A semiconductor factory recirculating cooling water system

Abstract

The embodiment of the utility model provides a kind of semiconductor factory circulating cooling water system, it is related to semiconductor manufacturing field.The utility model provides the semiconductor factory circulating cooling water system including cooling tower, mixed reaction pool, filter device and backwash device;Cooling tower is connected with terminal equipment, mixed reaction pool, and mixed reaction pool is used to carry out precipitation to calcium magnesium ion in cooling water;Cooling water in mixed reaction pool is transmitted to filter device bottom, and reflux pipeline is provided in filter device top, and filter device is backflowed to cooling tower by reflux pipeline after filtering cooling water, and cooling tower provides filtered cooling water to terminal equipment;Backwash device is set in filter device top, and the other end of backwash device is connected with liquid transmission pipe, and backwash device is washed to filter device by cooling water provided by liquid transmission pipe.The utility model provides the semiconductor factory circulating cooling water system in effective removal calcium magnesium ion in cooling water, and filtering effect is good.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and more specifically, to a circulating cooling water system for a semiconductor factory. Background Technology

[0002] In the semiconductor manufacturing industry, industrial circulating cooling water systems are core infrastructure for ensuring process stability, equipment reliability, and production sustainability. These systems lower water temperature through evaporative cooling in cooling towers. However, this process can lead to increased concentrations of calcium and magnesium ions in the water, causing structural problems, corrosion, and microbial growth.

[0003] Ordinary sand filters can only filter suspended solids and cannot remove calcium and magnesium ions from the water, resulting in poor filtration. After prolonged use, the filtration effect and operating efficiency will be greatly reduced due to problems such as impurity accumulation, colloidal substance accumulation, and microbial growth. Currently, calcium and magnesium ions in cooling water are generally removed by the following methods: adding ion exchange resin to the sand filter, but the resin needs to be regenerated periodically after saturation, which will produce high-salt wastewater, and the resin is prone to contamination or breakage with long-term use; adding zeolite adsorption to the sand filter, but the zeolite needs to be acid washed and regenerated after adsorption saturation, which is only suitable for small-flow scenarios; and using nano-adsorption materials in the sand filter, but the cost is high and the large-scale application is limited.

[0004] Therefore, there is an urgent need for a circulating cooling water system with good filtration performance and the ability to effectively remove calcium and magnesium ions from cooling water. Utility Model Content

[0005] The purpose of this invention is to provide a circulating cooling water system for semiconductor factories that can effectively remove calcium and magnesium ions from cooling water and has a wide range of applications.

[0006] This utility model provides a circulating cooling water system for a semiconductor factory, which can be used to remove calcium and magnesium ions from cooling water, including a cooling tower, a mixing reaction tank, a filtration device and a backwashing device; One end of the cooling tower is connected to the terminal equipment, and the other end is connected to the mixing reaction tank, which is used to precipitate calcium and magnesium ions in the cooling water. The mixing reaction tank transmits the cooling water to the bottom of the filtration device through a liquid transfer pipe. The top of the filtration device is equipped with a return pipe, through which the filtration device returns the filtered cooling water to the cooling tower. The cooling tower then provides the filtered cooling water to the terminal equipment. The backwashing device is located on top of the filter device and is connected to the liquid transfer pipe. The backwashing device rinses the filter device with cooling water supplied by the liquid transfer pipe.

[0007] In an optional embodiment, the filtration device includes a filter tank and, from bottom to top, a supporting water distribution layer, a quartz sand pad layer, a magnetic zeolite layer, a nano-coated sand layer, and a garnet particle layer laid in the filter tank.

[0008] In an optional embodiment, the supporting water distribution layer includes a pebble layer and a porous plate arranged sequentially from bottom to top. The porous plate is fixedly installed inside the filter tank. Each opening of the porous plate is provided with a slit anti-clogging cover. The anti-clogging cover is used to prevent the upper filter material from entering the opening and to allow cooling water to enter the quartz sand pad layer through the slit.

[0009] In an optional embodiment, the system further includes a reagent dosing unit, which stores a reagent and is connected to the mixing reaction tank for adding the reagent to the mixing reaction tank.

[0010] In an optional embodiment, the backwashing device includes a backwashing inlet pipe and a backwashing valve; The backwash inlet pipe is connected to the liquid transmission pipe, and the backwash valve is installed on the backwash inlet pipe; an on / off valve is installed on the liquid transmission pipe between the backwash inlet pipe and the filter device. When backwashing the filter device, the on / off valve is closed and the backwash valve is opened, and the cooling water enters the filter device through the backwash inlet pipe for backwashing.

