Three-band laser cutting machine

Abstract

The utility model relates to a three wave band laser cutting machine, including laser equipment, is installed with cutting equipment at the optical path end of laser equipment, and laser equipment includes shock attenuation optical platform, and is installed with laser on shock attenuation optical platform, and laser is used for emitting ultraviolet light, green light and infrared light, and cutting equipment includes steel frame pedestal, is installed with marble base plate on steel frame pedestal, is installed with movement axle system on marble base plate, and laser equipment, cutting equipment mutually build up independent ultraviolet light path subassembly, green light path subassembly, infrared light path subassembly, and are installed with lifting support on marble base plate, are installed with beam combining modulation subassembly on lifting support, and are installed with processing output end on lifting support still, three kinds of wave band lasers are transmitted through independent optical path respectively, wherein green light and infrared light realize subsequent optical path sharing through red-green beam combining mirror, ensure the reliability of each wave band laser independent work, and adapt to the different processing needs of various materials in college experiment.

Description

Technical Field

[0001] This utility model relates to a laser cutting machine, and more particularly to a three-band laser cutting machine. Background Technology

[0002] Laser cutting equipment is widely used in precision machining, but traditional single-band equipment struggles to meet the demands of multi-material processing, and its processing accuracy is easily affected by equipment vibration. Existing technologies, such as Chinese patent CN208619573U, disclose a vibration-damping platform that uses an air damper to connect the base plate to the placement surface to reduce vibration. However, this design primarily addresses vibration reduction for general-purpose equipment and does not solve the problems of multi-band laser beam combining and optical path stability.

[0003] Meanwhile, in the field of multi-band lasers, Chinese patent CN105071214A discloses a method for generating deep ultraviolet lasers, which converts visible light to the deep ultraviolet band through second and third harmonic crystals, but does not involve multi-band collaborative cutting and optical path modulation technology. Furthermore, regarding the stability of motion systems, Chinese patent CN110270766A discloses a motion axis system using a marble substrate to improve flatness and achieving positioning through relative X / Y axis movement; however, its base does not employ a weighted welding design, and vibration risks still exist when the equipment moves at high speeds.

[0004] Furthermore, regarding multi-optical path integration, Chinese patent CN101190476A discloses a cutting device comprising a laser head system and a granite platform. However, its optical path only supports single-band transmission and lacks beam combining and modulation components, making it impossible to achieve three-band beam splitting and beam combining processing. In summary, existing technologies have not yet solved problems such as multi-band optical path stability, efficient beam combining, and equipment vibration resistance optimization.

[0005] In view of the above-mentioned shortcomings, the designer actively researched and innovated in order to create a three-band laser cutting machine that would have greater industrial value. Utility Model Content

[0006] To solve the above-mentioned technical problems, the purpose of this utility model is to provide a three-band laser cutting machine.

[0007] This utility model discloses a three-band laser cutting machine, comprising a laser device and a cutting device mounted on the optical path end of the laser device. The laser device includes a vibration-damping optical platform, on which a laser is mounted. The laser emits ultraviolet, green, and infrared light. The cutting device includes a steel frame base, on which a marble substrate is mounted. A motion axis system is mounted on the marble substrate, including a motion axis X mounted on the marble substrate and a motion axis Y mounted above the motion axis X. A processing table is mounted on the motion axis Y. The laser device and the cutting device are interconnected by independent ultraviolet, green, and infrared optical path components. A lifting bracket is mounted on the marble substrate, on which a beam combining and modulation component is mounted, and a processing output end is also mounted.

[0008] The ultraviolet light path assembly includes a first ultraviolet reflector, a second ultraviolet reflector, a third ultraviolet reflector, a fourth ultraviolet reflector, and a fifth ultraviolet reflector, with each reflector forming a complete optical path; the infrared light path assembly includes a first infrared reflector, a second infrared reflector, and a third infrared reflector, with each reflector forming a complete optical path; the green light path assembly includes a first green light reflector, a second green light reflector, a third green light reflector, and a fourth green light reflector, with each reflector forming a complete optical path.

[0009] The beam combining and modulation assembly includes a red-green beam combiner mounted on a lifting bracket. The output end of the red-green beam combiner is sequentially equipped with a first red-green reflector and a second red-green reflector. The processing output end includes a galvanometer and a focusing objective lens. Ultraviolet light is reflected to the focusing objective lens by an ultraviolet optical path assembly. Infrared light and green light are transmitted to the red-green beam combiner through their respective optical path assemblies, and then guided to the galvanometer by the first red-green reflector and the second red-green reflector. The red-green beam combiner is configured to reflect infrared light and transmit green light.

