Integrated structure, radar with two stackable radar modular assemblies (RMA)

Abstract

A radar array assembly is provided that includes a first chassis and a first vertical stiffener. The first chassis is configured to house a first set of array electronics and a second set of array electronics. The first vertical stiffener is disposed within and operatively coupled to the first chassis, enabling the first chassis to be resistant to buckling and defining a first cavity in which the first set of array electronics is disposed and a second cavity in which the second set of array electronics is disposed. The first vertical stiffener is configured to be incorporated within the first set of array electronics and the second set of array electronics, and the first vertical stiffener includes a first integrated cooling manifold configured to cool both the first set of array electronics and the second set of array electronics.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to devices, systems, and methods for operating devices such as radar systems. More particularly, the present disclosure describes embodiments of devices, systems, and methods for creating phased array radar systems that are modular, scalable, and stackable.

Background Art

[0002] Antenna arrays for radar systems can include active electronically scanned array (AESA) antennas, as is known in the art. Typically, the basic building block of an AESA is a transmit / receive (T / R) module, which can be packaged to form AESA antenna elements and can include a radiator, a low-noise amplifier (LNA) for reception, a power amplifier (PA) for transmission, and various digital control phase or delay and gain components. Some of these T / R modules are arranged on an antenna panel in a grid format for transmitting and receiving radar signals. By digitally controlling the transmit and receive gains and phases, the AESA antenna can steer or point the resulting antenna beam without physically moving the antenna panel. Modern low-cost AESA antenna panels use printed circuit radiators connected to surface-mounted monolithic microwave integrated circuit (MMIC) devices. The MMIC devices include an LNA, a PA, and phase / gain control circuits, all of which are implemented on a single printed circuit board (PCB).

[0003] In recent years, AESA antenna array architectures have been developed using modular and / or stackable components. FIG. 1 is a diagram of a prior art antenna array 100 architecture constructed using modular, stackable components as described in several commonly assigned patents and patent applications, including U.S. Patent No. 8,810,448, entitled "Modular Architecture for Scalable Phased Array Radars," issued on August 19, 2014, U.S. Patent No. 9,116,222, entitled "Modular Architecture for Scalable Phased Array Radars" (a division of U.S. Patent No. 8,810,448), issued on August 25, 2015, and U.S. Patent Publication No. 20210083399, entitled "Modular and Stackable Antenna Array," having application number 16 / 573,954, filed on September 17, 2019, and published on March 18, 2021 (hereinafter referred to as the "‘954 application") in this specification. The disclosure of each of these documents is incorporated herein by reference.

[0004] As shown in FIG. 1 and further described in the above patent documents, a plurality of power and beamforming building blocks 102 can be arranged in rows and columns in the array 116. Each modular building block (MBB) 102 (also referred to herein as a radar modular assembly (RMA) and / or a functional building block (FBB)) can include a plurality of transmit / receive integrated multi-channel modules (TRIMM) cards 110, as well as its associated power and signal electronics cards, such as a plurality of TRIMM, synthesizer cards, DREX (digital receiver exciter) cards 106, synthesizer 108, and auxiliary power controller cards 104. In some embodiments, the RMA 102 can be based on the radar module 10 shown in FIG. 2, similar to the radar module 10 of FIG. 1A of the ‘448 patent.

[0005] As described in Patent No. ‘448, the radar module 10 includes a chassis 11 including a top cold plate 12, a supply manifold 14a having an inlet port 42, a return manifold 14b having an outlet port 22, a bottom cold plate 16, and a front plate 18. The chassis 11 is configured to hold LRUs (e.g., circuit cards) such as a transmit / receive integrated microwave module (TRIMM) 32, and the LRUs include a transmit / receive (T / R) module (33), a dual digital receiver exciter (DDREX) module 34, a synthesizer module 36, and an auxiliary / controllers module 40. The chassis 11 performs a cooling function. For example, a large amount of heat that needs to be dissipated is generated by the T / R module 33, and if not dissipated, the active circuits (e.g., power amplifiers) will not operate properly. The supply manifold 14a includes a channel for receiving coolant at the inlet port 42. The coolant circulates through the entire chassis 11 and is removed by the return manifold 14b and exits through the outlet port 22. In particular, the chassis 11 functions as a heat sink that takes heat away from active circuits (e.g., within the T / R module 33). The chassis 11 includes retaining screws 46 attached to the supply manifold 14a and the return manifold 14b.

[0006] In this exemplary architecture of the RMA102, each individual TRIMM card 110 may be replaceable, and the architecture may be modular in modular building blocks. A plurality of MBB / RMA102s can be combined to form a modular radar assembly (MRA), and a plurality of MRAs can be combined together to form a single radar antenna array 114. As further described in the above-mentioned '954 application, in the example of FIG. 1, a group of RMA102s can be coupled together with its own support structure 122 to form a building block section 112 of a modular radar assembly (MRA) 114, where each section 112 is configured to have its own respective connections for power, cooling, control signals, and beamforming, which are coupled in parallel such that each section 112 can function independently of the others from section to section. In the antenna array 100 of FIG. 1, this enables creating an antenna array of any desired size, including forming the array surface 120 by combining the sections 112 (e.g., stacking or placing adjacent to each other) and aligning the surfaces of each respective MRA sub-section 112 to create a single uniform array surface 120.

Summary of the Invention

[0007] The following presents a simplified summary in order to provide a basic understanding of one or more aspects of the embodiments described herein. This summary is not an extensive overview of all possible embodiments, and is not intended to identify key or essential elements of the embodiments, nor to delineate their scope. Rather, the primary purpose of this summary is to present some concepts of the embodiments described herein in a simplified form as a prelude to the more detailed description that is presented later.

[0008] For example, the embodiment described in the '954 application, as shown in FIG. 1, is useful for creating a radar system that can manufacture antenna arrays of any size that maintain the ability to easily increase the size, sensitivity, and functionality of the antenna array, and can provide scalable and stackable options. However, since the size of the support structure 122 (FIG. 1), which is provided behind the array 114 itself (actually, behind each section 112), is large and heavy, the embodiment may not be very suitable for smaller radar systems that may require only a few RMA102 (e.g., 2 to 8 RMA102). A number of applications have been developed that require smaller radars, such as radars having a size in the range of 2 to 6 MBBs. One problem with these applications is that the smaller the radar, the more likely it is that each size and configuration will require a new structural design because the support structure 122 is not used due to its size and weight. Thus, when a radar constructed using standard MBB102 is made smaller, it may be necessary to design a new support structure for each smaller radar configuration.

[0009] Another problem with the arrangement of FIG. 1 is that in some embodiments of the modular radar assembly (MRA) 114, it may be difficult to maintain a lattice structure along the edges or each MRA 114. As a result, in some embodiments, there may be gaps between the edges of the MRA. As is understood in the art, maintaining a consistent lattice spacing is important in antenna operation. For example, the higher the frequency at which the antenna operates, the narrower the lattice spacing between the active elements needs to be, so the space left for the active circuit or other functions becomes less. If a λ / 2 (half-wavelength at the transmission frequency) spacing is required for a wide scan angle, the lattice spacing becomes even narrower. Gaps within the lattice can cause problems such as undesirable changes in the antenna pattern and grounding problems. When multiple antenna elements operate together to create an antenna pattern (e.g., when the antenna elements are excited simultaneously), it can also be very important to have a common ground potential between the elements. If the ground is separated, or if the lattice spacing loses consistency and / or becomes too large, as those skilled in the art will understand, the quality of the resulting antenna pattern (created by multiple antenna elements at once) can degrade, and problems including signal loss, resonance effects, "sucking out" (nulls), etc. can occur.