[0011] In an optional embodiment, a water quality detection sensor is installed on the return pipeline.

[0012] In an optional embodiment, the backwashing device further includes a backwashing control module; The backwash control module is electrically connected to the backwash valve, the on / off valve, and the water quality detection sensor. The water quality detection sensor feeds back the water quality signal in the return pipeline to the backwash control module. When the backwash control module determines that the water quality signal is abnormal, it issues a command to the on / off valve and the backwash valve. The on / off valve closes, the backwash valve opens, and the cooling water in the backwash inlet pipe enters the top of the filter device to backwash the inside of the filter device.

[0013] In an optional embodiment, the top of the filter device is provided with a backwash nozzle, which is connected to the backwash inlet pipe.

[0014] In an optional embodiment, an external air supply line is connected to the backwash nozzle, and the external air supply line provides high-pressure gas to the backwash nozzle when the filter device is backwashed.

[0015] In an optional embodiment, the system further includes a wastewater collection tank, and the bottom of the filter device is provided with a backwash outlet pipe. A backwash outlet valve is provided on the backwash outlet pipe. The filter device is connected to the wastewater collection tank through the backwash outlet pipe, and the wastewater from the backwashing device backwashing the filter device enters the wastewater collection tank through the backwash outlet pipe.

[0016] The beneficial effects of the semiconductor factory circulating cooling water system provided in this embodiment of the invention include: In a mixing reaction tank, calcium and magnesium ions in the cooling water react and precipitate. The remaining calcium and magnesium ions in the treated cooling water are then adsorbed by a filtration device, which simultaneously filters out other particulate impurities, effectively improving the removal rate of calcium and magnesium ions. Furthermore, after prolonged operation, the filtration device is backwashed to remove suspended solids, colloidal particles, and other impurities, and to remove blockages between filter media particles, restoring the original porous structure and filtration capacity. This further enhances the filtration effect and the adsorption of calcium and magnesium ions. The filtration device can be reused, further ensuring its adsorption performance for residual calcium and magnesium ions in the cooling water and improving the efficiency of calcium and magnesium ion removal. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of the circulating cooling water system for a semiconductor factory provided in this embodiment.

[0019] Icons: 10 - Terminal equipment; 100 - Cooling tower; 200 - Mixing reaction tank; 300 - Filtration device; 310 - Supporting water distribution layer; 311 - Pebble layer; 312 - Porous plate; 320 - Quartz sand cushion layer; 330 - Magnetic zeolite layer; 340 - Nano-coated sand layer; 350 - Garnet particle layer; 400 - Backwashing device; 410 - Backwashing inlet pipe; 420 - Backwashing valve; 430 - Backwashing control module; 440 - Backwash nozzle; 510 - Liquid transfer pipe; 520 - Return pipeline; 521 - Water quality detection sensor; 530 - On / off valve; 600 - Chemical dosing unit; 700 - Wastewater collection tank; 710 - Backwashing outlet pipe; 720 - Backwashing outlet valve. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0023] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0024] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0025] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.

[0026] Current methods for removing calcium and magnesium ions from cooling water have significant limitations, limited applicability, and poor filtration efficiency.

[0027] To address the problems existing in the background art, this utility model provides a circulating cooling water system for semiconductor factories, which can be used to remove calcium and magnesium ions from cooling water. The overall structure, working principle, and technical effects of the circulating cooling water system for semiconductor factories provided by this utility model are described in detail below through embodiments and with reference to the accompanying drawings.

[0028] Please refer to Figure 1The semiconductor factory circulating cooling water system provided by this utility model includes a cooling tower 100, a mixing reaction tank 200, a filtration device 300, and a backwashing device 400. The cooling tower 100 is a conventional cooling tower. One end of the cooling tower 100 is connected to a terminal device 10 within the semiconductor factory, providing cooling water to the terminal device 10. The terminal device can be semiconductor process equipment. The other end of the cooling tower 100 is connected to the mixing reaction tank 200 to store cooling water and precipitate calcium and magnesium ions in the cooling water. The bottom of the filtration device 300 is connected to the mixing reaction tank 200 via a liquid transfer pipe 510. Cooling water reacted in the mixing reaction tank 200 enters the filtration device 300 from the bottom. A return pipe 520 is provided at the top of the filtration device 300. After filtration in the filtration device 300, the cooling water is returned to the cooling tower 100 through the return pipe 520. The cooling tower 100 then provides the filtered cooling water to the terminal device 10. The backwashing device 400 is installed on top of the filter device 300 and is connected to the liquid transfer pipe 510. After the filter device 300 has been running for a long time, the backwashing device 400 inputs cooling water provided by the liquid transfer pipe 510 from the top of the filter device 300 and discharges the cooling water from the bottom of the filter device 300 to backwash the inside of the filter device 300, so as to remove the impurities accumulated inside the filter device 300 and improve the filtration effect and adsorption efficiency of calcium and magnesium ions.

