Fixing device, fixing method, processing device, and chip manufacturing method

Abstract

This reduces the likelihood that devices contained in a plate-like material will be damaged and / or that chips manufactured from the plate-like material will detach from the first and / or second sheets due to the application of external force to the plate-like material. [Solution] A fastening device for fastening a second sheet to a frame unit, which includes a frame having a through hole formed therein, a first sheet whose outer edge region is fixed to the frame so as to close one end of the through hole, and a plate-like object fixed to the central region of the first sheet so as to be positioned in the through hole, wherein the fastening device comprises a holding mechanism for holding the frame unit and a fastening mechanism for fastening the second sheet to the frame unit, the holding mechanism including a holding portion for applying an attractive force to the plate-like object through the central region of the first sheet and a raised portion for raising an intermediate region of the first sheet located between the outer edge region and the central region toward or beyond the other end of the through hole.

Description

Technical Field

[0001] The present invention relates to a fixing device for fixing a second sheet so as to close at least a part of the other end side of a through hole with respect to a frame unit including a frame in which a through hole is formed, a first sheet whose outer edge region is fixed to the frame so as to close one end side of the through hole, and a plate-like object fixed to the central region of the first sheet so as to be positioned in the through hole, a fixing method for fixing the second sheet to the frame unit in this way, a processing device for manufacturing a plurality of chips from a frame unit including a plate-like object in which a division starting point is formed at the boundary of a plurality of devices fixed to the central region of the first sheet and provided in a matrix, and a chip manufacturing method for manufacturing a plurality of chips from this frame unit.

Background Art

[0002] A semiconductor package such as an IC (Integrated Circuit), which is an essential component in various electronic devices such as mobile phones and personal computers, is manufactured through a semiconductor manufacturing process. This semiconductor manufacturing process is roughly divided into a pre-process of forming a plurality of devices each including a large number of circuit elements on a wafer, and a post-process of manufacturing a plurality of semiconductor packages each including a device by processing this wafer.

[0003] In the post-process, for example, a semiconductor package is manufactured in the following order. First, a plurality of dies are manufactured by dividing the wafer along the boundaries of the plurality of devices. Next, the plurality of dies are mounted on a lead frame so that each is connected to an external electrode. Next, a semiconductor package substrate is manufactured by sealing the plurality of dies with resin. Next, a plurality of semiconductor packages are manufactured by dividing the semiconductor package substrate along the boundaries of the plurality of dies (that is, the boundaries of the plurality of devices).

[0004] The manufacturing of dies or semiconductor packages (hereinafter collectively referred to as "chips") by dividing wafers or semiconductor package substrates (hereinafter collectively referred to as "plate-like materials") as workpieces is carried out, for example, by forming division points at the boundaries of multiple devices and then applying external force to the plate-like material (see, for example, Patent Document 1). [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2001-319897 [Overview of the project] [Problems that the invention aims to solve]

[0006] To suppress the scattering of chips being manufactured, an external force is typically applied to a plate-like object after constructing a frame unit that includes a frame with through-holes, a sheet (first sheet) whose outer edge region is fixed to the frame so as to close one end of the through-holes, and a plate-like object fixed to the central region of the sheet so as to be positioned in the through-holes.

[0007] Furthermore, this frame unit may have a separate sheet (second sheet) fixed to it, in order to suppress damage to the device caused by the application of external force to the plate-like object, by closing the other end of the through-hole. In other words, the application of external force to the plate-like object may be performed with the plate-like object positioned inside the through-hole, which is completely sealed by the first and second sheets.

[0008] Furthermore, if an external force is applied to the plate-like material in this state, gas may flow into the interface between the plate-like material and the first and / or second sheet, causing pressurization. In this case, a strong localized force may act on the plate-like material, potentially damaging the device contained within it and / or causing the chip manufactured from the plate-like material to detach from the first and / or second sheet.

[0009] In view of this, the present invention aims to provide a fixing device, fixing method, processing device, and chip manufacturing method that can reduce the likelihood of a device contained in a plate-like material being damaged and / or a chip manufactured from the plate-like material peeling off from the first sheet and / or second sheet due to the application of an external force to the plate-like material. [Means for solving the problem]

[0010] According to one aspect of the present invention, a fastening device is provided for fastening a second sheet to a frame unit comprising a frame having a through hole formed therein, a first sheet whose outer edge region is fixed to the frame so as to close one end of the through hole, and a plate-like object fixed to the central region of the first sheet so as to be positioned in the through hole, the fastening device comprising: a holding mechanism for holding the frame unit with the plate-like object exposed; and a fastening mechanism for fastening the second sheet to the frame unit held by the holding mechanism so as to close at least a portion of the other end of the through hole, wherein the holding mechanism includes a holding portion for applying an attractive force to the plate-like object through the central region of the first sheet, and a raised portion for raising an intermediate region of the first sheet located between the outer edge region and the central region toward or beyond the other end of the through hole, the raised portion being movable or immovable with respect to the holding portion.

[0011] According to another aspect of the present invention, a method is provided for fixing a second sheet to a frame unit, which includes a frame having a through hole formed therein, a first sheet whose outer edge region is fixed to the frame so as to close one end of the through hole, and a plate-like object fixed to the central region of the first sheet so as to be positioned in the through hole, the method comprising: a holding step of holding the frame unit with the plate-like object exposed by applying an attractive force to the plate-like object through the central region of the first sheet; a raising step of raising an intermediate region of the first sheet located between the outer edge region and the central region toward or beyond the other end of the through hole, before or after the holding step; and a fixing step of fixing the second sheet to the frame unit so as to close at least a portion of the other end of the through hole, wherein in the fixing step the second sheet is fixed to the intermediate region of the first sheet.

[0012] According to yet another aspect of the present invention, a processing apparatus for manufacturing a plurality of chips from a frame unit comprising: a frame having through holes formed therein; a first sheet having an outer edge region fixed to the frame so as to close one end of the through holes; and a plate-like material fixed to the central region of the first sheet so as to be positioned in the through holes, with dividing points formed at the boundaries of a plurality of devices arranged in a matrix, the processing apparatus comprising: a fixing unit for fixing a second sheet to the frame unit so as to close at least a portion of the other end of the through holes; a dividing unit for manufacturing a plurality of chips by dividing the plate-like material contained in the frame unit to which the second sheet is fixed along the boundary; and the frame unit containing the plurality of chips manufactured from the plate-like material A processing apparatus is provided, comprising: a peeling unit for peeling off the second sheet; a transport unit for transporting the frame unit between the fixing unit, the dividing unit, and the peeling unit, wherein the fixing unit has a holding mechanism for holding the frame unit with the plate-like material exposed; and a fixing mechanism for fixing the second sheet to the frame unit held by the holding mechanism so as to close at least a portion of the other end of the through hole, wherein the holding mechanism includes a holding portion for applying an attractive force to the plate-like material through the central region of the first sheet; and a raised portion for raising an intermediate region of the first sheet located between the outer edge region and the central region toward or beyond the other end of the through hole, the raised portion being movable or immovable relative to the holding portion.

