CCS components, battery pack
Patent Information
- Application Number
- CN202521146160.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-05
- Publication Date
- 2026-08-14
- Estimated Expiration
- 2035-06-05
AI Technical Summary
[0004]本实用新型的实施例提供了一种CCS组件、电池包,可以改善现有技术中CCS组件存在表面清洁度低的技术问题
[0019]在本实用新型的实施例中,通过在CCS组件的基底朝向导电排的一侧表面形成有连接结构,导电排形成有配合结构,连接结构与配合结构呈嵌合设置;采用与基底一体成型的连接结构以及与导电排一体成型的配合结构,提高了CCS组件的表面清洁度;缓解了现有技术中CCS组件存在表面清洁度低的技术问题。
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Figure CN224637352U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power battery technology, specifically to a CCS component and a battery pack. Background Technology
[0002] In related technologies, the aluminum busbars of traditional CCS modules are usually fixed with adhesive, but adhesive bonding has the problems of easy contamination and uncontrollable cleanliness.
[0003] Therefore, CCS components in related technologies suffer from the technical problem of low surface cleanliness. Utility Model Content
[0004] The embodiments of this utility model provide a CCS component and a battery pack, which can improve the technical problem of low surface cleanliness in existing CCS components.
[0005] In a first aspect, embodiments of the present invention provide a CCS component, comprising:
[0006] Base;
[0007] Multiple conductive busbars are disposed on the substrate;
[0008] The substrate has a connecting structure on the side surface facing the conductive busbar, and the conductive busbar has a mating structure. The connecting structure and the mating structure are fitted together.
[0009] In one embodiment, the connecting structure and the mating structure are in an interference fit.
[0010] In one embodiment, the interference fit has an interference range of 0.1 mm to 0.3 mm.
[0011] In one embodiment, the connecting structure is a protrusion, and the mating structure is a groove or a through hole.
[0012] In one embodiment, the tensile strength of the protrusion ranges from 60 MPa to 70 MPa.
[0013] In one embodiment, the bending strength of the protrusion ranges from 90 MPa to 100 MPa.
[0014] In one embodiment, the mating structure is the through hole, and the protrusion is disposed through the through hole. The protrusion includes a first portion located inside the through hole and a second portion extending beyond the through hole, wherein the thickness of the second portion ranges from 3 mm to 4 mm.
[0015] In one embodiment, one of the conductive busbars is provided corresponding to two of the connection structures, and the two connection structures are arranged symmetrically.
[0016] In one embodiment, the substrate is a polycarbonate structure, or the substrate is an acrylonitrile-butadiene-styrene copolymer structure.
[0017] Secondly, embodiments of the present invention provide a battery pack including the CCS component as described in any of the above embodiments.
[0018] The beneficial effects of the embodiments of this utility model are as follows:
[0019] In the embodiments of this utility model, a connecting structure is formed on the surface of the CCS module facing the conductive bus, and a mating structure is formed on the conductive bus. The connecting structure and the mating structure are interlocked. By adopting a connecting structure integrally formed with the substrate and a mating structure integrally formed with the conductive bus, the surface cleanliness of the CCS module is improved, thus alleviating the technical problem of low surface cleanliness in existing CCS modules. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a three-dimensional schematic diagram of the CCS component provided in an embodiment of this utility model;
[0022] Figure 2 This is an exploded view of the CCS component provided in an embodiment of this utility model.
[0023] 1. Substrate; 2. Conductor bus; 3. Connection structure; 4. Mating structure; 5. CCS assembly. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of the present utility model and are not intended to limit the present utility model. In the present utility model, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.
[0025] Furthermore, the terms "first," "second," and similar words do not indicate any order, quantity, or importance, but are merely used to distinguish different technical features. The terms "multiple" and similar words indicate two or more unless otherwise expressly specified.
[0026] In related technologies, aluminum busbars are fixed by adhesive or by hot riveting. Using adhesive will inevitably cause the glue to come into contact with air or other objects, sticking to foreign objects, making the cleanliness of CCS component 5 uncontrollable.
