Transmittance measuring method, and method for manufacturing substrate with film

Abstract

To provide a transmittance measuring method for measuring the transmittance of an object to be measured by transmitting a light beam from a light source through the object to be measured and detecting the light beam with a detector, the transmittance measuring method capable of easily measuring the transmittance at a plurality of parts of the object to be measured, and a method for manufacturing a substrate with a film including a step of measuring the transmittance of a substrate with a film using the transmittance measuring method.SOLUTION: A substrate G with a film is supported at a predetermined position of a jig fixation plate 7 by using a measuring jig 6 that holds the substrate G with a film. The measuring jig 6 clamps and holds the substrate G with a film so as to cover one principal surface G1 of the substrate G with a film, and has a plurality of jig-side through holes 61d for exposing the principal surface G1. The jig fixation plate 7 is arranged intersecting an optical axis of a light beam L, and has a fixation plate-side through hole 71a through which the light beam L can pass. At the predetermined position, the substrate G with a film is supported, with any one of the jig-side through holes 61d and the fixation plate-side through hole 71a coaxially overlapped with each other.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a transmittance measurement method for measuring the transmittance of a measurement object, and a method for manufacturing a film-coated substrate, which is an example of the measurement object, the method including a step of measuring the transmittance of the film-coated substrate obtained by the transmittance measurement method. [Background technology]

[0002] For example, in a manufacturing process for a film-coated substrate in which a thin film (functional film) is formed on the main surface of a glass plate, as an example of quality inspection, a film-coated substrate produced through each process is randomly selected as a sample substrate, and the transmittance of the sample substrate is measured to improve the quality of the film-coated substrate as a final product.

[0003] A typical method for measuring the transmittance of a sample substrate, which is an object to be measured, is to use a spectrophotometer (see, for example, Patent Document 1). A spectrophotometer mainly comprises an integrating sphere with an opening, a light source arranged opposite the opening of the integrating sphere, and a detector that detects transmittance. Light irradiated from the light source reaches the inner surface of the integrating sphere through the opening, is first scattered and homogenized, and then is received by the detector.

[0004] When measuring the transmittance of an object to be measured using a spectrophotometer configured as described above, the object to be measured is first placed near the integrating sphere so as to block the opening of the integrating sphere, and then light is irradiated from the light source. Light emitted from the light source passes through the measurement object and reaches the inside of the integrating sphere, and is then received by a detector, whereby the transmittance of the measurement object is detected. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2003-42939 A Summary of the Invention [Problem to be solved by the invention]

[0006] Incidentally, spectrophotometers conventionally used in the manufacturing process of film-coated substrates are designed to measure small-sized sample substrates, mainly measuring about 50 mm x 50 mm, and only a holding mechanism suitable for such small-sized sample substrates is provided near the integrating sphere (more specifically, the opening of the integrating sphere). It has been difficult for this holding mechanism to stably hold a large-sized sample substrate, for example, measuring about 200 mm x 300 mm. Therefore, when measuring the transmittance at multiple locations on the large-sized sample substrate, the sample substrate must first be cut into a predetermined small size (approximately 50 mm x 50 mm) to form multiple sample pieces, and then the desired sample pieces must be sequentially extracted from among the multiple sample pieces and held by the holding mechanism, making the transmittance measurement task time-consuming for the operator.

[0007] The present invention has been made in consideration of the current problems described above, and has an objective of providing a transmittance measurement method that measures the transmittance of an object to be measured by transmitting a light beam emitted from a light source through the object to be measured and detecting it with a detector, the transmittance measurement method being capable of easily measuring the transmittance of multiple points on the object to be measured, and a method for manufacturing a film-coated substrate, which includes a step of measuring the transmittance of the film-coated substrate obtained by the transmittance measurement method. [Means for solving the problem]

[0008] The problem to be solved by the present invention has been described above, and the means for solving this problem will now be described.

