Resist composition, resist pattern forming method, compound, and acid diffusion control agent

JP2025187717APending Publication Date: 2025-12-25TOKYO OHKA KOGYO CO LTD
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Patent Information

Application Number
JP2024096738
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-06-14
Publication Date
2025-12-25

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Abstract

To provide a resist composition which achieves higher sensitivity and enhances lithographic characteristics such as resolution and dimensional uniformity in resist pattern formation, and to provide a compound useful as an acid diffusion control agent.SOLUTION: The resist composition generates an acid upon exposure, changes its solubility in a developer by the action of an acid, and contains: a base component which changes its solubility in a developer by the action of an acid; and a compound represented by formula (d0). In the formula (d0), Rd1 represents an alkyl group; k represents an integer of 2 or more; h represents an integer of 0 or more; Rd0 represents a substituent; and j represents an integer of 0 or more, provided that 5+2h≥j+k, k is an integer of 2 to 5 when h is 0, and k is 2 or 3 when h is an integer of 1 or more, m represents an integer of 1 or more, and Mm+ represents an m-valent organic cation.SELECTED DRAWING: None
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Patent Citations

  • Resist composition, resist pattern formation method, compound and acid diffusion control agent

    JP2022014782A