Interfaces for electronic control units with circuit arrangement for flexible input signal conditioning

Abstract

An electronic control unit comprises a housing and an interface that extends across the housing and includes a variety of interface pins accessible on both the outside and inside of the housing. A printed circuit board (PCB) is arranged within the housing. A variety of conductive traces are operationally coupled to the PCB and extend between a variety of discrete component pads. A microcontroller is positioned on a microcontroller pad and includes an input pin that is conductively coupled to a first conductive trace. An input terminal is positioned on an input terminal pad and is conductively coupled to a second conductive trace and one of the variety of interface pins.A FISC (Flexible Input Signal Conditioning) circuit comprises a multitude of discrete components positioned on respective discrete component connection pads and conductively coupled to respective sets of the multitude of conductive traces.

Description

TECHNICAL FIELD

[0001] This application relates to electronic control unit (ECU) interfaces with circuitry for flexible input signal conditioning and associated devices, systems and processes. BACKGROUND

[0002] An electronic control unit (ECU) can be deployed in applications such as vehicle systems, engine systems, power generation systems, and other industrial devices or systems. ECU designs are subject to a number of constraints and limitations, including those related to configurability, adaptability, and flexibility to support multiple applications and features, and limitations on input / output (I / O) pins, mechanical package size, PCB density, and other constraints and limitations. There continues to be a significant need for the unique devices, processes, and systems of the present disclosure. DISCLOSURE OF EXEMPLARY EMBODIMENTS

[0003] In order to clearly, concisely, and accurately describe exemplary embodiments of the present disclosure, the manner and process of making and using the same, and to enable the practice, manufacture, and use of the same, reference will now be made to specific exemplary embodiments, including those illustrated in the figures, and specific language will be used to describe the same. It should be understood, nevertheless, that no limitation on the scope of the invention is thereby created, and that the invention includes and protects such changes, modifications, and additional applications of the exemplary embodiments as would be apparent to one skilled in the art. SUMMARY OF REVELATION

[0004] Some embodiments include devices that include a configurable ECU interface. Some embodiments include unique processes that involve a configurable ECU interface. Some embodiments include unique systems that include a configurable ECU interface. Other embodiments, forms, objects, features, advantages, aspects, and benefits will become apparent from the following description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram illustrating certain aspects of an example system in an example operating environment. Fig. Figure 2 is a schematic diagram illustrating certain aspects of an exemplary implementation of the system of Fig. 1 represents. Fig. 3 is a schematic diagram illustrating certain aspects of certain components of the exemplary implementation of Fig. 2 in a first assembly state. Fig. Figure 4 is a schematic diagram illustrating certain aspects of certain components of the exemplary implementation of Fig. 2 in a second compilation state. Fig. 5 is a schematic diagram illustrating certain aspects of certain components of the exemplary implementation of Fig. 2 in a third compilation state. Fig. Figure 6 is a flowchart illustrating certain aspects of an example process. DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

[0005] With reference to Fig. 1 illustrates an exemplary system 100 that includes a prime mover system 110 (also referred to herein as system 110) and at least a portion of one or more loads 109. The system 100 may be provided in a number of forms, including, for example, a vehicle or vehicle powertrain system (e.g., an on-road vehicle or on-road vehicle powertrain system, or an off-road vehicle or off-road vehicle powertrain system), a work machine or work machine powertrain system, a genset or genset powertrain system, or a hydraulic fracturing rig or hydraulic fracturing rig powertrain system, to name several non-limiting examples. It should be appreciated that the system 100 may include a number of other components, as will be apparent to one of ordinary skill in the art given the benefit and understanding of the present disclosure.

[0006] In the illustrated example, the system 110 is configured and provided as an internal combustion engine system that includes an intake air treatment system 112, an engine 114, an exhaust system 116, a fuel supply system 158, and an electronic control system 130. It should be appreciated that the system 110 may include a number of other components, as will be apparent to one of ordinary skill in the art given the utility and insight of the present disclosure. In other exemplary embodiments, the system 110 may be configured and provided as a different type of prime mover system, such as a hybrid internal combustion engine-electric prime mover system, a battery-electric prime mover system, a fuel cell prime mover system, or another type of prime mover system.

[0007] The intake air treatment system 112 may include air treatment lines, air filters, compressors (such as a compressor of a turbocharger or supercharger), coolers (such as charge air coolers, intercoolers, and / or aftercoolers, which may be, for example, air-to-air or air-to-liquid), and sensors (such as temperature sensors, pressure sensors, mass flow sensors, and other types of sensors), as well as other components.

[0008] The engine 114 may be provided in a number of forms and typically includes a block containing a plurality of cylinders and a head coupled to the block. The head typically includes intake ports, intake valves configured to selectively open and close the intake ports, exhaust ports, exhaust valves configured to selectively open and close the exhaust ports, injector bores, fuel injectors disposed within the injector bores, spark plug bores, and spark plugs disposed within the spark plug bores. A plurality of pistons may be provided in respective ones of the plurality of cylinders.A crankshaft may be coupled to the plurality of pistons and configured to translate the reciprocating motion of the plurality of pistons to provide torque to drive loads 109, which may include internal loads of system 110 (such as oil pumps, valvetrains, fuel pumps, and other loads of engine 114 and auxiliary loads of system 110). It should be appreciated that system 110 may include a number of other components, as will be apparent to one of ordinary skill in the art given the benefit and insight of the present disclosure.

[0009] The exhaust system 116 may include one or more exhaust treatment lines, turbines (such as a turbine of a turbocharger), aftertreatment components (such as oxidation catalysts, particulate filters, selective catalytic reduction (SCR) catalysts, and / or other catalysts and aftertreatment components), and sensors (such as temperature sensors, pressure sensors, oxygen or lambda sensors, mass flow sensors, and other types of sensors), as well as other components.