[0009] That is, the transmittance measurement method according to aspect 1 of the present invention is a transmittance measurement method in which a light beam emitted from a light source is passed through the object to be measured and detected by a detector, and the transmittance of the object to be measured is measured by holding the object to be measured using a measurement tool and fixing the measurement tool to a tool fixing plate, thereby supporting the object to be measured at a predetermined position, the measurement tool holds the object to be measured by clamping it so as to cover one of its main surfaces and has a plurality of tool-side through holes that expose the one of its main surfaces, the tool fixing plate is arranged in a state intersecting the optical axis of the light beam and has a fixing plate-side through hole through which the light beam can pass, and at the predetermined position, the object to be measured is supported with one of the tool-side through holes and the fixing plate-side through hole overlapping coaxially with each other. By having such a configuration, according to the transmittance measurement method of the present invention, it is possible to measure the transmittance at a desired position on the object to be measured by simply changing the position of the measurement jig fixed to the jig fixing plate appropriately and changing the position of any jig-side through hole provided in the measurement jig to a position that overlaps coaxially with the fixing plate-side through hole, and the transmittance at multiple positions on the object to be measured can be easily measured. Furthermore, according to the transmittance measurement method of the present invention, there is no need to cut the object to be measured to form small sample pieces, as in the conventional method.The object to be measured can be held in a predetermined position as is (product size) and the transmittance can be measured.Therefore, the object to be measured after measurement can be handled as a final product without being disposed of, which is economical.

[0010] Moreover, in the transmittance measuring method according to a second aspect of the present invention, in the above-mentioned first aspect, the measuring jig is made of a resin member. With this configuration, even if the object to be measured is, for example, a film-coated substrate having a thin film (functional film) formed on the main surface of a glass plate, the object to be measured can be stably held by the measurement jig without causing scratches, chips, etc.

[0011] In addition, a transmittance measurement method according to aspect 3 of the present invention is characterized in that, in the above-mentioned aspect 1 or aspect 2, the measurement jig has a connection means consisting of a magnet, and is fixed by being detachably connected to the jig fixing plate via the connection means. With this configuration, the measuring jig can be easily attached to and detached from the jig fixing plate via the connecting means, and the position of the measuring jig fixed to the jig fixing plate can be immediately changed.

[0012] A transmittance measuring method according to a fourth aspect of the present invention is characterized in that in the first or second aspect, only the object to be measured is present on the optical axis of the light beam. With this configuration, for example, there is no risk of light from the light source being blocked by an unexpected object, causing an error in the detection value by the detector, and the transmittance of a desired location on the object to be measured can be measured with high accuracy.

[0013] Furthermore, a transmittance measurement method according to aspect 5 of the present invention is characterized in that, in the above-mentioned aspect 1 or aspect 2, the object to be measured held by the measurement jig between the light source and the detector is positioned on the light source side, and the jig fixing plate is positioned on the detector side. By having such a configuration, it is possible to secure sufficient working space for attaching and detaching the measuring jig to the jig fixing plate, while bringing the measuring jig (more specifically, the object to be measured held by the measuring jig) closer to the detector, thereby enabling the transmittance of the desired location on the object to be measured more accurately.

[0014] A transmittance measuring method according to a sixth aspect of the present invention is characterized in that, in the first or second aspect, the measuring jig and the jig fixing plate are colored black. By having such a configuration, it is possible to prevent a portion of the light beam emitted from the light source from being diffusely reflected by the measurement jig and / or the jig fixing plate without passing through the object to be measured, and the transmittance of the desired location on the object to be measured can be measured more accurately.

[0015] In addition, the manufacturing method of a film-coated substrate according to aspect 7 of the present invention is characterized in that it comprises a film-forming step of forming a thin film on a main surface of a glass plate to obtain a film-coated substrate, and a measurement step of measuring the transmittance of the film-coated substrate as a measurement object using the transmittance measurement method according to aspect 1 or aspect 2 after completion of the film-forming step. By having such a configuration, according to the manufacturing method of a film-coated substrate of the present invention, it is possible to measure the transmittance at a desired position of the film-coated substrate, which is the object to be measured, simply by appropriately changing the position of the measuring jig fixed to the jig fixing plate and changing the position of any jig-side through hole provided in the measuring jig to a position that overlaps coaxially with the jig-side through hole, and the transmittance at multiple positions on the film-coated substrate can be easily measured. Furthermore, according to the method for manufacturing a film-coated substrate of the present invention, there is no need to cut the film-coated substrate to form small sample pieces, and the film-coated substrate can be held in a predetermined position in its original state (product size) to measure the transmittance.Therefore, the film-coated substrate after measurement can be handled as a final product without being subject to disposal, which is economical. Effect of the Invention

