A laminated busbar

Abstract

The application relates to the technical field of integrated busbars and discloses a laminated busbar. The integrated busbar comprises a bottom UV film, a busbar, an upper UV film, a PCB cluster plate, a temperature sensor and a plurality of tinned copper wires; the width of the upper UV film is smaller than the width of the bottom UV film in the radial direction of the upper UV film; the plurality of tinned copper wires are all covered between the bottom UV film and the upper UV film, one end of the tinned copper wire is connected with the PCB cluster plate in signal, the other end of the tinned copper wire is bent along the radial direction of the upper UV film and is connected with the busbar in signal, the busbar is fixed on the bottom UV film, the temperature sensor is fixed on the upper surface of the bottom UV film, and the temperature sensor is connected with the tinned copper wire in signal. The integrated busbar optimizes the existing integrated busbar structure, thereby improving the production efficiency and reducing the production cost.

Description

Technical Field

[0001] This application relates to the technical field of integrated busbars, and in particular to a stacked busbar. Background Technology

[0002] With the booming development of the new energy market, the demand for power and energy storage batteries continues to rise. As a core component in the new energy field, the research and development of related technologies has attracted much attention. Among the many battery technologies, the integrated busbar, as a key component of the battery, has a significant impact on battery performance and safety.

[0003] Currently, the most common integrated busbars on the market are mainly divided into vacuum-formed integrated busbars, injection-molded integrated busbars, and hot-pressed integrated busbars. These traditional integrated busbars are relatively thick and heavy in structure, requiring a lot of space, which to some extent limits the flexibility of the overall design and layout of the battery pack. In addition, due to the complexity of the integrated busbar structure, the production process is difficult and prone to defective products. This not only leads to the waste of raw materials and increases production costs, but also prolongs the production cycle and reduces production efficiency.

[0004] To address these issues, researchers urgently need to optimize existing integrated busbar structures to effectively improve production efficiency, reduce production costs, and simultaneously meet the higher requirements of the new energy market for battery performance and space utilization. Utility Model Content

[0005] The technical problem to be solved by this application is to optimize the existing integrated busbar structure in order to improve production efficiency and reduce production costs.

[0006] To address the aforementioned issues, this application provides a multilayer busbar, comprising a bottom UV film, a busbar, an upper UV film, a PCB cluster, a temperature sensor, and a plurality of tin-plated copper wires; in the radial direction of the upper UV film, the width of the upper UV film is smaller than the width of the bottom UV film; the plurality of tin-plated copper wires are all wrapped between the bottom UV film and the upper UV film, one end of each tin-plated copper wire is signal-connected to the PCB cluster; the other end of each tin-plated copper wire is bent radially along the upper UV film and signal-connected to the busbar; the busbar is fixed to the bottom UV film; the temperature sensor is fixed to the upper surface of the bottom UV film, and the temperature sensor is signal-connected to one of the tin-plated copper wires.

[0007] Preferably, the tin-plated copper wires are of different lengths and are spaced apart; the overlapping portion between the upper UV film and the lower UV film is a coverage area, and the tin-plated copper wires are located in the coverage area; the other end of the tin-plated copper wire is bent to form a conductive wire, and the conductive wire protrudes out of the coverage area and is connected to the busbar signal.

[0008] Preferably, the busbar includes multiple aluminum busbars, which are arranged on both sides of the upper UV film and the tinned copper wire, and each of the conductive wires is connected to one of the aluminum busbars.

[0009] Preferably, the bottom UV film has several through holes, and each aluminum busbar is fixed at one of the through holes.

[0010] Preferably, a clearance groove is provided on the side of the aluminum busbar near the tin-plated copper wire, and the temperature sensor is located in the clearance groove.

[0011] Preferably, the bottom UV film has a bottom UV adhesive layer on one side for fixing the top UV film, and the top UV film has an upper UV adhesive layer on one side for fixing the bottom UV film.

[0012] Preferably, both the bottom UV film and the top UV film are single-sided insulating films.

[0013] Preferably, the temperature sensor is an NTC thermistor temperature sensor.

[0014] Preferably, the tin-plated copper wire is connected to the busbar by ultrasonic welding.

[0015] Preferably, the temperature sensor is connected to the corresponding tin-plated copper wire via ultrasonic welding.