[0010] Furthermore, in the aforementioned three-band laser cutting machine, the vibration-damping optical platform is equipped with a docking bracket at the optical path output end of the laser, and the first ultraviolet reflector, the first infrared reflector, and the first green light reflector are mounted on the docking bracket.

[0011] Furthermore, in the aforementioned three-band laser cutting machine, a pad is installed on the marble substrate, and a second ultraviolet reflector, a second infrared reflector, and a second green light reflector are respectively installed on the pad; a main carrier plate is installed on the lifting support, and a third green light reflector, a third infrared reflector, and a third ultraviolet reflector are respectively installed on the main carrier plate; a secondary carrier plate is also installed on the lifting support, and a fourth green light reflector, a red-green beam combiner, a fourth ultraviolet reflector, a first red-green reflector, and a fifth ultraviolet reflector are respectively installed on the secondary carrier plate.

[0012] Furthermore, in the aforementioned three-band laser cutting machine, several heavy-duty feet are installed below the frame base.

[0013] Furthermore, in the aforementioned three-band laser cutting machine, a damping and vibration isolation mechanism is installed on the vibration-damping optical platform, and the damping and vibration isolation mechanism is a spring damper.

[0014] Furthermore, in the aforementioned three-band laser cutting machine, the motion axis X and the motion axis Y form a cross-axis structure; the motion axis X includes an X-axis linear motor connected to the marble substrate, and a motion axis Y consisting of a Y-axis linear motor is mounted on the X-axis linear motor; a processing panel is mounted on the motion axis Y, and the light-emitting end of the focusing objective lens corresponds to the processing panel.

[0015] Furthermore, in the aforementioned three-band laser cutting machine, a control device is installed on the steel frame base, and the control device is electrically connected to the motion axis X and the motion axis Y; the control device is an industrial control computer.

[0016] By means of the above solution, this utility model has at least the following advantages:

[0017] 1. The laser adopts an external design, which effectively reduces the size of the equipment body and facilitates the installation, disassembly and maintenance of the laser, thereby improving the convenience of equipment use and maintenance.

[0018] 2. Enhanced overall stability: The center of gravity of the equipment is lowered by a weighted steel frame base, and the heavy-duty feet without cushioning pads and the weldable fixing method significantly reduce the vibration generated by the movement of the main body of the equipment, ensuring the reference stability of the optical path focusing point during processing.

[0019] 3. The optical path design is reasonable and efficient. The three types of lasers are transmitted through independent optical paths. The green light and infrared light are shared by a red-green beam combiner, which not only ensures the reliability of independent operation of each type of laser, but also optimizes the optical path layout and adapts to the different processing needs of various materials in university experiments.

[0020] 4. The vibration-damping optical platform adopts a damping and vibration isolation structure to reduce the impact of external factors on the laser. The cross-axis motion system drives the processing table to move flexibly. The combination of the two enables the equipment to maintain stable operation in a variety of experimental processing scenarios.

[0021] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the front structure of a three-band laser cutting machine.

[0023] Figure 2 This is a schematic diagram of the back structure of a three-band laser cutting machine.

[0024] The meanings of the labels in the figures are as follows.

[0025] 1. Laser 2. First ultraviolet mirror

[0026] 3 First infrared reflector 4 First green light reflector

[0027] 5 Second ultraviolet reflector 6 Second infrared reflector

[0028] 7 Second green light reflector 8 Third green light reflector

[0029] 9 Third infrared reflector 10 Third ultraviolet reflector

[0030] 11 Fourth green light reflector 12 Red-green beam combiner

[0031] 13 Fourth ultraviolet reflector 14 First red-green reflector

[0032] 15 Fifth ultraviolet reflector 16 Second red-green reflector

[0033] 17 Galvanometer 18 Focusing objective

[0034] 19 Heavy-duty foot cup 20 Steel frame base

[0035] 21 Motion axis Y 22 Motion axis X

[0036] 23 Shock-absorbing optical platform Detailed Implementation

[0037] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0038] like Figures 1 to 2This three-band laser cutting machine includes a laser device and a cutting device. The optical path of the laser device works in conjunction with the cutting device to achieve laser processing in three wavelengths: ultraviolet, green, and infrared. Its unique feature is that the laser device includes a vibration-damping optical platform 23, on which the laser 1 is mounted. The vibration-damping optical platform 23 adopts a damped vibration isolation structure, which can effectively reduce the impact of external vibrations on the laser 1. The laser 1 can emit ultraviolet, green, and infrared laser light in three wavelengths to meet different experimental processing needs. Simultaneously, the cutting device includes a steel frame base 20, which adopts a weighted design to lower the center of gravity of the equipment and enhance overall stability. Furthermore, several heavy-duty feet 19 are installed below the steel frame base 20. These heavy-duty feet 19 do not have cushioning pads and can be welded and fixed to a pre-set foundation. Considering the need to improve the fixation effect, a pre-embedded steel plate can be used for welding, thereby reducing the vibration of the main body of the equipment during operation.