[0016] The present invention has the following advantages. That is, according to the transmittance measurement method and the method for manufacturing a film-coated substrate of the present invention, the transmittance of a measurement object (for example, a film-coated substrate) at a plurality of points can be easily measured. [Brief description of the drawings]

[0017] [Figure 1] 1 is a schematic diagram showing an overall configuration of a transmittance measuring device for carrying out a transmittance measuring method according to the present invention. [Diagram 2] FIG. 2 is a plan view showing the overall configuration of the measuring jig. [Diagram 3] FIG. 3 is a diagram showing the overall configuration of the measuring jig, and is a cross-sectional view taken in the direction of an arrow A in FIG. 2. [Figure 4] 1A and 1B are diagrams showing the configuration of a base member, in which (a) is a plan view seen from the front side, and (b) is a plan view seen from the back side. [Diagram 5] 1A and 1B are diagrams showing the configuration of a cover member, in which (a) is a plan view seen from the front side, and (b) is a plan view seen from the back side. [Figure 6] 3A to 3C are process diagrams showing the procedure of each step in a method for manufacturing a film-coated substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Next, one embodiment of the present invention will be described with reference to FIGS.

[0019] [Overall configuration of transmittance measuring device 1] First, the overall configuration of a transmittance measuring device 1 for carrying out a transmittance measuring method according to the present invention will be described with reference to FIG.

[0020] The transmittance measuring device 1 in this embodiment is an apparatus that measures the transmittance at multiple points on a film-coated substrate G having a thin film (functional film) Gb formed on the main surface of a plate glass Ga (see Figure 3), for example as described below.

[0021] Transmittance measuring device 1 is constructed based on a general-purpose spectrophotometer, and mainly comprises a light source 2 that emits white light, an integrating sphere 3 arranged opposite light source 2, a detector 4 supported by integrating sphere 3, and a control device 5 electrically connected to detector 4. The transmittance measuring device 1 also includes a jig fixing plate 7 that supports the film-coated substrate G in a predetermined position via a measuring jig 6 described later, and a sample chamber (not shown) that isolates the light source 2, integrating sphere 3, detector 4, measuring jig 6, and jig fixing plate 7 from the outside and ensures a measurement space when measuring the transmittance of the film-coated substrate G.

[0022] A first opening 31 is provided on the curved surface of integrating sphere 3 at a position facing light source 2, and light beam L emitted from light source 2 is configured to pass through first opening 31 and reach the inner surface of integrating sphere 3. Furthermore, a second opening 32 is provided on the curved surface of integrating sphere 3 at a position other than the position facing light source 2 (for example, in this embodiment, at the upper end position), and detector 4 is supported by integrating sphere 3 in a state in which second opening 32 is blocked via a light receiving unit (not shown) that receives light.

[0023] On the other hand, the control device 5 electrically connected to the detector 4 includes an arithmetic processing unit constituted by a CPU (Central Processing Unit) and a memory unit constituted by a ROM (Read Only Memory), a RAM (Random Access Memory), a HDD (Hard Disk Drive), etc., and the memory unit pre-stores an arithmetic program, etc. for calculating the transmittance of the measurement object (film-coated substrate G) based on the detection value detected by the detector 4.

[0024] The control device 5 may be provided with an input means such as a touch panel, and an output means such as a monitor.

[0025] A white light beam L emitted from the light source 2 is split into monochromatic light by a spectroscope (not shown), and then passes through a film-coated substrate G supported by a jig fixing plate 7 (to be described later). The light beam L then passes through the film-coated substrate G and reaches the inner surface of the integrating sphere 3 through the first opening 31, where it is first scattered and homogenized, and then detected by the detector 4 through the second opening 32.

[0026] The detection value of the light flux L detected by the detector 4 is converted into an electrical signal and transmitted to the control device 5. Then, the control device 5, which receives the electrical signal from the detector 4, executes arithmetic processing in accordance with the arithmetic program based on the electrical signal, and calculates the transmittance of the measurement object (film-coated substrate G). In other words, the transmittance measuring device 1 in this embodiment measures the transmittance of the object to be measured (film-coated substrate G) by transmitting the light beam L emitted from the light source 2 through the object to be measured (film-coated substrate G) and detecting it with the detector 4.

[0027] The jig fixing plate 7 has a rectangular flat fixing plate 71 and a support member 72 that supports the fixing plate 71 on a base 8 provided in the sample chamber. The fixed plate 71 is made of a metallic member that is a magnetic body, and its outer size is set to be larger than the outer size of the measuring jig 6 . The support member 72 may be made of either a magnetic or non-magnetic metal member.

