Optical module and optical communication device

Abstract

SOLUTION: To provide an optical module in which a plurality of optical ICs is mounted on a first mounting surface of a module substrate by mutually differing their positions in a first direction, to perform photoelectric conversion, and in which a plurality of fiber bundles each includes a plurality of optical fibers extending in parallel to each other, and extends from the plurality of optical ICs to a first side in a second direction, and further, in which a plurality of optical connectors is positioned at an end on the opposite side of the plurality of optical ICs of the plurality of fiber bundles, and are connected to an external optical element so as to allow transmission of optical signals, and at least one control IC is mounted on the module substrate to control at least one of the plurality of optical ICs, and at least one power source IC is mounted on the module substrate to supply electric power to at least one of the plurality of optical ICs.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to an optical module that performs at least one of conversion from an optical signal to an electrical signal and conversion from an electrical signal to an optical signal, and an optical communication device that includes the optical module. [Background technology]

[0002] Devices that convert between optical signals and electrical signals are known (for example, see Patent Document 1 below). In Patent Document 1, multiple optical communication devices are mounted on a host circuit board. Each optical communication device is configured to be capable of inputting and / or outputting multi-channel optical signals. As a result, in Patent Document 1, one host circuit board can transmit optical signals with a number of channels equal to the number of channels of each optical communication device multiplied by the number of optical communication devices. Each optical communication device is mounted on the host circuit board by a connector. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2003-98392 A Summary of the Invention

[0004] An optical module according to an embodiment of the present disclosure includes a module substrate, a plurality of optical ICs, a plurality of fiber bundles, a plurality of optical connectors, at least one control IC, and at least one power supply IC. The module substrate has a first surface extending in a first direction and a second direction perpendicular to the first direction. The plurality of optical ICs are mounted on the first surface at different positions in the first direction and perform photoelectric conversion. The plurality of fiber bundles each have a plurality of optical fibers extending in parallel with each other and extend from the plurality of optical ICs to a first side in the second direction. The plurality of optical connectors are located at ends of the plurality of fiber bundles opposite to the plurality of optical ICs and are connected to external optical elements so as to be capable of transmitting optical signals. The at least one control IC is mounted on the module substrate and controls at least one of the plurality of optical ICs. The at least one power supply IC is mounted on the module substrate and supplies power to at least one of the plurality of optical ICs.

[0005] An optical communication device according to one aspect of the present disclosure includes the optical module described above and a motherboard electrically connected to the optical module. [Brief description of the drawings]

[0006] [Figure 1] FIG. 1 is an exploded perspective view of an optical module according to an embodiment of the present disclosure. [Diagram 2] 2 is an exploded perspective view of the optical module of FIG. 1, seen from a different direction than FIG. 1; [Diagram 3] 2 is a schematic diagram showing an example of the configuration of a signal processing system of a part of the optical module shown in FIG. 1; [Figure 4A] FIG. 11 is a schematic plan view showing another example of the arrangement of a plurality of optical ICs included in the optical module. [Figure 4B] FIG. 13 is a schematic plan view showing yet another example of the arrangement of a plurality of optical ICs included in the optical module. [Diagram 5] FIG. 13 is a schematic plan view showing another example of the configuration of a signal processing system of the optical module. [Figure 6] FIG. 13 is an exploded perspective view showing another example of a cooling part of the optical module. [Figure 7A] FIG. 7 is a cross-sectional view taken along line VIIa-VIIa in FIG. [Figure 7B] FIG. 7 is a cross-sectional view taken along line VIIb-VIIb in FIG. [Figure 7C] FIG. 7 is a side view of the cooling component of FIG. 6 . [Figure 8A] FIG. 11 is a cross-sectional view showing yet another example of a cooling component. [Figure 8B] 8B is a cross-sectional view showing the cooling component of FIG. 8A in a state different from that of FIG. 8A. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. The drawings used in the following description are schematic. Therefore, for example, the dimensional ratios in the drawings do not necessarily match the actual ones. In addition, the illustration of details may be omitted, and some shapes may be illustrated in an exaggerated manner. For convenience, an orthogonal coordinate system xyz is attached to the drawings. The relationship between the orthogonal coordinate system xyz and the vertical direction, etc. is arbitrary.

[0008] In the following, one embodiment (FIGS. 1 to 3) will be described first, and then various other examples (FIGS. 4A to 8B) will be described. In the description of the other examples, basically, only the differences from the previously described aspects (embodiments, etc.) will be described. Matters that are not specifically mentioned may be considered to be the same as or may be inferred from the previously described aspects. Furthermore, the description of one aspect may be applied to other aspects as long as no contradiction arises.

[0009] (Outline of optical module configuration) Fig. 1 is an exploded perspective view of an optical module 1 according to an embodiment of the present disclosure, as viewed from the +z side. Fig. 2 is an exploded perspective view of the optical module 1, as viewed from the -z side.

[0010] The optical module 1 performs at least one of conversion from an optical signal to an electrical signal and conversion from an electrical signal to an optical signal. The optical module 1 is configured to be capable of inputting and / or outputting multi-channel optical signals.

[0011] The optical module 1 is electrically connected, for example, to an external electronic device (for example, the motherboard 3 shown by the dotted line in FIG. 2). The optical module 1 is also optically connected to an optical element (for example, an optical waveguide not shown) external to the optical module 1. The optical module 1 contributes to the transmission of signals between the motherboard 3 and a counterpart device (not shown) connected to the end of the optical waveguide (or a counterpart device having an optical waveguide; the same applies below). From another perspective, the optical module 1 contributes to the transmission of information between the motherboard 3 and the counterpart device.

[0012] The optical waveguide may be an optical fiber or may have a sheet-like or plate-like structure. The optical module 1 may be optically connected to an external light-emitting element or light-receiving element without an external optical waveguide. However, in the description of this embodiment, the optical module 1 may be expressed on the assumption that it is connected to an external optical waveguide. The optically connected counterpart device may be, for example, another electronic device that performs optical communication with the electronic device including the motherboard 3, or may be a device within the electronic device including the motherboard 3.

[0013] The division of roles between the motherboard 3 and the optical module 1 may be appropriately set. For example, the optical module 1 does not substantially modify information contained in the input and / or output optical signal, but contributes only to the transmission of information. Furthermore, the optical module 1 does not perform signal modulation and / or demodulation, signal frequency change, signal filtering, or AD conversion of the signal, but only performs photoelectric conversion and signal amplification. However, at least a part of the processes described above as not being performed by the optical module 1 may be performed by the optical module 1. Furthermore, the optical signal and / or electrical signal input and / or output to the optical module 1 may be, for example, a binary digital signal or a signal in another format.

[0014] To realize the above-mentioned operations, the optical module 1 includes, for example, the following components. Module board 5 A plurality of optical ICs 7 (four in the illustrated example) mounted on the module board 5 for photoelectric conversion A plurality of fiber bundles 9 (as many as the optical ICs 7) extending from the plurality of optical ICs 7 A plurality of optical connectors 11 (the same number as the fiber bundles 9) located on the opposite side of the plurality of optical ICs 7 of the plurality of fiber bundles 9 At least one control IC 13 (one in the illustrated example) mounted on the module board 5 and controlling the multiple optical ICs 7 At least one power supply IC 15 (one in the illustrated example) mounted on the module board 5 and supplying power to the multiple optical ICs 7 An electrical connector 17 that is mounted on the module substrate 5 and electrically connected to an external electronic device (here, the motherboard 3) for the optical module 1. Passive components 19 mounted on module board 5 A cooling component 21 (heat sink in the illustrated example) that contributes to cooling the multiple optical ICs 7

[0015] Each fiber bundle 9 has a plurality of (four in the illustrated example) optical fibers 23 extending in parallel to each other. In other words, each optical IC 7 is capable of inputting and / or outputting multi-channel optical signals. The optical module 1 is capable of inputting and / or outputting optical signals with a number of channels equal to the total number of channels of the plurality of optical ICs 7.