[0027] Please see Figure 1 and Figure 2 The CCS component 5 (Cell Contacting System) provided in the embodiment of this utility model includes a substrate 1 and a plurality of conductive bars 2, the conductive bars 2 being disposed on the substrate 1; wherein, a connecting structure 3 is formed on the side surface of the substrate 1 facing the conductive bars 2, and a mating structure 4 is formed on the conductive bars 2, the connecting structure 3 and the mating structure 4 being fitted together.
[0028] It is understandable that the connecting structure 3 is formed on the side surface of the substrate 1 facing the conductive busbar 2, indicating that the connecting structure 3 and the substrate 1 are integrally formed.
[0029] It should be noted that in related technologies, adhesive can also be used to connect structure 3 and substrate 1; however, this results in low surface cleanliness.
[0030] In this embodiment, a connecting structure 3 is formed on the side surface of the substrate 1 facing the conductive bus 2, and a mating structure 4 is formed on the conductive bus 2. The connecting structure 3 and the mating structure 4 are interlocked to connect the substrate and the conductive bus 2. Since the connecting structure 3 and the mating structure 4 are integrally formed with the substrate 1 and the conductive bus 2 respectively, the process of rivets or glue is replaced, thereby improving the surface cleanliness of the CCS component 5, simplifying the process and reducing the cost.
[0031] In one embodiment, the connecting structure 3 and the mating structure 4 are in an interference fit.
[0032] Among them, interference fit means that the size of the connecting structure 3 is slightly larger than the size of the mating structure 4, and a tight fixation is achieved by generating friction through forced pressing.
[0033] Among them, the mating structure 4 is a circular or irregular cavity, and the connecting structure 3 is a shape that matches the mating structure 4 so that the connecting structure 3 can be embedded into the mating structure 4.
[0034] Understandably, there is no need to use glue for connection to avoid the risk of contamination; no need for hot riveting to simplify the process and reduce costs; and the aluminum strip is prevented from falling off by relying solely on friction, which improves mechanical stability.
[0035] Understandably, the interference fit requires precision stamping or injection molding to ensure tolerance.
[0036] Understandably, the assembly process is as follows:
[0037] First, press-fit assembly: The connecting structure 3 is embedded into the mating structure 4 by pressure, and the connection structure 3 and the mating structure 4 are fixed by elastic deformation.
[0038] Secondly, thermal expansion and contraction can be used to assist assembly. When the mating structure 4 is a hole and the connecting structure 3 is a protrusion, the mating structure 4 can be heated or the connecting structure 3 can be cooled to reduce the difficulty of assembly.
[0039] In this embodiment, the aluminum strip and the thermoformed PC are fixed without glue by interference fit, which has the advantages of cleanliness, cost and process simplification.
[0040] In one embodiment, the interference amount of the interference fit ranges from 0.1 mm to 0.3 mm.
[0041] The interference fit between the connecting structure 3 and the mating structure 4 is any one of 0.1mm, 0.2mm, or 0.3mm.
[0042] It is understandable that when the interference fit between the connecting structure 3 and the mating structure 4 is less than 0.1, the holding force of the conductive busbar 2 is insufficient; when the interference fit between the connecting structure 3 and the mating structure 4 is greater than 0.3, the installation of the conductive busbar 2 and the substrate 1 becomes difficult.
[0043] It is understandable that when the interference fit between the connecting structure 3 and the mating structure 4 is less than 0.1, it may lead to poor vibration resistance of the connection structure 3 and the mating structure 4. When the interference fit between the connecting structure 3 and the mating structure 4 is greater than 0.3, the contact stress between the connecting structure 3 and the mating structure 4 is large, which makes it easy to generate cracks.
[0044] It should be noted that when the interference fit between the connecting structure 3 and the mating structure 4 is greater than 0.3, the connecting structure 3 and the mating structure 4 can be made of a more resilient material, or a chamfer can be added to the orifice of the mating structure 4.
[0045] It should be noted that when the interference fit between the connecting structure 3 and the mating structure 4 is less than 0.1, a textured structure can be added to the surface of the connecting structure 3 to enhance friction and prevent loosening between the connecting structure 3 and the mating structure 4 after long-term use.
