Nitrogen heating device and wafer processing apparatus

Abstract

The utility model discloses a nitrogen heating device and wafer processing equipment, nitrogen heating device includes mounting panel and nitrogen heater, and mounting panel detachably installs at the top of the machine case of wafer processing equipment, nitrogen heater includes heating casing and a plurality of heating components, and heating casing detachably installs on mounting panel, and is provided with heating cavity in heating casing, and is provided with air inlet and air outlet on heating casing, and the first end of heating cavity is linked together with air inlet, and the second end of heating cavity is linked together with air outlet, and air inlet is linked together with the nitrogen gas source of outside to be heated, and the nitrogen gas of being heated is discharged from air outlet after air inlet, heating cavity, a plurality of heating components are arranged on heating casing, and heating component is configured to heat the nitrogen gas that passes through in heating cavity. The above-mentioned nitrogen heating device installs nitrogen heater at the top of wafer processing equipment machine case, and operator is not easy to touch by mistake, improves the security of equipment.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing equipment technology, and in particular to a nitrogen heating device and wafer processing equipment. Background Technology

[0002] In semiconductor manufacturing, wet processing is an important technology used to clean, etch, and remove impurities from the wafer surface. Compared to dry processing, wet processing offers advantages such as lower cost and easier operation.

[0003] Wet processing refers to the process of treating wafers using liquid chemical reagents. These processes typically involve steps such as cleaning, etching, and stripping to remove contaminants, form specific structures, or remove unwanted materials. After the cleaning process, the wafer needs to be dried with nitrogen. To ensure the dryness of the nitrogen, it needs to be heated in conjunction with the high-speed rotation of the wafer processing equipment to ensure the wafer surface is dry and clean.

[0004] Existing nitrogen heating devices are usually located at the bottom or side of wafer processing equipment. During the use of wafer processing equipment, the nitrogen heating devices are easily touched by operators, which can easily burn them and pose a certain safety hazard. Utility Model Content

[0005] To address the related technical problems, the present invention aims to provide a nitrogen heating device to solve the aforementioned problems; in addition, the present invention also provides a wafer processing equipment including the aforementioned nitrogen heating device.

[0006] To achieve the above objectives, the embodiments of this utility model adopt the following technical solutions:

[0007] A nitrogen heating device includes a mounting plate and a nitrogen heater, wherein:

[0008] The mounting plate can be detachably mounted on top of the wafer processing equipment chassis;

[0009] The nitrogen heater includes a heating shell and several heating components. The heating shell is detachably mounted on a mounting plate. A heating chamber is provided inside the heating shell. An air inlet and an air outlet are provided on the heating shell. The first end of the heating chamber is connected to the air inlet, and the second end of the heating chamber is connected to the air outlet. The air inlet is connected to an external nitrogen source to be heated. The nitrogen to be heated passes through the air inlet and the heating chamber and is discharged from the air outlet.

[0010] Several heating elements are disposed on the heating housing, and the heating elements are configured to heat the nitrogen gas passing through the heating chamber.

[0011] Optionally, the nitrogen heating device also includes a protective cover, which is fitted around the heating housing and covers the heating housing, with a gap between the protective cover and the heating housing.

[0012] Optionally, the protective cover is U-shaped, with openings at both ends along its length, and a clearance opening is provided on the protective cover, with the air inlet extending out of the clearance opening.

[0013] Optionally, the protective cover has multiple heat dissipation holes spaced apart.

[0014] Optionally, the protective cover has symmetrical extensions on both sides along its length, with mounting holes on the extensions. The mounting plate has threaded holes corresponding to the mounting holes, and fixing bolts pass through the mounting holes and are locked in the corresponding threaded holes to fix the protective cover to the mounting plate.

[0015] Optionally, the nitrogen heating device also includes a first temperature detector, which is disposed at a first end of the heating housing along its length and is configured to monitor the overall temperature of the nitrogen heating device.

