic devices, the load is an important component for absorbing high-frequency energy and achieving impedance matching. Its performance directly affects the stability and reliability of the system. The load will generate a lot of heat during long-term operation. If the heat cannot be dissipated in a timely and effective manner, it is easy to cause local overheating.

[0003] Currently, traditional RF loads are usually installed directly at the user end, lacking unified expansion components for centralized layout and structural integration, making it difficult to dissipate the heat generated by the load during high-power operation in a timely and effective manner. Utility Model Content

[0004] This utility model addresses the problems in the prior art by proposing the following technical solution:

[0005] This utility model provides a heat dissipation structure for high-power loads, including:

[0006] An expansion component, wherein a cable assembly and a load are provided on the expansion component;

[0007] The expansion component includes a box body and a cover body made of a heat-conducting plate. The cover body is disposed on the open end of the box body. Multiple mounting holes are distributed at intervals on the bottom end of the box body. Multiple loads are installed in the mounting holes one by one. The contact surface between the load and the box body is also provided with a heat-conducting coating layer.

[0008] As a preferred embodiment of the above technical solution, the accommodating cavity of the box body is provided with a plurality of connecting posts that connect the box body and the cover body.

[0009] As a preferred embodiment of the above technical solution, the cable assembly includes a plurality of connector 1 disposed on the housing and a plurality of connector 2 disposed on the cover, wherein the connector 1 and the connector 2 are connected by a cable.

[0010] As a preferred embodiment of the above technical solution, the cover includes a main cover plate located in the middle and sub-cover plates distributed around the main cover plate, and the second connector is disposed on the main cover plate.

[0011] As a preferred embodiment of the above technical solution, the load includes a columnar body and a limiting block disposed at one end of the body, and the exterior of the body is also provided with texture.

[0012] As a preferred embodiment of the above technical solution, the thermally conductive coating layer is thermally conductive silicone grease.

[0013] The beneficial effects of this utility model are as follows:

[0014] This invention integrates key components such as connectors and loads into a structure composed of a heat-conducting housing and a cover by setting an expansion component. The load is embedded through the bottom mounting hole and coated with thermal grease between the load and the housing contact surface, which effectively reduces the interface thermal resistance and constructs an efficient heat conduction path from the load heat source to the external environment, significantly improving the system's heat dissipation capacity and preventing performance degradation or device damage caused by local overheating. Attached Figure Description

[0015] Figure 1 The diagram shown is a front view of the heat dissipation structure in the embodiment;

[0016] Figure 2 What is shown is Figure 1 A cross-sectional view of the heat dissipation structure in the middle;

[0017] Figure 3 The diagram shown is a three-dimensional representation of the heat dissipation structure in the embodiment. Figure 1 ;

[0018] Figure 4 The diagram shown is a three-dimensional representation of the heat dissipation structure in the embodiment. Figure 2 ;

[0019] Figure 5 The diagram shown illustrates the interaction between the housing and the load in an embodiment.

[0020] Figure 6 The diagram shown is a schematic representation of the load in the embodiment;

[0021] Reference numerals: 1. Extension component; 2. Load; 201. Main body; 202. Limiting block; 203. Texture; 10. Box body; 11. Connector one; 12. Mounting hole; 20. Cover body; 21. Sub-cover plate; 22. Main cover plate; 23. Connector two; 30. Connecting post. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0023] Example

[0024] like Figure 1 , Figure 2 As shown, Figure 1 The diagram shown is a front view of the heat dissipation structure in the embodiment. Figure 2 What is shown is Figure 1 A cross-sectional view of the heat dissipation structure in the middle;

[0025] This device includes:

[0026] Expansion component 1 is provided with a cable assembly and a load 2, and the load 2 is cooled through expansion component 1.

[0027] Both the cable assembly and the load 2 are mounted on the expansion assembly 1. The cable assembly is connected to the external radio frequency module and is responsible for the signal transmission of the entire module.

[0028] The expansion component 1 includes a box body 10 and a cover body 20 made of a heat-conducting plate. The cover body 20 covers the open end of the box body 10. The accommodating cavity of the box body 10 is provided with a plurality of connecting posts 30 connecting the box body 10 and the cover body 20.

[0029] Multiple connecting posts 30 connect the box body 10 and the cover body 20, serving a connecting function and enhancing the structural stability of the expansion component 1.

[0030] Figure 1 End a is the end where the cover 20 is located, and end b is the end where the box 10 is located.

[0031] like Figure 3 , Figure 4 , Figure 5 As shown, Figure 3 The diagram shown is a three-dimensional representation of the heat dissipation structure in the embodiment. Figure 1 ; Figure 4 The diagram shown is a three-dimensional representation of the heat dissipation structure in the embodiment. Figure 2 ; Figure 5 The diagram shown illustrates the interaction between the housing and the load in an embodiment.

