Composition for heat transfer fluid, heat transfer fluid, heat transfer device, and heat transfer method

Abstract

To provide a heat transfer fluid having a relatively high boiling point.SOLUTION: The present disclosure provides a composition for a heat transfer fluid, which contains hexafluoropropene trimers having specific three structures, (I), (II), and (III), and in which a compound having the structure (I) is contained in an amount of 10 mass% or more and less than 85 mass% relative to the total amount of the hexafluoropropene trimers having the three structures.SELECTED DRAWING: None

Description

Technical Field

[0001] The present disclosure relates to a composition for a heat transfer fluid, a heat transfer fluid, a heat transfer device, and a heat transfer method.

Background Art

[0002] As a heat transfer fluid, it is known to use a trimer of hexafluoropropene (HFP) (Patent Document 1).

[0003] Since the trimer of HFP has a low global warming potential (GWP) and low toxicity, it has attracted attention as an alternative to chlorofluorocarbons (CFCs) and hydrochlorofluorocarbons (HCFCs).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] In a semiconductor manufacturing process, it is conceivable to use a heat transfer fluid for heat removal. However, if the boiling point is low, there is a possibility that the heat transfer fluid vaporized from the device may leak.

[0006] An object of the present invention is to provide a heat transfer fluid having a relatively high boiling point.

Means for Solving the Problems

[0007] The present disclosure includes the following aspects. [1] The following formulas (I) to (III):

Chemical Formula

[10] A semiconductor manufacturing device comprising the heat transfer device according to [8] or [9] above.

[11] A heat transfer method including a step of preparing a device and a step of transferring heat to or from the device using the composition for a heat transfer fluid according to any one of [1] to [3] above, or the heat transfer fluid according to [4] or [5] above. A heat transfer method.

[12] The heat transfer method according to

[11] above, wherein the device is a wafer used for manufacturing a semiconductor.

Advantages of the Invention

[0008] According to the present disclosure, a heat transfer fluid having a relatively high boiling point is provided.

Modes for Carrying Out the Invention

[0009] When referred to in this specification, the numerical range "A to B" is intended to include the numerical values of the lower and upper limits themselves. That is, the numerical range "A to B" means A or more and B or less.

[0010] Hereinafter, the composition for a heat transfer fluid of the present disclosure will be described.

[0011] (Composition for Heat Transfer Fluid) The composition for a heat transfer fluid of the present disclosure comprises the following formulas (I) to (III):

Chemical formula

[0012] The compounds represented by formulas (I) to (III) are so-called hexafluoropropene trimers.

[0013] In this specification, the compound represented by the above formula (I) includes both the E-form and the Z-form of the diastereomer unless otherwise specified.

[0014] In the composition for a heat transfer fluid of the present disclosure, the compound represented by the formula (I) may be contained in less than 85% by mass, preferably 80% by mass or less, for example 75% by mass or less, 70% by mass or less, 60% by mass or less, 50% by mass or less, or 40% by mass or less, based on the total amount of the compounds represented by the above formulas (I) to (III). By setting the content of the compound represented by the formula (I) within the above range, the boiling point of the composition for a heat transfer fluid increases. In other words, the vapor pressure of the composition for a heat transfer fluid decreases. When the vapor pressure of the composition for a heat transfer fluid becomes high, it becomes easy to vaporize. For example, when used in a semiconductor manufacturing apparatus, the leakage from the apparatus can increase. In addition, cavitation occurs and the flow rate control becomes unstable. Since the composition for a heat transfer fluid of the present disclosure has a low vapor pressure, leakage from the apparatus is suppressed, which is environmentally and economically advantageous. In addition, cavitation can be suppressed.

[0015] In the composition for a heat transfer fluid of the present disclosure, the compound represented by the formula (I) is preferably contained in 10% by mass or more, more preferably 20% by mass or more, still more preferably 30% by mass or more, even more preferably 40% by mass or more, for example 45% by mass or more, 50% by mass or more, 55% by mass or more, 60% by mass or more, or 65% by mass or more, based on the total amount of the compounds represented by the above formulas (I) to (III). By setting the content of the compound represented by the formula (I) within the above range, the kinematic viscosity decreases. For example, when used in a semiconductor manufacturing apparatus, the pressure for circulating the composition for a heat transfer fluid can be reduced. By reducing the pressure for circulating the composition for a heat transfer fluid, the pressure loss can be reduced, the leakage from the apparatus can also be reduced, and the operation cost can be lowered.