[0039] During implementation, a marble base plate is installed on the steel frame base 20. The marble base plate has high flatness and stability. A motion axis system is also installed on it. Specifically, the motion axis system used in this invention includes a motion axis X22 mounted on the marble base plate, and a motion axis Y21 mounted above the motion axis X22. The motion axis X22 and motion axis Y21 form a cross-axis structure. Considering the subsequent workpiece placement and processing requirements, a processing table is mounted on the motion axis Y21. Thus, through the coordinated movement of the motion axis X22 and motion axis Y21, the processing table can be moved in the forward, backward, left, and right directions to meet the processing position adjustment requirements.

[0040] Furthermore, a lifting bracket is installed on the marble substrate, on which a beam-combining modulation assembly and a processing output end are mounted. The processing output end includes a galvanometer 17 and a focusing objective lens 18. The light-emitting end of the focusing objective lens 18 corresponds to the processing table surface, ensuring that the laser can accurately act on the workpiece on the processing table surface. Simultaneously, to meet the processing requirements of three wavelengths (three optical paths), independent ultraviolet optical path components, green optical path components, and infrared optical path components are established between the laser equipment and the cutting equipment to respectively transmit the three wavelengths of laser light emitted by laser 1.

[0041] According to a preferred embodiment of this invention, the vibration-damping optical platform 23 is equipped with a docking bracket corresponding to the optical path output end of the laser 1. The docking bracket is equipped with a first ultraviolet reflector 2, a first infrared reflector 3, and a first green light reflector 4, used to receive the three types of laser light emitted by the laser 1 and guide them to the subsequent optical path. Simultaneously, to ensure orderly docking of the optical paths between the various reflectors and improve the transmission efficiency of the optical path, a pad is installed on the marble substrate, on which a second ultraviolet reflector 5, a second infrared reflector 6, and a second green light reflector 7 are respectively installed. During implementation, a main carrier plate and a secondary carrier plate are installed on the lifting bracket. A third green light reflector 8, a third infrared reflector 9, and a third ultraviolet reflector 10 are respectively installed on the main carrier plate. Furthermore, a fourth green light reflector 11, a red-green beam combiner 12, a fourth ultraviolet reflector 13, a first red-green reflector 14, and a fifth ultraviolet reflector 15 are respectively installed on the secondary carrier plate.

[0042] Furthermore, the ultraviolet optical path assembly includes the aforementioned first ultraviolet reflector 2, second ultraviolet reflector 5, third ultraviolet reflector 10, fourth ultraviolet reflector 13, and fifth ultraviolet reflector 15. These reflectors are sequentially coupled to form a complete optical path. The ultraviolet light emitted by the laser 1 is reflected sequentially by these reflectors and finally transmitted to the focusing objective lens 18, forming an ultraviolet focusing processing optical path. Simultaneously, the infrared optical path assembly used in this invention includes the aforementioned first infrared reflector 3, second infrared reflector 6, and third infrared reflector 9. These reflectors are sequentially coupled to form a complete optical path. The infrared light emitted by the laser 1 is reflected sequentially by these reflectors and transmitted to the beam combining and modulation assembly. Moreover, the green light optical path assembly includes the aforementioned first green light reflector 4, second green light reflector 7, third green light reflector 8, and fourth green light reflector 11. These reflectors are sequentially coupled to form a complete optical path. The green light emitted by the laser 1 is reflected sequentially by these reflectors and transmitted to the beam combining and modulation assembly.

[0043] Considering the need for beam combining and modulation during the cutting process, the beam combining and modulation component used in this invention includes a red-green beam combiner 12 mounted on the sub-carrier plate of the lifting support. The red-green beam combiner 12 is configured to reflect infrared light and transmit green light, so that the infrared light and green light share the subsequent optical path after the red-green beam combiner 12. Simultaneously, a first red-green reflector 14 and a second red-green reflector 16 are sequentially installed at the output end of the red-green beam combiner 12. Both the first red-green reflector 14 and the second red-green reflector 16 are compatible with both green and infrared light. During implementation, the infrared light and green light, after being combined by the red-green beam combiner 12, are guided sequentially through the first red-green reflector 14 and the second red-green reflector 16 to the galvanometer 17, forming the infrared galvanometer processing optical path and the green galvanometer processing optical path. The galvanometer 17 is also compatible with both green and infrared light, enabling laser beam deflection scanning.

