A semiconductor cold-heat shock test apparatus

Abstract

The utility model provides a kind of semiconductor cold and hot impact test equipment, comprising: box;It is located in box and separates its internal space into the detection chamber, high temperature chamber and the low temperature chamber of mutually independent isolation component;Rotatable embedded in the middle part of isolation component rotating column, including the strip-shaped accommodating groove being opened on its side face along the height direction thereof, the moving plate being located in accommodating cavity and making reciprocating motion along the radial direction of rotating column and the clamping structure for clamping the measured piece being installed on moving plate.This application, by isolation component, the box is divided into three relatively independent chambers, cooperate embedded in rotating column, without being taken out in the test chamber of semiconductor measured piece after cold and hot impact, detection can be realized, reduce the interference of external environment to detection result, improve detection accuracy, also improve detection efficiency.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor testing equipment, and in particular to a semiconductor thermal shock testing device. Background Technology

[0002] With the continuous innovation and development of the electronics industry, people's requirements for semiconductor quality are also getting higher and higher. Most electronic products, such as computers, mobile phones, or digital recorders, are closely related to semiconductors in their core components. At present, thermal shock testing machines are widely used in the market to test the degree to which semiconductor devices can withstand continuous high and low temperature environments in an instant, that is, to test the chemical changes or physical damage caused by thermal expansion and contraction in the shortest possible time.

[0003] In the Chinese utility model patent document with announcement number "CN222652778U" and titled "A Semiconductor Thermal Shock Testing Equipment", it is disclosed that "a test chamber is provided on the chamber body, a door is installed on the front side of the chamber body, a partition is fixedly installed in the middle of the test chamber, the partition divides the test chamber into a high-temperature chamber and a low-temperature chamber, a heating component is installed on the rear inner wall of the high-temperature chamber, a cooling component is installed on the rear inner wall of the low-temperature chamber, a hydraulic rod is fixedly installed on the top wall of the chamber body, a lifting frame is provided at the bottom end of the hydraulic rod, the lifting frame includes two cover plates, the two cover plates are fixedly connected by multiple connecting rods, the lifting frame is set in the through groove of the partition, and a rotating mechanism is provided on the lifting frame."

[0004] The problems with the above technical solution are as follows: On the one hand, after the semiconductor device has undergone extreme thermal shock cycles, it needs to be removed from the test chamber before testing. However, due to uncontrollable external factors, the time from removal to placement in the measuring equipment is affected by external temperature, humidity, dust, and airflow, causing the measurement accuracy to change over time, thus increasing experimental error. On the other hand, removing the device from the test chamber before testing undoubtedly prolongs the testing time and reduces testing efficiency.

[0005] Therefore, this application provides a thermal shock testing device that does not require removing the semiconductor device under test from the test chamber. Utility Model Content

[0006] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a semiconductor thermal shock testing device that can perform testing without removing the semiconductor test piece from the test chamber after thermal shock, thereby reducing the interference of the external environment on the test results, improving the accuracy of the test, and also improving the testing efficiency.

[0007] To achieve the above and other related objectives, this utility model provides the following technical solution: A semiconductor thermal shock testing device includes: a housing; an isolation assembly disposed within the housing and dividing its internal space into an independent testing chamber, a high-temperature chamber, and a low-temperature chamber; and a rotatable rotating column embedded in the middle of the isolation assembly, including a strip-shaped receiving groove formed on its side along its height direction, a movable plate disposed within the receiving cavity and reciprocating along the radial direction of the rotating column, and a clamping structure mounted on the movable plate for clamping the test piece.

[0008] The above technical solution is achieved by forming a three-chamber integrated structure consisting of a high-temperature chamber, a low-temperature chamber, and a detection chamber. This allows the test piece to complete the "thermal shock cycle-detection" process without being removed from the chamber. This enables seamless switching of the test piece between the various chambers within the chamber, avoiding interference from external factors during the process of removing the test piece for detection and improving the accuracy of the detection. At the same time, the fact that the test piece can be detected without being removed also improves the efficiency of the detection process.