[0046] In this embodiment, the interference range is defined as 0.1mm to 0.3mm, which can cover the actual application requirements while avoiding process risks.
[0047] In one embodiment, the connecting structure 3 is a protrusion, and the mating structure 4 is a groove or a through hole.
[0048] The protrusion can be cylindrical, square, or irregularly shaped.
[0049] When the connecting structure 3 is a circular protrusion and the mating structure 4 is a circular through hole, the top of the circular protrusion is flush with or slightly convex with the surface of the mating structure 4 after pressing.
[0050] When the connecting structure 3 is a square protrusion and the mating structure 4 is a rectangular groove, when the rectangular groove forms an interference fit with the connecting structure 3 along the width direction, a gap can be reserved along the length direction of the rectangular groove to prevent corner interference. When the connecting structure 3 is a circular protrusion and the mating structure 4 is a circular through hole, setting the connecting structure 3 as a square protrusion and the mating structure 4 as a rectangular groove can prevent the aluminum busbar from rotating and is suitable for scenarios requiring anti-torsion.
[0051] Among them, the connecting structure 3 is an irregular protrusion, and the matching structure 4 is a groove that matches the irregular protrusion; the irregular protrusion can be in the form of a T-shape or cross shape, etc., to prevent detachment.
[0052] Understandably, in order to avoid insufficient protrusion height leading to weak fixing force, the protrusion height needs to be greater than or equal to 3mm, and the groove depth needs to be greater than or equal to 3.5mm, so as to ensure that there is an effective contact area between the connecting structure 3 and the mating structure 4.
[0053] It should be noted that irregularly shaped structures have high processing costs, so easily processed shapes such as circles / squares should be preferred, or they can be integrally molded by injection molding.
[0054] In this embodiment, the interference fit design of the protrusion and the groove / through hole provides a variety of flexible and reliable solutions to suit different application scenarios.
[0055] In one embodiment, the tensile strength of the protrusion ranges from 60 MPa to 70 MPa.
[0056] The tensile strength of the protrusion can be any one of 60MPa, 65MPa, or 70MPa.
[0057] In one embodiment, the bending strength of the protrusion ranges from 90 MPa to 100 MPa.
[0058] The tensile strength of the protrusion can be any one of 90MPa, 95MPa, or 100MPa.
[0059] Operating temperature: -40℃ to 150℃.
[0060] Dielectric strength: 15kV / mm to 20kV / mm.
[0061] Among them, the volume resistivity is 10. 15 Ω·cm to 10 16 Ω·cm.
[0062] Understandably, the protrusion also needs to meet sufficient strength, hardness and resistance to deformation, so that it is not easily deformed during the pressing process and avoids permanent damage due to interference fit; the surface hardness of the protrusion needs to be greater than or equal to 60HB (Britt hardness) to prevent surface scratches or wear during assembly.
[0063] Understandably, the protrusion also needs to have a low coefficient of thermal expansion to avoid fit failure due to temperature changes; the protrusion also needs to have a low water absorption rate to prevent dimensional changes caused by humidity variations.
[0064] In this embodiment, by limiting the material selection of the substrate 1, the interference fit between the connecting structure 3 and the mating structure 4 is better satisfied.
[0065] In one embodiment, the substrate 1 is a polycarbonate structure, or the substrate 1 is an acrylonitrile-butadiene-styrene copolymer structure.
[0066] Understandably, polycarbonate structures have higher toughness and impact resistance compared to acrylonitrile-butadiene-styrene copolymer structures, while acrylonitrile-butadiene-styrene copolymer structures are less expensive.
[0067] In one embodiment, the mating structure 4 is a through hole, and the protrusion is provided through the through hole. The protrusion includes a first part located inside the through hole and a second part extending beyond the through hole. The thickness of the second part ranges from 3 mm to 4 mm.
[0068] The thickness of the second part can be any of 3mm, 3.5mm, or 4mm.
[0069] The first part is embedded inside the through hole, forming a fit with the hole wall.
[0070] The second part is the portion that protrudes from the outside of the through hole and can be used for subsequent assembly, welding, snap-fitting, etc.
