Laser Processing Equipment

Abstract

To enable an enclosure to approach a work-piece.SOLUTION: A laser processing device L is provided with a marker head 1 having a marker controller 100 and an enclosure 10. The marker head 1 comprises a galvano-scanner (a laser beam scanning part 5), arranged in the enclosure 10 so that an irradiation area R1 where printing is performed on a film (a work-piece W) at a position close to a bottom-side end part of the enclosure 10 is formed, which two-dimensionally scans a UV laser beam, and an optical element 57, arranged on a beam path of the UV laser beam in the enclosure 10, which adjusts a spot diameter of the UV laser beam so that chemical reaction is caused in a UV reaction layer in the irradiation area R1 formed on the work-piece W at the position close to the bottom-side end part of the enclosure 10.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The technology disclosed herein relates to a laser processing apparatus. [Background technology]

[0002] An example of a laser processing device is disclosed in Patent Document 1. Specifically, the laser processing device according to Patent Document 1 includes a laser beam deflection unit (laser beam scanning unit) that deflects laser beam, a housing that houses the laser beam deflection unit, and an exit window that is formed on the bottom surface of the housing and transmits the laser beam deflected by the laser beam deflection unit. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-104047 A Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, in a laser processing device such as that disclosed in Patent Document 1, the distance from the exit window to the workpiece (work distance) may be set as an index showing the installation conditions that will provide favorable processing results.

[0005] In addition, when an exit window is formed on the underside of the housing, as in the laser processing apparatus of Patent Document 1, it has been conventionally known to support the underside of the housing from below with a specified member for supporting the housing (hereinafter referred to as the "support member"), and to adjust the height position of the exit window so as to realize the work distance by adjusting the height of the support member.

[0006] On the other hand, in order to reduce the installation space of the laser processing device, it is possible to move the position of the workpiece corresponding to the work distance set in the laser processing device closer to the bottom surface of the housing in the height direction. In this case, it is effective to consider various points of view.

[0007] The technology disclosed herein has been made in consideration of the above points, and its purpose is to bring the housing and the workpiece into close proximity. [Means for solving the problem]

[0008] A first aspect of the present disclosure relates to a laser processing device that is attached to a mounting position and processes a workpiece by irradiating a laser beam toward an irradiation area. The laser processing device includes a laser beam deflection unit that deflects the laser beam so that the laser beam is irradiated toward the irradiation area according to a predetermined processing setting, and a housing that accommodates the laser beam deflection unit.

[0009] According to a first aspect of the present disclosure, the housing is formed with an exit window that transmits laser light irradiated toward the irradiation area via the laser light deflection unit, and a mounting surface that is arranged opposite the exit window and is attached to the mounting position.

[0010] According to the first aspect, in the housing according to the first aspect, a mounting surface is formed on the opposite side of the exit window. By configuring the housing to be mounted at the mounting position not on the outer surface on which the exit window is formed, but on the mounting surface facing the opposite side, the housing can be supported so as to be suspended from the mounting position. This eliminates the need to interpose a support member between the housing and the work, and allows the housing and the work to be placed close to each other.

[0011] In this case, the member for supporting the housing (support member) is located on the opposite side of the exit window, similar to the attachment position, and can be sufficiently separated from the workpiece. This makes it possible to suppress interference between the support member and the workpiece while keeping the housing and the workpiece close to each other.

[0012] Furthermore, according to a second aspect of the present disclosure, the housing may house a solid-state laser crystal that generates laser light based on excitation light, and a support plate that extends along a direction from the mounting surface toward the exit window and supports the solid-state laser crystal, and the support plate may be attached to the housing in a non-integral state with respect to the mounting surface.

[0013] According to the second aspect, the influence of distortion, vibration, etc., generated on the mounting surface at the mounting position on the solid-state laser crystal can be suppressed. As a result, even if the housing is configured to be supported at the mounting position, the laser light can be generated satisfactorily.

[0014] According to a third aspect of the present disclosure, the mounting surface may be provided with an attachment that allows the mounting surface to be attached to the mounting position.

[0015] According to the third aspect, instead of directly connecting the support member provided at the mounting position to the mounting surface of the housing, the support member is connected via an attachment, so that the housing can be mounted to the support member, which can take various forms, without having to make ingenious efforts in the structure of the housing itself. This is effective in facilitating replacement of various processing devices with the laser processing device according to the present disclosure in a manufacturing line where the use of various processing devices is assumed.

[0016] Furthermore, according to a fourth aspect of the present disclosure, the housing may have an exit surface in which the exit window is formed, and an open surface which surrounds the laser light deflection portion together with the mounting surface and the exit surface and is at least partially open to communicate with the exit window, and a cover member capable of opening and closing the open surface may be provided on the open surface.

[0017] According to the fourth aspect, by configuring the opening surface to be openable and closable, rather than the exit surface facing the workpiece and the mounting surface to be mounted at the mounting position, it becomes possible to access the exit window without causing interference with the workpiece, support member, etc. This makes it possible to improve the maintainability of the laser processing device.

[0018] Furthermore, according to a fifth aspect of the present disclosure, the housing may have a connection surface facing the side opposite the open surface and surrounding the laser light deflection portion together with the open surface, the mounting surface and the emission surface, and an electrical cable for supplying power within the housing may be connected to the connection surface.

[0019] According to the fifth aspect, the open surface on which the cover member is provided is located on the opposite side to the connection surface to which the electric cable is connected. When the cover member is opened, closed, or attached / detached, interference between the cover member and the electric cable is suppressed. This improves the maintainability of the laser processing device.

[0020] In addition, according to a sixth aspect of the present disclosure, the workpiece is transported in a predetermined transport direction, the irradiation area has a constant dimension in the transport direction, and the spot diameter of the laser light on the workpiece is set so that the focal depth of the laser light corresponds to a portion of the irradiation area where the optical path length of the laser light is longest and a portion of the irradiation area where the optical path length is shortest.

[0021] According to a seventh aspect of the present disclosure, a path corresponding to the irradiation area among the movement paths of the workpiece may include portions having different distances from the exit window.

[0022] Furthermore, according to an eighth aspect of the present disclosure, the workpiece is transported in a predetermined transport direction, a dimension of the irradiation area in the transport direction is 120 mm or more, the laser light deflection unit has a first mirror that deflects the laser light so that it is irradiated onto the irradiation area, the first mirror is arranged to face the workpiece across the exit window, the relative position of the workpiece with respect to the housing is set so that a distance from the first mirror to the workpiece is 150 mm or less, and a spot diameter of the laser light on the workpiece at the relative position is 60 μm or more.

[0023] In general, as the dimension of the irradiation area becomes longer, the optical path length difference between the center and the end of the irradiation area becomes larger. In this case, in order to realize a configuration that allows for the optical path length difference without providing a separate mechanism for adjusting the focus of the laser light, a laser light having a focal depth of a predetermined value or more is required.

[0024] According to the findings of the present inventors as a result of thorough investigation, in a layout set as in the eighth aspect, a sufficient depth of focus can be ensured by setting the spot diameter of the laser light on the workpiece to 60 μm or more.

[0025] A ninth aspect of the present disclosure relates to a laser processing device that is supported by a support member connectable to a connection surface of a substantially rectangular parallelepiped printing device having an exposed printing part that contacts a printing area on a workpiece and a connection surface different from the printing surface, and that processes the workpiece by irradiating a laser beam toward an irradiation area set corresponding to the printing area. The laser processing device includes a laser beam deflection unit that deflects the laser beam so that the laser beam is irradiated toward the irradiation area according to a predetermined processing setting, and a housing that accommodates the laser beam deflection unit.

[0026] According to a ninth aspect of the present disclosure, the housing is formed with an exit window that transmits laser light irradiated toward the irradiation area via the laser light deflection portion, and a mounting surface that is connected to the support member.

[0027] According to the ninth aspect, the housing according to the ninth aspect is formed with an exit window corresponding to the printing unit in the substantially rectangular printing device, and a mounting surface corresponding to the connection surface in the printing device. Here, by configuring the housing so that a support member is connected to the mounting surface, the housing can be supported from the side or above by the support member. This allows the housing and the work to be closer together than in a configuration in which the housing is supported from below.

[0028] In this case, the support member for supporting the housing is positioned to the side or above the housing, so it can be sufficiently separated from the workpiece. This makes it possible to suppress interference between the support member and the workpiece while keeping the housing and the workpiece close to each other.

[0029] According to a tenth aspect of the present disclosure, the workpiece may be transported in a state where it is wrapped around a transport roller, and the transport roller may be positioned so as to overlap the irradiation area.

[0030] Furthermore, according to an eleventh aspect of the present disclosure, the workpiece may be transported in a predetermined transport direction, the dimension of the irradiation area in the transport direction may be 120 mm or more, the output of the laser light passing through the exit window may be set to 2 W or less, and the spot diameter of the laser light on the irradiation area may be set to 60 μm or more.

[0031] According to the findings obtained as a result of extensive research by the inventors of the present application, by configuring as in the 11th aspect, it is possible to achieve a compact housing while ensuring a sufficient depth of focus. Effect of the Invention

[0032] As described above, according to the present disclosure, the housing and the workpiece can be brought into close proximity to each other. [Brief description of the drawings]

[0033] [Figure 1]FIG. 1 is a diagram illustrating an example of the overall configuration of a laser processing system. [Diagram 2] FIG. 2 is a block diagram illustrating a schematic configuration of the laser processing device. [Figure 3A] FIG. 3A is a perspective view illustrating an example of the appearance of a marker head. [Figure 3B] FIG. 3B is a perspective view illustrating an example of the appearance of the marker head. [Figure 4] FIG. 4 is a side view of the marker head. [Diagram 5] FIG. 5 is a perspective view illustrating a state in which a cover member is removed from the marker head. [Figure 6] FIG. 6 is a rear view of the marker head. [Figure 7] FIG. 7 is a diagram illustrating a connection structure of an electric cable in a marker head. [Figure 8] FIG. 8 is a perspective view illustrating an example of a housing structure for the marker head. [Figure 9] FIG. 9 is a perspective view illustrating an example of a housing structure for the marker head. [Figure 10] FIG. 10 is a cross-sectional view that illustrates a schematic example of the internal structure of the marker head. [Figure 11] FIG. 11 is a vertical cross-sectional view that illustrates a schematic example of the internal structure of the marker head. [Figure 12] FIG. 12 is a side view that illustrates a schematic example of a main part inside the substrate accommodating portion. [Figure 13] FIG. 13 is a side view that illustrates a schematic example of a main part inside the crystal housing portion. [Figure 14] FIG. 14 is a perspective view illustrating a schematic example of a main part inside the mirror housing portion. [Figure 15] FIG. 15 is a perspective view for explaining deflection of the laser light by the laser light scanning unit. [Figure 16] FIG. 16 is a perspective view for explaining deflection of the laser light by the laser light scanning unit. [Figure 17A] FIG. 17A is a schematic diagram for explaining the replacement of a printing device and a marker head. [Figure 17B] FIG. 17B is a perspective view for explaining attachment of the marker head to the support member. [Figure 18] FIG. 18 is a diagram for explaining various dimensions of the marker head and the support member. [Figure 19] FIG. 19 is a flow chart illustrating a basic control process of a laser processing apparatus. [Figure 20] FIG. 20 is a block diagram for explaining a circuit structure related to the power supply unit. [Figure 21] FIG. 21 is a flow chart showing a specific example of a control process for the power supply unit. [Figure 22] FIG. 22 is a perspective view showing a modified example of the mounting surface and the attachment. [Diagram 23] FIG. 23 is a schematic diagram showing a further modified example of the mounting surface. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0034] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. Note that the following description is merely an example.

[0035] That is, in this specification, a laser marker will be described as an example of a laser processing device, but the technology disclosed herein can be applied to laser application equipment in general, regardless of whether it is called a laser processing device or a laser marker.

[0036] Furthermore, in this specification, printing processing will be described as a representative example of processing, but the present invention is not limited to printing processing and can be used in any processing using laser light, such as image marking.

[0037] <Overall composition> Fig. 1 is a diagram illustrating an example of the overall configuration of a laser processing system S, and Fig. 2 is a diagram illustrating a schematic configuration of a laser processing device L in the laser processing system S. In addition, Fig. 17A is a schematic diagram for explaining replacement of a printing device 1001 with a marker head 1, and Fig. 17B is a perspective view for explaining attachment of the marker head 1 to a support member 501.

