Adhesive formulation for producing pressed material bodies

Abstract

The present invention relates to a chemically curable, aqueous, two-component adhesive formulation for forming press material bodies, in particular press material plates. Component A of the adhesive formulation comprises an aqueous phase of 20 to 100% by weight of a reactive resin functionalized with epoxy groups or a mixture of reactive resins functionalized with epoxy groups. Component B of the adhesive formulation comprises an aqueous phase of 30 to 100% by weight of a curing agent having functional amine groups or a mixture of curing agents having functional amine groups. The present invention also relates to a method for forming press material bodies, in particular press material plates, using such adhesive formulations.

Description

Technical Field

[0001] The present invention relates to a chemically curable aqueous two-component adhesive formulation for producing a press material molded body, particularly a press material plate, and to a method for producing a press material molded body, particularly a press material plate, by continuously or discontinuously compressing a mixture of the adhesive formulation and a chip material or a fiber material, or by compressing a layer of the adhesive formulation and a chip material or a fiber material.

Background Art

[0002] The concept of a press material molded body generally means a molded body that is formed into a press material molded body by joining materials having a chip material and / or a fiber material while curing a mixed adhesive formulation, supplying a press pressure, and optionally heating. The most common use of such a molded body is in the shape of a plate. Thus, the concept of a press material molded body includes, for example, chipboard, particularly rough chipboard (also referred to as oriented strand board; OSB), medium density (wood) fiberboard (so-called MDF board), high density (wood) fiberboard (so-called HDF board), and also laminated or layer-bonded plate structures such as, for example, veneer plywood.

[0003] Therefore, chip materials or fiber materials include a wide range of very common materials, such as other recycled materials like waste paper and sawmill waste, fibers such as wood fibers or cellulose fibers made from recycled building materials, other naturally derived fibers such as straw and bamboo, and also synthetic fibers such as polyester fibers. Of course, materials containing mixtures of fibers of various properties are also included in chip materials or fiber materials. Chip materials or fiber materials may differ in shape and degree of crushing. That is, chip materials or fiber materials can exist as fiber composites that have already taken shape, such as the plywood mentioned above. However, chip materials or fiber materials can be provided in a variety of crushing degrees and in more or less separate forms, such as with relatively small crushing degrees, like so-called chips, as in the chipboard or OSB mentioned above, or with relatively high crushing degrees, such as molten, so-called wood powder, as in the MDF board and HDF board mentioned above.

[0004] Regardless of whether the material is chipped or fiber-based, a common element in the various methods for manufacturing press-formed materials is that the chipped and / or fiber-based material, which contains an adhesive compound, is pressed under pressure and, in some cases, heated within a mold.

[0005] The adhesive formulations for these uses described above are generally known, and these known adhesive formulations must, of course, be adapted according to the type of molded article or plate to be manufactured and the process to be applied accordingly. In some cases, a wide variety of chemically diverse adhesive formulations are used for various processes. For example, when manufacturing so-called fiberboard, urea-formaldehyde resin, so-called UF resin, is mainly used, along with isocyanate-based resins in smaller amounts, while phenolic resins are mainly used for joining or bonding veneer layers. Thus, the need to adapt the adhesive formulation to a given process and / or product can sometimes result in economic disadvantages.

[0006] Furthermore, a common issue with adhesive formulations primarily used today in methods for manufacturing press-formed articles is the release of harmful substances, particularly during the curing process. Examples of this type of contaminant include volatile components and decomposition products of formaldehyde and isocyanate-based formulations. While attempts have already been made to at least reduce the amount of contaminants that may be released in commonly used adhesive formulations, other problems, particularly process engineering issues, often arise with lower-contamination formulations of this type.

[0007] For example, when manufacturing press-formed pieces, the working time must be kept sufficiently short in order to make the method economically feasible. Therefore, in the methods primarily used today, the pressing of chipped or fiber material with adhesive is carried out at high temperatures. The manufacture of chipboard or fiberboard is generally carried out at temperatures between 200°C and 250°C. This high temperature is therefore necessary, in particular, to obtain sufficient, and as complete as possible, curing within the core of the press mixture. This is because, for example, the heating of the press cake consisting of chipped or fiber material and adhesive is done from the side, and the heat must be transferred into the inner core. Of course, this high temperature can often result in damage to the molded product, such as cracking, and thus a high defect rate, in adhesive formulations currently in use, including modifications that reduce harmful substances. [Overview of the project] [Problems that the invention aims to solve]

[0008] The object of the present invention is to provide an adhesive formulation that overcomes the shortcomings of the prior art, enables the highly reliable manufacture of molded articles, reduces the amount of contaminants during the process while avoiding a large number of defective products, and can be used as universally as possible in various manufacturing methods for press-formed articles. Furthermore, the object of the present invention is to provide a method for manufacturing press-formed articles using this type of adhesive formulation. [Means for solving the problem]

[0009] This problem is solved, on the one hand, by chemically curable aqueous two-component adhesive formulations for manufacturing press material molded articles, particularly press material plates, by continuously or discontinuously compressing a mixture consisting of an adhesive formulation and a chip material or fiber material, or by compressing a laminate consisting of an adhesive formulation and a fiber material plate.

[0010] A chemically curable aqueous two-component adhesive compound comprises a first aqueous component A, which contains at least one chemically curable reactive resin. Furthermore, the chemically curable aqueous two-component adhesive compound comprises a second aqueous component B, which contains at least one curing agent for the chemically curable reactive resin of component A. Components A and B are prepared to form a chemically curable two-component adhesive compound by mixing components A and B. In other words, a curable two-component adhesive compound is formed by mixing two components A and B, or a curable two-component adhesive compound is formed by mixing two components A and B. The mixing of components A and B can preferably be done immediately before use, and therefore immediately before bonding chip material or fiber material, or immediately before bonding chip material or fiber material plate, which will be described in more detail below.

[0011] Component A comprises 20% to 100% by weight of an aqueous phase having a resin content of 30% to 70% by weight of a reactive resin functionalized with functional epoxy groups (Epoxid-Gruppen), or a mixture of reactive resins functionalized with functional epoxy groups. Component B comprises 20% to 100% by weight of an aqueous phase having a curing agent content of 30% to 70% by weight of a curing agent having functional amine groups (Amin-Gruppen), or a mixture of curing agents having functional amine groups.

[0012] Preferably, component A may contain 30% to 100% by weight, particularly 40% to 100% by weight, of an aqueous phase of a reactive resin functionalized with functional epoxy groups, or a mixture of reactive resins functionalized with functional epoxy groups. Preferably, the resin content of the aqueous phase of component A may be 40% to 65% by weight, particularly 40% to 60% by weight.