[0016] Optionally, the heating element is a heating wire or a ceramic heating plate, wherein:

[0017] The heating wire is either embedded in the heating housing or placed in the reinforcing cavity;

[0018] The heating element is a ceramic heating element, which is attached to the outer wall of the heating housing or to the inner wall of the heating chamber.

[0019] Optionally, the nitrogen heating device also includes a gas filter and a second temperature detector. The gas outlet is connected to an outlet pipe. The gas filter and the second temperature detector are arranged sequentially and at intervals on the outlet pipe. The gas filter is configured to filter the heated nitrogen to remove impurities and particles from the nitrogen. The second temperature detector is configured to detect the temperature of the heated and filtered nitrogen.

[0020] Optionally, the gas inlet is located on one side of the first end of the heating housing along its own length direction, and is positioned perpendicular to the length direction of the heating housing.

[0021] A wafer processing apparatus comprising the aforementioned nitrogen heating device.

[0022] The beneficial effects of this utility model are as follows: Compared with the prior art, the nitrogen heating device provided by this utility model has the following beneficial effects:

[0023] 1. By installing the nitrogen heater on the top of the wafer processing equipment chassis, operators are less likely to accidentally touch it, thus improving equipment safety;

[0024] 2. The gap between the protective cover and the heating shell forms an air insulation layer, which can block the high temperature of the heating shell from being transmitted to the surroundings, preventing burns to operators, and at the same time protecting other precision components on the top of the chassis from high temperature baking, preventing component aging or functional failure.

[0025] 3. Multiple heat dissipation holes on the protective cover can accelerate the discharge of hot air between the protective cover and the heating shell, further reducing the temperature of the inner wall of the protective cover and preventing the protective cover from deforming due to long-term high temperature; at the same time, it can prevent hot air from back-permeating into the heating chamber, ensuring that the heating component can output heat stably. Attached Figure Description

[0026] To more clearly illustrate and understand the technical solutions in the embodiments of this utility model, the accompanying drawings used in the background technology and embodiment description of this utility model will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the structure of a nitrogen heating device provided in an embodiment of this utility model;

[0028] Figure 2 This is a schematic diagram of the structure of the nitrogen heater in a nitrogen heating device provided in this embodiment of the utility model;

[0029] Figure 3 This is a schematic diagram of the structure of the protective cover in a nitrogen heating device provided in an embodiment of this utility model. Detailed Implementation

[0030] The present invention will be further described in detail below with reference to the accompanying drawings.

[0031] To facilitate understanding of this utility model, a more complete description of it will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model. It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or there may be an intermediate component. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or there may be an intermediate component. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of this utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0032] Please see Figures 1 to 3 As shown, this embodiment provides a nitrogen heating device, which includes a mounting plate 10 and a nitrogen heater 20. The mounting plate 10 is detachably mounted on the top of the chassis 30 of the wafer processing equipment. The nitrogen heater 20 includes a heating shell 21 and a plurality of heating components 24. The heating shell 21 is detachably mounted on the mounting plate 10. A heating chamber is provided inside the heating shell 21. An air inlet 22 and an air outlet 23 are provided on the heating shell 21. The first end of the heating chamber is connected to the air inlet 22, and the second end of the heating chamber is connected to the air outlet 23. The air inlet 22 is connected to an external nitrogen source to be heated. The nitrogen to be heated passes through the air inlet 22 and the heating chamber and is discharged from the air outlet 23. A plurality of heating components 24 are disposed on the heating shell 21. The heating components 24 are configured to heat the nitrogen passing through the heating chamber.

[0033] It is evident that by installing the nitrogen heater 20 on top of the wafer processing equipment chassis 30, operators are less likely to accidentally touch it, thus improving the safety of the equipment.

[0034] In one embodiment, the nitrogen heating device also includes a protective cover 40, which is fitted around the heating housing 21 and covers the heating housing 21, with a gap between the protective cover 40 and the heating housing 21.