[0029] By reacting calcium and magnesium ions in the cooling water in the mixing reaction tank 200 to form precipitates, most of the calcium and magnesium ions in the cooling water are removed. Then, the remaining calcium and magnesium ions in the cooling water after treatment in the mixing reaction tank are adsorbed in the filter device 300, while other particulate impurities in the cooling water are filtered out, effectively improving the removal rate of calcium and magnesium ions. Furthermore, after the filter device 300 has been running for a long time, it is backwashed by the backwash device 400 to remove suspended solids, colloidal particles, and other impurities, and to unblock the filter media particles, restoring the original porosity and filtration capacity, thereby improving the filtration effect and the adsorption effect of calcium and magnesium ions. The filter device 300 and the backwash device 400 can be reused, further ensuring the adsorption performance of the filter device 300 on residual calcium and magnesium ions in the cooling water and improving the efficiency of calcium and magnesium ion removal.

[0030] Please refer to Figure 1In some optional embodiments, the semiconductor factory circulating cooling water system further includes a reagent dosing unit 600, which stores reagents, including precipitants and flocculants. The reagent dosing unit 600 is connected to a mixing reaction tank 200. In the treatment process, the reagent dosing unit 600 adds precipitants and flocculants to the mixing reaction tank 200, where they react with calcium and magnesium ions in the cooling water to form precipitates. In other optional embodiments, the reagents may also include pH adjusters, disinfectants, oxidants, and other chemical reagents. The specific components of the reagents can be selected adaptively according to actual filtration requirements. Specifically, in this embodiment, the precipitant stored in the reagent dosing unit 600 is... A mixed solution of sodium hydroxide and NaOH solution, with a concentration of 10%-20%, is added. The specific dosage is adjusted in real time according to the hardness of the cooling water to be treated, thereby ensuring that calcium ions ( ) to produce calcium carbonate ( ) precipitate, magnesium ions ( ) generates magnesium hydroxide ( Precipitation. The flocculant stored in the reagent dosing unit 600 is 500 mg / L PAC (polyaluminum chloride) and 2‰ PAM (polyacrylamide) at a flocculant concentration of 2000 mg / L.

[0031] In some alternative embodiments, please refer to Figure 1 The filtration device 300 includes a filter tank and, from bottom to top, a supporting water distribution layer 310, a quartz sand pad layer 320, a magnetic zeolite layer 330, a nano-coated sand layer 340, and a garnet particle layer 350 laid in the filter tank.

[0032] Preferably, the supporting water distribution layer 310 includes a pebble layer 311 and a perforated plate 312 arranged sequentially from bottom to top. The perforated plate 312 is fixedly disposed within the filter device 300. Specifically, the perforated plate 312 is welded to the inside of the filter tank, and a plurality of orifices for cooling water to pass through are distributed on the perforated plate 312. The perforated plate 312 is a duplex steel perforated plate with a thickness of 12 mm. The orifice diameter of the perforated plate 312 is 8 mm, and the orifice is in the form of an inverted conical V-shaped hole, with adjacent orifices staggered at 45°. The pebble layer 311 is located within the filter device 300 and below the perforated plate 312, while the quartz sand pad layer 320 is located above the perforated plate 312. To prevent quartz sand in the quartz sand pad 320 from falling through the orifices below the porous plate 312, thus causing filter media loss and reducing filtration efficiency, an anti-clogging cover (not shown in the attached diagram) is installed on each orifice of the porous plate 312. The anti-clogging cover is located on the upper surface of the porous plate 312 and arches away from it. The anti-clogging cover has a 1mm wide gap, thus preventing quartz sand in the quartz sand pad 320 from falling into the orifices without affecting the passage of cooling water. To prevent corrosion of the anti-clogging cover during use, it is made of stainless steel. The supporting water distribution layer 310 provides support for the filter media in the filter device 300 while distributing cooling water through the pebble layer 311, ensuring that the cooling water evenly passes through the porous plate 312 and contacts the filter media, thereby improving the filtration efficiency.