[0038] The laser processing system S illustrated in Fig. 1 includes a laser processing device L and an external device 400 connected thereto. Among these, the laser processing device L illustrated in Fig. 1 and Fig. 2 is configured to perform processing on a workpiece W corresponding to a predetermined processing pattern Pp by irradiating a laser beam toward a predetermined irradiation area R1.

[0039] The irradiation area R1 here is an area set on the surface of the workpiece W, and may take various forms depending on the relative positional relationship between the laser processing device L and the workpiece W, the specifications of the laser processing device L, the movement path of the workpiece W, etc. The irradiation area R1 according to this embodiment is configured as a rectangular area as shown in FIG.

[0040] In particular, the laser processing device L according to this embodiment can emit laser light having a wavelength of about 350 nm as the laser light for processing the workpiece W. This wavelength corresponds to the wavelength range of ultraviolet light. Therefore, in the following description, the laser light for processing the workpiece W may be referred to as "UV laser light" to distinguish it from other laser lights such as near-infrared light. Note that laser lights other than ultraviolet light, such as infrared light, may also be used to process the workpiece W.

[0041] The following describes a case in which the workpiece W to be processed is made of a sheet-like film, and the film contains a UV reactive layer that chemically reacts with UV laser light.

[0042] However, in the laser processing apparatus L according to the present disclosure, the workpiece W that can be used as the processing target is not limited to a film containing a UV reactive layer. A film that chemically reacts with laser light having a wavelength other than ultraviolet light may be used, and the workpiece W made of various materials such as paper and synthetic resin may be used as the processing target.

[0043] In addition, the laser processing device L according to this embodiment is configured to perform so-called two-dimensional printing by two-dimensionally scanning the laser light, but as described later, this laser processing device L is configured to have a deep focal depth, so that so-called three-dimensional printing can also be performed. Therefore, this laser processing device L can even process a workpiece W transported along a three-dimensional movement path, as shown in Fig. 18 described later.

[0044] As shown in FIGS. 1 and 2, a laser processing apparatus L according to this embodiment includes a marker head 1, a marker controller 100, an electric cable 200, and an operation terminal 300. The marker head 1 is a marker controller 100, an electric cable 200, and an operation terminal 300.

[0045] Of these, the marker controller 100 is configured as a controller for controlling the marker head 1, and is capable of receiving settings related to a processing pattern and supplying power to the outside.

[0046] On the other hand, the marker head 1 is controlled by the marker controller 100 to emit laser light toward the irradiation area R1.

[0047] In this embodiment, the marker head 1 and the marker controller 100 are separate entities and connected by an electric cable 200. This electric cable 200 includes at least an electric wiring for transmitting power from inside the marker controller 100 (specifically, a power supply unit 104 described below) to the outside. Specifically, the electric cable 200 according to this embodiment is configured by bundling together an electric wiring for transmitting power and a signal wiring for transmitting and receiving an analog signal, a digital signal, and the like.

[0048] The marker head 1 according to this embodiment is installed on processing equipment 500 for processing a workpiece W made of a sheet-like film. As shown in Fig. 17A and Fig. 17B, this processing equipment 500 includes a support member 501 for supporting the marker head 1 and a transport roller 502 around which the workpiece W is wound.

[0049] 17B and 18, the processing equipment 500 further includes two rail members 503l and 503r that slidably support the marker head 1 via the support member 501, two fixed members 505 and 506 to which the ends of the two rail members 503l and 503r are attached, and a first driven roller 504l and a second driven roller 504r that are driven when the workpiece W is transported by the driving of the transport roller 502. At this time, it is preferable that the workpiece W is wound around the transport roller 502 so that the contact length between the transport roller 502 and the workpiece W is longer than the contact length between the first driven roller 504l and the workpiece W and is also longer than the contact length between the second driven roller 504r and the workpiece W. This makes it difficult for the workpiece W to slip on the transport roller 502 when the transport roller 502 transports the workpiece W. The "contact length" here refers to the length as seen in a cross section perpendicular to the rotation axis of each of the conveying roller 502, the first driven roller 504l, and the second driven roller 504r.

[0050] In this manner, the workpiece W in this embodiment can be a workpiece that is transported while being wrapped around the transport roller 502, and the transport roller 502 used in this case may be positioned so as to overlap with the irradiation area R1 in the vertical direction (the Z direction described below), for example, as shown in Figures 1, the lower diagram of Figure 17A, and Figure 18.

[0051] As shown in Fig. 17A, the support member 501 can mount the laser processing device L, particularly the housing 10 of the marker head 1, at a predetermined mounting position. Although Fig. 1, Fig. 17A, and Fig. 17B show an example of the support member 501 configured to suspend the housing 10 from above, as described later, the housing 10 may be supported from another direction, such as the side.

[0052] On the other hand, the conveying roller 502 is configured in a cylindrical shape having a central axis extending in the short dimension direction (the front-rear direction described later) of the workpiece W. In this case, the workpiece W is conveyed in the long dimension direction (the left-right direction described later) along a predetermined moving path by the rotation of the conveying roller 502.

[0053] Here, the processing equipment 500 of this embodiment is shared between the marker head 1 of this embodiment and a printing device 1001 that prints using a method other than laser light, as shown in the upper and lower figures of Figure 17A.

[0054] That is, the marker head 1 according to this embodiment is configured so as to be able to be attached in place of the printing device 1001 to a support member 501 of a processing facility 500 configured to mount the printing device 1001 thereon.

[0055] An example of a printing device 1001 that can replace the marker head 1 is a thermal transfer overprinter (TTO) for industrial use, but the marker head 1 can also be replaced with other printing devices 1001.

[0056] A printing device 1001 that can replace the marker head 1 may be, for example, one that includes a housing 1010 configured in an approximately rectangular parallelepiped shape and that has a printing surface 1010d that exposes a printing portion 1006 that contacts the printing area on the workpiece W, and a connection surface 1010u that is different from the printing surface 1010d and can be connected to a support member 501.

[0057] 17A, the marker head 1 is supported by a support member 501 connectable to the connection surface 1010u in the same manner as the printing device 1001. The marker head 1 thus supported performs processing on the workpiece W by irradiating laser light toward an irradiation area R1 set in correspondence with the printing area (an area in contact with the printing unit 1006 in the printing device 1001).

[0058] On the other hand, the operation terminal 300 has, for example, a central processing unit (CPU) and a memory, and is connected to the marker controller 100 so as to be able to transmit and receive electrical signals by wire or wirelessly.

[0059] The operation terminal 300 functions as a terminal for setting various processing conditions (also called printing conditions) such as print settings, and for displaying to the user information related to the processing of the workpiece W. This operation terminal 300 includes a display unit 301 for displaying information to the user, an operation unit 302 for accepting operation input by the user, and a storage device 303 for storing various information.

[0060] For example, the display unit 301 can be configured with a liquid crystal display or an organic EL panel. The operation unit 302 can be configured with a keyboard and a pointing device. Pointing devices include a mouse, a joystick, and the like. Instead of such a pointing device, the operation unit 302 may be configured with, for example, a touch panel type console directly connected to the marker controller 100.

[0061] The operation terminal 300 configured as described above can set processing conditions for laser processing based on operation input by a user. The processing conditions include one or more of the contents of the character string and figure to be printed on the workpiece W (processing pattern Pp), the target output of the laser light (laser power), and the scanning speed of the laser light on the workpiece W (scanning speed).

[0062] The processing conditions set by the operation terminal 300 are output to the marker controller 100 and stored in the storage unit 102 in the marker controller 100. If necessary, the storage device 303 in the operation terminal 300 may store the processing conditions.

[0063] The operation terminal 300 can be integrated into the marker controller 100, for example.

[0064] The external device 400 is connected to the marker controller 100 as necessary. In the example shown in Figures 1 and 2, a conveying speed sensor 401 and a programmable logic controller (PLC) 402 are provided as the external device 400.

[0065] The conveying speed sensor 401 is configured by, for example, a rotary encoder, and can detect the conveying speed of the workpiece W. The conveying speed sensor 401 outputs a signal (detection signal) indicating the detection result to the marker controller 100. The marker controller 100 controls two-dimensional scanning of the laser light, etc., based on the detection signal input from the conveying speed sensor 401.

[0066] The PLC 402 is configured by, for example, a microprocessor, and can input a control signal to the marker controller 100. The PLC 402 is used to control the laser processing system S in accordance with a predetermined sequence.

[0067] In addition to the above-mentioned devices and equipment, devices for operation and control, computers for performing various other processes, storage devices, peripheral devices, etc. can be connected to the laser processing apparatus L wirelessly or via wires.

[0068] Hereinafter, the hardware configurations of the marker head 1 and the marker controller 100 will be described in detail, and then the control of the marker head 1 by the marker controller 100 will be outlined.

[0069] <Marker controller 100> As shown in Figure 2, the marker controller 100 includes a receiving unit 101 that receives settings (processing settings) regarding processing conditions including a processing pattern, a memory unit 102 that stores the processing conditions, a control unit 103 that controls the marker head 1 based on the processing conditions, and a power supply unit 104 that serves as a power supply unit that supplies power to the marker head 1.

[0070] (Reception unit 101) The receiving unit 101 is configured to receive processing conditions input via the operation terminal 300 and to output the received processing conditions to the storage unit 102 and / or the control unit 103.

[0071] Specifically, the reception unit 101 according to this embodiment is electrically connected to the operation terminal 300, and can display a setting screen (not shown) for setting each processing condition on the above-mentioned display unit 301 of the operation terminal 300. The reception unit 101 can reflect the contents input through the setting screen in each processing condition, and output the reflected processing condition to the storage unit 102 and / or the control unit 103.

[0072] (Storage unit 102) The memory unit 102 is configured to temporarily or continuously store the processing conditions accepted by the accepting unit 101, and to output the stored processing conditions to the control unit 103, the display unit 301, etc., as necessary.

[0073] Specifically, the memory unit 102 according to this embodiment is configured using a non-volatile memory such as a hard disk drive (HDD) or a solid state drive (SSD), and can temporarily or continuously store data indicating processing conditions.

[0074] (Control unit 103) The control unit 103 is configured to control the power supply unit 104, the laser light output unit 4, the laser light scanning unit 5, etc. based on the processing conditions, thereby executing processing on the workpiece W corresponding to the processing conditions.

[0075] Specifically, the control unit 103 according to this embodiment includes a processor, a volatile memory, an input / output bus, etc. This control unit 103 generates a control signal based on the processing conditions read from the storage unit 102 or directly input from the receiving unit 101, and outputs the generated control signal to each unit of the laser processing device L, thereby controlling the processing of the workpiece W.

[0076] For example, when starting processing of the workpiece W, the control unit 103 reads a target output that constitutes one of the processing conditions from the memory unit 102, and controls the generation of laser excitation light by inputting a control signal generated regarding the target output to the power supply unit 104, etc.

[0077] (Power supply section 104) The power supply unit 104 supplies a drive current to the excitation light generation unit 2 based on a control signal output from the control unit 103. Although details are omitted, the power supply unit 104 determines a drive current based on a target output input from the control unit 103, and supplies the determined drive current to the excitation light generation unit 2. The power supply unit 104 supplies power to the excitation light generation unit 2, and can be configured by a DC power supply 104a or the like, as exemplified in Fig. 20 described later. Details of the power supply unit 104 will be described later.

[0078] In this embodiment, the excitation light generating unit 2, which is constituted by an excitation light source such as a laser diode, is configured to be built into the marker head 1, not into the marker controller 100. The power supplied from the power supply unit 104 is supplied to the excitation light generating unit 2 through the above-mentioned electric cable 200.

[0079] <Marker head 1> Fig. 3A and Fig. 3B are perspective views illustrating an example of the appearance of the marker head 1. Fig. 4 is a side view of the marker head 1, Fig. 5 is a perspective view illustrating the marker head 1 with the cover member 13 removed, and Fig. 6 is a rear view of the marker head 1.

[0080] Moreover, Fig. 7 is a diagram illustrating a connection structure of the electric cable 200 in the marker head 1, and Figs. 8 and 9 are perspective views illustrating a housing structure of the marker head 1. Moreover, Fig. 10 is a cross-sectional view that generally illustrates the internal structure of the marker head 1, and Fig. 11 is a vertical cross-sectional view that generally illustrates the internal structure of the marker head 1. The cross-section in Fig. 10 approximately coincides with the AA section in Fig. 11.

