Chip milling and encapsulating device

Abstract

The utility model relates to chip processing equipment technical field, and disclose a kind of chip milling and sealing device, including equipment box, milling and sealing mechanism, support, electric power wiring assembly, console, feeding assembly, discharge assembly constitute, equipment box is as the basis bearing structure of entire device, using solid material quality manufacturing, provide stable installation space for internal milling and sealing mechanism, electric power wiring assembly and other components, simultaneously play the protection effect to internal component, barrier external dust, impurity, guarantee equipment stable operation.The utility model is through the integration milling, packaging function, through orderly cooperation of each component, realize the coherent processing of chip from raw material to packaged product, reduce process circulation time consumption, improve overall processing efficiency, adapt to various needs, milling assembly adjustable cutter adapts different chip milling;Packaging component supports heat sealing, cold sealing switching, satisfies various chip packaging requirements, the buffer structure of feeding, discharge adapts continuous production, improves equipment versatility and flexibility.

Description

Technical Field

[0001] This utility model relates to the field of chip processing equipment technology, specifically a chip milling and encapsulation device. Background Technology

[0002] In the chip manufacturing process, milling and packaging are critical steps. Traditional equipment suffers from problems such as fragmented functions and poor coordination among components: chip transmission is prone to jamming during milling, affecting the processing rhythm; milling cutters are inconvenient to adjust and difficult to adapt to diverse chip specifications; packaging positioning accuracy is low, which can easily lead to packaging defects; and the lack of buffering in the loading and unloading stages makes it difficult to achieve continuous production and meet the high-efficiency, high-precision processing requirements of modern chips. Therefore, there is an urgent need for integrated chip milling and packaging equipment with good coordination. Utility Model Content

[0003] (a) Technical problems to be solved

[0004] To address the shortcomings of existing technologies, this invention provides a chip milling and packaging device, which solves the problems mentioned in the background art.

[0005] (II) Technical Solution

[0006] To achieve the above objectives, this utility model provides the following technical solution: a chip milling and encapsulation device, comprising a device housing, a milling and encapsulation mechanism, a support, a power wiring assembly, a control console, a feeding assembly, and a discharging assembly. The functions and cooperative relationships of each part are as follows:

[0007] The equipment enclosure serves as the basic load-bearing structure of the entire device. It is made of robust materials, providing stable installation space for internal components such as the milling and sealing mechanism and power wiring components. At the same time, it protects the internal components, blocking external dust and impurities and ensuring stable operation of the equipment.

[0008] The milling and sealing mechanism is the core processing unit, encompassing material transfer components, milling feeding components, milling components, milling output components, uprights, positioners, top sealing components, and side sealing components.

[0009] The material transfer component is assembled on the front top of the equipment housing. It adopts a belt or chain transmission structure, which can be flexibly adapted according to the actual scenario. With the continuous movement of the conveyor belt / chain, it realizes the stable and continuous transportation of chip materials in the device, connecting the feeding, milling, packaging and unloading stages.

[0010] The milling assembly is located on one side of the top of the equipment housing and is equipped with a milling station. It is equipped with adjustable milling cutters. Operators can adjust milling parameters, such as speed and feed rate, through the control panel according to chip specifications, such as size and thickness, to accurately perform chip milling operations and adapt to different chip milling needs.

[0011] The milling feeding assembly and the milling output assembly are adapted to the milling assembly. The milling feeding assembly pushes the chip on the material transfer assembly to the milling station. After the milling is completed, the milling output assembly transports the milled chip back to the material transfer assembly, ensuring a smooth connection between the milling process and subsequent processes.

[0012] The stand and positioner are mounted on the other side of the top of the equipment housing, providing installation support for the positioner. The positioner is installed above the rear end of the stand and uses mechanical positioning, such as positioning pins, grippers, or visual positioning combined with cameras and visual algorithms, to accurately position the milled chips on the material transfer components, providing a high-precision position reference for subsequent packaging operations and ensuring the accuracy of the milling and sealing operations.

[0013] The top and side encapsulation components are located on the other side of the top of the material transfer component and are adapted to the positioner. They can be heat-sealed to fuse the encapsulation material by heating or cold-sealed to achieve the encapsulation process by pressure. They can be flexibly switched according to the chip encapsulation requirements to encapsulate the top and side of the chip respectively, ensuring the encapsulation quality and meeting the encapsulation needs of different chips.