[0009] Furthermore, the rotating column also includes rotating shafts located at both ends along its length. The rotating shafts pass through the isolation assembly and the housing in sequence along their own length and are connected to the output end of the rotating drive unit located outside the housing.

[0010] To achieve the above technical solution, the rotating column can be driven by the rotating drive unit to rotate within the isolation assembly, thereby enabling the strip-shaped receiving groove to connect with different chambers and allowing the test piece to switch seamlessly between the chambers.

[0011] Furthermore, the clamping structure is at least partially housed within the strip-shaped receiving groove, and includes a main jaw rotatably mounted on a movable plate, a drive cylinder for driving the main jaw to perform clamping actions, and a pair of secondary jaws rotatably mounted on the main jaw for clamping the workpiece to be tested.

[0012] To achieve the above technical solution, the clamping structure is gradually retracted into the strip-shaped receiving groove under the drive of the moving plate. The secondary gripper is folded until the test piece is parallel to the moving plate, so that the test piece can be completely accommodated in the strip-shaped receiving groove. This prevents interference and collision with the partition plate when the rotating column rotates, thus avoiding damage to the test piece.

[0013] Furthermore, the main gripper and the secondary gripper are detachably connected.

[0014] By implementing the above technical solution, technicians can replace different secondary grippers according to the different shapes of the test pieces, so that different test pieces can be firmly clamped, thus improving the applicability of the clamping structure.

[0015] Furthermore, it also includes a circulation assembly for maintaining a constant temperature inside the detection chamber, which includes an air tank located outside the housing, gas pipes connected to an air inlet and an air outlet respectively opened on the side wall of the detection chamber, and a temperature sensor located inside the detection chamber.

[0016] The above technical solution effectively ensures a stable detection environment within the re-detection chamber, free from external interference, thereby improving detection accuracy.

[0017] Furthermore, the testing chamber is also equipped with a visual inspection component, including industrial cameras positioned on either side of the workpiece and a supplementary light source that illuminates the workpiece.

[0018] The above technical solution enables technicians to clearly observe the physical changes, defects, and features that occur on the test piece after thermal shock cycles within the test chamber through the testing terminal.

[0019] Furthermore, the opening width of the strip-shaped receiving groove is smaller than the thickness of the isolation component.

[0020] By implementing the above technical solution, it is possible to effectively prevent the connection between two adjacent chambers due to the gap between the strip-shaped receiving groove and the partition when the rotating column rotates.

[0021] Furthermore, it also includes a sealing cover for sealing the enclosure; the enclosure, sealing cover, and isolation components are all equipped with an insulation layer.

[0022] To achieve the above technical solution, the insulation design further reduces the impact of the external environment on the internal temperature of the chamber and the mutual interference between the various chambers, ensuring the accuracy of the test results.

[0023] Furthermore, a heating component is installed in the high-temperature chamber, and a cooling component is installed in the low-temperature chamber.

[0024] To achieve the above technical solution, the heating mechanism and the cooling mechanism are used to control the temperature inside the heating chamber and the freezing chamber to achieve the required temperature for the test.

[0025] Furthermore, it also includes a control unit that is electrically connected to the drive unit, heating assembly, cooling assembly, vision inspection assembly, and circulation assembly; the control unit includes a built-in programmable controller and an interactive screen; the interactive screen is used to set the chamber temperature, circulation parameters, and the switching on and off of the circulation assembly, and to display the detection data measured by the vision inspection assembly.

[0026] By implementing the above technical solution, technicians can more conveniently control the electrical components located in the enclosure, change the temperature environment of each chamber, and more intuitively observe the physical changes of the test piece after thermal shock through the control unit.