[0016] Compared with the prior art, this application includes at least one of the following beneficial technical effects:

[0017] This integrated busbar primarily achieves power transmission and monitoring functions through its unique structure. The bottom and top UV films tightly wrap the tin-plated copper wires, ensuring their stable fixation and insulation. One end of the tin-plated copper wire connects to the PCB board, while the other end extends beyond the upper UV film's coverage area for electrical connections with other components, enabling efficient power transmission and distribution. The busbar is fixed to the bottom UV film, located on both sides of the upper UV film and the tin-plated copper wire, and connected to it. It can collect current from multiple individual battery cells or distribute it to different circuit branches. Temperature sensors monitor the integrated busbar temperature in real time, promptly reporting abnormal temperature signals. This allows the battery management system to respond quickly and take measures to prevent safety issues caused by overheating, such as thermal runaway, significantly improving battery system safety and extending battery life.

[0018] Here, by using a new UV film pressing process to replace the traditional hot-pressing insulating film, blister bracket, and injection-molded bracket integrated busbar assembly process, and by using tin-plated copper wire for wiring to replace the existing numerous processes such as FPC etching, SMT, and laser welding, the integrated busbar structure is made simpler, reducing assembly steps and the number of parts, thus having advantages such as improved production efficiency and cost savings.

[0019] Compared to traditional vacuum-formed integrated busbars with vacuum-formed supports for the insulation layer, and injection-molded integrated busbars with injection-molded supports for the insulation layer, the UV insulating film has a thinner and lighter structure, effectively reducing space occupation, improving battery assembly design flexibility, and making it more suitable for space-constrained scenarios, such as small new energy equipment. It can accommodate more cells, increasing the energy density of the battery pack. Secondly, the simplified structure reduces production difficulty and defect rate, reduces raw material waste and production cycle, thereby reducing production costs, improving production efficiency, enhancing the company's market competitiveness, and meeting the large-scale battery production needs of the new energy market. Tinned copper wires work closely with the busbar to ensure stable power transmission and distribution. The rational layout of each component improves the stability and reliability of the integrated busbar, enhances the overall performance of the battery system, and ensures the normal operation of new energy equipment. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the overall structure of the novel integrated busbar in Embodiment 1 of this application.

[0022] Figure 2 This is an exploded view of the novel integrated busbar in Embodiment 1 of this application.

[0023] Figure 3 This is a process flow diagram of the processing method of the novel integrated busbar in Embodiment 2 of this application.

[0024] Explanation of reference numerals in the attached diagram: 1. Bottom UV film; 11. Through hole; 2. Tinned copper wire; 21. Conductive wire; 3. Busbar; 31. Aluminum busbar; 32. Clearance groove; 4. Top UV film; 5. PCB board; 6. Temperature sensor. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0026] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0027] It should also be understood that the terminology used in this application specification is for the purpose of describing particular embodiments only and is not intended to limit the application. As used in this application specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0028] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0029] Please refer to Figure 1 and Figure 2 This application provides a stacked busbar, which simplifies the existing integrated busbar structure. The new integrated busbar is lighter and more suitable for space-constrained scenarios. The integrated busbar includes a bottom UV film 1, a busbar 3, an upper UV film 4, a PCB board 5, a temperature sensor 6, and several tin-plated copper wires 2.

[0030] Specifically, in the radial direction of the upper UV film 4, the width of the upper UV film 4 is smaller than the width of the lower UV film 1. Several tin-plated copper wires 2 are wrapped between the lower UV film 1 and the upper UV film 4, with one end of each tin-plated copper wire 2 connected to the PCB board 5 for signal transmission. The other end of each tin-plated copper wire 2 is bent radially along the upper UV film 4 and connected to the busbar 3 for signal transmission. The busbar 3 is fixed to the lower UV film 1. A temperature sensor 6 is fixed to the upper surface of the lower UV film 1, and the temperature sensor 6 is connected to one of the tin-plated copper wires 2 for signal transmission.

[0031] This integrated busbar primarily achieves power transmission and monitoring functions through its unique structure. The bottom UV film 1 and the top UV film 4 tightly wrap the tin-plated copper wire 2, ensuring its stable fixation and insulation. One end of the tin-plated copper wire 2 connects to the PCB board 5, while the other end extends radially along the top UV film 4 for electrical connection with other components, achieving efficient power transmission and distribution. The busbar 3 is fixed to the bottom UV film 1 and connected to the tin-plated copper wire 2, capable of collecting current from multiple battery cells or distributing it to different circuit branches. A temperature sensor 6 monitors the integrated busbar temperature in real time, promptly reporting abnormal temperature signals, enabling the battery management system to respond quickly and take measures to prevent safety issues such as thermal runaway caused by overheating, significantly improving battery system safety and extending battery life.