[0016] The module board 5 has a plurality of optical ICs 7 mounted thereon, as well as a control IC 13, a power supply IC 15, and an electrical connector 17 mounted thereon. This constitutes the optical module 1. This allows for a smaller size compared to a configuration in which the optical ICs 7 are attached to a circuit board via a connector. The optical module 1 does not necessarily need to include the passive components 19 and the cooling component 21.

[0017] In this disclosure, when it is said that an IC (7, 13, 15, etc.) is mounted on module substrate 5, the IC is joined to module substrate 5 by a conductive joining material (not shown) such as solder (including lead-free solder). Therefore, for example, a mode in which the IC is detachably disposed on module substrate 5 by a connector is not included in the term "mounted" here.

[0018] In addition, in the present disclosure, when ICs are mounted on a module substrate, the number of ICs may be counted based on the unit of direct mounting on the module substrate 5. For example, multiple optical ICs 7 are not conceptually regarded as one IC as a whole. Conversely, even if one optical IC 7 includes multiple IC chips, one optical IC 7 is not regarded as multiple ICs.

[0019] 1 and 2, the configuration of the components of the optical module 1 will be roughly described in the order listed above. Then, an example of the processing of the optical IC 7 and the control IC 13 will be described with reference to FIG.

[0020] (Module board) The module substrate 5 is, for example, a flat-plate member. The front and back of the flat plate are a first mounting surface 5a and a second mounting surface 5b on which electronic components (such as the optical IC 7) are mounted, respectively. The module substrate 5 is, for example, a rigid printed wiring board. In a rigid printed wiring board, the basic configuration (excluding a specific configuration according to the arrangement of the optical IC 7, etc.) may be various configurations, for example, a known configuration.

[0021] For example, the printed wiring board may be a double-sided board or a multi-layer board on which electronic components (here, an optical IC 7 or the like) can be mounted on both sides. The double-sided board has a plate-shaped insulator and conductor layers (not shown) overlapping both sides of the insulator. The multi-layer board has a plate-shaped insulator and three or more conductor layers (not shown) located on both sides and inside the insulator. The conductor layers may be connected to each other, for example, by solid or hollow via conductors (not shown) that penetrate a part or all of the thickness of the insulator. The conductor layers on the front and back of the insulator may be partially covered with an insulating film (solder resist). Unlike the example shown in the figure, the printed wiring board may be a single-sided board in which a conductor layer is formed only on one side of the plate-shaped insulator.

[0022] Also, for example, in a printed wiring board, the material of the insulator and the material of the conductor may be appropriate. For example, the insulator may be made of an organic material, an inorganic material, or a combination of these. More specifically, the insulator may be, for example, a substrate such as glass cloth impregnated with resin, or may be ceramic. The conductor may be a metal such as copper. For example, the conductor layer may be made of substantially the same material as a whole, or may be made of two or more layers that are partly or entirely made of different materials. For example, the via conductor may be made of the same material as a whole, or may be made of different materials on the inside and outside.

[0023] Conductors (conductor layers and via conductors) (not shown) of the module substrate 5 may include portions with appropriate functions. For example, the conductors may have lands on which various electronic components (7, 13, 15, 17, and 19) are mounted, and wiring that connects the lands to each other. The lands may be pads for surface mounting or may be for through-hole mounting. In addition to the above, the conductors may also include portions that constitute electronic elements. The electronic elements are, for example, passive elements such as resistors, inductors, or capacitors.

[0024] The planar shape and various dimensions of the module substrate 5 may be set appropriately depending on the number and sizes of electronic components (such as the optical IC 7) mounted on the module substrate 5. In the illustrated example, the planar shape of the module substrate 5 is rectangular having four sides parallel to the x or y direction. As an example of the dimensions of a relatively small optical module 1, the length of each side of the module substrate 5 in a plan view is 30 mm or more and 50 mm or less. If the module substrate 5 is not rectangular, each side of the smallest rectangle that encompasses the module substrate 5 may satisfy the above-mentioned dimensional range.

[0025] (Optical IC7) The configurations of the multiple optical ICs 7 are, for example, the same as each other. Unlike the illustrated example, the configurations of at least some of the optical ICs 7 may be different from the configurations of other optical ICs 7 in terms of their internal configuration and / or external configuration. For example, some of the optical ICs 7 may be configured to transmit optical signals, and the remaining optical ICs 7 may be configured to receive optical signals. In addition, the number of channels of some of the optical ICs 7 may be different from the number of channels of the other optical ICs 7. Note that, for convenience, in the description of this embodiment, expressions may be used assuming that the multiple optical ICs 7 have the same configuration as each other.

[0026] The optical IC 7 is a generally thin (z-direction length is shorter than the x- and y-direction lengths) rectangular parallelepiped component. A fiber bundle 9 (multiple optical fibers 23) extends from one face (the face on the +x side) of the rectangular parallelepiped. The optical IC 7 performs photoelectric conversion on multiple optical signals transmitted by the multiple optical fibers 23. The optical IC 7 may have, for example, an electronic element (described later) such as a photoelectric conversion element, and a package 7a that houses the electronic element. The size of the optical IC 7 (package 7a) may be set appropriately depending on the number and diameter of the optical fibers 23, and the number and size of the electronic elements therein.

[0027] Except for the optical fiber 23 extending out, the package 7a of the optical IC 7 may have various configurations, for example, may be the same as a known configuration. For example, the material of the sealing portion 7b of the package 7a may be ceramic or resin. The package 7a may be surface mounted (as in the illustrated example) or through-hole mounted. In the case of surface mounting, the terminal 7c may be a pin (as in the illustrated example) or a pad (or a bump bonded to a pad). The shape and number of the pins are arbitrary. In the illustrated example, a mode in which pins extend as terminals from two side surfaces along the xz plane is shown. In the description of the embodiment, for convenience, expressions based on this mode may be used.

[0028] The multiple optical ICs 7 are mounted together on the first mounting surface 5a of the module substrate 5. The multiple optical ICs 7 are mounted, for example, so that the directions in which the fiber bundles 9 extend are the same. The multiple optical ICs 7 are mounted, for example, at different positions in a direction perpendicular to the direction in which the fiber bundles 9 extend (y direction) so that the multiple fiber bundles 9 do not overlap each other. In the illustrated example, the multiple optical ICs 7 are aligned in a row in the y direction. In other words, the positions of the multiple optical ICs 7 in the x direction are the same. The pitch of the arrangement is, for example, constant.

[0029] When it is said that the positions of electronic components in a planar view are the same or different, for example, the positions of the geometric centers of the electronic components in a planar view may be referenced.

[0030] The number of optical ICs 7 may be any number equal to or greater than 2. In the illustrated example, four optical ICs 7 are illustrated. This is merely an example, and the number of optical ICs 7 may be two, or ten or more. It does not matter whether the number is an odd number or an even number.

[0031] The positions and arrangement ranges of the multiple optical ICs 7 in the x and y directions are arbitrary. For example, when the module substrate 5 is divided into thirds in the x direction, each optical IC 7 may fit in any of the regions, or may span two or more regions. The center of each optical IC 7 may coincide with the center of the module substrate 5 in the x direction, or may be located on the +x side or -x side. The center of the arrangement range of the entire multiple optical ICs 7 in the y direction may coincide with the center of the module substrate 5 in the y direction (in the illustrated example), or may be located on the +y side or -y side.

[0032] However, from the viewpoint of miniaturization, the pitch of the multiple optical ICs 7 may be relatively small, and the difference between the length of the module substrate 5 in the y direction and the length of the arrangement range in the y direction of the multiple optical ICs 7 as a whole may be small. For example, the pitch of the multiple optical ICs 7 may be the minimum size that does not cause a short circuit between adjacent optical ICs 7. Furthermore, the arrangement range in the y direction of the multiple optical ICs 7 as a whole (for example, the minimum rectangular range that includes all the optical ICs 7) may be 2 / 3 or more, 3 / 4 or more, or 4 / 5 or more of the length of the module substrate 5 in the y direction.

[0033] Unlike the illustrated example, an optical IC 7 may be mounted on the second mounting surface 5b. Also, an optical IC 7 may have a fiber bundle 9 extending in a direction other than the +x side.