[0027] As described above, the semiconductor thermal shock testing equipment of this utility model has the following beneficial effects: 1. In this application, by forming a three-chamber integrated structure of high-temperature chamber, low-temperature chamber and detection chamber, the test piece can complete the "thermal shock cycle-detection" testing process without being removed, realizing seamless switching of the test piece in each chamber of the chamber, avoiding interference from external factors during the process of removing the test piece for testing, and improving the accuracy of the test; at the same time, the test piece can be tested without being removed, which also improves the efficiency of the test.

[0028] 2. In this application, the rotating column embedded in the isolation component rotates within the isolation component under the drive of the rotation drive unit, thereby realizing the connection between the strip-shaped receiving groove and different chambers, enabling seamless switching of the test piece between various chambers. Attached Figure Description

[0029] Figure 1 The diagram shown is a structural schematic of a semiconductor thermal shock testing device according to this utility model.

[0030] Figure 2 The diagram shown is a schematic representation of the internal structure of the housing in this utility model.

[0031] Figure 3 The diagram shown is a schematic representation of the internal structure of the rotating column in this invention.

[0032] Figure 4 The diagram shown is a schematic representation of the internal structure of the clamping structure in this utility model.

[0033] Figure 5 The schematic diagram shows the structure of the visual inspection component in this utility model.

[0034] The components include: 1. Housing; 11. Detection chamber; 111. Air inlet; 112. Air outlet; 12. High-temperature chamber; 13. Low-temperature chamber; 2. Isolation assembly; 21. Partition; 3. Rotating column; 31. Strip-shaped receiving groove; 311. Slide rail; 32. Moving plate; 33. Clamping structure; 331. Main gripper; 332. Drive cylinder; 333. Secondary gripper; 334. Connecting shaft; 335. Gear; 336. Rack; 337. Telescopic cylinder; 34. Rotating shaft; 35. Rotation drive unit; 4. Circulation assembly; 41. Air tank; 42. Gas pipeline; 43. Temperature sensor; 5. Vision inspection assembly; 51. Industrial camera; 52. Supplemental lighting source; 6. Sealing cover; 7. Control unit; 71. Interactive screen. Detailed Implementation

[0035] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification.

[0036] Please see Figure 1-5 It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and are not intended to limit the scope of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this invention, should still fall within the scope of the disclosed technical content. Furthermore, the terms "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and not intended to limit the scope of this invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.

[0037] Please see Figures 1 to 5 This utility model provides a semiconductor thermal shock testing device, including a housing 1, an isolation component 2 disposed in the housing 1, and a rotatable rotating column 3 embedded in the middle of the isolation component 2.

[0038] The isolation component 2 divides the internal space of the housing 1 into three independent chambers: a detection chamber 11, a high-temperature chamber 12, and a low-temperature chamber 13. Specifically, the high-temperature chamber 12 is equipped with a heating component (not shown in the figure), the low-temperature chamber 13 is equipped with a cooling component (not shown in the figure), and the detection chamber 11 is connected to a protective gas circulation component 4, providing a stable detection environment for the semiconductor device under test. Preferably, the isolation component 2 includes three partitions 21, which are evenly distributed around the center of the housing 1, dividing the interior of the housing 1 into three independent and sealed chambers, each chamber being distributed in a 120° circumference.

[0039] Furthermore, the rotating column 3 includes a strip-shaped receiving groove 31 formed on its side along its height direction, a movable plate 32 disposed within the strip-shaped receiving groove 31 and reciprocating along the radial direction of the rotating column 3, and a clamping structure 33 mounted on the movable plate 32 for clamping the test piece. The movable plate 32, which can reciprocate along the radial direction of the rotating column 3 within the strip-shaped receiving groove 31, enables the clamping structure 33 and the clamped test piece to be accommodated in or removed from the strip-shaped receiving groove 31, and allows the test piece to switch between different chambers as the rotating column 3 rotates.

[0040] By forming a three-chamber integrated structure with the high-temperature chamber 12, the low-temperature chamber 13, and the detection chamber 11, the test piece can complete the "thermal shock cycle-detection" process without being removed from the chamber. This achieves seamless switching between the test piece and the chambers within the enclosure 1, avoiding interference from external factors during the process of removing the test piece for testing and improving the accuracy of the test. At the same time, the fact that the test piece can be tested without being removed also improves the efficiency of the test.

