Moisture-curing polyurethane hot-melt resin composition, adhesive, laminate, and method for bonding adherends.
A moisture-curing polyurethane hot-melt resin composition with specific polyols and polyamines forms a narrow and thick coating film, addressing the challenge of reduced bonding areas in electronic terminals by enhancing adhesive strength and impact resistance.
Patent Information
- Application Number
- JP2025202707
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-03
- Filing Date
- 2025-11-25
- Publication Date
- 2026-06-15
AI Technical Summary
The miniaturization of electronic terminals and enlargement of device screens have narrowed frame margins and reduced bonding areas, making it difficult to form a sufficient adhesive thickness with moisture-curable polyurethane hot-melt adhesives, leading to decreased adhesive strength and impact resistance, resulting in peeling or breakage of components.
A moisture-curing polyurethane hot-melt resin composition comprising specific polyols and polyamines, which allows for the formation of a narrow and thick coating film with high adhesive strength and drop impact resistance, using a urethane prepolymer with isocyanate groups, polyether polyol, polyacrylic polyol, and a controlled polyamine content.
The resin composition enables the application of a fine line pattern with excellent adhesive strength and impact resistance, forming a cured film that withstands drops and maintains flexibility.