[0010] When using a structure such as the radar module 10 (FIG. 1) as part of the RMA102 and / or MRA114, this design (e.g., as shown in FIG. 1A of the '448 patent and as described above in the description of FIG. 1) includes its cooling manifold (e.g., supply manifold 14a and return manifold 14b) along the outer wall portion of the chassis 11, including the inlet port 42 and the outlet port 22. Therefore, there may be a problem of maintaining the aforementioned grid spacing. The space and thickness occupied by this manifold arrangement (on both sides of the chassis 11) can increase the size of the gap between the MRAs (especially when the MRA102s are adjacent and each has the same structure such that the cooling manifold from one MRA is arranged relative to the cooling manifold from another MRA). When the space is occupied by these manifolds above the outside of the chassis, it may be difficult to maintain the grid and the grid spacing at the edge of the antenna array.

[0011] Certain embodiments of this specification further elaborate on the RMA design described in Patent No. ‘448 and Application No. ‘354. For example, by creating a structure of two RMAs with a single shared cooling manifold arrangement disposed between the two RMAs, it helps to address at least this problem. Since the outer wall portion of the 2-RMA arrangement does not need to have both manifolds housed therein, it can be made thinner. Thus, the overall arrangement of two RMAs according to the embodiments of this specification allows the grid spacing on the antenna surface to be closer compared to the case of using the two RMAs 102 in FIG. 1 that use the chassis 11 shown in FIG. 1. Further, the central shared manifold between the two RMAs is also configured to be operable as an internal support structure of the RMA within the building block itself, within the array grid (between the TRIMMs). For example, in certain embodiments, a structure is added and the chassis 11 is modified by providing additional internal supports via a stiffener structure that is also configured to house the cooling manifold. The additional support and strength provided by the stiffener structure enables stacking of the 2-RMA structure without the need for the bulky, heavy support structure 122 of FIG. 1. In certain embodiments, the stackability may enable the creation of smaller-sized radars, such as up to the height of three double-RMA units, with any desired width.

[0012] Furthermore, certain embodiments of the present specification can expand and improve the above system because they can form a radar using the double RMA structure described in certain embodiments of the present specification without requiring significant additional structures behind the array. For example, certain embodiments provide an RMA structure with built-in self-support via a vertical manifold and an array plate. Thus, the double RMA structure of the present specification is self-supporting (i.e., has built-in self-support, particularly by vertical stiffeners and an array plate, as further described below) and stackable, enabling many realizable configurations with little to no non-recurring engineering (NRE) costs. Limited custom structures may be provided to enable the radar being formed to have the correct height (e.g., by placing it on a tower, pedestal, or other separate structure), movement (e.g., by placing it on a rotating structure), and / or mobility (e.g., by placing it on a ship, moving vehicle, truck, aircraft, etc.).

[0013] In one aspect, a radar array assembly is provided that includes a first chassis and a first vertical stiffener. The first chassis is configured to house a first set of array electronics and a second set of array electronics. The first vertical stiffener is disposed within and operably coupled to the first chassis, enabling the first chassis to be resistant to buckling and defining a first cavity in which the first set of array electronics is disposed and a second cavity in which the second set of array electronics is disposed. The first vertical stiffener is configured to be incorporated within the first set of array electronics and the second set of array electronics and includes a first integrated cooling manifold configured to cool both the first set of array electronics and the second set of array electronics.

[0014] In some embodiments, the first chassis includes a first channel configured to allow coolant to flow therethrough, the first vertical stiffener includes a second channel configured to allow coolant to flow therethrough, and the first channel and the second channel are operably in communication. In some embodiments, the radar array assembly further includes a first array plate having a first side and a second side opposite the first side, the first array plate is coupled to the first vertical stiffener, the first array plate includes a third channel configured to allow coolant to flow therethrough, and the third channel is operably in communication with at least one of the first channel and the second channel.

[0015] In some embodiments, the radar array assembly further includes a first array plate having a first side and a second side opposite the first side, the first array plate is coupled to the first vertical stiffener, the first array plate is configured to support a first radiator assembly and a second radiator assembly, the first radiator assembly and the second radiator assembly are operably in communication with a first set of array electronics and a second set of array electronics, respectively, and the first array plate is configured to allow the first radiator assembly and the second radiator assembly to be interlocked and aligned to create a single monolithic array plane. In some embodiments, the first vertical stiffener and the first array plate, when combined with the first chassis, provide built-in self-support to the radar array assembly. In some embodiments, the first vertical stiffener and the first array plate, when combined with the first chassis, are configured to allow the first chassis to be stacked on top of a second chassis identical to the first chassis to double the size of the single monolithic array plane.

[0016] In some embodiments, the radar array assembly is a first array plate having a first side and a second side opposite the first side, coupled to a first vertical stiffener, and having a first portion associated with a first set of array electronics and a second portion associated with a second set of array electronics, a first radiator assembly operably coupled to the first portion of the first array plate and configured to operably communicate with the first set of array electronics, and a second radiator assembly operably coupled to the second portion of the first array plate and configured to operably communicate with the second set of array electronics, the first array plate being configured to support the first radiator assembly and the second radiator assembly and configured to allow the first radiator assembly and the second radiator assembly to be interlocked and aligned to create a single monolithic array face.

[0017] In some embodiments, the radar array assembly is a first array plate having a first side and a second side opposite the first side, the first array plate being coupled to a first vertical stiffener, the first array plate being configured to support a first radiator assembly and a second radiator assembly, the first radiator assembly and the second radiator assembly each being operably communicative with a first set of array electronics and a second set of array electronics, the first array plate being configured to allow the first radiator assembly and the second radiator assembly to be interlocked and aligned to create a single monolithic array surface, a first array plate; a second chassis operably coupled to the first chassis, the second chassis being configured to house a third set of array electronics and a fourth set of array electronics, the third set of array electronics and the fourth set of array electronics being coupled to the second chassis by respective second support structures housed within the second chassis, a second chassis; a second vertical stiffener disposed within and operably coupled to the second chassis, the second vertical stiffener being configured to be incorporated within the third set of array electronics and the fourth set of array electronics, the second vertical stiffener including a second integrated cooling manifold configured to cool both the third set of array electronics and the fourth set of array electronics, the second vertical stiffener; a second array plate having a first side and a second side opposite the first side, the second array plate being coupled to the second vertical stiffener, the second array plate being configured to support a third radiator assembly and a fourth radiator assembly, the third radiator assembly and the fourth radiator assembly each being operably communicative with the third set of array electronics and the fourth set of array electronics, the second array plate being such that the third radiator assembly and the fourth radiator assembly are part of a single monolithic array surface,It further includes a second array plate configured to be interlocked with and aligned with the first radiator assembly and the second radiator assembly.

[0018] In certain embodiments, the first chassis includes a first side disposed adjacent to the first cavity and a second side disposed adjacent to the second cavity, and the second chassis is operably coupled to the first chassis along one of the first side and the second side. In certain embodiments, the second chassis is stacked on top of the first chassis.

[0019] In some embodiments, the first chassis includes a first side disposed adjacent to the first cavity and a second side disposed adjacent to the second cavity, the second chassis includes a third side disposed adjacent to the third cavity and a fourth side disposed adjacent to the fourth cavity, and the radar array assembly further includes a splice plate configured to fix at least one of the first side and the second side of the first chassis to at least one of the third side and the fourth side of the second chassis.

[0020] In some embodiments, the radar array assembly further includes a top plate operably coupled to the top of the first chassis and configured to cover the top surface of the first vertical stiffener and the top side of the first cavity, and a bottom plate operably coupled to the bottom of the first chassis and configured to cover the bottom surface of the first vertical stiffener and the bottom side of the first cavity and the bottom side of the second cavity, and the top plate, the bottom plate, and the first chassis cooperate to provide a watertight and electromagnetic interference (EMI) resistant housing for the first set of array electronics and the second set of array electronics.