[0013] Component B may preferably contain an aqueous phase of a curing agent having a functional amine group, or a mixture of curing agents having a functional amine group, in an amount of 35% to 100% by weight, particularly 40% to 100% by weight. Preferably, the aqueous phase of component B may have a curing agent content of 40% to 65% by weight, particularly 40% to 60% by weight.

[0014] In this case, the aqueous two-component adhesive compound consists of 20% to 80% by weight of component A and 20% to 80% by weight of component B. In other words, the two-component adhesive compound is formed by mixing 20% ​​to 80% by weight of component A and 20% to 80% by weight of component B. In particular, the two-component adhesive compound may consist of 30% to 70% by weight of component A and 30% to 70% by weight of component B.

[0015] The aqueous phases of components A and B are interpreted as aqueous dispersions and / or aqueous suspensions and / or aqueous emulsions and / or aqueous solutions of the reactive substance, respectively, depending on the type of reactive substance used, and therefore depending on the reactive resin and crosslinking agent / curing agent, respectively. Here, the remainder can be formed by water, at least mainly, in weight percent, and therefore up to 100% by weight of the aqueous phase. However, the aqueous phases of components A and B may also contain other components, such as dispersion aids and / or suspension aids or their stabilizers, emulsifiers, defoamers, etc.

[0016] Furthermore, components A and B may contain other components, substances, or additives in addition to the aqueous phase described above, such as pigments. Examples of preferred additives that components A and B may contain are described in more detail below. Insofar as components A and / or components B contain other components, in particular additives, a person skilled in the art should appropriately select from a certain range of weight percent a proportion of the reactive resin or curing agent aqueous phase less than 100% by weight of the component in question (A or B). If components A and / or components B contain further additives, the weight percent ratio of component A to component B must also be conformed within the stated weight percent range.

[0017] Adhesive formulations or two-component adhesive formulations may also be referred to as adhesive preparations, sizing agents, or, as is commonly used in the terminology of the relevant technical fields, adhesives (Leimformulierung). In particular, two-component adhesive formulations may be intended for use in the manufacture of chipboard, fiberboard, and laminated board structures such as veneer plywood.

[0018] The two-component adhesive formulations having the described characteristics are characterized, on the one hand, by the fact that they can be used without releasing harmful substances. As experiments have shown, in the described adhesive formulations, in particular, no release of formaldehyde and isocyanates occurs when the adhesive formulation is cured during the process of manufacturing press-formed articles. Thus, for example, when using mainly wood fiber-based fibrous materials, the release of formaldehyde can be limited or reduced compared to conventional adhesive formulations, at least compared to the amount of formaldehyde released from the wood fiber material itself. This means, in subsequent results, advantages in terms of the release of harmful substances during the manufacture of press-formed articles or press-formed plates, and consequently, a significant improvement in working conditions, for example.

[0019] Surprisingly, it was also shown that two-component adhesive formulations of specific compositions can be used universally in the technical field of press-formed material manufacturing without the need for essential adaptation. Thus, using this two-component adhesive formulation, chipboard, MDF board, HDF board, and OSB plate, as well as chip materials or veneer plywood, can be manufactured, or similar manufacturing methods can be carried out using the two-component adhesive formulation.

[0020] Furthermore, it was demonstrated that using this two-component adhesive formulation significantly reduces the temperature during the pressing process compared to conventional adhesive formulations based on prior art. Specifically, in experiments, for example, when manufacturing MDF boards, using this two-component adhesive formulation reduced the temperature during the pressing process to approximately 160°C or below. This is in comparison to the over 200°C typically required when using conventional adhesive formulations. This, in principle, leads to a reduction in energy costs, and consequently, a decrease in manufacturing costs.

[0021] In this regard, it has been shown that this two-component adhesive formulation is also advantageous in terms of manufacturing press-formed articles without defects, or at least with reduced defects. Clearly, when using the described two-component adhesive formulation, on the one hand, good heat conduction from the outer region of the press cake, which consists of, for example, chip material or fiber material and the adhesive formulation, is obtained so that a sufficiently high core temperature can be obtained in the core region during the pressing process of this type of press cake, and it can be cured as completely as possible. This can be particularly supported by the mechanical properties that can be obtained, such as the mechanical bending strength and / or lateral tensile strength of the molded article manufactured as a plate, which is clearly within or exceeds the standardized requirements for each plate, such as MDF board or HDF board. On the other hand, since the temperature required to cure the adhesive formulation of the present invention as completely as possible during the pressing process is relatively low, it is likely that damage will not occur during the pressing process, and defects resulting from such damage can be prevented.

[0022] In a modified example of the two-component adhesive composition, the aqueous phase of the reactive resin functionalized by the functional epoxy groups of component A, or the mixture composed of the reactive resin functionalized by the functional epoxy groups, can have an epoxy equivalent weight (Epoxid-AEquivalentgewicht) of from 200 g / mol to 1500 g / mol.

[0023] The amount of epoxy groups within the specified range has been shown to be particularly suitable for the curing reaction of the reactive resin of component A by the curing agent having amine groups of component B. Preferably, the aqueous phase of the reactive resin of component A functionalized by the epoxy groups, or the mixture composed of the reactive resin functionalized by the epoxy groups, can have an epoxy equivalent weight of from 450 g / mol to 1100 g / mol.

[0024] The aqueous phase of component B, the curing agent having amine groups, or the mixture composed of the curing agent having amine groups can have an amine active hydrogen equivalent weight of from 200 g / mol to 700 g / mol. Preferably, the aqueous phase of component B, the curing agent having amine groups, or the mixture composed of the curing agent having amine groups can have an amine active hydrogen equivalent weight of from 250 g / mol to 600 g / mol.

[0025] In particular, the ratio of the epoxy equivalent weight of the aqueous phase of the reactive resin functionalized by the functional epoxy groups of component A, or the mixture composed of the reactive resin functionalized by the functional epoxy groups, to the amine active hydrogen equivalent weight of the aqueous phase of the curing agent having functional amine groups of component B, or the mixture composed of the curing agent having functional amine groups, can be from 3:1 to 1:2.

[0026] It has been revealed that the equivalent ratio is advantageous for the curing of the two-component adhesive composition during the pressing process within the specified range, and is also advantageous for the mechanical properties achievable by the pressed material molded body accordingly.

