A low-modulus, high-strength, low-hygroscopic epoxy resin composition and its preparation method

Abstract

This invention relates to the field of advanced semiconductor packaging materials technology, and particularly to a low-modulus, high-strength, and low-moisture-absorbing epoxy resin composition and its preparation method. By weight, the epoxy resin composition comprises: 20-60 parts of MAR-type epoxy resin base material one, 15-40 parts of modified masterbatch, 0.01-5 parts of a first catalyst, 30-700 parts of silicon powder, 0-30 parts of additives, and 25-60 parts of curing agent; the modified masterbatch is prepared from: MAR-type epoxy resin base material two, a second catalyst, and HTPB; the curing agent is MAR-type phenolic resin. This invention introduces HTPB into the MAR-type resin system to create a synergistic effect, resulting in a packaging material with low modulus, high strength, and low moisture absorption. The obtained composition can achieve a moisture sensitivity level of MSL1, meeting the high reliability packaging requirements of DFN / QFN and other packaging forms.

Description

Technical Field

[0001] This invention relates to the field of advanced semiconductor packaging materials technology, and in particular to a low-modulus, high-strength, low-moisture-absorbing epoxy resin composition and its preparation method. Background Technology

[0002] With the continuous pursuit of miniaturization, high performance, and high reliability in electronic products by consumer electronics, communication equipment, automotive electronics, and the Internet of Things, advanced packaging forms such as DFN (Dual Flat No-leads) / QFN (Quad Flat No-leads) have been widely used due to their significant advantages such as small size, light weight, excellent thermal performance, and high pin density. However, the trend of packaged devices towards high-density integration and ultra-thinness has placed unprecedentedly stringent requirements on the performance of packaging materials.

[0003] DFN / QFN packaging structures face complex thermomechanical stress challenges during service (especially when used in power devices and RF modules). Due to the mismatch in the coefficient of thermal expansion (CTE) between the chip, packaging materials, and substrate, significant thermal stress is generated under temperature change scenarios such as power-on / power-off and ambient temperature fluctuations, as well as high-temperature reflow soldering processes (especially the 260°C peak temperature required by lead-free processes). This requires that packaging materials meet the following requirements: 1) Low modulus (especially high temperature modulus): Packaging materials need to provide good stress buffering capacity, absorb and disperse stress, and prevent fatal failures such as chip cracking or interface delamination caused by stress concentration; 2) High strength: With the trend of device thinning and miniaturization, it is necessary to ensure that the packaging structure has sufficient mechanical support, bending resistance and impact resistance during processing, testing, transportation and use to maintain structural integrity; 3) Low moisture absorption: In humid environments (such as high temperature and high humidity testing) or during reflow soldering, the moisture absorbed by the material evaporates rapidly, producing the "popcorn effect", which is the main cause of packaging cracking or internal corrosion; packaging materials need to have extremely low water absorption rate to meet high reliability requirements (such as humidity sensitivity level MSL 1).

[0004] Under current packaging requirements, existing product systems struggle to balance the trade-offs between low modulus, high strength, low moisture absorption, and processing stability. For example, while traditional epoxy resin systems (such as BP-type resin systems) possess good mechanical strength, their modulus is generally high (especially at high temperatures), resulting in insufficient stress buffering capacity. After multiple temperature cycles or 260°C lead-free reflow soldering, the risk of interface delamination increases significantly, making it difficult to meet the requirements of high-reliability packaging (such as automotive electronics and industrial control). Simultaneously, their moisture absorption is often too high, failing humidity sensitivity tests. Traditional low-stress agents (such as silicone rubber, silicone oil, and organosilicon) can reduce room-temperature modulus, but their effect on reducing high-temperature modulus (especially at reflow soldering temperatures approaching or exceeding Tg) is minimal. This temperature range is precisely where thermal stress is most severe, and it also sacrifices material strength and heat resistance, still failing to meet packaging requirements.

[0005] Chinese invention patent CN114456543B discloses an epoxy resin composition, an epoxy resin molding compound, its preparation method, and its application. By increasing the crosslinking density and filler content of the epoxy resin, it solves the problems of high linear expansion coefficient and warpage in epoxy resin composition encapsulation materials, achieving an epoxy resin molding compound with a high glass transition temperature and low linear expansion coefficient, suitable for high-voltage, high-current, high-power module encapsulation. However, it does not solve the technical problem of simultaneously achieving the desired balance between epoxy resin's hygroscopicity, low modulus, and high strength.