[0021] In another aspect, a radar module is provided that includes a first set of array electronics, a second set of array electronics, a chassis, a vertical stiffener, and an array plate. The first set of array electronics is operably communicative with a first set of radiators integrated within a first radiator assembly. The second set of array electronics is operably communicative with a second set of radiators integrated within a second radiator assembly. The chassis is configured to house the first set of array electronics and the second set of array electronics, and the first set of array electronics and the second set of array electronics are coupled to the chassis by respective support structures housed within the chassis. The vertical stiffener is disposed within the chassis and operably coupled to the chassis to enable the chassis to be resistant to buckling, and the vertical stiffener is configured to be incorporated within the first set of array electronics and the second set of array electronics, and is configured to define within the chassis a first cavity in which the first set of array electronics is disposed and a second cavity in which the second set of array electronics is disposed, and the vertical stiffener includes an integrated cooling manifold configured to cool both the first set of array electronics and the second set of array electronics. The array plate has a first side and a second side opposite the first side, and the array plate is coupled to the vertical stiffener and is configured to support the first radiator assembly and the second radiator assembly, and the array plate is configured to enable the first radiator assembly and the second radiator assembly to be interlocked and aligned such that they create a single monolithic array face of the radar module.

[0022] In some embodiments, the chassis includes a first channel configured to allow coolant to flow therethrough, the vertical stiffener includes a second channel configured to allow coolant to flow therethrough, and the first channel and the second channel are operatively connected. In some embodiments, the array plate includes a third channel configured to allow coolant to flow therethrough, and the third channel is operatively connected to at least one of the first channel and the second channel. In some embodiments, the first channel is operatively connected to at least one of a coolant inlet port and a coolant outlet port integrated within the vertical stiffener. In some embodiments, the integrated cooling manifold further includes a supply manifold operatively connected to the coolant inlet port and a return manifold operatively connected to the coolant outlet port.

[0023] In some embodiments, each of a first set of array electronics and a second set of array electronics includes a plurality of radar transmit / receive (T / R) modules, each T / R module including a power supply and a beamforming signal, the power supply and the beamforming signal being connected in parallel to each of a first set of radiators and a second set of radiators.

[0024] In another aspect, an antenna array including a plurality of stacked radar modules is provided, each radar module including a first set of array electronics, a second set of array electronics, a chassis, a vertical stiffener, and an array plate.

[0025] The first set of array electronic devices is operably communicative with a first set of radiators integrated within a first radiator assembly. The second set of array electronic devices is operably communicative with a second set of radiators integrated within a second radiator assembly. The chassis is configured to house the first set of array electronic devices and the second set of array electronic devices, and the first set of array electronic devices and the second set of array electronic devices are coupled to the chassis by respective support structures housed within the chassis. A vertical stiffener is disposed within the chassis and operably coupled to the chassis to enable the chassis to be resistant to buckling, and the vertical stiffener is configured to be incorporated within the first set of array electronic devices and the second set of array electronic devices. Within the chassis, a first cavity in which the first set of array electronic devices is disposed and a second cavity in which the second set of array electronic devices is disposed are defined, and the vertical stiffener includes an integrated cooling manifold configured to cool both the first set of array electronic devices and the second set of array electronic devices. The array plate has a first side and a second side opposite the first side, and the array plate is coupled to the vertical stiffener and configured to support the first radiator assembly and the second radiator assembly, and the array plate is configured to enable the first radiator assembly and the second radiator assembly to be interlocked and aligned such that each creates a single monolithic array face of a respective radar module.

[0026] In some embodiments, the chassis, the vertical stiffener, and the array plate of each radar module are configured such that each monolithic array face of each radar module aligns with each other monolithic array face within the plurality of radar modules to create a single monolithic array face of the antenna array, and the single monolithic array face has no interruptions within the array lattice of the single monolithic array face of the antenna array.

[0027] It should be understood that the individual elements of the different embodiments described in this specification can be combined to form other embodiments not specifically described above. The various elements described in the context of a single embodiment may be provided separately or in any suitable sub-combination. It should also be understood that other embodiments not specifically described herein are within the scope of the claims included herein.

[0028] Details regarding these and other embodiments are described more fully herein.

[0029] The advantages and aspects of the embodiments to be described, as well as the embodiments themselves, will be more fully understood in conjunction with the following detailed description and the accompanying drawings.

Brief Description of the Drawings

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DETAILED DESCRIPTION OF THE INVENTION

[0031] The drawings are not to scale and instead are emphasized to show the principles and features of the embodiments of the present disclosure. In the drawings, like reference numerals indicate like elements.

[0032] Before describing the details of particular systems, devices, and methods, it should be noted that the concepts disclosed herein include, but are not limited to, new structural combinations of components and circuits, and are not necessarily limited to their specific detailed configurations. Thus, the structures, methods, functions, controls, and arrangements of components and circuits are, for the most part, shown in the drawings by simplified block diagrams and schematics that are readily understandable so as not to obscure the disclosure with structural details that would be readily apparent to one of ordinary skill in the art who benefits from the description herein.

[0033] Furthermore, the following detailed description is provided in the context of a target detection system (e.g., a radar system) configured to detect, track, monitor, and / or identify a target in at least some examples, where the target can include, but is not limited to, aircraft (both unmanned and manned), unmanned aerial vehicles, unmanned autonomous vehicles, robots, ships, spacecraft, autonomous vehicles, and celestial bodies, as well as birds, insects, and rain. At least some embodiments herein can be used with any system related to any radar application, including but not limited to military radars, air traffic control radars, weather monitoring radars, etc.

[0034] It is believed that users and purchasers of radar systems would prefer to avoid the cost, risk, and extended time for developing and deploying new radars. Recent radar development and advancements have focused on modulating scalable phased array technology to reduce the design required to adjust the sensitivity and aperture of radars. Specific examples of such modularization are described in some of the generally assigned patents and patent applications mentioned above. Using a scalable system such as the scalable phased array antenna described in the above-mentioned patent documents can mean that users and customers of radars are less averse to adapting these mature available radar solutions to new mission spaces.

[0035] Multiple applications have been developed that require smaller radars, such as radars having a size within the range of 2 to 6 RMAs. One problem with these applications is that each size and configuration may require a new structural design and / or significant design engineering for each configuration. Certain embodiments of the present specification further extend with respect to RMA designs known in the art (e.g., those described in the aforementioned '448 patent and '354 application), by including the RMA support structure within a building block in an array lattice (e.g., between the TRIMMs), eliminating the need for a separate support structure or other structure behind the array, and at least helping to address this problem. For example, certain embodiments of the present specification enable many realizable configurations that are self-supporting, stackable, and have little to no non-recurring engineering (NRE) costs.

[0036] In certain embodiments of the present specification, further described below, an integrated structure (IS2RMA) having two stackable RMAs is provided as a building block for constructing even more radar configurations. Since the building blocks of the IS2RMA are self-supporting, they can be stacked to create many configurations with little to no NRE. In some embodiments, the radar arrangement is made using a single RMA (half of the IS2RMA), and similar combinations can be created when an odd number of RMAs is required. In certain embodiments, the IS2RMA building blocks are configured to have an integrated internal structure that can support several more building blocks on top, providing an arrangement and configuration suitable for smaller 2- to 6-RMA radars, and allowing the radar to be easily configured to meet mission requirements with little or no new development.

[0037] As further described below, the stackable IS2RMA radar provides the following advantageous features in certain embodiments: For a scalable phased array that can be formed into many different types of radar array assemblies and antenna arrays having a single monolithic array face, a fully enclosed, electromagnetic interference (EMI) shielded, weather-resistant integrated structure is provided, providing a chassis having vertical stiffeners including an integrated cooling manifold, enabling the delivery and field installation of a fully integrated, calibrated, and tested radar, having an integrated structure that enables a rapid sensitivity improvement by stacking more IS2RMA radars on top of or along the sides, and enables stacking of multiple units without interrupting the array lattice, In certain embodiments, mature array technology can be adapted, utilized, and / or reused to enable a tower-based radar product line.