[0034] (fiber bundle) The configurations of the multiple fiber bundles 9 are, for example, identical to each other. Unlike the illustrated example, the configurations of at least some of the fiber bundles 9 may be different from the configurations of the other fiber bundles 9. For example, the number of optical fibers 23 included in some of the fiber bundles 9 may be different from the number of optical fibers 23 included in the other fiber bundles 9. Furthermore, for example, the length of some of the fiber bundles 9 may be different from the length of the other fiber bundles 9.

[0035] In each fiber bundle 9, the multiple optical fibers 23 may or may not be covered with a sheath and bundled. The drawings in the present disclosure illustrate an embodiment in which no sheath is provided in order to clearly show that the fiber bundle 9 has optical fibers 23. Note that, as is clear from the fact that the multiple optical fibers 23 do not have to be bundled, when the multiple optical fibers 23 extend in parallel, the multiple optical fibers 23 do not need to extend parallel to each other.

[0036] The number of optical fibers 23 included in each fiber bundle 9 may be any number equal to or greater than two. In the illustrated example, four optical fibers 23 are illustrated. This is merely an example, and the number of optical fibers 23 included in each fiber bundle 9 may be two, or ten or more. It does not matter whether the number is an odd number or an even number.

[0037] In each fiber bundle 9, the optical fibers 23 may be arranged arbitrarily in the cross section. In the illustrated example, all the optical fibers 23 are arranged in a row in one radial direction (y direction) of the optical fibers 23 at least inside the optical IC 7 and inside the optical connector 11. In the optical IC 7, the arrangement direction of the optical fibers 23 is, for example, the longitudinal direction of the side surface (+x side surface) of the optical IC 7, and from another point of view, the direction along the first mounting surface 5a of the module substrate 5. Unlike the illustrated example, the optical fibers 23 may be arranged in two or more rows, or may be arranged in a manner that does not match the concept of arrangement.

[0038] Each optical fiber 23 may have various configurations, for example, a known configuration. For example, although not particularly shown, the optical fiber 23 has a core and a cladding that covers the core and has a higher refractive index than the core. The core and the cladding are made of a light-transmitting material (for example, quartz glass or plastic). The optical fiber 23 may further have a coating made of an appropriate material (for example, resin or fiber) that covers the cladding. Also, for example, the optical fiber 23 may be a single mode or a multimode. The diameter of the optical fiber 23 is arbitrary.

[0039] The optical fibers 23, for example, have a certain degree of flexibility. In turn, the fiber bundle 9 has flexibility. Therefore, the optical connector 11 can be oriented in various directions other than the direction illustrated in the drawings. In the illustrated example, the optical fibers 23 are arranged in the y direction, so that bending deformation in the z direction is relatively easy.

[0040] The fiber bundle 9 is fixed to the optical IC 7 so as not to be removable. In other words, the fiber bundle 9 cannot be separated from the optical IC 7 without destroying the optical IC 7. For example, the fiber bundle 9 and the sealing portion 7b are fixed by an adhesive or by direct contact, and / or the sealing portion 7b is fastened to the fiber bundle 9. The same may be true for the fixing of the fiber bundle 9 to the optical connector 11. However, the optical connector 11 may be configured by fixing two or more members by screws or the like, and some or all of the members may be separable from the fiber bundle 9.

[0041] (Optical connector) The optical connector 11 is removably connected to a mating connector (not shown) of an external optical waveguide (not shown) of the optical module 1, and optically connects the optical IC 7 to the external optical waveguide. The configurations of the multiple optical connectors 11 are, for example, identical to each other. Unlike the illustrated example, the configurations of at least some of the optical connectors 11 may be different from the configurations of the other optical connectors 11.

[0042] Each optical connector 11 (and the mating connector) may have various configurations, for example, a known configuration. For example, the optical connector 11 and the mating connector may be positioned in the radial direction of the optical fiber 23 by inserting (fitting) one housing into the other housing, and / or the optical fiber 23 may be positioned in the radial direction by inserting (fitting) a guide pin provided in one connector into a guide hole provided in the other connector. The end face of the optical fiber 23 and the end face of the external optical waveguide may directly face each other, or may be optically connected via an optical component (e.g., a lens) provided in at least one of the connectors.

[0043] (Control IC) The control IC 13 is mounted on the module substrate 5 and is electrically connected to at least one optical IC 7 via a conductor (wiring) of the module substrate 5. The control IC 13 inputs a control signal to the at least one optical IC 7. The specific operation of the optical IC 7 controlled by the control IC 13 may be various, and an example will be shown later with reference to FIG.

[0044] The number of control ICs 13 is arbitrary. In the illustrated example, only one control IC 13 is provided, and the one control IC 13 controls all the optical ICs 7. Unlike the illustrated example, for example, the same number of control ICs 13 as the number of optical ICs 7 may be provided, and one control IC 13 may control only one optical IC 7. Also, for example, the number of control ICs 13 may be two or more, and may be less than the number of the optical ICs 7, or the number of control ICs 13 may be greater than the number of the optical ICs 7. From another perspective, the number of optical ICs 7 to be controlled may differ between the control ICs 13, or two or more control ICs 13 may perform different controls on one optical IC 7. As described above, the optical module 1 may have at least one control IC 13 that controls at least one optical IC 7.

[0045] As can be understood from the above description, in an embodiment in which a plurality of control ICs 13 are provided, the configurations of the plurality of control ICs 13 may be the same as each other in terms of internal configuration and / or external configuration, or may be different from each other. In addition, the configuration of the control IC 13 may be various configurations, and may be a known configuration, for example, except for a specific configuration according to the processing content, etc. The above-mentioned description of the package 7a of the optical IC 7 may be used for the package (reference numerals omitted) of the control IC 13, unless a contradiction occurs. Unlike the optical IC 7, the control IC 13 does not have a fiber bundle 9 extending therefrom, and therefore may have pin-shaped terminals (reference numerals omitted) on four side surfaces, unlike the illustrated example.

[0046] The control IC 13 may be mounted at any position. In the illustrated example, the control IC 13 is mounted on the first mounting surface 5a. In other words, the control IC 13 is mounted on the same mounting surface as the mounting surface on which the multiple optical ICs 7 are mounted. Unlike the illustrated example, one or multiple control ICs 13 may be mounted on the second mounting surface 5b. Furthermore, the multiple control ICs 13 may be distributed and mounted on the first mounting surface 5a and the second mounting surface 5b.

[0047] (Power IC) The power supply IC 15 is mounted on the module substrate 5, and is electrically connected to at least one optical IC 7 via a conductor (wiring) of the module substrate 5. The power supply IC 15 supplies power to the at least one optical IC 7.

[0048] The number of power supply ICs 15 is arbitrary. In the illustrated example, only one power supply IC 15 is provided, and one power supply IC 15 supplies power to all optical ICs 7. Unlike the illustrated example, for example, the same number of power supply ICs 15 as the number of optical ICs 7 may be provided, and one power supply IC 15 may supply power to only one optical IC 7. Also, for example, two or more power supply ICs 15 may be provided, which is less than the number of the optical ICs 7, or more than the number of the optical ICs 7. From another perspective, the number of optical ICs 7 to which power is supplied may differ between the power supply ICs 15, or two or more power supply ICs 15 may supply different powers to one optical IC 7. As described above, the optical module 1 may have at least one power supply IC 15 that supplies power to at least one optical IC 7.

[0049] As can be understood from the above description, in an embodiment in which a plurality of power supply ICs 15 are provided, the configurations of the plurality of power supply ICs 15 may be the same as each other in terms of internal configuration and / or external configuration, or may be different from each other. The configuration of the power supply IC 15 may be various configurations, and may be a known configuration, for example, except for a specific configuration according to the role content, etc. The above description of the package 7a of the optical IC 7 may be used for the package (reference numerals omitted) of the power supply IC 15, unless a contradiction occurs. Unlike the optical IC 7, the power supply IC 15 does not have a fiber bundle 9 extending therefrom, and therefore may have pin-shaped terminals (reference numerals omitted) on four side surfaces, unlike the illustrated example.

