Display device with monitorable driving ic temperature

Abstract

The utility model discloses a kind of display equipment capable of monitoring driving IC temperature, it is related to display technical field;Display equipment capable of monitoring driving IC temperature includes display screen body, mainboard, driving IC, circuit carrier and board-to-board connector, application processor is equipped on mainboard, circuit carrier is equipped with temperature detection element, circuit carrier is arranged corresponding with driving IC in spatial position, to make temperature detection element be located just below driving IC, the first connecting end of board-to-board connector is located on circuit carrier and is electrically connected with temperature detection element, the second connecting end of board-to-board connector is located on the mainboard and is electrically connected with application processor.The utility model utilizes original circuit carrier inside display equipment, temperature detection element is set just below driving IC, to accurately monitor the temperature of driving IC.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a display device capable of monitoring the temperature of a driver IC. Background Technology

[0002] As display technology rapidly advances towards higher resolution, higher refresh rates, and greater flexibility, the integration and power consumption of display driver ICs (DICs) continue to increase. Their operating temperature has become a core factor affecting the performance and reliability of display modules. On one hand, excessively high driver IC temperatures can lead to decreased efficiency of the internal charge pump, causing voltage fluctuations in modules such as VGH / VGL, resulting in screen ghosting, flickering, and even pixel damage. On the other hand, prolonged high-temperature operation accelerates the aging of internal semiconductor devices in the driver IC, significantly shortening the lifespan of the display module. In extreme cases, thermal runaway can even pose safety risks. Therefore, accurate and real-time monitoring of the driver IC temperature is a crucial prerequisite for achieving thermal management of display modules (such as dynamic frequency reduction and brightness adjustment), ensuring stable display performance, and extending the service life of equipment. This has significant research and application value in fields such as smartphones, automotive displays, and high-end gaming screens.

[0003] Current temperature detection solutions for display driver ICs (DICs) still suffer from problems such as insufficient detection accuracy, poor adaptability, or high cost, making it difficult to meet the precise temperature control requirements of highly integrated display modules. Some solutions use a design where the temperature sensor is built into the driver IC. These sensors can only detect the junction temperature inside the chip and cannot reflect the actual thermal impact of the driver IC on surrounding components (such as pixel units and FPCs). They also cannot flexibly adapt to different models of driver ICs, resulting in poor versatility. Some solutions place the temperature sensor directly on the side of the driver IC, which cannot accurately detect the key heat sources inside the driver IC. In addition, some solutions place the temperature sensor on the backlight module or motherboard of the display module. Placing it on the backlight module usually requires the design of additional circuit components, increasing costs, while placing it on the motherboard results in a large response delay due to the distance between the motherboard and the display module, leading to untimely over-temperature protection. Utility Model Content

[0004] This utility model provides a display device capable of monitoring the temperature of a driver IC, comprising:

[0005] The display screen itself;

[0006] The motherboard has an application processor.

[0007] The driver IC is mounted on the display screen body and is bonded and connected to the display screen body.

[0008] The circuit carrier is equipped with a temperature sensing element; the circuit carrier is arranged spatially corresponding to the driving IC, such that the temperature sensing element is located directly below the driving IC;

[0009] The board-to-board connector includes a first connection end and a second connection end; the first connection end is disposed on the circuit carrier and electrically connected to the temperature sensing element; the second connection end is disposed on the motherboard and electrically connected to the application processor.

[0010] Optionally, the circuit carrier is an FPC, and the FPC is bonded to the driver IC;

[0011] The FPC is bent and attached to the back of the display body so that the temperature sensing element is located directly below the driver IC.

[0012] Optionally, the back of the display screen body is provided with an A-shell, and the back of the A-shell is provided with a sub-board, and the circuit carrier is the sub-board.

[0013] Optionally, the driver IC includes at least one of a VGH module, a VGL module, and a charge pump module; the temperature sensing element is located directly below at least one of the VGH module, VGL module, and charge pump module.

[0014] Optionally, the circuit carrier has a component area, and the temperature sensing element is encapsulated in the component area.

[0015] Optionally, the temperature sensing element is a thermistor.

[0016] Optionally, the display device for monitoring the temperature of the driver IC further includes a constant voltage source and a voltage divider resistor; a first end of the thermistor is connected to the constant voltage source, a second end of the thermistor is connected to the first end of the voltage divider resistor, and the second end of the voltage divider resistor is grounded; the node between the thermistor and the voltage divider resistor is connected to the first connection terminal of the board-to-board connector.

[0017] Optionally, the display device is an LCD display, and the display body includes a stacked backlight module and a liquid crystal panel.