[0038] Before describing the details of certain improved systems, devices, and methods, it should be noted that the concepts disclosed herein include, but are not limited to, new structural combinations of software, components, and / or circuits, and are not necessarily limited to their specific detailed configurations. Thus, the structure, method, function, control, and arrangement of components and circuits are, for the most part, shown in simplified mechanical representations and simplified diagrams so as not to obscure the description of the structure in relation to the details of external components (e.g., power supplies, control electronics, communication sections) and cable wiring and connections, which will be readily apparent to those skilled in the art who benefit from the description herein.

[0039] According to one embodiment, FIG. 3 is a diagram 300 of an exemplary radar building block assembly IS2RMA302 fabricated using two radar module assemblies (RMA) radar building blocks 308, and FIG. 4 is a diagram of the array plate and vertical stiffener assembly 310 of FIG. 3. The assembly of two RMAs 308 in the particular configuration of the present specification in FIG. 3 is referred to as "IS2RMA" and is configured to include a particular chassis 315 (further described herein) as well as an array plate and vertical stiffener assembly 310 (shown in FIG. 3 and more particularly in FIG. 4), and associated array electronics 317 (see also FIG. 8A). The radar building block assembly IS2RMA302, also referred to herein as IS2RMA302, includes two RMAs 308 (one shown in cutaway in FIG. 3 to expose the synthesizer card 108). Each RMA 308 is substantially similar to the MBB / RMA 102 described above with reference to FIG. 1 and includes half of the array electronics 317 for IS2RMA302.

[0040] Each RMA308 includes the same functional components and includes its own respective set of array electronics, each of which includes several transmit / receive integrated multi-channel module (TRIMM) cards 110 and their associated power and signal electronics cards, synthesizer cards, DREX (Digital Receiver Exciter) cards 106, synthesizers 108, and auxiliary power controller cards 104. In certain embodiments, the set of array electronics housed in the MBB / RMA308 includes all of the electronic hardware and functionality of an antenna having a radiator, beamformer, TRIMM, DREX, and AC / DC power conversion. In certain embodiments, the set of array electronics 317 is operably communicative with each set of radiators within a radiator assembly 314 integrated into a radome assembly 312. In certain embodiments, each set of array electronics includes a plurality of radar transmit / receive (T / R) modules, each of which includes a power supply and a beamforming signal, and the power supply and beamforming signal are connected in parallel to each respective set of radiators within a radiator assembly 314 integrated into a radome assembly 312.

[0041] The building blocks of the MBB / RMA308, as will be appreciated, operate in parallel and are stand-alone (smaller) radars that can be increased in order to adjust the sensitivity, performance, and size of the radar. The exact array electronics 317 shown in the figure are provided by way of example and not limitation, and it will be understood that those skilled in the art will be able to implement the array electronics 317 in a plurality of different ways. Further, each of these functional components within the array electronics 317 is not specifically depicted in this figure as the focus in FIG. 3 is on the chassis structure and the elements therein.

[0042] Each of the two MBB / RMAs 308 within the IS2RMA assembly 302 has its own respective integrated radiator assembly 312 that includes a plurality of radiators (heat dissipating elements) as part of the radiator assembly 314. The integrated radiator 312 is substantially the same size as the radiator assembly 314, which consists of a plurality of heat dissipating elements. The integrated radiator 312 includes a radome 309, which in certain embodiments is a protective composite cover. Advantageously, as will be appreciated, the radome 309 is also modular and allows stacking. The integrated radiator 312 is directly attached to the radiator assembly 314 and is configured to be part of each MBB / RMA 308. The integrated radiator 312 is configured, in certain embodiments, as is understood in the art, by the arrangement of interlocking edges 319, to be closely spaced along the array plane and to enable consistency. Thus, the integrated radiator 312 of each MBB / RMA 308 forms part of the array plane in the resulting radar when, for example, as is understood, the IS2RMA assembly 302 is stacked and combined as described herein. Further, when a plurality of IS2RMA assemblies 302 are stacked or otherwise combined, the integrated radiator 312 allows the overall array structure to be the same size as the active array plane rather than extending beyond the edges of the active array plane.

[0043] As will be appreciated, since the built-in supports provided as part of the IS2RMA302 assembly do not extend beyond the active area of the array face formed by the plurality of integrated radiators 312 interconnected via the lattice structure interlocking edges 319, the IS2RMA assembly 302 can be stacked without interrupting the block spacing between adjacent stacked IS2RMA assemblies 302. Thus, all IS2RMA assemblies 302 can operate in the same manner regardless of the array size. The integrated radiators 312 (including its radome 309) enable the modular stacking approach described herein without interrupting the unit cell spacing between adjacent stacked IS2RMA308 assemblies that would otherwise adversely affect the RF performance of the system. Further, the design of the chassis 315, and the design of the array plate and vertical stiffener assembly 310, further serve to improve the strength of the assembly for stacking and further reduce the spacing between assemblies, as further described herein.

[0044] Figures 5 - 8B provide further views of the chassis 315 of the IS2RMA assembly 302 and the array electronics 317 disposed therein. FIG. 5 is a first view 500 of the IS2RMA chassis showing, according to one embodiment, the array plate and vertical stiffener assembly 310 installed and the top cover plate removed. FIG. 6 is a second view 600 of the IS2RMA chassis of FIG. 5 showing, according to one embodiment, the top cover plate 304 installed. FIG. 7 is a third view 700 of the IS2RMA chassis 315 of FIG. 6 showing, according to one embodiment, the array electronics 317 installed and both rear doors 313 removed. FIG. 8A is another view 800A of the IS2RMA chassis 315 with an array plate and vertical stiffeners showing, according to one embodiment, the cooling manifold path. FIG. 8B is a view of an exemplary block of the RMA S - band array electronics 317 installed within the chassis of FIG. 8A, according to one embodiment. FIG. 8B shows that the array electronics assembly 317 includes a first portion 317a and a second portion 317b, which are separable at a split point 804. Each array electronics assembly 317a, 317b includes its own respective support structure 808a, 808b. Some cooling manifolds 802, 804, 805 are also part of the array electronics assembly 317.

[0045] Referring to FIGS. 3 to 8A, the chassis 315 of the IS2RMA assembly 302 (which is part of the housing of the IS2RMA assembly 302) includes a top plate 304, two side plates 306 (only one is visible in FIG. 3), a bottom plate 360, two rear corner supports 311 (only one is visible at 311), an array plate and vertical stiffener assembly 310, and respective rear doors 313 (only one rear door 313 is shown in FIG. 3 for clarity and to allow additional details to be seen) over each RMA 308 housed in the IS2RMA assembly 302. Not only the top plate 304 and the bottom plate 360, but also the rear doors 313, as will be understood, help ensure that the entire chassis of the IS2RMA assembly 302 is watertight and resistant to electromagnetic interference (EMI). As further shown herein, when the IS2RMA assemblies 302 are stacked, either the top plate 304 or the bottom plate 360 is removed, so that there is no structure between the first IS2RMA assembly 302 stacked on top of the second IS2RMA assembly 302 (e.g., further shown in FIGS. 9A - 9B, FIGS. 10A - 10D, FIGS. 11A - 11B, etc., which are further described below herein) other than the built-in housing 808 of the array electronics 317. This helps to minimize the spacing between the IS2RMA assemblies 302.

[0046] Each side plate 306 is made of a material, such as aluminum, that can help ensure that the IS2RMA assembly 302 is watertight and EMI resistant, but this is not limiting. In certain embodiments, the side plate 306 is made of a conductive material. The overall thickness of the side plate 306 (also referred to as side panel 306) is configured and sized to help ensure that all of the resulting antenna elements in the array are on the grid when the IS2RMA assemblies 302 are stacked in parallel. The side plate 306 is different from the supply manifold 14a and the return manifold 14b that form the side covers of the chassis 11 of the radar module 10 of FIG. 1 in that the side plate 306 is thinner and does not need to include a part of the cooling manifold structure (and thus does not increase the thickness of the side plate). The side plate 306 is held by a plurality of screws 319, as shown in FIG. 3 (for clarity, not all of the screws 319 are depicted in the figure, but should be understood).

