Sensor component, sensor and method for manufacturing a sensor

Abstract

Sensor component (P), comprising: a sensor part (20) with a sensor body (21) and a pair of connecting terminals (22) extending away from the sensor body (21); and a mounting part (30) for holding the sensor part (20), wherein the connection terminals (22) are resin-sealed by means of an external part (40) in a state in which each of the connection terminals (22) is connected to a corresponding core (12) of a corresponding conductor (11), wherein melting elements (50), which melt during the forming of the outer part (40), are provided on the outer surface of the support element (30), which is arranged inside the outer part (40), wherein the melt parts (50) comprise a first melt part (50F) and a second melt part (50S), and the first melting part (50F) is arranged in a position in which it separates the sensor body (21) and connecting parts (23) in which the connecting terminals (22) are connected to the wires (12), wherein the first melting part (50F) is arranged such that it completely surrounds the entire periphery of the mounting part (30), and characterized by the fact that the second melt part (50S) is arranged on the outer surface of the holder part (30) in a position in which it separates the adjacent connecting parts (23), wherein the second melt part (50S) is arranged such that it completely surrounds an entire section of the support part (30) which lies between the adjacent connecting parts (23).

Description

TECHNICAL AREA

[0001] The present invention relates to a sensor component, a sensor and a method for manufacturing a sensor. TECHNICAL BACKGROUND

[0002] It is conventionally known that a sensor is formed by resin-sealing a sensor component, which is connected to a terminal end of a cable harness, with an outer part (as disclosed, for example, in JP 2014 - 130 100 A). The sensor component is formed by means of a sensor part held by a mounting part, wherein the sensor part comprises a sensor body and a connecting terminal extending from the sensor body. A conductor is connected to a portion of the connecting terminal that is exposed by the mounting part. The outer part is formed by placing the sensor component, to which the conductor is connected, in a mold and then injecting a synthetic resin into the mold and curing the resin.

[0003] US Patent 2002 / 0181207 A1 discloses a sensor component in which an IC module is held by a mounting part and arranged in a housing. A section of the mounting part, in which a connection terminal is connected to a conductor in an insertion hole of the mounting part, is resin-sealed by means of a housing. An annular melt element, which melts during the molding of the housing, is provided on the outer surface of the mounting part and prevents the ingress of water where a surface of the mounting part connects to a surface of the housing. OVERVIEW OF THE INVENTION TASKS TO BE SOLVED BY THE INVENTION

[0004] In the configuration described above, there is a risk of a gap forming at the boundary between the mounting part and the outer part. If a gap exists between the mounting part and the outer part, there is a risk that moisture reaching the mounting part via the conductor's wire will pass through the gap and reach the sensor body, potentially causing a malfunction in the sensor.

[0005] The present invention was developed in relation to the circumstances described above, and an object of the present invention is to provide a sensor component, a sensor, and a method for manufacturing a sensor, according to which moisture reaching a mounting part via a conductor is prevented from penetrating the sensor body. MEANS OF SOLVING THE TASK

[0006] A sensor component according to the present invention comprises: a sensor part with a sensor body and a pair of connecting terminals extending from the sensor body, and a mounting part for holding the sensor part, wherein the connecting terminals are resin-sealed by means of an outer part in a state in which each of the connecting terminals is connected to a corresponding conductor; and melt components, which melt during the molding of the outer part, are provided on an outer surface of the mounting part, which is arranged inside the outer part. The melt components comprise a first melt component and a second melt component. The first melt component is arranged in a position in which it separates the sensor body and connecting components in which the connecting terminals are connected to the conductors.The first melting element is positioned such that it completely surrounds the entire periphery of the mounting part. The second melting element is positioned on the outer surface of the mounting part in such a way that it separates the adjacent connecting parts. The second melting element is positioned such that it completely surrounds the entire section of the mounting part that lies between the adjacent connecting parts.

[0007] A sensor according to the present invention comprises: the sensor component and an outer part which resin-seals the sensor component, wherein the melted parts are melted and adhered to the outer part.

[0008] A method for manufacturing the sensor according to the present invention is a method for manufacturing the sensor described above, wherein the method comprises: a sensor component manufacturing step of manufacturing the sensor component by holding the sensor component with the mounting component; a conductor connection step of connecting the conductors to the connection terminals of the sensor component; and a resin sealing step of resin sealing the sensor component by the outer part, wherein in the resin sealing step the melted parts are melted and bonded to the outer part. ADVANTAGEOUS EFFECTS OF THE INVENTION

[0009] According to the present invention, the melted parts are arrested at a position between the sensor body and the connecting part of the connection terminal with the outer part, thus preventing moisture that reaches the mounting part via the conductor's core from penetrating into the sensor body.

