Manufacturing method of wiring boards
By employing a mask with multiple projection regions to form aperture patterns, including a spanning boundary pattern, the method addresses the inaccuracies in existing laser processing methods, improving the precision and yield of printed circuit board manufacturing.
JP2026101505APending Publication Date: 2026-06-22IBIDEN CO LTD
Patent Information
- Authority / Receiving Office
- JP Β· JP
- Patent Type
- Applications
- Current Assignee / Owner
- IBIDEN CO LTD
- Filing Date
- 2024-12-10
- Publication Date
- 2026-06-22
Smart Images
Figure 2026101505000001_ABST
Abstract
Improving yield in the manufacturing of circuit boards. [Solution] The method for manufacturing a wiring board according to the embodiment includes: preparing a mask including a first projection region MA1 having a first light-transmitting pattern and a second projection region MA2 having a second light-transmitting pattern; irradiating the insulating layer DL with laser light through the first projection region MA1 to form a first aperture pattern corresponding to the first light-transmitting pattern in a first processing region DA1 of the insulating layer DL; and irradiating the insulating layer DL with laser light through the second projection region MA2 to form a second aperture pattern corresponding to the second light-transmitting pattern in a second processing region DA2 of the insulating layer DL. The first processing region DA1 and the second processing region DA2 are adjacent, and the method further includes forming a third aperture pattern spanning the first processing region DA1 and the second processing region DA2 by irradiating the insulating layer DL with laser light through a third projection region MA3 having a third light-transmitting pattern.
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Citation Information
Patent Citations
JP2020179408A