[0027] As is known per se, the concept of functionalized resins can generally be understood as chemical substances in which each functional group, in this case the epoxy group of the reactive resin of component A or the amine group of the curing agent of component B, is chemically bonded and present on an oligomer or polymer carrier or hydrocarbon backbone, respectively. The nature of the carrier can basically be of various natures.

[0028] A mixture preferably consisting of a reactive resin functionalized by an epoxy group or a reactive resin functionalized by the epoxy group of component A can be selected from the group consisting of functionalized acrylate resins, functionalized styrene acrylate resins, functionalized acrylic acid copolymers, functionalized (meth)acrylate-copolymers, functionalized acrylate-urethane-copolymers and functionalized cationic polyesters.

[0029] Depending on the type of resin(s) or polymer(s) functionalized with the epoxy group used, the aqueous phase of component A can be in the form of an aqueous dispersion, suspension or emulsion. Particularly in the case of cationic systems, the aqueous phase of component A can also be formed by an aqueous solution. An example of a suitable aqueous phase of component A can be Evonik's product, Ancarez® AR555.

[0030] A curing agent having a functional amine group of component B or a mixture consisting of a curing agent having a functional amine group can be selected from the group consisting of functionalized acrylates, functionalized acrylate-polymers, functionalized acrylate-copolymers, polyamine additives, functionalized acrylate-urethane-copolymers, functionalized styrene-acrylate resins and cationic epoxyamine additives.

[0031] An example of a suitable aqueous phase of component B is here Evonik's Anquamin® 728.

[0032] In preferred embodiments, component A or component B may contain 0.1% to 20% by weight of one or more polyhydric alcohols.

[0033] By using one or more polyhydric alcohols within a specific weight percentage range, it is possible to effectively prevent or delay premature or extremely rapid curing of the two-component adhesive formulation after mixing, especially where necessary. The polyhydric alcohols act as reaction retarders in the specific reactive resins or curing agents / crosslinking agents of the two-component adhesive formulation. That is, the necessary mixing with chip materials or fiber materials and / or coating of boards containing chip materials or fiber materials can be carried out without the high risk of excessively rapid curing. This feature is particularly significant in processes where the two-component adhesive formulation is mixed with chip materials or fiber materials at elevated temperatures, such as in so-called blow lines. It has been demonstrated that this is particularly effective when component A or component B contains one or more polyhydric alcohols in an amount from 1% to 17% by weight. As the polyhydric alcohol, glycols such as butyl diglycol can be used.

[0034] Components A and B can each have a pH value between 7 and 10.

[0035] From this perspective, when using a polyhydric alcohol as a reaction retarder, it is beneficial to adjust the pH of the polyhydric alcohol to a pH value that is at least approximately equivalent to the pH of the component, for example, to a pH of 7 to 10, before adding the polyhydric alcohol to the component. This measure can prevent undesirable aggregation of component A or component B, in particular.

[0036] In further embodiments, the two-component adhesive formulation may contain 0.2% to 10% by weight of anionic wax or neutral wax, or a mixture of similar waxes.

[0037] This can improve, in particular, the adhesion of chip materials or fiber materials, and therefore the mixing of chip materials or fibers with chip materials or the lamination of chip material or fiber material boards. Preferably, component A or component B of the two-component adhesive formulation may contain 1% to 6% by weight of anionic wax or neutral wax or a mixture of similar waxes. Suitable waxes or wax mixtures include, for example, Sasol's Hydrowax A 18.

[0038] Alternatively, instead of one or more types of wax as components of component A or B, solid wax may be added in the process of bonding chip material or fiber material by adhesive mixing, as will be further described below using the method for manufacturing press-formed materials.

[0039] In other embodiments of the two-component adhesive formulation, component A or component B may contain 0.1% to 50% by weight of one or more fillers and / or pigments.

[0040] Fillers and / or pigments can ultimately be used to adjust the mechanical properties and / or coloration of the press-formed material.

[0041] Furthermore, the two-component adhesive formulation may be more effective if component A or component B contains 0.1% to 12% by weight of one or more types of wetting agents or surfactants.

[0042] This feature, in particular, improves the handling of the aqueous phase of the components and enhances the adhesion properties of two-component adhesive formulations. A suitable wetting agent is, for example, Disperbyk 190 from Byk.

[0043] Furthermore, component A or component B may contain 0.1% to 15% by weight of one or more types of antifoaming agents.

[0044] This feature can provide a favorable effect on the pressing process, particularly in the manufacturing of press-formed products, for example, by preventing the formation of air bubbles. Suitable defoaming agents include, for example, Evonik's Surfynol 420 or Surfynol DF 75.

[0045] Component A or component B of the two-component adhesive formulation may further contain 0.1% to 15% by weight of one or more types of thickeners.

[0046] Suitable examples of thickeners include Elemenis' Rheolate 310D and / or Dow's Acrysol RM 8W. The use of such thickeners allows for the adjustment or adaptation of rheology and, consequently, the processing characteristics of two-component adhesive formulations in particular. Specifically, adhesive formulations containing thickeners are particularly suitable for forming coatings by roller application, for example.

[0047] The problems of the present invention can also be solved by a first method for manufacturing a press-formed body, particularly a press-formed plate.

[0048] This method has the following steps: - A step of preparing chip material or fiber material or a mixture of chip material or fiber material, - A step of preparing a chemically curable adhesive formulation, - A step of mixing chip material or fiber material or a mixture of chip material or fiber material with an adhesive compound to form a press cake, - The press cake is continuously compressed or press cake pieces are produced while the adhesive mixture is curing, and the press cake pieces are discontinuously compressed in the press mold while the adhesive mixture is curing.

[0049] In this method, it is important that the adhesive compound used is a chemically curable aqueous two-component adhesive compound as described above and as defined in the applicable claims. In this case, the press cake or press cake piece comprises 77% to 98.5% by weight of chip material or fiber material or a mixture of chip material or fiber material and 1% to 20% by weight of adhesive compound.

[0050] The advantages of this type of manufacturing method, which uses a specific two-part adhesive formulation, have already been described in connection with the above-mentioned description of two-part adhesive formulations. A two-part adhesive formulation can be formed in the manufacturing method by combining two components A and B. The combination or mixing of the two components can be done before or during the step of mixing chip material or fiber material and / or a mixture of chip material or fiber material with the adhesive formulation to produce a press cake.