[0081] In addition, Figure 11 is a longitudinal cross-sectional view that generally illustrates the internal structure of the marker head 1, Figure 12 is a side view that generally illustrates the main parts within the substrate accommodating section H13, and Figure 13 is a side view that generally illustrates the main parts within the crystal accommodating section H12.

[0082] FIG. 14 is a perspective view that illustrates a schematic example of a main part inside the mirror housing portion H11, and FIGS. 15 and 16 are perspective views for explaining the deflection of the laser light by the laser light scanning portion.

[0083] (Schematic configuration of marker head 1) As shown in FIG. 2, the marker head 1 has, as its main components, an excitation light generating unit 2, an excitation light guiding unit 3 as a light guiding optical system, a laser light output unit 4, and a laser light scanning unit 5 as a laser light deflection unit.

[0084] Although details will be described later, the excitation light generating unit 2 generates excitation light for exciting laser light based on power supplied via an electric cable 200. The excitation light guiding unit 3 guides the excitation light generated by the excitation light generating unit 2 and inputs it to the laser light output unit 4. The laser light output unit 4 has a solid-state laser crystal 41 that generates laser light based on the excitation light guided by the excitation light guiding unit 3.

[0085] The laser light scanning unit 5 also has a first scanner 51 that drives a first mirror 51a so that the laser light generated by the solid-state laser crystal 41 is irradiated toward a desired position in the irradiation area R1, and a first control board 53 that controls this first scanner 51.

[0086] More specifically, the laser light scanning unit 5 in this embodiment is configured using a so-called two-axis (X-axis and Y-axis) galvanometer scanner, and in addition to a first scanner 51 as a Y scanner, further has a second scanner 52 as an X scanner and a second control board 54 that controls this second scanner 52.

[0087] The laser light scanning unit 5 controls the first scanner 51 via a first control board 53 and controls the second scanner 52 via a second control board 54, thereby driving the first mirror 51a of the first scanner 51 and the second mirror 52a of the second scanner 52.

[0088] At this time, the laser light scanning unit 5, which serves as a laser light deflection unit, drives the first mirror 51a and the second mirror 52a in accordance with predetermined processing settings (settings related to the processing pattern Pp), thereby deflecting the laser light generated by the laser light output unit 4 so that it is irradiated toward the desired position in the irradiation area R1.

[0089] The marker head 1 also includes a housing 10 that houses the above-mentioned components, namely, the excitation light generating unit 2, the excitation light guiding unit 3, the laser light output unit 4, and the laser light scanning unit 5. The housing 10 is formed with an exit window 6 that transmits the laser light deflected by the first mirror 51a of the laser light scanning unit 5 (i.e., the laser light irradiated toward the irradiation area R1 via the laser light scanning unit 5).

[0090] Below, the configuration regarding the appearance of the marker head 1 (specifically, the configuration of the six sides of the housing 10) and the internal structure of the marker head 1 will be described in order.

[0091] (Outer surface of the housing 10) As illustrated in Fig. 3A, the housing 10 of the marker head 1 is configured as a roughly rectangular parallelepiped with a longer dimension in the front-to-rear direction (the direction from the right and front side to the left and depth side in Fig. 3A) compared to the left-to-right direction (the direction from the left and front side to the left and depth side in Fig. 3A when viewed from the front of the housing 10). Note that "left and right" in this specification corresponds to left and right as viewed by a user facing the housing 10.

[0092] Hereinafter, the front-rear direction of the housing 10 is regarded as the X direction, the left-right direction as the Y direction, and the height direction as the Z direction. In detail, the depth side of the paper of Fig. 3A in the X direction is regarded as the +X direction, and the front side of the paper of the same figure is regarded as the -X direction. Similarly, the front side of the paper of Fig. 3A in the Y direction is regarded as the +Y direction, and the depth side of the paper of the same figure is regarded as the -Y direction. Similarly, the upper side of the paper of Fig. 3A in the Z direction is regarded as the -Z direction, and the lower side of the paper of the same figure is regarded as the +Z direction.

[0093] For convenience, a definition based on the external shape of the housing 10 has been exemplified here, but instead of or in addition to this definition, a definition based on the operating direction and positional relationship of each component contained in the housing 10 can also be used.

[0094] For example, the first direction, which is the deflection direction by the first mirror 51a, can be the Y direction, and the second direction, which is the deflection direction by the second mirror 52a, can be the X direction. In this embodiment, the deflection direction by the mirror included in the laser light scanning unit 5 and driven indicates the direction in which the irradiation position is scanned in the irradiation area R1 by driving the mirror. That is, the irradiation position in the irradiation area R1 is scanned in the Y direction by driving the first mirror 51a to rotate. In addition, the irradiation position in the irradiation area R1 is scanned in the X direction by driving the second mirror 52a to rotate. Similarly, the irradiation direction, which is the direction from the marker head 1 toward the irradiation area R1, more specifically, the direction from the exit window 6 toward the irradiation area R1, can be regarded as the Z direction. The irradiation direction may be the direction from the first mirror 51a toward the irradiation area R1. In this embodiment, the "direction from a certain member toward the irradiation area R1" refers to one of the axial directions in which a certain member and the irradiation area R1 face each other. The "direction from a certain member toward the irradiation area R1" is not the traveling direction of light from a certain member toward the irradiation area R1. Therefore, although the irradiation position in the irradiation area R1, i.e., the traveling direction of light toward the irradiation area R1, changes due to the rotation of the first mirror 51a and the rotation of the second mirror 52a, the irradiation direction in this embodiment does not change in accordance with the change in the traveling direction of the light.

[0095] In the following description, it is assumed that the definition based on the outer shape of the housing 10 coincides with the definition based on the deflection direction and irradiation direction of the first mirror 51a and the second mirror 52a.

[0096] 3A to 7, the housing 10 has a bottom surface 10d on which the exit window 6 is formed, and a top surface 10u facing the bottom surface 10d and the exit window 6. For example, the bottom surface 10d faces the +Z direction, while the top surface 10u faces the -Z direction, and both are made of one or more plate-like members having a thickness in the Z direction. Note that "facing" here refers to conceptual facing when the housing 10 is considered as a conceptual rectangular parallelepiped.

[0097] The housing 10 further has a bottom surface 10d, a top surface 10u, as well as a front surface 10f surrounding the excitation light generating unit 2, the excitation light guiding unit 3, the laser light output unit 4, and the laser light scanning unit 5, a rear surface 10b, a left side surface 10l, and a right side surface 10r.

[0098] The front surface 10f, the rear surface 10b, the left side surface 10l, and the right side surface 10r all face in a direction perpendicular to the top surface 10u and the bottom surface 10d (i.e., a direction along the XY plane). For example, the front surface 10f faces in the -X direction, while the rear surface 10b faces in the +X direction, and both are made of one or more plate-like members having a thickness in the X direction. Similarly, for example, the left side surface 10l faces in the +Y direction, while the right side surface 10r faces in the -Y direction, and both are made of one or more plate-like members having a thickness in the Y direction.

[0099] The six sides of the housing 10 will be described in order below. The terms "side" in the bottom side 10d, top side 10u, front side 10f, back side 10b, left side 10l, and right side 10r also include plate-like members having a certain thickness. These six sides are merely classified for convenience, and do not need to be separate from each other. For example, at least one of the left side 10l and the right side 10r and at least a part of the bottom side 10d (particularly the non-offset portion 18 described below) may be integrally formed.

[0100] -Top surface 10u- As shown in Fig. 3A, the top surface 10u of the six surfaces constituting the housing 10 extends along the XY direction and is formed into a rectangular plate shape with the dimension in the X direction being longer than that in the Y direction. The top surface 10u according to this embodiment is configured as a mounting surface that is connected to a support member and is mounted to the mounting position. In this case, the plate thickness of the top surface 10u is greater than the plate thicknesses of the left side surface 10l and the right side surface 10r.

[0101] An attachment 7 that can be attached to a mounting position is provided on the top surface 10u as a mounting surface. The attachment 7 is configured as a plate-like member that extends along a direction (XY direction) substantially parallel to the top surface 10u and has a thickness in a direction (Z direction) perpendicular to the top surface 10u. The attachment 7 is placed on the top surface 10u and is fastened to the top surface 10u by a fastener 7b such as a bolt, as shown in FIG. 10, for example. As described above, the plate thickness of the top surface 10u is greater than the plate thicknesses of the left side surface 10l, right side surface 10r, etc. Increasing the plate thickness of the top surface 10u is advantageous in ensuring an insertion allowance for the fastener 7b.

[0102] Fastening holes 7a corresponding to the support member 501 to be placed at the attachment position are provided on the upper surface of the attachment 7. With the support member 501 placed on the attachment 7, the support member 501 can be attached to the attachment 7 by fastening a fastener such as a bolt into the fastening hole 7a. As a result, the top surface 10u is attached to the attachment position via the attachment 7, and at the same time, the housing 10 is suspended from the support member 501.

[0103] -Bottom 10d- As shown in Fig. 4, the bottom surface 10d of the six surfaces is disposed on the opposite side of the top surface 10u across the laser light scanning unit 5. As shown in Fig. 5, the bottom surface 10d is formed in a curved shape extending along the X direction and having a central portion in the Y direction recessed toward the -Z side.

[0104] Specifically, the bottom surface 10d according to this embodiment has an offset portion 16a located in the center in the Y direction and offset toward the -Z side, and non-offset portions 18 located at both ends in the Y direction and protruding toward the +Z side compared to the offset portion 16a, as shown in Figures 5 and 10. Both the offset portion 16a and the non-offset portion 18 are formed to extend flatly along the X direction.

[0105] In detail, a groove having a trapezoidal cross section with an offset portion 16a as an upper base and expanding in diameter toward the +Z side is formed on the bottom surface 10d according to the present embodiment. The exit window 6 is provided on the offset portion 16a as the upper base. The bottom surface 10d according to the present embodiment is configured as an exit surface on which the exit window 6 is formed. The details of the exit window 6 will be described later.

[0106] On the other hand, non-offset portion 18 constitutes a portion of bottom surface 10d from a portion corresponding to the oblique side of the trapezoid to the +Z end. Non-offset portion 18 according to this embodiment is constituted by a first plate-like member 18l located on the +Y side of offset portion 16a, and a second plate-like member 18r located on the -Y side of offset portion 16a.

[0107] The first plate-like member 18l is formed in a thin plate shape as shown in Fig. 10, and has an inverted L shape when viewed from the -X side. Here, "inverted L shape" refers to a shape obtained by inverting an L shape with respect to an axis of symmetry extending in the Z direction. The first plate-like member 18l is disposed on the opposite side of the second plate-like member 18r across the offset portion 16a. The vertical side of the inverted L shape of the first plate-like member 18l constitutes the oblique side on the +Y side of the trapezoid, and the horizontal side of the inverted L shape constitutes the +Z side end of the +Y side.

[0108] The second plate-like member 18r is formed in a thin plate shape as shown in Fig. 10, and has an L-shape when viewed from the -X side. The second plate-like member 18r is disposed on the opposite side of the first plate-like member 18l across the offset portion 16a. The vertical side of the L-shape of the second plate-like member 18r constitutes the oblique side on the -Y side of the trapezoid, and the horizontal side of the L-shape constitutes the +Z side end on the -Y side.

[0109] 10, the first plate-shaped member 18l, together with the lower half of the left side surface 10l, covers the exit window 6 from the +Y side. Meanwhile, the second plate-shaped member 18r, together with the lower half of the right side surface 10r, covers the exit window 6 from the -Y side. In this manner, the first plate-shaped member 18l and the second plate-shaped member 18r, together with the lower half of the left side surface 10l and the lower half of the right side surface 10r, form a skirt-shaped cover (skirt portion).

[0110] -Front 10f- As shown in FIGS. 3B and 5, the front surface 10f of the six surfaces extends along the YZ direction and is formed in a plate shape provided with an indicator 11, two ventilation holes 12, 12, and a notch 10c.

[0111] As shown in Fig. 3B and Fig. 5, the indicator 11 is provided on the upper side of the front surface 10f near the right end, and is composed of three lamps 11a, 11b, and 11c aligned along the Y direction (only shown in Fig. 5). The three lamps 11a, 11b, and 11c are each composed of a light emitting diode (LED) electrically connected to the marker controller 100. Hereinafter, the three lamps 11a, 11b, and 11c are referred to as the first lamp 11a, the second lamp 11b, and the third lamp 11c, in order from the +Y side.