[0018] Optionally, the display device is an OLED display, and the display screen body is an OLED panel.

[0019] Optionally, a polarizer, an OCA layer, and a cover glass are stacked sequentially on the display screen body.

[0020] This utility model has the following beneficial effects:

[0021] The display device provided by this utility model places the temperature detection element directly below the driver IC through a circuit carrier to accurately measure the temperature. The application processor on the motherboard can obtain the temperature signal of the temperature detection element in real time, thereby realizing dynamic monitoring of the temperature of the driver IC, ultimately ensuring stable display effect and eliminating safety hazards. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 A plan view of a display device capable of monitoring the temperature of a driver IC, provided in Embodiment 1 of this utility model;

[0024] Figure 2 A side view of a display device capable of monitoring the temperature of a driver IC, provided in Embodiment 1 of this utility model;

[0025] Figure 3 This is a schematic diagram of the temperature detection circuit of the display device that can monitor the temperature of the driver IC according to this utility model;

[0026] Figure 4 This is a schematic diagram of the structure of a display device capable of monitoring the temperature of a driver IC, provided in Embodiment 2 of this utility model.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Display screen body; 2. Driver IC; 2-1. Heat source; 3. Main board; 4. FPC; 5. Component area; 6. Thermistor; 7. Board-to-board connector (first connection end); 8. Board-to-board connector (second connection end); 9. Application processor; 10. Voltage divider resistor; 11. A shell; 12. Sub-board; 13. Backlight module; 14. LCD panel; 15. Polarizing film; 16. OCA layer; 17. Cover glass. Detailed Implementation

[0029] To make the utility model's objectives, features, and advantages more apparent and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0030] In the description of this utility model, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" (if present) indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0032] The technical terms are explained below:

[0033] Driver IC: Display driver integrated circuit, used to receive signals from the motherboard and convert them into signals to drive pixels to emit light; FPC: Flexible circuit board, in this utility model, FPC specifically refers to a flexible circuit board bonded to the driver IC, used to connect the driver IC and the motherboard; VGH: Gate high voltage, used to turn on the pixel switches in the display panel; VGL: Gate low voltage, used to turn off the pixel switches in the display panel; Charge pump: A voltage conversion circuit, used to convert low voltage into high voltage required to drive the panel; OCA: Optical transparent adhesive; A shell: The frame structure on the back of the display module; KB board: Sub-board, a circuit board set behind the A shell to realize a few auxiliary functions, forming a division of labor and cooperation with the motherboard.

[0034] The present invention provides a display device capable of monitoring the temperature of a driver IC. It utilizes the existing circuitry within the display device to place a temperature sensing element directly below the driver IC, thereby enabling precise temperature monitoring of the driver IC. The circuitry includes, but is not limited to, an FPC bonded to the driver IC, or a sub-board within the display device. The present invention presents the following specific embodiments. It should be noted that these specific embodiments are merely illustrative and do not constitute any limitation on the scope of protection of the present invention.

[0035] Example 1

[0036] See Figure 1 , 2The display device that can monitor the temperature of the driver IC includes a display body (1), a driver IC (2), a motherboard (3) and an FPC (4); the display body (1) includes a backlight module (13) and a liquid crystal panel (14), on which a polarizer (15), an OCA layer (16) and a cover glass (17) are stacked in sequence.

[0037] Among them, the driver IC (2) is set on the display body (1) and is bound to the display body (1), the FPC (4) is bound to the driver IC (2), the FPC (4) is provided with a temperature detection element, which is a thermistor (6); the FPC (4) is provided with a component area (5), which is a pre-planned circuit integration area on the FPC (4), and the thermistor (6) is set in the component area (5) to be compatible with the circuit structure and processing technology of the FPC itself.

[0038] The FPC (4) is electrically connected to the motherboard (3) via a board-to-board connector. The board-to-board connector includes a first connection end (7) on the FPC (4) and a second connection end (8) on the motherboard (3). The first connection end (7) is electrically connected to a thermistor (6). The motherboard (3) is equipped with an application processor (9). The second connection end (8) is electrically connected to the GPIO interface of the application processor (9).