[0010] The second melting element of the sensor component of the present invention is provided on an outer surface of the mounting part at a position where it separates the adjacent connecting parts. With this design, the second melting element is anchored to the outer part at the position of the outer surface of the mounting part between the adjacent connecting parts. Accordingly, it is possible to prevent moisture reaching the mounting part via the conductor from penetrating the adjacent connecting parts, and to prevent a short circuit between the connecting parts. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a perspective view showing a sensor according to embodiment 1. Fig. Figure 2 is a cross-sectional view showing the positional relationship between the sensor and a rotor that is fixed to a vehicle body. Fig. Figure 3 is a schematic view showing the positional relationship between the rotor and the sensor. Fig. Figure 4 is a perspective view showing a sensor component connected to conductors. Fig. Figure 5 is a top view showing the sensor component. Fig. Figure 6 is a side view showing the sensor component. Fig. Figure 7 is a bottom view showing the sensor component. Fig. Figure 8 is a front view showing the sensor component. Fig. Figure 9 is a rear view showing the sensor component. Fig. Figure 10 is a side cross-sectional view showing a state in which the sensor component is resin-sealed by means of an outer part. Fig. Figure 11 is a top-view cross-sectional view showing a state in which the sensor component is resin-sealed by means of the outer part. Fig. Figure 12 is a cross-sectional view showing a state in which a melt part is being melted, and a view corresponding to a cross-section along a line AA in Fig. 11. Fig. Figure 13 is a cross-sectional view of the sensor showing a state in which the molten part is being melted, and a view corresponding to a cross-section along a line BB in Fig. 11. Fig. Figure 14 shows a process of encasing a sensor part according to embodiment 2. Fig. Figure 15 is a cross-sectional view showing the sensor component in a state where a sheathing layer is formed on it, and a view corresponding to a cross-section along a line CC in Fig. 14. Fig. Figure 16 is a cross-sectional view showing the sensor component in a state where the cladding layer is formed on it, and a view corresponding to a cross-section along a line DD in Fig. 14. Fig. Figure 17 is a cross-sectional view of the sensor showing a state in which the conductor is connected to the connection terminal, and a view corresponding to a cross-section along line AA in Fig. 11. Fig. Figure 18 is a top view showing a sensor component of another embodiment (1). Fig. Figure 19 is a side view showing the sensor component. Fig. Figure 20 is a bottom view showing the sensor component. DESCRIPTION OF THE EXECUTION FORMS

[0011] Preferred embodiments of the present invention are described below.

[0012] The melt components of the sensor component of the present invention can also be ribs projecting from the outer surface of the mounting part, the projecting end of the ribs being tapered to a point. With this design, the guiding end of the melt components simply melts during the forming of the outer part, and the melt components can be reliably bonded to the outer part.

[0013] The connection terminals of the sensor component of the present invention can also be encased using a moisture-repellent coating. With this configuration, even if moisture reaches the connection terminal, the terminals are not directly exposed to moisture, thus preventing a short circuit between them. EXECUTION FORM 1

[0014] The following describes embodiment 1, in which the present invention is carried out, with regard to Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9, Fig. 10, Fig. 11, Fig. 12 to Fig. 13 described in detail.

[0015] A sensor according to this embodiment is a vehicle sensor that can be attached to a vehicle, in particular a wheel speed sensor S, which is used to measure the speed of a wheel. As in Fig. As shown in Figure 2, the wheel speed sensor S is fixed to a fixed part B of the vehicle, which faces a rotor R that rotates together with the vehicle's wheel. The wheel speed sensor S has a cable harness 10 that is connected to a control unit or the like mounted in the vehicle. The vehicle's control unit can calculate the vehicle's wheel speed in accordance with output signals from the wheel speed sensor S and can use the calculated wheel speed to control the ABS (anti-lock braking system) or the like.

[0016] As in Fig. As shown in Figure 1, the cable bundle 10 is formed by sheathing two conductors 11 together with a resin sheath or the like to form a single conductor. Each conductor 11 is formed by means of a core 12 which is sheathed by an insulating sheath 13, the insulating sheath 13 being removed at the connection section, and the exposed core 12 being electrically connected to a connection terminal 22 of a sensor part 20.

[0017] The wheel speed sensor S is formed by resin sealing a sensor component P, which is connected to the cable harness 10, with an outer part 40. As in Fig. As shown in Figure 6, the sensor component P comprises a sensor part 20 with a sensor body 21 and connecting terminals 22 extending from the sensor body 21, and a mounting part 30 for holding the sensor part 20. The sensor component P is an overmolded or molded product, which is obtained by insert molding (primary molding) from the mounting part 30 with the sensor part 20, which serves as the insert. The wheel speed sensor S is an overmolded or molded product, which is obtained by insert molding (secondary molding) from the outer part 40 with the sensor component P, to which the cable harness 10 is connected, which serves as the insert.