[0013] Preferably, the processing apparatus further comprises a controller for controlling the fixing unit, the splitting unit, the peeling unit and the transport unit, the fixing unit further comprising a first imaging mechanism for transmitting a first image signal to the controller for forming a first image obtained by imaging the frame unit held by the holding mechanism from the other end of the through hole, the first image signal being obtained by imaging at least a portion of the outer edge of the frame and a planned splitting line included in the boundary or a portion not included in the boundary but representing the direction in which the planned splitting line extends, the splitting unit comprising a support mechanism for supporting the frame unit and obtained by imaging the frame unit supported by the support mechanism from the one end of the through hole The splitting unit comprises: a second imaging mechanism for transmitting a second image signal to the controller for forming a second image showing at least a portion of the outer edge of the frame; a rotation mechanism for rotating the frame unit, supported by the support mechanism, along its circumferential direction; and a pressing mechanism for splitting a plate-like object at a boundary by pressing the plate-like object contained in the frame unit, supported by the support mechanism, wherein the pressing mechanism includes a pressing member extending along a predetermined direction; and the controller controls the splitting unit to operate the rotation mechanism to align the planned splitting line parallel to the predetermined direction based on the first and second image signals, and then to operate the pressing mechanism to press the plate-like object with the pressing member.

[0014] A chip manufacturing method for producing a plurality of chips from a frame unit comprising: a frame having through holes formed therein; a first sheet having an outer edge region fixed to the frame so as to close one end of the through holes; and a plate-like object fixed to the central region of the first sheet so as to be positioned in the through holes and having dividing points formed at the boundaries of a plurality of devices arranged in a matrix, the method comprising: a fixing phase in which a second sheet is fixed to the frame unit so as to close at least a portion of the other end of the through holes; a splitting phase after the fixing phase in which the plate-like object included in the frame unit is split along the boundary in which a plurality of chips are produced; and after the splitting phase in which the frame A method for manufacturing a chip is provided, comprising: a peeling phase for peeling the second sheet from a frame unit, the fixing phase comprising: a holding step for holding the frame unit with the plate-like object exposed by applying an attractive force to the plate-like object through the central region of the first sheet; a raising step for raising an intermediate region of the first sheet located between the outer edge region and the central region toward or beyond the other end of the through hole before or after the holding step; and a fixing step for fixing the second sheet to the frame unit so as to close at least a portion of the other end of the through hole, wherein in the fixing step the second sheet is fixed to the intermediate region of the first sheet.

[0015] Preferably, in the chip manufacturing method, the fixing phase further comprises a first imaging step, after the holding step and before the fixing step, of imaging the frame unit from the other end of the through hole so as to form a first image showing at least a portion of the outer edge of the frame and a division line to be included in the boundary or a portion not included in the boundary but representing the direction in which the division line to be included extends; the splitting phase comprises a support step of supporting the frame unit; a second imaging step, after the support step, of imaging the frame unit from the one end of the through hole so as to form a second image showing at least a portion of the outer edge of the frame; a rotation step, after the second imaging step, of rotating the frame unit along its circumferential direction so that the division line to be included is parallel to a predetermined direction based on the first and second images; and a pressing step, after the rotation step, of dividing the plate-like object at the boundary by pressing the plate-like object, wherein the plate-like object is pressed by a pressing member extending along the predetermined direction. [Effects of the Invention]

[0016] In the present invention, the second sheet can be fixed to the frame unit such that the intermediate region located between the outer edge region and the central region of the first sheet is raised toward or beyond the other end of the through hole, thereby closing at least a portion of the other end of the through hole. In this case, the second sheet is more easily fixed to the intermediate region of the first sheet.

[0017] Furthermore, when the second sheet is fixed to the intermediate region of the first sheet, the volume of the sealed space surrounding the plate-like object becomes smaller compared to when they are not fixed. Also, when the volume of this space becomes smaller, it becomes more difficult for gas to flow into the interface between the plate-like object and the first and / or second sheet when an external force is applied to the plate-like object, and it becomes more difficult for the gas that does flow into the interface to be pressurized.

[0018] Therefore, according to the present invention, it is possible to reduce the probability that a strong force acts locally on the plate-like object, causing the device contained in the plate-like object to be damaged and / or the chip manufactured from the plate-like object to peel off from the first sheet and / or the second sheet.

Brief Description of the Drawings

[0019] [Figure 1] FIG. 1(A) is a perspective view schematically showing an example of a frame unit, and FIG. 1(B) is a cross-sectional view schematically showing the frame unit shown in FIG. 1(A). [Figure 2] FIG. 2 is a side view schematically showing an example of a fixing device for fixing a sheet so as to close at least a part of the other end side of the through hole formed in the frame with respect to the frame unit. [Figure 3] FIG. 3(A) is a top view schematically showing a table provided in the fixing device, and FIG. 3(B) is a view schematically showing this table. [Figure 4] FIG. 4 is a flowchart schematically showing an example of a fixing method for fixing a sheet to a frame unit in the fixing device. [Figure 5] FIG. 5(A) is a view schematically showing the state of the holding step, and FIG. 5(B) is a view schematically showing the state of the raising step. [Figure 6] FIG. 6(A) is a view schematically showing the state of the fixing step, and FIG. 6(B) is a view schematically showing the state of the cutting step. [Figure 7] FIG. 7 is a cross-sectional view schematically showing the frame unit after the cutting step. [Figure 8] FIG. 8 is a block diagram schematically showing an example of a processing device for manufacturing a plurality of chips from a frame unit. [Figure 9] FIG. 9 is a view schematically showing an example of a fixing unit. [Figure 10] FIG. 10 is a view schematically showing an example of a dividing unit. [Figure 11]Figure 11 is a schematic flowchart illustrating an example of a chip manufacturing method in which multiple chips are manufactured from a frame unit in a processing unit. [Figure 12] Figure 12 is a flowchart schematically showing an example of several steps included in the fixation phase. [Figure 13] Figure 13 schematically shows the first imaging step included in the fixation phase. [Figure 14] Figure 14 is a flowchart that schematically shows an example of the multiple steps included in the division phase. [Figure 15] Figure 15(A) schematically shows the second holding step, and Figure 15(B) schematically shows the second imaging step. [Figure 16] Figure 16(A) schematically shows the rotation step, and Figure 16(B) schematically shows the division step. [Modes for carrying out the invention]

[0020] Embodiments of the present invention will be described with reference to the attached drawings. Figure 1(A) is a schematic perspective view showing an example of a frame unit, and Figure 1(B) is a schematic cross-sectional view showing the frame unit shown in Figure 1(A). The frame unit 11 shown in Figures 1(A) and 1(B) includes a plate-like object 13.

[0021] The plate-like object 13 is a wafer made of, for example, silicon (Si), silicon carbide (SiC), or gallium nitride (GaN). A notch 13a is formed on the outer edge of the plate-like object 13 to indicate a specific crystal orientation of the material of the plate-like object 13. In addition, multiple devices 15 are provided on one side 13b of the plate-like object 13.

[0022] Multiple devices 15 are arranged in a matrix (specifically, so as to be aligned in the direction from the center of the plate-like object 13 toward the notch 13a (first alignment direction) and in the direction perpendicular to the first alignment direction (second alignment direction)). Therefore, the boundaries of the multiple devices 15 extend in a grid pattern. The portion of the boundaries of the multiple devices 15 that extends linearly (specifically, along the first alignment direction or the second alignment direction) is also called the division line.

[0023] Furthermore, splitting points 17 are formed at the boundaries of the multiple devices 15. These splitting points 17 include a modified portion 17a, which is a part of the plate-like material 13 where the crystal structure is disordered, and a crack 17b that extends from the modified portion 17a along the thickness direction of the plate-like material 13. The modified portion 17a is, for example, closer to one surface 13b of the plate-like material 13 than to the other surface 13c. Also, the crack 17b reaches one surface 13b of the plate-like material 13 but does not reach the other surface 13c.

[0024] The modified portion 17a is formed, for example, by irradiating the plate-like object 13 with a laser beam of a wavelength that penetrates the material of the plate-like object 13, with its focal point positioned at the boundary of multiple devices 15. When the modified portion 17a is formed, the volume of the plate-like object 13 expands, generating internal stress in the plate-like object 13. The crack 17b is then formed by the internal stress acting in such a way that it cleaves the portion of the plate-like object 13 near the modified portion 17a along the thickness direction.