[0047] The array plate and the vertical stiffener assembly 310 include a vertical stiffener 334 and an array plate 332 that are operatively coupled together. In certain embodiments, a groove or other mating structure is formed on the array plate 332 to enable coupling of the vertical stiffener 334 thereto. The vertical stiffener 334, as shown in FIG. 4, has not only a top surface and a bottom surface, but also side portions facing each cavity formed within the chassis 315. The array plate 332 and the vertical stiffener 334 each have a first side portion and a second side portion on the opposite side of the first side portion. In certain embodiments, the vertical stiffener 334 is coupled to the array plate 332 by a plurality of screws (not shown). In certain embodiments, the vertical stiffener 334 is coupled to the array plate 332 by an adhesive. Those skilled in the art will understand that there are numerous ways to couple the array plate 332 and the vertical stiffener 334 together, and the examples provided herein are illustrative and not intended to be limiting. For example, in some embodiments, the array plate 332 and the vertical stiffener 334 are bolted together, and optionally, in certain embodiments, pins may be used for alignment. The vertical stiffener 334, in some embodiments, is not coupled to the array plate 332, but rather is directly coupled to the chassis 315.

[0048] The array plate 332 is a sheet of material configured to provide special support to the rear of each integrated radiator 312 associated with each RMA within the IS2RMA assembly 302. The array plate 332 has a size in certain embodiments that can provide structural integrity and support to each integrated radiator 312, including when the IS2RMA assemblies 302 are stacked. The array plate 332 is implemented in certain embodiments as a single sheet configured to support two integrated radiators 312. In certain embodiments, the array plate 332 can be formed as an array plate structure that can include one portion that supports two radiators, or as two separate array plate portions (not shown but readily understood), each array plate portion being configured to support a respective integrated radiator 312 and each separate array plate portion being coupled to a vertical stiffener 334. In some embodiments, the array plate 332 is formed using a single sheet of a high-strength material or a sufficiently rigid material such as aluminum, but this is not limiting. The array plate 332 can be configured to allow the radome assemblies 312 coupled thereto to be interlocked and aligned such that they create a single monolithic array surface.

[0049] Those skilled in the art will understand that various materials may be suitable for use when implementing the array plate 332, depending on the overall weight of the IS2RMA assembly 302, the environmental conditions under which it needs to operate, the cost, etc. Also, the array plate 332 helps reduce the need to provide additional supports (such as the support structure 122) throughout the structure of the IS2RMA assembly 302. In certain embodiments, as shown in FIG. 4, the array plate 332 includes one or more channels 342, which can be used, as needed, for routing wiring and / or cable harnesses, routing coolant and / or coolant tubes, etc. For example, in at least one embodiment, the channels 342 on the array plate are configured to receive coolant. Further, when the array plate 332 is used to assist in cooling support, advantageously, the array plate 332 is made of a material having good thermal conductivity. In some embodiments, as shown in FIG. 4, the array plate includes a plurality of holes or bores 321, which can be used for various purposes as needed, as will be understood by those skilled in the art, for example, for RF connections between the T / R module and the integrated radiator assembly, for pass-throughs for mounting front-end electronic components, etc.

[0050] The vertical stiffener 334 is formed from a material (e.g., aluminum) having appropriate strength and rigidity to enable the chassis 315 to be resistant to buckling when stacked. Further, in certain embodiments, the material used to fabricate the vertical stiffener 334 is a material having good thermal conductivity to support the cooling function further described below. The vertical stiffener 334 includes a plurality of holes or bores, and as will be appreciated, if set screws 350 can be installed therein, the vertical stiffener 334 can have components of the IS2RMA304 assembly or other elements coupled thereto, and moreover, internal features of the stiffener (e.g., cooling manifold features) can be coupled. In certain embodiments, the vertical stiffener 334 includes one or more internal channels (not visible in the figures), and these internal channels can be operably in communication with corresponding channels 342 on the array plate 332, enabling a continuous flow of coolant between the cooling hoses and channels and the array plate 332. For example, in at least one embodiment, the channels of the vertical stiffener are configured to receive coolant and are operably in communication with one or more other channels, and the coolant is directed to those channels (e.g., channels 342 on the array plate) or into channels that are part of the cooling ribs 511 (see below), and the coolant is received from those channels. Further, as further described below, the cable tray cooling plate 504 (FIG. 5) also includes internal channels for the flow of coolant.

[0051] In certain embodiments, the vertical stiffener 334 also performs the cooling function of the chassis 315 and provides equivalent and / or auxiliary functions for the separate supply manifold 14a and return manifold 14b disposed as part of the outer wall portion of the chassis 11 within the chassis 11 of FIG. 1 (e.g., internal manifolds 335, 337 for providing cooling inlets and cooling return connections). In addition to the hoses associated with directing the coolant flow, having separate supply manifold 14a and return manifold 14b on other sides of the chassis 11, as done within the device of FIG. 1, and providing space for cable routing and wiring, for example, requires providing connections and space for these features on these outer portions, contributing to the overall width and thickness of the chassis 11 of FIG. 1, and as a result, increasing the spacing between the MRA and their radiator assemblies on the surface of the array. This increased spacing can, as described above, degrade the quality of the antenna pattern and cause grounding issues. In contrast, by implementing certain aspects of the cooling function, coolant flow, and / or cable support coupled to the vertical stiffener 334 or a portion thereof, this increased spacing can be reduced. In certain embodiments, this is achieved by repositioning a portion of the inlet hose and outlet hose to the vertical stiffener 334, as will be described later in connection with FIG. 5, and also by providing a cable tray / cooling plate structure coupled between the outer plate and the vertical stiffener. In some embodiments herein, even though a portion of the hoses and cooling function / cooling manifold(s) are embedded within the vertical stiffener 334 and / or within the array electronics 317 (particularly within the active array electronics), the overall space within the dimensions of the chassis 315 is conserved while providing the necessary cooling function for the active array electronics 317. In fact, in certain embodiments, embedding the cooling manifold function within the active array electronics can provide improved cooling compared to providing the cooling manifold on the outer wall portion of the chassis.

[0052] Referring to FIG. 5, arrows 572, 574 indicate the direction of the coolant flow within the cable tray cooling plate 504 which itself has internal channels for the coolant flow, as will be understood. Referring to the RMA on the left side of the image, the cable tray / cooling plate 504 and the side RMA cooling manifold 554 transport the coolant from the central vertical stiffener 334 in the directions of arrows 572 and 574 to the supply portion of the side plate 306. The coolant then flows through the side RMA cooling manifold 554 and returns to the central vertical stiffener 334. In the case of the RMA on the right side of the image, the internal channels of the cable tray / cooling plate 504 return the (here heated) coolant to the vertical stiffener 334 in the direction of arrow 570.

[0053] As is known, array electronic devices 317, particularly active array electronic devices such as transmit / receive (T / R) modules, generate a large amount of heat that needs to be dissipated. If this large amount of heat is not dissipated, active circuits (e.g., power amplifiers) will not operate properly. To provide cooling as part of the vertical stiffener 334, the vertical stiffener 334 includes a supply manifold 335 having a channel for receiving coolant at port 322, for example, by supply hose 326. FIG. 8A shows the positions of the supply manifold 335 and the return manifold 337, but of course these positions are not limiting. For example, the positions may be reversed. In certain embodiments, the cooling manifolds (e.g., supply manifold 335 and return manifold 337) of the vertical stiffener 334 are integrated manifolds built into the vertical stiffener 334. The coolant circulates throughout the chassis 315 and is removed via the return manifold 337 (FIGS. 6, 8A) and exits the coolant outlet port 320 via the coolant return hose 324. As will be appreciated, in certain embodiments, the chassis 315 also functions as a heat sink that extracts heat from the active circuits (e.g., within the T / R module), particularly when the chassis 315 is formed using a material with good thermal conductivity such as a metal material. In some embodiments, as shown in FIG. 4, the vertical stiffener 334 includes set screws 350 attached to the supply manifold 335 and the return manifold 337.