[0010] The fuel supply system 158 may be configured and provided as a high-pressure common rail fuel injection system including a plurality of injectors in fluid communication with a common fuel rail that delivers fuel at a relatively high pressure to the plurality of injectors. The common fuel rail may be supplied with fuel by a high-pressure pump, which in turn may be fed by a relatively low-pressure fuel circuit that includes a booster pump and may be submerged in a tank containing a reservoir of fuel.

[0011] The ECS 130 preferably includes one or more programmable solid-state integrated circuit-type microcontrollers and one or more non-volatile storage media configured to store instructions executable by the one or more microcontrollers. For the purposes of this application, the term microcontroller should be understood to include microprocessors and other types of integrated circuit processors. The ECS 130 is in operative communication with sensors or controllers of the intake air treatment system 112, the engine 114, the exhaust system 116, and the fuel delivery system 158, and may be configured and arranged to control the operation of and / or receive inputs from them.The ECS 130 is in operative communication with one or more system sensors 102 of the system 100, which may include, for example, a throttle position sensor or accelerator pedal position sensor, and may be configured and arranged to control the operation of and / or receive inputs from them. It should be appreciated that . Fig. 1 Control relationships between the aforementioned components are conceptually represented using dashed arrows and that various communication hardware and protocols can be used for implementation, such as one or more Controller Area Networks (CAN) or other communication components.

[0012] The ECS 130 may be implemented in any of a number of ways that combine or distribute the control function across one or more control units in various ways. The ECS 130 may execute operational logic that defines various control, management, and / or regulatory functions. This operational logic may be in the form of dedicated hardware, such as a hard-wired state machine, an analog computation engine, programming instructions, and / or other forms as would be apparent to those skilled in the art. The ECS 130 may be provided as a single component or a collection of operatively coupled components; and may consist of digital circuitry, analog circuitry, or a hybrid combination of both of these types.When comprised of a multi-component form, the ECS 130 may include one or more components located remotely relative to each other in a distributed arrangement. The ECS 130 may include multiple processing units arranged to operate independently, in a pipelined processing arrangement, in a parallel processing arrangement, or the like.It should be further appreciated that the ECS 130 and / or any of its constituent components may include one or more signal conditioners, modulators, demodulators, arithmetic logic units (ALUs), central processing units (CPUs), limiters, oscillators, control clocks, amplifiers, signal conditioners, filters, format converters, communication ports, clamps, delay devices, memory devices, analog-to-digital (A / D) converters, digital-to-analog (D / A) converters, and / or other circuitry or components, as would be apparent to one skilled in the art, to perform the desired communications.

[0013] An operating environment 99 is also in Fig. 1. As described above, during typical operation of the system 100, ambient air 91 of the operating environment 99 is received as an input to the system 100, and treated exhaust gases 93 from the system 100 are vented into the operating environment 99. In some embodiments, the loads 109 may comprise, at least in part, a portion of the operating environment 99. For example, in embodiments where the system 100 is provided in the form of a genset or genset-powertrain system, the one or more loads 109 may comprise loads at various nodes in a distributed power network in addition to load components that, even if small, are integral to the system 100.As another example, in embodiments where the system 100 is provided in the form of a vehicle or vehicle powertrain system, the loads 109 may include forces such as wind, gravity, road surface friction, and other environmental load components in addition to load components that, even if small, are integral to the system 100.

[0014] With reference to Fig. 2 illustrates an exemplary implementation of the ECS 130. In the illustrated example, the ECS 130 includes an electronic control unit (ECU) 210. The ECU 210 includes a housing 212 and an interface 217. The housing 212 encloses an interior space 214 containing a plurality of electronic control components. The interface 217 extends across the housing 212 and includes a plurality of interface pins 107 conductively accessible on the exterior surface 94 of the housing 212 and conductively accessible on the interior surface 214 of the housing 212.

[0015] A printed circuit board 215 is housed in the housing 212. The printed circuit board 215 includes FISC (Flexible Input Signal Conditioning) circuitry 220, which includes an input terminal 219 operatively coupled to an interface pin 107a of the interface 217 and operatively coupled to the microcontroller 250. The FISC circuitry 220 is also coupled to an input pin 254 of the microcontroller 250, which is mounted on the printed circuit board 215 and thereby operatively coupled thereto.

[0016] The interface pin 107a may be selectively operatively coupled to a sensor 77 through a connector 119 of a wiring harness 117, and the same are in an operatively coupled state in Fig. 1, appreciating that the wiring harness 117 may also be decoupled from the interface pin 107a. In such an operatively coupled state, the interface pin 107a may receive a sensor signal 97 from the sensor 77, which in turn may be received and conditioned by the FISC circuitry 220 and provided as an input to the microcontroller 205. The input signal 97 may take one of a variety of forms depending on the selection and configuration of the sensor 77. For example, the sensor 77 may be configured to provide the sensor signal 97 in the form of an analog signal or a SENT (Single Edge Nibble Transmission) signal.

[0017] With reference to Fig. 3, the circuit board 215 is illustrated in a first assembly state, wherein a plurality of conductors have been provided on the circuit board 215. In the Fig. 3, the plurality of conductors comprises conductive traces 221-229 that may be formed integrally with the circuit board 215 (for example, using deposition, etching, lamination, machining, masking, photoresist, and / or other formation techniques) and are operatively coupled to the circuit board 215 by such integral formation. In the assembly state illustrated in Fig. 3, the FISC circuitry 220 includes conductive traces 221-229 and may consist essentially of the conductive traces 221-229 in combination with one or more ground planes and / or reference planes of the circuit board 215.

[0018] The conductive traces 221-229 include respective sets of mounting conductors 230-247, which are preferably formed continuously with their respective conductive traces or may be formed separately and conductively coupled to their respective conductive traces. Each of the mounting conductors 230-247 may be configured and provided in a number of forms, for example, as a mounting pad, a through-hole mount, or another type of mounting conductor. In the illustrated example, the mounting conductors 230-246 are configured and provided as mounting pads and are also referred to herein as such. In other embodiments, one or more of the mounting conductors 230-246 may be configured and provided as a through-hole mount or another type of mounting conductor.In the illustrated example, the mounting conductor 247 is configured and provided as a mounting pad in combination with one or more mechanical reinforcement features and is also referred to herein as a terminal mount. In other embodiments, the mounting conductor 247 may be configured and provided as a through-hole mount or another type of mounting conductor.