[0025] On the other surface 13c of the plate-like object 13, the central region of a disc-shaped tape (first sheet) 19, which has a larger diameter than the plate-like object 13, is attached (fixed). This tape 19 has, for example, a flexible film-like base layer and an adhesive layer (glue layer) provided on one surface of the base layer (the surface facing the plate-like object 13).

[0026] The base layer consists of, for example, polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), polyvinyl chloride (PVC), or polystyrene (PS). The adhesive layer consists of, for example, UV-curable silicone rubber, acrylic material, or epoxy material.

[0027] Furthermore, a frame 21 is attached to the outer edge region of the tape 19, which has a disc-shaped through hole 21a with a diameter larger than that of the plate-like object 13. In other words, the tape 19 is attached to the frame 21 in such a way that it positions the plate-like object 13 in the through hole 21a and closes one end (the lower side) of the through hole 21a.

[0028] The frame 21 is made of a metal material such as aluminum or stainless steel. The outer edge of the frame 21 includes four arc-shaped portions 21b and four linear portions 21c.

[0029] Furthermore, in a plan view, the four arc portions 21b are arranged such that their diameters are larger than the diameter of the through hole 21a, and their centers coincide with a virtual circle that is aligned with the center of the through hole 21a. In addition, the four arc portions 21b are arranged along the circumferential direction of the frame 21 at approximately equal angular intervals.

[0030] Furthermore, the four straight sections 21c are arranged such that, in a plan view, their centers coincide with a virtual square whose centers are aligned with the centers of the through-holes 21a. The length of each side of this virtual square is greater than the diameter of the through-holes 21a and smaller than the diameter of the virtual circle described above. In addition, each of the four straight sections 21c is positioned between a pair of adjacent arc sections 21b along the circumferential direction of the frame 21.

[0031] Furthermore, a pair of notches 21d and 21e are formed between one of the four straight sections 21c and a pair of arc sections 21b adjacent to that straight section 21c. The notch 21d is formed to cut out the outer edge of the frame 21 at an acute angle. The notch 21e is formed to cut out the outer edge of the frame 21 at a right angle.

[0032] The pair of notches 21d and 21e are used to indicate the orientation of the plate-like object 13, which is integrated with the frame 21 via the tape 19. The plate-like object 13 is then integrated with the frame 21 such that, for example, the first alignment direction is perpendicular to the straight section 21c located between the pair of notches 21d and 21e.

[0033] There are no restrictions on the material, shape, structure, or size of the plate-like object 13, the tape 19, and the frame 21. For example, the plate-like object 13 may be a rectangular plate-shaped structure (e.g., a semiconductor package substrate). Also, one or two orientation flats may be formed on the outer edge of the plate-like object 13 instead of a notch 13a. Furthermore, the plate-like object 13 may be integrated with the frame 21 via a tape 19 attached to one of its surfaces 13b.

[0034] Furthermore, the tape 19 may consist only of a base layer without an adhesive layer on one side. In this case, the tape 19 is fixed, for example, by heat-pressing it to the plate-shaped object 13 and the frame 21. Also, if the plate-shaped object 13 is a rectangular plate-shaped structure, a rectangular plate-shaped through-hole may be formed in the frame 21 instead of a circular plate-shaped through-hole 21a, and the tape 19 may be rectangular plate-shaped.

[0035] Figure 2 is a schematic side view showing an example of a fastening device for fixing a sheet to a frame unit 11 such that it closes at least a portion of the other end (upper side) of the through hole 21a formed in the frame 21. The fastening device 2 shown in Figure 2 has a holding mechanism 4 for holding the frame unit 11 with the plate-like object 13 exposed.

[0036] This holding mechanism 4 includes a table 6. Figure 3(A) is a schematic top view of the table 6, and Figure 3(B) is a schematic diagram of the table 6. In Figure 3(B), components that communicate with or are connected to the table 6 are shown as blocks.

[0037] Table 6 includes a frame 8. This frame 8 includes a disc-shaped bottom wall and cylindrical side walls that rise from the bottom wall. A disc-shaped porous plate 10, for example, made of porous ceramics, is fixed to the recess defined by the bottom wall and side walls of the frame 8.

[0038] The porous plate 10 has an upper surface that is approximately flush with the upper surface of the side wall of the frame 8, and its diameter is approximately equal to the diameter of the plate-like object 13. Furthermore, the porous plate 10 can be selectively connected to the suction source 12 or the air supply source 14 via a flow path 8a or the like formed in the bottom wall of the frame 8.

[0039] The suction source 12 includes, for example, an ejector. The air supply source 14 includes, for example, a tank for storing high-pressure air, a filter for removing foreign matter mixed in with the air supplied from the tank, and a regulator for adjusting the pressure of the gas supplied from the tank.

[0040] In the holding mechanism 4, the upper surface of the porous plate 10 becomes a holding part for applying suction force to the plate-shaped object 13 via the central region of the tape 19. Specifically, the frame unit 11 is placed on the table 6 so that the plate-shaped object 13 is superimposed on the porous plate 10 via the central region of the tape 19, and then the suction source 12, which is in communication with this holding part, is activated.

[0041] This makes it possible to create a negative pressure in the channel 8a formed in the bottom wall of the frame 8, thereby applying a suction force from the holding part to the plate-shaped object 13 through the central region of the tape 19. In addition, in the holding mechanism 4, it is also possible to return the channel 8a to normal pressure and eliminate the suction force acting on the plate-shaped object 13 by stopping the operation of the suction source 12 and operating the air supply source 14 which is in communication with the holding part.

[0042] Furthermore, an annular groove is formed on the upper side of the side wall of the frame 8 so as to surround the porous plate 10, and a lifting member 16 can be accommodated in this groove. The inner diameter of this lifting member 16 is larger than the diameter of the plate-like object 13, and the outer diameter is smaller than the diameter of the through hole 21a formed in the frame 21.

[0043] Furthermore, the lifting member 16 is connected to the drive source 20 via lifting rods 18 that pass through each of the multiple through holes formed in the side and bottom walls of the frame 8. The drive source 20 includes, for example, a motor.

[0044] In the holding mechanism 4, the upper surface of the lifting member 16 becomes a raised portion that raises the intermediate region of the tape 19, located between the outer edge region and the central region, toward or beyond the other end of the through hole 21a formed in the frame 21. Specifically, the frame unit 11 is placed on the table 6 so that the plate-like object 13 is superimposed on the porous plate 10 via the central region of the tape 19, and then the drive source 20 is operated to raise this raised portion.

[0045] This makes it possible to raise the raised portion higher than the upper surface of the side wall of the frame 8 and the upper surface of the porous plate 10, so that the intermediate region of the tape 19 is raised toward or beyond the other end of the through hole 21a. In addition, in the holding mechanism 4, it is also possible to make the raised portion approximately flush with the upper surface of the side wall of the frame 8 and the upper surface of the porous plate 10 by operating the drive source 20 to lower the raised portion.

[0046] As shown in Figure 2, a fixing mechanism 22 is provided above the holding mechanism 4. This fixing mechanism 22 has a feed roller 22a for feeding out the sheet 23 from the raw material sheet (roll sheet). Note that the feed roller 22a does not overlap with the table 6 in a plan view. The raw material sheet is a rectangular sheet 23 wound around which the length is orders of magnitude larger than the width.