[0018] In the description of the components, "rear" will subsequently be used to indicate a direction (left inwards). Fig. 2) denotes the area in which the cable harness extends from the outer part 40, with "front" being the opposite side (right in Fig. 2) the rear, with "top" referring to the upper side in Fig. 2 is designated and "bottom" refers to the lower side in Fig. 2 is designated.

[0019] The sensor part 20 comprises the sensor body 21, which includes a sensing element (not shown) that converts a physical quantity to be sensed into an electrical quantity or the like, and the connecting terminals 22 extending from the sensor body 21.

[0020] The sensor body 21 is formed by sealing a detection circuit, which includes a detection element, with a molded resin material, so that it is impermeable to liquids and has a plate shape as a whole.

[0021] As in Fig. As shown in Figure 6, the sensor body 21 is embedded in the front end section of the mounting part 30 with the direction of the plate thickness as its up-down direction, and the upper surface of the sensor body 21 is free from the upper surface of the mounting part 30. In a state in which the wheel speed sensor S is fixed to the vehicle, the upper surface of the sensor body 21 is arranged such that it faces the outer periphery of the rotor R (see Figure 6). Fig. 2) is directed towards. It should be noted that the sensor part 20 of this embodiment is designed as a Hall IC which houses a signal conversion circuit, and wherein a Hall element serves as a magneto-electrical conversion element which converts changes in a magnetic field into electrical signals and outputs the electrical signals from the connection terminals 22.

[0022] As in Fig. 5 and Fig. As shown in Figure 6, the connection terminals 22 have an elongated, rectangular plate shape and extend in one direction from the sensor body 21. A coating, such as tin, is applied to the outer surface of the connection terminals 22. The sensor part 20 has a pair of connection terminals 22, wherein the pair of connection terminals 22 extends substantially parallel to the sensor body 21 and is bent obliquely downwards.

[0023] A capacitor 24 is connected to one side (top surface) of the pair of connection terminals 22. The extending end sections (rear end sections) of the connection terminals 22 are connection parts 23 to which conductors 12 of the conductor 11 are connected. As in Fig. As shown in Figure 12, the wires 12 of the conductor 11 are electrically connected to the upper sides of the connection terminals 22 by means of solder material 27.

[0024] As in Fig. As shown in Figure 4, the front end sections (sections near the rear section of the sensor body 21) and the connecting parts 23 of the connection terminals 22 are exposed on the upper surface of the mounting part 30. The exposed sections of the front end sections of the connection terminals 22 are located on the bottom of a recess 31, which is formed slightly below the upper surface of the sensor body 21.

[0025] A moisture-repellent agent (not shown) is applied to the connection terminals 22. The moisture-repellent agent is applied to the exposed sections at the front end sections of the connection terminals 22. The moisture-repellent agent is applied to the recess 31 to encase the exposed sections of the connection terminals 22. Accordingly, even if moisture penetrates near the sensor body 21, a short circuit of the connection terminals 22 is prevented.

[0026] The connecting parts 23 of the connecting terminals 22 are placed on the upper surface of the placement section 33, which is formed in the rear section of the mounting part 30 described later.

[0027] For example, the mounting part 30 is made of synthetic resin, such as nylon resin, and is formed in one piece with the sensor part 20. The mounting part 30 as a whole is elongated in the front-to-back direction.

[0028] The mounting part 30 includes the placement part 33, which holds the connecting parts 23 of the connecting terminals 22 on its upper side. The placement part 33 has a plate-like shape, which is formed along the lower surface of the mounting part 30. As shown in Fig. As shown in Figure 6, the upper surface of the placement part 33 slopes gradually downwards towards the rear end, with the rear section of the lower surface of the placement part 33 having a stepped portion that is slightly below the front section. The width of the placement part 33 is less than that of the front section of the mounting part 30, and the connecting part 23 projects partially in the width direction towards two opposite sides.

[0029] The mounting part 30 has a first partition 34 that separates the sensor body 21 and the connecting parts 23. The first partition 34 is positioned in front of the placement part 33, and its surface is essentially vertical. The first partition 34 extends across the entire width of the mounting part 30. The capacitor 24 is embedded in the first partition 34.

[0030] The mounting part 30 has a second partition 35 that separates the adjacent connecting parts 23. The second partition 35 is positioned between the adjacent connecting parts 23, and its surface forms substantially a right angle. The second partition 35 is perpendicular to the upper surface of the placement part 33 and divides the placement part 33 in the width direction, extending from the first partition 34 to the rear end of the mounting part 30. In a plan view, the second partition 35 is located in the center in the width direction of the placement part 33 and is substantially perpendicular to the first partition 34. The thickness (dimension in the width direction of the mounting part 30) of the second partition 35 is less than that of the first partition 34.