[0033] Furthermore, the quartz sand pad 320 is laid above the supporting water distribution layer 310. Preferably, the height of the quartz sand pad 320 is 10cm. Those skilled in the art can set it according to actual conditions, and it is not limited here. The quartz sand pad 320 supports the magnetic zeolite layer 330, supports the upper filter media, prevents the upper filter media from being carried away by the water flow during backwashing, and also plays a role in uniformly distributing water, dispersing the weight of the upper filter media and water, and making the cooling water more evenly distributed to the magnetic zeolite layer 330.

[0034] Furthermore, the magnetic zeolite layer 330 includes zeolite particles and magnetite particles, and within the magnetic zeolite layer 330, 10% magnetite particles are incorporated into the zeolite particles. Zeolite mixed with magnetite particles is mixed with water to form a slurry, which is then pumped into the filter device 300. This forms a layer structure within the magnetic zeolite layer 330, where magnetite particles are embedded within the zeolite particle layer. Both the zeolite particles and the magnetite particles in the magnetic zeolite layer 330 can adsorb residual calcium and magnesium ions in the cooling water, further improving the removal rate of calcium and magnesium ions. During production, a magnet is used to check the uniformity of the magnetite particle distribution within the magnetic zeolite layer 330, requiring a magnetization intensity ≥ 40 emu / g. To meet the filtration requirements of the cooling water, the filling height of the magnetic zeolite layer 330 within the filter device 300 is 40 ± 2 cm.

[0035] Furthermore, the nano-coated sand layer 340 includes a surface covered with... The quartz sand in the layer. Nano-coated sand layer 340 The layer can adsorb residual calcium and magnesium ions in the cooling water, further improving the removal rate of calcium and magnesium ions. The nano-coated sand layer 340 is made of quartz sand, and during processing, it is removed by vacuum adsorption. Alumina sol is loaded onto the surface of quartz sand, dried and cured at 105℃, and then compacted in layers within the filter device 300 by vibration every 10cm to form a nano-coated sand layer 340. Specifically, the coating coverage of the nano-coated sand layer 340 is ≥90%, and the porosity of the nano-coated sand layer 340 is 38%-42%.

[0036] For further details, please refer to Figure 1 Please refer to Figure 1 The particle size of the garnet granule layer 350 decreases gradually from top to bottom, with the top particles having a diameter of 0.5 mm and the bottom particles having a diameter of 0.3 mm. Furthermore, the garnet granule layer 350 requires acid pretreatment before filling; specifically, it uses 5%... Soak in (hydrogen chloride) solution for 2 hours.

[0037] The filtration device 300 uses multiple layers of filter media to trap sediment, while the magnetite in the magnetic zeolite layer 330 accelerates sediment separation and improves sedimentation efficiency; furthermore, the nano-coated sand layer 340 has nano-coated sand on its surface. The coating provides adsorption sites for calcium and magnesium ions. The hydroxyl groups on its surface react with calcium and magnesium ions to form precipitates, further enhancing the removal efficiency. This system, through the synergy of chemical precipitation and sand filtration, adsorbs calcium and magnesium ions in cooling water while simultaneously filtering out other impurities, improving both the removal efficiency and filtration of other impurities. Furthermore, it is easy to operate, low in cost, and widely applicable.

[0038] Please refer to Figure 1 In some optional embodiments, the backwashing device 400 includes a backwash inlet pipe 410 and a backwash valve 420. The backwash inlet pipe 410 is connected to a liquid transfer pipe 510, and the backwash valve 420 is installed on the backwash inlet pipe 410. An on / off valve 530 is installed on the liquid transfer pipe 510 between the backwash inlet pipe 410 and the filter device 300. When backwashing of the filter device 300 is required, the backwash valve 420 is opened, allowing cooling water to enter from the backwash inlet pipe 410 to the top of the filter device 300, thereby achieving backwashing of the filter device 300.

[0039] Understandably, an on / off valve 530 is installed on the liquid transfer pipe 510 between the backwash inlet pipe 410 and the filter device 300 to control the flow of water from the liquid transfer pipe 510 to the bottom of the filter device 300. When the filter device 300 is working, the on / off valve 530 is opened, and cooling water enters the filter device 300 from the bottom for filtration. When backwashing the filter device 300, the on / off valve 530 is disconnected, and the backwash valve 420 is opened, allowing cooling water to enter the filter device 300 from the top for backwashing.