[0019] A portion 221a of conductive trace 221 extends between and conductively couples mounting pad 230 and mounting pad 231. Mounting pad 230 is configured to interface with connection pad 205, which is configured to interface with microcontroller 250. It should be appreciated that the configuration of printed circuit board mounting conductors, such as mounting pads, and connection pads refers to the arrangement, geometry, positioning, sizing, and other physical characteristics that enable interface and operative coupling of the mounting pad to a circuit component that may be disposed on the connection pad, operatively coupled to the mounting pad, and thereby mounted on the printed circuit board.

[0020] The mounting pad 231 is configured to be associated with the connection area 201, which is configured to be associated with a discrete passive circuit component. It should be appreciated that discrete passive circuit components according to the present disclosure may include circuit elements such as resistors, zero-ohm resistors or jumpers, capacitors, and diodes, for example, the specific discrete passive components described herein in connection with Fig. 4 and Fig. 5 are described.

[0021] Conductive trace 222 includes a first portion 222a that extends between and conductively couples mounting pad 232 and mounting pad 233. Mounting pad 232 is configured to interface with pad 201. Mounting pad 233 is configured to interface with pad 202, which is configured to interface with a discrete passive circuit component.

[0022] The conductive trace 222 includes a second portion 222b that extends between and conductively couples the first portion 222a to the mounting pad 239. The mounting pad 239 is configured to interface with the connection pad 204, which is configured to interface with a discrete passive circuit component.

[0023] The conductive trace 223 includes a first portion 223a that extends between and conductively couples the mounting pad 234 and the mounting pad 235. The mounting pad 234 is configured to be coupled to the connection pad 202. The mounting pad 235 is configured to be coupled to the connection pad 203, which is configured to be coupled to a discrete passive circuit component. The conductive trace 223 includes a second portion 223b that extends between and conductively couples the first portion 223a and the mounting pad 241. The mounting pad 241 is configured to be coupled to the connection pad 205, which is configured to be coupled to a discrete passive circuit component.

[0024] The conductive trace 224 includes a first portion 224a that extends between and conductively couples the mounting pad 236 and the terminal holder 247. The mounting pad 236 is configured to interface with the connection surface 203. The device holder 247 is configured to interface with the connection surface 209, which is configured to interface with the connection holder 247, which is configured to interface with the input terminal 219 of the printed circuit board.

[0025] The conductive trace 224 includes a second portion 224b that extends between and conductively couples the first portion 223a to the mounting pad 243. The mounting pad 243 is configured to interface with the connection pad 206, which is configured to interface with a discrete passive circuit component.

[0026] The conductive trace 224 includes a third portion 224c that extends between and conductively couples the first portion 223a to the mounting pad 245. The mounting pad 245 is configured to interface with the connection pad 207, which is configured to interface with a discrete passive circuit component.

[0027] The conductive trace 224 includes a fourth portion 224d that extends between and conductively couples the first portion 223a and the mounting pad 237. The mounting pad 237 is configured to interface with the connection pad 208, which is configured to interface with a discrete passive circuit component.

[0028] The conductive traces 225, 226, 227, 228 are configured to provide a ground connection of the FISC circuitry 220. A portion 225a of the conductive trace 225 extends between and conductively couples the mounting pad 240 to ground, which may be structured, for example, as a ground plane of the circuit board 215, which may include an analog ground, a digital ground, a chassis or frame ground, and / or other types of ground. The mounting pad 240 is configured to interface with the connection pad 204. A portion 226a of the conductive trace 226 extends between and conductively couples the mounting pad 242 to ground. The mounting pad 242 is configured to interface with the connection pad 205. A portion 227a of the conductive trace 227 extends between the mounting pad 244 and ground and conductively couples them. The mounting pad 244 is configured to interface with the connection area 206.A portion 228a of conductive trace 228 extends between and conductively couples mounting pad 246 to ground. Mounting pad 246 is configured to interface with connection surface 207.

[0029] Conductive trace 229 is configured to provide a reference for FISC circuitry 220. A portion 229a of conductive trace 229 extends between and conductively couples a voltage source V_ref to the mounting pad 238. Mounting pad 238 is configured to be coupled to the connection pad 208.

[0030] In the Fig. 4, the FISC circuitry 220 is configured and operable to receive and condition a SENT signal, for example, from a sensor such as a form of sensor 77 used in conjunction with Fig. 2 is received.

[0031] With reference to Fig. 4, the circuit board 215 is illustrated in a second assembly state, wherein a first set of circuit components have been mounted on the circuit board 215 and operatively coupled thereto. In the Fig. 4, the first set of circuit components includes the microcontroller 250, resistors 261, 262, 263, 268, capacitors 264, 255, 267 and a clamping diode 266. In the configuration shown in Fig. 3, the FISC circuitry 220 includes conductive traces 221-229 and mounting pads 230-246 and may consist essentially of the conductive traces 221-229 and the mounting pads 230-246 and the first set of discrete passive components in combination with one or more ground planes and / or reference planes of the circuit board 215.

[0032] Capacitor 267 is mounted on pad 207 and is conductively coupled to mounting pads 245, 246, thereby conductively coupling on one side to conductive trace 224, terminal support 247, and input terminal 219, and conductively coupling on the other side to conductive trace 228 and ground. Capacitor 267 is configured to provide electrostatic discharge (ESD) protection for FISC circuitry 220. It should be appreciated that the configuration of a capacitor, such as capacitor 267 and the other capacitors disclosed herein, refers to its capacitance value and may also refer to other electrical characteristics, such as voltage or current rating, as well as physical characteristics such as temperature ratings and dimensions, among other characteristics.