[0031] As in Fig. As shown in Figure 6, the upper surface of the second partition 35 slopes gradually downwards towards the rear end. The degree of slope of the upper surface of the second partition 35 is similar to the degree of slope of the upper surface of the placement part 33, and the height of the second partition 35 is essentially constant in the front-to-rear direction.

[0032] The mounting part 30 has a pair of side walls 36, which are perpendicular to the two sides in the direction of the width of the placement part 33. The pair of side walls 36 are provided on the front end section of the placement part 33 and are continuous with the rear side of the first partition 34. The pair of side walls 36 is slightly deeper than the first partition 34.

[0033] Melt elements 50 are provided on the outer surface of the mounting part 30. The melt elements 50 will be described in detail later.

[0034] The outer part 40 is made of the same type of synthetic resin as the mounting part 30, which ensures a good connection between the outer part 40 and the mounting part 30. As shown in Fig. As shown in Figure 1, the outer part 40 as a whole has an elongated rod shape in the direction in which the cable harness 10 extends and encloses the entire part from the connection section of the cable harness 10 to the front end of the sensor component P.

[0035] The front section of the outer part 40 (hereinafter referred to as "outer front section 41") has a cuboid shape, and the rear section (hereinafter referred to as "outer rear section 42") has a circular cylindrical shape. The majority of the mounting part 30 is embedded in the outer front section 41. The placement part 33 of the mounting part 30 and the connection section of the cable harness 10 are embedded in the outer rear section 42. The outer rear section 42 is further secured to the vehicle by being inserted into an insertion hole 44 of a mounting bracket 43.

[0036] The bracket 43 is essentially an oval plate with an insertion hole 44, which is formed in one end section in the longitudinal direction, and with a fixing hole 45, which is formed in the other end section, for fixing the bracket 43 to the vehicle. Both the insertion hole 44 and the fixing hole 45 are essentially circular and penetrate the bracket 43 in the front-to-back direction (direction of the plate thickness). At the insertion hole 44, the bracket 43 forms a single part with the outer rear section 42, which is inserted into the insertion hole 44. The wheel speed sensor S is attached to a suitable position on the vehicle by means of the fixing hole 45 of the bracket 43 using a method such as screws.

[0037] The outer surface of the mounting part 30 is provided with the fused parts 50, which are fused during the forming of the outer part 40 and bonded to it. The fused parts 50 are one or more ribs projecting from the outer surface of the mounting part 30 and have a triangular cross-section that tapers to a point at the projecting end.

[0038] As in Fig. As shown in Figure 5, the melt parts 50 have first melt parts 50F, which separate the connecting parts 23 from the sensor body 21, and second melt parts 50S, which separate the adjacent connecting parts 23.

[0039] The first melt components 50F are arranged at a position along the front-to-back direction of the mounting part 30 and extend in a direction that is substantially orthogonal to the front-to-back direction. The first melt components 50F as a whole are arranged such that they continuously surround the entire periphery of the mounting part 30. Several (in this embodiment, two) of the first melt components 50F are provided on the moisture penetration path in the front-to-back direction.

[0040] Each of the first melt parts 50F has first upper melt part sections 51 provided on the upper surface of the holder part 30, first lateral melt part sections 52 provided on the left and right side surfaces of the holder part 30, and first lower melt part sections 53 provided on the lower surface of the holder part 30. A pair of the first upper melt part sections 51, a pair of the first lateral melt part sections 52, and a pair of the first lower melt part sections 53 are each formed substantially parallel to each other in the front-to-back direction.

[0041] As in Fig. As shown in Figure 5, the first upper melt sections 51 are arranged on the upper surface of the first partition 34. The first upper melt section 51 on the rear side, formed from the front-back pair of the first upper melt sections 51, is continuous with the second upper melt sections 55 described later.

[0042] As in Fig. As shown in Figure 6, each of the first lateral melting section sections 52 extends substantially vertically downwards onto the side surface of the support part 30 from the two ends in the direction of the width of the first upper melting section sections 51 to the lower surface of the support part 30.

[0043] As in Fig. As shown in Figure 7, the first lower melt sections 53 extend along the lower surface of the mounting part 30 and are formed continuously with the lower ends of the first lateral melt sections 52. The middle sections of the first lower melt sections 53 are shifted slightly to the right such that they surround the part in which the capacitor 24 is embedded. The first lower melt section 53 on the rear side from the front-back pair of the first lower melt sections 53 is formed continuously with a second lower melt section 57, which will be described later.