[0016] In the composition for a heat transfer fluid of the present disclosure, the compound represented by the formula (I) is, for example, 10% by mass or more and less than 85% by mass, 20% by mass or more and less than 85% by mass, 30% by mass or more and less than 85% by mass, 35% by mass or more and less than 85% by mass, 40% by mass or more and less than 85% by mass, 50% by mass or more and less than 85% by mass, 50% by mass or more and 80% by mass or less, 50% by mass or more and 70% by mass or less, 50% by mass or more and 60% by mass or less, 55% by mass or more and 80% by mass or less, 60% by mass or more and 75% by mass or less, or 65% by mass or more and 70% by mass or less with respect to the total amount of the compounds represented by the above formulas (I) to (III). In the composition for a heat transfer fluid of the present disclosure, the compound represented by the formula (I) is preferably 30% by mass or more and less than 85% by mass, more preferably 35% by mass or more and 80% by mass or less, still more preferably 35% by mass or more and 60% by mass or less, and even more preferably 50% by mass or more and 60% by mass or less with respect to the total amount of the compounds represented by the above formulas (I) to (III).

[0017] In the composition for a heat transfer fluid of the present disclosure, the mass ratio of the compound represented by the formula (II) and the compound represented by the formula (III) is not particularly limited, and can be, for example, 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, 4:6 to 6:4, or 4.5:5.5 to 5.5:4.5.

[0018] The compounds represented by the formulas (I) to (III) can be produced by a conventional method. For example, but not limited to, they can be obtained by the method described in International Publication No. 2018 / 172919. Also, they can be obtained by trimerizing hexafluoropropene as a raw material by a conventional method.

[0019] The composition for a heat transfer fluid of the present disclosure may contain a hexafluoropropene trimer represented by C9F 18 in addition to the compounds represented by the formulas (I) to (III).

[0020] The composition for a heat transfer fluid of the present disclosure may contain a hexafluoropropene dimer.

[0021] The hexafluoropropene dimer may include (E)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, (Z)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, or 1,1,3,4,4,5,5-nonafluoro-2-(trifluoromethyl)-2-pentene.

[0022] The composition for a heat transfer fluid of the present disclosure may contain a hexafluoropropene tetramer.

[0023] The hexafluoropropene tetramer may include 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0024] The composition for a heat transfer fluid of the present disclosure, in addition to the hexafluoropropene trimer, contains C m F 2m and / or C n F (2n-2) [wherein m is an integer of 4 or more and 12 or less and other than 9, and n is an integer of 4 or more and 12 or less.].

[0025] m is an integer of 4 or more, preferably an integer of 5 or more, more preferably an integer of 6 or more. Also, n is an integer of 12 or less, preferably an integer of 11 or less, more preferably an integer of 10 or less. However, m does not include 9.

[0026] n is an integer of 4 or more, preferably an integer of 5 or more, more preferably an integer of 6 or more. Also, n is an integer of 12 or less, preferably an integer of 11 or less, more preferably an integer of 10 or less. Further, n is particularly preferably 9.

[0027] C m F 2m may be a chain compound or a cyclic compound which may have a substituted structure. The chain compound may be a so-called alkene and may be linear or branched.

[0028] C n F (2n-2) may be a chain compound or a cyclic compound which may have a substituted structure. The chain compound may be a so-called diene or an alkyne, and may be linear or branched.

[0029] In the composition for a heat transfer fluid of the present disclosure, C m F 2m and / or C n F (2n-2) coexists with hexafluoropropene trimer, thereby improving the function as a heat transfer fluid. Further, the composition for a heat transfer fluid of the present disclosure contains C m F 2m and / or C n F (2n-2) thereby improving the stability of the hexafluoropropene trimer.

[0030] C m F 2m and / or C n F (2n-2) content may be preferably 10% by mass or less, more preferably 5% by mass or less, and still more preferably 1% by mass or less with respect to the hexafluoropropene trimer in the composition for a heat transfer fluid of the present disclosure. Also, C m F 2m and / or C n F (2n-2) content may be preferably 0.0001% by mass or more, more preferably 0.001% by mass or more with respect to the hexafluoropropene trimer in the composition for a heat transfer fluid of the present disclosure. Note that C m F 2m and / or C n F (2n-2) is not an essential component in the composition for a heat transfer fluid of the present disclosure and may not be contained.

[0031] The composition for a heat transfer fluid of the present disclosure may contain perfluorotripropylamine in addition to hexafluoropropene trimer. The composition for a heat transfer fluid containing hexafluoropropene trimer and perfluorotripropylamine may be an azeotropic-like liquid. Since the composition for a heat transfer fluid is an azeotropic-like liquid, even when the composition for a heat transfer fluid vaporizes, the change in composition is small and handling becomes easy.