[0032] In terms of insulation, the UV film has excellent insulating properties, effectively preventing current leakage and ensuring safe current transmission within the tinned copper wire 2. Regarding structural fixation, the UV film serves to fix the tinned copper wire 2, maintaining its stable position within the device and preventing short circuits or poor contact caused by wire displacement due to vibration or other external forces. The PCB cluster 5 can receive and send control signals. For example, in a battery management system, the PCB cluster 5 receives signals such as temperature and voltage from the battery via conductive lines 21, and can also send control signals to the battery, such as charging or discharging control signals, thereby achieving monitoring and management of the entire battery system. Here, by using a new UV film pressing process to replace the traditional hot-pressing insulating film, blister bracket, and injection-molded bracket integrated busbar assembly process, and by using tinned copper wire acquisition wiring technology to replace the existing numerous processes such as FPC etching, SMT, and laser welding, the integrated busbar structure is simplified, reducing assembly steps and the number of parts, thus offering advantages such as improved production efficiency and cost savings.

[0033] Compared to traditional vacuum-formed integrated busbars with vacuum-formed supports for the insulation layer, and injection-molded integrated busbars with injection-molded supports for the insulation layer, the UV insulating film has a thinner and lighter structure, effectively reducing space occupation, improving battery assembly design flexibility, and making it more suitable for space-constrained scenarios, such as small new energy equipment. It can accommodate more cells, increasing the energy density of the battery pack. Secondly, the simplified structure reduces production difficulty and defect rate, reduces raw material waste and production cycle, thereby reducing production costs, improving production efficiency, enhancing the company's market competitiveness, and meeting the large-scale battery production needs of the new energy market. The tin-plated copper wire 2 and the busbar 3 work closely together to ensure stable power transmission and distribution. The rational layout of each component improves the stability and reliability of the integrated busbar, enhances the overall performance of the battery system, and ensures the normal operation of new energy equipment.

[0034] In one specific embodiment, the tin-plated copper wires 2 are of varying lengths and are spaced apart. The overlapping portion between the upper UV film 4 and the lower UV film 1 forms a coverage area, where the tin-plated copper wires 2 are located. The other end of each tin-plated copper wire 2 is bent to form a conductive wire 21, which protrudes from the coverage area and connects to the busbar 3. In this embodiment, the tin-plated copper wires 2 are connected to the busbar 3 via ultrasonic welding. This design allows electrical energy to be transmitted from the PCB board 5 through the tin-plated copper wires 2, flowing into the busbar 3 via the conductive wires 21, and then being collected or distributed by the busbar 3, achieving efficient and stable collection and transmission of electrical energy and ensuring the normal operation of the battery system.

[0035] The varying lengths of the tinned copper wires 2 accommodate different battery cell and busbar spacing 3, avoiding excessively long wires from becoming tangled and excessively short wires from causing connection difficulties. This improves space utilization and enhances the flexibility of battery pack design. The lengths of each tinned copper wire 2 can be precisely planned according to the battery pack layout, facilitating integrated busbar installation and battery pack assembly. The diverse lengths of the tinned copper wires 2 adapt to different battery pack specifications and complex application environments, improving the adaptability of the integrated busbar and facilitating future expansion and upgrades. For example, adding battery cells or adjusting the battery pack structure only requires changing the length of some tinned copper wires 2, without significantly modifying the overall design, reducing costs and time. Furthermore, multiple tinned copper wires 2 transmit power in parallel, increasing the power transmission path, reducing resistance, minimizing power loss, and improving transmission efficiency. Each tinned copper wire 2 transmits independently without interference, improving power transmission stability and ensuring stable operation of the battery system.

[0036] Furthermore, the busbar 3 includes multiple aluminum busbars 31. These aluminum busbars 31 are arranged on both sides of the upper UV film 4 and the tin-plated copper wire 2, with each conductive wire 21 connected to one aluminum busbar 31. Current can be effectively transmitted to the corresponding aluminum busbar 31 through the conductive wires 21, and then collected or distributed among the aluminum busbars 31. Because the aluminum busbars 31 have good electrical and thermal conductivity, they can not only efficiently conduct current but also help dissipate the heat generated during power transmission, thereby ensuring the stability of current transmission and the temperature stability of the busbar 3.

[0037] The arrangement of multiple aluminum busbars 31 increases the power transmission path, reduces resistance, minimizes power loss, and improves transmission efficiency. Each conductive line 21 connects to one aluminum busbar 31, making power transmission more orderly and efficient, facilitating current collection, distribution, and management, and enhancing the overall integration of the battery system. Furthermore, the strength and rigidity of the aluminum busbars 31 provide excellent mechanical support for the busbar 3, ensuring structural stability under battery vibration and impact conditions, guaranteeing reliable power transmission, and reducing the risk of electrical connection failures due to structural deformation. The aluminum busbars 31 are relatively inexpensive and easy to process and manufacture, reducing the production cost of the busbar 3. Simultaneously, the design of multiple aluminum busbars 31 allows for flexible adjustment of their quantity and layout according to different battery system requirements, offering good scalability and meeting diverse battery pack configuration requirements.

