Wafer processing condition setting plate

JP1830126SActive Publication Date: 2026-06-25SCREEN HOLDINGS CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
SCREEN HOLDINGS CO LTD
Filing Date
2025-12-18
Publication Date
2026-06-25

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Abstract

This article is attached to the wafer holding section of the chamber in a wafer cleaning apparatus and is used to set the processing conditions of chemicals and other substances when liquid-treating wafers.
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