[0112] The first lamp 11a is configured, for example, with a blue LED, and lights up in blue in conjunction with a key switch (not shown) provided on the laser processing device L. The "key switch" here refers to a switch that is switched by a key managed by a safety manager or the like. By inserting the key into the laser processing device L and turning the key in a predetermined direction, the device can be switched among an "OFF" state that corresponds to a power-off state, a "POWER ON" state that corresponds to a power-on state and does not permit emission of laser light, and a "LASER ON" state that corresponds to a power-on state and permits emission of laser light.

[0113] On the other hand, the second lamp 11b is configured to be able to switch the emission color between green and orange, and the emission color is switched in response to various conditions in addition to the state of the key switch. The third lamp 11c is configured to be able to switch the emission color between green, orange, and red, and the emission color is switched in response to various conditions in addition to the state of the key switch.

[0114] The first lamp 11a, the second lamp 11b, and the third lamp 11c are each electrically connected to the marker controller 100, and are configured to light up in response to a control signal input from the control unit 103. The control of the indicator 11 will be described in detail later.

[0115] 3B and 5, one of the two ventilation holes 12, 12 is provided on the lower side of the front surface 10f near the left end, and the other of the two ventilation holes 12, 12 is provided on the lower side of the front surface 10f near the right end. Both of the two ventilation holes 12, 12 penetrate the front surface 10f in the thickness direction, and each communicates with a second storage section H2 described later.

[0116] 3B and 5, the cutout 10c is formed by cutting out a portion including the lower end of the front surface 10f, and is connected to the front end (the end on the -X direction side) of the offset portion 16a. The cutout 10c is arranged between the two ventilation openings 12, 12 in the Y direction.

[0117] In detail, the notch 10c is formed in a substantially trapezoidal shape tapered toward the +Z direction so as to have a cross section substantially matching the cross section of the trapezoid with the offset portion 16a as the upper base. The front surface 10f according to this embodiment is configured as a user access surface (open surface) that is at least partially open so as to communicate with the exit window 6 via the offset portion 16a by providing the notch 10c in the lower half thereof.

[0118] -Details of the front 10f 1 (dust collector and camera)- The cutout 10c according to this embodiment can be used for various purposes in addition to maintenance actions for the exit window 6 (for example, cleaning actions performed by inserting a cleaning tool through the cutout 10c).

[0119] Generally, when a UV laser is irradiated onto a workpiece W such as a film, smoke is generated. Therefore, a dust collector separate from the marker head 1 may be connected to the front surface 10f, and the smoke may be sucked in through the notch 10c. Note that instead of attaching a dust collector to the marker head 1 externally, such as by connecting it to the front surface 10f, the dust collector may be built into the marker head 1.

[0120] Furthermore, a camera may be built into or attached externally to the marker head 1 in order to inspect the printed content after a UV laser is irradiated onto a workpiece W such as a film to perform a printing process. Such a camera may be attached, for example, to the notch 10c or to the offset portion 16a. In the former case, a reflecting mirror may be provided around the exit window 6 so that the irradiation area R1 can be imaged from directly above (-Z side) as much as possible. Also, lighting may be provided around the camera or exit window 6 so that an image as bright as possible can be obtained.

[0121] -Details of the front surface 10f 2 (cover member 13 and opening / closing sensor)- A cover member 13 capable of opening and closing the front surface 10f is attached to the front surface 10f as an open surface. The cover member 13 has a first cover part 13a fixed to the upper half of the front surface 10f, a second cover part 13b that can swing to open and close the lower half of the front surface 10f, particularly the open portion defined by the notch 10ca, and a hinge mechanism 13c that connects the first cover part 13a and the second cover part 13b (see FIGS. 3A and 3B).

[0122] The first cover part 13a is formed in a rectangular plate shape covering the upper half of the front surface 10f, and has a through hole (reference number omitted) formed at approximately the same position as the indicator 11. The first cover part 13a is fixed to the upper half of the front surface 10f by fasteners such as screws.

[0123] The second cover part 13b is formed in a rectangular plate shape capable of covering the lower half of the front surface 10f, particularly the cutout 10c, and has through holes (reference numbers omitted) formed at approximately the same positions as the two ventilation holes 12, 12. The second cover part 13b is supported by the first cover part 13a via a hinge mechanism 13c.

[0124] The hinge mechanism 13c is located in the center of the front surface 10f in the Z direction, and pivotally connects the upper edge of the second cover portion 13b to the lower edge of the first cover portion 13a.

[0125] The hinge mechanism 13c can swing the second cover portion 13b around a rotation axis extending in the Y direction while the first cover portion 13a is fixed to the front surface 10f (see FIGS. 3A and 3B). By swinging the second cover portion 13b in the opening direction, the notch 10c in the front surface 10f can be exposed. By exposing the notch 10c, various maintenance operations such as cleaning of the exit window 6 can be performed through the offset portion 16a connected to the notch 10c.

[0126] The cover member 13 is not essential, and the front surface 10f may be exposed without providing the cover member 13.

[0127] In addition, although not shown in the figure, an opening / closing sensor that detects the opening and closing of the cover member 13 may be provided on at least one of the cover member 13 (particularly, the second cover portion 13b) and the front surface 10f (particularly, the peripheral portion of the cutout 10c on the front surface 10f).

[0128] Such an open / close sensor may be, for example, a magnetic sensor including a magnet provided on one of the second cover portion 13b and the front surface 10f, and a magnetic sensor (e.g., a Hall element) provided on the other of the second cover portion 13b and the front surface 10f. Note that the magnetic sensor is merely an example, and an optical sensor, a mechanical sensor, or the like may also be used.

[0129] This magnet sensor is electrically connected to the marker controller 100 and / or the circuit board in the marker head 1, and can output a detection signal indicating the open / closed state of the cover member 13, particularly the second cover part 13b, to the marker controller 100 and / or the circuit board.

[0130] By providing such an open / close sensor, it becomes possible to detect the open / closed state of the cover member 13 and perform various controls based on the open / closed state. As one example, the marker controller 100 according to this embodiment emergency stops the emission of the laser light when the cover member 13 is opened during emission of the laser light. Thereafter, the emission of the laser light can be resumed by closing the cover member 13 and performing an operation to release the emergency stop via the operation unit 302.

[0131] In addition, when the cover member 13 is regarded as one outer surface of the housing 10, the cover member 13 is visually recognized by the user when attaching the marker head 1. In this case, for example, the second cover portion 13b of the cover member 13 can be provided with a first mark M1 as a mark, as shown in FIG.

[0132] The first mark M1 is composed of a first center line M11 indicating the center of the irradiation area R1 (the intersection of the diagonals of the irradiation area R1), a +Y edge M12 indicating the edge on the +Y side of the irradiation area R1, and a -Y edge M13 indicating the center on the -Y side of the irradiation area R1.

[0133] It should be noted that the cover member 13 is not essential. In the case where the front surface 10f is regarded as the outer surface of the housing 10 without providing the cover member 13, the first mark M1 can be attached to the front surface 10f.

[0134] -Back 10b- 3B and 5, the rear surface 10b of the six surfaces is disposed on the opposite side of the front surface 10f across the laser beam scanning unit 5, and is formed in a plate shape extending along the YZ direction. The rear surface 10b according to the present embodiment can be regarded as one outer surface of the housing 10 (an outer surface different from the cover member 13), and serves as a connection surface to which an electric cable 200 that supplies power to the inside of the housing 10 is connected. The rear surface 10b as a connection surface surrounds the laser beam scanning unit 5 as a laser beam deflection unit together with the front surface 10f as an open surface, the top surface 10u as an attachment surface, and the bottom surface 10d as an emission surface.

[0135] 7, a connection cover 14 is provided on the rear surface 10b as a connection surface to cover a connection portion between the rear surface 10b and the electric cable 200. The connection cover 14 regulates the extension direction Ae of the electric cable 200 so that the electric cable 200 is unwound in an in-plane direction (YZ direction) of the rear surface 10b, more specifically, in a direction (Y direction) intersecting the irradiation direction (Z direction) among the in-plane directions (YZ directions).

[0136] In other words, the connection cover 14 is configured to feed out the electric cable 200 along a direction (Y direction or Z direction) perpendicular to the X direction which is a direction connecting the front surface 10f and the rear surface 10b.

[0137] Specifically, the connection cover 14 in this embodiment has an enclosing portion 14a that surrounds the connection terminal with the electric cable 200 in the marker head 1, a lid portion 14b that closes the enclosing portion 14a, a sealing member 14c that liquid-tightly seals the space between the enclosing portion 14a and the lid portion 14b, and a wire diameter conversion connector 14d that adjusts the wire diameter of the electric cable 200.

[0138] Among these, the surrounding portion 14a is formed so as to surround the connector opening on the rear surface 10b from the sides (YZ directions). More specifically, the surrounding portion a according to this embodiment is formed in a rectangular thin box shape opening toward the +X direction.

[0139] When the enclosure 14a is considered as a thin box, the bottom surface 14e is provided with two openings (reference numerals omitted) each leading to a different connection terminal. Among the side walls constituting the enclosure 14a, the left side wall 14f facing the +Y side is provided with a first through hole 14g penetrating the left side wall 14f along the Y direction as the extension direction Ae. The electric cable 200 is inserted through the first through hole 14g, so that the extension direction Ae of the electric cable 200 is restricted.

[0140] The wire diameter conversion connector 14d is disposed inside the enclosure 14a and is housed in a housing space partitioned by the enclosure 14a and the lid 14b. Here, the electric cable 200 according to this embodiment is composed of a first cable portion 201 extending from the marker controller 100 and connected to the wire diameter conversion connector 14d, and a second cable portion 202 extending from the wire diameter conversion connector 14d and connected to a connection terminal of the marker head 1. The wire diameter of the second cable portion 202 is set to be smaller than the wire diameter of the first cable portion 201 so as to fit the connection terminal of the marker head 1.

[0141] That is, in this embodiment, the electric cable 200 is connected to the marker head 1 in a state in which the wire diameter is converted by the wire diameter conversion connector 14d.

[0142] In general, there is a need to change the cable length of the electric cable 200 depending on the installation environment of the marker head 1. Here, when attempting to use an electric cable 200 that is longer than normal, there is a concern about voltage drop compared to a relatively short electric cable, and as a countermeasure to this, it is conceivable to use an electric cable 200 having a larger wire diameter.

[0143] As the wire diameter of the electrical cable 200 may change depending on the installation environment of the marker head 1, it may be possible to use the wire diameter conversion connector 14d as described above. However, simply using the wire diameter conversion connector 14d raises concerns about water getting into the connection between the first cable portion 201 and the wire diameter conversion connector 14d, and the connection between the second cable portion 202 and the wire diameter conversion connector 14d.

[0144] 7, by housing the wire diameter conversion connector 14d inside the connection cover 14, it is possible to prevent the above-mentioned connection parts from becoming wet. This makes it possible for the marker head 1 to be adapted to a wider range of installation environments.

[0145] -Left side 10l- As shown in FIGS. 3A, 3B, and 10, the left side surface 10l of the six surfaces is disposed on the +Y side with respect to the laser light scanning unit 5, and is formed in a plate shape extending along the ZX direction.

[0146] In addition, when the left side surface 10l is regarded as one of the outer surfaces of the housing 10, this left side surface 10l is visually recognized by the user when attaching the marker head 1. As shown in FIG. 3A, a second mark M2 can be attached to this left side surface 10l.

[0147] The second mark M2 is composed of a second center line M21 indicating the center of the irradiation area R1 (the intersection of the diagonals of the irradiation area R1), a +X edge M22 indicating the edge on the +X side of the irradiation area R1, and a -X edge M23 indicating the edge on the -X side of the irradiation area R1.

[0148] -Right side 10r- 4, 5, and 10, the right side surface 10r of the six surfaces is disposed on the -Y side with respect to the laser light scanning unit 5, and is formed in a plate shape extending along the ZX direction. The right side surface 10r is disposed on the opposite side of the left side surface 10l with the laser light scanning unit 5 in between.

[0149] When the right side surface 10r is regarded as one outer surface of the housing 10, a third mark M3 configured similarly to the second mark M2 can be attached to this right side surface 10r.

[0150] The third mark M3 is composed of a third center line M31 indicating the center of the irradiation area R1 (the intersection of the diagonals of the irradiation area R1), a +X edge M32 indicating the edge on the +X side of the irradiation area R1, and a -X edge M33 indicating the edge on the -X side of the irradiation area R1.