[0038] In one specific embodiment, the bottom UV film 1 has a plurality of through holes 11, and each aluminum busbar 31 is fixed at the through hole 11.

[0039] The through-holes 11 in the bottom UV film 1 provide precise positioning for the installation of the aluminum busbars 31. Each aluminum busbar 31 is fixed at one of the through-holes 11, typically through mechanical connections (such as bolts, welding, etc.) and adhesives. Mechanical connections provide stable physical support, ensuring that the aluminum busbars 31 do not shift within the integrated busbar. Simultaneously, the contact between the aluminum busbars 31 and the bottom UV film 1 at the through-holes 11 provides a stable electrical connection point for current transmission (e.g., connecting battery terminals). Current can be further conducted through the contact area between the aluminum busbars 31 and the bottom UV film 1 to other conductive components such as the tinned copper wires 2, enabling current transmission between different parts within the busbar.

[0040] In one specific embodiment, a recess 32 is provided on the side of the aluminum busbar 31 near the tin-plated copper wire 2, and the temperature sensor 6 is located within the recess 32. Placing the temperature sensor 6 within the recess 32 of the aluminum busbar 31 avoids additional space occupation, making the integrated busbar structure more compact and improving space utilization, which is especially important for battery packs with limited space, and facilitates overall structural optimization. Furthermore, since the temperature sensor 6 is embedded in the recess 32 and partially enclosed by the aluminum busbar 31, it is less susceptible to external interference and can still operate stably under battery vibration, impact, and other operating conditions, continuously monitoring the temperature and providing reliable assurance for the stable operation of the battery system.

[0041] During battery operation, the tinned copper wire 2 and aluminum busbar 31 generate heat due to the current flowing through them. The temperature sensor 6 can quickly and accurately detect temperature changes at these points and transmit the temperature signal to the battery management system in real time. When the tinned copper wire 2 or busbar 3 overheats due to a fault, the temperature sensor 6 can quickly report the temperature abnormality. Upon receiving the signal, the battery management system immediately takes measures such as cutting off the circuit and activating the cooling system to effectively prevent safety accidents caused by overheating and ensure the safe operation of the battery system.

[0042] In this embodiment, both the bottom UV film 1 and the top UV film 4 are single-sided insulating films. Specifically, single-sided insulating cold-pressed UV adhesive films in the prior art can be used, such as the patent document with publication number CN119875557A. Therefore, the specific components of the bottom UV film 1 and the top UV film 4 will not be described in detail.

[0043] During production, this UV film is tightly bonded to tin-plated copper wire and other components through a cold-pressing process. In the battery system, the single-sided insulating UV film plays a crucial role in insulation and protection, preventing current leakage and short circuits. Its insulating layer effectively blocks the flow of current between different conductive components, ensuring that electrical energy is transmitted along a predetermined path. Meanwhile, the other side of the UV film can cooperate with other structural components or insulating materials within the battery pack to form a complete electrical insulation system.

[0044] In this embodiment, the temperature sensor 6 is an NTC thermistor temperature sensor, and the temperature sensor 6 is connected to the corresponding tinned copper wire 2 by ultrasonic welding. The NTC thermistor temperature sensor operates based on the negative temperature coefficient (NTC) characteristic. When the integrated busbar generates heat during operation, causing the ambient temperature to rise, the resistance value of the NTC thermistor will decrease accordingly.

[0045] When the temperature changes, the NTC thermistor can quickly sense the change and convert it into an electrical signal. Temperature sensor 6 transmits the detected temperature signal (resistance change signal) to the control system. The control system processes and analyzes these signals, performing operations such as filtering and amplification to improve signal accuracy and reliability. Then, the control system determines whether the integrated busbar is operating normally based on a preset temperature threshold. If the temperature exceeds the normal range, the control system will take corresponding measures, such as issuing an alarm, adjusting the current, or activating the cooling system, to ensure the safe operation of the integrated busbar and its associated system.