[0047] Furthermore, the sheet 23 has either a single-layer structure consisting only of a base layer, or a multi-layer structure including a base layer and an adhesive layer provided on one side of the base layer. Note that the sheet 23 is a component that is intended to be peeled off after being fixed to the frame unit 11. Therefore, from the viewpoint of facilitating this peeling, it is preferable that the sheet 23 has a single-layer structure consisting only of a base layer and not including an adhesive layer.

[0048] Furthermore, the base layer and adhesive layer of the sheet 23 are made of the same materials as the base layer and adhesive layer of the tape 19 described above. In addition, in the sheet 23 having a multilayer structure, a surface treatment to suppress the adhesion of the adhesive layer may be applied to the other side of the base layer.

[0049] A guide roller 22b is provided below the feed roller 22a. The sheet 23 (or the base layer side if the sheet 23 has a multi-layer structure) that is fed out by rotating the feed roller 22a comes into contact with this guide roller 22b.

[0050] Furthermore, the fixing mechanism 22 is provided with a guide roller 22c that, in a plan view, sandwiches the table 6 together with the guide roller 22b. The sheet 23 (or the base layer side if the sheet 23 has a multi-layer structure) pulled out from the guide roller 22b comes into contact with this guide roller 22c.

[0051] Furthermore, a retrieval roller 22d for collecting the sheet 23 is provided above the guide roller 22c. The retrieval roller 22d is connected to a motor (not shown) for rotating the retrieval roller 22d. When this motor is operated, the sheet 23 is wrapped around the retrieval roller 22d and collected, and the feed roller 22a is rotated to feed out more of the sheet 23.

[0052] Furthermore, a pressure roller 22e is provided between the two guide rollers 22b and 22c. In addition, the pressure roller 22e is connected to an actuator (not shown) that circulates the pressure roller 22e so as to press the sheet 23 against the table 6. Specifically, when this actuator is operated, the pressure roller 22e moves from a standby position (first standby position) through a start position (first start position) and an end position (first end position) in sequence, and returns to the first standby position.

[0053] Specifically, the first standby position is the position of the pressure roller 22e that does not contact the sheet 23 (specifically, in a plan view, between the guide roller 22b and the guide roller 22c, and above both). The first start position is the position of the pressure roller 22e that allows the sheet 23 to be pressed against one end of the frame unit 11 held by the holding mechanism 4. The first end position is the position of the pressure roller 22e that allows the sheet 23 to be pressed against the other end of the frame unit 11 held by the holding mechanism 4.

[0054] Furthermore, the pressing roller 22e may be provided in such a way that the portion near its surface can be heated. For example, the pressing roller 22e may have a built-in heating element to which an external current source is connected.

[0055] A cutting mechanism 24 is provided directly above the table 6 via a sheet 23 located between two guide rollers 22b and 22c. This cutting mechanism 24 has a support rod 24a whose center is located directly above the center of the table 6.

[0056] The base end of an arm 24b, which has a length approximately equal to half the diameter of the table 6 (i.e., the outer diameter of the side wall of the frame 8), is fixed to the lower end of the support rod 24a. A cutter 24c is provided on the underside of the tip of the arm 24b.

[0057] Furthermore, the support rod 24a is connected to an actuator (not shown) for raising and lowering the support rod 24a. When the actuator is operated to lower the cutter 24c, the cutter 24c can be made to cut through the sheet 23.

[0058] Furthermore, the support rod 24a is connected to a motor (not shown) for rotating the support rod 24a. When this motor is operated, the support rod 24a is rotated around a straight line passing through its center and aligned vertically, which in turn allows the cutter 24c to rotate around this straight line.

[0059] Furthermore, the distance between the rotation axis of the support rod 24a and the tip (lower end) of the cutter 24c is adjusted to be greater than the radius of the through hole 21a formed in the frame 21, and less than half the length of each side of a virtual square that overlaps with the four straight sections 21c included in its outer edge. For example, this distance is adjusted to be approximately equal to the radius of the tape 19.

[0060] Figure 4 is a schematic flowchart illustrating an example of a fixing method for fixing a sheet (second sheet) to a frame unit 11 using a fixing device 2. In this method, first, the frame unit 11 is held with the plate-like object 13 exposed (holding step S11). Figure 5(A) is a schematic diagram showing the holding step S11.

[0061] In the holding step S11, first, the frame unit 11 is placed on the table 6 such that the center of the plate-shaped object 13 and the center of the table 6 (the center of the porous plate 10) overlap vertically via the tape 19. Then, the suction source 12, which is in communication with the flow path 8a, is operated so that the flow path 8a formed in the bottom wall of the frame 8 of the table 6 becomes negative pressure. As a result, a suction force acts on the plate-shaped object 13 from the upper surface (holding part) of the porous plate 10 via the central region of the tape 19. Consequently, the frame unit 11 is held on the upper surface of the table 6.

[0062] After the holding step S11, the intermediate region of the tape 19 is raised (raising step S12). Figure 5(B) is a schematic diagram showing the raising step S12.

[0063] In the raising step S12, the drive source 20 is operated to raise the lifting member 16 together with the lifting rod 18. As a result, the upper surface (raised portion) of the lifting member 16 and the intermediate region of the tape 19 rise toward or beyond the other end of the through hole 21a formed in the frame 21.

[0064] Following the raising step S12, the sheet 23 is fixed to the intermediate region of the tape 19 (fixing step S13). Figure 6(A) is a schematic diagram showing the fixing step S13.

[0065] In the fixing step S13, the actuator connected to the pressing roller 22e is operated to move the pressing roller 22e from the first standby position, passing through the first start position and the first end position in sequence, and returning to the first standby position. As a result, the sheet 23 is pressed against the frame unit 11 and the sheet 23 is fixed to at least the middle region of the tape 19.

[0066] Specifically, if the sheet 23 has a single-layer structure consisting only of a base layer, the intermediate region of the tape 19 (specifically, the portion located above the upper surface (raised portion) of the lifting member 16) is attached to the sheet 23. This closes a portion of the other end of the through hole 21a formed in the frame 21 (specifically, the portion near the center), and seals the space inside the contact interface between the intermediate region of the tape 19 and the sheet 23 around the plate-like object 13.

[0067] Furthermore, if the sheet 23 has a single-layer structure and the portion near the surface of the pressing roller 22e is heated, or if the sheet 23 has a multi-layer structure including a base layer and an adhesive layer, the sheet 23 is heat-pressed or attached to the plate-like object 13 and / or frame 21 in addition to the intermediate region of the tape 19. As a result, the entire other end of the through-hole 21a formed in the frame 21 is closed, and the space inside the through-hole 21a is divided into two sections around the plate-like object 13, with the contact interface between the intermediate region of the tape 19 and the sheet 23 as the boundary.

[0068] After the fixing step S13, the portion of the sheet 23 that includes the area fixed to the middle region of the tape is cut out (cutting step S14). Figure 6(B) is a schematic diagram showing the cutting step S14.

[0069] In cutting step S14, first, the actuator connected to the support rod 24a is operated to lower the support rod 24a, arm 24b, and cutter 24c until the tip of the cutter 24c penetrates the tape 19 and contacts the frame 21. Next, the motor connected to the support rod 24a is operated to rotate the cutter 24c more than one full turn. This cuts out the circular portion overlapping the frame unit 11 from the sheet 23.

[0070] Figure 7 is a schematic cross-sectional view of the frame unit 11 after the cutting step S14, that is, the frame unit 11 after the fixing method shown in Figure 4 has been implemented. When this method is implemented, the portion (second sheet) 23a cut out from the sheet 23 is fixed to the intermediate region of the tape 19. Therefore, in the frame unit 11 shown in Figure 7, the space inside the contact interface between the intermediate region of the tape 19 and the second sheet 23a around the plate-like object 13 is sealed, or the space inside the through hole 21a is divided into two parts with this contact interface as the boundary.