[0040] Please refer to Figure 1 To facilitate the discharge and storage of backwashed wastewater, in this embodiment, the system also includes a wastewater collection tank 700. A backwash outlet pipe 710 is also provided at the bottom of the filter device 300. The filter device 300 is connected to the wastewater collection tank 700 through the outlet pipe. The wastewater from the backwashing of the filter device 300 by the backwashing device 400 enters the wastewater collection tank 700 through the backwash outlet pipe 710, thus achieving the storage and collection of the backwashed wastewater. A backwash outlet valve 720 is also provided on the backwash outlet pipe 710 to control the opening and closing of the backwash outlet pipe 710.

[0041] For further details, please refer to Figure 1 In some alternative embodiments, a water quality sensor 521 is provided on the return pipe 520. The backwash device 400 includes a backwash inlet pipe 410, a backwash valve 420, and a backwash control module 430. The backwash inlet pipe 410 is connected to the liquid transmission pipe 510, and the backwash valve 420 is provided on the backwash inlet pipe 410. An on / off valve 530 is provided on the liquid transmission pipe 510 between the backwash inlet pipe 410 and the filter device 300. The backwash control module 430 is electrically connected to the backwash valve 420 and the water quality sensor 521. The water quality sensor 521 is used to detect the water quality signal of the cooling water in the return pipe 520 and transmit the water quality signal to the backwash control module 430. When the backwash control module 430 determines that the water quality signal is abnormal, it sends a command to the backwash valve 420 and controls the backwash valve 420 to open. Cooling water in the backwash inlet pipe 410 enters the top of the filter device 300 to backwash the interior of the filter device 300. Furthermore, the backwash control module 430 is electrically connected to the on / off valve 530 on the liquid transfer pipe 510. The water quality sensor 521 detects the water quality signal of the cooling water in the return pipe 520 and transmits the water quality signal to the backwash control module 430. When the backwash control module 430 determines that the water quality signal is abnormal, it sends a command to the on / off valve 530 and controls the on / off valve 530 to close. Simultaneously, it sends a command to the backwash valve 420 and controls the backwash valve 420 to open for backwashing.

[0042] In this embodiment, the water quality sensor 521 is a hardness sensor, used to detect the hardness of the cooling water in the return pipe 520. When the hardness of the cooling water in the return pipe 520 is detected to be greater than 200 mg / L, the backwash control module 430 controls the on / off valve 530 to close and controls the backwash valve 420 to open. In other optional embodiments, the water quality sensor 521 can also be a differential pressure sensor, used to detect the pressure difference between the cooling water pressure in the return pipe 520 and the cooling water pressure in the liquid transmission pipe 510. When the pressure difference is greater than 0.08 MPa, the backwash control module 430 controls the on / off valve 530 to close and controls the backwash valve 420 to open.

[0043] Please refer to Figure 1 In some optional embodiments, a backwash nozzle 440 is provided on the top of the filter device 300. The backwash nozzle 440 is connected to the backwash inlet pipe 410. When the filter device 300 is backwashed, the water in the backwash inlet pipe 410 is sprayed out through the backwash nozzle 440 to improve the backwashing effect. Furthermore, a combined air-water backwashing system can be used to backwash the filter device 300. Specifically, an external air source pipeline (not shown in the attached diagram) is connected to the backwash nozzle 440. Specifically, when backwashing the filter device 300, while the backwash control module 430 controls the on / off valve 530 to close and the backwash valve 420 to open, the external air source pipeline is opened. The external air source (such as an air compressor, air pump, etc.) provides high-pressure gas to the backwash nozzle 440 through the external air source pipeline. The high-pressure gas provided by the external air source pipeline and the cooling water provided by the backwash water inlet pipe 410 mix instantaneously at the backwash nozzle 440, forming a high-intensity air-water mixed pulse jet that is ejected to backwash and clean the multi-layer filter media inside the filter device 300, improving the cleaning effect on the filter media. Specifically, in this embodiment, the gas pressure in the air-water mixed pulse jet is 0.3 MPa, and the water pressure passing through each square meter of filter area per second is... The specific composition of the gas is not limited here.