[0050] The power supply IC 15 may be configured as, for example, a DC (Direct Current) / DC converter. For example, the power supply IC 15 converts DC power supplied from the outside (motherboard 3) via the electrical connector 17 into DC power of an appropriate voltage or current and supplies it to the optical IC 7. The power supply IC 15 may be a constant voltage power supply or a constant current power supply. The power supply IC 15 may be capable of supplying a plurality of types of power with different voltages or currents, or may be capable of supplying one type of power. Unlike the above description, the power supply IC 15 may be a converter other than a DC / DC converter. The power supply IC 15 may or may not contribute to the power supply to the control IC 13. Unlike the illustrated example, another power supply IC may be interposed between the electrical connector 17 and the power supply IC 15.

[0051] The power supply IC 15 may be mounted at any position. In the illustrated example, the power supply IC 15 is mounted on the first mounting surface 5a. In other words, the power supply IC 15 is mounted on the same mounting surface as the mounting surface on which the multiple optical ICs 7 are mounted. Unlike the illustrated example, one or more power supply ICs 15 may be mounted on the second mounting surface 5b (a surface on which the optical IC 7 is not mounted). Furthermore, the multiple power supply ICs 15 may be distributed and mounted on the first mounting surface 5a and the second mounting surface 5b.

[0052] (Electrical Connector) The electrical connector 17 is removably connected to a mating connector (not shown) of the motherboard 3 (or a cable connecting the motherboard 3 and the optical module 1) to electrically connect the module substrate 5 and the motherboard 3. The electrical connector 17 (or, from another point of view, the motherboard 3 connected to the electrical connector 17) is electrically connected to electronic components mounted on the module substrate 5 via conductors (wiring) of the module substrate 5. For example, the electrical connector 17 is connected to the optical IC 7, the control IC 13, and the power supply IC 15 directly or indirectly via other electronic elements. The other electronic elements are, for example, active elements or passive elements mounted on the module substrate 5, or passive elements constituted by the conductors of the module substrate 5.

[0053] The number of electrical connectors 17 is arbitrary. In the illustrated example, only one electrical connector 17 is provided. Unlike the illustrated example, in an embodiment in which two or more electrical connectors 17 are provided, the two or more electrical connectors 17 may be connected to the same device (here, the motherboard 3) or may be connected to different devices.

[0054] The electrical connector 17 may be mounted at any position. In the illustrated example, the electrical connector 17 is mounted on the second mounting surface 5b (the surface on which the optical IC 7 is not mounted) and engages with a connector of a mating device in the z direction. Unlike the illustrated example, one or more electrical connectors 17 may be mounted on the first mounting surface 5a (the surface on which the optical IC 7 is mounted), or may be disposed on an edge of the module substrate 5 and engage with an electrical connector of a mating device in a direction along the module substrate 5. Furthermore, the multiple electrical connectors 17 may be distributed and mounted on the first mounting surface 5a and the second mounting surface 5b.

[0055] Each electrical connector 17 (and the mating connector) may have various configurations, for example, known configurations. For example, the electrical connector 17 and the mating connector may be positioned relative to each other by inserting (fitting) one housing into the other housing, and / or may be positioned relative to each other by contact between terminals. Also, for example, the electrical connector 17 and the mating connector may be electrically connected to each other by inserting a plurality of pin-shaped terminals of one connector into a plurality of cylindrical terminals of the other connector, or may be electrically connected to each other by abutting a plurality of layered terminals formed on the surface of a substrate of one connector against leaf spring-shaped terminals provided in a recess of the other connector.

[0056] (Passive Components) The passive components 19 are, for example, resistors, capacitors, or inductors. One passive component 19 may be interposed between any two of the electrical connector 17, the optical IC 7, the control IC 13, and the power supply IC 15, and contribute to impedance matching. The number, function (resistor, capacitor, inductor, etc.), shape (chip type, etc.), size, mounting method (surface mounting, through-hole mounting, etc.), mounting position, etc. of the passive components 19 are arbitrary.

[0057] (Cooling parts) The cooling component 21 (heat sink) is made of a material with high thermal conductivity. The cooling component 21 is thermally connected to at least one of the module substrate 5 and the electronic components mounted on the module substrate 5 directly or via another material (e.g., grease). As a result, the cooling component 21 contributes to improving the heat dissipation of the optical module 1. An example of a material with high thermal conductivity is metal (e.g., aluminum). For example, the entire cooling component 21 may be integrally formed from the same material. For example, the cooling component 21 is disposed on the first mounting surface 5a side of the module substrate 5. Although not particularly shown, a cooling component disposed on the second mounting surface 5b side of the module substrate 5 may be provided instead of or in addition to the cooling component 21.

[0058] The cooling component 21 may have a plurality of fins 21d. The surface area of ​​the cooling component 21 is increased by the plurality of fins 21d, and the heat dissipation performance is improved. In the illustrated example, the plurality of fins 21d protrudes to the +z side (the side opposite to the first mounting surface 5a with respect to the cooling component 21) and extends along the first mounting surface 5a. The thickness (length in the y direction in the illustrated example), height (length in the z direction), extension length (length in the x direction in the illustrated example), extension direction (x direction or y direction, etc.), pitch, number, etc. of the plurality of fins 21d may be arbitrary. Instead of the plurality of fins 21d, a plurality of pins protruding to the +z side and arranged two-dimensionally on the xy plane may be provided.

[0059] In the illustrated example, the cooling component 21 is configured to function as a housing for protecting the electronic components (7, 13, 15, etc.) mounted on the first mounting surface 5a. Specifically, the cooling component 21 has a recess 21a formed on a surface facing the first mounting surface 5a. From another perspective, the cooling component 21 has an annular wall portion (four wall portions 21b along the four sides from another perspective) extending along the edge of the surface facing the first mounting surface 5a. The cooling component 21 is disposed on the first mounting surface 5a so that the top surfaces (surfaces on the -z side) of the four wall portions 21b abut against the first mounting surface 5a. The electronic components mounted on the first mounting surface 5a are accommodated in the recess 21a.

[0060] The wall 21b on the +x side has a notch 21c formed therein to lower the height of the wall 21b. This allows the fiber bundle 9 to extend to the outside of the cooling component 21. In the illustrated example, a plurality of notches 21c are formed, and each notch 21c allows one fiber bundle 9 to extend. Unlike the illustrated example, the number of notches 21c may be one or a plurality less than the number of fiber bundles 9, and each notch 21c may allow two or more fiber bundles 9 to extend. The shape and dimensions of the notch 21c are arbitrary. For example, the depth (length in the z direction) of the notch 21c may be smaller than the height (length in the z direction) of the wall 21b (in the illustrated example) or may be equal to it.

[0061] The cooling component 21 may have, on a surface facing the first mounting surface 5a, protrusions 25 (25A to 25D) that contribute to contact with the first mounting surface 5a and / or electronic components mounted on the first mounting surface 5a (for example, the surface on the +z side thereof). In the illustrated example, a plurality of protrusions 25A that individually contact the plurality of optical ICs 7, a protrusion 25B that contacts the control IC 13, a protrusion 25C that contacts the power supply IC 15, and a protrusion 25D that contacts the first mounting surface 5a are exemplified. The wall portion 21b may be regarded as an example of the protrusion 25. The protrusion 25 may also be provided in an embodiment in which the cooling component 21 does not function as a housing.

[0062] The shape and size of the protrusion 25 are arbitrary. For example, in the illustrated example, a protrusion 25 is provided for each IC, but one protrusion 25 may contact two or more ICs (which may be the same type or different types). In addition, the contact area between one protrusion 25 and one IC may or may not occupy a large portion (e.g., 80% or more) of the area of ​​the top surface (surface on the +z side) of the IC. In the illustrated example, the protrusions 25B and 25C contact most of the top surfaces of the control IC 13 and the power supply IC 15. On the other hand, the protrusion 25A contacts the top surface of the optical IC 7 in a range that overlaps the processing unit 29 (FIG. 3 to be described later) and does not overlap the conversion unit 27 (FIG. 3 to be described later) in a planar perspective view, and the contact area is 30% or more and less than 80% of the area of ​​the top surface of the optical IC 7. The protrusion 25D may not be provided, or may be provided over a wider range than the illustrated example.