[0006] Against this backdrop, providing a packaging material with excellent overall performance, especially one that combines low modulus, high strength, and low moisture absorption, to meet the high reliability packaging requirements of DFN / QFN and other packaging forms, has become a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0007] To address the aforementioned technical challenges and enable encapsulation materials to possess low moisture absorption, high heat resistance, low modulus, and high strength, this invention proposes an epoxy resin composition suitable for DFN / QFN encapsulation. This composition innovatively introduces epoxidized hydroxyl-terminated polybutadiene (HTPB) into a MAR-type resin system (MAR-type epoxy resin and MAR-type phenolic resin), creating a synergistic effect. This results in an encapsulation material with low modulus, high strength, and low moisture absorption. The resulting composition achieves a moisture sensitivity rating of MSL1, meeting the high reliability encapsulation requirements of DFN / QFN and other encapsulation forms.

[0008] The first aspect of the present invention provides an epoxy resin composition with low modulus, high strength, and low moisture absorption. The epoxy resin composition comprises, by weight: 20-60 parts of MAR type epoxy resin base, 15-40 parts of modified masterbatch, 0.01-5 parts of first catalyst, 30-700 parts of silica powder, 0-30 parts of additives, and 25-60 parts of curing agent.

[0009] Optionally, the raw materials for preparing the modified masterbatch include: MAR (multi-aromatic ring) type epoxy resin base material II, a second catalyst, and HTPB (epoxidized hydroxyl-terminated polybutadiene).

[0010] MAR-type resin systems (MAR epoxy / MAR phenolic resins) possess a polycyclic aromatic ring structure, which imparts good heat resistance and suppresses hygroscopicity. This invention preferably uses MAR-type epoxy resin and MAR-type phenolic resin for curing to construct a three-dimensional cross-linked network structure, thereby improving the cross-linking density and mechanical strength of the material. However, the polycyclic aromatic ring structure also suffers from excessively high modulus and insufficient toughness, resulting in poor performance of the cured product in resisting thermal and mechanical shocks. During application, it also faces the risk of interfacial delamination and brittle fracture, failing to meet encapsulation requirements. This invention introduces HTPB into the MAR-type resin system, effectively balancing the material's low modulus, high strength, and low hygroscopicity. It is speculated that the flexible segments of HTPB effectively combine with the high rigidity of MAR resin. The flexible polybutadiene segments in the HTPB molecular chain act as "soft segments" in the cross-linking network, thereby reducing the material's modulus and imparting good flexibility and impact resistance. Furthermore, at specific formulation amounts, a "rigid-flexible synergy" is achieved, overcoming the difficulty of simultaneously achieving hygroscopicity, heat resistance, and low modulus.

[0011] Optionally, the mass ratio of the MAR-type epoxy resin base material II to HTPB is (8-12):1.

[0012] Optionally, the hydroxyl functionality of the HTPB is 1-5; further optionally, it is 2-3, and even more preferably, it is 2.4.

[0013] Optionally, the molecular weight of the HTPB is 1000-4000; more preferably 1000-2000.

[0014] Optionally, the amount of HTPB added is 3-5 wt% of the sum of the masses of MAR-type epoxy resin base material one and MAR-type epoxy resin base material two. Studies have found that the amount of HTPB added has a crucial impact on the performance of the product. When the amount of HTPB added is too low, the decrease in modulus and the strength enhancement effect of the product are greatly reduced. When the amount added is too high, the viscosity of the composition is too high, and the processing performance is poor. This is mainly manifested in unstable mold flow during molding, and problems such as delamination, porosity, and cracking are prone to occur after molding. Only an appropriate amount of HTPB can play a synergistic role with the MAR-type resin system, taking into account properties such as low moisture absorption, high modulus, and high strength.

[0015] Optionally, both MAR-type epoxy resin base material one and MAR-type epoxy resin base material two are MAR-type epoxy resins with an epoxy equivalent of 260~290g / eq and a viscosity of 0.08~0.16Pa·s at 150℃.

[0016] Optionally, both the MAR type epoxy resin base material one and the MAR type epoxy resin base material two have a viscosity of 0.10~0.14 Pa·s at 150°C.

[0017] Optionally, the amount of the MAR type epoxy resin base material added is 3-20 wt% based on the total mass of the epoxy resin composition.