[0028] The jig fixing plate 7 is positioned near the first opening 31 in the integrating sphere 3, between the light source 2 and the detector 4 supported by the integrating sphere 3, with the fixing plate 71 intersecting in a direction approximately perpendicular to the optical axis of the light beam L. Furthermore, the fixed plate 71 is provided with a fixed-plate-side through-hole 71a having a size substantially equal to that of the first opening 31 of the integrating sphere 3, and the jig fixing plate 7 is disposed such that the position of the fixed-plate-side through-hole 71a is substantially coaxial with the first opening 31. In other words, the light flux L emitted from the light source 2 can pass through the jig fixing plate 7 via the fixed-plate-side through-hole 71a.

[0029] In addition, in this embodiment, first opening 31 of integrating sphere 3 and fixed plate side through hole 71a of fixed plate 71 are formed into a circular hole shape having an inner diameter of, for example, about 16 mm.

[0030] In the fixing plate 71, the flat surface 71b on the light source 2 side functions as a fixing surface for fixing the measurement jig 6, and as described below, the attachment and detachment of the measurement jig 6 to the jig fixing plate 7 is performed in the space between the light source 2 and the fixing plate 71.

[0031] Here, the measurement jig 6 holds the film-coated substrate G, which is the object to be measured, and is removably fixed to the flat surface 71b of the fixing plate 71, thereby supporting the film-coated substrate G at a desired predetermined position. The configuration of the measuring jig 6 will be described in detail later.

[0032] Thus, in the transmittance measuring device 1 of this embodiment, between the light source 2 and the detector 4 supported by the integrating sphere 3, the film-coated substrate G held by the measuring jig 6 is positioned on the light source 2 side, and the jig fixing plate 7 (more specifically, fixing plate 71) is positioned on the detector 4 side.

[0033] By having such a configuration, it is possible to secure sufficient working space for attaching and detaching the measuring jig 6 to the jig fixing plate 7, while bringing the measuring jig 6 (more specifically, the film-coated substrate G held by the measuring jig 6) closer to the detector 4, and the transmittance of the desired location on the film-coated substrate G can be measured more accurately.

[0034] [Configuration of measurement jig 6] Next, the configuration of the measuring jig 6 will be described in detail with reference to FIGS.

[0035] As shown in FIG. 2, the measurement jig 6 mainly includes a base member 61 that covers one main surface G1 (see FIG. 3) of the film-coated substrate G, and a cover member 62 that holds the film-coated substrate G together with the base member 61.

[0036] 4(a) and 4(b), the base member 61 is made of a substantially rectangular plate-shaped member, and has a substantially rectangular recessed portion 61a in the center when viewed from above. That is, the base member 61 has a flat bottom surface portion 61b and a substantially rectangular frame-shaped protruding portion 61c that protrudes along the periphery of the bottom surface portion 61b.

[0037] The inner peripheral side surface 61c1 of the protruding portion 61c is provided along the outer shape of the film-coated substrate G (see FIG. 2) and is located slightly closer to the center in a planar view than the outer shape of the film-coated substrate G. Furthermore, a step 61c3 is provided on the inner periphery of a protruding end surface 61c2 of the protruding portion 61c.

[0038] The side surface P of the step portion 61c3 is provided along the peripheral end surface of the film-coated substrate G. Moreover, the depth of the step portion 61c3 (the dimension from the bottom surface Q of the step portion 61c3 to the protruding end surface 61c2) is set to be approximately equal to the thickness of the film-coated substrate G.

[0039] The pedestal member 61 is configured so that the peripheral edge portion of the film-coated substrate G can be fitted thereon via the step portion 61c3. That is, as shown in FIG. 3, the film-coated substrate G is fitted into the step portion 61c3 of the base member 61, so that the peripheral portion of one main surface G1 (in this embodiment, the back surface side) is supported by the bottom surface Q of the step portion 61c3, and the main surface G1 is covered by the bottom surface portion 61b.

