A high-power Schottky diode

Abstract

The utility model belongs to sampling device technical field, concretely relates to a kind of high-power schottky diode, including chip and three pins, the chip outer surface is equipped with mounting cover, mounting cavity is equipped in the mounting cover, the chip is installed in mounting cavity, three through-slots are equipped in the mounting cover front side, three the through-slots are communicated with mounting cavity, three the pin respectively passes through three through-slots and extends into mounting cavity, three the pin end of extension into mounting cavity is connected with chip, the mounting cover front surface is equipped with heat dissipation component, the heat dissipation component one end is connected with the chip in three through-slots, and heat dissipation component is reasonably designed and efficient.Passage of heat conduction piece and pin connection, can guide pin heat outward;Heat sink further absorbs and diffuses heat conduction piece heat, the heat dissipation groove arranged on it further increases the heat dissipation area, strengthens the heat dissipation function, effectively reduces chip and pin temperature, guarantees device stable operation.

Description

Technical Field

[0001] This utility model belongs to the field of sampling device technology, specifically relating to a high-power Schottky diode. Background Technology

[0002] High-power Schottky diodes are special diodes based on metal-semiconductor (MS) junctions, designed for high-power, high-efficiency applications. Their core advantages lie in low forward voltage drop, ultra-high-speed switching characteristics, and high-temperature resistance. Unlike ordinary PN junction diodes, it forms a Schottky barrier through direct contact between a metal (such as platinum or molybdenum) and an N-type semiconductor. This structure eliminates the minority carrier storage effect in PN junctions, enabling switching speeds down to the nanosecond level. Simultaneously, the forward voltage drop is reduced to 0.15-0.45V (far lower than the 0.7V of silicon PN junctions), significantly reducing conduction losses. It is particularly suitable for low-voltage, high-current applications. Its power handling capability is achieved through optimized chip area, the use of low-resistivity semiconductor materials (such as gallium arsenide), and improved packaging processes (such as copper clip bonding and DBC substrates). A single diode can withstand tens to hundreds of amperes of current, and the reverse withstand voltage typically covers the range of 15-200V, meeting the needs of industrial power supplies, new energy vehicle charging modules, and high-frequency communication rectification. Existing Schottky diodes have a simple structure and lack good heat dissipation, making them prone to breakdown due to overheating, especially for high-power Schottky diodes. Utility Model Content

[0003] The purpose of this invention is to provide a high-power Schottky diode to solve the problems existing in the background art.

[0004] To achieve the above-mentioned technical objectives, the technical solution adopted by this utility model is as follows: A high-power Schottky diode includes a chip and three pins. The outer surface of the chip is provided with a mounting cover, and a mounting cavity is provided inside the mounting cover. The chip is mounted in the mounting cavity. Three through slots are provided on the front side of the mounting cover, and the three through slots communicate with the mounting cavity. The three pins extend into the mounting cavity through the three through slots, and one end of the three pins extending into the mounting cavity is connected to the chip. A heat dissipation assembly is provided on the front surface of the mounting cover, and one end of the heat dissipation assembly is connected to the chip in the three through slots.

[0005] The heat dissipation assembly includes three heat-conducting components. The upper side of the mounting cover is provided with three connecting slots. The three heat-conducting components pass through the three connecting slots and are connected to the corresponding pins. The upper ends of the three heat-conducting components pass through the connecting slots and communicate with the outside.

[0006] The three heat-conducting components are provided with a heat dissipation plate on their upper sides.

[0007] The heat sink is provided with several heat dissipation slots arranged freely from the left.

[0008] All three heat-conducting components are bonded to the heat-conducting component adhesive.

[0009] The chip has a gap between the side facing the three through slots and the inner wall of the mounting cavity.

[0010] The mounting cover has a mounting plate on its upper side, and the mounting plate has mounting holes.

[0011] This utility model has the following technical advantages compared with the prior art: 1. The mounting cover encloses and seals the chip within the mounting cavity, effectively preventing external factors from damaging the chip, avoiding the intrusion of external impurities and dust, providing a reliable protective environment for the chip, and extending the chip's lifespan.

[0012] 2. The heat dissipation component is rationally designed and highly efficient. The heat-conducting component passes through the connecting slot and connects to the pin, which can guide the heat from the pin to the outside; the heat sink further absorbs and diffuses the heat from the heat-conducting component, and the heat dissipation slots on it increase the heat dissipation area, enhance the heat dissipation function, effectively reduce the temperature of the chip and pin, and ensure the stable operation of the device.

[0013] 3. The thermally conductive component is bonded to the lead with adhesive, which not only dissipates heat but also limits the lead's position. If the lead is accidentally pulled, the thermally conductive component prevents it from being pulled out of the mounting cover, thus avoiding device failure due to loose or detached leads.

[0014] 4. A gap is provided between the chip and the inner wall of the mounting cavity. When the pin is accidentally pulled, the pulling force will not be directly transmitted to the chip, effectively protecting the chip from external damage and reducing the risk of chip damage.

[0015] 5. The mounting cover is equipped with a mounting plate with mounting holes on the upper side, which makes it convenient for staff to use screws and other tools to quickly and securely install the entire device into the designated position, improving installation efficiency. Attached Figure Description

[0016] This utility model can be further illustrated by the non-limiting embodiments given in the accompanying drawings.

[0017] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a cross-sectional structural diagram of the present invention.