[0018] The catalysts used in this invention can be listed as organophosphorus compounds (such as triphenylphosphine TPP), tertiary amines, imidazoles (such as 2-ethyl-4-methylimidazolium), quaternary ammonium salts, boron trifluoride complexes, etc.

[0019] Optionally, both the first catalyst and the second catalyst are TPP.

[0020] Optionally, the amount of the first catalyst added is 0.05-3 wt% based on the total mass of the epoxy resin composition.

[0021] Optionally, the amount of the second catalyst added is 0.01-2% of the MAR type epoxy resin base material.

[0022] Further optionally, the mass ratio of the MAR-type epoxy resin base material II, the second catalyst, and HTPB is 10:1:0.1.

[0023] Optionally, the modified masterbatch is prepared by mixing MAR type epoxy resin base material II, second catalyst and HTPB, and stirring at 130-170℃ until transparent to obtain the modified masterbatch.

[0024] Optionally, the silicon powder is spherical fused silicon dioxide.

[0025] Optionally, the amount of silicon powder added is 50-90 wt% based on the total mass of the epoxy resin composition.

[0026] Optionally, the curing agent is a MAR-type phenolic resin.

[0027] Further optionally, the MAR-type phenolic resin has a hydroxyl equivalent of 200~210 g / eq and a viscosity of 0.12~0.18 Pa·s at 150°C; even more optionally, the viscosity of the MAR-type phenolic resin is 0.14~0.16 Pa·s.

[0028] Optionally, the amount of MAR-type phenolic resin added is 3-20 wt% based on the total mass of the epoxy resin composition.

[0029] Optionally, the ratio of the number of hydroxyl groups in the MAR-type phenolic resin to the number of epoxy groups in the MAR-type epoxy resin is 1.

[0030] In some embodiments, the total amount of MAR-type epoxy resin base material one, MAR-type epoxy resin base material two, and MAR-type phenolic resin is maintained at 100 parts.

[0031] Optionally, the additives include release agents, coupling agents, and pigments; the mass ratio of the release agent, coupling agent, and pigment is (3-10):(1-5):(2-7).

[0032] Optionally, the coupling agent is a silane coupling agent, including γ-aminopropyltriethoxysilane (KH-550), γ-aminopropyltrimethoxysilane (KH-551), γ-glycidoxypropyltrimethoxysilane (KH-560), vinyltriethoxysilane (VTES), vinyltrimethoxysilane, γ-methacryloyloxypropyltrimethoxysilane (KH-570), 3-mercaptopropyltrimethoxysilane (KH-590), etc.; further optionally, 3-mercaptopropyltrimethoxysilane.

[0033] Optionally, the amount of coupling agent added is 0.1-5 wt% based on the total mass of the epoxy resin composition.

[0034] The release agent may include, for example, polyethylene wax, polytetrafluoroethylene wax, dimethyl silicone oil, amino silicone oil, hydrogen-containing silicone oil, perfluoropolyether, carnauba wax, synthetic paraffin wax, etc.; optionally, the release agent is polyethylene wax.

[0035] Optionally, the amount of release agent added is 0.1-5 wt% based on the total mass of the epoxy resin composition.

[0036] The present invention does not specifically limit the pigments mentioned, such as carbon black.

[0037] The second aspect of the present invention provides a method for preparing a low-modulus, high-strength, and low-hygroscopic epoxy resin composition. The preparation steps of the epoxy resin composition include: mixing MAR type epoxy resin base material I, modified masterbatch, first catalyst, silica powder, additives and curing agent at high speed, extruding, shaping, and obtaining the finished product.

[0038] Optionally, the raw materials for preparing the epoxy resin composition are all ground to below 30 mesh before mixing.

[0039] Further optionally, the preparation steps of the epoxy resin composition include: adding MAR type epoxy resin base material one, modified masterbatch, first catalyst, silicon powder, additives and curing agent (all below 30 mesh) to a high-speed mixer for high-speed mixing according to the formula amount, then transferring the material to an extruder to process it into a melt, and then transferring it to a calender to extrude it into a sheet material to obtain the finished product.

[0040] A third aspect of the present invention provides an application of a low-modulus, high-strength, low-moisture-absorption epoxy resin composition used in DFN / QFN encapsulation.

[0041] Optionally, the curing temperature of the epoxy resin composition is 170-180℃, and the curing time is 4-6 hours; after curing, the epoxy resin composition forms an epoxy resin molding compound (EMC).

[0042] Further optionally, the water absorption rate of the cured epoxy resin composition is ≤0.21%, and the test conditions are 121°C for 72 hours.