[0014] The supports are installed at the four corners of the bottom of the equipment enclosure. They adopt a stable support structure to provide reliable support for the equipment enclosure, maintain a reasonable distance between the equipment and the ground, and facilitate heat dissipation, wiring, and daily maintenance at the bottom of the equipment.

[0015] The power wiring assembly is located at the rear top of the equipment enclosure. It integrates power access and circuit distribution functions to supply power to various electrical components within the device, such as the motors of the material conveying assembly, the milling power mechanism of the milling assembly, and the control console. At the same time, it standardizes circuit connections to ensure the stable operation of the equipment's electrical system.

[0016] The control console is located on the front side of the equipment housing and is equipped with a touch-screen interface. Operators can intuitively set milling parameters, such as tool speed and milling depth, and packaging process parameters, such as heat sealing temperature and cold sealing pressure. They can also monitor the equipment's operating status in real time, enabling convenient operation and control and reducing the difficulty of manual operation.

[0017] The feeding component is located at one end of the material conveying component and has a material buffer structure, such as a hopper or buffer track, which can temporarily store chips to be fed and convey them to the material conveying component in a rhythmic manner to ensure continuous feeding. The discharging component is located at the other end of the material conveying component and also has a material buffer function. It temporarily stores packaged chips and completes the discharging in an orderly manner. Together with the feeding component, it ensures the continuous operation of the device and improves production efficiency.

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] 1. In this utility model, by integrating milling and packaging functions and through the orderly collaboration of various components, the chip is processed continuously from raw material to packaged finished product, reducing the time spent on process flow, improving the overall processing efficiency, and adapting to diverse needs. The milling component has adjustable cutting tools to adapt to milling different chips; the packaging component supports hot sealing and cold sealing switching to meet diverse chip packaging requirements, and the feeding and unloading buffer structure is adapted to continuous production, improving the equipment's versatility and flexibility.

[0020] 2. In this utility model, stable material transmission and precise positioning by the positioner ensure the accuracy of milling and packaging operations, reduce defective products, and improve chip processing quality. In addition, its control console touch interface simplifies operation, and the equipment box protection and support facilitate equipment maintenance, reducing equipment use and maintenance costs. Attached Figure Description

[0021] Figure 1 This is a perspective view of the entire utility model;

[0022] Figure 2 For the present utility model Figure 1 Enlarged view of point A in the middle;

[0023] Figure 3 For the present utility model Figure 2 Enlarged view of point B in the middle.

[0024] In the diagram: 1. Equipment housing; 2. Milling and sealing mechanism; 3. Support; 4. Power wiring assembly; 5. Control console; 6. Feeding assembly; 7. Discharging assembly; 21. Material transfer assembly; 22. Milling feeding assembly; 23. Milling assembly; 24. Milling discharge assembly; 25. Stand; 26. Positioner; 27. Top sealing assembly; 28. Side sealing assembly. Detailed Implementation

[0025] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0026] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] Please see Figures 1-3 In this embodiment of the present invention, a chip milling and packaging device includes a device housing 1, a milling and packaging mechanism 2, a support 3, a power wiring assembly 4, a control console 5, a feeding assembly 6, and a discharging assembly 7. These components work together to achieve chip milling and packaging. The specific implementation and operation are as follows:

[0029] The support 3 is installed at the four corners of the bottom of the equipment housing 1 using bolts and other connecting parts to ensure that the equipment housing 1 is horizontal and stably supported, completing the assembly of the basic load-bearing structure. The milling mechanism 2 is then installed. The material conveying component 21, with its belt or chain transmission structure, is installed at the mounting position on the front top of the equipment housing 1. The tension and smoothness of the conveyor belt / chain are adjusted. The milling component 23, equipped with adjustable milling cutters, is installed at the milling station on one side of the top of the equipment housing 1. The power and control lines are connected, and the tool adjustment function is initially tested. The milling feeding component 22 is then installed. Milling the material output component 24 to make it compatible with the milling component 23 and the material transfer component 21, testing the continuity and accuracy of the feeding and discharging actions, installing the stand 25 on the other side of the top of the equipment housing 1, fixing the positioner 26 above the rear end of the stand 25, calibrating the positioning accuracy of the positioner 26 to make it compatible with the chip position on the material transfer component 21, installing the top packaging component 27 and the side packaging component 28 on the other side of the top of the material transfer component 21 to ensure compatibility with the positioner 26, and connecting the process control circuit, such as the heating circuit for heat sealing and the pressure control circuit for cold sealing.