[0041] Please continue reading. Figure 3 The rotating column 3 also includes rotating shafts 34 located at both ends along its length.

[0042] Specifically, one end of the rotating shaft 34 passes sequentially through the isolation assembly 2 and the housing 1 along its length and is connected to the output end of the rotating drive unit 35 located outside the housing 1. The rotating drive unit 35 is located below the housing 1, and its output end is connected to the rotating shaft 34, driving the rotating column 3 to rotate within the housing 1 to change the chamber communicating with the strip-shaped receiving groove 31. Preferably, a sealing strip is installed at the contact point between the partition 21 and the rotating column 3 to ensure that the two remain sealed when the rotating column 3 rotates, preventing gas leakage from each chamber.

[0043] It should be noted that the opening width of the strip-shaped receiving groove 31 is less than the thickness of the partition plate 21, so as to avoid the two adjacent chambers from connecting due to the gap between the strip-shaped receiving groove 31 and the partition plate 21 when the rotating column 3 rotates.

[0044] Please continue reading. Figures 3 to 4 The clamping structure 33 is at least partially housed within the strip-shaped receiving groove 31. It includes a main gripper 331 rotatably mounted on a movable plate 32 via a rotating flange, a drive cylinder 332 that drives the main gripper 331 to perform clamping actions, and a pair of auxiliary grippers 333 rotatably mounted on the main gripper 331 for clamping the workpiece to be tested. A slide rail 311 is provided on the inner wall of the strip-shaped receiving groove 31. The side of the movable plate 32 away from the opening of the strip-shaped receiving groove 31 is connected to the output end of a drive motor. Driven by the drive motor, the movable plate 32 drives the clamping structure 33 to reciprocate radially along the rotating column 3. Preferably, the auxiliary grippers 333 are rotatably mounted on the main gripper 331 via a connecting shaft 334. A gear 335 is sleeved on the connecting shaft 334. The rotational drive of the auxiliary grippers 333 by the telescopic cylinder 337 is achieved through the meshing between the rack 336 connected to the output end of the telescopic cylinder 337 and the gear 335.

[0045] When the technician places the test piece into the housing 1, the main gripper 331, driven by the drive cylinder 332, moves closer to the side of the test piece, and the secondary gripper 333 clamps the test piece. When the test piece needs to enter the next chamber, the clamping structure 33, driven by the moving plate 32, gradually retracts into the strip-shaped receiving groove 31, and the secondary gripper 333 folds up until the test piece is parallel to the moving plate 32, so that the test piece can be completely contained in the strip-shaped receiving groove 31 and will not interfere with or collide with the partition 21 when the rotating column 3 rotates, thus preventing damage to the test piece.

[0046] Preferably, the main gripper 331 and the secondary gripper 333 are detachably connected. Technicians can replace different secondary grippers 333 according to the different shapes of the test pieces, so that different test pieces can be firmly clamped, thus improving the applicability of the clamping structure 33.

[0047] Please continue reading. Figure 1 and Figure 2 It also includes a circulation component 4 for maintaining a constant temperature within the detection chamber 11.

[0048] Specifically, the circulation component 4 includes an air storage tank 41 located outside the housing 1, a gas pipe 42 connected to an air inlet 111 and an outlet gas respectively opened on the side wall of the detection chamber 11, and a temperature sensor 43 located inside the detection chamber 11.

[0049] like Figure 1 As shown, the gas storage tank 41 is placed on the workbench and stores protective gas. The protective gas circulates between the gas storage tank 41 and the detection chamber 11 through the gas pipe 42, the inlet 111, and the outlet 112. Before detection, inert gas is introduced to replace the air in the detection chamber 11 and discharged through the three-way valve connected to the gas pipe 42 to prevent oxidation of the wafer after it enters the detection chamber 11 at high temperature.