[0046] Furthermore, NTC thermistors are simple in structure, small in size, and stable in performance. They can operate stably for extended periods over a wide temperature range and are not easily affected by external environmental factors. This provides reliable and stable temperature monitoring data for battery systems, reducing battery performance degradation and safety hazards caused by temperature monitoring failures. Compared to other types of temperature sensors, NTC thermistors are lower in cost, easier to integrate and install on integrated busbars, and require no complex supporting facilities or high maintenance costs. While ensuring the temperature monitoring performance of the battery system, this effectively reduces the overall cost of the battery system and enhances its market competitiveness.

[0047] In one specific embodiment, the bottom UV film 1 has a bottom UV adhesive layer on one side for fixing the top UV film 4, and the top UV film 4 has an upper UV adhesive layer on one side fixed to the bottom UV film 1.

[0048] The bottom and top UV adhesive layers are fixed to the aluminum busbar 31 and tinned copper wire 2 by UV light irradiation and room temperature, eliminating the need for traditional hot pressing equipment. Compared to structures without UV adhesive layers, this new integrated busbar will not experience loosening or delamination between layers during long-term use. For example, during the frequent bumpy driving of an electric vehicle, the busbar can still remain stable, and the internal wire connections will not loosen or the insulation layer will detach due to vibration, thereby improving the service life and reliability of the busbar.

[0049] In addition, UV adhesive possesses excellent insulation properties. In high-voltage, high-current battery systems or other electrical equipment, good insulation is crucial for ensuring safe operation. This enhanced insulation allows equipment to operate under safer conditions, reducing malfunctions and safety accidents caused by insulation problems, such as electric shock and fire. Even in special circumstances, such as minor damage to the UV film or slight displacement of the tinned copper wire 2, the UV adhesive layer can still provide a certain degree of insulation, preventing current leakage or short circuits between different conductive components.

[0050] On the other hand, this embodiment also optimizes the processing method of the integrated busbar, which can improve the problems of multiple processes and low efficiency of hot-pressing integrated busbar in the traditional busbar processing method. It has advantages such as improving production efficiency, reducing the number of parts of the integrated busbar, and reducing costs. Specifically, the processing method includes steps S1-S10.

[0051] Step S1: The tin-plated copper wire is fixed on the bottom UV film by an automatic wiring machine. The wiring machine can automatically feed and cut the wire according to the design line and arrange the tin-plated copper wire into multiple conductive lines.

[0052] Using automated wiring machines to fix tinned copper wires significantly improves the speed and accuracy of wiring. Compared with traditional manual or semi-automatic wiring methods, automated wiring machines can quickly lay out tinned copper wires according to a predetermined design. They can complete multiple operation steps such as wire feeding, cutting, and wiring in a short time, reducing delays and errors that may be caused by manual operation and lowering labor costs.

[0053] Step S2: Place the temperature sensor and busbar at the corresponding window positions punched out by the bottom UV film, and pre-fix them by bonding with the UV adhesive layer on the bottom UV film.

[0054] Pre-fixation using a UV adhesive layer on the UV underlayer film is a quick and convenient method. The UV adhesive cures rapidly under UV light, temporarily fixing the temperature sensor and busbar to the corresponding window positions on the underlayer UV film. Compared to traditional mechanical fixing or manual positioning and bonding methods, this pre-fixation method can significantly shorten assembly time.

[0055] The underlying UV film is pre-cut with corresponding window positions, providing precise mounting positioning for the temperature sensor and busbar. This ensures that the temperature sensor and busbar are in the correct position during subsequent processing steps, avoiding rework or scrap due to positional deviations. The automated pre-fixing process ensures that each component is installed in the predetermined design position, improving the efficiency and accuracy of the entire assembly process.

[0056] Pre-fixation ensures the temperature sensor and busbar remain stable on the underlying UV film, preventing displacement or skewing during subsequent processing and handling. The pre-fixation of the UV adhesive layer also provides a foundation for the subsequent curing process. Furthermore, the accuracy and stability of pre-fixation reduce material waste caused by assembly errors or component damage, thereby lowering overall production costs.

[0057] Step S3: Cover and fix the upper UV film onto the tin-plated copper wire, and extend multiple conductive lines out of the coverage area of ​​the upper UV film.

[0058] The upper UV film covers the tinned copper wire, providing excellent insulation protection. Simultaneously, the upper UV film protects the tinned copper wire from physical damage such as friction and impact. During the installation and use of the integrated busbar, the tinned copper wire may be subjected to physical forces from other components or the external environment; the upper UV film acts as a buffer and protector, extending the service life of the tinned copper wire.

