Dual-housing type bone conduction MEMS microphone

Abstract

The utility model discloses a kind of double-shell type bone conduction MEMS microphones, it relates to bone conduction MEMS microphone technical field, to solve the problem that the existing bone conduction microphone has insufficient in structural strength and protective performance, assembly convenience and use stability are improved, its technical scheme main point includes PCB board, first shell and second shell are installed on the outer surface of the PCB board, the second shell is located in the inside of first shell, diaphragm assembly is provided on the outer surface of the second shell, the diaphragm assembly is located between first shell and second shell, MEMS chip and ASIC chip are provided on the outer surface of the PCB board, the MEMS chip and ASIC chip are located in the inside of second shell, a plurality of PAD connecting structures are provided on the outer surface of the side of the PCB board. Reach the effect that can be conveniently assembled, while protective performance is strong, structural connection firmness is strong, can carry out more stable work.

Description

Technical Field

[0001] This utility model relates to the field of bone conduction MEMS microphone technology, and in particular to a double-shell type bone conduction MEMS microphone. Background Technology

[0002] Bone conduction microphones transmit sound signals by picking up vibrations from the user's own bones and are widely used in the field of smart wearables. These devices mainly consist of a MEMS chip, a mass block, a sealed cavity, and an ASIC chip. When a user speaks, the vocal cords vibrate and are transmitted through the skull to the diaphragm of the MEMS chip. The inertia of the mass block causes the diaphragm to shift, resulting in a change in the chip's internal capacitance, which is then converted into an electrical signal. This design avoids the dependence on air pressure, a reliance on traditional microphones, and eliminates environmental noise and airflow interference through the sealed cavity.

[0003] Existing bone conduction microphones are inadequate in terms of structural strength and protective performance, and their ease of assembly and stability in use need to be improved. Utility Model Content

[0004] The purpose of this invention is to provide a double-shell type bone conduction MEMS microphone that is easy to assemble, has strong protective performance, a strong structural connection, and can perform more stable operation.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A dual-shell bone conduction MEMS microphone includes a PCB board. A first shell and a second shell are mounted on the outer surface of the PCB board. The second shell is located inside the first shell. A diaphragm assembly is disposed on the outer surface of the second shell and is located between the first shell and the second shell. A MEMS chip and an ASIC chip are disposed on the outer surface of the PCB board. Both the MEMS chip and the ASIC chip are located inside the second shell. Multiple PAD connection structures are disposed on one outer surface of the PCB board.

[0007] By adopting the above technical solution, the first and second shells can be used to ensure the stability of the internal structure, while also improving the overall structural strength of the microphone and preventing damage to the internal structure during assembly.

[0008] Furthermore, the diaphragm assembly includes a support ring, a diaphragm is covered and installed at the port of the support ring, and a mass block is adhered and installed on the outer surface of the diaphragm, the mass block being located inside the support ring.

[0009] By adopting the above technical solution, the diaphragm can be vibrated using a mass block.

[0010] Furthermore, a first vent hole is provided on the outer surface of the mass block, and a second vent hole is provided on the outer surface of the first outer shell.

[0011] By adopting the above technical solution, the stability of the internal air pressure is ensured.

[0012] Furthermore, a sound hole is provided on the outer surface of the second housing.

[0013] By adopting the above technical solution, the effective propagation of vibration is ensured.

[0014] Furthermore, the MEMS chip is electrically connected to the ASIC chip via gold wires, and the ASIC chip is electrically connected to the PCB board via gold wires.

[0015] By adopting the above technical solution, stable transmission of electrical signals is ensured.

[0016] Furthermore, both the first and second housings are soldered to the PCB board using solder paste.

[0017] By adopting the above technical solutions, the structural connection strength can be effectively improved.

[0018] In summary, the beneficial technical effects of this utility model are as follows:

[0019] This invention can protect the internal structure of the microphone during use by utilizing the first and second outer shells. At the same time, it can effectively prevent damage to the deepest structure during the assembly of the internal structure, thus effectively improving the assembly stability. Attached Figure Description

[0020] Figure 1 This is a diagram of the internal structure of this utility model.

[0021] In the diagram: 1. PCB board; 2. First shell; 3. Second shell; 4. MEMS chip; 5. ASIC chip; 6. PAD connection structure; 7. Sound hole; 8. Support ring; 9. Diaphragm; 10. First vent hole; 11. Second vent hole; 12. Mass block; 13. Diaphragm assembly. Detailed Implementation

[0022] The method of this utility model will be further described in detail below with reference to the accompanying drawings.