[0043] Further optionally, the moisture sensitivity rating of the cured epoxy resin composition is MSL1.

[0044] MSL (Moisture Sensitivity Level) is a classification standard used in the electronics industry to assess the moisture resistance of components. MSL1 indicates that a component can be stored indefinitely at temperatures ≤30°C and relative humidity (RH) of 85%, without considering workshop life limitations. This means that components of this level have extremely strong resistance to moisture and their performance is hardly affected by moisture absorption under normal storage conditions.

[0045] Beneficial effects:

[0046] This invention provides an epoxy resin composition with low modulus, high strength, and low moisture absorption, and a method for preparing the same, which has the following advantages:

[0047] (1) The epoxy resin composition of the present invention uses a resin system of MAR type epoxy resin and MAR type phenolic resin to provide high crosslinking density and rigid skeleton, while introducing HTPB to participate in the reaction, giving the product a combination of rigidity and flexibility. The resulting epoxy resin composition can have low modulus, high strength, low moisture absorption and high heat resistance.

[0048] (2) The present invention introduces a specific amount of HTPB to participate in the chain extension reaction, and prepares a modified masterbatch by mixing HTPB with MAR type epoxy resin at a certain temperature before mixing with other raw materials. This can increase the molecular weight of epoxy resin, further enhance the integrity of the crosslinking network, optimize product performance, and improve the stability of subsequent processing.

[0049] (3) In this invention, spherical molten silica, release agent polyethylene wax and coupling agent 3-mercaptopropyltrimethoxysilane are preferably added to the MAR type resin system to maximize the compatibility between the raw materials, so that the epoxy composition has good processing performance and takes into account lower modulus, higher strength and lower moisture absorption, and the moisture sensitivity level reaches MSL1.

[0050] (4) The epoxy resin composition of the present invention is suitable for high-density, thin electronic assembly devices, especially for leadless packaging scenarios such as DFN / QFN, and can meet the packaging requirements of high-reliability electronic devices.

[0051] (5) The raw materials of this invention are readily available and the preparation process is simple. It significantly improves the reliability and process adaptability of the packaged device, provides technical support for high-quality packaging materials, and has broad application prospects. Detailed Implementation

[0052] The following is some information about the raw materials used in the embodiments and comparative examples of this invention:

[0053] MAR type epoxy resin base material 1 and MAR type epoxy resin base material 2: both are from Shandong Aimont, product model EMTE500, epoxy equivalent is 260~290g / eq, viscosity is 0.10~0.14Pa·s (150℃).

[0054] BP (Bisphenol A) type epoxy resin: sourced from Mitsubishi, Japan, product model YX4000H, epoxy equivalent of 187~197g / eq, viscosity of 0.01~0.06Pa·s (150℃).

[0055] MAR type phenolic resin: derived from Meiwa Kasei, product model MEH-7851S, with a hydroxyl equivalent of 200~210g / eq and a viscosity of 0.14~0.16 Pa·s (150℃).

[0056] HTPB: Molecular weight 1450, sourced from Liten Chemical, product model Polybd® 605E, product structural formula is... n is 3 to 6.

[0057] TPP: Sourced from Zhangjiagang Beixing Chemical Co., Ltd.

[0058] Spherical fused silica: sourced from Denki Kagaku Kogyo Co., Ltd., product model FB940.

[0059] Polyethylene wax: sourced from Clariant GmbH, Germany, product model number Licowax PED522.

[0060] 3-Mercaptopropyltrimethoxysilane: Sourced from Evonik Industries, product model Dynasylan MTMO.

[0061] Epoxy-modified silicone oil: sourced from Shin-Etsu Chemical, product model KF-105.

[0062] Unless otherwise specified, all raw materials, equipment and other consumables used in this invention are commercially available.

[0063] Examples 1-3

[0064] Examples 1-3 provide a low-modulus, high-strength, low-hygroscopic epoxy resin composition and its preparation method. The formulation of the epoxy resin composition is shown in Table 1 (the values ​​in the table are parts by weight).

[0065] Table 1

[0066]

[0067] The modified masterbatch is prepared by mixing MAR type epoxy resin base material II, HTPB and second catalyst, and stirring at 150°C until transparent to obtain the modified masterbatch.