[0051] Chip material or fiber material refers to materials that include, for example, fibers such as wood fibers or cellulose fibers, including fibers derived from waste paper; other recycled materials such as sawmill waste or recycled building timber; other naturally derived fibers such as straw or bamboo; and synthetic fibers such as polyester fibers. Chip material or fiber material, and / or chip material mixture or fiber material mixture, can be completely different in appearance, and in particular, they may be completely different in degree of crushing. Chip material or fiber material, and / or chip material mixture or fiber material mixture, can be provided at various degrees of crushing, for example, with a relatively low degree of crushing, such as so-called chips, as in the chipboard or OSB mentioned above; or with a relatively high degree of crushing, such as molten, so-called wood powder, as in the MDF board and HDF board mentioned above.

[0052] In a further embodiment of this method, 0.1% to 3% by weight of solid wax can be added during the process of mixing chip material or fiber material or a mixture of chip material or fiber material with an adhesive formulation.

[0053] This makes it possible to improve the adhesion of chip materials or fiber materials or mixtures of chip materials or fiber materials, and therefore the mixing of adhesive formulations with chip materials or fiber materials or mixtures of chip materials or fiber materials.

[0054] Finally, however, the problems of the present invention can also be solved by other methods for manufacturing press material plates. These other methods have the following steps: - Prepare a plate having a large number of chip materials or fiber materials, - At least one surface of the plate provided for bonding with other plates is coated with an adhesive compound. - A plate laminate is formed by stacking coated plates, - The plate laminate is compressed in the press mold while the adhesive mixture is curing.

[0055] In this further method, it is again important that a chemically curable adhesive formulation, as described above and defined in the applicable claims, is used as the water-soluble two-component adhesive formulation. Here, the weight percentage of plates in the plate laminate is 80% to 99% by weight, and the weight percentage of the adhesive formulation in the plate laminate is 1% to 20% by weight.

[0056] To better understand the present invention, the present invention will be described below in detail with reference to figures, using non-limiting embodiments, and a method for forming a press material plate will also be described.

[0057] Within the framework of the present invention, examples of compositions for chemically curable, water-soluble, two-component adhesive formulations are as follows: Ingredient A Ancarez(R) AR555; Evonik; 45.66% by weight; Butyl diglycol; 5% by weight, Hydrowax A 18; Sasol; 1% by weight; Component B Anquamine® 728; Evonik; 48.34% by weight.

[0058] In the described examples, the weight percentages of the individual components of the two-component adhesive formulation are based on 100% by weight of the two-component adhesive formulation consisting of component A and component B. Therefore, in the described examples, component A consists of 88.38% by weight of Ancarez® AR555, 9.68% by weight of butyl diglycol, and 1.94% by weight of hydrowax A 18, relative to 100% by weight of component A. In the described examples, component B consists of 100% by weight of Anquamine® 728. In this example, the two-component adhesive formulation consists of 51.66% by weight of component A and 48.34% by weight of component B.

[0059] Ancarez® AR555 is an aqueous phase or dispersion of a nonionic reactive resin functionalized with epoxy groups, having a solid content of approximately 55% by weight and an epoxy equivalent of 550 g / mol.

[0060] Anquamine® 728 is an aqueous phase of a curing agent having an amine group, having a solid content of approximately 55% by weight and an amine active hydrogen equivalent (H-aktiv AEquivalentgewicht) (AHEW) of 250 g / mol, and is an aqueous phase of a curing agent having a functional amine group.

[0061] Certain two-component adhesive formulations have been proven to be fundamentally good and universally suitable for use in known methods for manufacturing press-formed articles.

[0062] However, certain two-component adhesive formulations should be considered merely examples, and adapted or other formulations or recipes may be used instead of the adhesive formulations described above, depending on the specific requirements of each method for manufacturing press-formed articles.

[0063] That is, for example, product Ancarez® AR555 can substitute for and / or be mixed with other aqueous phases of a mixture consisting of a reactive resin functionalized with epoxy groups or a reactive resin functionalized with functional epoxy groups. Preferably, the mixture of the reactive resin functionalized with epoxy groups or a reactive resin functionalized with functional epoxy groups of component A can be selected from the group consisting of functionalized acrylate resins, functionalized styrene acrylate resins, functionalized acrylic acid copolymers and functionalized (meth)acrylate copolymers, functionalized acrylate-urethane copolymers and functionalized cationic polyesters.

[0064] Similarly, product Anquamine® 728 is replaceable with, or can be mixed with, other aqueous phases of a curing agent having a functional amine group or a mixture of curing agents having a functional amine group. Preferably, component B, which is a curing agent having a functional amine group or a mixture of curing agents having a functional amine group, can be selected from the group consisting of functionalized acrylates, functionalized acrylate polymers, functionalized acrylate copolymers, polyamine additives, functionalized acrylate-urethane copolymers, functionalized styrene-acrylate resins, and cationic epoxyamine additives.

[0065] Those skilled in the art will know of products similar to those described in the examples.

[0066] The butyl diglycol described in the above-mentioned examples can be replaced with, or mixed with, other polyhydric alcohols or mixtures of glycols or polyhydric alcohols. Depending on the type of method for forming the press-formed article or the process control, all polyhydric alcohols or mixtures of polyhydric alcohols as components of either component A or B can be omitted. The same applies to the hydrowax A 18 described in the examples.

[0067] Furthermore, in component B, as shown for butyl diglycol and hydrowax A 18 in the above-mentioned examples, each additive can be added in place of component A.

[0068] Depending on the requirements or process control, component A or component B of the two-component adhesive formulation may also be effective in having other additives different from those described in the above examples, namely butyl diglycol and hydrowax A 18. For example, component A or component B may contain, for example, 0.1% to 50% by weight of one or more fillers and / or pigments, 0.1% to 12% by weight of one or more wetting agents, 0.1% to 15% by weight of one or more defoaming agents and / or 0.1% to 15% by weight of one or more thickeners. Furthermore, component A or component B may contain 0.1% to 20% by weight of one or more polyhydric alcohols and 0.2% to 10% by weight of anionic or neutral waxes.

[0069] Depending on the type and amount of additives, or the general requirements and process control of the method for forming the press-formed body, the weight percentages of components A and B of the adhesive formulation—that is, the aqueous phase, polyhydric alcohol, and various additives—can of course be adapted. In this case, the appropriate adaptation of the weight percentages of each component can be carried out by those skilled in the art within the weight percentage ranges described above for each component. Of course, the weight percentages of components A and B relative to each other in a two-component adhesive formulation may be appropriately adjusted within the specified weight percentage range.

[0070] In particular, component A of the two-component adhesive formulation contains 20% to 100% by weight of an aqueous phase having a resin content of 30% to 70% by weight of a reactive resin functionalized with epoxy groups, or a mixture of reactive resins functionalized with functional epoxy groups. Furthermore, component B of the two-component adhesive formulation contains 30% to 100% by weight of an aqueous phase having a curing agent ratio of 30% to 70% by weight of a curing agent having amine groups, or a mixture of curing agents having amine groups. In this case, the aqueous two-component adhesive formulation consists of 30% to 70% by weight of component A and 30% to 70% by weight of component B.