[0071] Understandably, the thickness of the second part is in the range of 3mm to 4mm to ensure the assembly clearance or interference with adjacent parts; at the same time, it can meet the structural strength requirements of the connection structure 3 and the mating structure 4; in addition, it can provide sufficient material allowance for secondary processing.
[0072] In one embodiment, a conductive busbar 2 is provided corresponding to two connecting structures 3, and the two connecting structures 3 are arranged symmetrically.
[0073] It is understandable that by making the conductive busbar 2 symmetrically arranged with respect to the two connecting structures 3, the connecting structures 3 are subjected to more uniform force, thus avoiding damage caused by uneven force on one side of the connecting structure 3.
[0074] It is understandable that symmetrical distribution can evenly disperse the force at the fixed point, avoid stress concentration on one side, and improve the resistance to vibration and impact.
[0075] Understandably, this design prevents the conductive busbar 2 from deforming or loosening due to uneven stress; and the symmetrical design simplifies the assembly process, eliminates the need to distinguish directions, and reduces the risk of operational errors.
[0076] Understandably, symmetrical connection can reduce the resistance difference of conductive busbar 2, ensure uniform current transmission, and avoid local overheating. After symmetrical fixing, no additional glue or hot riveting is required, while ensuring mechanical strength and cleanliness.
[0077] In this embodiment, the symmetrical connection structure 3 significantly improves the reliability and production efficiency of the CCS component 5 through mechanical optimization and process simplification.
[0078] An embodiment of this utility model provides a battery pack including a CCS component 5 as described in any of the above embodiments.
[0079] This utility model provides a CCS component 5, which forms a connecting structure 3 and a mating structure 4 on the substrate 1 and the conductive busbar 2 of the CCS component 5, respectively. The connecting structure 3 and the mating structure 4 are fitted together to achieve the connection between the substrate 1 and the conductive busbar 2. Since the connecting structure 3 and the mating structure 4 are formed by the substrate 1 and the conductive busbar 2, there is no need to use glue or rivets for fixing, which improves the surface cleanliness of the CCS component 5 and reduces the cost.
[0080] It should be noted that the connecting structure 3 can also be a groove or a hole, and the mating structure 4 can also be a protrusion.
[0081] The embodiments of this utility model have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.
Claims
1. A CCS assembly (5) characterized in that, include: Base (1); Multiple conductive busbars (2) are disposed on the substrate (1); The substrate (1) has a connecting structure (3) on one side of the conductive bus (2), and the conductive bus (2) has a mating structure (4). The connecting structure (3) and the mating structure (4) are fitted together.
2. The CCS assembly (5) according to claim 1, characterized in that The connecting structure (3) and the mating structure (4) are in an interference fit.
3. The CCS assembly (5) according to claim 2, characterized in that The interference amount of the interference fit ranges from 0.1 mm to 0.3 mm.
4. The CCS assembly (5) according to claim 3, characterized in that The connecting structure (3) is a protrusion, and the mating structure (4) is a groove or a through hole.
5. The CCS assembly (5) according to claim 4, characterized in that The tensile strength of the protrusion ranges from 60 MPa to 70 MPa.
6. The CCS assembly (5) according to claim 4, characterized in that The bending strength of the protrusion ranges from 90 MPa to 100 MPa.
7. The CCS assembly (5) according to claim 4, characterized in that The mating structure (4) is the through hole, and the protrusion is provided through the through hole. The protrusion includes a first part located inside the through hole and a second part extending beyond the through hole. The thickness of the second part ranges from 3 mm to 4 mm.
8. The CCS assembly (5) according to any one of claims 1 to 7, characterized in that The substrate (1) is a polycarbonate structure, or the substrate (1) is an acrylonitrile-butadiene-styrene copolymer structure.
9. The CCS assembly (5) according to any one of claims 1 to 7, characterized in that One of the conductive busbars (2) is provided corresponding to two of the connection structures (3), and the two connection structures (3) are arranged symmetrically.
10. A battery pack, characterized by, Includes the CCS component (5) as described in any one of claims 1 to 9.