[0068] The preparation steps of the epoxy resin composition include: according to the formula, adding MAR type epoxy resin base material one, modified masterbatch, first catalyst, silicon powder, additives and curing agent (all below 30 mesh) into a high-speed mixer for high-speed mixing, then transferring the material to an extruder to process it into a melt, and then transferring it to a calender to extrude it into a sheet material to obtain the finished product.

[0069] Comparative Examples 1-3

[0070] Comparative Examples 1-3 provide an epoxy resin composition with low modulus, high strength, and low moisture absorption, and a method for preparing the same. The formulation of the epoxy resin composition is shown in Table 2 (the values ​​in the table are parts by weight).

[0071] Table 2

[0072]

[0073] The preparation steps of the modified masterbatch and epoxy resin composition are the same as in Example 1.

[0074] Comparative Example 4

[0075] Comparative Example 4 provides an epoxy resin composition with low modulus, high strength, and low moisture absorption, and a method for preparing the same. The formulation of the epoxy resin composition is shown in Table 3 (the values ​​in the table are parts by weight).

[0076] Table 3

[0077]

[0078] The modified masterbatch is prepared by mixing BP type epoxy resin (II), HTPB and the second catalyst, and stirring at 150°C until transparent to obtain the modified masterbatch.

[0079] The preparation steps of the epoxy resin composition include: according to the formula amount, adding BP type epoxy resin (I), modified masterbatch, first catalyst, silicon powder, additives and curing agent (all below 30 mesh) into a high-speed mixer for high-speed mixing, then transferring the material to an extruder to process it into a melt, and then transferring it to a calender to extrude it into a sheet material to obtain the finished product.

[0080] Comparative Example 5

[0081] Comparative Example 5 provides an epoxy resin composition with low modulus, high strength, and low moisture absorption, and a method for preparing the same. The formulation of the epoxy resin composition is shown in Table 4 (the values ​​in the table are parts by weight).

[0082] Table 4

[0083]

[0084] The modified masterbatch is prepared by mixing MAR type epoxy resin base material II, epoxy-modified silicone oil and second catalyst, and stirring at 150°C until transparent to obtain the modified masterbatch.

[0085] The preparation steps of the epoxy resin composition are the same as in Example 1.

[0086] Comparative Example 6

[0087] Comparative Example 6 provides a low-modulus, high-strength, and low-hygroscopic epoxy resin composition and its preparation method. The formulation of the epoxy resin composition is the same as that in Example 2; the difference lies in the preparation method of the epoxy resin composition, as detailed below:

[0088] The preparation steps of the epoxy resin composition include: according to the formula, adding MAR type epoxy resin base material one, MAR type epoxy resin base material two, HTPB, first catalyst, second catalyst, silicon powder, additives and curing agent (all below 30 mesh) into a high-speed mixer for high-speed mixing, then transferring the material to an extruder to process it into a melt, and then transferring it to a calender to extrude it into a sheet material to obtain the finished product.

[0089] Performance testing

[0090] 1. Processing performance

[0091] The sheet materials prepared in the examples and comparative examples were used to determine the spiral flow length, gel time and viscosity of the sheet materials in accordance with the national standard GB / T 40564-2021 Test Method for Epoxy Molding Compounds for Electronic Packaging; the test results are recorded in Table 5.

[0092] The test conditions for the spiral flow length were 175℃ and 120s.

[0093] The gel time was tested at 175°C.

[0094] The viscosity was tested at 110℃.

[0095] 2. Curing performance

[0096] The sheet materials prepared in the examples and comparative examples were injected into the mold and cured at 175°C for 5 hours. After curing, the materials were cooled to room temperature and the curing performance was tested. The test indicators included flexural strength, Tg (glass transition temperature), water absorption rate and moisture sensitivity level. The test results are recorded in Table 5.

[0097] Bending strength (including room temperature / high temperature modulus and room temperature / high temperature bending strength): tested using a tensile testing machine.

[0098] The normal temperature is 25℃, and the high temperature is 260℃.

[0099] Tg: Tested using a static mechanical analyzer (TMA).

[0100] Water absorption rate: The cured epoxy resin composition was placed in a closed pressure vessel for a high-pressure cooking test (PCT) at 121°C for 72 hours. The water absorption rate of the sample was calculated by gravimetric method.

[0101] Humidity sensitivity rating: Refer to IPC / JEDEC J-STD-020C for humidity sensitivity rating test. A humidity sensitivity rating of MSL1 is recorded as pass, and a rating of less than MSL1 is recorded as NG.