[0040] As shown in FIGS. 4(a) and 4(b), the bottom surface portion 61b is provided with a plurality of jig-side through-holes 61d (19 in this embodiment). Each of the jig side through holes 61d has substantially the same shape and outer size as the fixed plate side through holes 71a provided in the jig fixing plate 7 (more specifically, the fixed plate 71) described above. Further, the plurality of jig side through holes 61d are arranged at positions corresponding to a plurality of measurement points set in advance on the film-coated substrate G, respectively.

[0041] In this embodiment, several (12 in this embodiment) jig side through holes 61d·61d··· are provided in a position close to the inner side surface 61c1 of the protruding portion 61c. In order to avoid overlap with these jig side through holes 61d·61d···, several (12 in this embodiment) cutout portions 61c4·61c4··· are provided on the side surface 61c1 of the protruding portion 61c.

[0042] As shown in Figure 2, in the film-coated substrate G held by the measuring jig 6, one (rear side) main surface G1 (see Figure 3) covered by the bottom surface portion 61b is exposed to the outside of the measuring jig 6 only at the locations where the multiple jig-side through holes 61d·61d··· are located.

[0043] As shown in Figures 5(a) and (b), the cover member 62 is made of a plate-like member having a substantially rectangular frame shape, and in a plan view is formed to have substantially the same shape as the protruding end surface 61c2 of the protruding portion 61c of the base member 61 (see Figure 4(a)). Specifically, the shape of the outer periphery of the cover member 62 is formed to be substantially the same as the shape of the outer periphery of the base member 61 (more specifically, the protruding portion 61c). The shape of the inner periphery of the cover member 62 is formed to be substantially the same as the shape of the inner periphery of the side surface 61c1 of the protruding portion 61c.

[0044] Then, as shown in Figure 3, with the film-coated substrate G fitted into the step portion 61c3 of the base member 61, a lid member 62 is stacked on the base member 61 from the other side (the front surface side in this embodiment) of the film-coated substrate G, so that the peripheral portion of the film-coated substrate G is clamped between the base member 61 and the lid member 62. As a result, the film-coated substrate G is held by the measuring jig 6 with one of the main surfaces G1 (rear surface) being covered by the bottom surface portion 61b of the pedestal member 61.

[0045] The base member 61 and the cover member 62 constituting the measuring jig 6 are both made of resin materials such as polyacetal resin. With this configuration, even if the object to be measured is, for example, a film-coated substrate G having a thin film Gb formed on the main surface of a glass plate Ga, the object to be measured (film-coated substrate G) can be stably held by the measurement jig 6 without causing scratches, chips, etc.

[0046] As shown in FIG. 5(b), one main surface 62a of the lid member 62 has a plurality of (four in this embodiment) metal pieces 62b, 62b, 62b, 62b embedded therein. These multiple metal pieces 62b are all made of a magnetic metal member and are disposed at the center of each side of the cover member 62 in the extension direction when viewed from above.

[0047] On the other hand, as shown in FIG. 4(a), a plurality of (four in this embodiment) first connection means 61e made of magnets are embedded in each of the protruding end faces 61c2 of the protruding portion 61c of the base member 61. These first connection means 61e, 61e, 61e, 61e are arranged at positions opposite the metal pieces 62b, 62b, 62b, 62b, respectively, in a state in which the cover member 62 is stacked on the base member 61.

[0048] When the film-coated substrate G is held by the measuring jig 6, the base member 61 and the cover member 62 are fixed in a state in which they are arranged in a stacked manner on each other via the first connecting means 61e and the metal piece 62b.

[0049] The measurement jig 6 holding the film-coated substrate G is fixed to the flat surface 71b of the jig fixing plate 7 (more specifically, the fixing plate 71) with the back surface of the base member 61 (the main surface opposite to the side on which the protruding portion 61c is provided) facing the flat surface 71b on the light source 2 (see Figure 1) side of the jig fixing plate 7 (more specifically, the fixing plate 71). In addition, the measurement jig 6 is fixed to the plane 71b of the fixing plate 71 in a state in which the jig side through hole 61d (for example, the jig side through hole 61d1 in Figure 3), among the multiple jig side through holes 61d·61d··, which is located in the area where the transmittance of the film-coated substrate G is to be measured, is coaxial with the fixing plate side through hole 71a of the fixing plate 71.