[0032] Here, the azeotropic-like liquid means a liquid in which the difference in the mole fraction of each component contained in the azeotropic-like liquid between the gas phase and the liquid phase is within 10%.

[0033] Perfluorotripropylamine is also called tris(heptafluoropropyl)amine or N,N-bis(heptafluoropropyl)(heptafluoropropyl)amine, and has the general formula: N(CF2CF2CF3) a (CF(CF3)CF3) 3-a (where a is an integer from 0 to 3). Perfluorotripropylamine may contain only one kind of the compounds represented by the above general formula, or may contain a plurality of kinds. N(CF2CF2CF3)3 is preferred, but N(CF2CF2CF3) a (CF(CF3)CF3) 3-a (where a is an integer from 0 to 2) may be included. Specifically, products such as "Fluorinate (registered trademark)" (manufactured by 3M) (FC-3283) can be mentioned.

[0034] The composition for a heat transfer fluid of the present disclosure may further contain perfluoropolyether, and a mixture of methoxytridecafluoroheptene isomers, perfluorotributylamine, and the like.

[0035] The perfluoropolyether is preferably represented by the general formula: RO-Rf 1 -R’ and in the formula, where R and R’ are the same or different and are -C m F 2m+1a monovalent group represented by, where m is an integer from 1 to 8, and Rf 1 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units, and the repeating units are: (i) -CFXO- (where X is F or CF3); (ii) -CF2CFXO- (where X is F or CF3); (iii) -CFXCF2O- (where X is F or CF3); (iv) -CF2CF2CF2O-; or (v) -CF2CF2CF2CF2O- represented by, or Rf 1 is (vi) -(CF2) n -CFY-O- (where n is an integer from 0 to 3, and Y is a monovalent group represented by the general formula -ORf 2 Z, where Rf 2 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units represented by -CFXO-, -CF2CFXO-, -CF2CF2CF2O-, or -CF2CF2CF2CF2O-, where each X is the same or different and is F or CF3, and Z is a monovalent C 1-5 perfluoroalkyl group).

[0036] Specific examples of the perfluoropolyether include products such as GALDEN (registered trademark) "HT135" and GALDEN (registered trademark) "HT110" (both manufactured by Solvay).

[0037] The methoxytridecafluoroheptene isomer mixture specifically includes methyl-perfluoroheptene ether (MPHE) (C7F 13 OCH3). Specific examples include products such as "Opteon SF10" (manufactured by Chemours).

[0038] When the composition for a heat transfer fluid of the present disclosure contains perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture, since their properties as a heat transfer fluid are similar to those of the compound represented by C9F 18 regardless of their content ratios, the properties of the entire composition for a heat transfer fluid as a heat transfer fluid are basically unchanged. Therefore, in this case, the composition for a heat transfer fluid of the present disclosure preferably contains the compound represented by C9F 18 in an amount of 40% to 99.9% by mass, more preferably 60% to 99.9% by mass, and even more preferably 80% to 99.9% by mass, based on the entire composition for a heat transfer fluid.

[0039] The composition for a heat transfer fluid of the present disclosure may further contain water. The water content is 1 ppm by mass or more, preferably 5 ppm by mass or more, in the composition for a heat transfer fluid. By setting the water content to a certain level or more, for example, 1 ppm by mass or more, it is possible to suppress the charging of the composition due to a decrease in the stability of the composition for a heat transfer fluid. Also, the water content is 1000 ppm by mass or less, preferably 500 ppm by mass or less, and more preferably 100 ppm by mass or less, in the composition for a heat transfer fluid. By setting the water content to a certain level or less, for example, 1000 ppm by mass or less, it is possible to suppress the decomposition of the HFP trimer represented by C9F 18 during heating, and thus suppress the increase in fluoride ions and the increase in acidity.

[0040] In one aspect, the water content is preferably 0.0001 part by mass or more, more preferably 0.01 part by mass or more, and even more preferably 0.1 part by mass or more, based on 100 parts by mass in total of the compound represented by C9F 18

[0041] On the other hand, the water content is such that the water content is C9F 18It is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less with respect to 100 parts by mass in total of the compounds represented by

[0042] The composition for a heat transfer fluid of the present disclosure may further contain fluoride ions. The amount of fluoride ions in the composition for a heat transfer fluid is preferably 0.000001% by mass or more, more preferably 0.00001% by mass or more, still more preferably 0.001% by mass or more, and particularly preferably 0.001% by mass or more with respect to the whole composition for a heat transfer fluid.