[0033] The clamp diode 266 is mounted on the connection surface 206 and is conductively coupled to the mounting pads 243, 244, and thereby conductively coupled on one side to the conductive trace 224, the terminal support 247, and the input terminal 219, and conductively coupled on the other side to the conductive trace 227 and ground. The clamp diode 266 is configured to clamp a voltage at a node of the conductive trace 224 within one or more predetermined limits or within a predetermined range. In some embodiments, the clamp diode 266 may be provided in the form of a packaged component including two Zener diodes configured in an anti-parallel arrangement. In the illustrated embodiment, the clamp diode 266 is configured and provided as a two-terminal device.In another embodiment, clamp diode 266 may be configured and provided as a three-terminal device in which two inputs are conductively coupled to a common node. In such embodiments, one or more additional mounting pads and / or one or more additional conductive traces may be provided, configured to provide such conductive coupling to a common node.

[0034] Resistor 268 is mounted on pad 208 and is conductively coupled to mounting pads 237, 238, thereby conductively coupling on one side to conductive trace 224, terminal support 247, and input terminal 219, and conductively coupling on the other side to conductive trace 229 and reference voltage V_ref. Resistor 268 is configured in a pull-up configuration to provide a standard reference voltage for FISC circuitry 220. It should be appreciated that the configuration of a resistor, such as resistor 268 and the other resistors disclosed herein, refers to its resistance and may also refer to other electrical characteristics, such as voltage or current rating, as well as physical characteristics such as temperature ratings and dimensions, among other characteristics.

[0035] Resistor 263 is mounted on pad 203 and is conductively coupled to mounting pads 236, 235, thereby conductively coupling on one side to conductive trace 224, terminal support 247, and input terminal 219, and conductively coupling on the other side to conductive trace 223. Capacitor 255 is mounted on pad 205 and is conductively coupled to mounting pads 241, 242, thereby conductively coupling on one side to conductive trace 223, and conductively coupling on the other side to conductive trace 226 and ground. Resistor 263 and capacitor 255 comprise a first resistive-capacitive (RC) network 271 and are each configured to provide a first low-pass filtering of an input signal received by FISC circuitry 220 via input terminal 219.

[0036] Resistor 262 is mounted on pad 202 and is conductively coupled to mounting pads 234, 233, thereby conductively coupled on one side to conductive trace 223 and conductively coupled on the other side to conductive trace 222. Capacitor 264 is mounted on pad 204 and is conductively coupled to mounting pads 239, 240, thereby conductively coupled on one side to conductive trace 222 and conductively coupled on the other side to conductive trace 225 and ground. Resistor 262 and capacitor 264 comprise a second resistive-capacitive (RC) network 272 and are each configured to provide second low-pass filtering of an input signal received by FISC circuitry 220 via input terminal 219.

[0037] Resistor 261 is mounted on pad 201 and is conductively coupled to mounting pads 232, 231, thereby conductively coupled on one side to conductive trace 222 and conductively coupled on the other side to conductive trace 221 and mounting pad 230. Resistor 261 is configured to provide input current limiting. Microcontroller 250 is mounted on pad 205 and is conductively coupled to mounting pad 230 and the aforementioned components of FISC circuitry 220.

[0038] With reference to Fig. 5, the circuit board 215 is illustrated in a third assembly state, wherein a second set of circuit components has been assembled on the circuit board 215 and operatively coupled thereto. In the Fig. 5, the first set of circuit components includes the microcontroller 250, resistors 263, 268, zero-ohm resistors or short circuits 371, 372 and capacitors 255, 267 and a clamping diode 266. In the configuration shown in Fig. 5, the FISC circuitry 220 includes conductive traces 221-229 and mounting pads 230-246 and may consist essentially of the conductive traces 221-229 and the mounting pads 230-246 and the second set of discrete passive components in combination with one or more ground planes and / or reference planes of the circuit board 215.

[0039] In the Fig. 5, the FISC circuitry 220 includes the capacitor 267, the resistor 268, the resistor 263 and the capacitor 255, which may be provided in the same form and configuration and which may have the same functionality as in connection with the FISC circuitry 220 shown in Fig. 4. The terminal pads 204, 206 are not populated in the illustrated form. In other embodiments, the terminal pads 204, 206 may be assembled as described in connection with the Fig. 4, and some or all of the portion 224b of the conductive trace 224 and some or all of the portion 222b of the conductive trace 222 may be selectively removed or interrupted to isolate the populated components from the operative portions of the FISC circuitry 220.

[0040] The zero-ohm resistor or short circuit 372 is conductively coupled to the mounting pads 234, 233, and thereby conductively coupled on one side to the conductive trace 223 and conductively coupled on the other side to the conductive trace 222.

[0041] The zero-ohm resistor or short circuit 371 is conductively coupled to the mounting pads 232, 231, and thereby conductively coupled on one side to the conductive trace 222 and conductively coupled on the other side to the conductive trace 221 and the mounting pad 230. The microcontroller 250 is mounted on the connection area 205 and is conductively coupled to the mounting pad 230 and the aforementioned components of the FISC circuitry 220.

[0042] In the Fig. 5, the FISC circuitry 220 is configured and operable to receive and condition an analog signal received, for example, from a sensor such as a form of sensor 77 used in conjunction with Fig. 2. It should be appreciated that the FISC circuitry 220 may be configured to either the assembly state of Fig. 4 or the compilation state of Fig. 5 can be compiled by the selective inclusion and exclusion of certain of the multitude of discrete components.

[0043] With reference to Fig.6 illustrates an exemplary system configuration process 300 (also referred to herein as process 300) that may be performed by or in connection with an electronic control system such as the ECS 130 or another electronic control system, for example, by or in connection with the microcontroller 250 or another microcontroller. The process 300 begins at start operation 302 and proceeds to operation 304, which reads one or more microcontroller calibrations, such as calibration 252 or another microcontroller calibration.

[0044] From operation 304, process 300 proceeds to condition 306, which evaluates whether an analog calibration is set, for example, whether the calibration read at operation 304 is configured to cause the microcontroller to process and operate using an analog input. If condition 306 evaluates positive, process 300 proceeds to operation 308.