[0035] As can be seen, the gap between the protective cover 40 and the heating housing 21 forms an air insulation layer, which can block the high temperature of the heating housing 21 from being transmitted to the surroundings, preventing burns to operators, and at the same time protecting other precision components on the top of the chassis 30 from high-temperature baking, preventing component aging or functional failure.

[0036] In one embodiment, the protective cover 40 is U-shaped, with openings at both ends along its length. The protective cover 40 has a clearance opening 41, and the air inlet 22 extends out of the clearance opening 41.

[0037] As can be seen, the U-shaped protective cover 40 can fit the long strip structure of the heating shell 21, saving lateral space. The opening design at both ends facilitates air circulation, avoids heat accumulation inside the protective cover 40, maintains the heat dissipation effect of the heat insulation layer, and prevents the protective cover 40 from overheating.

[0038] In one embodiment, the protective cover 40 is provided with a plurality of heat dissipation holes 42 spaced apart.

[0039] As can be seen, the multiple heat dissipation holes 42 on the protective cover 40 can accelerate the discharge of hot air between the protective cover 40 and the heating shell 21, further reduce the temperature of the inner wall of the protective cover 40, and prevent the protective cover 40 from deforming due to long-term high temperature; at the same time, it can prevent hot air from penetrating back into the heating chamber, ensuring that the heating component 24 can stably output heat.

[0040] In one embodiment, the protective cover 40 has symmetrical extensions 43 on both sides along its length direction. The extensions 43 have mounting holes, and the mounting plate 10 has threaded holes corresponding to the mounting holes. The fixing bolts pass through the mounting holes and are locked in the corresponding threaded holes to fix the protective cover 40 on the mounting plate 10.

[0041] As can be seen, the mounting holes of the extension 43 and the threaded holes of the mounting plate 10 are fixed by bolts, which can firmly lock the protective cover 40 in the preset position, preventing the protective cover 40 from loosening and colliding with the heating housing 21 during the operation of the wafer processing equipment, which would cause the heating component 24 to shift or the pipeline to fall off. The detachable nature of the bolt connection allows the protective cover 40 to be quickly removed when the heating component 24 is inspected later, without damaging other structures, thus reducing maintenance complexity.

[0042] In one embodiment, the nitrogen heating device also includes a first temperature detector 50, which is disposed at a first end of the heating housing 21 along its length direction, and is configured to monitor the overall temperature of the nitrogen heating device.

[0043] As can be seen, the first temperature detector 50 monitors the overall temperature of the device and can provide real-time feedback on the risk of overheating. If the heating component 24 is short-circuited, causing the shell temperature to rise sharply, the detector can trigger an alarm to prevent fire or component burnout. At the same time, the overall temperature change can be used to determine whether the heating system is normal, which facilitates quick location of the fault point and reduces troubleshooting time.

[0044] In one embodiment, the heating element 24 is a heating wire or a ceramic heating plate. The heating wire is embedded in the heating housing 21 or is disposed in the reinforcing cavity. The heating element 24 is a ceramic heating plate, which is attached to the outer wall of the heating housing 21 or to the inner wall of the heating cavity.

[0045] As can be seen, the multiple options enable the device to adapt to the heating requirements of different wafer processing processes, thus improving its versatility.

[0046] In one embodiment, the nitrogen heating device further includes a gas filter 60 and a second temperature detector 70. The gas outlet is connected to an outlet pipe. The gas filter 60 and the second temperature detector 70 are sequentially and alternately arranged on the outlet pipe. The gas filter 60 is configured to filter the heated nitrogen to remove impurities and particles from the nitrogen. The second temperature detector 70 is configured to detect the temperature of the heated and filtered nitrogen.