[0063] The cooling component 21 (protruding portion 25 from another point of view) may be in direct contact with the cooling target (first mounting surface 5a or electronic component) or indirectly in contact with the cooling target via another material. An example of the other material is grease. Another example of the other material is a sheet having high thermal conductivity and elasticity that is attached to the protruding portion 25 and / or the cooling target. The sheet attached to the protruding portion 25 may be regarded as a part of the protruding portion 25. Unlike the example shown in the figure, the protruding portion 25 may not be provided, and the grease and / or sheet may be disposed to realize a thermal connection between the cooling component 21 and the cooling target. In this case, the above description of the contact target and contact area of ​​the protruding portion 25 may be used for the contact target and contact area of ​​the grease and / or sheet.

[0064] The cooling component 21 may be fixed to the module substrate 5 by any suitable method. For example, it may be fixed by a screw (not shown) (and a nut as necessary) or by an engagement claw.

[0065] (An example of processing by optical IC and control IC) 3 is a block diagram showing an example of the configuration of a signal processing system of the optical module 1. Here, one optical IC 7, one control IC 13, and one power supply IC 15 are shown.

[0066] The optical IC 7 includes, for example, a conversion unit 27 that directly performs photoelectric conversion, a processing unit 29 that processes an electrical signal related to the conversion unit 27, and a sensor 31 that detects temperature.

[0067] The conversion unit 27 has, for example, the same number of photoelectric conversion elements 33 as the number of channels (the number of optical fibers 23 connected to one optical IC 7). The photoelectric conversion elements 33 are, for example, laser diodes for transmitting optical signals, or photodiodes for receiving optical signals. The laser diodes generate optical signals corresponding to the electrical signals input from the processing unit 29, and output the optical signals to the optical fibers 23. The photodiodes generate electrical signals corresponding to the optical signals input from the optical fibers 23, and output the electrical signals to the processing unit 29.

[0068] The processing unit 29 has, for example, individual circuits 35 in the same number as the number of channels. The multiple individual circuits 35 are individually (one-to-one) connected to the multiple photoelectric conversion elements 33. The individual circuits 35 are drive circuits for transmitting optical signals, or amplifier circuits for receiving optical signals. The drive circuits output, to the photoelectric conversion elements 33, electrical signals corresponding to electrical signals input from outside the optical module 1 via the electrical connector 17. The amplifier circuits amplify the electrical signals input from the photoelectric conversion elements 33, and output them to outside the optical module 1 via the electrical connector 17.

[0069] The relationship between the above configuration in terms of signal processing and the configuration in terms of hardware of the optical IC 7 is arbitrary. For example, the photoelectric conversion elements 33 may be fabricated as elements separate from each other and mounted on the same substrate, or may be fabricated on the same substrate. The individual circuits 35 may be fabricated as IC chips separate from each other and mounted on the same substrate, or may be fabricated in one IC chip. The conversion unit 27 and the processing unit 29 may be fabricated as chips separate from each other and mounted on the same substrate, or may be fabricated on the same substrate. The same applies to the sensor 31.

[0070] The positional relationship between the conversion unit 27 and the processing unit 29 in planar perspective is also arbitrary. For example, the conversion unit 27 may be located on the side where the fiber bundle 9 extends from the optical IC 7 (the +x side in FIG. 1) with respect to the processing unit 29. As described above, the cooling component 21 may directly or indirectly abut against the top surface of the optical IC 7 in a range where it overlaps with the processing unit 29 but does not overlap with the conversion unit 27 in planar perspective. Of course, unlike the above description, the cooling component 21 may abut against the top surface of the optical IC 7 in a range where it overlaps with the conversion unit 27.

[0071] The sensor 31 outputs an electrical signal corresponding to the temperature to the control IC 13. The control IC 13 controls the individual circuit 35 based on the temperature detected by the sensor 31 so as to compensate for changes in the characteristics of the photoelectric conversion element 33 caused by temperature changes, for example. Specifically, for example, the individual circuit 35 applies a bias to the anode or cathode of the photoelectric conversion element 33 with a voltage or current corresponding to a value stored in its own register. The control IC 13 rewrites the value stored in the register according to the detection value of the sensor 31. This reduces changes in the relative relationship between the intensity of the optical signal and the intensity of the electrical signal caused by temperature changes.

[0072] The configuration, number and arrangement of the sensor 31 are arbitrary. For example, the sensor 31 is composed of a thermistor or a resistance temperature detector, and changes its electrical resistance according to the temperature. The sensor 31 may have only a transducer, or may have a circuit for performing a predetermined process (e.g., amplification) in addition to the transducer. Only one sensor 31 may be provided on one optical IC 7 (as in the illustrated example), or multiple sensors 31 may be provided on multiple photoelectric conversion elements 33 individually. A number of sensors 31 less than the number of the photoelectric conversion elements 33 may be provided, and the detection value of the nearest sensor 31 may be used for each photoelectric conversion element 33, or a representative value of the detection value may be used.

[0073] The above example of the process may be modified as appropriate. For example, in the above description, the multiple individual circuits 35 individually apply bias to the multiple photoelectric conversion elements 33. However, one circuit may be provided that applies a common bias to the multiple photoelectric conversion elements 33. Also, for example, the control IC 13 may generate the bias instead of the processing unit 29 in the optical IC 7 generating the bias.

[0074] As described above, in the illustrated example, the control IC 13 is not interposed between the electrical connector 17 and the optical IC 7. In other words, the control IC 13 does not have a function of transmitting an electrical signal to be converted into an optical signal and / or an electrical signal converted from an optical signal. However, the control IC 13 may have such a function. In addition, the control IC 13 may have other functions, such as a function of monitoring the current applied to the photoelectric conversion element 33.

[0075] (Summary of the embodiment) As described above, the optical module 1 may include a module substrate 5, a plurality of optical ICs 7, a plurality of fiber bundles 9, a plurality of optical connectors 11, at least one control IC 13, and at least one power supply IC 15. The module substrate 5 has a first surface (first mounting surface 5a) extending in a first direction (y direction) and a second direction (x direction) perpendicular to the first direction. The plurality of optical ICs 7 are mounted on the first mounting surface 5a at different positions in the y direction, and perform photoelectric conversion. The plurality of fiber bundles 9 each have a plurality of optical fibers 23 extending in parallel with each other, and extend from the plurality of optical ICs 7 to a first side (+x side) in the second direction. The plurality of optical connectors 11 are located at the ends of the plurality of fiber bundles 9 opposite to the plurality of optical ICs 7, and are connected to an external optical element (e.g., an optical waveguide, not shown) so as to be capable of transmitting an optical signal. The at least one control IC 13 is mounted on the module substrate 5, and controls at least one of the plurality of optical ICs 7. At least one power supply IC 15 is mounted on the module substrate 5 and supplies power to at least one of the multiple optical ICs 7 .

[0076] Therefore, for example, by providing a plurality of optical ICs 7 each capable of transmitting a multi-channel optical signal, the transmission band can be expanded. On the other hand, by mounting the plurality of optical ICs 7, the control IC 13, and the power supply IC 15 on the module substrate 5 and modularizing them, the size can be reduced.

[0077] The at least one control IC 13 may include only one control IC 13. The one control IC 13 may control multiple (all) optical ICs 7.

[0078] In this case, for example, the module substrate 5 can be made smaller than in a configuration in which a plurality of optical ICs 7 and the same number of control ICs 13 are provided (this configuration is also included in the technology according to the present disclosure). This is because, for example, the package is standardized to reduce the volume occupied by the package, and the gap between the packages to prevent short circuits between the packages is eliminated.

[0079] The at least one power supply IC 15 may include only one power supply IC. The one power supply IC 15 may supply power to multiple optical ICs 7.