[0044] The second melt elements 50S are arranged on the rear section of the mounting part 30 and extend in the front-to-back direction. The second melt elements 50S are arranged such that they completely surround the entire section located between the adjacent connecting parts 23. Several (in this embodiment, two) of the second melt elements 50S are arranged along the moisture penetration path in the left-to-right direction (the direction of the width of the mounting part 30).

[0045] Each of the second melt parts 50S has second upper melt part sections 55 arranged on the upper surface of the support part 30, second rear melt part sections 56 arranged on the rear surface, and second lower melt part sections 57 arranged on the lower surface. A pair of the second upper melt part sections 55, a pair of the second rear melt part sections 56, and a pair of the second lower melt part sections 57 are each configured such that they are substantially parallel to each other in the left-right direction.

[0046] As in Fig. As shown in Figure 5, the second upper melting sections 55 are provided on the upper surface of the second partition 35. The second upper melting sections 55 extend in a front-to-back direction along the left and right edges of the second partition 35.

[0047] The front end of each of the second upper melt section sections 55 is formed continuously with the first upper melt section 51. The second upper melt section 55 and the first upper melt section 51 are substantially orthogonal to each other, and the second upper melt section 51 is interrupted at a section where the first upper melt section 51 is formed continuously with the second upper melt section 55 (a section located between the left-right pair of the second upper melt sections 55).

[0048] As in Fig. As shown in Figure 6, the second rear melting section 56 extends substantially vertically downwards onto the rear surface of the mounting part 30 from the rear end of the second upper melting section 55 to the lower surface of the mounting part 30. As shown in Fig. As shown in Figure 9, the second rear melting section sections 56 are formed along the edges on the left and right sides of the rear surface of the second partition 35.

[0049] As in Fig. As shown in Figure 7, the second underside melt section sections 57 extend forward onto the lower surface of the mounting part 30 and are continuous with the lower end of the second rearside melt section sections 56. The majority of the second underside melt section sections 57 is slightly offset outwards with respect to the rear end section.

[0050] The front end of each of the second underside melting sections 57 is formed continuously with the first underside melting section 53. The second underside melting section 57 and the first underside melting section 53 are formed substantially orthogonally to each other, and the first underside melting section 53 is interrupted at a section where the first underside melting section 53 is formed continuously with the second underside melting section 57 (a section that lies between the left-right pair of the second underside melting sections 57).

[0051] Next, an example of a method for manufacturing the wheel speed sensor S according to this embodiment is described. The method for manufacturing the wheel speed sensor S comprises: a sensor component manufacturing step of manufacturing a sensor component P by holding the sensor part 20 with the mounting part 30; a conductor connection step of connecting the conductors 11 to the connection terminals 22 of the sensor component P; and a resin sealing step of resin sealing the sensor component P by an outer part 40.

[0052] First, the sensor component manufacturing step is performed. In this step, the sensor component 20 is positioned and held in a mold for primary forming. A synthetic resin is then injected into the mold, which cures to form the mounting part 30. Thus, a sensor component P, in which the sensor component 20 is embedded within the mounting part 30, is produced in one piece.

[0053] Next, the conductor connection step is performed. In this step, the wires 12 of the conductors 11 of a cable harness 10 are connected to the connection terminals 22 of the sensor component P using a method such as soldering.

[0054] Next, the resin sealing step is performed. In this step, the sensor component P, the connector of the cable harness 10, and the bracket 43 are positioned and held in a mold for secondary forming in a state where the connector of the cable harness 10 is inserted into an insertion hole 44 of the bracket 43. A synthetic resin is then injected into the mold, which cures, thus forming the outer part 40. The formed outer rear section 42 is bonded in place with the peripheral surface of the insertion hole 44 of the bracket 43. This forms the bracket 43 and the outer part 40 together as a single piece.

[0055] Likewise, in the resin sealing step, the melt parts 50 are formed and bonded to the outer part 40. As shown in the enlarged view in Fig. As shown in Figure 12, the leading end section of the melt parts is formed and attached to the outer part. By forming and attaching the first melt part 50F to the outer part 40, a moisture penetration path extending from the connecting parts 23 to the sensor body 21 is completely blocked by the contact area between the mounting part 30 and the outer part 40. By forming and attaching the second melt part 50S to the outer part 40, a moisture penetration path extending between the adjacent connecting parts 23 is completely blocked by the contact area between the mounting part 30 and the outer part 40.

[0056] The following section describes in more detail the effect and impact of this embodiment with the configuration described above.