[0043] Also, the amount of fluoride ions contained in the composition for a heat transfer fluid of the present disclosure is preferably 5% by mass or less, more preferably 1% by mass or less, still more preferably 0.1% by mass or less, and particularly preferably 0.01% by mass or less with respect to the whole composition for a heat transfer fluid.

[0044] As the fluoride ion source, known fluoride ion sources can be widely used and are not particularly limited. Specifically, hydrogen fluoride, sodium fluoride, sodium hydrogen fluoride, potassium fluoride, potassium hydrogen fluoride, lithium fluoride, cesium fluoride, calcium fluoride, magnesium fluoride, aluminum fluoride, zinc fluoride, silver fluoride, and iron fluoride can be exemplified. These may contain only one kind or may contain a plurality of kinds. Preferably, the fluoride ion source is hydrogen fluoride.

[0045] (Heat transfer fluid) The heat transfer fluid of the present disclosure may contain other components in addition to the composition for a heat transfer fluid of the present disclosure. In one aspect, the composition for a heat transfer fluid itself may be the heat transfer fluid. In another aspect, the composition for a heat transfer fluid contains other components.

[0046] Other components other than the composition for the heat transfer fluid contained in the heat transfer fluid of the present disclosure may be any components that do not inhibit the effects and purposes of the present disclosure. Examples of such other components include water, stabilizers, and the like.

[0047] The stabilizer exerts a stabilizing effect and functions as a so-called acid acceptor or antioxidant. As the stabilizing effect, the main ones include the effect of preventing the decomposition of hexafluoropropene trimer by capturing radicals generated in the system, and the acid acceptor effect of preventing further decomposition of hexafluoropropene trimer by acid by capturing the acid generated in the system.

[0048] As such a stabilizer, known stabilizers can be widely adopted. Among them, since it is possible to effectively suppress the occurrence of metal corrosion due to the composition, it is preferable to use one or more stabilizers selected from the group consisting of unsaturated alcohol-based stabilizers, nitro-based stabilizers, amine-based stabilizers, phenol-based stabilizers, and epoxy-based stabilizers.

[0049] As the unsaturated alcohol-based stabilizer, known ones can be widely adopted. For example, one or more selected from the group consisting of 3-buten-2-ol, 2-buten-1-ol, 4-propen-1-ol, 1-propen-3-ol, 2-methyl-3-buten-2-ol, 3-methyl-3-buten-2-ol, 3-methyl-2-buten-1-ol, 2-hexen-1-ol, 2,4-hexadien-1-ol, and oleyl alcohol can be used.

[0050] As the nitro stabilizer, known ones can be widely adopted. As the aliphatic nitro compound, for example, nitromethane, nitroethane, 1-nitropropane, 2-nitropropane and the like can be mentioned. As the aromatic nitro compound, for example, one or more selected from the group consisting of nitrobenzene, o-, m- or p-dinitrobenzene, o-, m- or p-nitrotoluene, dimethylnitrobenzene, m-nitroacetophenone, o-, m- or p-nitrophenol, o-nitroanisole, m-nitroanisole and p-nitroanisole can be used.

[0051] As the amine stabilizer, known ones can be widely adopted. For example, one or more selected from the group consisting of pentylamine, hexylamine, diisopropylamine, diisobutylamine, di-n-propylamine, diallylamine, triethylamine, N-methylaniline, pyridine, morpholine, N-methylmorpholine, triallylamine, allylamine, α-methylbenzylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, propylamine, isopropylamine, dipropylamine, tripropylamine, butylamine, isobutylamine, dibutylamine, tributylamine, dibenzylamine, tribenzylamine, 2-ethylhexylamine, aniline, N,N-dimethylaniline, N,N-diethylaniline, ethylenediamine, propylenediamine, diethylenetriamine, tetraethylenepentamine, benzylamine, dibenzylamine, diphenylamine and diethylhydroxylamine can be used.

[0052] As the phenol stabilizer, known ones can be widely adopted. For example, one or more selected from the group consisting of 2,6-di-tert-butyl-4-methylphenol, 3-cresol, phenol, 1,2-benzenediol, 2-isopropyl-5-methylphenol, and 2-methoxyphenol can be used.

[0053] As epoxy stabilizers, known ones can be widely adopted. For example, one or more selected from the group consisting of butylene oxide, 1,2-propylene oxide, 1,2-butylene oxide, butyl glycidyl ether, diethylene glycol diglycidyl ether, and 1,2-epoxy-3-phenoxypropane can be used.