[0044] In addition, a control device is installed on the steel frame base 20. The control device can be an industrial computer, which is electrically connected to the motion axis X22 and motion axis Y21 to control the motion parameters of the motion axis system and realize the automated control of the processing process.

[0045] Furthermore, the directions or positional relationships described in this utility model are based on the directions or positional relationships shown in the accompanying drawings. They are only for the purpose of facilitating the description of this utility model and simplifying the description, and are not intended to indicate or imply that the device or structure referred to must have a specific orientation, or to operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0046] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A three-band laser cutting machine, comprising a laser device, with a cutting device installed at the optical path end of the laser device. Its features are: The laser device includes a vibration-damping optical platform (23), on which a laser (1) is mounted; The laser is used to emit ultraviolet, green, and infrared light; The cutting equipment includes a steel frame base (20), on which a marble substrate is mounted, and on which a motion axis system is mounted, the motion axis system including a motion axis X (22) mounted on the marble substrate, and a motion axis Y (21) mounted above the motion axis X (22); a processing table is mounted on the motion axis Y (21); The laser equipment and the cutting equipment are interconnected by independent ultraviolet light path components, green light path components, and infrared light path components; A lifting bracket is installed on the marble substrate, a beam-combining modulation component is installed on the lifting bracket, and a processing output end is also installed on the lifting bracket. The ultraviolet optical path assembly includes a first ultraviolet reflector (2), a second ultraviolet reflector (5), a third ultraviolet reflector (10), a fourth ultraviolet reflector (13), and a fifth ultraviolet reflector (15), and each reflector forms a complete optical path with each other; The infrared optical path assembly includes a first infrared reflector (3), a second infrared reflector (6), and a third infrared reflector (9), with each reflector forming a complete optical path. The green light optical path assembly includes a first green light reflector (4), a second green light reflector (7), a third green light reflector (8), and a fourth green light reflector (11), with each reflector forming a complete optical path. The beam combining modulation assembly includes a red-green beam combining mirror (12) mounted on a lifting bracket. The output end of the red-green beam combining mirror (12) is sequentially equipped with a first red-green reflector (14) and a second red-green reflector (16). The processing output end includes a galvanometer (17) and a focusing objective (18). Ultraviolet light is reflected to the focusing objective (18) through the ultraviolet optical path assembly. Infrared light and green light are transmitted to the red-green beam combiner (12) through their respective optical path assemblies, and then guided to the galvanometer (17) through the first red-green reflector (14) and the second red-green reflector (16). The red-green beam combiner (12) is configured to reflect infrared light and transmit green light.

2. The three-band laser cutting machine according to claim 1, characterized in that: The vibration-damping optical platform (23) is equipped with a docking bracket at the optical path output end of the laser (1), and the first ultraviolet reflector (2), the first infrared reflector (3), and the first green light reflector (4) are mounted on the docking bracket.

3. The three-band laser cutting machine according to claim 1, characterized in that: A pad is installed on the marble substrate, and a second ultraviolet reflector (5), a second infrared reflector (6), and a second green light reflector (7) are respectively installed on the pad. The lifting support is equipped with a main carrier plate, and the main carrier plate is respectively equipped with a third green light reflector (8), a third infrared reflector (9), and a third ultraviolet reflector (10); The lifting support is also equipped with a sub-carrier plate, on which a fourth green light reflector (11), a red-green beam combiner (12), a fourth ultraviolet reflector (13), a first red-green reflector (14), and a fifth ultraviolet reflector (15) are respectively installed.

4. The three-band laser cutting machine according to claim 1, characterized in that: Several heavy-duty foot cups (19) are installed below the frame base (20).

5. The three-band laser cutting machine according to claim 1, characterized in that: The vibration reduction optical platform (23) is equipped with a damping and vibration isolation mechanism, which is a spring damper.

6. The three-band laser cutting machine according to claim 1, characterized in that: The motion axis X (22) and motion axis Y (21) form a cross-axis structure; the motion axis X (22) includes an X-axis linear motor connected to the marble substrate, and the motion axis Y (21) formed by the Y-axis linear motor is mounted on the X-axis linear motor. A processing panel is mounted on the motion axis Y (21), and the light-emitting end of the focusing objective (18) corresponds to the processing panel.

7. The three-band laser cutting machine according to claim 1, characterized in that: A control device is installed on the steel frame base (20), and the control device is electrically connected to the motion axis X (22) and the motion axis Y (21); the control device is an industrial computer.

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