[0047] As can be seen, by setting up the gas filter 60, impurities that may exist in the heated nitrogen are removed, ensuring that the purity of the nitrogen entering the wafer processing cavity meets the process requirements, avoiding wafer surface defects caused by impurities, and improving chip yield; by setting up the second temperature detector 70, the actual temperature of the outlet nitrogen can be detected in real time, ensuring that the nitrogen temperature accurately matches the process requirements, and avoiding wafer performance abnormalities caused by temperature deviation.

[0048] In one embodiment, the gas inlet is located on one side of the first end of the heating housing 21 along its own length direction, and is arranged perpendicular to the length direction of the heating housing 21.

[0049] As can be seen, the layout can avoid airflow short-circuiting caused by the air inlet 22 and the air outlet 23 being on the same straight line, and further ensure uniform nitrogen temperature at the outlet.

[0050] A wafer processing apparatus comprising the aforementioned nitrogen heating device.

[0051] In the embodiments disclosed in this utility model, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; "linking" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments disclosed in this utility model according to the specific circumstances.

[0052] The above embodiments merely illustrate the basic principles and characteristics of this utility model. This utility model is not limited to the above examples. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A nitrogen heating device, characterized in that, The nitrogen heating device includes a mounting plate and a nitrogen heater, wherein: The mounting plate is detachably mounted on the top of the chassis of the wafer processing equipment; The nitrogen heater includes a heating shell and several heating components. The heating shell is detachably mounted on the mounting plate. A heating chamber is provided inside the heating shell. An air inlet and an air outlet are provided on the heating shell. A first end of the heating chamber is connected to the air inlet, and a second end of the heating chamber is connected to the air outlet. The air inlet is connected to an external nitrogen source to be heated. The nitrogen to be heated passes through the air inlet and the heating chamber and is discharged from the air outlet. Several heating elements are disposed on the heating housing, and the heating elements are configured to heat nitrogen gas passing through the heating chamber.

2. The nitrogen heating device according to claim 1, characterized in that, The nitrogen heating device also includes a protective cover, which is fitted around the heating housing and covers the heating housing, with a gap between the protective cover and the heating housing.

3. A nitrogen heating device according to claim 2, characterized in that, The protective cover is U-shaped, with openings at both ends along its length. The protective cover has clearance openings, and the air inlet extends out of the clearance openings.

4. A nitrogen heating device according to claim 2, characterized in that, The protective cover has multiple heat dissipation holes spaced apart.

5. A nitrogen heating device according to claim 2, characterized in that, The protective cover has symmetrical extensions on both sides along its length. The extensions have mounting holes, and the mounting plate has threaded holes corresponding to the mounting holes. Fixing bolts pass through the mounting holes and are locked in the corresponding threaded holes to fix the protective cover to the mounting plate.

6. A nitrogen heating device according to claim 1, characterized in that, The nitrogen heating device further includes a first temperature detector, which is disposed at a first end of the heating housing along its length and is configured to monitor the overall temperature of the nitrogen heating device.

7. A nitrogen heating device according to claim 1, characterized in that, The heating element is a heating wire or a ceramic heating plate, wherein: The heating wire is embedded in the heating housing or the heating wire is disposed in the heating cavity; The heating element is a ceramic heating element, which is attached to the outer wall of the heating housing or to the inner wall of the heating cavity.

8. A nitrogen heating device according to claim 1, characterized in that, The nitrogen heating device further includes a gas filter and a second temperature detector. The gas outlet is connected to an outlet pipe. The gas filter and the second temperature detector are sequentially and alternately arranged on the outlet pipe. The gas filter is configured to filter the heated nitrogen to remove impurities and particles from the nitrogen. The second temperature detector is configured to detect the temperature of the heated and filtered nitrogen.

9. A nitrogen heating device according to claim 1, characterized in that, The air inlet is located on one side of the first end of the heating housing along its own length direction and is perpendicular to the length direction of the heating housing.

10. A wafer processing apparatus, characterized in that, The wafer processing equipment includes the nitrogen heating device described in any one of claims 1-9.

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