[0045] At operation 308, the microcontroller performs a test of the analog input. For example, operation 308 may involve the microcontroller otherwise controlling a system, such as system 100, such that, in the case of a properly functioning system, an analog input is received, and the microcontroller is operated to detect and process such an input. Process 300 proceeds from operation 308 to condition 310.

[0046] Condition 310 evaluates whether the analog input test has passed, for example, whether an analog input has been received by the microcontroller and / or whether an expected analog input value has been received by the microcontroller. If condition 310 evaluates positive, process 300 proceeds to operation 312, which sets an analog input condition to active. Process 300 proceeds from operation 312 to end operation 390 and can then be repeated or called again.

[0047] If condition 310 evaluates to negative, process 300 proceeds to operation 314, which sets an analog input error to true. Process 300 proceeds from operation 312 to end operation 390 and may then be repeated or called again. In some embodiments, process 300 may alternatively optionally proceed from operation 314 to operation 318.

[0048] If condition 306 evaluates negative, process 300 proceeds to condition 316, which evaluates whether a SENT calibration is set, for example, whether the calibration read at operation 304 is configured to cause the microcontroller to process and operate using a SENT input. If condition 316 evaluates negative, process 300 proceeds to operation 326, which sets a calibration error condition to true. Process 300 proceeds from operation 326 to end operation 390 and may then be repeated or called again.

[0049] If condition 316 evaluates to positive, process 300 proceeds to operation 318. At operation 318, the microcontroller performs a check for the SENT input. For example, operation 318 may involve the microcontroller otherwise controlling a system, such as system 100, such that, in the case of a properly functioning system, a SENT input is received, and operating the microcontroller to detect and process such an input. Process 300 proceeds from operation 318 to condition 320.

[0050] Condition 320 evaluates whether the SENT input check has passed, for example, whether a SENT input has been received by the microcontroller and / or whether an expected value of a SENT input has been received by the microcontroller. If condition 320 evaluates positive, process 300 proceeds to operation 322, which sets a SENT input condition to active. Process 300 proceeds from operation 322 to end operation 390 and can then be repeated or called again.

[0051] If condition 320 evaluates to negative, process 300 proceeds to operation 324, which sets a SENT input error to true. Process 300 proceeds from operation 322 to end operation 390 and may then be repeated or called again.

[0052] If condition 306 evaluates negative, process 300 proceeds to condition 316, which evaluates whether a SENT calibration is set, for example, whether the calibration read at operation 304 is configured to cause the microcontroller to process and operate using a received SENT input. If condition 316 evaluates negative, process 300 proceeds to operation 326, which sets a calibration error condition to true. Process 300 proceeds from operation 326 to end operation 390 and may then be repeated or called again.

[0053] As illustrated by this detailed description, the present disclosure contemplates a variety of embodiments, including the following examples. A first exemplary embodiment is an electronic control system comprising: an electronic control unit comprising a housing and an interface extending across the housing and including a plurality of interface pins accessible on an exterior side of the housing and an interior side of the housing; a circuit board disposed within the housing; a plurality of conductive traces operatively coupled to the circuit board and extending between a plurality of discrete component pads; a microcontroller positioned on a microcontroller pad and including an input pin conductively coupled to a first conductive trace of the plurality of conductive traces;an input terminal positioned on an input terminal pad and conductively coupled to a second conductive trace of the plurality of conductive traces and one of the plurality of interface pins;and a FISC (Flexible Input Signal Conditioning) circuit comprising a plurality of discrete components positioned on respective ones of the plurality of discrete component pads and conductively coupled to respective sets of the plurality of conductive traces, the FISC circuit being selectively configurable into a first configuration including a capacitor configured to protect against electrostatic discharge, a voltage clamp, a reference voltage generator, a first low-pass filter, and a second low-pass filter, and a second configuration including the capacitor and the first low-pass filter and excluding the voltage clamp and the second low-pass filter, the first configuration being configured to condition a SENT input signal, and the second configuration being configured to condition an analog input signal;

[0054] A second exemplary embodiment includes the features of the first exemplary embodiment, wherein the plurality of conductive traces and the plurality of discrete component pads comprise: the first conductive trace extending between the microcontroller pad and a first discrete component pad, a third conductive trace extending between the first discrete component pad, a second discrete component pad, and a third discrete component pad, a fourth conductive trace extending between the second discrete component pad, a fourth discrete component pad, and a fifth discrete component pad, and the second conductive trace extending between the fourth discrete component pad, a sixth discrete component pad,a seventh discrete component pad, an eighth discrete component pad, and an input connection pad.

[0055] A third exemplary embodiment includes the features of the second exemplary embodiment, wherein the capacitor is positioned on the seventh discrete component pad and is conductively coupled to the fourth conductive trace and to ground.

[0056] A fourth exemplary embodiment includes the features of the second exemplary embodiment, wherein the voltage clamp comprises a resistor positioned on the sixth discrete component pad and conductively coupled to the fourth conductive trace and to ground.

[0057] A fifth exemplary embodiment includes the features of the second exemplary embodiment, wherein the reference voltage generator comprises a resistor positioned on the eighth discrete component pad and conductively coupled to a voltage source.

[0058] A sixth exemplary embodiment includes the features of the second exemplary embodiment, wherein the first low-pass filter comprises a resistor positioned on the fourth discrete component pad and conductively coupled to the second conductive trace and the fourth conductive trace, and a capacitor positioned on the fifth discrete component pad and conductively coupled to the fourth conductive trace and ground.

[0059] A seventh exemplary embodiment includes the features of the second exemplary embodiment, wherein the second low-pass filter comprises a resistor positioned on the second discrete component pad and conductively coupled to the third conductive trace and the fourth conductive trace, and a capacitor positioned on the third discrete component pad and conductively coupled to the third conductive trace and ground.

[0060] An eighth exemplary embodiment includes the features of the first exemplary embodiment, wherein the microcontroller is selectively configured to process one of an analog input signal and a SENT input signal provided to one of the plurality of interface pins and received at the input pin of the microcontroller.