[0054] From the reason that the decomposition of hexafluoropropene trimer that may occur due to various causes can be more effectively prevented by combining and using stabilizers having different stabilizing effects, it is preferably composed of one or more selected from the above-mentioned epoxy stabilizers, as well as the group consisting of unsaturated alcohol stabilizers, nitro stabilizers, and phenolic stabilizers.

[0055] From the viewpoint of effectively suppressing the acid liberation from the hexafluoropropene trimer and suppressing the corrosion of metals by the liquid composition, the content of the stabilizer in the whole heat transfer fluid is preferably 0.0001% by mass or more, and more preferably 0.01% by mass or more. On the other hand, considering the point of avoiding unfavorable physical property changes of the heat transfer fluid due to excessive addition of the stabilizer, the content of the stabilizer in the whole heat transfer fluid is preferably 10% by mass or less, and more preferably 5% by mass or less.

[0056] (Composition for heat transfer fluid or use of heat transfer fluid) The composition for a heat transfer fluid and the heat transfer fluid of the present disclosure are used to extract heat from various objects to be heat-transferred or supply heat to the objects to be heat-transferred. The objects to be heat-transferred in the present disclosure are articles, devices, and atmospheres that are cooled, heated, or maintained at a temperature to be controlled. Examples of such objects to be heat-transferred include electrical components, mechanical components, and optical components, as well as processed products and assembled products thereof. Specific examples of the objects to be heat-transferred in the present disclosure include, but are not particularly limited to, wafers used for manufacturing semiconductor devices, microprocessors, power control semiconductors, electrical branch switches, power transformers, circuit boards, multi-chip modules, mounted and unmounted semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, missile components, and the like.

[0057] The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure has a small pressure loss during circulation in use, and thus is preferably used in applications where a large amount of heat transfer is required. In a preferred embodiment, the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is used in a semiconductor manufacturing process. The object to be heat-transferred in the semiconductor manufacturing process is a wafer used for manufacturing a semiconductor device.

[0058] The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure can also be used as a two-phase immersion cooling fluid, a chiller fluid, or a Rankine cycle working fluid.

[0059] In a device designed to transfer heat using the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure, the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure can be used to replace the heat transfer fluid in use in the above device.

[0060] The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure can be a drop-in replacement, near-drop-in replacement, or retrofit replacement for the heat transfer fluid in use. Here, "drop-in replacement" means that it can be replaced without any changes on the equipment side. "Near-drop-in replacement" means that it can be replaced with almost no changes on the equipment side. "Retrofit replacement" means that it can be replaced with a minimum of changes on the equipment side (without significant changes). The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is preferably capable of being a drop-in replacement or near-drop-in replacement for the above heat transfer fluid.

[0061] Whether a drop-in replacement, near-drop-in replacement, or retrofit replacement is possible can be determined by whether all of the following conditions are satisfied. (i) The boiling point of the heat transfer fluid is at least about 80% or more, preferably at least about 85% or more, of the boiling point of the heat transfer fluid before replacement. (ii) The freezing point of the heat transfer fluid is equal to or lower than the freezing point of the heat transfer fluid before replacement. (iii) The kinematic viscosity of the heat transfer fluid is at least about 200% or less, preferably at least about 150% or less, of the kinematic viscosity of the heat transfer fluid before replacement. (iv) The heat transfer fluid is miscible with the heat transfer fluid before replacement in any ratio.

[0062] By setting the boiling point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure to be at least about 80% or more, preferably at least about 85% or more, of the boiling point of the heat transfer fluid before replacement, the occurrence of cavitation and leakage from the device can be suppressed. The upper limit of the boiling point of the heat transfer fluid is not particularly limited, but for example, it may be at least about 130% or less of the boiling point of the heat transfer fluid before replacement.

[0063] By making the pour point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure equal to or lower than the pour point of the heat transfer fluid before replacement, it becomes possible to use it even at temperatures below the conventional operating temperature, and the operating temperature range can be expanded. The upper limit of the pour point of the heat transfer fluid is not particularly limited, but for example, it may be at a temperature not higher than 30 °C higher than the pour point of the heat transfer fluid before replacement.

[0064] By making the kinematic viscosity of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure at most about 200%, preferably at most about 150% of the kinematic viscosity of the heat transfer fluid before replacement, an increase in power consumption can be suppressed or the power consumption can be reduced. The kinematic viscosities are preferably compared at the kinematic viscosity at the operating temperature, but are not limited thereto, and for example, they can be compared at the kinematic viscosity at any temperature from -20 °C to -40 °C, specifically at the kinematic viscosity at -20 °C.