[0050] Preferably, the gas pipe 42 connected to the air inlet 111 is surrounded by a temperature regulating device, which regulates the temperature inside the detection chamber 11 by heating or cooling the inert gas input into the detection chamber 11.

[0051] Please continue reading. Figure 2 and Figure 5 As shown in the figure, the detection chamber 11 is equipped with a vision inspection component 5, including an industrial camera 51 positioned opposite each other on both sides of the workpiece under test and a supplementary light source 52 illuminating the workpiece under test. High-definition industrial cameras 51 and adjustable supplementary light sources 52 are respectively installed at the upper and lower ends or the left and right ends of the detection chamber 11 to detect surface cracks, deformations and other features of the workpiece under test in real time.

[0052] The clamping structure 33 can rotate the workpiece along with itself according to the setting position of the industrial camera 51 and the supplementary light source 52, the properties of the workpiece itself, and the requirements of the process, so as to achieve the best observation effect.

[0053] Please continue reading. Figure 1 It also includes a sealing cover 6 for sealing the chamber 1. Preferably, the chamber 1, the sealing cover 6, and the isolation assembly 2 are all provided with a thermal insulation layer to further reduce the influence of the external environment on the internal temperature of the chamber 1 and the mutual interference between the various chambers, so as to ensure the accuracy of the test results.

[0054] In addition, such as Figure 1 As shown, this application also includes a control unit 7 that is electrically connected to the rotary drive unit, heating assembly, cooling assembly, vision inspection assembly 5 and circulation assembly 4. The control unit 7 includes a built-in programmable controller and an interactive screen 71. The interactive screen 71 is used to set the temperature of each chamber, circulation parameters, and the on / off state of the circulation assembly 4, and to display the detection images and data measured by the vision inspection assembly 5.

[0055] Technicians can more easily control the electrical components located in the enclosure 1, change the temperature environment of each chamber, and more intuitively observe the physical changes of the test piece after thermal shock through the control unit 7.

[0056] The implementation principle of the semiconductor thermal shock testing equipment of this utility model is as follows: The technician opens the sealing cover 6, places the test piece into the testing chamber 11 inside the housing 1, and clamps it using the clamping structure 33, then closes the sealing cover 6. Subsequently, the technician sets the temperature in the high-temperature chamber 12 and the low-temperature chamber 13, the number of thermal shock cycles, the residence time of the test piece in each chamber, and the temperature in the testing chamber 11 on the interactive screen 71, and clicks the start button. Then, the heating and cooling components begin to work, gradually bringing the temperature in both chambers to the set temperature. Simultaneously, the circulation component 4 begins to work, supplying the test piece with heat. Protective gas is introduced into the testing chamber 11 and the air inside is discharged. The temperature inside the testing chamber 11 is detected by the temperature sensor 43 located therein, and the temperature inside the testing chamber 11 is adjusted in real time to maintain it within a preset temperature range. When the temperature in the high-temperature chamber 12 and the low-temperature chamber 13 reaches the preset temperature, the cycle begins. The clamping structure 33 retracts and accommodates the test piece into the strip-shaped receiving groove 31. The secondary gripper 333 rotates to drive the rotating column 3 of the test piece rotation drive unit 35 to start rotating, transferring the test piece from the testing chamber 11 to the high-temperature chamber 12 or the low-temperature chamber 13. When the test piece dwell time is reached, the drive motor... The moving plate 32 moves radially along the rotating column 3 toward the inside of the strip-shaped receiving groove 31. Driven by the moving plate 32, the clamping structure 33 and the clamped workpiece are gradually and completely contained within the strip-shaped receiving groove 31 along the slide rail 311. Then, the rotating column 3 rotates again, carrying the workpiece into the next chamber. When the rotating column 3 stops rotating, the strip-shaped receiving groove 31 connects with the current chamber. Driven by the drive motor, the moving plate 32 moves along the slide rail 311 toward the current chamber, pushing the clamping structure 33 and the workpiece out of the strip-shaped receiving groove 31 and remaining in the current chamber for a certain period. This process is repeated until the required number of cycles is reached. 3. The test piece is moved back into the strip-shaped receiving groove 31 and enters the detection chamber 11 through the rotation of the rotating column 3. The clamping structure 33 is pushed out of the strip-shaped receiving groove 31 again by the moving plate 33 to move the test piece between the industrial camera 51 and the supplementary light source 52. The vision inspection component 5 inspects the test piece and transmits the captured image to the control unit 7. The clamping structure 33 can rotate itself according to the settings of the vision inspection component 5 to achieve the most convenient position for observing the test piece. The technician observes through the interactive screen 71 whether the surface of the test piece has cracked or other changes caused by thermal shock after undergoing thermal shock cycles.