[0061] A ninth exemplary embodiment is a process for configuring an electronic control unit including a housing and an interface extending across the housing and including a plurality of interface pins accessible on an exterior of the housing and an interior of the housing, the process comprising: populating a printed circuit board including a plurality of conductive traces operatively coupled to the printed circuit board and extending between a plurality of discrete component pads with a microcontroller positioned on a microcontroller pad and including an input pin conductively coupled to a first conductive trace of the plurality of conductive traces and an input terminal,positioned on an input terminal pad and conductively coupled to a second conductive trace of the plurality of conductive traces and one of the plurality of interface pins; selectively populating the circuit board with a FISC (Flexible Input Signal Conditioning) circuit comprising a plurality of discrete components positioned on respective ones of the plurality of discrete component pads and conductively coupled to respective sets of the plurality of conductive traces according to one of the following: a first configuration including a capacitor configured to protect against electrostatic discharge, a voltage clamp, a reference voltage generator, a first low-pass filter, and a second low-pass filter; and a second configuration including the capacitor and the first low-pass filter and excluding the voltage clamp and the second low-pass filter.wherein the first configuration is configured to condition a SENT input signal, and the second configuration is configured to condition an analog input signal; and arranging the circuit board in the housing of the electronic control unit.

[0062] A tenth exemplary embodiment includes the features of the ninth exemplary embodiment, wherein the plurality of conductive traces and the plurality of discrete component pads comprise: the first conductive trace extending between the microcontroller pad and a first discrete component pad, a third conductive trace extending between the first discrete component pad, a second discrete component pad, and a third discrete component pad, a fourth conductive trace extending between the second discrete component pad, a fourth discrete component pad, and a fifth discrete component pad, and the second conductive trace extending between the fourth discrete component pad, a sixth discrete component pad,a seventh discrete component pad, an eighth discrete component pad, and an input connection pad.

[0063] An eleventh exemplary embodiment includes the features of the tenth exemplary embodiment, wherein the capacitor is positioned on the seventh discrete component pad and is conductively coupled to the fourth conductive trace and to ground.

[0064] A twelfth exemplary embodiment includes the features of the tenth exemplary embodiment, wherein the voltage clamp comprises a resistor positioned on the sixth discrete component pad and conductively coupled to the fourth conductive trace and to ground.

[0065] A thirteenth exemplary embodiment includes the features of the tenth exemplary embodiment, wherein the reference voltage generator comprises a resistor positioned on the eighth discrete component pad and conductively coupled to a voltage source.

[0066] A fourteenth exemplary embodiment includes the features of the tenth exemplary embodiment, wherein the first low-pass filter comprises a resistor positioned on the fourth discrete component pad and conductively coupled to the second conductive trace and the fourth conductive trace, and a capacitor positioned on the fifth discrete component pad and conductively coupled to the fourth conductive trace and ground.

[0067] A fifteenth exemplary embodiment includes the features of the tenth exemplary embodiment, wherein the second low-pass filter comprises a resistor positioned on the second discrete component pad and conductively coupled to the third conductive trace and the fourth conductive trace, and a capacitor positioned on the third discrete component pad and conductively coupled to the third conductive trace and ground.

[0068] A sixteenth exemplary embodiment includes the features of the ninth exemplary embodiment, including selectively configuring the microcontroller to process one of an analog input signal and a SENT input signal provided to one of the plurality of interface pins and received at the input pin of the microcontroller.

[0069] A seventeenth exemplary embodiment is a device comprising: a printed circuit board configured to be installed in a housing of an electronic control unit, comprising an interface extending across the housing and including a plurality of interface pins accessible on an exterior side of the housing and an interior side of the housing; a plurality of conductive traces operatively coupled to the printed circuit board and extending between a plurality of discrete component pads; a microcontroller positioned on a microcontroller pad and including an input pin conductively coupled to a first conductive trace of the plurality of conductive traces;an input terminal positioned on an input terminal pad and conductively coupled to a second conductive trace of the plurality of conductive traces and one of the plurality of interface pins;and a FISC (Flexible Input Signal Conditioning) circuit comprising a plurality of discrete components positioned on respective ones of the plurality of discrete component pads and conductively coupled to respective sets of the plurality of conductive traces, the FISC circuit being selectively configurable into a first configuration including a capacitor configured to protect against electrostatic discharge, a voltage clamp, a reference voltage generator, a first low-pass filter, and a second low-pass filter, and a second configuration including the capacitor and the first low-pass filter and excluding the voltage clamp and the second low-pass filter, the first configuration being configured to condition a SENT input signal, and the second configuration being configured to condition an analog input signal;

[0070] An eighteenth exemplary embodiment includes the features of the seventeenth exemplary embodiment, wherein the plurality of conductive traces and the plurality of discrete component pads comprise: the first conductive trace extending between the microcontroller pad and a first discrete component pad, a third conductive trace extending between the first discrete component pad, a second discrete component pad, and a third discrete component pad, a fourth conductive trace extending between the second discrete component pad, a fourth discrete component pad, and a fifth discrete component pad, and the second conductive trace extending between the fourth discrete component pad, a sixth discrete component pad,a seventh discrete component pad, an eighth discrete component pad, and an input connection pad.

[0071] A nineteenth exemplary embodiment includes the features of the eighteenth exemplary embodiment, wherein the capacitor is positioned on the seventh discrete component pad and is conductively coupled to the fourth conductive trace and to ground.

[0072] A twentieth exemplary embodiment includes the features of the eighteenth exemplary embodiment, wherein the voltage clamp comprises a resistor positioned on the sixth discrete component pad and conductively coupled to the fourth conductive trace and to ground.

[0073] A twenty-first exemplary embodiment includes the features of the eighteenth exemplary embodiment, wherein the reference voltage generator comprises a resistor positioned on the eighth discrete component pad and conductively coupled to a voltage source.