[0023] Reference Figure 1A dual-shell bone conduction MEMS microphone includes a PCB board 1. A first shell 2 and a second shell 3 are mounted on the outer surface of the PCB board 1. The second shell 3 is located inside the first shell 2. A diaphragm assembly 13 is disposed on the outer surface of the second shell 3, and the diaphragm assembly 13 is located between the first shell 2 and the second shell 3. A MEMS chip 4 and an ASIC chip 5 are disposed on the outer surface of the PCB board 1, and both the MEMS chip 4 and the ASIC chip 5 are located inside the second shell 3. Multiple PAD connection structures 6 are disposed on one side of the outer surface of the PCB board 1. The first shell 2 and the second shell 3 are soldered to the PCB board 1 with solder paste. During use, the first shell 2 and the second shell 3 can be used to protect the internal structure of the microphone. At the same time, during the assembly of the internal structure, damage to the deepest structure can be effectively avoided, and the assembly stability is effectively improved.

[0024] Reference Figure 1 The diaphragm assembly 13 includes a support ring 8, with a diaphragm 9 covering and installed at the port of the support ring 8. A mass block 12 is adhered and installed on the outer surface of the diaphragm 9, located inside the support ring 8. A first vent hole 10 is provided on the outer surface of the mass block 12, a second vent hole 11 is provided on the outer surface of the first shell 2, and a sound hole 7 is provided on the outer surface of the second shell 3. The MEMS chip 4 is electrically connected to the ASIC chip 5 via gold wires, and the ASIC chip 5 is electrically connected to the PCB board 1 via gold wires. When in use, the wearer makes a sound, and the vibration of the bones drives the diaphragm 9 in the diaphragm assembly 13 to vibrate. With the sound hole 7 connected, the pressure inside the cavity changes, and the changing pressure is transmitted to the diaphragm of the MEMS chip 4, causing the diaphragm of the MEMS chip 4 to vibrate. The vibration signal is converted into an electrical signal, which is amplified and processed by the ASIC chip 5 before being output, ensuring the effective operation of the microphone.

[0025] Working principle: When in use, first install the microphone in the designated position, then it can effectively pick up sound. When the wearer makes a sound, the vibration of the bones drives the diaphragm 9 in the diaphragm assembly 13 to vibrate. With the sound hole 7 connected, the pressure in the cavity changes. The change in pressure is transmitted to the diaphragm of the MEMS chip 4, causing the diaphragm of the MEMS chip 4 to vibrate. The vibration signal is converted into an electrical signal, which is then amplified and processed by the ASIC chip 5 before being output.

[0026] The embodiments described herein are preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape, and principle of this utility model should be included within the scope of protection of this utility model.

Claims

1. A double-shell type bone conduction MEMS microphone, comprising a PCB board (1), characterized in that: A first housing (2) and a second housing (3) are mounted on the outer surface of the PCB board (1). The second housing (3) is located inside the first housing (2). A diaphragm assembly (13) is disposed on the outer surface of the second housing (3). The diaphragm assembly (13) is located between the first housing (2) and the second housing (3). A MEMS chip (4) and an ASIC chip (5) are disposed on the outer surface of the PCB board (1). Both the MEMS chip (4) and the ASIC chip (5) are located inside the second housing (3). A plurality of PAD connection structures (6) are disposed on one side of the outer surface of the PCB board (1).

2. The double-shell type bone conduction MEMS microphone according to claim 1, characterized in that: The diaphragm assembly (13) includes a support ring (8), a diaphragm (9) is covered and installed at the port of the support ring (8), and a mass block (12) is adhered and installed on the outer surface of the diaphragm (9), the mass block (12) being located inside the support ring (8).

3. A double-shell type bone conduction MEMS microphone according to claim 2, characterized in that: The outer surface of the mass block (12) is provided with a first vent hole (10), and the outer surface of the first outer shell (2) is provided with a second vent hole (11).

4. A double-shell type bone conduction MEMS microphone according to claim 1, characterized in that: A sound hole (7) is provided on the outer surface of the second housing (3).

5. A double-shell type bone conduction MEMS microphone according to claim 1, characterized in that: The MEMS chip (4) is electrically connected to the ASIC chip (5) via gold wires, and the ASIC chip (5) is electrically connected to the PCB board (1) via gold wires.

6. A double-shell type bone conduction MEMS microphone according to claim 1, characterized in that: The first outer shell (2) and the second outer shell (3) are both soldered to the PCB board (1) by solder paste.

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