[0039] The temperature detection circuit of this embodiment is referred to Figure 3 The display device that can monitor the temperature of the driver IC also includes a constant voltage source (used to power the temperature detection circuit, represented by VCC in the figure) and a voltage divider resistor (10) (not shown in the figure, which can be set on the FPC); the first end of the thermistor (6) is connected to the constant voltage source, the second end of the thermistor (6) is connected to the first end of the voltage divider resistor (10), the second end of the voltage divider resistor (10) is grounded, and the node between the thermistor (6) and the voltage divider resistor (10) is connected to the first connection end (7) of the board-to-board connector; when the temperature of the driver IC (2) changes, the resistance of the thermistor (6) changes, and the application processor (9) detects the voltage value at the node between the thermistor (6) and the voltage divider resistor (10) through the circuit of the board-to-board connector. The change of this voltage value reflects the change of the resistance of the thermistor (6). The application processor (9) converts the detected voltage value into a digital signal and provides the digital signal to the control circuit on the motherboard (3) related to display brightness, power supply and other functions. The relevant control circuit adjusts the brightness of the display device or performs a power-off operation.

[0040] See Figure 2In this embodiment, the FPC (4) is bent and attached to the back of the backlight module 13. By adjusting the bending degree of the FPC (4), the thermistor (6) on it can be aligned and arranged directly below the driver IC (2) to dynamically monitor the heat temperature of the driver IC (2). This solution utilizes the original FPC of the display device and does not add an extra circuit board. Although the thermistor (6) is separated from the driver IC (2) by the display body (1), the display body (1) is also the main heat source in the display device. Arranging the thermistor (6) on the FPC (4) directly below the driver IC (2) can more accurately assess the heat effect generated by the driver IC (2) under actual conditions.

[0041] In some preferred embodiments, the position of the thermistor (6) is arranged corresponding to the position of the heat source (2-1) in the driver IC (2) to accurately detect the temperature of the core heat source of the driver IC (2); wherein the heat source (2-1) is usually the VGH module, VGL module or charge pump module in the driver IC (2).

[0042] In some preferred embodiments, the temperature detection range of the thermistor (6) is 20~80°C.

[0043] Example 2

[0044] See Figure 4 The display device that can monitor the temperature of the driver IC includes a display body, a driver IC (2), a motherboard (3), an FPC (4), an A-shell (11), and a sub-board (12); the display body includes a backlight module (13) and a liquid crystal panel (14), on which a polarizer (15), an OCA layer (16), and a cover glass (17) are stacked in sequence.

[0045] Among them, the driver IC (2) is set on the display body and is bound to the display body, and the FPC (4) is bound to the driver IC (2); the A shell (11) is set on the back of the backlight module (13), and the back of the A shell (11) is provided with a sub-board (12).

[0046] Sub-board (12) includes, but is not limited to, power management sub-board, heat dissipation management sub-board, signal processing and interface expansion sub-board, etc. Temperature detection element is provided on sub-board (12), the temperature detection element is thermistor (6), thermistor (6) is located in component area (5) on sub-board (12), component area (5) is a pre-planned circuit integration area on sub-board (12); the spatial position of sub-board (12) is below driver IC (2), thermistor (6) is arranged directly below driver IC (2).

[0047] The sub-board (12) is electrically connected to the main board (3) via a board-to-board connector. The board-to-board connector includes a first connection end (7) on the sub-board (12) and a second connection end (8) on the main board (3). The first connection end (7) is electrically connected to a thermistor (6). The main board (3) is equipped with an application processor (9). The second connection end (8) is electrically connected to the GPIO interface of the application processor (9).

[0048] The temperature detection circuit of this embodiment is referred to Figure 3 The display device that can monitor the temperature of the driver IC also includes a constant voltage source (used to power the temperature detection circuit, represented by VCC in the figure) and a voltage divider resistor (10) (not shown in the figure, which can be set on the FPC); the first end of the thermistor (6) is connected to the constant voltage source, the second end of the thermistor (6) is connected to the first end of the voltage divider resistor (10), the second end of the voltage divider resistor (10) is grounded, and the node between the thermistor (6) and the voltage divider resistor (10) is connected to the first connection end (7) of the board-to-board connector; when the temperature of the driver IC (2) changes, the resistance of the thermistor (6) changes, and the application processor (9) detects the voltage value at the node between the thermistor (6) and the voltage divider resistor (10) through the circuit of the board-to-board connector. The change of this voltage value reflects the change of the resistance of the thermistor (6). The application processor (9) converts the detected voltage value into a digital signal and provides the digital signal to the control circuit on the motherboard (3) related to display brightness, power supply and other functions. The relevant control circuit adjusts the brightness of the display device or performs a power-off operation.