[0074] A twenty-second exemplary embodiment includes the features of the eighteenth exemplary embodiment, wherein the first low-pass filter comprises a resistor positioned on the fourth discrete component pad and conductively coupled to the second conductive trace and the fourth conductive trace, and a capacitor positioned on the fifth discrete component pad and conductively coupled to the fourth conductive trace and ground.

[0075] A twenty-third exemplary embodiment includes the features of the eighteenth exemplary embodiment, wherein the second low-pass filter comprises a resistor positioned on the second discrete component pad and conductively coupled to the third conductive trace and the fourth conductive trace, and a capacitor positioned on the third discrete component pad and conductively coupled to the third conductive trace and ground.

[0076] A twenty-fourth exemplary embodiment includes the features of the eighteenth exemplary embodiment, wherein the microcontroller is selectively configured to process one of an analog input signal and a SENT input signal provided to one of the plurality of interface pins and received at the input pin of the microcontroller.

[0077] A twenty-fifth exemplary embodiment includes the features of the seventeenth exemplary embodiment, including the electronic control unit with the circuit board installed in the housing of the electronic control unit.

[0078] It should be appreciated that terms such as "a non-volatile memory", "a non-volatile storage medium", and "a non-volatile storage device" refer to a number of types of devices and storage media that may be configured to store information, such as data or instructions, that is readable or executable by a processor or other components of a computer system, and that such terms include and include a single or unitary device or medium storing such information, multiple devices or media over or between which respective portions of such information are stored, and multiple devices or media over or between which multiple copies of such information are stored.

[0079] It should be appreciated that terms such as "determine", "determined", "determining" and the like, when used in connection with a control method or process, an electronic control system or controller, electronic controllers, or components or operations of the foregoing, refer inclusively to a number of acts, configurations, devices, operations, and techniques including, without limitation, calculating or computing a parameter or value, obtaining a parameter or value from a lookup table or using a lookup operation, receiving parameters or values ​​from a data link or network communication, receiving an electronic signal (e.g.a voltage, SENT, current, or pulse width modulation (PWM) signal) indicative of the parameter or value, receiving an output from a sensor indicative of the parameter or value, receiving other outputs or inputs indicative of the parameter or value, reading the parameter or value from a storage location on a computer-readable medium, receiving the parameter or value as a runtime parameter, and / or by receiving a parameter or value by which the interpreted parameter can be calculated, and / or by referencing a default value that is interpreted as the parameter value.

[0080] Although exemplary embodiments of the disclosure have been illustrated and described in detail in the drawings and in the foregoing description, the same should be considered as illustrative and not restrictive, it being understood that only certain exemplary embodiments have been shown and described, and that all changes and modifications that fall within the spirit of the claimed inventions are intended to be protected. It should be understood that although the use of words such as preferably, preferentially, or additionally preferred employed in the above description indicates that the feature so described may be more desirable, it may nevertheless not be necessary, and embodiments lacking it may be contemplated as being within the scope of the invention, which scope is defined by the following claims.When reading the claims, it is intended that when words such as "a," "an," "at least one," or "at least a part" are used, there is no intention to limit the claim to only one element unless expressly stated otherwise in the claim. When the phrase "at least a part" and / or "a part" is used, the element may include part and / or all of the element, unless expressly stated otherwise.