[0065] When the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is miscible with the heat transfer fluid before replacement in any ratio, the replacement operation becomes easy.

[0066] Furthermore, when the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure satisfies the following conditions, it is suitable for drop-in replacement, near-drop-in replacement, or retrofit replacement. (v) The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure has a relative permittivity of at most 120% of the relative permittivity of the heat transfer fluid before replacement. (vi) The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure has a dielectric strength of at least 90% of the dielectric strength of the heat transfer fluid before replacement. (vii) The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure has a specific heat of at least 90% of the specific heat of the heat transfer fluid before replacement. (viii) The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure has a thermal conductivity of at least 90% of the thermal conductivity of the heat transfer fluid before replacement.

[0067] By setting the dielectric constant of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure to 120% or less of the dielectric constant of the heat transfer fluid before replacement, it can be suitably used as an alternative composition. The upper limit of the dielectric constant of the heat transfer fluid is not particularly limited, but for example, it may be 80% or more of the dielectric constant of the heat transfer fluid before replacement.

[0068] By setting the dielectric breakdown voltage of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure to 90% or more of the dielectric breakdown voltage of the heat transfer fluid before replacement, it can be suitably used as an alternative composition. The upper limit of the dielectric breakdown voltage of the heat transfer fluid is not particularly limited, but for example, it may be 120% or less of the dielectric breakdown voltage of the heat transfer fluid before replacement.

[0069] By setting the specific heat of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure to 90% or more of the specific heat of the heat transfer fluid before replacement, it can be suitably used as an alternative composition. The upper limit of the specific heat of the heat transfer fluid is not particularly limited, but for example, it may be 120% or less of the specific heat of the heat transfer fluid before replacement.

[0070] By setting the thermal conductivity of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure to 90% or more of the thermal conductivity of the heat transfer fluid before replacement, it can be suitably used as an alternative composition. The upper limit of the thermal conductivity of the heat transfer fluid is not particularly limited, but for example, it may be 120% or less of the thermal conductivity of the heat transfer fluid before replacement.

[0071] The boiling point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure can preferably be 105 °C or higher, more preferably 108 °C or higher. Also, the upper limit of the boiling point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, but for example, it can be 150 °C or lower, 130 °C or lower, or 120 °C or lower.

[0072] The pour point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure can preferably be -80 °C or lower, more preferably -100 °C or lower, and even more preferably -110 °C or lower. Also, the lower limit of the pour point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, but for example, it can be -180 °C or higher, or -160 °C or higher.

[0073] The kinematic viscosity at 25 °C of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure can preferably be 5.0 cSt or less, more preferably 4.5 cSt or less, still more preferably 4.0 cSt or less, and even more preferably 3.7 cSt or less. Further, the kinematic viscosity at 25 °C of the composition for a heat transfer fluid of the present disclosure can be 1.0 cSt or more, for example, 1.2 cSt or more, 2.0 cSt or more, 2.6 cSt or more, or 3.1 cSt or more.

[0074] The relative permittivity of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure can preferably be 3.0 or less, more preferably 2.5 or less, and still more preferably 2.0 or less. Further, the lower limit of the relative permittivity of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, and can be, for example, 1.1 or more.

[0075] The dielectric strength of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure can preferably be 40 kV or more, more preferably 50 kV or more, and still more preferably 50 kV or more. Further, the upper limit of the dielectric strength of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, and can be, for example, 150 kV or less, or 100 kV or less.

[0076] The specific heat of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure at 30 °C can preferably be 800 J / kg·K or more, more preferably 900 J / kg·K or more, and still more preferably 1000 J / kg·K or more. Further, the upper limit of the specific heat of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, and can be, for example, 2000 J / kg·K or less, or 1500 J / kg·K or less.

[0077] The thermal conductivity of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure at 25°C is preferably 0.0570 W / (m·K) or more, more preferably 0.0600 W / (m·K) or more, still more preferably 0.0620 W / (m·K) or more, even more preferably 0.0660 W / (m·K) or more, and particularly preferably 0.0700 W / (m·K) or more. Also, the thermal conductivity of the composition for a heat transfer fluid of the present disclosure at 25°C may be 0.0750 W / (m·K) or less.

[0078] The boiling point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is the temperature at which a peak derived from endotherm is observed when the temperature is raised from 25°C at a rate of 5°C / min using DSC (Differential Scanning Calorimetry).