[0080] In this case, for example, similarly to the aspect in which only one control IC 13 is provided, the module board 5 can be made smaller.

[0081] The optical module 1 may further include a cooling component 21 that is in direct or indirect contact with the multiple optical ICs 7 and the module substrate 5 and cools them.

[0082] In this case, for example, the cooling component 21 covering a wide area covering the module substrate 5 dissipates heat from the multiple optical ICs 7, enabling stable optical communication. Also, for example, by being in contact with both the multiple optical ICs 7 and the module substrate 5, the temperature difference between them can be reduced, and the transition period of temperature change can be shortened. As a result, for example, the probability that optical communication becomes unstable when starting up a device including the optical module 1 can be reduced.

[0083] <Various other examples> Various other examples of the optical module 1 will be described below.

[0084] (Another example of optical IC placement) 4A and 4B are schematic plan views showing another example and yet another example of the arrangement of a plurality of optical ICs 7. In other words, these figures show an optical module 1A according to another example and an optical module 1B according to yet another example.

[0085] In these examples, at least one optical IC 7 is shifted in the x direction from one (on one side) or two (on both sides) optical ICs 7 adjacent in the y direction. This allows, for example, a small distance in the y direction between optical ICs 7 adjacent in the y direction. Furthermore, as shown by the overlapping region R1, adjacent optical ICs 7 can overlap a part of their y direction arrangement ranges. As a result, the entire y direction arrangement range of the multiple optical ICs 7 can be reduced. From another perspective, in the example shown in FIG. 1, the distance (y direction) between adjacent optical ICs 7 for reducing the probability of short circuiting is dead space, but such a space can be reduced. As a result, the module substrate 5 can be easily miniaturized.

[0086] A specific embodiment of the shifting of the positions of the multiple optical ICs 7 in the x direction as described above may be appropriately set. For example, all the optical ICs 7 may be shifted from the adjacent optical ICs 7 (FIG. 4B), or some of the optical ICs 7 may be shifted from the adjacent optical ICs 7 (FIG. 4A).

[0087] More specifically, in the example of Fig. 4B, the multiple optical ICs 7 are shifted one by one to the opposite side from each other. Other examples of the manner in which all the optical ICs 7 are shifted from the adjacent optical ICs 7 include a manner in which all the multiple optical ICs 7 are shifted one by one to the same side. Also, there is a manner in which two or more optical ICs 7 are shifted one by one to the same side, and then two or more optical ICs 7 are shifted one by one to the opposite side from the same side (and further, the above two types of shifts are repeated).

[0088] In the example of Fig. 4A, the positions of two or more (two in the illustrated example) optical ICs 7 on the center side are shifted from the positions of two or more (two in the illustrated example) optical ICs 7 on both sides. In addition, as a mode in which some optical ICs 7 are shifted from adjacent optical ICs 7, for example, a mode in which two or more optical ICs 7 on one side in the y direction and at least one optical IC 7 on the other side in the y direction are shifted in the x direction can be mentioned.

[0089] The two optical ICs 7 that are adjacent to each other in the y direction and shifted in the x direction may overlap each other in the y direction (overlap area R1 may be formed) as in the illustrated example, or may not overlap each other as in the illustrated example. Even in the latter case, it is easier to reduce the overall y direction arrangement range of the multiple optical ICs 7 compared to the embodiment of FIG. 1.

[0090] In the embodiment where the overlapping region R1 is formed, only the pin-shaped terminals 7c may overlap (the illustrated example), or the sealing portions 7b may overlap. In the illustrated example, the terminals 7c are pin-shaped for surface mounting, so the overlapping of the sealing portions 7b is premised on the overlapping of the pin-shaped terminals 7c. However, as described above, the terminals 7c may be, for example, pins for through-hole mounting, or pads or bumps for surface mounting, and thus the overlapping of the terminals 7c does not necessarily have to be premised on the overlapping of the sealing portions 7b. The size of the overlapping region R1 in the y direction is arbitrary.

[0091] The two optical ICs 7 that form the overlapping region R1 and are offset from each other in the x direction do not overlap each other in their x direction arrangement ranges, for example. The distance between them in the x direction (the size of the gap between them in the x direction) is arbitrary. It is also possible for the two optical ICs 7 that form the overlapping region R1 to have their x direction arrangement ranges overlap each other. For example, as in the illustrated example, in an embodiment in which the terminal 7c is a pin for surface mounting, the terminal 7c on the most +x side and the side surface of the sealing portion 7b on the +x side are separated by a predetermined distance. The same applies to the -x side. Therefore, the x direction arrangement ranges may overlap by a length shorter than the above distance.

[0092] In the two optical ICs 7 forming the overlapping region R1, the fiber bundle 9 extending from the optical IC 7 located on the -x side may extend so as not to overlap the optical IC 7 located on the +x side (as shown in the example), or may extend so as to overlap a part in the y direction. In the former case, the fiber bundle 9 may or may not contact the optical IC 7 on the +x side in the y direction. In the aspect in which a part of the fiber bundle 9 extending from the optical IC 7 on the -x side overlaps the optical IC 7 on the +x side, the fiber bundle 9 extending from the optical IC 7 on the -x side and the fiber bundle 9 extending from the optical IC 7 on the +x side do not overlap each other, for example.

[0093] In addition, when the optical ICs 7 adjacent to each other in the arrangement order in the y direction are not identical in appearance, whether or not they are shifted from each other in the x direction may be determined rationally. For example, the geometric centers of the sealing portion 7b (or the smallest imaginary rectangle surrounding the sealing portion 7b and the terminal 7c) may be compared to determine whether or not they are shifted from each other.

[0094] As described above, at least one of the multiple optical ICs 7 may be positioned offset in the second direction (x direction, the direction in which the fiber bundle 9 extends from the optical IC7) from one or two optical ICs 7 adjacent to it in the first direction (y direction).

[0095] In this case, for example, as described above, the module substrate 5 can be easily miniaturized. An optical IC 7 located on the +x side (the side from which the fiber bundle 9 extends) of an adjacent optical IC 7 in the y direction can function as a member that restricts movement in the y direction of the fiber bundle 9 extending from the adjacent optical IC 7. Therefore, not only is miniaturization easily achieved, but the optical IC 7 can also be used as a positioning member for the fiber bundle 9. From this perspective as well, the module substrate 5 can be made smaller.

[0096] Furthermore, the placement range of the at least one optical IC7 does not overlap with that of the adjacent one or two optical ICs7 in the second direction (x direction), and may overlap partially with that of the adjacent one or two optical ICs7 in the first direction (y direction).

[0097] In this case, for example, the effect of reducing the arrangement range in the y direction of the entire plurality of optical ICs 7 is improved, and further, the effect of facilitating miniaturization of the module substrate 5 is improved.

[0098] (Another example related to power supply ICs) Fig. 5 is a schematic plan view showing another example of the power supply IC 15. In other words, Fig. 5 shows an optical module 1C according to another example.

[0099] In the description of the embodiment, it has been mentioned that two or more power supply ICs 15 may be provided. The optical module 1C is an example of such an embodiment. The multiple (three in the illustrated example) power supply ICs 15 (15A, 15B, and 15C) can supply power of different voltages (or currents), for example. Each power supply IC 15 supplies power to multiple (for example, all) optical ICs 7, as indicated by dotted lines. Each optical IC 7 uses the multiple types of power supplied from the multiple power supply ICs 15A to 15C for different purposes, for example. For example, the optical IC 7 may allocate multiple types of power to at least two or more of an internal core logic circuit, an I / O (input / output) circuit, an auxiliary logic circuit, a circuit that applies a voltage to the photoelectric conversion element 33, and a memory.

[0100] The number of types of power (the number of power supply ICs 15 in the illustrated example) is arbitrary. As described in the description of the embodiment, the mounting positions of the multiple power supply ICs 15 are arbitrary. In Fig. 5, the arrangement of the optical ICs 7 is shown in Fig. 4A as an example, but it is clear that other arrangements may be used.