[0057] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A semiconductor thermal shock testing device, characterized in that, include: Box (1); An isolation assembly (2) is installed inside the housing (1) and divides its internal space into independent detection chambers (11), high-temperature chambers (12) and low-temperature chambers (13); The rotatable rotating column (3) embedded in the middle of the isolation assembly (2) includes a strip-shaped receiving groove (31) opened on its side along its own height direction, a movable plate (32) disposed in the receiving cavity (31) and moving back and forth along the radial direction of the rotating column (3), and a clamping structure (33) mounted on the movable plate (32) for clamping the test piece.

2. The semiconductor thermal shock testing equipment according to claim 1, characterized in that, The rotating column (3) also includes rotating shafts (34) located at both ends of its length direction. The rotating shafts (34) pass through the isolation component (2) and the housing (1) in sequence along their own length direction and are connected to the output end of the rotating drive unit (35) located outside the housing (1).

3. The semiconductor thermal shock testing equipment according to claim 1, characterized in that, The clamping structure (33) is at least partially housed in the strip-shaped receiving groove (31), and includes a main jaw (331) rotatably mounted on a movable plate (32), a drive cylinder (332) for driving the main jaw (331) to perform clamping actions, and a pair of auxiliary jaws (333) rotatably mounted on the main jaw (331) for clamping the workpiece to be tested.

4. The semiconductor thermal shock testing equipment according to claim 3, characterized in that, The main gripper (331) and the secondary gripper (333) are detachably connected.

5. The semiconductor thermal shock testing equipment according to claim 1, characterized in that, It also includes a circulation assembly (4) for maintaining a constant temperature inside the detection chamber (11), which includes an air tank (41) located outside the housing (1), a gas pipe (42) connected to an air inlet (111) and an air outlet (112) respectively opened on the side wall of the detection chamber (11), and a temperature sensor (43) located inside the detection chamber (11).

6. The semiconductor thermal shock testing equipment according to claim 1, characterized in that, The detection chamber (11) is also equipped with a vision detection component (5), including an industrial camera (51) located on both sides of the workpiece to be tested and a supplementary light source (52) illuminating the workpiece to be tested.

7. The semiconductor thermal shock testing equipment according to claim 1, characterized in that, The opening width of the strip-shaped receiving groove (31) is smaller than the thickness of the isolation component (2).

8. The semiconductor thermal shock testing equipment according to claim 1, characterized in that, It also includes a sealing cover (6) for sealing the box (1); the box (1), the sealing cover (6) and the isolation assembly (2) are all provided with a thermal insulation layer.

9. The semiconductor thermal shock testing equipment according to claim 1, characterized in that, The high-temperature chamber (12) is equipped with a heating component, and the low-temperature chamber (13) is equipped with a cooling component.

10. The semiconductor thermal shock testing apparatus according to any one of claims 1-9, characterized in that, It also includes a control unit (7) that is electrically connected to the drive unit (35), heating assembly (121), cooling assembly (131), vision inspection assembly (5), and circulation assembly (4); the control unit (7) includes a built-in programmable controller and an interactive screen (71); the interactive screen (71) is used to set the chamber temperature, circulation parameters, and the on / off state of the circulation assembly and to display the detection data measured by the vision inspection assembly (5).

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