[0032] The bottom of the box 10 has multiple mounting holes 12 spaced apart, and multiple loads 2 are installed in the mounting holes 12 one by one. The contact surface between the load 2 and the box 10 is also provided with a thermally conductive coating layer.

[0033] The bottom of the box 10 has multiple mounting holes 12 spaced apart. The load 2 is embedded in the mounting holes 12 to achieve a distributed arrangement of multiple loads 2. The load 2 is close to the box 10, forming a good heat conduction interface and increasing the effective heat dissipation area. The heat generated by the load 2 can be effectively dissipated through the heat conduction plate, thereby avoiding local overheating and promoting the overall temperature field balance.

[0034] The thermally conductive coating layer is made of thermally conductive silicone grease, which has good thermal conductivity and adhesion, further improving thermal conductivity efficiency.

[0035] Furthermore, the surfaces of the box body 10 and the cover body 20 have been anodized and blackened, which can improve heat dissipation by 10%-15% under natural cooling conditions and by 30% under forced air cooling conditions compared to the original solution.

[0036] Specifically, the cable assembly includes multiple connectors 11 disposed on the housing 10 and multiple connectors 23 disposed on the cover 20, with connectors 11 and connectors 23 connected by cables.

[0037] Connector 11 and connector 23 are connected to different radio frequency modules, and the cables are located inside the housing 10.

[0038] like Figure 6 As shown, Figure 6 The diagram shown is a schematic representation of the load in the embodiment;

[0039] The load 2 includes a columnar body 201 and a limiting block 202 disposed at one end of the body 201. The body 201 is also provided with texture 203 on its exterior.

[0040] The size of the limiting block 202 is larger than the inner diameter of the mounting hole. The limiting block 202 plays an axial limiting role during the installation of the load 2, and the texture 203 increases the installation stability of the load 2.

[0041] like Figure 3 As shown, Figure 3 The diagram shown is a three-dimensional representation of the heat dissipation structure in the embodiment. Figure 1 ;

[0042] The cover 20 includes a main cover plate 22 located in the middle and sub-cover plates 21 distributed around the main cover plate 22. Connector 23 is disposed on the main cover plate 22.

[0043] The main cover plate 22 is a box-shaped structure with its opening facing downwards. The main cover plate 22 and multiple sub-cover plates 21 cooperate to form a cover body 20. The sub-cover plates 21 cover the non-electrical interface area. The modular design facilitates local maintenance.

[0044] Working principle: This utility model integrates key components such as connectors and loads 2 into a structure composed of a heat-conducting housing 10 and a cover 20 through the set expansion component 1. The load 2 is embedded through the bottom mounting hole 12 and the contact surface between it and the housing 12 is coated with thermal grease, which effectively reduces the interface thermal resistance and constructs an efficient heat conduction path from the load heat source to the external environment, significantly improving the heat dissipation capacity of the system and preventing performance degradation or device damage caused by local overheating.

[0045] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. A heat dissipation structure for high-power loads, characterized in that, include: An expansion component (1) is provided with a cable assembly and a load (2); The expansion component (1) includes a box body (10) and a cover body (20) made of a heat-conducting plate. The cover body (20) is closed on the open end of the box body (10). The bottom end of the box body (10) has a plurality of mounting holes (12) spaced apart. A plurality of loads (2) are installed in the mounting holes (12) one by one. The contact surface between the loads (2) and the box body (10) is also provided with a heat-conducting coating layer.

2. The high-power load heat dissipation structure according to claim 1, characterized in that, The accommodating cavity of the box (10) is provided with a plurality of connecting posts (30) connecting the box (10) and the cover (20).

3. The high-power load heat dissipation structure according to claim 1, characterized in that, The cable assembly includes a plurality of connector one (11) disposed on the housing (10) and a plurality of connector two (23) disposed on the cover (20), wherein the connector one (11) and the connector two (23) are connected by a cable.

4. The high-power load heat dissipation structure according to claim 3, characterized in that, The cover (20) includes a main cover plate (22) located in the middle and sub-cover plates (21) distributed around the main cover plate (22), and the connector two (23) is disposed on the main cover plate (22).

5. The high-power load heat dissipation structure according to claim 1, characterized in that, The load (2) includes a columnar body (201) and a limiting block (202) disposed at one end of the body (201). The body (201) is also provided with texture (203) on its exterior.

6. The high-power load heat dissipation structure according to claim 1, characterized in that, The thermally conductive coating layer is thermally conductive silicone grease.

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