Claims

[1] Electronic control system comprising: an electronic control unit comprising a housing and an interface extending across the housing and including a plurality of interface pins accessible on an exterior side of the housing and an interior side of the housing; a circuit board arranged in the housing; a plurality of conductive traces operatively coupled to the circuit board and extending between a plurality of discrete component pads; a microcontroller positioned on a microcontroller pad and including an input pin conductively coupled to a first conductive trace of the plurality of conductive traces; an input terminal positioned on an input terminal pad and conductively coupled to a second conductive trace of the plurality of conductive traces and one of the plurality of interface pins; and a FISC (Flexible Input Signal Conditioning) circuit comprising a plurality of discrete components positioned on respective ones of the plurality of discrete component pads and conductively coupled to respective sets of the plurality of conductive traces, the FISC circuit being selectively configurable into a first configuration including a capacitor configured to protect against electrostatic discharge, a voltage clamp, a reference voltage generator, a first low-pass filter, and a second low-pass filter, and a second configuration including the capacitor and the first low-pass filter and excluding the voltage clamp and the second low-pass filter, the first configuration being configured to condition a SENT input signal, and the second configuration being configured to condition an analog input signal. [2] The electronic control system of claim 1, wherein the plurality of conductive traces and the plurality of discrete component pads comprise: the first conductive trace extending between the microcontroller pad and a first discrete component pad, a third conductive trace extending between the first discrete component pad, a second discrete component pad, and a third discrete component pad, a fourth conductive trace extending between the second discrete component pad, a fourth discrete component pad, and a fifth discrete component pad, and the second conductive trace extending between the fourth discrete component pad, a sixth discrete component pad, a seventh discrete component pad, an eighth discrete component pad, and an input terminal pad. [3] The electronic control system of claim 2, wherein the capacitor is positioned on the seventh discrete component pad and is conductively coupled to the fourth conductive trace and to ground. [4] The electronic control system of claim 2, wherein the voltage clamp comprises a resistor positioned on the sixth discrete component pad and conductively coupled to the fourth conductive trace and to ground. [5] The electronic control system of claim 2, wherein the reference voltage generator comprises a resistor positioned on the eighth discrete component pad and conductively coupled to a voltage source. [6] The electronic control system of claim 2, wherein the first low-pass filter comprises a resistor positioned on the fourth discrete component pad and conductively coupled to the second conductive trace and the fourth conductive trace, and a capacitor positioned on the fifth discrete component pad and conductively coupled to the fourth conductive trace and ground. [7] The electronic control system of claim 2, wherein the second low-pass filter comprises a resistor positioned on the second discrete component pad and conductively coupled to the third conductive trace and the fourth conductive trace, and a capacitor positioned on the third discrete component pad and conductively coupled to the third conductive trace and ground. [8] The electronic control system of claim 1, wherein the microcontroller is selectively configured to process one of an analog input signal and a SENT input signal provided to one of the plurality of interface pins and received at the input pin of the microcontroller. [9] A process for configuring an electronic control unit including a housing and an interface extending across the housing and including a plurality of interface pins accessible on an exterior side of the housing and on an interior side of the housing, the process comprising: Populating a printed circuit board including a plurality of conductive traces operatively coupled to the printed circuit board and extending between a plurality of discrete component pads with a microcontroller positioned on a microcontroller pad and including an input pin conductively coupled to a first conductive trace of the plurality of conductive traces, and an input terminal positioned on an input terminal pad and conductively coupled to a second conductive trace of the plurality of conductive traces and one of the plurality of interface pins; selectively populating the circuit board with a FISC (Flexible Input Signal Conditioning) circuit comprising a plurality of discrete components positioned on respective ones of the plurality of discrete component pads and conductively coupled to respective sets of the plurality of conductive traces, according to one of: a first configuration including a capacitor configured to protect against electrostatic discharge, a voltage clamp, a reference voltage generator, a first low-pass filter, and a second low-pass filter, and a second configuration including the capacitor and the first low-pass filter and excluding the voltage clamp and the second low-pass filter, wherein the first configuration is configured to condition a SENT input signal, and the second configuration is configured to condition an analog input signal; and Placing the circuit board in the electronic control unit housing. [10] The process of claim 9, wherein the plurality of conductive traces and the plurality of discrete component pads comprise: the first conductive trace extending between the microcontroller pad and a first discrete component pad, a third conductive trace extending between the first discrete component pad, a second discrete component pad, and a third discrete component pad, a fourth conductive trace extending between the second discrete component pad, a fourth discrete component pad, and a fifth discrete component pad, and the second conductive trace extending between the fourth discrete component pad, a sixth discrete component pad, a seventh discrete component pad, an eighth discrete component pad, and an input terminal pad. [11] The process of claim 10, wherein the capacitor is positioned on the seventh discrete component pad and is conductively coupled to the fourth conductive trace and to ground. [12] The process of claim 10, wherein the voltage clamp comprises a resistor positioned on the sixth discrete component pad and conductively coupled to the fourth conductive trace and to ground. [13] The process of claim 10, wherein the reference voltage generator comprises a resistor positioned on the eighth discrete component pad and conductively coupled to a voltage source. [14] The process of claim 10, wherein the first low-pass filter comprises a resistor positioned on the fourth discrete component pad and conductively coupled to the second conductive trace and the fourth conductive trace, and a capacitor positioned on the fifth discrete component pad and conductively coupled to the fourth conductive trace and ground. [15] The process of claim 10, wherein the second low-pass filter comprises a resistor positioned on the second discrete component pad and conductively coupled to the third conductive trace and the fourth conductive trace, and a capacitor positioned on the third discrete component pad and conductively coupled to the third conductive trace and ground. [16] The process of claim 9, comprising selectively configuring the microcontroller to process one of an analog input signal and a SENT input signal provided to one of the plurality of interface pins and received at the input pin of the microcontroller. [17] Facility comprising: a printed circuit board configured to be installed in a housing of an electronic control unit, comprising an interface extending across the housing and including a plurality of interface pins accessible on an exterior side of the housing and on an interior side of the housing; a plurality of conductive traces operatively coupled to the circuit board and extending between a plurality of discrete component pads; a microcontroller positioned on a microcontroller pad and including an input pin conductively coupled to a first conductive trace of the plurality of conductive traces; an input terminal positioned on an input terminal pad and conductively coupled to a second conductive trace of the plurality of conductive traces and one of the plurality of interface pins; and a FISC (Flexible Input Signal Conditioning) circuit comprising a plurality of discrete components positioned on respective ones of the plurality of discrete component pads and conductively coupled to respective sets of the plurality of conductive traces, the FISC circuit being selectively configurable into a first configuration including a capacitor configured to protect against electrostatic discharge, a voltage clamp, a reference voltage generator, a first low-pass filter, and a second low-pass filter, and a second configuration including the capacitor and the first low-pass filter and excluding the voltage clamp and the second low-pass filter, the first configuration being configured to condition a SENT input signal, and the second configuration being configured to condition an analog input signal. [18] The device of claim 17, wherein the plurality of conductive traces and the plurality of discrete component pads comprise: the first conductive trace extending between the microcontroller pad and a first discrete component pad, a third conductive trace extending between the first discrete component pad, a second discrete component pad, and a third discrete component pad, a fourth conductive trace extending between the second discrete component pad, a fourth discrete component pad, and a fifth discrete component pad, and the second conductive trace extending between the fourth discrete component pad, a sixth discrete component pad, a seventh discrete component pad, an eighth discrete component pad, and an input terminal pad. [19] The device of claim 18, wherein the capacitor is positioned on the seventh discrete component pad and is conductively coupled to the fourth conductive trace and to ground. [20] The device of claim 18, wherein the voltage clamp comprises a resistor positioned on the sixth discrete component pad and conductively coupled to the fourth conductive trace and to ground. [21] The device of claim 18, wherein the reference voltage generator comprises a resistor positioned on the eighth discrete component pad and conductively coupled to a voltage source. [22] The device of claim 18, wherein the first low-pass filter comprises a resistor positioned on the fourth discrete component pad and conductively coupled to the second conductive trace and the fourth conductive trace, and a capacitor positioned on the fifth discrete component pad and conductively coupled to the fourth conductive trace and ground. [23] The device of claim 18, wherein the second low-pass filter comprises a resistor positioned on the second discrete component pad and conductively coupled to the third conductive trace and the fourth conductive trace, and a capacitor positioned on the third discrete component pad and conductively coupled to the third conductive trace and ground. [24] The device of claim 17, wherein the microcontroller is selectively configured to process one of an analog input signal and a SENT input signal provided to one of the plurality of interface pins and received at the input pin of the microcontroller. [25] The device according to claim 17, comprising the electronic control unit with the circuit board installed in the housing of the electronic control unit.

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