[0050] In other words, the film-coated substrate G is supported at a predetermined position by the jig fixing plate 7 via the measuring jig 6 while being held by the measuring jig 6 . In addition, at the above-mentioned specified position, the film-coated substrate G is supported by the jig fixing plate 7 with any one of the jig side through holes 61d1 provided in the measurement jig 6 (more specifically, the base member 61) and the fixing plate side through hole 71a provided in the jig fixing plate 7 (more specifically, the fixing plate 71) coaxially overlapping each other.

[0051] As shown in FIG. 1, a groove 8a is provided in advance on the base 8 provided in the aforementioned sample chamber (not shown) to avoid interference with the measuring jig 6, and the measuring jig 6 is configured to be able to displace its position relative to the fixing plate 71 of the jig fixing plate 7 to a certain extent in the vertical direction via the groove 8a.

[0052] Then, when the measurement jig 6 holding the film-coated substrate G is fixed to the jig fixing plate 7 in the above-described state, only one area of ​​the film-coated substrate G exposed to the outside of the measurement jig 6 by the jig side through hole 61d1 is present on the optical axis of the light beam L emitted from the light source 2.

[0053] Therefore, according to the measurement jig 6 in this embodiment, the light beam L from the light source 2 is not blocked by an unexpected object, for example, and an error does not occur in the detection value by the detector 4, and the transmittance of a desired location on the film-coated substrate G can be accurately measured by the transmittance measuring device 1 described above.

[0054] In this embodiment, both the measurement jig 6 and the jig fixing plate 7 are colored black. By having such a configuration, when the transmittance of a film-coated substrate G is measured using the transmittance measuring device 1, it is possible to prevent a portion of the light beam L emitted from the light source 2 from being diffusely reflected by the measuring jig 6 and / or the jig fixing plate 7 without passing through the film-coated substrate G, and the transmittance of a desired location on the film-coated substrate G can be measured more accurately.

[0055] As shown in Figure 4(b), a plurality of (12 in this embodiment) second connection means 61f·61f..., which are an example of the connection means according to the present invention and are made of magnets, are embedded in the back surface of the base member 61, and these plurality of second connection means 61f·61f... are each arranged along the peripheral portion of the base member 61.

[0056] Then, as shown in Figure 3, the measurement jig 6 holding the film-coated substrate G is fixed by being detachably connected to the flat surface 71b of the jig fixing plate 7 (more specifically, the fixing plate 71) via these multiple second connection means 61f·61f···.

[0057] With this configuration, the measuring jig 6 can be easily attached and detached to the jig fixing plate 7 via the second connection means 61f, and the position of the measuring jig 6 fixed to the jig fixing plate 7 can be immediately changed.

[0058] As described above, the transmittance measurement method in this embodiment is performed by the transmittance measurement apparatus 1 described above, and is a transmittance measurement method in which the light beam L emitted from the light source 2 is transmitted through the film-coated substrate G, which is the object to be measured, and detected by the detector 4, thereby measuring the transmittance of the film-coated substrate G. In the above-mentioned transmittance measurement method, the film-coated substrate G is held by a measurement jig 6, and the measurement jig 6 is fixed to a jig fixing plate 7 (more specifically, fixing plate 71), thereby supporting the film-coated substrate G at a predetermined position.

[0059] Here, the measurement jig 6 holds the film-coated substrate G by clamping it so as to cover one of the main surfaces G1 of the film-coated substrate G with the bottom surface portion 61b of the base member 61, and has a plurality of jig-side through holes 61d·61d··· in the bottom surface portion 61b that expose the one of the main surfaces G1. Further, the jig fixing plate 7 (fixing plate 71) is disposed in a state intersecting the optical axis of the light beam L, and has a fixing plate-side through-hole 71a through which the light beam L can pass.

[0060] Then, at the specified position, the film-coated substrate G is configured to be supported by the jig fixing plate 7 (fixing plate 71) via the measurement jig 6, with one of the jig side through holes 61d and the fixing plate side through hole 71a coaxially overlapping each other.

[0061] By having such a configuration, according to the transmittance measurement method embodied in this embodiment, it is possible to measure the transmittance at a desired position of the film-coated substrate G, which is the object to be measured, simply by appropriately changing the position of the measurement jig 6 fixed to the jig fixing plate 7 and changing the position of any jig side through hole 61d provided in the measurement jig 6 to a position that overlaps coaxially with the fixing plate side through hole 71a, and the transmittance at multiple positions on the object to be measured (film-coated substrate G) can be easily measured.