[0054] As seen in FIGS. 3 - 8A, the vertical stiffener 334 is provided with a cooling intake port 322 (FIG. 4) that can be coupled to the supply hose 326 for taking in coolant, and a cooling connection coupled to the coolant return hose 324 (FIG. 4). When the vertical stiffener 334 is coupled to the array plate 332 and positioned between the side plates 306, the cover plate 304, and the bottom plate 360, it forms four cavities 510, 512, 514, 516 (FIG. 5) in which the array electronic device 317 (FIG. 8B) is disposed.

[0055] Referring to FIG. 5, in certain embodiments, the chassis 315 includes additional cooling features within cavities 510, 512, 514, 516. Further, in certain embodiments, additional cooling is provided via top cold plates 523 and bottom cold plates 508 disposed at the top and bottom sides, respectively, of each of the cavities 510, 512, 514, 516. Further, cooling is provided to the edges of the TRIMMs within the cavities 510, 512, 514, 516. When an IS2RMA assembly 302 is stacked on top of another IS2RMA assembly 302 (e.g., as described herein in connection with FIGS. 9A - 12C), the bottom cold plate 508 serves to hold various electronic devices and modules because the IS2RMA assembly 302 is directly coupled to the top of another IS2RMA assembly 302 (with its top cold plate 523 also removed), note that there is no bottom plate 360 (bottom cover). Also, the chassis 315 can include additional built - in supports for routing cables, such as cable tray 503. Also, the chassis 315 includes a plurality of slots (not visible in the figure) for holding the TRIMM 110 and other array electronics, and the slots are disposed on both sides of a plurality of cooling ribs 511. In certain embodiments, the slots and the cooling ribs 511 together form a support structure for the array electronics. In certain embodiments, the top cold plate 523 and the bottom cold plate 508 each also include cooling ribs 511 having channels (not shown) for carrying coolant. Gaps between the cooling ribs 511 form slots (not visible but well understood) that hold the TRIMM 110 and other array electronics in a parallel configuration that contributes to efficient cooling of the array electronics.

[0056] The above IS2RMA assembly 302 is provided with a self-supporting built-in, EMI-shielded, weather-resistant, stackable integrated structure that is fully enclosed in a scalable phased array. For example, FIG. 9A is a diagram of an exemplary 4-RMA radar 900 made from a stack in which a first IS2RMA 302a and a second IS2RMA 302b are joined together. FIG. 9B is an illustration of a cutaway view 950 of the exemplary 4-RMA radar 900 of FIG. 9A according to one embodiment, and includes a splice plate according to one embodiment. To show the details inside the first IS2RMA 302a, the rear doors 313a, 313b of the first IS2RMA 302a are shown in a removed state, while the rear doors 313c, 313d of the second IS2RMA 302b are in place. The rear doors 313 are also EMI-resistant and watertight. The rear doors 313 may, as will be understood, be replaced with corresponding rear covers instead. Further, in the 4-RMA radar 900, the connector feedthroughs are also selected to be EMI-resistant and watertight.

[0057] Referring first to FIG. 9A, a top plate 304 coupled to the top of the first IS2RMA 302a ensures that the 4-RMA radar 900 has a watertight and EMI-resistant housing at its top. Similarly, a bottom plate 360 coupled to the bottom of the second IS2RMA 302b ensures that the 4-RMA radar 900 has a watertight and EMI-resistant housing at its bottom. As shown in both FIGS. 9A and 9B, there is no required structure or other support between the first IS2RMA 302a and the second IS2RMA 302b.

[0058] To further ensure that the entire housing of the 4-RMA radar 900 is waterproof and EMI resistant, in certain embodiments, the splice plate 902 is attached to the side of the 4-RMA radar 900, for example, by a plurality of set screws 904, and the splice plate 902 is configured to couple the first IS2RMA 302a to the second IS2RMS 302b. The splice plate 902 is coupled to the side plate 306a of the first IS2RMA 302a and the side plate 306b of the second IS2RMA 302b, as shown in FIG. 9A. Although not visible in the perspective view of FIG. 9A, in certain embodiments, the other sides of the 4-RMA radar 900 also have corresponding splice plates 902 similarly attached to the respective other side panels of the first IS2RMA 302a and the second IS2RMA 302b. Embodiments with a pair of splice plates 902 are shown, for example, in FIGS. 10A - 12C (further described herein). In embodiments where the IS2RMA assemblies 302 are not stacked but instead are arranged in parallel without stacking (e.g., FIG. 12D), as will be appreciated, the splice plates 902 are not required along the sides, but instead the splice plates may be arranged along the top side or the bottom side.

[0059] Figure 10A is a partial exploded view of the partially assembled chassis 315 of the 4-RMA radar of FIG. 9A, showing a front view of the array plates 332a, 332b and the vertical stiffener 334b (the vertical stiffener 334a is not visible in FIG. 10A) before the antenna radiator 312 (not shown in FIG. 10A) is installed. The serrated portion 1002b is configured as part of the bottom plate 306c as shown in FIG. 10A, and thus can fit into the radiator 312b as shown in FIG. 10B. FIG. 10B is a partial exploded view 1-25 of the partially assembled chassis of the 4-RMA radar of FIGS. 9A and 10A, showing a front view of the partially assembled chassis with the antenna radiators 312a, 312b, 312c, 312d installed according to one embodiment. As shown in FIGS. 10A and 10B, the serrated region 1004 at the bottom of the array plate 332a of the top IS2RMA chassis is configured to fit into the corresponding serrated edge at the top of the array plate 332b of the bottom IS2RMA chassis. However, when the integrated radiators 312a, 312b, 312c, 312d are attached (FIG. 10B), the top two integrated radiators 312a, 312b are configured to fit their top serrated edges with the serrated edges on the cover plate 304 and their bottom serrated edges (e.g., 1006a) with the top serrated edges of the corresponding bottom two integrated radiators 312c, 312d. Next, the bottom serrated edges of the bottom two integrated radiators 312c, 312d fit into the serrated edges on the bottom plate 360. This arrangement helps to minimize the spacing between the integrated radiators 312 of the 4-RMA radar 900.

[0060] Figure 10C is FIG. 1050 of the partially assembled chassis of the 4-RMA radar of FIG. 9A, showing a front view of the fully assembled exploded assembly of FIG. 10A before the antenna radiator 312 is installed according to one embodiment. FIG. 10D is a rear view of the partially assembled chassis 315 of the 2-RMA radar, showing a rear view of the array plate 332 and the vertical stiffener 334 installed in the chassis 315.

[0061] FIG. 11A is a front view 1100 of a partially assembled chassis 315 of a 4-RMA radar 900 of FIG. 9A, showing a yet-to-be-attached top cover plate 304, as well as a yet-to-be-attached first splice plate 902c and a second splice plate 902d, according to one embodiment. FIG. 11B is another front view 1150 of a partially assembled chassis 315 of a 4-RMA radar 900 of FIG. 9A, showing a top IS2RMA 302a and a bottom IS2RMA 302b before they are assembled together (the array electronics 317 are not visible in these figures).

[0062] FIGS. 12A - 12C show high-level steps depicting a method of doubling a radar in a particular embodiment using the above configuration. FIG. 12A is a front view of a first portion 1200 of an exemplary arrangement for doubling a radar, according to one embodiment. At the start in FIG. 12A, there is a 2-RMA radar assembly IS2RMA 302a. FIG. 12B is an exploded front view 1210 of a second portion of an exemplary arrangement for doubling the radar 302a of FIG. 12A. As shown in FIG. 12B, the top plate of the IS2RMA 302a is removed and another IS2RMA radar 302b is placed on top, but its bottom plate 360 is removed so there is no divider between the top IS2RMA 301a and the bottom IS2RMA 301b. Next, splice plates 902a, 902b are bolted to the sides. FIG. 12C is a front view 1250 of a third portion of an exemplary arrangement for doubling a radar, according to one embodiment, showing a 4-RMA radar assembly.