[0071] The aqueous phase of a reactive resin functionalized with the functional epoxy groups of component A, or a mixture consisting of a reactive resin functionalized with functional epoxy groups, can have an epoxy equivalent of 200 g / mol to 1500 g / mol. The aqueous phase of a curing agent having the functional amine groups of component B, or a mixture consisting of a curing agent having functional amine groups, can have an amine active hydrogen equivalent of 200 g / mol to 700 g / mol. In this case, the ratio of the epoxy equivalent of the aqueous phase of the reactive resin functionalized with the functional epoxy groups of component A, or a mixture consisting of a reactive resin functionalized with functional epoxy groups, to the amine active hydrogen equivalent of the aqueous phase of the curing agent having the functional amine groups of component B, or a mixture consisting of a curing agent having functional amine groups, can be 3:1 to 1:2.

[0072] Furthermore, components A and B may each have a pH value between 7 and 10.

[0073] The following describes an example of a method for manufacturing press material plates, with the help of diagrams. Each diagram is a highly simplified, schematic representation. [Brief explanation of the drawing]

[0074] [Figure 1]Figure 1 shows an embodiment of a continuous pressing process for press cakes that forms a press material plate. [Figure 2] Figure 2 shows an example of a discontinuous pressing process for laminating layers consisting of a plate having a fibrous material and a two-component adhesive compound. [Modes for carrying out the invention]

[0075] A method for forming a press-formed material, particularly a press-formed material plate, basically involves the following steps: - Prepare chip material, fiber material, or a mixture of chip material and fiber material. - Prepare a chemically curable adhesive formulation, -While forming the press cake, mix the chip material or fiber material or a mixture of chip material or fiber material with the adhesive compound. - The press cake is continuously pressed while the adhesive mixture is curing, or press cake pieces are manufactured, and the press cake pieces are discontinuously compressed in the press mold while the adhesive mixture is curing.

[0076] In this case, a chemically curable aqueous two-component adhesive formulation, as described above and defined in the applicable claims, can be used as the adhesive formulation.

[0077] The mixing of chip material, fiber material, or a mixture of chip material or fiber material with a two-component adhesive formulation is also known in specialized terminology as gluing, and as is known, it can be carried out in various ways. In this regard, the most common methods include mechanical gluing or mixing in a mixing device, so-called blowline gluing, and, less frequently, dry gluing (Trockenbeleimung). These gluing or mixing methods are known to those skilled in the art, so a detailed explanation can be omitted here. In this case, instead of the examples for a two-component adhesive formulation containing wax (hydrowax A 18), solid wax may be mixed in at a rate of 0.1% to 3% by weight during the process of mixing the chip material, fiber material, or mixture of chip material or fiber material with the adhesive formulation.

[0078] The production of a two-component adhesive formulation by mixing components A and B can be carried out, for example, before mixing with chip material or fiber material, or during the process of mixing with chip material or fiber material.

[0079] A so-called press cake is formed or obtained by mixing chip material or fiber material or a mixture of chip material or fiber material with a two-component adhesive compound, and the press cake is then compressed.

[0080] Figure 1 shows an embodiment of a continuous pressing process for a press cake 1. This type of continuous pressing process for the press cake 1 can be performed using a double-belt press 2, as shown in the embodiment of Figure 1. The double-belt press 2 shown in the embodiment of Figure 1 has a so-called underbelt 3, on which the press cake 1 is applied and transported, and an overbelt 4 as a pressing member. As shown in Figure 1, the press cake 1 is guided between the underbelt 3 and the overbelt 4 of the double-belt press 2 and compressed or pressed to a desired press pressure by adjusting the relative positions of the underbelt 3 and the overbelt 4. During the process of compressing the press cake 1, a two-component adhesive compound is also cured, and the curing of the two-component adhesive compound can be started or accelerated, for example, by a heating means 5 shown in Figure 1.

[0081] Figure 1 shows only one possible embodiment for continuously pressing a press cake 1, but other continuously operating press systems, such as presses with press rollers, or presses with a combination of belts and rollers, or so-called calender presses, are known and commonly used in the field of manufacturing press material molded products. In the case of continuous pressing, as shown in Figure 1, a press material strand 6 is obtained, which can then be separated by cutting into a press material molded product, in particular a press material plate.

[0082] For example, as can be seen using the embodiment shown in Figure 1, instead of continuous compression, the method also allows for discontinuous pressing of pre-formed press cake pieces, obtained, for example, by dividing a continuously released press cake, onto a press material molded body while curing a two-component adhesive mixture. Such discontinuous compression can be carried out, for example, in a press mold having a displaceable press stamp.

[0083] Regardless of whether the process is carried out by continuously or discontinuously compressing the press cake or press cake pieces, the press cake or press cake pieces have a weight percentage of chip material or fiber material or a mixture of chip material or fiber material of 77% to 98.5% by weight, and a weight percentage of two-component adhesive compound of 1% to 20% by weight.

[0084] Figure 2 briefly and broadly illustrates an embodiment of an alternative method for manufacturing press-formed articles, particularly press-formed plates, which may also utilize the two-component adhesive formulation according to the present invention.

[0085] - Prepare a number of plates having chip material or fiber material, especially plywood, - At least one surface of the plate provided for bonding with other plates is coated with an adhesive compound, - By stacking coated plates, a plate laminate is formed. - The plate laminate is compressed in the press mold while the adhesive mixture is curing.

[0086] Figure 2 shows a corresponding plate laminate 7, in which plates 8 having chip material or fiber material are laminated with layers of a two-component adhesive compound 9, each placed between two plates 8. The plate laminate 7, roughly shown schematicly in Figure 2, can be compressed, for example, by a press stamp 10, and possibly also within a press mold not shown in Figure 2. The plates 8 can be coated or glued with the adhesive compound 9 before compression, thereby essentially coating one surface 11 of the plates, or at least both surfaces 11 of the inner plate 8, with the adhesive compound 9.

[0087] In the process control of the plate laminate 7 by compression, as shown in Figure 2, the two-component adhesive compound 9 described above can also be used as the adhesive compound, with the weight percentage of plates in the plate laminate ranging from 80% to 99% by weight, and the weight percentage of the adhesive compound in the plate laminate ranging from 1% to 20% by weight.