[0151] Incidentally, it is not essential that the configuration includes both the second mark M2 and the third mark M3, and the configuration may include either the second mark M2 or the third mark M3.

[0152] (Internal space of the housing 10) The housing 10 defines an internal space surrounded by six sides, namely, a bottom side 10d, a top side 10u, a front side 10f, a rear side 10b, a left side side 10l, and a right side side 10r. The internal space is partitioned into a plurality of storage sections by plate-like members disposed within the housing 10.

[0153] As such plate-like members, the marker head 1 according to this embodiment has a first base plate 15, a second base plate 16, and a third base plate 17. In this embodiment, the first base plate 15, the second base plate 16, and the third base plate 17 are separate from one another. Among these plate-like members, the first base plate 15 is configured as a support plate capable of supporting the solid-state laser crystal 41.

[0154] The configuration of each plate-like member will be described in order below.

[0155] -First base plate 15- 8, 9, and 10, the first base plate 15 is configured as a metal plate-like member extending in the X direction, and is housed in the housing 10 (in other words, surrounded by six sides of the housing 10). The plate thickness of the first base plate 15 is set to be greater than the plate thicknesses of at least the left side surface 10l and the right side surface 10r of the six sides of the housing 10.

[0156] In particular, the first base plate 15 according to this embodiment has an inverted L-shape when viewed from the -X side. Here, the "inverted L-shape" refers to a shape obtained by inverting an L-shape with respect to an axis of symmetry extending in the Z direction. Hereinafter, the portion of the first base plate 15 corresponding to the vertical side of the inverted L-shape may be referred to as the vertical side portion 15a, and the portion corresponding to the horizontal side of the inverted L-shape may be referred to as the horizontal side portion 15b.

[0157] The first base plate 15 is disposed between the left side surface 10l and the right side surface 10r in the Y direction, and is disposed on the +Y side of the second base plate 16. The first base plate 15 is disposed on the +Y side of the third base plate 17, with the second base plate 16 in between.

[0158] Here, a sealing member (not shown) is provided between the left end portion (the end portion on the +Y side) of the horizontal side portion 15b and the left side surface 10l of the housing 10 to liquid-tightly seal the gap between the first base plate 15 and the left side surface 10l.

[0159] The first base plate 15 is disposed below the top surface 10u in the Z direction.

[0160] 10, the upper end (the end on the -Z side) of the vertical side portion 15a faces the top surface 10u with a predetermined gap therebetween. This causes the first base plate 15 to be non-integral with the top surface 10u of the housing 10 (a state in which the first base plate 15 is allowed to be displaced relative to the top surface 10u).

[0161] When an outer surface of the six surfaces of the housing 10 other than the top surface 10u is used as the mounting surface, instead of providing a gap between the top surface 10u and the vertical side portion 15a, a gap may be provided between the outer surface used as the mounting surface and the first base plate 15. For example, when the left side surface 10l of the housing 10 is used as the mounting surface, a gap can be provided between the left end of the horizontal side portion 15b and the left side surface 10l.

[0162] The first base plate 15 is disposed between the front surface 10f and the rear surface 10b in the X direction. As shown in Fig. 11, the first base plate 15 is fixed to the front surface 10f by front surface side fasteners 15c and is fixed to the rear surface 10b by rear surface side fasteners 15d.

[0163] That is, the first base plate 15 serving as a support plate is attached to the housing 10 via the front surface 10f and the back surface 10b while being in a non-integral state with the top surface 10u serving as an attachment surface.

[0164] Next, the vertical side portion 15a will be described in detail. The vertical side portion 15a according to this embodiment is formed in a thick plate shape extending along the Z direction as the irradiation direction and the X direction. As shown in Fig. 11, at least two through holes 15e and 15f are formed in the vertical side portion 15a.

[0165] Of the two through holes 15e, 15f, the second through hole 15e located on the +X side is used to optically couple the excitation light guide 3 and the laser light output unit 4. The second through hole 15e constitutes a first entrance window 91 that allows excitation light to enter from the excitation light guide 3 to the laser light output unit 4.

[0166] Of the two through holes 15e, 15f, the third through hole 15f located on the -X side is used to optically couple the laser light output unit 4 and the laser light scanning unit 5. An optical member 15h such as glass that transmits laser light is fitted into the third through hole 15f. The third through hole 15f and the optical member 15h, together with a fifth through hole 50b described later, form a second entrance window 92 that allows the laser light to enter the laser light scanning unit 5 from the laser light output unit 4.

[0167] Of the left and right side surfaces of the vertical side portion 15a, the left side surface facing the +Y side forms a partition surface 15g that divides a crystal housing portion H12 described below. Various optical components including the solid-state laser crystal 41 are fastened to this partition surface 15g.

[0168] Of the left and right side surfaces of the vertical side portion 15a, the right side surface facing the -Y side supports from the left a first casing 50 that defines a mirror housing section H11 described below. Instead of supporting the first casing 50 with the right side surface of the vertical side portion 15a, the right side surface may define a part of the mirror housing section H11.

[0169] Next, the horizontal side portion 15b will be described in detail. The horizontal side portion 15b according to this embodiment is formed in a thick plate shape extending along the X direction and the Y direction. As shown in Fig. 10, a first heat sink 81 as a heat sink according to this embodiment is provided on the lower surface of the horizontal side portion 15b.

[0170] The first heat sink 81 is composed of a plurality of fins protruding in the +Z direction. These fins are aligned in the Y direction. Each fin is formed to extend in the X direction. The first heat sink 81 is thermally coupled to components of the laser light output unit 4 (for example, the solid-state laser crystal 41) via the first base plate 15.

[0171] In the example shown in FIG. 10, the horizontal side portion 15b and the first heat sink 81 are integrally formed, but the present invention is not limited to this, and the horizontal side portion 15b and the first heat sink 81 may be formed separately.

[0172] -Second base plate 16- As shown in Figures 8, 9, and 10, the second base plate 16 is configured as a metal plate-like member extending in the X direction, and defines a portion of the six sides of the housing 10, in particular an offset portion 16a on the bottom surface 10d.

[0173] In particular, the second base plate 16 according to this embodiment is formed in a Z shape when viewed from the -Y side. When the second base plate 16 is considered to be Z-shaped, the upper side corresponds to the offset portion 16a in this embodiment. In the X direction, the length of the offset portion 16a as the upper side is set to be longer than the length of the bottom side when the second base plate 16 is considered to be Z-shaped.

[0174] The second base plate 16 is disposed between the left side surface 10l and the right side surface 10r in the Y direction, more specifically, between the first base plate 15 and the third base plate 17. The second base plate 16 is supported by the first base plate 15 and the third base plate 17 via fasteners such as screws (not shown).

[0175] The second base plate 16 is disposed below the top surface 10u in the Z direction. The second base plate 16 is disposed on the -Z side of the horizontal side portion 15b of the first base plate 15. Specifically, in the second base plate 16, the offset portion 16a as the upper side of the Z shape is disposed at approximately the same Z position as the +Z side portion (lower portion) when the vertical side portion 15a of the first base plate 15 is divided in half in the Z direction. In addition, in the second base plate 16, the portion corresponding to the bottom side of the Z shape is disposed at approximately the same Z position as the end portion (lower end portion) on the +Z side of the left side surface 10l and the right side surface 10r.

[0176] Here, a sealing member (not shown) is provided between the +Y side end (left end) of the offset portion 16a of the second base plate 16 and the right side surface of the vertical side portion 15a of the first base plate 15, for liquid-tightly sealing the gap between the offset portion 16a and the right side surface.

[0177] Similarly, a sealing member (not shown) is provided between the -Y side end (right end) of offset portion 16a and the left side surface of vertical side portion 17a of third base plate 17, for liquid-tightly sealing the gap between offset portion 16a and the left side surface.

[0178] The second base plate 16 is disposed between the front surface 10f and the rear surface 10b in the X direction. The second base plate 16 is fixed to the front surface 10f and the rear surface 10b via the first base plate 15 and the third base plate 17. The second base plate 16 may be directly fastened to the front surface 10f and the rear surface 10b.

[0179] Next, to describe the offset portion 16a in detail, the offset portion 16a according to this embodiment is formed in a thick plate shape extending along the X direction and the Y direction. When the offset portion 16a is divided into two in the X direction, the +X side portion (the rear portion in the front-rear direction) has the exit window 6 according to this embodiment formed therein.

[0180] The exit window 6 has an exit hole 61 penetrating the +X side portion of the offset portion 16a, a cover glass 62 fitted into the exit hole 61, and a seal member (not shown) that liquid-tightly seals the gap between the exit hole 61 and the cover glass 62 (see FIG. 10). The cover glass 62 is configured as an optical member that transmits the laser light deflected by the laser light scanning unit 5 and directed toward the irradiation area R1. The cover glass 62 can be formed in a rectangular shape corresponding to the shape of the irradiation area R1, for example, a rectangular shape that is approximately similar to the irradiation area R1 and smaller than the irradiation area R1.

[0181] 8, 9, and 10, of the upper and lower surfaces of the offset portion 16a, the upper surface facing the -Z side supports the first casing 50 from below. More specifically, the first casing 50 can be fastened to the upper surface of the offset portion 16a, and this fastening makes it possible to fix the first casing 50 to the second base plate 16. Instead of supporting the first casing 50 by the upper surface of the offset portion 16a, the upper surface may define a part of the mirror housing portion H11.

[0182] -Third base plate 17- 8, 9, and 10, the third base plate 17 is configured as a metal plate-like member extending in the X direction, and is housed in the housing 10 (in other words, surrounded by six sides of the housing 10). The plate thickness of the third base plate 17 is set to be greater than the plate thicknesses of at least the left side surface 10l and the right side surface 10r of the six sides of the housing 10.

[0183] In particular, the third base plate 17 according to this embodiment has an L-shape when viewed from the -X side. Hereinafter, a portion of the third base plate 17 corresponding to the vertical side of the L-shape may be referred to as a vertical side portion 17a, and a portion corresponding to the horizontal side of the L-shape may be referred to as a horizontal side portion 17b.

[0184] The third base plate 17 is disposed between the left side surface 10l and the right side surface 10r in the Y direction, and is disposed on the -Y side of the second base plate 16. The third base plate 17 is disposed on the -Y side of the first base plate 15, with the second base plate 16 in between.

[0185] Here, a sealing member (not shown) is provided between the right end portion (the end portion on the +Y side) of the horizontal side portion 17b of the third base plate 17 and the right side surface 10r of the housing 10 to liquid-tightly seal the gap between the third base plate 17 and the right side surface 10r.

[0186] The third base plate 17 is disposed below the top surface 10u in the Z direction.

[0187] The third base plate 17 is disposed between the front surface 10f and the rear surface 10b in the X direction. The third base plate 17 is fixed to the front surface 10f and the rear surface 10b by fasteners (not shown).

[0188] Next, the vertical side portion 17a of the third base plate 17 will be described in detail. The vertical side portion 17a according to this embodiment is formed in a thick plate shape extending along the -Z direction as the irradiation direction and the X direction. In the Z direction, the dimension of the vertical side portion 17a of the third base plate 17 is shorter than the dimension of the vertical side portion 15a of the first base plate 15. This vertical side portion 17a supports the second base plate 16 from the -Y side.

[0189] Next, the horizontal side portion 17b of the third base plate 17 will be described in detail. The horizontal side portion 17b according to this embodiment is formed in a thick plate shape extending along the X direction and the Y direction. Various components can be attached to this horizontal side portion 17b. The components attached to the horizontal side portion 17b include the first control board 53 of the laser light scanning unit 5. In addition, as shown in FIG. 10, a second heat sink 82 as a heat sink according to this embodiment is provided on the lower surface of the horizontal side portion 15b facing the -Z side.

[0190] The second heat sink 82 is composed of a plurality of fins protruding in the +Z direction. These fins are aligned in the Y direction. Each fin is formed to extend in the X direction. The second heat sink 82 is thermally coupled to components of the excitation light generating unit 2 (e.g., the excitation light source 21) via the third base plate 17.

[0191] That is, in this embodiment, the first heat sink 81 for cooling the laser light output section 4 is configured separately from the second heat sink 82 for cooling the excitation light generation section 2.

[0192] In the example shown in FIG. 10, the horizontal side portion 17b and the second heat sink 82 are integrally formed, but the present invention is not limited to this, and the horizontal side portion 17b and the second heat sink 82 may be formed separately.