[0044] In summary, the circulating cooling water system for a semiconductor factory provided by this utility model adsorbs residual calcium and magnesium ions in the mixing reaction tank 200 after treatment, while simultaneously filtering out other particulate impurities in the cooling water, effectively improving the removal rate of calcium and magnesium ions. Furthermore, after the filter device 300 has been running for a long time, it is backwashed by the backwashing device 400 to remove suspended solids, colloidal particles, and other impurities, and to remove blockages between filter media particles, restoring the original porous structure and filtration capacity, thereby improving the filtration effect and the adsorption effect of calcium and magnesium ions. The filter device 300 can be reused, further ensuring its adsorption performance of residual calcium and magnesium ions in the cooling water and improving the efficiency of calcium and magnesium ion removal.

[0045] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. A circulating cooling water system for a semiconductor factory, characterized in that, It can be used to remove calcium and magnesium ions from cooling water, including in cooling towers, mixing reaction tanks, filtration devices, and backwashing devices. One end of the cooling tower is connected to the terminal equipment, and the other end is connected to the mixing reaction tank, which is used to precipitate calcium and magnesium ions in the cooling water. The mixing reaction tank transmits the cooling water to the bottom of the filtration device through a liquid transfer pipe. The top of the filtration device is equipped with a return pipe, through which the filtration device returns the filtered cooling water to the cooling tower. The cooling tower then provides the filtered cooling water to the terminal equipment. The backwashing device is located on top of the filter device and is connected to the liquid transfer pipe. The backwashing device rinses the filter device with cooling water supplied by the liquid transfer pipe.

2. The semiconductor factory circulating cooling water system according to claim 1, characterized in that, The filtration device includes a filter tank and, from bottom to top, a supporting water distribution layer, a quartz sand pad layer, a magnetic zeolite layer, a nano-coated sand layer, and a garnet particle layer laid in the filter tank.

3. The semiconductor factory circulating cooling water system according to claim 2, characterized in that, The supporting water distribution layer includes a pebble layer and a porous plate arranged sequentially from bottom to top. The porous plate is fixedly installed inside the filter tank. Each opening of the porous plate is provided with a slit anti-clogging cover. The anti-clogging cover is used to prevent the upper filter material from entering the opening and to allow cooling water to enter the quartz sand pad layer through the slit.

4. The semiconductor factory circulating cooling water system according to claim 1, characterized in that, The system also includes a reagent dosing unit, which stores reagents and is connected to the mixing reaction tank and used to add the reagents to the mixing reaction tank.

5. The semiconductor factory circulating cooling water system according to claim 1, characterized in that, The backwashing device includes a backwashing inlet pipe and a backwashing valve; The backwash inlet pipe is connected to the liquid transmission pipe, and the backwash valve is installed on the backwash inlet pipe; an on / off valve is installed on the liquid transmission pipe between the backwash inlet pipe and the filter device. When backwashing the filter device, the on / off valve is closed and the backwash valve is opened, and cooling water enters the filter device through the backwash inlet pipe for backwashing.

6. The semiconductor factory circulating cooling water system according to claim 5, characterized in that, A water quality detection sensor is installed on the return pipeline.

7. The semiconductor factory circulating cooling water system according to claim 6, characterized in that, The backwashing device also includes a backwashing control module; The backwash control module is electrically connected to the backwash valve, the on / off valve, and the water quality detection sensor. The water quality detection sensor feeds back the water quality signal in the return pipeline to the backwash control module. When the backwash control module determines that the water quality signal is abnormal, it issues a command to the on / off valve and the backwash valve. The on / off valve closes, the backwash valve opens, and the cooling water in the backwash inlet pipe enters the top of the filter device to backwash the inside of the filter device.

8. The semiconductor factory circulating cooling water system according to claim 7, characterized in that, The top of the filter device is equipped with a backwash nozzle, which is connected to the backwash inlet pipe.

9. The semiconductor factory circulating cooling water system according to claim 8, characterized in that, An external air supply line is connected to the backwash nozzle. When the filter device is being backwashed, the external air supply line provides high-pressure gas to the backwash nozzle.

10. The semiconductor factory circulating cooling water system according to claim 5 or 7, characterized in that, The system also includes a wastewater collection tank. The bottom of the filter device is also provided with a backwash outlet pipe and a backwash outlet valve. The filter device is connected to the wastewater collection tank through the backwash outlet pipe. The wastewater from the backwashing of the filter device by the backwashing device enters the wastewater collection tank through the backwash outlet pipe.

Images