[0059] By covering and fixing the upper UV film onto the tin-plated copper wire, the position of the tin-plated copper wire can be further stabilized. Combined with the fixing effect of the lower UV film, this keeps the tin-plated copper wire stable between the upper and lower UV films, preventing displacement or movement during subsequent processing or use. This stable structure helps ensure the layout accuracy of the conductive lines and guarantees the reliability of current transmission. Extending multiple conductive lines beyond the coverage area of ​​the upper UV film allows for effective management and guidance of the conductive lines. This design ensures that the conductive lines extend along a predetermined path, facilitating connection with subsequent circuit components (such as PCBs), while avoiding tangling or interference between conductive lines, improving the neatness and standardization of the entire integrated busbar wiring.

[0060] Step S4: The temperature sensor, busbar, and tinned copper wire are cold-pressed and fixed to the bottom UV film through a cold pressing process.

[0061] The cold-pressing process applies pressure to ensure a tight bond between the temperature sensor, busbar, tinned copper wire, and the underlying UV film. This physical pressure effectively eliminates air between the components and the underlying UV film, creating a secure contact. Simultaneously, the UV adhesive layer on the underlying UV film further enhances the bonding effect. The cold-pressed components exhibit significantly improved mechanical stability, better resisting mechanical stresses such as vibration and impact, ensuring no displacement or loosening occurs during subsequent processing and use.

[0062] Cold pressing is a relatively efficient fixing method. Compared to traditional hot pressing or other complex fixing processes, it can fix temperature sensors, busbars, and tinned copper wires in a shorter time. Unlike hot pressing, cold pressing does not require heating and cooling processes and can be performed directly at room temperature, thus significantly shortening the production cycle. Furthermore, cold pressing does not require additional heating equipment or large amounts of energy to raise the temperature, greatly reducing energy consumption compared to hot pressing. Over long-term production, this energy saving effect can significantly reduce production costs.

[0063] In this embodiment, the cold pressing parameters are: temperature 10-30℃, pressing time 2-3 min, and pressure 0.3-0.5 MPa. Preferably, the pressure is 0.4 MPa.

[0064] Temperature conditions are controlled between 10-30℃. This temperature range is the normal operating temperature range for most materials (such as UV films, tinned copper wires, busbars, and temperature sensors) near room temperature, during which the physical and chemical properties of the materials are relatively stable. For example, at 10-30℃, the flexibility, viscosity, and mechanical properties of UV films remain in good condition. They will not become too stiff due to excessively low temperatures, nor will they soften or deform due to excessively high temperatures, which is conducive to the smooth progress of the cold pressing process.

[0065] The pressure is 0.4 MPa, which is a moderate pressure. For integrated busbar components, this pressure ensures sufficient pressure contact between components without causing excessive compression damage to the materials. During the cold pressing process, 0.4 MPa pressure allows the temperature sensor, busbar, tinned copper wire, and underlying UV film to adhere tightly without causing plastic deformation or damage to the internal structure of the components. For example, for metal components such as the aluminum busbar and tinned copper wire of the busbar, good contact can be achieved at 0.4 MPa pressure without metal deformation or damage due to excessive pressure.

[0066] The pressing time is set to 2-3 minutes, providing ample time for the cold pressing process. Within this timeframe, the components can fully contact and adapt to each other under pressure, eliminating air between components and maximizing the contact area at the bonding points. For example, during the 2-3 minute pressing process, the temperature sensor and manifold can fully adhere to the underlying UV film, ensuring stable positioning and good adhesion during subsequent curing and use.

[0067] Here, temperature, pressing time, and pressure work together to achieve optimal cold-pressing fixation. At temperatures between 10-30℃, the material is in a stable state; a pressure of 0.4MPa provides moderate force; and a pressing time of 2-3 minutes ensures that components such as temperature sensors, busbars, and tinned copper wires are firmly fixed to the underlying UV film. This coordinated approach ensures that the integrated busbar after cold pressing achieves high quality standards in terms of mechanical strength, electrical connectivity, and stability.

[0068] Step S5: The bottom UV film and the top UV film are cured by UV light to completely fix the temperature sensor, busbar, tinned copper wire and other components.

[0069] UV light irradiation cures the bottom and top UV films, causing a photochemical reaction that cross-links and cures both the UV adhesive layer and the UV film itself. This curing process not only strengthens the bottom and top UV films themselves but also enhances the adhesion between components such as temperature sensors, busbars, and tinned copper wires and the UV film. The cured UV film acts like a robust "protective shell," tightly encasing and securing these components, ensuring they do not shift or loosen during subsequent use.