[0193] Furthermore, in the case where the first base plate 15 and the third base plate 17 are separate bodies as in this embodiment, the first heat sink 81 provided on the first base plate 15 and the second heat sink 82 provided on the third base plate 17 are separate bodies. However, the present disclosure is not limited to such a configuration, and the first heat sink 81 and the second heat sink 82 can also be configured as an integral body.

[0194] (Outline of first storage section H1 and second storage section H2) As described above, the internal space of the housing 10 is partitioned by the first base plate 15, the second base plate 16 and the third base plate 17 into a plurality of housing sections.

[0195] As such a storage section, the housing 10 of this embodiment is formed with a first storage section H1 in which a cover glass 62 is provided as an optical member, and a second storage section H2 in which at least a portion of the periphery of the cover glass 62 protrudes beyond the cover glass 62 toward the irradiation area R1 (see dashed line Sl in Figure 10).

[0196] The first housing section H1 and the second housing section H2 are arranged side by side along the irradiation direction (-Z direction), with the first housing section H1 disposed on one side (-Z side) of the irradiation direction, and the second housing section H2 disposed on the other side (+Z side) of the irradiation direction. The boundary between the first housing section H1 and the second housing section H2 is defined by the first base plate 15, the second base plate 16, and the third base plate 17.

[0197] The first housing unit H1 houses optical components related to generation of excitation light, generation of laser light, and deflection of laser light. Specifically, the first housing unit H1 according to this embodiment houses an excitation light generating unit 2, an excitation light guide unit 3, a laser light output unit 4, and a laser light scanning unit 5.

[0198] In the example shown in Figure 10, the first storage section H1 is configured as a space surrounded by the top surface 10u, an upper portion of the front surface 10f, a lower portion of the back surface 10b, an upper portion of the left side surface 10l, an upper portion of the right side surface 10r, a portion of the bottom surface 10d formed by the second base plate 16, the first base plate 15, and the third base plate 17.

[0199] On the other hand, the second housing portion H2 houses cooling components related to cooling of the optical components housed in the first housing portion H1. Specifically, the second housing portion H2 according to this embodiment houses a first heat sink 81 and a second heat sink 82 thermally coupled to the optical components housed in the first housing portion H1, a first blower fan 83 as a blower that blows air to the first heat sink 81, and a second blower fan 84 as a blower that blows air to the second heat sink 82.

[0200] In the example shown in Figure 10, the second storage section H2 is configured as a space surrounded by a lower portion of the front surface 10f, a lower portion of the back surface 10b, a lower portion of the left side surface 10l, a lower portion of the right side surface 10r, a portion of the bottom surface 10d configured by the non-offset portion 18 excluding the offset portion 16a, the first base plate 15, and the third base plate 17.

[0201] Furthermore, of the first housing portion H1 and the second housing portion H2, at least the first housing portion H1 is configured to satisfy the IP standard defined by the International Electrotechnical Commission (IEC). This allows the marker head 1 to be washed with water without causing the solid-state laser crystal 41, the first mirror 51a, and other optical components to become wet. This contributes to improving the ease of cleaning the marker head 1.

[0202] In addition, the housing 10 constituting the first housing portion H1 and the second housing portion H2 can be shaped to have an exterior shape that makes it difficult for water to accumulate when washing with water. Such an exterior shape can be realized, for example, by inclining the top surface 10d with respect to the XY plane. Such an exterior shape contributes to improving the sanitation of the marker head 1.

[0203] In this case, by configuring the front surface 10f to be opened and closed by the cover member 13 as described above, wiping after washing with water (particularly wiping the vicinity of the exit window 6) becomes easy. This contributes to improving the maintainability of the marker head 1.

[0204] (Details of the first storage section H1) Here, of the first housing section H1 and the second housing section H2 described above, the first housing section H1 is further divided into three housing sections arranged in a direction (XY direction) perpendicular to the irradiation direction, for example, along the Y direction. Specifically, the housing 10 according to this embodiment has a mirror housing section H11, a crystal housing section H12, and a substrate housing section H13.

[0205] The mirror housing section H11 houses the first mirror 51a and the second mirror 52a in the laser light scanning section 5. The mirror housing section H11 according to this embodiment is partitioned by the first casing 50 capable of sealing the first mirror 51a and the second mirror 52a in an airtight manner. As described above, the first casing 50 may be partitioned using the offset section 16a. When the first casing 50 is partitioned using the offset section 16a, it is preferable that a buffer material is provided between the offset section 16a and the first casing 50. Since the offset section 16a is a part of the bottom surface 10d, it is easily affected by distortion, vibration, etc., and the buffer material can reduce the influence of the external influence on the first casing and the members housed in the first casing. Alternatively, the crystal housing section H12 may be partitioned using the first base plate 15, similar to the crystal housing section H12 described later.

[0206] Here, the first casing 50 is formed in a box shape with a bottom that is open toward the -Z side. The first casing 50 is held by the first base plate 15.

[0207] The dimension of the first casing 50 in the X direction substantially matches the dimension of the offset portion 16a in the X direction. Similarly, the dimension of the first casing 50 in the Y direction substantially matches the dimension of the offset portion 16a in the Y direction.

[0208] The opening on the -Z side of the first casing 50 can be closed by, for example, a lid portion 59 shown in Fig. 10. Instead of sealing the opening by the lid portion 59, for example, the opening of the first casing 50 may be sealed by the top surface 10u. When sealing the opening of the first casing 50 by the top surface 10u, it is preferable to provide a buffer material between the top surface 10u and the first casing 50. This can reduce the influence of distortion, vibration, etc. generated in the top surface 10u on the first casing 50 and the members housed in the first casing.

[0209] Furthermore, at least four through holes 50a, 50b, 50c, and 50d are formed in the first casing 50. Of the four through holes 50a, 50b, 50c, and 50d, the fourth through hole 50a formed in the left wall portion of the first casing 50 communicates with the third through hole 15f of the first base plate 15 by assembling the marker head 1, and constitutes a second entrance window 92 together with the third through hole 15f and the optical member 15h fitted into the third through hole 15f.

[0210] On the other hand, of the four through holes 50a, 50b, 50c, and 50d, the fifth through hole 50b formed in the bottom of the first casing 50 is disposed on the +X side when the first casing 50 and therefore the offset portion 16a are divided in half in the X direction. A defocus lens 57 serving as an optical element is provided in the fifth through hole 50b. The defocus lens 57 will be described later.

[0211] Among the four through holes 50a, 50b, 50c, and 50d, the sixth through hole 50c formed in the right wall portion (the wall portion located on the -Y side) of the first casing 50 is disposed on the +X side when the first casing 50 and therefore the offset portion 16a are divided in half in the X direction. The second motor 52b constituting the second scanner 52 can be inserted and fixed in the sixth through hole 50c.

[0212] Among the four through holes 50a, 50b, 50c, and 50d, the seventh through hole 50d formed in the rear wall portion (wall portion located on the +X side) of the first casing 50 is disposed on the +X side when the first casing 50 and thus the offset portion 16a are divided in half in the X direction. In the Z direction, the seventh through hole 50d is disposed on the +Z side of the sixth through hole 50c. In the Y direction, the center of the seventh through hole 50d (the center of a circle when the seventh through hole 50d is considered to have a circular cross section) is disposed at substantially the same position as the optical axis of the cover glass 62. The first motor 51b constituting the first scanner 51 can be inserted and fixed into the seventh through hole 50d.

[0213] The crystal housing section H12 is defined by a support plate (first base plate 15) having a partition surface 15g extending along the irradiation direction, and is disposed on the opposite side of the partition surface 15g to the mirror housing section H11 (the +Y side in the illustrated example) to house a solid-state laser crystal 41. The crystal housing section H12 houses optical components constituting the laser light output section 4, such as the solid-state laser crystal 41. The crystal housing section H12 is defined by a second casing 40 capable of hermetically sealing such optical components. The crystal housing section H12 according to this embodiment can house a nonlinear optical crystal 45 in a sealed state.

[0214] Here, second casing 40 is formed in a box shape with a bottom that opens toward the -Y side. Second casing 40 is attached to vertical side portion 15a of first base plate 15, and is supported from the -Y side by partition surface 15g of vertical side portion 15a. The opening of second casing 40 on the -Y side can be closed by partition surface 15g.

[0215] The internal space of the crystal housing section H12 can be divided into two sections, a Q switch housing section H121 and a wavelength conversion section H122, arranged in the X direction. The Q switch housing section H121 is a space that houses the Q switch 43. The wavelength conversion section H122 is a space that houses the nonlinear optical crystal 35.

[0216] Here, the Q switch accommodating section H121 and the wavelength conversion section H122 are arranged along the X direction, and both are configured as spaces surrounded by the second casing 40 and the partition surface 15g. More specifically, the second casing 40 is configured by a box-shaped body corresponding to the Q switch accommodating section H121 and a box-shaped body corresponding to the wavelength conversion section H122, and the spaces surrounded by the respective box-shaped bodies and the partition surface 15g are the Q switch accommodating section H121 and the wavelength conversion section H122. The Q switch accommodating section H121 and the wavelength conversion section H122 are optically coupled by an optical member not shown. In this way, the Q switch accommodating section H121 and the wavelength conversion section H122 are configured as separate spaces, thereby reducing the risk that impurities generated in the Q switch 43 described later will adhere to the wavelength conversion element 45 described later, thereby reducing the risk of reducing the output of the laser light.

[0217] The substrate accommodating section H13 is disposed on the opposite side of the crystal accommodating section H12 with respect to the mirror accommodating section H11, and accommodates the first control substrate 53. The substrate accommodating section H13 according to this embodiment is defined as the space within the internal space of the first accommodating section H1 excluding the mirror accommodating section H11 and the crystal accommodating section H12.

[0218] In other words, in this embodiment, the phrase "a specified member is accommodated in the mirror accommodating section H11" indicates that the member is surrounded on six sides by the first casing 50, and the phrase "a specified member is accommodated in the crystal accommodating section H12" indicates that the member is surrounded on six sides by the second casing 40 and the partition surface 15g.

[0219] In contrast, the phrase "a specific member is housed in the substrate housing portion H13" simply indicates that the member is disposed in the space excluding the mirror housing portion H11 and the crystal housing portion H12 in the housing 10. Of course, this is not limited to the configuration, and a casing dedicated to the substrate housing portion H13 (a third casing, so to speak) may be provided, similar to the first casing 50 and the second casing 40.

[0220] (Details of the second storage section H2) On the other hand, the second housing portion H2 is partitioned into a +Z side portion in the housing 10 by a first plate-like member 18l and a second plate-like member 18r as plate-like members. This second housing portion H2 has two spaces arranged with an interval in a direction perpendicular to the irradiation direction, for example, in the arrangement direction (Y direction) of the mirror housing portion H11, the crystal housing portion H12, and the substrate housing portion H13.

[0221] As these two spaces, the second housing unit H2 according to this embodiment has a crystal-side housing unit H21 and a light source-side housing unit H22. Here, since the crystal-side housing unit H21 and the light source-side housing unit H22 are disposed apart in the Y direction, a space that does not belong to the second housing unit H2 is partitioned between the crystal-side housing unit H21 and the light source-side housing unit H22.

[0222] The first plate-shaped member 18l and the second plate-shaped member 18r according to this embodiment are configured to partition a space including the optical path closer to the irradiation area R1 (the optical path on the +Z side) of the optical path of the laser light connecting the first mirror 51a as a scanner mirror and the irradiation area R1, in addition to the second storage section H2 as a space for storing the members. Hereinafter, this space is referred to as the "optical path partition section" and is given the symbol H3. The optical path partition section H3 according to this embodiment is configured as a space surrounded on three sides, the +Y side, the -Y side, and the -Z side, by the first plate-shaped member 18l, the second plate-shaped member 18r, and the cover glass 62.

[0223] In the illustrated example, the optical path dividing section H3 is configured as a space with an open lower end on the +Z side, but is not limited to such a configuration. The +Z side end of the optical path dividing section H3 may be covered with an optical member such as glass. The optical member covering the +Z side end of the optical path dividing section H3 may be provided alternatively to the cover glass 62, or may be used in combination with the cover glass 62.

[0224] Of the two spaces constituting the second accommodation portion H2, the crystal-side accommodation portion H21 accommodates a first heat sink 81 and a first ventilation fan 83. The first heat sink 81 and the first ventilation fan 83 are disposed side by side in the X direction.

[0225] Here, although it overlaps with the above explanation, the first heat sink 81 according to this embodiment is thermally coupled to at least the optical components attached to the first base plate 15 among the optical components constituting the laser light output unit 4.