[0101] As described above, in the optical module 1C, at least one power supply IC 15 may include two or more power supply ICs 15. The two or more power supply ICs 15 may supply power of different voltages. Each power supply IC 15 may supply power to multiple optical ICs 7.

[0102] In this case, for example, when one type of voltage (or current) is considered, each power supply IC 15 is shared by multiple optical ICs 7. Therefore, compared to an embodiment in which a power supply IC 15 is provided for each optical IC 7 and each voltage (this embodiment is also included in the technology according to the present disclosure), the optical module 1C can be made smaller. Also, compared to the optical module 1 (FIG. 1) having only one power supply IC 15, for example, the configuration of the power supply IC 15 can be simplified, leading to cost reduction.

[0103] (Another example related to cooling parts) As shown in FIG. 4A and FIG. 4B, the optical ICs 7 may be different from each other in the x direction (the direction in which the fiber bundles 9 extend). In such an embodiment, when the lengths of the multiple fiber bundles 9 are the same, the lengths of the multiple fiber bundles 9 extending from the end of the module substrate 5 on the +x side are different from each other. Furthermore, the positions of the multiple optical connectors 11 are different from each other. This difference may cause inconvenience depending on the configuration of the device to which the multiple optical connectors 11 are connected. Therefore, in the example described below, a regulating member is provided to align the lengths of the multiple fiber bundles 9 extending from the end of the module substrate 5 on the +x side. In the example described below, the cooling component also serves as the regulating member. Specifically, it is as follows.

[0104] Fig. 6 is an exploded perspective view showing a part of an optical module 1D according to another example. Fig. 7A is a cross-sectional view taken along line VIIa-VIIa in Fig. 6. Fig. 7B is a cross-sectional view taken along line VIIb-VIIb in Fig. 6. Fig. 7C is a side view of the optical module 1D as seen from the +x side (however, the cross section of the fiber bundle 9 is shown).

[0105] As shown in Fig. 6, in the description here, the arrangement of the multiple optical ICs 7 is taken as an example in the arrangement shown in Fig. 4A. However, the multiple optical ICs 7 may be arranged in other ways. The cooling component 121 of the optical module 1D may have multiple fins 21d (or multiple pins) and a protrusion 25, similar to the cooling component 21. However, illustration of such parts is omitted here.

[0106] In the following description, for convenience, the fiber bundle 9 extending from the optical IC 7 located relatively on the -x side may be referred to as the first fiber bundle 9A. The fiber bundle 9 extending from the optical IC 7 located relatively on the +x side may be referred to as the second fiber bundle 9B. The optical connector 11 provided on the first fiber bundle 9A may be referred to as the first optical connector 11A. The optical connector 11 provided on the second fiber bundle 9B may be referred to as the second optical connector 11B.

[0107] 7A, the first fiber bundle 9A extends, for example, in a substantially straight line from the optical IC 7 to reach the end on the +x side of the module substrate 5. On the other hand, as shown in FIG 7B, the second fiber bundle 9B is bent midway to reach the end on the +x side of the module substrate 5 (in planar perspective). That is, the second fiber bundle 9B deviates more from a straight line shape than the first fiber bundle 9A, and thus the difference in length from both optical ICs 7 to the end of the module substrate 5 is smaller than the difference in positions in the x direction (positions of the side surfaces on the +x side) of the optical ICs 7 to which they are connected.

[0108] The difference in the path of the fiber bundle 9 as described above may be realized by bending in any direction, and in the illustrated example, it is realized by bending in the z direction. The number of times it can be bent is also arbitrary. From another perspective, the number of positions at which the cooling component 121 defines the path of the fiber bundle 9 is arbitrary. In the illustrated example, the first fiber bundle 9A extends linearly, but the first fiber bundle 9A may also be bent at an appropriate position. From another perspective, the cooling component 121 may define only the length by which the second fiber bundle 9B extends from the module substrate 5, or may additionally define the length by which the first fiber bundle 9A extends from the module substrate 5.

[0109] There are various possible configurations for the cooling component 121 to define (regulate) at least a part of the path of at least a part of the fiber bundles 9. In the illustrated example, the following is provided.

[0110] 6, the cooling component 121 has four walls 121b, similar to the cooling component 21. The wall 121b on the +x side has notches (121ca and 121cb) for extending the fiber bundle 9 to the outside of the cooling component 121. The notch 121cb corresponding to the second fiber bundle 9B is cut into the wall 121b deeper (longer in the z direction) than the notch 121ca corresponding to the first fiber bundle 9A. The optical module 1D also has an auxiliary member 37 fixed to the module substrate 5. The auxiliary member 37 protrudes from the first mounting surface 5a of the module substrate 5 to the +z side, and has a protrusion 37a inserted into a part of the -z side of the notch 121cb.

[0111] Therefore, when the cooling component 121 is attached to the module substrate 5, as shown in FIG. 7C, an opening through which the first fiber bundle 9A passes is formed at the height of the first mounting surface 5a, and an opening through which the second fiber bundle 9B passes is formed on the +z side of the former opening. For example, both openings have the same shape and size. The auxiliary member 37 may be regarded as a part of the cooling component 121, or as a member separate from the cooling component 121. In the following, for convenience, the latter way of understanding will be used. In any case, the cooling component 121 functions as a regulating member that regulates the path of the fiber bundle 9.

[0112] 7B, the cooling component 121 has a protrusion 121f protruding from the surface facing the first mounting surface 5a toward the -z side. The protrusion 121f abuts against a portion of the second fiber bundle 9B that extends from the optical IC 7 to the notch 121cb from the +z side, and regulates the path. Therefore, the second fiber bundle 9B bends toward the +z side at the position of the protrusion 121f and extends into the notch 121cb.

[0113] As shown in Fig. 7A, a state in which the first optical connector 11A is positioned as far as possible on the +x side is assumed. Furthermore, as shown in Fig. 7B, a state in which the second optical connector 11B is positioned as far as possible on the +x side is assumed, on the condition that the z-direction position of the second optical connector 11B is aligned with the z-direction position of the first optical connector 11A. At this time, the x-direction position of the first optical connector 11A and the x-direction position of the second optical connector 11B may, for example, be approximately the same. For example, the difference between the two may be 1 / 3 or less or 1 / 5 or less of the difference in the x-direction positions of the optical IC7 on the -x side and the optical IC7 on the +x side.

[0114] Assume that the first optical connector 11A and the second optical connector 11B are each positioned at the maximum on the +x side. That is, unlike FIG. 7B, assume that the second fiber bundle 9B is extended in parallel to the x direction from the opening position formed by the notch 121cb. At this time, the difference between the x direction position of the first optical connector 11A and the x direction position of the second optical connector 11B is smaller than, for example, the difference between the x direction positions of the optical IC 7 on the -x side and the optical IC 7 on the +x side. Note that the length of the fiber bundle 9 extending from the end of the +x side of the module substrate 5 in the assumed state is an example of the extension length described later.

[0115] Unlike the illustrated example, the z-direction positions at which the first fiber bundle 9A and the second fiber bundle 9B extend from the end portion on the +x side of the module substrate 5 (extending from the notch of the cooling component 121) may be the same for the first fiber bundle 9A and the second fiber bundle 9B. That is, while the shapes and sizes of the notches 121ca and 121cb are the same, a protrusion may be appropriately formed on the -z side surface of the cooling component 21 and / or the first mounting surface 5a to adjust the length of the second fiber bundle 9B extending from the end portion on the +x side of the module substrate 5.

[0116] 8A and 8B are views corresponding to FIGS. 7A and 7B, showing yet another example.

[0117] In the cooling component 121A in this example, the notch through which the first fiber bundle 9A and the second fiber bundle 9B pass is the notch 121ca shown in FIG. 6. That is, the first fiber bundle 9A and the second fiber bundle 9B pass through openings at the same height. In addition, the first fiber bundle 9A and the second fiber bundle 9B are each provided with a stopper 39. The length of the fiber bundle 9 from the optical connector 11 to the stopper 39 is the same for the first fiber bundle 9A and the second fiber bundle 9B. The position of the stopper 39 in the x direction is restricted by the opening formed by the notch 121ca. The cooling component 121 may define a part of the path of the fiber bundle 9 in this manner.