[0071] Figure 8 is a schematic block diagram showing an example of a processing apparatus for manufacturing multiple chips from a frame unit 11. In Figure 8, the transport path of the frame unit 11 is indicated by arrows.

[0072] The processing apparatus 26 shown in Figure 8 is a device capable of performing three processes independently. Specifically, one process is the attachment of the second sheet 23a to the frame unit 11, for which the processing apparatus 26 is equipped with an attachment unit 28. The second process is the division of the plate-like material 13 contained in the frame unit 11 along the boundaries of multiple devices 15, for which the processing apparatus 26 is equipped with a division unit 30. The third process is the peeling of the second sheet 23a from the frame unit 11, for which the processing apparatus 26 is equipped with a peeling unit 32.

[0073] Furthermore, the processing apparatus 26 is equipped with a cassette support base 34, an inversion unit 36, and a transport unit 38 to supply the frame unit 11 to the fixing unit 28, the splitting unit 30, and the peeling unit 32, enabling the execution of these processes. Specifically, the cassette support base 34 is for supporting the cassette that houses the frame unit 11. The inversion unit 36 ​​is for inverting the frame unit 11, that is, for changing the orientation of the tape 19 from downward to upward, or vice versa. The transport unit 38 is for transporting the frame unit 11 between the fixing unit 28, the splitting unit 30, the peeling unit 32, the cassette supported by the cassette support base 34, and the inversion unit 36.

[0074] In addition, the processing unit 26 is provided with a controller 40 for controlling the fixing unit 28, the splitting unit 30, the peeling unit 32, the inversion unit 36, and the transport unit 38. This controller 40 includes a processor and memory. The processor can read various programs stored in the memory and control the components of the processing unit 26. In addition to various programs, the memory can also store various data used when these programs are being executed by the processor.

[0075] In the processing apparatus 26, known peeling units 32, cassette support base 34, inversion unit 36, and transport unit 38 can be used. For example, the peeling unit 32 can be the one described in Japanese Patent Application Publication No. 2021-190626. Also, the cassette support base 34, inversion unit 36, and transport unit 38 can be the ones described in Japanese Patent Application Publication No. 2018-182159.

[0076] Figure 9 is a schematic diagram showing an example of a fixing unit 28. In Figure 9, some of the components of the fixing unit 28 are shown as blocks. In short, the fixing unit 28 comprises the components of the fixing device 2 (specifically, the holding mechanism 4, the fixing mechanism 22, and the cutting mechanism 24), a moving mechanism 42 connected to the table 6, and an imaging mechanism (first imaging mechanism) 44 provided to be separated from the fixing mechanism 22 and the cutting mechanism 24 in a direction perpendicular to the vertical direction (first horizontal direction).

[0077] The moving mechanism 42 includes, for example, a ball screw and a motor for rotating the screw shaft of the ball screw. When the moving mechanism 42 is operated, the table 6 can be moved along the first horizontal direction to be positioned at one of the loading / unloading position (first loading / unloading position), the fixed position, or the imaging position (first imaging position).

[0078] Specifically, the first loading / unloading position is the position on the table 6 from which the frame unit 11 can be loaded and unloaded by the transport unit 38. The fixing position is the position on the table 6 from which the plate-shaped object 13 included in the frame unit 11, which is held by the holding mechanism 4, can be pressed by the pressing roller 22e included in the fixing mechanism 22. In short, the fixing position is the position on the table 6 from which the rotation axis of the support rod 24a of the cutting mechanism 24 passes through its center (see Figure 2). The first imaging position is the position on the table 6 from which the imaging mechanism 44 can image at least a portion of the outer edge of the frame 21 included in the frame unit 11, which is held by the holding mechanism 4 (for example, the straight section 21c located between a pair of notches 21d, 21e) and the planned division lines included in the boundary of the multiple devices 15 (for example, the line closest to the notch 13a among multiple planned division lines, each extending along the second arrangement direction described above). In short, the first imaging position is the position of the table 6, where one end in the first horizontal direction is directly below the imaging mechanism 44 (see Figure 9).

[0079] The imaging mechanism 44 includes, for example, a light source such as an LED (Light Emitting Diode), an objective lens, and an image sensor such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor. When the imaging mechanism 44 is operated with the table 6 that holds the frame unit 11 positioned at the first imaging position so that the plate-shaped object 13 is exposed, the frame unit 11 is imaged from the other end of the through hole 21a formed in the frame 21.

[0080] As a result, the imaging mechanism 44 obtains a signal (first image signal) for forming an image (first image) that shows at least a portion of the outer edge of the frame 21 and the division line included in the boundary of the plurality of devices 15, or a portion not included in the boundary but representing the direction in which the division line extends. For example, such a portion could be a circuit pattern included in at least one of the plurality of devices 15. Alternatively, if an orientation flat is formed on the outer edge of the plate-like object 13 instead of a notch 13a, the portion may be an orientation flat. The obtained first image signal is then transmitted from the imaging mechanism 44 to the controller 40.

[0081] Figure 10 is a schematic diagram showing an example of a divided unit 30. In Figure 10, some of the components of the divided unit 30 are shown as blocks. This divided unit 30 is provided with a holding mechanism (support mechanism) 46 for holding the frame unit 11. The holding mechanism 46 has a table 48.

[0082] The table 48 includes a main body 50. The main body 50 has a circular top surface that is approximately perpendicular to the vertical direction. The diameter of the top surface of the main body 50 is approximately equal to the diameter of the plate-like object 13. The main body 50 also has a frame 50a that includes a disc-shaped bottom wall and cylindrical side walls that rise from the bottom wall. A disc-shaped porous plate (not shown) made of porous ceramics is fixed in the recess defined by the bottom wall and side walls of the frame 50a.

[0083] This porous plate can be selectively connected to a suction source 52 or an air supply source 54 via a flow path (not shown) formed in the bottom wall of the frame 50a. The suction source 52 has a structure similar to that of the suction source 12, for example. The air supply source 54 has a structure similar to that of the air supply source 14, for example.

[0084] Four additional parts 56 are provided around the main body 50 at approximately equal angular intervals in a plan view. Each additional part 56 is connected to the main body 50 via a connecting member 58 that extends radially along the upper surface of the main body 50. Each additional part 56 has a rectangular upper surface that is approximately perpendicular to the vertical direction and positioned below the upper surface of the main body 50.

[0085] Furthermore, each additional part 56 is positioned so as to overlap with the frame 21 when the center of the upper surface of the main body 50 and the center of the plate-like object 13 are aligned. For example, each additional part 56 is positioned such that the distance between the center of the upper surface of the main body 50 and each additional part 56 in a plan view is approximately equal to the radius of the through hole 21a formed in the frame 21.

[0086] Furthermore, each additional part 56 has a frame 56a that includes a rectangular plate-shaped bottom wall and a rectangular tubular side wall erected from the bottom wall. A rectangular plate-shaped porous plate (not shown) made of porous ceramics is fixed to the recess defined by the bottom wall and side wall of the frame 56a. This porous plate can selectively communicate with a suction source 52 or an air supply source 54 via a flow path (not shown) formed in the bottom wall of the frame 56a.

[0087] In the holding mechanism 46, the upper surfaces of the porous plates of the main body 50 and the four additional parts 56 serve as holding parts for applying suction force to the frame unit 11. For example, the frame unit 11 is placed on the table 48 so that the plate-like object 13 and the frame 21 are superimposed on the main body 50 and each additional part 56 via the central region of the second sheet 23a, and then the suction source 52, which communicates with these holding parts, is activated.