[0226] On the other hand, the first blower fan 83 is disposed on the +X side of the first heat sink 81 as shown in FIG. 13. The first blower fan 83 is configured by a so-called axial fan, and generates an airflow passing through the first heat sink 81 according to a control signal received from the marker controller 100. The first blower fan 83 may be disposed on the -X side of the first heat sink 81. In this embodiment, power and signals for driving the first blower fan are supplied via an electric cable 200 whose connection portion is covered by a connection cover 14 provided on the +X side. Therefore, if the first blower fan 83 is configured to be provided on the +X side of the first heat sink 81, the space required for wiring is reduced, which is advantageous for miniaturizing the marker head 1.

[0227] 13, the airflow generated by the first blower fan 83 flows into the crystal-side accommodation section H21 from the ventilation opening 12 provided on the front surface 10f of the housing 10. The airflow thus flows along the X direction from the -X side to the +X side, passing through the first heat sink 81 and the first blower fan 83. The airflow that has passed through the first blower fan 83 flows out from an exhaust opening provided on the rear surface 10b of the housing 10, as indicated by the arrow Al2 in FIG.

[0228] Here, a first straightening plate 85 for straightening the flow direction of the air current is attached to the rear surface 10b of the housing 10 (see also FIG. 6). As shown by the arrow A13 in FIG. 13, this first straightening plate 85 guides the flow direction of the air current flowing out from the rear surface 10b to the opposite side (-Z side) of the direction from the housing 10 toward the workpiece W. This is advantageous in suppressing collision between the exhaust gas and the workpiece W, and in turn stabilizing the posture of the workpiece W.

[0229] The light source side accommodation portion H22 accommodates the second heat sink 82 and the second ventilation fan 84. The second heat sink 82 and the second ventilation fan 84 are disposed side by side in the X direction.

[0230] The second heat sink 82 according to this embodiment is thermally coupled to at least the excitation light source 21 attached to the third base plate 17 among the optical components housed in the substrate housing portion H13.

[0231] On the other hand, the second blower fan 84 is disposed on the +X side of the second heat sink 82 as shown in FIG. 12. The second blower fan 84 is configured by an axial fan like the first blower fan 83, and generates an airflow passing through the second heat sink 82 according to a control signal received from the marker controller 100. The second blower fan 84 may be disposed on the -X side of the second heat sink 82. In this embodiment, power and signals for driving the first blower fan are supplied via an electric cable 200 whose connection portion is covered by a connection cover 14 provided on the +X side. Therefore, if the first blower fan 83 is configured to be provided on the +X side of the second heat sink 82, the space required for wiring is reduced, which is advantageous for miniaturizing the marker head 1.

[0232] 12, the airflow generated by the second blower fan 84 flows into the light-source-side accommodation section H22 from the ventilation opening 12 provided in the front surface 10f of the housing 10. The airflow flows from the -X side to the +X side along the X direction, passing through the second heat sink 82 and the second blower fan 84. The airflow that has passed through the second blower fan 84 flows out from an exhaust opening provided in the rear surface 10b of the housing 10, as indicated by the arrow Ar2 in FIG.

[0233] Here, a second straightening plate 86 that straightens the flow direction of the airflow is attached to the rear surface 10b of the housing 10 (see also FIG. 6). As shown by the arrow Ar3 in FIG. 12, this second straightening plate 86 changes the flow direction of the airflow flowing out from the rear surface 10b to the opposite side (-Z side) of the direction from the housing 10 toward the workpiece W. This is advantageous in suppressing collision between the exhaust air and the workpiece W, and in turn stabilizing the posture of the workpiece W.

[0234] Below, the configurations of the excitation light generating unit 2, the excitation light guiding unit 3, the laser light output unit 4, the laser light scanning unit 5, etc., which are provided in the first storage unit H1 and the second storage unit H2, will be described in detail, including their relative positional relationships within the housing 10.

[0235] (Excitation light generation unit 2) The excitation light generating unit 2 includes an excitation light source 21 that generates laser excitation light (excitation light) based on power (driving current) supplied from a power supply unit 104, a metal plate 22 that supports the excitation light source 21, a temperature control unit 23 that adjusts the temperature of the excitation light source 21, and a light source control board 24 that supports the excitation light source 21 based on a control signal input from the marker controller 100.

[0236] The excitation light source 21, metal plate 22, temperature adjustment unit 23, and light source control board 24 constituting the excitation light generation unit 2 are all housed in the board housing unit H13. As a result, the excitation light generation unit 2, particularly the excitation light source 21, is disposed on the opposite side of the mirror housing unit H11 from the laser light output unit 4. This allows the excitation light generation unit 2 and the laser light output unit 4 to be separated as far as possible.

[0237] -Metal Plate 22- The metal plate 22 is made of metal and configured as a thin plate-like member. As shown in Fig. 11 and Fig. 12, the metal plate 22 is placed on the -X side portion when the third base plate 17 is divided in the X direction into a +X side portion, a central portion, and a -X side portion. The metal plate 22 is fastened to the upper surface of the third base plate 17 (more specifically, the upper surface of the horizontal side portion 17b of the third base plate 17) and is thermally coupled to the second heat sink 82 via the third base plate 17.

[0238] Furthermore, an excitation light source 21 is placed on the upper surface of the metal plate 22 , while a plate-shaped temperature adjustment section 23 is sandwiched between the lower surface of the metal plate 22 and the third base plate 17 .

[0239] -Excitation light source 21- The excitation light source 21 is configured to receive power from the power supply unit 104 via the electric cable 200 and to generate excitation light according to the power. The output of the excitation light generated by the excitation light source 21 increases as the driving current increases.

[0240] The excitation light source 21 according to this embodiment is composed of a laser diode (LD). The laser light emitted from the excitation light source 21 is collected by a focusing lens (not shown) or the like, and output as laser excitation light (excitation light). The excitation light source 21 is optically coupled to a fiber cable 31 constituting the excitation light guide section 3. The laser excitation light output from the excitation light source 21 is guided to the excitation light guide section 3 via the fiber cable 31.

[0241] 11 and 12, the excitation light source 21 is formed in a rectangular thin plate shape and is fixed to the upper surface of the metal plate 22 with its thickness direction aligned along the Z direction. Like the metal plate 22, the excitation light source 21 is arranged in the -X side portion when the third base plate 17 is divided into thirds in the X direction. By arranging it in this manner, the excitation light source 21 according to this embodiment is arranged at the upstream end (-X side end away from the second blower fan 84) of the airflow generated by the second blower fan 84 compared to the downstream end (+X side end adjacent to the second blower fan 84) of the airflow.

[0242] Moreover, one side surface of the excitation light source 21 faces obliquely toward the +X side and the +Y side, and the upstream end portion of the fiber cable 31 is connected to the one obliquely facing side surface.

[0243] -Temperature control section 23- The temperature adjustment unit 23 is configured to adjust the temperature of the excitation light source 21 so as to fall within a predetermined temperature range. Here, the temperature range (the predetermined temperature range) realized by the temperature adjustment unit 23 is set based on the guaranteed environment of the marker head 1, and is preferably set to be higher than the guaranteed environment of the marker head 1, and more preferably set to be 40°C or higher and 60°C or lower.

[0244] Specifically, the temperature adjustment unit 23 according to this embodiment is configured by a substantially thin-plate-like Peltier element, and is sandwiched between the upper surface of the third base plate 17 (more specifically, the upper surface of the horizontal side portion 17b) and the lower surface of the metal plate 22. The temperature adjustment unit 23 dissipates heat from the metal plate 22. A harness (not shown) for supplying current to the temperature adjustment unit 23 is connected to the side of the temperature adjustment unit 23. When current is supplied via the harness, the temperature adjustment unit 23 absorbs heat on the surface on the metal plate 22 side and generates heat on the surface on the third base plate 17 side.

[0245] -Light source control board 24- The light source control board 24 is electrically connected to the marker controller 100 and controls the power supplied from the power supply unit 104 to the excitation light source 21 .

[0246] The light source control board 24 according to this embodiment is configured as a circuit board in the shape of a substantially rectangular thin plate. The light source control board 24 is disposed with both its front and back sides aligned along the ZX direction, and is fastened to, for example, the vertical side portion 17a of the third base plate 17 from the -Y side (fastening structure not shown).

[0247] As shown in FIG. 12, the light source control board 24 is also disposed on the -Z side of the excitation light source 21 in the Z direction, and is electrically connected to the excitation light source 21 by wiring (not shown).

[0248] (Excitation light guide section 3) The excitation light guiding unit 3 as a light guiding optical system has a fiber cable 31 that optically couples the excitation light source 21 and the solid-state laser crystal 41 in the laser light output unit 4, and a fiber guide 32 configured to wind the fiber cable 31 with a predetermined bending radius. The fiber cable 31 and the fiber guide 32 are both housed in the substrate housing portion H13 in the housing 10.

[0249] -Fiber Cable 31- The fiber cable 31 is composed of a so-called optical fiber, one end of which (one end as viewed in the light propagation direction) is connected to the excitation light source 21, while the other end (the end located opposite the one end in the light propagation direction) is connected to the first entrance window 91.

[0250] The other end of the fiber cable 31 is optically coupled to the solid-state laser crystal 41 via a first entrance window 91 and a first deflection mirror 42 described below. At least a part of the intermediate portion connecting one end and the other end of the fiber cable 31 is wound around a fiber guide 32.

[0251] The fiber cable 31 can guide the excitation light generated in the excitation light source 21 to the solid-state laser crystal 41 .

[0252] -Fiber Guide 32- The fiber guide 32 is configured to wind the fiber cable 31 with a predetermined bending radius. The bending radius of the fiber guide 32 is set to be equal to or larger than the minimum bending radius of the fiber cable 31.

[0253] Specifically, the fiber guide 32 according to this embodiment is formed in a substantially cylindrical reel shape around which the fiber cable 31 can be wound multiple times. The fiber guide 32 is disposed with the central axis of the cylindrical shape aligned along the Y direction, and is attached to the vertical side portion 17a of the third base plate 17 from the -Y side.

[0254] 12, the fiber guide 32 is disposed in the range from the front end of the light source control board 24 to the rear end of the second control board 54 in the X direction. As shown in FIG. 11, the fiber guide 32 is disposed on the +Y side of the light source control board 24 and the second control board 54 and on the -Y side of the right wall portion of the first casing 50 in the Y direction.

[0255] (Laser light output unit 4) The laser light output unit 4 includes the first deflection mirror 42 that bends the optical path of the excitation light, the solid-state laser crystal 41 that generates a fundamental wave based on the excitation light, a Q switch 43 that pulses the fundamental wave based on a control signal input from the marker controller 100, and a first reflecting mirror 44 for reflecting the fundamental wave. These optical components are hermetically housed in the Q switch housing section H121 obtained by dividing the crystal housing section H12 in half. Among these optical components, at least the solid-state laser crystal 41 can also be housed in the wavelength conversion section H122.

[0256] The laser light output unit 4 also has a nonlinear optical crystal 45 that receives the laser light (fundamental wave) generated by the solid-state laser crystal 41 and wavelength-converts the laser light to a shorter wavelength, a second reflecting mirror 46 that configures a resonant light path together with the first reflecting mirror 44, a laser light separating unit 47 that separates the laser light wavelength-converted to the shorter wavelength side from the resonant light path, and a second deflection mirror 48 that bends the light path of the laser light separated by the laser light separating unit 47. These optical components are housed airtight in the wavelength converting unit H122 that is obtained by dividing the crystal housing unit H12 in half.

[0257] In particular, the laser light output unit 4 according to this embodiment is configured as a so-called intra-cavity type laser oscillator. That is, on the way from the first reflection mirror 44 to the second reflection mirror 46, the Q switch 43, the first deflection mirror 42, the solid-state laser crystal 41, the first separator 47a constituting the laser light separation unit 47, the second wavelength conversion element 45b as the nonlinear optical crystal 45, and the first wavelength conversion element 45a also as the nonlinear optical crystal 45 are arranged in this order. In other words, the first reflection mirror 44, the second reflection mirror 46, and each member between the first reflection mirror 44 and the second reflection mirror 46 constitute a resonance unit, and the first wavelength conversion element 45a and the second wavelength conversion element 45b are arranged inside the resonance unit. In this embodiment, the laser light output unit 4 is configured as an intra-cavity type laser oscillator, but it may also be an extra-cavity type laser oscillator in which the nonlinear optical crystal 45 is not located between the first reflecting mirror 44 and the second reflecting mirror 46.