[0079] The pour point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is the temperature at which a peak derived from endotherm is observed when the temperature is raised at a rate of 5°C / min after cooling to below the freezing point with liquid nitrogen using DSC.

[0080] The dielectric constant of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is the value observed at a frequency of 1 kHz in an environment of a temperature of 25°C and a humidity of 60% using the capacitance method.

[0081] The kinematic viscosity and density of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure are the values measured using a kinematic viscometer SVM3001 manufactured by Anton Paar.

[0082] The dielectric breakdown voltage of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is the dielectric breakdown voltage when a liquid sample is immersed between spherical electrodes adjusted to a predetermined interval and the voltage is increased at a constant rate. The measurement conditions are as follows. Electrode shape: spherical (φ12.5 mm) Electrode interval: 2.5 mm Voltage increase rate: 2 kV / second Measurement atmosphere: in air (22°C, 57% RH)

[0083] The specific heat of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is the value obtained under the following conditions using DSC. Measuring device: Differential Scanning Calorimeter DSC8500 manufactured by Perkin-Elmer Heating rate: 10 °C / min Standard sample: Sapphire (-Al2O3) Atmosphere: In a dry nitrogen stream Sample container: Aluminum sealed container

[0084] The thermal conductivity of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is a value obtained by the unsteady thin wire method.

[0085] The compatibility of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is determined by whether it is compatible when mixed with the target solvent. Here, compatibility means that when the two are mixed, they become a uniform state, that is, the phases do not separate.

[0086] (Device for heat transfer) The present disclosure further provides a device for heat transfer, comprising a device and a mechanism for transferring heat to or from the device, the mechanism including the composition for a heat transfer fluid or the heat transfer fluid described above.

[0087] The device may be a component, an object to be processed, an assembly, etc. that is cooled, heated, or maintained at a predetermined temperature or temperature range. Examples of the device include electrical components, mechanical components, and optical components. For example, a wafer used for manufacturing semiconductors, semiconductor elements, computers, server computers, servers including blade servers; disk arrays / storage systems; storage area networks; storage connected to a network; storage communication systems; workstations; routers; telecommunications infrastructure / switches; wired, optical, and wireless communication devices; cell processing devices; printers; power supply devices; displays; optical devices; measurement systems including handheld systems; military electronic equipment; chemical reactors; fuel cells; heat exchangers; electrochemical cells; microprocessors; power control semiconductors; power distribution switch devices; power transformers; circuit boards; multi-chip modules; packaged or unpackaged semiconductor devices; lasers, etc. Preferably, it is a wafer used for manufacturing semiconductors.

[0088] The semiconductor element is a heat-generating element mounted on the device. Examples include a CPU, a GPU, an SSD, etc. The semiconductor element is composed of, for example, single-element silicon, germanium, compound semiconductors such as gallium arsenide (GaAs), gallium phosphide (GaP), indium phosphide (InP), gallium nitride (GaN), silicon carbide (SiC), etc.

[0089] When the device is a server computer, one logic board or a plurality of logic boards are arranged in the internal space. The logic board includes a number of heat-generating electronic components including at least one processor such as a CPU and a GPU. In addition, other heat-generating components of the computer such as, for example, a chipset; memory, graphics chips, network chips, RAM, power supply devices, daughter cards; storage drives such as solid-state drives and mechanical hard disks can also be used.

[0090] The heat transfer device is a heat transfer device for transferring heat between the heat transfer fluid and an object to be heat transferred, and heat transfer (transmission) is performed by making heat contact with the object to be heat transferred. For example, when heat is taken from the object to be heat transferred, it is cooling, and when heat is supplied, it is heating. Although it may be a different mechanism depending on each case, cooling and heating may be performed with one heat transfer device.

[0091] The heat transfer device is not particularly limited, and examples include a pump, a valve, a fluid confinement system, a pressure control system, a cooler, a heat exchanger, a heat source, a heat sink, a refrigeration system, an active temperature control system, a passive temperature control system, and the like.

[0092] More specifically, examples of the heat transfer device include a temperature-controlled wafer chuck in a plasma-enhanced chemical vapor deposition (PECVD) tool, a temperature-controlled test head for die performance testing, a temperature-controlled working area in semiconductor process equipment, a heat shock test bath solution reservoir, a constant temperature bath, etc., and preferably a temperature-controlled working area in semiconductor process equipment.

[0093] The object to be heat transferred that is brought into thermal contact with the heat transfer device is the same as described above.

[0094] The present disclosure also provides a semiconductor manufacturing apparatus including the heat transfer device of the present disclosure.