[0088] This makes it possible to create negative pressure in the flow channels formed in the bottom walls of the frames 50a and 56a, thereby applying suction force to the plate-shaped object 13 and the frame 21 from these holding parts via the second sheet 23a. In addition, in the holding mechanism 46, it is also possible to return the flow channels to normal pressure and eliminate the suction force acting on the plate-shaped object 13 and the frame 21 by stopping the operation of the suction source 52 and operating the air supply source 54 which is in communication with the holding part.

[0089] In addition, the main body 50 is connected to a moving mechanism 60 and a rotating mechanism 62. The moving mechanism 60 includes, for example, a ball screw and a motor for rotating the screw shaft of the ball screw. When the moving mechanism 60 is operated, the table 48 can be moved along a direction perpendicular to the vertical direction (second horizontal direction) to position it at either the loading / unloading position (second loading / unloading position), the division position, or the imaging position (second imaging position). The second horizontal direction may be parallel to or non-parallel to the first horizontal direction.

[0090] Specifically, the second loading / unloading position is a position on the table 48 where the frame unit 11 can be loaded onto and unloaded by the transport unit 38. The splitting position is, for example, a position on the table 48 where the plate-shaped object 13 included in the frame unit 11, which is held by the holding mechanism 46, can be pressed by the pressing roller (pressing member) 64a included in the pressing mechanism 64, which will be described later. In short, the splitting position is a position on the table 48 where the main body 50 is located directly below the pressing roller 64a. The second imaging position is, for example, a position on the table 48 where at least a part of the outer edge of the frame 21 included in the frame unit 11, which is held by the holding mechanism 46 (for example, the straight section 21c located between a pair of notches 21d, 21e) can be imaged by the imaging mechanism (second imaging mechanism) 66, which will be described later. In short, the second imaging position is a position on the table 48 where at least one of the four additional parts 56 is located directly below the imaging mechanism 66.

[0091] The rotating mechanism 62 includes, for example, a driven pulley connected to the table 48, a belt wrapped around the pulley, a drive pulley connected to the driven pulley via the belt, and a motor for rotating the drive pulley. When the rotating mechanism 62 is operated, the table 48 can be rotated with a straight line along the vertical direction passing through the center of the table 48 as the axis of rotation.

[0092] Furthermore, in the divided unit 30, a pressing mechanism 64 and an imaging mechanism 66 are provided at a position higher than the table 48. The pressing mechanism 64 includes a pressing roller 64a that extends along a direction perpendicular to the second horizontal direction and the vertical direction (third horizontal direction (a predetermined direction)).

[0093] Furthermore, the pressing roller 64a is connected to an actuator (not shown) that circulates the pressing roller 64a so as to press the plate-shaped object 13 against the table 48. Specifically, when this actuator is operated, the pressing roller 64a moves from the standby position (second standby position) through the start position (second start position) and the end position (second end position) in order, and returns to the second standby position.

[0094] Specifically, the second standby position is the position of the pressure roller 64a that does not contact the frame unit 11, which is held by the holding mechanism 46 so that the second sheet 23a faces downward. The second start position is the position of the pressure roller 64a that can press one end of the plate-like object 13 included in the frame unit 11 in the third horizontal direction from the tape 19 side. The second end position is the position of the pressure roller 64a that can press the other end of the plate-like object 13 included in the frame unit 11 in the third horizontal direction from the tape 19 side.

[0095] The imaging mechanism 66 has a structure similar to, for example, the imaging mechanism 44. When the imaging mechanism 66 is operated with the table 48 that holds the frame unit 11 positioned at the second imaging position so that the tape 19 is exposed, the frame unit 11 is imaged from one end of the through hole 21a formed in the frame 21.

[0096] As a result, the imaging mechanism 66 obtains a signal (second image signal) for forming an image (second image) showing at least a portion of the outer edge of the frame 21. The obtained second image signal is then transmitted from the imaging mechanism 66 to the controller 40.

[0097] Figure 11 is a schematic flowchart illustrating an example of a chip manufacturing method in which multiple chips are manufactured from a frame unit 11 in the processing apparatus 26. In this method, first, the second sheet 23a is fixed to the frame unit 11 (fixing phase P1). Figure 12 is a schematic flowchart illustrating an example of several steps included in the fixing phase P1.

[0098] In short, the fixation phase P1 includes the holding step S11, the lifting step S12, the fixation step S13, and the cutting step S14 shown in Figure 4, as well as a first imaging step S15 performed after the holding step S11 and before the lifting step S12. Since the holding step S11, lifting step S12, fixation step S13, and cutting step S14 are performed in the fixation phase P1 as described above, a detailed explanation of these steps will be omitted.

[0099] In the first imaging step S15, the frame unit 11 is imaged so that the first image described above (here, for convenience, an image showing at least a portion of the outer edge of frame 21 and the planned division line) is formed. Figure 13 is a schematic diagram showing the first imaging step S15.

[0100] In the first imaging step S15, the controller 40 first operates the movement mechanism 42 to position the table 6 at the first imaging position described above. Then, the controller 40 operates the imaging mechanism 44 to image a portion 11a of the frame unit 11 that includes at least a part of the outer edge of the frame 21 and the division line included in the boundary of the multiple devices 15, from the other end of the through hole 21a formed in the frame 21.

[0101] As a result, the imaging mechanism 44 obtains the first image signal, and the obtained first image signal is transmitted from the imaging mechanism 44 to the controller 40. When the controller 40 receives the first image signal, it uses the first image signal to determine information indicating the positional relationship between at least a portion of the outer edge of the frame 21 and the division line (for example, the angle between the direction in which the straight section 21c located between the pair of notches 21d and 21e extends and the second arrangement direction).

[0102] After the fixing phase P1, the frame unit 11 is inverted so that the second sheet 23a faces downwards (first inversion phase P2). This first inversion phase P2 is performed so that the side of the plate-like object 13 that will be pressed in the splitting phase P3 described later (specifically, the upper side) is the other side 13c where the crack 17b is not exposed, i.e., the tape 19 side. Note that the first inversion phase P2 is performed by a known method, so a detailed explanation is omitted (see, for example, Japanese Patent Application Publication No. 2018-182159).

[0103] Following the first inversion phase P2, the plate-like object 13 is divided along the boundaries of multiple devices 15 (dividing phase P3). Figure 14 is a flowchart schematically showing an example of the multiple steps included in the dividing phase P3.

[0104] In the splitting phase P3, the frame unit 11 is first held (second holding step (support step) S31). Figure 15(A) is a schematic diagram showing the second holding step S31.

[0105] In the second holding step S31, first, the frame unit 11 is placed on the table 48 such that the center of the plate-shaped object 13 and the center of the table 48 overlap vertically via the second sheet 23a. Then, the suction source 52, which is in communication with these flow paths, is operated so that the flow paths formed in the bottom walls of the frame 50a of the main body 50 of the table 48 and the frame 56a of each of the four additional parts 56 become negative pressure.

[0106] As a result, a suction force acts on the plate-like object 13 and the frame 21 from the upper surface (holding part) of the porous plate of the main body 50 and the four additional parts 56 via the second sheet 23a. Consequently, the frame unit 11 is held on the upper surface of the table 48.

[0107] Following the second holding step S31, the frame unit 11 is imaged (second imaging step S32) so that the second image described above (specifically, an image showing at least a portion of the outer edge of frame 21) is formed. Figure 15(B) is a schematic diagram showing the second imaging step S32.