[0018] The symbols for the main components are explained below: Chip 1, pin 11, mounting cover 12, mounting cavity 13, through slot 14, heat-conducting component 21, connecting slot 22, heat sink 23, heat sink 24, gap 25, mounting plate 26, mounting hole 27. Detailed Implementation

[0019] To enable those skilled in the art to better understand this utility model, the technical solution of this utility model will be further described below in conjunction with the accompanying drawings and embodiments.

[0020] like Figure 1-2 As shown, this utility model discloses a high-power Schottky diode, including a chip 1 and three pins 11. The outer surface of the chip 1 is provided with a mounting cover 12, and the mounting cover 12 is provided with a mounting cavity 13. The chip 1 is installed in the mounting cavity 13. The front side of the mounting cover 12 is provided with three through slots 14, which are connected to the mounting cavity 13. The three pins 11 pass through the three through slots 14 and extend into the mounting cavity 13. One end of the three pins 11 extending into the mounting cavity 13 is connected to the chip 1. The front surface of the mounting cover 12 is provided with a heat dissipation component, one end of which is connected to the chip 1 in the three through slots 14.

[0021] Chip 1 is installed in mounting cavity 13, and three pins 11 pass through through slot 14 and are located in mounting cavity 13, so that the three pins 11 can be connected to chip 1. Mounting cover 12 can wrap and protect chip 1. Mounting cover 12 can seal and protect chip 1, preventing external damage to chip 1. At the same time, it can ensure that chip 1 is in a sealed space, so that external impurities and dust will not affect chip 1. One end of the heat dissipation component extends into the through slot 14 and connects to the pin 11, thus dissipating heat to the outside. This design allows the heat from the pin 11 to be guided outward after contact with the pin 11, improving the heat dissipation effect of the pin 11 and indirectly achieving the heat dissipation effect of the chip 1.

[0022] The heat dissipation assembly includes three heat-conducting components 21. The upper side of the mounting cover 12 is provided with three connecting slots 22. The three heat-conducting components 21 pass through the three connecting slots 22 and are connected to the corresponding pins 11. The upper ends of the three heat-conducting components 21 pass through the connecting slots 22 and communicate with the outside.

[0023] The heat-conducting component 21 can pass through the connecting groove 22 and connect to the pin 11. One end of the heat-conducting component 21 is connected to the outside, so the heat-conducting component 21 can guide the heat outward, thereby improving the heat dissipation effect. The end face of the heat-conducting component 21 is connected to the outside, which can improve the heat dissipation effect of the heat-conducting component 21.

[0024] A heat sink 23 is provided on the upper side of the three heat-conducting components 21. The heat sink 23 is designed to absorb and guide the heat from the heat-conducting components 21. Due to the large area of ​​the heat sink 23, the heat sink 12 can further improve the heat dissipation effect.

[0025] The heat sink 23 has several heat dissipation slots 24 arranged freely from left to right. The design of the heat dissipation slots 24 can further increase the area of ​​the upper side of the heat sink 12, thereby achieving the effect of heat dissipation from the heat sink 12 to the outside.

[0026] All three heat-conducting components 21 are glued together. This glued-to-connection design, where each heat-conducting component 21 is inserted into the connecting groove 22, effectively limits the movement of the pin 11. In the event of accidental pulling of the pin 11, the heat-conducting component 21 prevents the pin 11 from being pulled out of the mounting cover 12. A gap 25 is provided between the side of chip 1 facing the three through slots 14 and the inner wall of the mounting cavity 13. When pin 11 is accidentally pulled, the pulling force of pin 11 will not be transmitted to chip 1, thus achieving the effect of protecting chip 1.

[0027] The mounting cover 12 has a mounting plate 26 on its upper side, and the mounting plate 26 has mounting holes 27. This design facilitates the installation of the mounting cover 12 by the staff.

[0028] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A high-power Schottky diode, comprising a chip (1) and three pins (11), characterized in that: The chip (1) has a mounting cover (12) on its outer surface and a mounting cavity (13) inside the mounting cover (12). The chip (1) is mounted in the mounting cavity (13). The front side of the mounting cover (12) has three through slots (14) that communicate with the mounting cavity (13). The three pins (11) pass through the three through slots (14) and extend into the mounting cavity (13). One end of the three pins (11) extending into the mounting cavity (13) is connected to the chip (1). The front surface of the mounting cover (12) has a heat dissipation assembly. One end of the heat dissipation assembly is connected to the chip (1) inside the three through slots (14). The chip (1) is connected, and the heat dissipation assembly includes three heat-conducting components (21). The upper side of the mounting cover (12) is provided with three connecting slots (22). The three heat-conducting components (21) pass through the three connecting slots (22) and are connected to the corresponding pins (11). The upper ends of the three heat-conducting components (21) pass through the connecting slots (22) and communicate with the outside. The upper side of the three heat-conducting components (21) is provided with a heat dissipation plate (23). The three heat-conducting components (21) are all glued to the heat-conducting components (21). The chip (1) facing the three through slots (14) has a gap (25) between it and the inner wall of the mounting cavity (13).

2. A high-power Schottky diode according to claim 1, characterized in that: The heat sink (23) has several heat sink slots (24) arranged freely from the left.

3. A high-power Schottky diode according to claim 1, characterized in that: The mounting cover (12) has a mounting plate (26) on its upper side, and the mounting plate (26) has mounting holes (27).

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