[0070] Furthermore, UV-cured UV films exhibit superior insulation properties. The cured UV film has a denser structure, better preventing current leakage and increasing the insulation resistance of the integrated busbar, which is crucial for ensuring its safe operation under high voltage and high current conditions. Moreover, the cured UV film is more resistant to environmental factors such as temperature, humidity, and chemicals. It maintains stable performance over a wide temperature range, preventing component loosening or performance degradation due to temperature changes; it also resists the corrosive effects of moisture and chemicals, extending the service life of the integrated busbar.

[0071] Step S6: Ultrasonically weld each conductive wire to the aluminum busbar for fixation.

[0072] Ultrasonic welding is a highly efficient welding technology that utilizes high-frequency vibration energy to cause the metal atoms between the conductive wire and the aluminum busbar to diffuse and bond, forming a strong weld joint. This welding method ensures extremely high reliability of the electrical connection between the conductive wire and the aluminum busbar during long-term use, preventing loosening or detachment due to external factors such as vibration and temperature changes. Ultrasonic welding enables direct metal-to-metal connections, offering higher connection strength and stability compared to other connection methods (such as simple mechanical connections or adhesive bonding). This stability is crucial for ensuring the normal operation of integrated busbars under various complex working conditions, especially in applications with extremely high reliability requirements, such as electric vehicles and industrial equipment.

[0073] Ultrasonic welding effectively reduces the contact resistance between the conductive wire and the aluminum busbar, ensuring minimal energy loss during current transmission. Low contact resistance improves power transmission efficiency and reduces energy waste and safety hazards caused by resistance heating. Ultrasonic welding guarantees highly consistent conductivity at each weld point. In mass production, this consistency ensures stable electrical performance for every product, reduces performance fluctuations due to variations in weld quality, and improves product quality control.

[0074] By ultrasonically welding each conductive wire to the aluminum busbar, a robust connection between the conductive wire and the aluminum busbar is achieved, ensuring the stability and reliability of the electrical connection. This also significantly reduces the amount of wiring harness used. Ultrasonic welding directly fuses the aluminum busbar to the connection point (such as battery tabs or terminals), eliminating the need for intermediate wiring harnesses and achieving a "cableless" connection. This design reduces the number of parts, simplifies the overall structure, and reduces the complexity and potential failure points caused by excessive wiring harnesses, further enhancing the simplicity and reliability of the integrated busbar.

[0075] Step S7: Solder the temperature sensor to the tin-plated copper wire to fix it in place.

[0076] Soldering is a reliable electrical connection method. By soldering a temperature sensor to a tinned copper wire, the temperature signal (electrical signal) generated by the temperature sensor can be stably transmitted to the subsequent control system. Soldering can form a good electrical contact, reduce contact resistance, and reduce signal loss and interference during transmission.

[0077] Meanwhile, soldered connections offer superior durability. In the operating environment of integrated busbars, factors such as temperature variations and vibrations may occur. Soldered connections can resist these factors to a certain extent, maintaining the long-term effectiveness of the electrical connection. Compared to simple plug-in connections or other temporary connection methods, soldered connections are less prone to loosening or poor contact, thus ensuring that the temperature sensor transmits signals stably throughout its entire lifespan.

[0078] Step S8: Fix the tin-plated copper wire to the PCB board using a through-hole pulse soldering process.

[0079] Through-hole pulse soldering enables a stable and low-impedance electrical connection between tinned copper wires and the PCB board, allowing current to be efficiently and stably transferred from the tinned copper wires to the PCB board and then to subsequent circuit components, ensuring the normal operation of the entire circuit system. This process offers fast soldering speed and concentrated energy, providing sufficient heat in a short time to melt the solder and wet the pads and leads, forming a strong solder joint. This effectively avoids problems such as cold solder joints and false solder joints, thus significantly improving the reliability of the electrical connection between the tinned copper wires and the PCB board, and enhancing the stability of the entire circuit.

[0080] Through-hole pulse soldering offers high soldering speed, enabling the completion of large-scale soldering tasks in a short time, significantly improving production efficiency. Compared to traditional manual soldering methods, through-hole pulse soldering saves substantial time and labor costs, making it particularly suitable for large-scale production. This process is easily automated and can be integrated with automated production lines and equipment to further enhance production efficiency and quality stability. By programming and controlling soldering parameters, consistent quality across each solder joint can be ensured, reducing errors from manual operation.

[0081] Step S9, Welding performance test: The ultrasonic solder joints of the tinned copper wire and busbar are automatically inspected by AVI vision.