[0095] (Heat Transfer Method) The present disclosure discloses a heat transfer method including a step of preparing a device and a step of transferring heat to or from the device using the above-described composition for a heat transfer fluid or a heat transfer fluid. Here, heat can be transferred by arranging a heat transfer device so as to be in thermal contact with the device. When the heat transfer device is arranged so as to be in thermal contact with the device, it removes heat from the device, supplies heat to the device, or maintains the device at a selected temperature or temperature range. The direction of heat flow (from the device or to the device) is determined by the relative temperature difference between the device and the heat transfer device.

[0096] Although the present invention has been described above, the present invention is not limited to the above, and can be implemented in various forms without departing from the gist of the present invention.

Example

[0097] Hereinafter, the present disclosure will be described with reference to examples, but the present disclosure is not limited to the following examples.

[0098] (Production Example 1) Based on the method described in Chem Ber (1973), Vol. 106, pp2950-2959, an HFP trimer was obtained. The obtained HFP trimer was purified by distillation to remove impurities such as dimers and tetramers of hexafluoropropene. Further, the purified HFP trimer was separated by distillation into the compounds represented by formulas (I), (II) and (III).

[0099] The compounds represented by formulas (I), (II) and (III) obtained above were mixed so that the ratios of the compounds represented by formulas (I), (II) and (III) were the ratios shown in the following table, to obtain trimer mixtures 1 to 5. Examples 1 to 3 are trimer mixtures 1 to 3, and Comparative Examples 1 to 2 are trimer mixtures 4 to 5.

[0100]

Table 1

[0101] (Measurement of boiling point) The boiling point was measured as the temperature at which a peak derived from endotherm was observed when the temperature was raised from 25°C at 5°C / min using DSC.

[0102] (Kinematic viscosity) The density and kinematic viscosity at 25°C were measured using a kinematic viscosity system SVM-3001 manufactured by Anton Paar.

[0103] (Thermal conductivity) The thermal conductivity at 25°C was measured by the transient hot-wire method.

[0104] (Pressure loss) The pressure loss was calculated from the Hagen - Poiseuille's equation with the inner diameter of the pipe being 7.5 cm, the pipe length being 10 m, and the average flow velocity being 2.35 m / s.

[0105]

Table 2

[0106] The compositions of Examples 1 - 3 have a lower kinematic viscosity and a smaller pressure loss compared to the composition described in Comparative Example 1. Also, the compositions of Examples 1 - 3 have a higher boiling point and a smaller loss due to vaporization compared to the composition described in Comparative Example 2. Moreover, the compositions of Examples 1 - 3 have sufficient thermal conductivity.

Industrial Applicability

[0107] The heat transfer fluid and the heat transfer fluid composition of the present disclosure can be suitably used in various applications that require heat transfer, particularly in semiconductor manufacturing processes.

Claims

1. The following formulas (I) to (III): 【Chemistry 1】 The hexafluoropropene trimer is represented by A heat transfer fluid composition, comprising the compound represented by formula (I) in an amount of 10 mass % or more and less than 85 mass % based on the total amount of the compounds represented by formulas (I) to (III).

2. The heat transfer fluid composition according to claim 1, wherein the compound represented by formula (I) is contained in an amount of 30 mass% or more and less than 85 mass% based on the total amount of the compounds represented by formulas (I) to (III).

3. The heat transfer fluid composition according to claim 1, wherein the compound represented by formula (I) is contained in an amount of 50 mass% or more and less than 60 mass% based on the total amount of the compounds represented by formulas (I) to (III).

4. The heat transfer fluid composition according to claim 1, which is used in a semiconductor manufacturing process.

5. A heat transfer fluid comprising the heat transfer fluid composition of claim 1.

6. The heat transfer fluid of claim 5 further comprising a stabilizer.

7. 6. The heat transfer fluid of claim 5 used in semiconductor manufacturing processes.

8. 10. Use of the heat transfer fluid composition according to claim 1 or the heat transfer fluid according to claim 5 for heat transfer.

9. A device, A mechanism for transferring heat to or from said device, comprising the heat transfer fluid composition of claim 1 or the heat transfer fluid of claim 5. An apparatus for heat transfer comprising:

10. 10. The heat transfer apparatus of claim 9, wherein the device is a wafer used to manufacture semiconductors.

11. A semiconductor manufacturing device comprising the heat transfer device according to claim 9.

12. Providing a device; transferring heat to or from said device using the heat transfer fluid composition of claim 1 or the heat transfer fluid of claim 5; A method of heat transfer comprising:

13. The heat transfer method of claim 12 , wherein the device is a wafer used to manufacture semiconductors.

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