Vacuum chuck and vacuum printing jig for adhesive pad printing

By setting a non-penetrating vacuum groove and a through-hole structure at the bottom of the vacuum chuck, the problem of glue entering the sound hole and vacuum hole was solved, achieving a stable printing process and equipment reliability, and improving the yield and lifespan of MEMS microphones.

CN224335286UActive Publication Date: 2026-06-09XINZHIYUAN INTELLIGENT EQUIPMENT MANUFACTURING (SUZHOU) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
XINZHIYUAN INTELLIGENT EQUIPMENT MANUFACTURING (SUZHOU) CO LTD
Filing Date
2025-06-30
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

When using existing vacuum suction cups on printed circuit boards, adhesive can easily be sucked into the sound holes and vacuum holes of MEMS microphones, leading to decreased microphone performance and equipment contamination. Furthermore, reducing vacuum suction to prevent adhesive from being sucked in can result in printing defects.

Method used

Design a vacuum suction cup that uses a non-penetrating vacuum groove and a through hole at the bottom of the groove. The vacuum groove is set to correspond to the blank area of ​​the printed circuit board, and the through hole at the bottom of the groove is connected to the vacuum generating device to form a large area of ​​uniform adsorption force, avoiding the sound hole area.

Benefits of technology

It effectively prevents glue from entering the acoustic pores and vacuum pores, improves adsorption stability, reduces acoustic pore blockage rate, enhances equipment reliability and service life, and reduces maintenance costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

This specification relates to the field of printed circuit board manufacturing technology, specifically disclosing a vacuum suction cup and vacuum printing fixture for printing adhesive pads. The vacuum suction cup is used to adsorb printed circuit boards, on which multiple MEMS microphone units are disposed, and each MEMS microphone unit has a sound hole. The vacuum suction cup includes a suction cup body, and a vacuum adsorption structure is disposed on the adsorption area of ​​the suction cup body. The vacuum adsorption structure includes at least one vacuum groove. The position of the at least one vacuum groove in the adsorption area corresponds to the blank area on the corresponding printed circuit board where no MEMS microphone unit is disposed. Each vacuum groove is a non-through vacuum groove, and the bottom of each vacuum groove is provided with multiple groove bottom through holes penetrating the suction cup body. Each groove bottom through hole is connected to a vacuum generating device. The above-mentioned vacuum suction cup can effectively reduce the probability of adhesive being sucked into the sound hole and groove bottom through holes while ensuring adsorption stability.
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