[0082] AVI (Automated Vision Inspection) can quickly and accurately identify surface defects in solder joints, such as their shape, size, location, and integrity. This helps ensure that each solder joint meets predetermined quality standards, thereby improving overall product quality. AVI systems typically record inspection results, providing detailed traceability data for the production process. This is extremely useful for quality control and problem tracking, especially when analyzing production issues or conducting quality certification. Automated vision inspection can detect welding defects early in the production process, allowing manufacturers to adjust process parameters or perform rework in a timely manner, thereby reducing production costs and increasing production efficiency.

[0083] Step S10: Functional performance test; Power on the integrated busbar and test its electrical performance, such as continuity and insulation withstand voltage.

[0084] Continuity testing ensures that current flows normally and continuously through all conductive paths of the integrated busbar. By conducting power-on tests, problems such as open circuits in wires and poor contact at connection points can be detected in a timely manner, thus guaranteeing that the integrated busbar can reliably transmit current in actual use and fulfill its basic function as a current transmission medium. It can also verify whether the conductive lines are correctly connected to the corresponding aluminum busbars and PCB components as required by the design. If there are wiring errors or wires connected to incorrect endpoints, abnormal current paths or short circuits can be detected during power-on testing, ensuring that the integrated busbar's function meets design expectations.

[0085] Insulation withstand voltage testing verifies whether the insulation performance of the integrated busbar meets the standards. During energization testing, a certain voltage is applied to test whether the insulating material (such as a UV film) can effectively prevent current leakage. Poor insulation performance may lead to leakage between adjacent conductive parts, which not only affects the performance of the integrated busbar but may also cause serious safety accidents such as electric shock or fire. It also determines the reliability of the integrated busbar under high voltage conditions, which is crucial for ensuring the safe operation of the integrated busbar in complex and variable electrical environments.

[0086] Therefore, the implementation principle of this processing method is as follows: through automated operations (such as automatic wiring and AVI inspection) and optimized process steps (such as cold pressing and UV curing), production efficiency is significantly improved, while cumbersome procedures and labor costs are reduced. Simultaneously, rigorous quality inspection procedures ensure the electrical performance and connection reliability of the product, effectively improving product quality and stability. Furthermore, this method reduces the number of parts in the integrated busbar, lowering material and inventory costs. Overall, this processing method not only improves production efficiency and product quality but also reduces production costs, enhancing the product's market competitiveness. It possesses significant economic and technological advantages, is suitable for large-scale production, and can meet the new energy market's demand for efficient, reliable, and low-cost battery components.

[0087] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A laminated busbar, characterized in that: Includes a bottom UV film, busbar, top UV film, PCB board, temperature sensor, and several tinned copper wires; In the radial direction of the upper UV film, the width of the upper UV film is smaller than the width of the lower UV film; Several of the tin-plated copper wires are wrapped between the bottom UV film and the top UV film, and one end of the tin-plated copper wire is connected to the PCB board signal. The other end of the tin-plated copper wire is bent radially along the upper UV film and connected to the bus signal. The busbar is fixed to the bottom UV film; The temperature sensor is fixed to the upper surface of the bottom UV film, and the temperature sensor is signal-connected to a tinned copper wire.

2. The laminated busbar according to claim 1, characterized in that, The tin-plated copper wires are of different lengths and are spaced apart; The overlapping portion between the upper UV film and the lower UV film is the coverage area, and the tin-plated copper wire is located in the coverage area; The other end of the tinned copper wire is bent to form a conductive wire, which protrudes from the coverage area and is connected to the busbar signal.

3. A laminated busbar according to claim 2, characterized in that, The busbar includes multiple aluminum busbars, which are arranged on both sides of the upper UV film, and each conductive line is connected to one of the aluminum busbars.

4. A laminated busbar according to claim 3, characterized in that, The bottom UV film has several through holes, and each aluminum busbar is fixed at one of the through holes.

5. A laminated busbar according to claim 3, characterized in that, A clearance groove is provided on the side of the aluminum busbar near the tin-plated copper wire, and the temperature sensor is located in the clearance groove.

6. A laminated busbar according to claim 1, characterized in that, The bottom UV film is provided with a bottom UV adhesive layer on one side for fixing the top UV film, and the top UV film is provided with an upper UV adhesive layer on one side for fixing the bottom UV film.

7. A laminated busbar according to claim 1, characterized in that, Both the bottom UV film and the top UV film are single-sided insulating films.

8. A laminated busbar according to claim 1, characterized in that, The temperature sensor is an NTC thermistor temperature sensor.

9. A laminated busbar according to claim 1, characterized in that, The tin-plated copper wire is connected to the busbar by ultrasonic welding.

10. A laminated busbar according to claim 1, characterized in that, The temperature sensor is connected to the corresponding tin-plated copper wire via ultrasonic welding.

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