[0118] As described above, the optical module 1D may have a defining member (cooling component 121 and auxiliary member 37) that defines at least a part of the path of at least one of the multiple fiber bundles 9. The multiple optical ICs 7 may have a first optical IC (-x side optical IC 7) and a second optical IC (+x side optical IC 7) located on the first side (the side from which the fiber bundle 9 extends, +x side) from the first optical IC. The multiple fiber bundles 9 may have a first fiber bundle 9A extending from the -x side optical IC 7 and a second fiber bundle 9B extending from the +x side optical IC 7. The length of each fiber bundle 9 from the corresponding optical IC 7 to the corresponding optical connector 11 is referred to as the total length. The length of each fiber bundle 9 that can extend from the end of the +x side of the module substrate 5 to the +x side in parallel to the first direction (x direction) is referred to as the extension length. The first fiber bundle 9A and the second fiber bundle 9B may have the same overall length. The defining member (the cooling component 121 and the auxiliary member 37) may define at least a part of the path of at least the second fiber bundle 9B such that the difference between the extension length of the first fiber bundle 9A and the extension length of the second fiber bundle 9B is smaller than the difference in the positions of the -x-side light IC7 and the +x-side light IC7 in the x-direction.

[0119] In this case, for example, as described above, in a mode in which the positions of the optical ICs 7 in the x direction are different and the lengths of the fiber bundles 9 are the same, the difference in the positions of the optical connectors 11 can be reduced, improving convenience. From another perspective, the need to make the lengths of the multiple fiber bundles 9 different from each other in order to make the positions of the optical connectors 11 equal (such a mode is also included in the technology according to the present disclosure) is reduced. As a result, for example, the configurations of the multiple fiber bundles 9, etc. can be made the same, improving productivity.

[0120] The above-described defining member may be in contact with the multiple optical ICs 7 and may cool the multiple optical ICs 7. That is, the cooling component 121 may form at least a part of the defining member.

[0121] In this case, for example, the cooling component 121 also serves as the regulating member, which allows the optical module 1D to be simplified and, in turn, reduced in size.

[0122] The technology according to the present disclosure is not limited to the above embodiment and other examples, and may be implemented in various forms.

[0123] For example, not only a fiber bundle but also wiring for transmitting an electrical signal may extend from the optical IC. In this case, separate connectors may be provided for the fiber bundle and the wiring, or a common connector may be provided. In other words, the optical connector may also function as an electrical connector. The cooling component may be a Peltier element instead of a heat sink.

[0124] From the present disclosure, a concept different from the concept of mounting multiple optical ICs, at least one control IC, at least one power supply IC, and an electrical connector together on a module substrate can be extracted. For example, a technology for shifting the positions of multiple optical ICs in the second direction from each other or adjusting the lengths of multiple fiber bundles by a cooling component does not need to be premised on the requirement that the control IC and the power supply IC are mounted on a module substrate together with the optical IC.

[0125] The following concepts may be extracted from this disclosure. (Concept 1) a module substrate having a first surface extending in a first direction and a second direction perpendicular to the first direction; A plurality of optical ICs that perform photoelectric conversion and are mounted on the first surface at different positions in the first direction; a plurality of fiber bundles each having a plurality of optical fibers extending in parallel with each other and extending from the plurality of optical ICs to a first side in the second direction; a plurality of optical connectors located at ends of the plurality of fiber bundles opposite to the plurality of optical ICs, the optical connectors being connected to external optical elements so as to be capable of transmitting optical signals; at least one control IC mounted on the module substrate and configured to control at least one of the optical ICs; at least one power supply IC mounted on the module substrate and configured to supply power to at least one of the optical ICs; The optical module has (Concept 2) At least one optical IC among the plurality of optical ICs is shifted in position in the second direction from one or two optical ICs adjacent thereto in the first direction. 2. The optical module according to claim 1. (Concept 3) The at least one optical IC does not overlap with the adjacent one or two optical ICs in the second direction, and the arrangement ranges of the at least one optical IC in the first direction partially overlap each other. 3. The optical module according to claim 2. (Concept 4) the at least one control IC includes only one control IC; The one control IC controls the plurality of optical ICs. The optical module according to any one of concepts 1 to 3. (Concept 5) the at least one power supply IC includes only one power supply IC; The one power supply IC supplies power to the plurality of optical ICs. The optical module according to any one of Concepts 1 to 4. (Concept 6) The at least one power supply IC includes two or more power supply ICs; The two or more power supply ICs supply power at different voltages, and each power supply IC supplies power to the plurality of optical ICs. The optical module according to any one of Concepts 1 to 4. (Concept 7) The optical ICs and the module substrate are directly or indirectly in contact with each other, and the optical ICs and the module substrate are further provided with a cooling component for cooling them. The optical module according to any one of Concepts 1 to 6. (Concept 8) a defining member defining a path of at least a portion of at least one of the plurality of fiber bundles; The plurality of optical ICs include A first optical IC; a second optical IC located closer to the first side than the first optical IC; The plurality of fiber bundles include a first fiber bundle extending from the first optical IC; a second fiber bundle extending from the second optical IC; When the length of each fiber bundle from the corresponding optical IC to the corresponding optical connector is called the total length, and the length of each fiber bundle that can extend from the end of the first side of the module substrate in parallel to the second direction toward the first side is called the extension length, the first fiber bundle and the second fiber bundle have the same overall length; The defining member defines a path of at least a portion of the second fiber bundle such that a difference between an extension length of the first fiber bundle and an extension length of the second fiber bundle is smaller than a difference in positions of the first optical IC and the second optical IC in the first direction. The optical module according to any one of Concepts 1 to 7. (Concept 9) The defining member is in contact with the optical ICs and cools the optical ICs. 9. The optical module of claim 8. (Concept 10) An optical module according to any one of concepts 1 to 9; a motherboard electrically connected to the optical module; An optical communication device comprising: [Explanation of symbols]

[0126] 1...optical module, 3...motherboard (external electronic device), 5...module board, 5a...first mounting surface (first surface), 7...optical IC, 9...fiber bundle, 11...optical connector, 13...control IC, 15...power supply IC, 17...electrical connector, 23...optical fiber.

Claims

1. a module substrate having a first surface extending in a first direction and a second direction perpendicular to the first direction; a plurality of optical ICs that perform photoelectric conversion and are mounted on the first surface at different positions in the first direction; a plurality of fiber bundles each including a plurality of optical fibers and extending from the plurality of optical ICs to a first side in the second direction; An optical module having An optical module, wherein two or more optical ICs among the plurality of optical ICs are located on the first side in the second direction relative to two or more optical ICs on both sides, and their arrangement range in the second direction does not overlap with the two or more optical ICs on both sides.

2. a distance between the optical IC on the center side and the optical ICs on both sides that are adjacent in arrangement order in the first direction is smaller than a distance between two or more optical ICs on the center side that are adjacent in arrangement order in the first direction; 2. The optical module according to claim 1.

3. The two or more optical ICs on both sides have terminals protruding toward the center in the first direction.

2. The optical module according to claim 1.

4. a plurality of optical connectors located at ends of the plurality of fiber bundles opposite to the plurality of optical ICs, the optical connectors being connected to external optical elements so as to be capable of transmitting optical signals; at least one control IC mounted on the module substrate and configured to control at least one of the plurality of optical ICs; at least one power supply IC mounted on the module substrate and configured to supply power to at least one of the optical ICs; having the at least one control IC and the at least one power supply IC are located on an opposite side of the optical ICs from the fiber bundles in the second direction; 2. The optical module according to claim 1.

5. a cooling component that is in direct or indirect contact with the optical ICs and the module substrate and cools them; the cooling component has a plurality of protrusions that are brought into contact with the plurality of optical ICs individually; 2. The optical module according to claim 1.

6. An optical module according to any one of claims 1 to 5; a motherboard electrically connected to the optical module; An optical communication device comprising:

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