[0062] Furthermore, according to the transmittance measurement method embodied by this embodiment, there is no need to cut the object to be measured (film-coated substrate G) to form small-sized sample pieces, as in the conventional method. The transmittance can be measured by holding the object (film-coated substrate G) in a predetermined position as is (product size). Therefore, the object to be measured (film-coated substrate G) after measurement can be handled as a final product without being subject to disposal, which is economical.

[0063] [Method of manufacturing film-coated substrate G]

[0064] Next, a method for producing a film-coated substrate, which includes a step of measuring the transmittance of the obtained film-coated substrate G by the above-mentioned transmittance measuring method, will be described with reference to FIG.

[0065] The manufacturing method of the film-coated substrate G mainly includes a film-forming process S01 in which a thin film (functional film) Gb is formed on a main surface of a glass plate Ga to obtain a film-coated substrate G, and a measurement process S02 in which, after completion of the film-forming process S01, the transmittance of the obtained film-coated substrate G is measured using the transmittance measurement method described above, with the film-coated substrate G being used as the measurement object.

[0066] In the film formation process S01, the film formation method for forming a thin film Gb on the main surface of the plate glass Ga is not particularly limited, and may be any film formation method, such as a film formation method using a general-purpose carousel-type sputtering apparatus (film formation apparatus).

[0067] In addition, for the plate glass Ga, which is the film-forming object in this embodiment, for example, a glass substrate represented by a flat panel display (FPD) such as a liquid crystal display, a plasma display, or an organic EL display, or a cover glass of a portable electronic device, etc. can be used. For the thin film Gb formed on the main surface of the glass plate Ga, for example, an anti-reflection film for reducing reflectance, a half mirror film, or a reflective film for increasing reflectance can be used.

[0068] In the measurement step S02, the produced film-coated substrates G are randomly sampled as sample substrates, and the transmittance of the sample substrates is measured using the transmittance measurement method described above as a measurement object.

[0069] Although one embodiment of the present invention has been described above, the present invention is not limited to such an embodiment, which is merely illustrative, and it is of course possible to embody the present invention in various other forms without departing from the spirit of the present invention. The scope of the present invention is indicated by the description of the claims, and further includes the equivalent meanings described in the claims, and all modifications within the scope of the claims. [Explanation of symbols]

[0070] 2 light source 4. Detector 6 Measuring fixture 61d Jig side through hole 61f Second connection means (connection means) 7 Jig fixing plate 71a Fixed plate side through hole G Film-coated substrate (measurement object) G1 main surface Ga plate glass Gb thin film L luminous flux S01 Film formation process S02 Measurement process

Claims

1. A transmittance measurement method for measuring the transmittance of a measurement object by transmitting a light beam emitted from a light source through the measurement object and detecting the light beam with a detector, comprising: The measurement object is held by a measurement jig, and the measurement jig is fixed to a jig fixing plate to support the measurement object at a predetermined position; The measuring tool is The measurement object is held by clamping the measurement object so as to cover one of the main surfaces of the measurement object, and a plurality of jig-side through holes exposing the one main surface; The jig fixing plate is A light source is disposed in a state where the light source intersects with the optical axis of the light beam, a through hole on a fixed plate side through which the light beam can pass; At the predetermined position, The object to be measured is Any one of the jig-side through holes and the fixing plate-side through holes are supported in a state where they are coaxially overlapped with each other. A method for measuring transmittance.

2. The measuring jig is made of a resin member. The transmittance measuring method according to claim 1 .

3. The measuring tool is A connecting means is provided, The jig is fixed by being detachably connected to the jig fixing plate via the connecting means. The transmittance measuring method according to claim 1 or 2,

4. On the optical axis of the light beam, Only the object to be measured is present; The transmittance measuring method according to claim 1 or 2,

5. Between the light source and the detector, The measurement object held by the measurement tool is located on the light source side, The jig fixing plate is located on the detector side. The transmittance measuring method according to claim 1 or 2,

6. The measurement jig and the jig fixing plate are colored black. The transmittance measuring method according to claim 1 or 2,

7. a film-forming step of forming a thin film on a main surface of the glass plate to obtain a film-coated substrate; After the film formation process is completed, the transmittance measurement method according to claim 1 or 2 is used to measure the transmittance. and a measuring step of measuring the transmittance of the obtained film-coated substrate as a measurement object. The present invention relates to a method for producing a film-coated substrate.

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