[0102] Table 5

[0103]

[0104] The data in Table 5 show that the introduction of HTPB into the MAR-type resin system in this invention, under specific formulation design, enables the epoxy resin composition to achieve a balance of lower modulus, higher strength, and lower hygroscopicity, while achieving a moisture sensitivity level of MSL1. In Comparative Example 1, without the addition of modified masterbatch, all properties of the epoxy resin composition deteriorated. In Comparative Example 2, with the same amount of silica powder added, the lower HTPB content resulted in poor modulus reduction and strength improvement after curing, and a higher water absorption rate, failing to achieve a moisture sensitivity level of MSL1. In Comparative Example 3, with the same amount of silica powder added, the excessively high HTPB content led to excessively high viscosity, resulting in a lower modulus and higher strength after curing, but the water absorption rate and moisture sensitivity level still failed to meet requirements. Comparative Example 4, using BP-type epoxy resin instead of MAR-type epoxy resin, achieved a lower modulus, but its high water absorption rate prevented it from achieving a moisture sensitivity level of MSL1. Comparative Example 5 replaced HTPB with epoxy-modified silicone oil, which reduced the modulus and Tg to some extent, but still failed to achieve the moisture sensitivity level MSL1, thus failing to meet the usage requirements. Comparative Example 6, although it added HTPB to the system, did not pre-preparate a modified masterbatch, resulting in insufficient polymer cross-linking and entanglement. Furthermore, it could not be uniformly mixed during extrusion processing. Therefore, its EMC performance was not significantly improved compared to Comparative Example 1 without HTPB, and it also failed to achieve the moisture sensitivity level MSL1.

Claims

1. A low-modulus, high-strength, low-moisture-absorption epoxy resin composition, characterized in that, The epoxy resin composition comprises, by weight, 20-60 parts of MAR type epoxy resin base, 15-40 parts of modified masterbatch, 0.01-5 parts of first catalyst, 30-700 parts of silica powder, 0-30 parts of additives, and 25-60 parts of curing agent. The raw materials for preparing the modified masterbatch include: MAR type epoxy resin base material II, a second catalyst, and HTPB; The curing agent is a MAR-type phenolic resin; The amount of HTPB added is 3-5 wt% of the sum of the masses of MAR type epoxy resin base material one and MAR type epoxy resin base material two. The HTPB is epoxidized hydroxyl-terminated polybutadiene.

2. The low-modulus, high-strength, low-moisture-absorption epoxy resin composition according to claim 1, characterized in that, Both MAR-type epoxy resin base material one and MAR-type epoxy resin base material two are MAR-type epoxy resins with an epoxy equivalent of 260~290g / eq and a viscosity of 0.10~0.14Pa·s at 150℃.

3. The low-modulus, high-strength, low-moisture-absorption epoxy resin composition according to claim 1, characterized in that, The ratio of the number of hydroxyl groups in the MAR-type phenolic resin to the number of epoxy groups in the MAR-type epoxy resin is 1.

4. The low-modulus, high-strength, low-moisture-absorption epoxy resin composition according to claim 1, characterized in that, The mass ratio of the MAR type epoxy resin base material II to HTPB is (8-12):

1.

5. The low-modulus, high-strength, low-moisture-absorption epoxy resin composition according to claim 1, characterized in that, Both the first catalyst and the second catalyst are TPP.

6. The low-modulus, high-strength, low-moisture-absorption epoxy resin composition according to claim 1, characterized in that, The modified masterbatch is prepared by mixing MAR type epoxy resin base material II, second catalyst and HTPB, and stirring at 130-170℃ until transparent to obtain the modified masterbatch.

7. The low-modulus, high-strength, low-moisture-absorption epoxy resin composition according to claim 1, characterized in that, The additives include release agents, coupling agents, and pigments; the mass ratio of the release agent, coupling agent, and pigments is (3-10):(1-5):(2-7).

8. A method for preparing a low-modulus, high-strength, low-hygroscopic epoxy resin composition according to any one of claims 1-7, characterized in that, The preparation steps of the epoxy resin composition include: mixing MAR type epoxy resin base material one, modified masterbatch, first catalyst, silicon powder, additives and curing agent at high speed according to the formulation amount described in claim 1, extruding, shaping, and obtaining the finished product.

9. The application of a low-modulus, high-strength, low-moisture-absorbing epoxy resin composition according to any one of claims 1-7, characterized in that, The epoxy resin composition is used for DFN / QFN encapsulation.

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