[0088] It should be noted at this point that the embodiments illustrate possible embodiments, and therefore, the present invention is not limited to the specifically shown embodiments.

[0089] The area of ​​protection is defined by the claims. However, the specification and drawings should be used in considering the claims. Individual features or combinations of features of the various embodiments illustrated and described may themselves represent independent progressive solutions. The problem underlying an independent progressive solution can be read from the specification.

[0090] All descriptions of value regions within a specific description include both any subregion and all subregions thereof. For example, descriptions 1 through 10 include all subregions starting from the lower limit of 1 and the upper limit of 10, i.e., all subregions starting at or above the lower limit of 1 and ending at or below the upper limit of 10, such as 1 through 1.7, or 3.2 through 8.1, or 5.5 through 10.

[0091] Finally, I would like to formally point out that, in order to make the structure easier to understand, some of the components are not shown to scale, and / or are enlarged and / or reduced. [Explanation of Symbols]

[0092] 1 Pressed cake 2. Double Belt Press 3 Underbelt 4 Overbelt 5 Heating means 6 Pressing material strands 7 Plate Laminate 8 plates 9. Adhesive formulations 10 Press Stamps

Claims

1. A chemically curable, aqueous, two-component adhesive formulation for producing pressed material bodies by continuous or discontinuous compression of a mixture of the adhesive formulation and chip and / or fiber material or by compression of a laminate of the adhesive formulation and chip and / or fiber material, a first aqueous component A having at least one chemically curable reactive resin; a second aqueous component B having at least one hardener for the chemically curable reactive resin of component A; having said components A and B are provided to form a chemically curable two-part adhesive formulation by mixing said components A and B; said component A consists of an aqueous dispersion, suspension, emulsion or solution of one or a mixture of reactive resins functionalized with epoxy groups, or of several reactive resins functionalized with epoxy groups, said component A comprises an aqueous dispersion, suspension, emulsion or solution of one reactive resin functionalized with epoxy groups or of a mixture of reactive resins functionalized with epoxy groups, together with other components or additives; the proportion of an aqueous dispersion, suspension, emulsion or solution of one or a mixture of reactive resins functionalized with epoxy groups in component A is 20 to 100% by weight, the proportion of said one reactive resin functionalized with epoxy groups or said mixture of reactive resins functionalized with epoxy groups in the aqueous dispersion, suspension, emulsion or solution of said one reactive resin functionalized with epoxy groups or said mixture of reactive resins functionalized with epoxy groups is 30 to 70% by weight, and component B consists of an aqueous dispersion, suspension, emulsion or solution of one or a mixture of curing agents having amine groups, or said component B comprises an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one curing agent having an amine group or a mixture of several curing agents having an amine group, and other components or additives; the proportion of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one type of curing agent having an amine group or a mixture of multiple types of curing agents having an amine group in component B is 20 to 100% by weight, the proportion of the one curing agent having an amine group or the mixture of the multiple curing agents having an amine group in the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of the one curing agent having an amine group or the mixture of the multiple curing agents having an amine group is 30 to 70% by weight, The aqueous two-part adhesive formulation comprises 20% to 80% by weight of component A and 20% to 80% by weight of component B. In things, the epoxy-functionalized reactive resin or mixture of epoxy-functionalized reactive resins of component A has an epoxy equivalent weight of 200 g / mol to 1500 g / mol; the epoxy-functionalized reactive resin or mixture of epoxy-functionalized reactive resins of component A is selected from the group consisting of functionalized acrylate resins, functionalized styrene acrylate resins, functionalized acrylic acid copolymers and functionalized (meth)acrylate copolymers, functionalized acrylate-urethane copolymers and functionalized cationic polyesters, 1. A chemically curable, water-based, two-part adhesive formulation comprising:

2. 2. The adhesive formulation of claim 1, wherein the amine-containing curing agent or mixture of amine-containing curing agents of component B has an amine active hydrogen equivalent of 200 g / mol to 700 g / mol.

3. 3. The adhesive formulation according to claim 1 or 2, characterized in that the ratio of the amine active hydrogen equivalent of the amine group-containing curing agent or mixture of amine group-containing curing agents of component B to the epoxy equivalent of the epoxy group-functionalized reactive resin or mixture of epoxy group-functionalized reactive resins of component A is from 3:1 to 1:

2.

4. The amine group-containing curing agent or mixture of amine group-containing curing agents of component B is selected from the group consisting of functionalized acrylates, functionalized acrylate polymers, functionalized acrylate copolymers, polyamine adducts, functionalized acrylate-urethane copolymers, functionalized styrene-acrylate resins and cationic epoxyamine adducts.

4. The adhesive formulation according to claim 1 .

5. 5. The adhesive formulation according to any one of claims 1 to 4, characterized in that said component A or said component B has from 0.1% to 20% by weight of one or more polyhydric alcohols.

6. 6. The adhesive formulation according to claim 1, wherein components A and B each have a pH value of from 7 to 10.

7. 7. The adhesive formulation according to claim 1, wherein component A or component B comprises 0.2% to 10% by weight of an anionic wax or a neutral wax or a mixture of these waxes.

8. 8. The adhesive formulation according to any one of claims 1 to 7, characterized in that the component A or the component B comprises 0.1% to 50% by weight of one or more fillers and / or pigments.

9. 9. The adhesive formulation according to any one of claims 1 to 8, characterized in that said component A or said component B has from 0.1% to 12% by weight of one or more wetting agents.

10. 10. The adhesive formulation according to any one of claims 1 to 9, characterized in that said component A or said component B comprises 0.1% to 15% by weight of one or more defoamers.

11. 11. The adhesive formulation according to any one of claims 1 to 10, characterized in that said component A or said component B comprises 0.1% to 15% by weight of one or more thickeners.