[0108] In the second imaging step S32, first, the controller 40 operates the moving mechanism 60 to position the table 48 at the second imaging position. Then, the controller 40 operates the imaging mechanism 66 to image a portion 11b of the frame unit 11, which includes at least a part of the outer edge of the frame 21, from one end of the through hole 21a formed in the frame 21. In the second imaging step S32, the frame unit 11 is imaged such that the portion 11b to be imaged includes a portion of the outer edge of the frame 21 that is common with the portion 11a imaged in the first imaging step S15.

[0109] As a result, the imaging mechanism 66 obtains the second image signal, and the obtained second image signal is transmitted from the imaging mechanism 66 to the controller 40. When the controller 40 receives the second image signal, it uses the information obtained based on the first image signal and the second image signal to determine, for example, the specific direction in which the planned division lines extend (for example, the second array direction).

[0110] After the second imaging step S32, the frame unit is rotated (rotation step S33) so that the planned division line is parallel to the third horizontal direction (specifically, the direction in which the pressing roller 64a included in the pressing mechanism 64 extends). Figure 16(A) is a schematic diagram showing the rotation step S33.

[0111] In rotation step S33, the controller 40 operates the rotation mechanism 62 to rotate the frame unit 11 along its circumferential direction until the specific direction in which the division line, which the controller 40 identified in the second imaging step S32 extends, coincides with the third horizontal direction described above.

[0112] Following the rotation step S33, the plate-shaped object 13 is pressed to divide it at the boundaries of the multiple devices 15 (pressing step S34). Figure 16(B) is a schematic diagram showing the pressing step S34.

[0113] In the pressing step S34, an actuator connected to the pressing roller 64a is operated to move the pressing roller 64a from the second standby position, passing through the second start position and the second end position in sequence, and returning to the second standby position. As a result, the plate-like object 13 is pressed via the tape 19, and the crack 17b contained in the splitting starting point 17 extends further until it reaches the other surface 13c of the plate-like object 13. Consequently, the plate-like object 13 is split along the boundaries of the multiple devices 15, and multiple chips are manufactured.

[0114] After the pressing step S34, that is, after the splitting phase P3, the frame unit 11 is inverted so that the second sheet 23a faces upward (second inversion phase P4). This second inversion phase P4 is performed to position the second sheet 23a on the side (specifically, the upper side) from which the second sheet 23a will be peeled off the frame unit 11 in the peeling phase P5 described later. Since the second inversion phase P4 is performed by a known method, a detailed explanation thereof is omitted (see, for example, Japanese Patent Application Publication No. 2018-182159).

[0115] Following the second inversion phase P4, the second sheet 23a is peeled off the frame unit 11 (peeling phase P5). Since the peeling phase P5 is carried out by known methods, a detailed explanation thereof is omitted (see, for example, Japanese Patent Application Publication No. 2021-190626).

[0116] In the embodiment described above, the second sheet 23a can be fixed to the frame unit 11 such that the intermediate region located between the outer edge region and the central region of the tape 19 is raised toward or beyond the other end of the through hole 21a formed in the frame 21, thereby closing at least a portion of the other end of the through hole 21a. In this case, the second sheet 23a is more easily fixed to the intermediate region of the tape 19.

[0117] Furthermore, when the second sheet 23a is fixed to the intermediate region of the tape 19, the volume of the sealed space surrounding the plate-like object 13 becomes smaller compared to when they are not fixed. Also, if the volume of this space is smaller, when an external force is applied to the plate-like object 13 in the splitting phase P3, it becomes more difficult for gas to flow into the interface between the plate-like object 13 and the tape 19 and / or the second sheet 23a, and it becomes more difficult for the gas that has flowed into the interface to be pressurized.

[0118] Therefore, according to the embodiment described above, it is possible to reduce the likelihood that a strong localized force will act on the plate-like object 13, causing damage to the device 15 contained in the plate-like object 13, and / or that the chip manufactured from the plate-like object 13 will peel off from the tape 19 and / or the second sheet 23a.

[0119] Furthermore, in the above-described embodiment, the three processes can be carried out in a single processing unit 26. Therefore, in the above-described embodiment, it is possible to manufacture multiple chips smoothly from the frame unit 11 compared to the case where the three processes are carried out in separate devices.

[0120] Furthermore, in the above-described embodiment, it is possible to divide the plate-like object 13 while aligning a specific division line included in the boundary of the multiple devices 15 with the direction in which the pressing roller 64a included in the pressing mechanism 64 extends. Therefore, in the above-described embodiment, it is possible to smoothly divide the plate-like object 13 in the division phase P3.

[0121] The embodiments described above represent one aspect of the present invention, and the present invention is not limited to the content described above.

[0122] For example, in the present invention, a splitting initiation point containing a crack that reaches the other surface 13c but not the other surface 13b may be formed in the plate-like object 13. In this case, it is preferable that the plate-like object 13 is split by pressing from the other surface 13c side (second sheet 23a side) where the crack is exposed. That is, in this case, it is preferable that the production of multiple chips from the frame unit 11 is carried out in accordance with the chip manufacturing method shown in Figure 11, with the first inversion phase P2 and the second inversion phase P4 omitted. Also, in this case, the production of chips from the frame unit 11 may be carried out in the processing apparatus 26 shown in Figure 8, with the inversion unit 36 ​​omitted.

[0123] Furthermore, in the present invention, the raised portion may be immovable relative to the holding portion (specifically, the upper surface of the porous plate 10) of the holding mechanism 4 included in the fixing device 2 or fixing unit 28. In this case, the holding mechanism 4 is provided with an annular protrusion on the upper surface of the side wall of the frame 8 of the table 6, instead of, for example, the lifting member 16, the plurality of lifting rods 18 and the drive source 20. Also in this case, when the frame unit 11 is loaded onto the table 6, the intermediate region of the tape 19 located between the outer edge region and the central region is raised toward or beyond the other end of the through hole 21a. Therefore, in this case, the fixing of the second sheet 23a to the frame unit 11 is carried out in accordance with the plurality of steps shown in Figures 4 and 12, with the order changed so that the raised step S12 is carried out before the holding step S11.

[0124] Furthermore, in the present invention, instead of the holding mechanism 46 included in the divided unit 30, a support mechanism may be provided that simply supports the frame unit 11 without having the function of holding it. Also, in the present invention, instead of the pressing roller 64a of the pressing mechanism 64 included in the divided unit 30, a pressing blade capable of pressing the plate-shaped object 13 by moving along the thickness direction of the plate-shaped object 13 may be provided. Furthermore, in the present invention, instead of the holding mechanism 46 and the pressing mechanism 64 included in the divided unit 30, a bending mechanism for performing two-point bending or three-point bending on the frame unit 11 may be provided.

[0125] Furthermore, in the present invention, the three processes described above may be performed below or to the side of the plate-like object 13 contained in the frame unit 11 or the plurality of chips manufactured therefrom, rather than above. That is, in the processing apparatus 26, the fixing unit 28, the dividing unit 30, or the peeling unit 32 may be replaced with fixing units, dividing units, or peeling units, respectively, for performing the process below or to the side of the plate-like object 13. For example, in the processing apparatus 26, the dividing unit 30 may be replaced with a dividing unit for dividing the plate-like object 13 along the boundary of the plurality of devices 15 by pressing the plate-like object 13 from below. Moreover, in this case, the processing apparatus 26 does not need to be provided with an inversion unit 36.