[0057] The wheel speed sensor S according to this embodiment is provided with a sensor component P comprising: the sensor part 20 with the sensor body 21 and the connecting terminals 22 extending from the sensor body 21, and the mounting part 30 for holding the sensor part 20. The sensor component P is formed by resin sealing the connecting terminals 22 through the outer part 40, in which these are connected to the conductors 12 of the conductors 11, wherein the first melt part 50F of the melt parts 50, which melts during the forming of the outer part 40, is provided at a position on the outer surface of the mounting part 30, which separates the connecting part 23 and the sensor body 21.

[0058] With this design, the first melting part 50F is attached to the outer part 40 at a position between the connecting parts 23 of the connecting terminals 22 and the sensor body 21, thus preventing moisture that reaches the mounting part 30 through the conductor 12 of the conductor 11 from penetrating into the sensor body 21.

[0059] The second melting element 50S of the melting elements 50 is also arranged at the position that separates the adjacent connecting elements 23 of the outer surface of the mounting element 30. Because, in this embodiment, the second melting element 50S is connected to the outer part at the position between the adjacent connecting elements 23 of the outer surface of the mounting element 30, moisture reaching the mounting element 30 via the conductors 12 of the wires 11 can be prevented from penetrating the connecting elements 23, thus preventing a short circuit between the connecting elements 23.

[0060] Furthermore, the melt elements 50 each form a rib projecting from the outer surface of the mounting part 30, with the projecting end of the rib tapering to a point. This design facilitates the melting of the leading end of the melt elements 50 during the forming of the outer part 40, thus enabling the melt elements 50 to be reliably bonded to the outer part 40. EXECUTION FORM 2

[0061] The sensor S according to embodiment 2, in which the present invention is implemented, is described below with regard to Fig. 14, Fig. 15, Fig. 16 to Fig. 17 described.

[0062] The sensor S according to this embodiment differs from embodiment 1 in that the moisture-repellent agent is applied to the connection terminals 22 before the sensor part 20 is held with the mounting part 30. It should be noted that the structures are the same as in embodiment 1 and that they are given the same reference numerals, and redundant descriptions are omitted.

[0063] Similar to embodiment 1, the sensor S according to this embodiment is provided with a sensor component P, which comprises: a sensor part 20 with a sensor body 21 and connecting terminals 22 extending from the sensor body 21; a mounting part 30 for holding the sensor part 20; and an outer part 40, which resin-seals the sensor component P. Similar to embodiment 1, the sensor S is provided with melt elements 50, which melt during the molding of the outer part 40 and which are provided on the outer surface of the mounting part 30.

[0064] Similar to embodiment 1, a pair of connecting terminals 22 is mounted on a capacitor 24. As in Fig. As shown in Figure 16, the capacitor 24 is connected to a pair of terminals 22 by means of a conductive paste 25, such as a silver paste. The capacitor 24 is sealed with a protective material 26, such as epoxy resin.

[0065] Similar to embodiment 1, a moisture-repellent agent is applied to the connection terminals 22. The moisture-repellent agent forms a sheathing layer C, which encases the connection terminals 22. The sheathing layer C encases at least the side of the sensor body 21 of the connection terminals 22.

[0066] The sheathing layer C is bonded to the outer surface of the connection terminals 22 without a gap, forming a transparent coating. As shown in Fig. 15 and Fig. As shown in Figure 16, the sheathing layer C encases the entire upper, lower, right and left side surfaces of the connection terminals 22, as well as the entire upper and lower surfaces, and the front, rear, left and right side surfaces of the capacitor 24 and the sensor body 21. In other words, the sheathing layer C uniformly encases the entire sensor part 20.

[0067] Next, an example of a method for manufacturing the wheel speed sensor S according to this embodiment is described. Similar to embodiment 1, the method for manufacturing the wheel speed sensor S comprises: a sensor component manufacturing step of manufacturing the sensor component P by holding the sensor part 20 with the mounting part 30; a conductor connection step of connecting the conductor 11 to the connection terminals 22 of the sensor component P; and a resin sealing step of resin sealing the sensor component P by means of the outer part 40. The sensor component manufacturing step further comprises: a sheathing step of forming a sheathing layer C on the sensor part 20; and a holding step of holding the sensor part 20 with the mounting part 30.

[0068] In the sensor component manufacturing step, the first step is the encapsulation step, which involves forming the encapsulation layer C on the sensor part 20. This encapsulation step includes a preparation step to ensure that the multiple sensor parts 20 can be treated as a single piece. In this preparation step, as described in Fig. As shown in Figure 14, a large number of sensor parts 20 are arranged and fixed on a strip element 28. The sensor parts 20 are arranged in the direction in which the connecting terminals 22 extend orthogonally to the strip element 28 and are positioned at predetermined intervals along the extended direction of the strip element 28. The sensor parts 20 are fixed to the side edge section of the strip element 28 using, for example, adhesive tape or the like. The end sections of the connecting part 23 on the side of the connecting terminals 22 of the sensor parts 20 are fixed to the strip element 28, and essentially the entire sensor parts 20 protrude from the strip element 28. It should be noted that several perforated sections 29 are arranged in a row along the longitudinal direction of the strip element 28.