12. 1. A method of forming a pressed material body, comprising: - providing a chip material and / or a fibre material or a chip material and / or fibre material mixture, - providing a chemically curable adhesive formulation; - mixing chip material and / or fiber material or a mixture of chip material and / or fiber material with an adhesive formulation to produce a press cake; - compressing the press cake continuously whilst the adhesive formulation is curing, or producing press cake pieces and discontinuously compressing the press cake pieces in a press mould whilst the adhesive formulation is curing; 20. The method of claim 19, further comprising: The adhesive formulation is a chemically curable, water-based, two-part adhesive formulation, The two-part adhesive formulation comprises a first water-based component A comprising at least one chemically curable reactive resin; a second aqueous component B comprising at least one curing agent for the chemically curable reactive resin of component A; said components A and B are prepared to form said chemically curable two-part adhesive formulation by mixing said components A and B; said component A consists of an aqueous dispersion, suspension, emulsion or solution of a reactive resin functionalized with epoxy groups or of a mixture of reactive resins functionalized with epoxy groups, said component A comprises an aqueous dispersion, suspension, emulsion or solution of one reactive resin functionalized with epoxy groups or of a mixture of reactive resins functionalized with epoxy groups, together with other components or additives; the proportion of an aqueous dispersion, suspension, emulsion or solution of one or a mixture of reactive resins functionalized with epoxy groups in component A is 20 to 100% by weight, the proportion of said one reactive resin functionalized with epoxy groups or said mixture of reactive resins functionalized with epoxy groups in the aqueous dispersion, suspension, emulsion or solution of said one reactive resin functionalized with epoxy groups or said mixture of reactive resins functionalized with epoxy groups is 30 to 70% by weight, said component B consisting of an aqueous dispersion, suspension, emulsion or solution of one or a mixture of curing agents having amine groups, said component B comprises an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one curing agent having an amine group or a mixture of several curing agents having an amine group, and other components or additives; the proportion of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one type of curing agent having an amine group or a mixture of multiple types of curing agents having an amine group in component B is 20 to 100% by weight, the proportion of the one curing agent having an amine group or the mixture of the multiple curing agents having an amine group in the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of the one curing agent having an amine group or the mixture of the multiple curing agents having an amine group is 30 to 70% by weight, The aqueous two-part adhesive formulation comprises 20% to 80% by weight of component A and 20% to 80% by weight of component B, the epoxy-functionalized reactive resin or mixture of epoxy-functionalized reactive resins of component A is selected from the group consisting of functionalized acrylate resins, functionalized styrene acrylate resins, functionalized acrylic acid copolymers and functionalized (meth)acrylate copolymers, functionalized acrylate-urethane copolymers and functionalized cationic polyesters, the presscake or the presscake pieces have a weight percentage of 77% to 98.5% by weight of the chip material and / or the fiber material or the chip material and / or the fiber material mixture and a weight percentage of 1% to 20% by weight of the adhesive formulation; A method comprising:

13. The method according to claim 12, characterized in that in the process of mixing the chip material and / or the fiber material or the chip material and / or the fiber material mixture with the adhesive formulation, 0.1% by weight to 3% by weight of solid wax is mixed.

14. 1. A method of forming a press material plate, comprising: - providing a number of plates with chip material and / or fibers; - coating at least one surface of the plate intended for bonding to another plate with an adhesive compound; - stacking the coated plates to form a plate stack; - compressing the plate stack in a press whilst the adhesive formulation is curing; 20. The method of claim 19, further comprising: The adhesive formulation is a chemically curable, water-based, two-part adhesive formulation, The two-part adhesive formulation comprises a first water-based component A comprising at least one chemically curable reactive resin; a second aqueous component B comprising at least one curing agent for the chemically curable reactive resin of component A; said components A and B are prepared to form said chemically curable two-part adhesive formulation by mixing said components A and B; said component A consists of an aqueous dispersion, suspension, emulsion or solution of a reactive resin functionalized with epoxy groups or of a mixture of reactive resins functionalized with epoxy groups, said component A comprises an aqueous dispersion, suspension, emulsion or solution of one reactive resin functionalized with epoxy groups or of a mixture of reactive resins functionalized with epoxy groups, together with other components or additives; the proportion of an aqueous dispersion, suspension, emulsion or solution of one or a mixture of reactive resins functionalized with epoxy groups in component A is 20 to 100% by weight, the proportion of said one reactive resin functionalized with epoxy groups or said mixture of reactive resins functionalized with epoxy groups in the aqueous dispersion, suspension, emulsion or solution of said one reactive resin functionalized with epoxy groups or said mixture of reactive resins functionalized with epoxy groups is 30 to 70% by weight, said component B consisting of an aqueous dispersion, suspension, emulsion or solution of one or a mixture of curing agents having amine groups, said component B comprises an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one curing agent having an amine group or a mixture of several curing agents having an amine group, and other components or additives; the proportion of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one type of curing agent having an amine group or a mixture of multiple types of curing agents having an amine group in component B is 20 to 100% by weight, the proportion of the one curing agent having an amine group or the mixture of the multiple curing agents having an amine group in the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of the one curing agent having an amine group or the mixture of the multiple curing agents having an amine group is 30 to 70% by weight, The aqueous two-part adhesive formulation comprises 20% to 80% by weight of component A and 20% to 80% by weight of component B, the epoxy-functionalized reactive resin or mixture of epoxy-functionalized reactive resins of component A is selected from the group consisting of functionalized acrylate resins, functionalized styrene acrylate resins, functionalized acrylic acid copolymers and functionalized (meth)acrylate copolymers, functionalized acrylate-urethane copolymers and functionalized cationic polyesters, the weight percentage of the plates in the plate stack is between 80% and 99% by weight, and the weight percentage of the adhesive formulation in the plate stack is between 1% and 20% by weight; A method comprising:

15. A chemically curable, aqueous, two-component adhesive formulation for producing pressed material bodies by continuous or discontinuous compression of a mixture of the adhesive formulation and chip and / or fiber material or by compression of a laminate of the adhesive formulation and chip and / or fiber material, a first aqueous component A having at least one chemically curable reactive resin; a second aqueous component B having at least one hardener for the chemically curable reactive resin of component A; having said components A and B are provided to form a chemically curable two-part adhesive formulation by mixing said components A and B; said component A consists of an aqueous dispersion, suspension, emulsion or solution of one or a mixture of reactive resins functionalized with epoxy groups, or said component A comprises an aqueous dispersion, suspension, emulsion or solution of one reactive resin functionalized with epoxy groups or of a mixture of reactive resins functionalized with epoxy groups, together with other components or additives; the proportion of an aqueous dispersion, suspension, emulsion or solution of one or a mixture of reactive resins functionalized with epoxy groups in component A is 20 to 100% by weight, the proportion of said one reactive resin functionalized with epoxy groups or said mixture of reactive resins functionalized with epoxy groups in the aqueous dispersion, suspension, emulsion or solution of said one reactive resin functionalized with epoxy groups or said mixture of reactive resins functionalized with epoxy groups is 30 to 70% by weight, and component B consists of an aqueous dispersion, suspension, emulsion or solution of one or a mixture of curing agents having amine groups, or said component B comprises an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one curing agent having an amine group or a mixture of several curing agents having an amine group, and other components or additives; the proportion of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one type of curing agent having an amine group or a mixture of multiple types of curing agents having an amine group in component B is 20 to 100% by weight, the proportion of the one curing agent having an amine group or the mixture of the multiple curing agents having an amine group in the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of the one curing agent having an amine group or the mixture of the multiple curing agents having an amine group is 30 to 70% by weight, The aqueous two-part adhesive formulation comprises 20% to 80% by weight of component A and 20% to 80% by weight of component B. In things, the epoxy-functionalized reactive resin or mixture of epoxy-functionalized reactive resins of component A has an epoxy equivalent weight of 200 g / mol to 1500 g / mol; The amine group-containing curing agent or mixture of amine group-containing curing agents of component B is selected from the group consisting of functionalized acrylates, functionalized acrylate polymers, functionalized acrylate copolymers, polyamine adducts, functionalized acrylate-urethane copolymers, functionalized styrene-acrylate resins and cationic epoxyamine adducts.