[0049] Sub-boards (power management sub-board, heat dissipation management sub-board, signal processing and interface expansion sub-board, etc.) are usually equipped with thermistors for monitoring the temperature of components on the sub-board. Therefore, in this embodiment, the thermistors on the sub-board can be reused, that is, the original thermistors on the sub-board can be used as thermistors for monitoring the temperature of the driver IC (2) in this embodiment. Only the placement of the original thermistors on the sub-board needs to be adjusted, which reduces the circuit design of the display device and saves costs.

[0050] In some preferred embodiments, the position of the thermistor (6) is arranged to correspond to the position of the heat source of the driver IC (2) in order to accurately detect the temperature of the core heat source of the driver IC (2); wherein the heat source is usually the VGH module, VGL module or charge pump module in the driver IC (2).

[0051] In some preferred embodiments, the temperature detection range of the thermistor (6) is 20~80°C.

[0052] Based on the display device that can monitor the temperature of the driver IC provided in Embodiments 1 and 2, a temperature detection logic for the display device can be further designed. Since the voltage value detected by the application processor corresponds one-to-one with the resistance value of the thermistor, the corresponding temperature-voltage curve can be obtained by statistically analyzing the correspondence between the voltage value and different temperature values ​​of the thermistor.

[0053] In some implementations, when the display brightness increases (for example, when the display usage scenario changes from indoor to outdoor, and the display brightness increases), if the temperature rise of the thermistor within 5 seconds exceeds a preset threshold, it is determined that the driver IC is overheating abnormally, and the display is powered off through the relevant control circuit. The preset threshold can be set to the temperature rise within 5 seconds after the display brightness changes from the minimum of 5 nits to the maximum of 1200 nits.

[0054] In other implementations, for different brightness levels of the display screen, the temperature threshold corresponding to each brightness level can be collected separately. When the display screen is displaying at a certain brightness level, if the temperature detected by the thermistor suddenly exceeds the temperature threshold of that level, it is determined that the driver IC is abnormally overheating, and the display screen is powered off through the relevant control circuit.

[0055] It should be noted that the solutions in Embodiments 1 and 2 are not limited to LCD displays (LCD displays include backlight modules and liquid crystal panels), but are also applicable to OLED displays (where the OLED panel is directly used as the display body).

[0056] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A display device capable of monitoring the temperature of a driver IC, characterized in that, include: The display screen itself; The motherboard has an application processor. The driver IC is mounted on the display screen body and is bonded and connected to the display screen body. The circuit carrier is provided with a temperature sensing element; the circuit carrier is arranged in a spatial position corresponding to the driving IC, such that the temperature sensing element is located directly below the driving IC; The board-to-board connector includes a first connection end and a second connection end; the first connection end is disposed on the circuit carrier and electrically connected to the temperature sensing element; the second connection end is disposed on the motherboard and electrically connected to the application processor.

2. The display device capable of monitoring the temperature of the driver IC according to claim 1, characterized in that, The circuit carrier is an FPC, and the FPC is bonded to the driver IC. The FPC is bent and attached to the back of the display body so that the temperature sensing element is located directly below the driver IC.

3. The display device capable of monitoring the temperature of the driver IC according to claim 1, characterized in that, The back of the display screen body is provided with a shell A, and the back of the shell A is provided with a sub-board, which is the circuit carrier.

4. The display device capable of monitoring the temperature of the driver IC according to claim 1, characterized in that, The driver IC includes at least one of a VGH module, a VGL module, and a charge pump module; The temperature sensing element is located directly below at least one of the VGH module, VGL module, and charge pump module.

5. The display device capable of monitoring the temperature of the driver IC according to claim 1, characterized in that, The circuit carrier has a component area, and the temperature detection element is encapsulated in the component area.

6. The display device capable of monitoring the temperature of the driver IC according to claim 1, characterized in that, The temperature sensing element is a thermistor.

7. The display device capable of monitoring the temperature of the driver IC according to claim 6, characterized in that, It also includes a constant voltage source and voltage divider resistors; The first end of the thermistor is connected to the constant voltage source, the second end of the thermistor is connected to the first end of the voltage divider resistor, and the second end of the voltage divider resistor is grounded; the node between the thermistor and the voltage divider resistor is connected to the first connection end of the board-to-board connector.

8. The display device capable of monitoring the temperature of the driver IC according to claim 1, characterized in that, The display screen body includes a stacked backlight module and a liquid crystal panel.

9. The display device capable of monitoring the temperature of the driver IC according to claim 1, characterized in that, The display screen itself is an OLED panel.

10. The display device capable of monitoring the temperature of a driver IC according to claim 8 or 9, characterized in that, The display screen body has a polarizer, an OCA layer and a cover glass layer stacked on it in sequence.

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