[0069] After the preparation step, the coating layer C is formed (applied) to the sensor part 20 by immersing the entire sensor part 20 in a coating solution. With the sensor parts 20 hanging downwards from the belt element 28, the section up to the side edge of the belt element 28 is immersed (e.g., soaked) in the coating solution. In this way, the coating material can be applied to a large number of sensor parts 20 simultaneously. Subsequently, a drying step is carried out by heating and drying the sensor parts 20 to which the coating material has been applied. This forms the coating layer C.

[0070] Next, a separation step is performed in which the sensor part 20 is separated from the strip element 28. In this separation step, the end sections of the connecting terminals 22 are separated at a position along the side edges of the strip element 28. At this point, by separating the large number of connecting terminals 22 from the strip element 28 simultaneously, the sensor parts 20 can be separated from the strip element 28 at the same time.

[0071] Next, the holding step of the sensor part 20 with the mounting part 30 is performed. The sensor part 20, on which the coating layer C is formed, is positioned and held in the mold for primary forming during this holding step. Subsequently, a synthetic resin is injected into the mold, which cures and thereby forms the mounting part 30. Accordingly, a sensor component P, in which the sensor part 20 is embedded in the mounting part 30, is produced in one piece.

[0072] Next, similar to embodiment 1, the conductor connection step is carried out. In the conductor connection step, the conductors 12 of the conductors 11 of the cable harness 10 are connected to the connection terminals 22 of the sensor component P using solder material 27. The sheathing layer C is melted by the heat of the solder material 27 such that each of the conductors 12 and the connection terminals 22 are brought into direct contact and connected to each other without the sheathing layer C being positioned between them (see Fig. 17). Similar to embodiment 1, the resin sealing step is then carried out. In the resin sealing step, similar to embodiment 1, the melt parts 50 are melted and bonded to the outer part 40.

[0073] It should be noted that by performing the sheathing step before the holding step, it is possible to prevent the sheathing layer C from forming on the outer surface of the holder part 30, and a deterioration of the adhesion between the holder part 30 and the outer part 40 can be prevented. Additionally, it can be prevented that a positioning recess (not shown), which is provided in the holder part 30 for positioning the sensor component P in the mold for secondary forming, is filled with the sheathing layer C.

[0074] Similar to embodiment 1, in the embodiment described above, the melting element 50 is provided on the outer surface of the mounting part 30. Accordingly, it can be prevented that moisture reaching the mounting part 30 via the conductors 12 of the conductors 11 penetrates towards the sensor body 21.

[0075] Furthermore, according to this embodiment, the sensor component P is provided with a water-repellent coating layer C, which is designed to encase the side of the sensor body 21 of the connection terminal 22. Even if moisture reaches the connection terminals 22, the moisture does not come into direct contact with the part enclosed by the coating layer C in the connection terminals 22. In other words, the moisture does not penetrate to the side of the sensor body 21 of the connection terminals 22, and thus no moisture reaches the section where ion migration can occur. If, in this embodiment, the conductive paste 25 connected to the capacitor 24 is a silver paste, then ion migration is expected to occur in a section where the connection terminals 22 are connected to the capacitor 24.Additionally, in the section of the connection terminals 22 located in the recess 31, the upper surfaces of the adjacent connection terminals 22 are exposed without enclosing the mounting part 30, and the upper surfaces of the connection terminals 22 and the upper surface of the mounting part 30 are flush with each other. Ion migration is expected to occur more frequently in this section than in a section where the entire portion of the connection terminals 22, including the upper surfaces, is separately enclosed by the mounting part 30. The sensor component P according to this embodiment can prevent ion migration because moisture does not adhere to the sections of the connection terminals 22, such as a section located in the recess 31 or a section where the connection terminals 22 are connected to the capacitor 24.Accordingly, a short circuit between the connection terminals 22 can be prevented.