[0126] Furthermore, the structures and methods of the embodiments described above can be modified as appropriate without departing from the scope of the present invention. [Explanation of Symbols]

[0127] 2: Fixing device 4: Holding mechanism 6: Table 8: Frame (8a: Flow channel) 10: Porous plate 11: Frame unit (11a, 11b: parts) 12:Suction source 13: Plate-like object (13a: Notch, 13b: One side, 13c: Other side) 14: Air supply source 15: Devices 16: Lifting / lowering member 17: Splitting point (17a: Modified area, 17b: Crack) 18: Lifting rod 19: Tape (First Sheet) 20: Power source 21: Frame (21a: through hole, 21b: arc section, 21c: straight section) (21d, 21e: notches) 22: Fixing mechanism (22a: feed roller, 22b, 22c: guide roller) (22d: Recovery roller, 22e: Pressing roller) 23: Sheet (23a: Cut-out portion from the sheet (second sheet)) 24: Cutting mechanism (24a: support rod, 24b: arm, 24c: cutter) 26: Processing Unit 28: Fixing Unit 30: Split Unit 32: Peeling Unit 34: Cassette support stand 36: Reversal Unit 38: Conveyor Unit 40: Controller 42: Movement mechanism 44: Imaging mechanism (First imaging mechanism) 46: Holding mechanism (support mechanism) 48: Table 50: Main body (50a: Frame) 52: Suction source 54: Air supply source 56: Addition part (56a: Frame) 58: Connecting member 60: Movement mechanism 62: Rotation mechanism 64: Pressing mechanism (64a: Pressing roller (pressing member)) 66: Imaging mechanism (Second imaging mechanism)

Claims

1. A fastening device for fastening a second sheet to a frame unit, which includes a frame having a through hole formed therein, a first sheet whose outer edge region is fixed to the frame so as to close one end of the through hole, and a plate-like object fixed to the central region of the first sheet so as to be positioned in the through hole, wherein the second sheet is fastened to close at least a portion of the other end of the through hole, A holding mechanism for holding the frame unit in an exposed state, The device includes a fastening mechanism for fastening the second sheet to the frame unit held by the holding mechanism such that it closes at least a portion of the other end of the through hole, The holding mechanism is, A holding portion for applying suction force to the plate-shaped object through the central region of the first sheet, The first sheet includes a raised portion for causing an intermediate region located between the outer edge region and the central region to rise toward or beyond the other end of the through hole, The raised portion is a fixing device that is movable or immovable relative to the holding portion.

2. A method for fixing a second sheet to a frame unit, which includes a frame having a through hole formed therein, a first sheet whose outer edge region is fixed to the frame so as to close one end of the through hole, and a plate-like object fixed to the central region of the first sheet so as to be positioned in the through hole, wherein the second sheet is fixed so as to close at least a portion of the other end of the through hole, A holding step in which the frame unit is held in a state in which the plate-like object is exposed by applying a suction force to the plate-like object through the central region of the first sheet, A raising step, before or after the holding step, in which an intermediate region of the first sheet located between the outer edge region and the central region is raised toward or beyond the other end of the through hole, The method includes, after the holding step and the raising step, a fixing step of fixing the second sheet to the frame unit so as to close at least a portion of the other end of the through hole, A fixing method comprising the fixing step, wherein the second sheet is fixed to the intermediate region of the first sheet.

3. A processing apparatus for manufacturing a plurality of chips from a frame unit comprising: a frame having through holes formed therein; a first sheet having an outer edge region fixed to the frame so as to close one end of the through holes; and a plate-like object fixed to the central region of the first sheet so as to be positioned in the through holes, with dividing points formed at the boundaries of a plurality of devices arranged in a matrix, wherein the processing apparatus comprises: A fastening unit for fastening a second sheet to the frame unit so as to close at least a portion of the other end of the through hole, A dividing unit for manufacturing a plurality of chips by dividing the plate-like material contained in the frame unit to which the second sheet is fixed along the boundary, A peeling unit for peeling the second sheet from the frame unit which includes the plurality of chips manufactured from the plate-like material, The system includes a transfer unit for transporting the frame unit between the fixing unit, the dividing unit, and the peeling unit, The fixing unit is, A holding mechanism for holding the frame unit in an exposed state, The device includes a fastening mechanism for fastening the second sheet to the frame unit held by the holding mechanism such that it closes at least a portion of the other end of the through hole, The holding mechanism is, A holding portion for applying suction force to the plate-shaped object through the central region of the first sheet, The first sheet includes a raised portion for causing an intermediate region located between the outer edge region and the central region to rise toward or beyond the other end of the through hole, The apparatus is such that the raised portion is movable or immovable relative to the holding portion.

4. The system further comprises a controller for controlling the fixing unit, the splitting unit, the peeling unit, and the transport unit, The fixing unit further comprises a first imaging mechanism for transmitting a first image signal to the controller for forming a first image obtained by imaging the frame unit held by the holding mechanism from the other end of the through hole, which shows at least a portion of the outer edge of the frame and a division line included in the boundary or a portion not included in the boundary but representing the direction in which the division line extends. The divided unit is, A support mechanism for supporting the frame unit, A second imaging mechanism for transmitting a second image signal to the controller for forming a second image showing at least a portion of the outer edge of the frame, obtained by imaging the frame unit supported by the support mechanism from one end of the through hole, A rotation mechanism for rotating the frame unit, which is supported by the support mechanism, along its circumferential direction, It has a pressing mechanism for dividing the plate-like object at the boundary by pressing the plate-like object included in the frame unit supported by the support mechanism, The pressing mechanism includes a pressing member that extends along a predetermined direction, The processing apparatus according to claim 3, wherein the controller controls the dividing unit to operate the rotation mechanism to make the dividing line parallel to the predetermined direction based on the first image signal and the second image signal, and then to operate the pressing mechanism to press the plate-shaped object with the pressing member.

5. A method for manufacturing a plurality of chips from a frame unit comprising: a frame having a through hole formed therein; a first sheet having an outer edge region fixed to the frame so as to close one end of the through hole; and a plate-like object fixed to the central region of the first sheet so as to be positioned in the through hole, with dividing points formed at the boundaries of a plurality of devices arranged in a matrix. A fixing phase in which a second sheet is fixed to the frame unit so as to close at least a portion of the other end of the through hole, Following the fixing phase, a splitting phase is performed to manufacture multiple chips by dividing the plate-like material contained in the frame unit along the boundary, The process includes, after the splitting phase, a peeling phase in which the second sheet is peeled off from the frame unit, The fixing phase is, A holding step in which the frame unit is held in a state in which the plate-like object is exposed by applying a suction force to the plate-like object through the central region of the first sheet, A raising step, before or after the holding step, in which an intermediate region of the first sheet located between the outer edge region and the central region is raised toward or beyond the other end of the through hole, The method includes, after the holding step and the raising step, a fixing step of fixing the second sheet to the frame unit so as to close at least a portion of the other end of the through hole, In the fixing step, the second sheet is fixed to the intermediate region of the first sheet. A method for manufacturing chips.

6. The fixing phase further comprises a first imaging step, after the holding step and before the fixing step, of imaging the frame unit from the other end of the through hole such that a first image is formed showing at least a portion of the outer edge of the frame and the division line to be included in the boundary or a portion not included in the boundary but representing the direction in which the division line to be included extends, The division phase is, A support step that supports the frame unit, A second imaging step is performed, following the support step, to image the frame unit from one end of the through hole such that a second image is formed showing at least a portion of the outer edge of the frame, Following the second imaging step, a rotation step is performed to rotate the frame unit along its circumferential direction so that the planned division line is parallel to a predetermined direction based on the first and second images. The process includes, after the rotation step, a pressing step in which the plate-shaped object is divided at the boundary by pressing it, The method for manufacturing a chip according to claim 5, wherein in the pressing step, the plate-shaped object is pressed by a pressing member extending in the predetermined direction.

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