[0063] As will be appreciated, many different combinations of the IS2RMA assemblies 302 can be combined and stacked in the same manner as described above. For example, FIG. 12D is a front view of another arrangement 1260 that doubles the radar according to one embodiment, showing a parallel arrangement of a first IS2RMA assembly 302c and a second IS2RMA assembly 302d. As will be understood in the art, in certain embodiments, an additional bottom splice plate (not shown) may be used to couple the first IS2RMA assembly 302c to the second IS2RMA assembly 302d. In some embodiments, the IS2RMA assembly may include one or more lifting rings 1262. Further, FIGS. 13A-13E show additional combinations or portions of combinations that may be achievable (note that the splice plate of FIG. 13C is modified to be suitable for attaching three IS2RMAs with three IS2RMAs stacked).

[0064] Figure 13A is a rear perspective view of an exemplary single RMA radar 1300 in a 1x1 arrangement according to one embodiment. The single RMA radar 1300 differs from the RMA of FIG. 1 in that it has a chassis that incorporates the features of the single RMA radar of FIG. 13A as shown in FIGS. 3-4 for the IS2RMA assembly 302. That is, the single RMA radar has not only an array plate and vertical stiffener assembly having an array plate 332 (not visible but its position is shown) behind the integrated radiator 312, but also a supply manifold 335, a return manifold 337, a coolant inlet port 322, and a coolant outlet port 320, and includes a vertical stiffener 334 with a built-in cooling function. In certain embodiments, the single RMA radar 1300 may be coupled to the side of the IS2RMA assembly 302 or stacked on top of another single RMA radar 1300 if an odd number (e.g., three) of RMAs are desired. For example, assume a 3x2 radar is desired. The single RMA radar 1300 can be stacked on top of another single RMA radar 1300 and then coupled to a 2x2 radar (e.g., as shown in FIG. 13B). Further, as will be understood by those skilled in the art, in the case of stacking with the width of a single RMA, a cover is required over the cooling ports in the vertical stiffener assembly 310.

[0065] Figure 13B is a rear perspective view of an exemplary RMA radar in a 2x2 arrangement according to one embodiment. This arrangement is similar to the 4RMA radar of FIG. 12C, but a view from the back is shown. Also, FIG. 13B shows the coolant distribution within the side panels 306 of the chassis for each of the IS2RMA 301a, 302b. For example, the connection part 1302 is for taking in coolant and correlates to approximately the same position as the cooling manifold 554 of FIG. 5. The connection part 1303 is for the outlet direction of the heated coolant. FIG. 13C is a rear perspective view of an exemplary RMA radar in a 2x3 arrangement according to one embodiment. The 2x3 radar of FIG. 13C has a modified splice plate 903 configured to be mated and coupled (and provided with a watertight seal and an EMI-resistant seal) to a stack of three IS2RMA assemblies 302. FIG. 13D is a rear perspective view of an exemplary RMA radar in a 4x1 arrangement according to one embodiment. The 4x1 radar of FIG. 13D is similar to the 4x1 radar of FIG. 12D, but a rear view is shown. FIG. 13E is a rear perspective view of an exemplary RMA radar in a 4x2 arrangement according to one embodiment.

[0066] As will be appreciated, the IS2RMA assembly 302 can be implemented as a building block for creating and configuring many different types of radar systems other than those explicitly set forth and described herein, including non-military applications such as 5G systems, commercial radar systems (FAA (Federal Aviation Administration), meteorology, mapping, navigation, etc.), and commercial surveillance radar systems. As will be understood by those skilled in the art, the IS2RMA assembly 302 and its advantageous features (such as the array plate and vertical stiffener assembly including an integrated cooling function) also have commercial applicability, including as part of any type of stackable back-end processing that may require integrated cooling even when radar functionality is not required.

[0067] The terms "comprises", "comprising", "includes", "including", "has" and their composites mean at least "including but not limited to these". As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" include plural referents. The various elements described in the context of a single embodiment may be provided separately or in any suitable subcombination. Further, it will be understood that various changes in the details, materials and arrangements of the parts described and illustrated herein may be made by those skilled in the art without departing from the scope of the following claims.

[0068] Throughout the present disclosure, unless there is a clear indication to the contrary in the context, it should be understood that the individual elements as described may be singular or plural. For example, the terms "circuit" and "circuit configuration" and "module" can include either a single component or multiple components, which can be either active and / or passive and are connected or otherwise coupled together to provide the described function. In the drawings, like or related elements have like or related alphabetic, numeric or alphanumeric indicators. Further, although the disclosed embodiments have been described in the context of implementations using discrete components including one or more integrated circuit chips, alternatively, the functionality of any component or circuit may be implemented using one or more appropriately programmed processors depending on the signal frequencies or data rates to be processed and / or the functions to be achieved.

[0069] Similarly, further, in the figures of the present application, the total number of elements or components shown is not intended to be limiting, and those skilled in the art will recognize that the number of specific components or types of elements can be selected, in some cases, to suit the requirements of a particular user.

[0070] When describing and illustrating embodiments of this specification, in the text and drawings, specific terms (e.g., languages, phrases, product brand names, etc.) can be used for clarification. These names are merely examples and are not limiting. The embodiments described in this specification are not limited to the specific terms thus selected, and each specific term includes at least all grammatical, literal, scientific, technical, and functional equivalents, as well as any other equivalents that operate in a similar manner to achieve similar purposes. Furthermore, in the drawings, figures, and text, specific features, elements, circuits, modules, tables, software modules, systems, etc. can be given specific names. However, such terms used in this specification are for illustrative purposes and not limiting.

[0071] The embodiments included in this specification have been described and illustrated in an advantageous form with a certain degree of specific detail, but this disclosure is merely described as an example, and it is understood that many changes can be made to the details of the configuration and combination and arrangement of components without departing from the spirit and scope of the described embodiments. Although at least some principles of the technology have been described and illustrated with reference to specific embodiments, it will be recognized that the technology and embodiments described in this specification can be implemented in many other different forms and in many different environments. The technology and embodiments disclosed in this specification can be used in combination with other technologies. Furthermore, all publications and references cited in this specification are hereby expressly incorporated by reference in their entirety. The individual elements of the different embodiments described in this specification can be combined to form other embodiments not specifically described above. The various elements described in the context of a single embodiment may be provided separately or in any suitable sub-combination. It should be understood that other embodiments not specifically described in this specification are also within the scope of the following claims.

Claims

1. A first chassis configured to house a first set of array electronic devices and a second set of array electronic devices, The first chassis is arranged within the first chassis and operably coupled thereto to enable it to be resistant to buckling and to define a first cavity in which the first set of array electronic devices is disposed and a second cavity in which the second set of array electronic devices is disposed. A first vertical stiffener, the first vertical stiffener being configured to be incorporated into the first set of array electronic devices and the second set of array electronic devices, the first vertical stiffener having a first integrated cooling manifold configured to cool both the first set of array electronic devices and the second set of array electronic devices, the first vertical stiffener; A radar array assembly, including.

2. The first chassis includes a first channel configured to allow coolant to flow therethrough, the first vertical stiffener includes a second channel configured to allow coolant to flow therethrough, and the first channel and the second channel are operably in communication. The radar array assembly according to claim 1.

3. Further comprising a first array plate having a first side and a second side opposite the first side, the first array plate being coupled to the first vertical stiffener, the first array plate including a third channel configured to allow coolant to flow therethrough, and the third channel is operably in communication with at least one of the first channel and the second channel. The radar array assembly according to claim 2.

4. Further comprising a first array plate having a first side portion and a second side portion on the opposite side of the first side portion, the first array plate being coupled to the first vertical stiffener, the first array plate being configured to support a first radiator assembly and a second radiator assembly, the first radiator assembly and the second radiator assembly being operably in communication with the first set of array electronics and the second set of array electronics, respectively, the first array plate being configured to allow the first radiator assembly and the second radiator assembly to be interlocked and aligned to create a single monolithic array surface. The radar array assembly according to claim 1.