[0076] Furthermore, in the encapsulation step of forming the encapsulation layer C on the connection terminals 22, the encapsulation layer C is formed by immersing the entire sensor part 20 in the encapsulation solution. According to this method, the encapsulation layer C can be formed in a simple manner, thus improving the feasibility of the encapsulation step. OTHER VERSIONS

[0077] The present invention is not limited to the embodiments described above with reference to the figures, and the following embodiments, for example, are also included within the technical scope of the present invention. (1) In the embodiment described above, the position at which the melt parts 50 are formed has been shown precisely. However, the position at which the melt parts are formed may differ from the embodiments described above. For example, in particular, as shown in the Fig. 18, Fig. 19 to Fig. 20 shows that the melt part 50 is shaped such that the first upper melt part section 51 extends along the rear end edge of the first partition 34, or the second lower melt part section 57 extends along the left and right end edges of the placement part 33. (2) In the embodiments described above, the sensor component P is formed by means of an insert mold of the holder part 30 with the sensor part 20, which serves as an insert. However, there is no restriction in this respect, and the sensor component can also be formed by attaching the sensor part to a holder part, which is manufactured separately, to form a single piece. (3) In the embodiments described above, the holder 43 and the outer part 40 are formed in one piece during the resin sealing step. However, there is no restriction in this respect, and thus the outer part can, for example, be formed as one part with the holder by inserting the formed outer part into the insertion hole of the holder after the resin sealing step, or both the outer part and the holder can be formed in the resin sealing step. (4) In the embodiments described above, the moisture-repellent agent is applied to the connection terminals 22. However, the application of the moisture-repellent agent is not necessary. (5) In the embodiments described above, a case was described in which the sensor is a wheel speed sensor S. However, there is no such limitation, and the present invention can be applied to various types of sensors. (6) In the embodiments described above, the melt parts 50 are formed in duplicate, although the melt parts do not necessarily have to be formed in duplicate and can also be formed in single or triple form. (7) In embodiment 2 described above, the coating layer C is formed over the entire sensor part 20, and there is no limitation in this respect to this embodiment. The coating layer can be formed at least only on the section of the sensor part where ion migration is expected. (8) In embodiment 2 described above, the recess 31 and the connecting part to which the connection terminal 22 and the capacitor 24 are connected were given as examples of sections in which ion migration is likely to occur. However, there is no limitation in this respect, and if the section in which ion migration may occur differs from the embodiment described above due to a different configuration of the sensor part, the section on which the coating layer is formed may also differ from the embodiment described above. (9) In embodiment 2 described above, the application of the coating material to the sensor part 20 by immersion has been shown, although there is no restriction in this respect, and the method for applying the coating material to the sensor part 20 can also be carried out using any other known method, such as spray coating or brush coating. REFERENCE MARK LIST C Coating layer (moisture-repellent agent) P Sensor component S Wheel speed sensor (sensor) 11 leaders 12 wires 20 Sensor part 21 Sensor bodies 22 Connection port 23 Connecting part 30 Mounting part 40 Outdoor part 50 Melting part

Claims

[1] Sensor component (P), comprising: a sensor part (20) with a sensor body (21) and a pair of connecting terminals (22) extending away from the sensor body (21); and a mounting part (30) for holding the sensor part (20), wherein the connection terminals (22) are resin-sealed by means of an external part (40) in a state in which each of the connection terminals (22) is connected to a corresponding core (12) of a corresponding conductor (11), wherein melting elements (50), which melt during the forming of the outer part (40), are provided on the outer surface of the support element (30), which is arranged inside the outer part (40), wherein the melt parts (50) comprise a first melt part (50F) and a second melt part (50S), and the first melting part (50F) is arranged in a position in which it separates the sensor body (21) and connecting parts (23) in which the connecting terminals (22) are connected to the wires (12), wherein the first melting part (50F) is arranged such that it completely surrounds the entire periphery of the mounting part (30), and characterized by . that the second melt part (50S) is arranged on the outer surface of the holder part (30) in a position in which it separates the adjacent connecting parts (23), wherein the second melt part (50S) is arranged such that it completely surrounds an entire section of the support part (30) which lies between the adjacent connecting parts (23). [2] Sensor component according to claim 1, wherein the melt parts (50) are ribs projecting from the outer surface of the mounting part (30), and wherein the projecting end of the ribs is tapered. [3] Sensor component according to one of claims 1 to 2, wherein a moisture-repellent agent (C) is applied to the connection terminals (22). [4] Sensor (S), comprising: the sensor component (P) according to one of claims 1 to 3; and the outer part (40), which resin-seals the sensor component (P), wherein the melted parts (50) are melted and attached to the outer part (40). [5] Method for manufacturing the sensor (S) according to claim 4, wherein the method comprises: a sensor component manufacturing step of manufacturing the sensor component (P) by holding the sensor part (20) with the holder part (30); a conductor connection step of connecting the conductors (11) to the connection terminals (22) of the sensor component (P); and a resin sealing step of resin sealing of the sensor component (P) by the outer part (40), wherein In the resin sealing step, the melt parts (50) are melted and bonded to the outer part (40).

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