1. A chemically curable, water-based, two-part adhesive formulation comprising:

16. 1. A method of forming a pressed material body, comprising: - providing a chip material and / or a fibre material or a chip material and / or fibre material mixture, - providing a chemically curable adhesive formulation; - mixing chip material and / or fiber material or a mixture of chip material and / or fiber material with an adhesive formulation to produce a press cake; - compressing the press cake continuously whilst the adhesive formulation is curing, or producing press cake pieces and discontinuously compressing the press cake pieces in a press mould whilst the adhesive formulation is curing; 20. The method of claim 19, further comprising: The adhesive formulation is a chemically curable, water-based, two-part adhesive formulation, The two-part adhesive formulation comprises a first water-based component A comprising at least one chemically curable reactive resin; a second aqueous component B comprising at least one curing agent for the chemically curable reactive resin of component A; said components A and B are prepared to form said chemically curable two-part adhesive formulation by mixing said components A and B; said component A consists of an aqueous dispersion, suspension, emulsion or solution of a reactive resin functionalized with epoxy groups or of a mixture of reactive resins functionalized with epoxy groups, said component A comprises an aqueous dispersion, suspension, emulsion or solution of one reactive resin functionalized with epoxy groups or of a mixture of reactive resins functionalized with epoxy groups, together with other components or additives; the proportion of an aqueous dispersion, suspension, emulsion or solution of one or a mixture of reactive resins functionalized with epoxy groups in component A is 20 to 100% by weight, the proportion of said one reactive resin functionalized with epoxy groups or said mixture of reactive resins functionalized with epoxy groups in the aqueous dispersion, suspension, emulsion or solution of said one reactive resin functionalized with epoxy groups or said mixture of reactive resins functionalized with epoxy groups is 30 to 70% by weight, said component B consisting of an aqueous dispersion, suspension, emulsion or solution of one or a mixture of curing agents having amine groups, said component B comprises an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one curing agent having an amine group or a mixture of several curing agents having an amine group, and other components or additives; the proportion of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one type of curing agent having an amine group or a mixture of multiple types of curing agents having an amine group in component B is 20 to 100% by weight, the proportion of the one curing agent having an amine group or the mixture of curing agents having an amine group in the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of the one curing agent having an amine group or the mixture of curing agents having an amine group is 30 to 70% by weight, The aqueous two-part adhesive formulation comprises 20% to 80% by weight of component A and 20% to 80% by weight of component B, the amine group-containing curing agent or mixture of amine group-containing curing agents of component B is selected from the group consisting of functionalized acrylates, functionalized acrylate polymers, functionalized acrylate copolymers, polyamine adducts, functionalized acrylate-urethane copolymers, functionalized styrene-acrylate resins and cationic epoxy amine adducts; the presscake or the presscake pieces have a weight percentage of 77% to 98.5% by weight of the chip material and / or the fiber material or the chip material and / or the fiber material mixture and a weight percentage of 1% to 20% by weight of the adhesive formulation; A method comprising:

17. 1. A method of forming a press material plate, comprising: - providing a number of plates with chip material and / or fibers; - coating at least one surface of the plate intended for bonding to another plate with an adhesive compound; - stacking the coated plates to form a plate stack; - compressing the plate stack in a press whilst the adhesive formulation is curing; 20. The method of claim 19, further comprising: The adhesive formulation is a chemically curable, water-based, two-part adhesive formulation, The two-part adhesive formulation comprises a first water-based component A comprising at least one chemically curable reactive resin; a second aqueous component B comprising at least one curing agent for the chemically curable reactive resin of component A; said components A and B are prepared to form said chemically curable two-part adhesive formulation by mixing said components A and B; said component A consists of an aqueous dispersion, suspension, emulsion or solution of a reactive resin functionalized with epoxy groups or of a mixture of reactive resins functionalized with epoxy groups, said component A comprises an aqueous dispersion, suspension, emulsion or solution of one reactive resin functionalized with epoxy groups or of a mixture of reactive resins functionalized with epoxy groups, together with other components or additives; the proportion of an aqueous dispersion, suspension, emulsion or solution of one or a mixture of reactive resins functionalized with epoxy groups in component A is 20 to 100% by weight, the proportion of said one reactive resin functionalized with epoxy groups or said mixture of reactive resins functionalized with epoxy groups in the aqueous dispersion, suspension, emulsion or solution of said one reactive resin functionalized with epoxy groups or said mixture of reactive resins functionalized with epoxy groups is 30 to 70% by weight, said component B consisting of an aqueous dispersion, suspension, emulsion or solution of one or a mixture of curing agents having amine groups, said component B comprises an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one curing agent having an amine group or a mixture of several curing agents having an amine group, and other components or additives; the proportion of an aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of one type of curing agent having an amine group or a mixture of multiple types of curing agents having an amine group in component B is 20 to 100% by weight, the proportion of the one curing agent having an amine group or the mixture of the multiple curing agents having an amine group in the aqueous dispersion, aqueous suspension, aqueous emulsion or aqueous solution of the one curing agent having an amine group or the mixture of the multiple curing agents having an amine group is 30 to 70% by weight, The aqueous two-part adhesive formulation comprises 20% to 80% by weight of component A and 20% to 80% by weight of component B, the amine group-containing curing agent or mixture of amine group-containing curing agents of component B is selected from the group consisting of functionalized acrylates, functionalized acrylate polymers, functionalized acrylate copolymers, polyamine adducts, functionalized acrylate-urethane copolymers, functionalized styrene-acrylate resins and cationic epoxy amine adducts; the weight percentage of the plates in the plate stack is between 80% and 99% by weight, and the weight percentage of the adhesive formulation in the plate stack is between 1% and 20% by weight; A method comprising:

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