[0030] The electrical and control components are assembled, and the power wiring assembly 4 is installed on the rear top of the equipment box 1 to connect the external power supply and the internal power supply circuits. The control console 5 is installed on the front side of the equipment box 1 to complete the control circuit connection and system debugging, ensuring that the touch interface can set parameters and monitor status normally.

[0031] The feeding component 6 and the discharging component 7 are installed at both ends of the material conveying component 21. The feeding component 6 and the discharging component 7 with buffer structures are installed respectively. The material buffering and conveying functions are debugged to ensure smooth connection with the material conveying component 21.

[0032] The working principle of this utility model is as follows: The operator places the chip to be processed into the buffer structure of the feeding component 6. The feeding component 6 conveys the chip to the material transfer component 21 according to a set rhythm. The material transfer component 21 moves the chip towards the milling station. After reaching the designated position, the milling feeding component 22 pushes the chip to the milling station of the milling component 23. The milling component 23 performs milling operations on the chip using an adjustable milling cutter according to the parameters set on the control console 5. After milling is completed, the milling unloading component 24 sends the chip back to the material transfer component 21 for continued transfer. The material transfer component 21 moves the milled chip to below the positioner 26. The positioner 26 accurately positions the chip. Subsequently, the top packaging component 27 and the side packaging component 28 perform packaging operations on the top and sides of the chip respectively according to the set packaging process. The packaged chip is moved to the discharge component 7 by the material transfer component 21. The discharge component 7 temporarily stores the chip and discharges it in an orderly manner. Throughout the process, the control console 5 monitors the operating status of each component in real time, and the operator can adjust the parameters to ensure the stable and efficient operation of the equipment.

[0033] This chip milling and packaging device, through its integrated design and the coordinated operation of its components, effectively addresses the shortcomings of traditional chip processing equipment, enabling efficient, precise, and continuous chip milling and packaging. It is suitable for various chip manufacturing scenarios and helps improve the production level and product quality of the chip processing industry.

[0034] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A chip milling and encapsulation device, comprising a device housing (1), a milling and encapsulation mechanism (2), a support (3), a power wiring assembly (4), a control console (5), a feeding assembly (6), and a discharging assembly (7); Its features are: The milling and sealing mechanism (2) includes a material transfer component (21), a milling feeding component (22), a milling component (23), a milling discharge component (24), a stand (25), a positioner (26), a top sealing component (27), and a side sealing component (28). The material transfer component (21) is mounted on the front side of the top of the equipment housing (1). The milling component (23) is located on one side of the top of the equipment housing (1) and is equipped with a milling station. The milling feeding component (22) and the milling discharge component (24) are adapted to the milling component (23). The stand (25) is located on the other side of the top of the equipment housing (1). The positioner (26) is installed above the rear end of the stand (25). The top sealing component (27) and the side sealing component (28) are located on the other side of the top of the material transfer component (21) and are adapted to the positioner (26). The support (3) is located at the four corners of the bottom of the equipment box (1); The power wiring assembly (4) is located on the rear side of the top of the equipment housing (1); The control console (5) is located on one side of the front end of the equipment housing (1); The feeding component (6) is located at one end of the material conveying component (21), and the discharging component (7) is located at the other end of the material conveying component (21).

2. The chip milling and packaging apparatus according to claim 1, characterized in that: The material conveying component (21) adopts a belt conveyor or chain conveyor structure.

3. The chip milling and packaging apparatus according to claim 1, characterized in that: The milling assembly (23) is equipped with an adjustable milling cutter.

4. The chip milling and encapsulation apparatus according to claim 1, characterized in that: The locator (26) adopts mechanical positioning or visual positioning.

5. The chip milling and packaging apparatus according to claim 1, characterized in that: The top encapsulation component (27) and the side encapsulation component (28) are heat-sealed or cold-sealed.

6. A chip milling and encapsulation apparatus according to any one of claims 1-5, characterized in that: The console (5) is equipped with a touch operation interface.

7. A chip milling and encapsulation apparatus according to any one of claims 1-5, characterized in that: The feeding component (6) and the discharging component (7) have a material buffer structure.

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