5. The radar array assembly according to claim 4, wherein the first vertical stiffener and the first array plate, when combined with the first chassis, provide built-in self-support to the radar array assembly.

6. The radar array assembly according to claim 4, wherein the first vertical stiffener and the first array plate, when combined with the first chassis, are configured such that the first chassis can be stacked on a second chassis identical to the first chassis to double the size of the single monolithic array surface.

7. A first array plate having a first side portion and a second side portion on the opposite side of the first side portion, the first array plate being coupled to the first vertical stiffener and having a first portion associated with the first set of array electronics and a second portion associated with the second set of array electronics, the first array plate, A first radiator assembly operably coupled to the first portion of the first array plate and configured to be operably in communication with the first set of array electronics, A second radiator assembly operably coupled to the second portion of the first array plate and configured to be operably in communication with the second set of array electronics, Further comprising The first array plate is configured to support the first radiator assembly and the second radiator assembly, and is configured to enable the first radiator assembly and the second radiator assembly to be interlocked and aligned so as to create a single monolithic array surface. The radar array assembly according to claim 1.

8. A first array plate having a first side and a second side opposite the first side, the first array plate being coupled to the first vertical stiffener, the first array plate being configured to support a first radiator assembly and a second radiator assembly, the first radiator assembly and the second radiator assembly being operably in communication with the first set of array electronics and the second set of array electronics, respectively, the first array plate being configured to enable the first radiator assembly and the second radiator assembly to be interlocked and aligned so as to create a single monolithic array surface. The first array plate, A second chassis operably coupled to the first chassis, the second chassis being configured to house a third set of array electronics and a fourth set of array electronics, the third set of array electronics and the fourth set of array electronics being coupled to the second chassis by respective second support structures housed within the second chassis. The second chassis, A second vertical stiffener disposed within and operably coupled to the second chassis, enabling the second chassis to be resistant to buckling and defining a third cavity in which the third set of array electronics is disposed and a fourth cavity in which the fourth set of array electronics is disposed, the second vertical stiffener being configured to be incorporated within the third set of array electronics and the fourth set of array electronics, the second vertical stiffener having a second integrated cooling manifold configured to cool both the third set of array electronics and the fourth set of array electronics. The second vertical stiffener, A second array plate having a first side portion and a second side portion on the opposite side of the first side portion, the second array plate being coupled to the second vertical stiffener, the second array plate being configured to support a third radiator assembly and a fourth radiator assembly, the third radiator assembly and the fourth radiator assembly being operably in communication with the third set of array electronics and the fourth set of array electronics, respectively, the second array plate being configured such that the third radiator assembly and the fourth radiator assembly can be interlocked with and aligned with the first radiator assembly and the second radiator assembly as part of the single monolithic array surface, the second array plate, The radar array assembly according to claim 1, further comprising.

9. The first chassis includes a first side portion disposed adjacent to the first cavity and a second side portion disposed adjacent to the second cavity, and the second chassis is operably coupled to the first chassis along one of the first side portion and the second side portion. The radar array assembly according to claim 8.

10. The radar array assembly according to claim 8, wherein the second chassis is stacked on top of the first chassis.

11. The first chassis includes a first side portion disposed adjacent to the first cavity and a second side portion disposed adjacent to the second cavity, the second chassis includes a third side portion disposed adjacent to the third cavity and a fourth side portion disposed adjacent to the fourth cavity, the radar array assembly further includes a splice plate, and the splice plate is configured to fix at least one of the first side portion and the second side portion of the first chassis to at least one of the third side portion and the fourth side portion of the second chassis. The radar array assembly according to claim 10.

12. A top plate operably coupled to the top of the first chassis and configured to cover the top surface of the first vertical stiffener, the top side portions of the first cavity, and the top side portions of the second cavity, A bottom plate operably coupled to the bottom of the first chassis and configured to cover the bottom surface of the first vertical stiffener, the bottom side of the first cavity, and the bottom side of the second cavity. Further comprising The top plate, the bottom plate, and the first chassis cooperate to provide a housing for the first set of array electronics and the second set of array electronics, the housing being watertight and electromagnetic interference (EMI) resistant. The radar array assembly according to claim 1.

13. A first set of array electronics operably communicating with a first set of radiators integrated within a first radiator assembly. A second set of array electronics operably communicating with a second set of radiators integrated within a second radiator assembly. A chassis configured to house the first set of array electronics and the second set of array electronics, wherein the first set of array electronics and the second set of array electronics are coupled to the chassis by respective support structures housed within the chassis. The chassis. A vertical stiffener disposed within the chassis and operably coupled to the chassis to enable the chassis to be resistant to buckling, the vertical stiffener being configured to be incorporated within the first set of array electronics and the second set of array electronics, within the chassis, defining a first cavity in which the first set of array electronics is disposed and a second cavity in which the second set of array electronics is disposed, the vertical stiffener having an integrated cooling manifold configured to cool both the first set of array electronics and the second set of array electronics. The vertical stiffener. An array plate having a first side and a second side opposite the first side, the array plate being coupled to the vertical stiffener and configured to support the first radiator assembly and the second radiator assembly, the array plate being configured to enable the first radiator assembly and the second radiator assembly to be interlocked and aligned to create a single monolithic array surface of a radar module. The array plate. Including a radar module.

14. The chassis includes a first channel configured to allow coolant to flow therethrough, the vertical stiffener includes a second channel configured to allow coolant to flow therethrough, and the first channel and the second channel are operably in communication. The radar module according to claim 13.

15. The array plate includes a third channel configured to allow coolant to flow therethrough, and the third channel is operably in communication with at least one of the first channel and the second channel. The radar module according to claim 14.

16. The first channel is operably in communication with at least one of a coolant inlet port and a coolant outlet port integrated within the vertical stiffener. The radar module according to claim 14.

17. The integrated cooling manifold further includes a supply manifold operably in communication with a coolant inlet port and a return manifold operably in communication with a coolant outlet port. The radar module according to claim 13.

18. Each of the first set of array electronics and the second set of array electronics includes a plurality of respective radar transmit / receive (T / R) modules, each T / R module includes a power supply and a beamforming signal, and the power supply and the beamforming signal are each connected in parallel to the first set of radiators and the second set of radiators. The radar module according to claim 13.

19. An antenna array including a plurality of stacked radar modules, each radar module comprising a first set of array electronics operably in communication with a first set of radiators integrated within a first radiator assembly, a second set of array electronics operably in communication with a second set of radiators integrated within a second radiator assembly, a chassis configured to house the first set of array electronics and the second set of array electronics, wherein the first set of array electronics and the second set of array electronics are coupled to the chassis by respective support structures housed within the chassis, the chassis A vertical stiffener disposed within the chassis and operably coupled to the chassis to enable the chassis to be resistant to buckling, the vertical stiffener being configured to be incorporated within the first set of array electronics and the second set of array electronics, and within the chassis, defining a first cavity in which the first set of array electronics is disposed and a second cavity in which the second set of array electronics is disposed, the vertical stiffener having an integrated cooling manifold configured to cool both the first set of array electronics and the second set of array electronics, the vertical stiffener and An array plate having a first side and a second side opposite the first side, the array plate being coupled to the vertical stiffener and configured to support the first radiator assembly and the second radiator assembly, the array plate being configured to enable the first radiator assembly and the second radiator assembly to be interlocked and aligned to create a single monolithic array surface of the respective radar module, the array plate and The antenna array including.

20. The chassis, the vertical stiffener, and the array plate of each of the respective radar modules are configured such that for each of the respective radar modules, a single monolithic array surface is aligned with the single monolithic array surface of each of the other respective radar modules within the plurality of radar modules, enabling the creation of a single monolithic array surface of the antenna array, the single monolithic array surface having no interruption within the array lattice of the single monolithic array surface of the antenna array, the antenna array according to claim 19.

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