[0258] Here, the first deflection mirror 42 is positioned so as to merge the optical axis of the excitation light guided by the excitation light guide section 3 and passing through the first entrance window 91 (the optical axis extending along the Y direction as indicated by symbol A1 in FIG. 11) and the optical axis of the resonant optical path (the optical axis extending along the X direction as indicated by symbol A2 in FIGS. 11 and 12).

[0259] Moreover, the first separator 47a is arranged so as to separate, for example, laser light including the third harmonic from the resonant optical path connecting the first reflecting mirror 44 and the second reflecting mirror 46. That is, the laser light output unit 4 amplifies the laser light composed of photons emitted by stimulated emission from the solid-state laser crystal 41 by multiple reflection between the first reflecting mirror 44 and the second reflecting mirror 46, while converting the wavelength of the laser light to the short wavelength side. The amplified laser light is separated by the laser light separating unit 47 and output from the laser light output unit 4.

[0260] The laser light output unit 4 also has a Q switch driver 49 that drives the Q switch 43 as a component disposed outside the crystal housing unit H12. As shown in Fig. 13, the Q switch driver 49 is attached to the +X side portion when the top surface 10u is divided into two in the X direction. The Q switch driver 49 is also disposed on the +Y side of the vertical side portion 15a of the first base plate 15.

[0261] The Q switch driver 49 may be attached to the left side surface 10l, the back surface 10b, etc. of the housing 10. The Q switch driver 49 can be attached to a plate-like member that constitutes the outer surface of the housing 10.

[0262] -First reflecting mirror 44- The first reflecting mirror 44 is accommodated in the Q switch accommodating section H121 and is configured to reflect at least the fundamental wave. The first reflecting mirror 44 constitutes a resonator together with the second reflecting mirror 46. The first reflecting mirror 44 according to this embodiment is configured as a total reflecting mirror that reflects the fundamental wave.

[0263] Moreover, the first reflection mirror 44 according to this embodiment is attached to a partition surface 15g that defines the crystal housing portion H12, and is thermally coupled to the first heat sink 81 via the first base plate 15.

[0264] -Second reflecting mirror 46- The second reflecting mirror 46 is housed in the wavelength converting unit H122 and is configured to reflect at least the fundamental wave. The second reflecting mirror 46 constitutes a resonator together with the first reflecting mirror 44. Note that the second reflecting mirror 46 according to this embodiment is configured as a total reflecting mirror that reflects not only the fundamental wave but also a second harmonic having a wavelength higher than that of the fundamental wave and a third harmonic having an even higher wavelength than that of the second harmonic.

[0265] Moreover, the second reflecting mirror 46 according to this embodiment is attached to the partition surface 15g in the same manner as the first reflecting mirror 44, and is thermally coupled to the first heat sink 81 via the first base plate 15. In order to configure a highly accurate resonant optical path in this manner, it is preferable that the first reflecting mirror 44 and the second reflecting mirror 46, which are both ends of the resonant optical path, are positioned by the same first base plate 15.

[0266] -Q Switch 43- The Q switch 43 is accommodated in the Q switch accommodation section H121, and is configured to pulse oscillate the fundamental wave generated in the solid-state laser crystal 41. Specifically, the Q switch 43 is disposed so as to be located on the optical axis of the resonance optical path (optical path of the resonator), and is interposed between the solid-state laser crystal 41 and the first reflecting mirror 44.

[0267] The Q switch 43 according to this embodiment is a so-called active Q switch that operates based on an RF signal applied from a Q switch driver 49. That is, if the Q switch 43 is turned on, the laser light incident on the Q switch 43 is deflected and separated from the resonant optical path. In this case, the multiple reflection of the laser light is restricted, and as a result, the generation of a population inversion in the solid-state laser crystal 41 is promoted.

[0268] When the Q switch 43 is turned on for a predetermined period and then turned off, the laser light undergoes multiple reflections without being separated by the Q switch 43, and is amplified by the multiple reflections. In this case, a high-power laser light is pulsed.

[0269] Moreover, the Q switch 43 according to this embodiment is attached to the partition surface 15g in the same manner as the first reflecting mirror 44 and the like, and is thermally coupled to the first heat sink 81 via the first base plate 15.

[0270] -Q Switch Driver 49- The Q switch driver 49 is housed inside the housing 10 and outside the crystal housing part H12, and generates an RF signal to be applied to the Q switch 43 based on a control signal input from the marker controller 100.

[0271] The Q switch driver 49 is attached to the top surface 10u via a metallic support plate, and is thermally coupled to the housing 10 via the support plate and the top surface 10u.

[0272] -First deflection mirror 42- The first deflection mirror 42 is accommodated in the Q switch accommodation unit H121, and is disposed between the Q switch 43 and the solid-state laser crystal 41 in the X direction. The first deflection mirror 42 according to this embodiment is configured by a so-called beam splitter. The first deflection mirror 42 totally reflects the excitation light incident from the first entrance window 91 toward the +Y side so that the light propagates along the X direction. On the other hand, the first deflection mirror 42 transmits the fundamental wave propagating along the X direction without reflecting it. The fundamental wave transmitted through the first deflection mirror 42 reaches the first reflection mirror 44 via the Q switch 43.

[0273] Moreover, the first deflection mirror 42 according to this embodiment is attached to the partition surface 15g in the same manner as the first reflection mirror 44 and the like, and is thermally coupled to the first heat sink 81 via the first base plate 15.

[0274] -Solid Laser Crystal 41- The solid-state laser crystal 41 is accommodated in the Q-switch accommodation section H121 and is composed of a laser medium capable of forming a population inversion. The solid-state laser crystal 41 is configured to perform stimulated emission corresponding to the incident laser excitation light when the laser excitation light is incident on its end face. The wavelength of the photons emitted by stimulated emission (so-called fundamental wavelength) increases or decreases depending on the specific configuration of the solid-state laser crystal 41, but in this embodiment, it is in the infrared region of about 1 μm.

[0275] In this embodiment, rod-shaped Nd:YVO4 (yttrium vanadate) is used as the laser medium constituting the solid-state laser crystal 41. Laser excitation light is incident on one end face of the rod-shaped solid-state laser crystal 41, and laser light having a fundamental wavelength (so-called fundamental wave) is emitted from the other end face (so-called one-directional excitation method by end pumping). In this example, the fundamental wavelength is set to 1064 nm. On the other hand, the wavelength of the laser excitation light is set near the central wavelength of the absorption spectrum of Nd:YVO4 to promote stimulated emission. However, the present invention is not limited to this example, and other laser media such as rare earth doped YAG, YLF, GdVO4, etc. can also be used. Various solid-state laser media can be used depending on the application of the laser processing device L.

[0276] Moreover, solid-state laser crystal 41 according to this embodiment is attached to partition surface 15g in the same manner as first reflecting mirror 44 and the like, and is thermally coupled to first heat sink 81 via first base plate 15.

[0277] -Nonlinear Optical Crystals 45- The nonlinear optical crystal 45 is configured by combining a first wavelength conversion element 45a that receives the fundamental wave generated by the solid-state laser crystal 41 and generates a second harmonic having a wavelength higher than that of the fundamental wave, and a second wavelength conversion element 45b that generates a third harmonic having a wavelength higher than that of the second harmonic. Both the first wavelength conversion element 45a and the second wavelength conversion element 45b are housed in the wavelength conversion section H122.

[0278] The first wavelength conversion element 45a is a nonlinear optical crystal capable of generating a second harmonic wave, and is configured to double the frequency of the fundamental wave when the fundamental wave is incident and output it as a second harmonic wave (Second Harmonic Generation: SHG). That is, the wavelength of the laser light generated when the fundamental wave is incident on the first wavelength conversion element 45a is in the visible light range of about 500 nm. In particular, in this embodiment, the wavelength of the second harmonic wave is set to 532 nm.

[0279] Generally, the conversion efficiency of the first wavelength conversion element 45a is less than 100%. Therefore, when a fundamental wave is incident on the first wavelength conversion element 45a, a laser beam in which the fundamental wave and the second harmonic are mixed is emitted.

[0280] In this embodiment, LBO (LiB3O3) is used as the first wavelength conversion element 45a. However, the first wavelength conversion element 45a is not limited to this example, and various organic nonlinear optical materials, inorganic nonlinear optical materials, etc. can be used as the first wavelength conversion element 45a.

[0281] The second wavelength conversion element 45b is a nonlinear optical crystal capable of generating a third harmonic wave, and is configured to convert the fundamental wave and the second harmonic wave into a third harmonic wave having a frequency three times that of the fundamental wave and emit the third harmonic wave (Third Harmonic Generation: THG) when the fundamental wave and the second harmonic wave are incident on the second wavelength conversion element 45b (particularly, when the propagation directions of the fundamental wave and the second harmonic wave are the same). That is, the wavelength of the laser light generated when the fundamental wave and the second harmonic wave are incident on the second wavelength conversion element 45b is in the ultraviolet region of about 350 nm (specifically, near the boundary between the visible light region and the ultraviolet region). In particular, in this embodiment, the wavelength of the third harmonic wave is set to 355 nm.

[0282] Generally, the conversion efficiency of the second wavelength conversion element 45b is less than 100%. Therefore, when the fundamental wave and the second harmonic are incident on the first wavelength conversion element 45a, a laser beam in which the fundamental wave, the second harmonic, and the third harmonic are mixed is emitted.

[0283] In this embodiment, LBO (LiB3O3) is used as the second wavelength conversion element 45b. However, the second wavelength conversion element 45b is not limited to this example, and various organic nonlinear optical materials, inorganic nonlinear optical materials, etc. can be used as the second wavelength conversion element 45b.

[0284] Moreover, nonlinear optical crystal 45 according to this embodiment is attached to partition surface 15 g in the same manner as first reflecting mirror 44 and the like, and is thermally coupled to first heat sink 81 via first base plate 15 .

[0285] -Laser light separation unit 47- The laser beam separating unit 47 is housed in the wavelength converting unit H122, and is configured to separate the third harmonic from the resonant optical path of the laser beam to generate a UV laser beam for laser processing.

[0286] The laser beam separating unit 47 is composed of a plurality of optical components. Specifically, the laser beam separating unit 47 according to the present embodiment has a first separator 47a for extracting the second harmonic and the third harmonic from the laser beam, a concave lens 47b for adjusting the beam diameter of the laser beam consisting of the second harmonic and the third harmonic, and a second separator 47c for extracting the third harmonic from the laser beam.

[0287] The first separator 47a is a so-called beam splitter, and is configured to transmit the fundamental wave while reflecting the second and third harmonics. The first separator 47a is disposed so as to intersect with the optical axis of the resonant optical path connecting the first reflecting mirror 44 and the second reflecting mirror 46, and is tilted at approximately 45 degrees with respect to the optical axis. The laser light reflected by the first separator 47a propagates toward the -Z side.

[0288] The concave lens 47b is configured to transmit the laser light reflected by the first separator 47a, i.e., the laser light separated from the resonant optical path, thereby expanding the beam diameter of the transmitted laser light. In this embodiment, the concave lens 47b is interposed between the first separator 47a and the second separator 47c, but is not limited to such an arrangement.

[0289] The second separator 47c is a beam splitter similar to the first separator 47a, and is configured to transmit the second harmonic wave while reflecting the third harmonic wave. The second separator 47c is disposed so as to intersect with the optical axis of the laser light that has passed through the concave lens 47b, and is tilted at approximately 45 degrees with respect to the optical axis. The laser light reflected by the second separator 47c propagates toward the -X side.

[0290] In addition, each optical component that constitutes the laser light separation unit 47 is attached to the partition surface 15g, similar to the first reflecting mirror 44, and is thermally coupled to the first heat sink 81 via the first base plate 15 (see also Figure 10).

[0291] In this way, in order to generate laser light along a highly accurate optical path, it is preferable that the first reflecting mirror 44, the second reflecting mirror 46, the Q switch 43, the first deflection mirror 42, the solid-state laser crystal 41, the nonlinear optical crystal 45 and the laser light separation unit 47 are all positioned by the same first base plate 15.

[0292] -Second deflection mirror 48- The second deflection mirror 48 is housed in the wavelength conversion unit H122 and is disposed on the -X side relative to other optical members housed in the crystal housing unit H12. The second deflection mirror 48 according to this embodiment is configured by a so-called beam splitter. The second deflection mirror 48 reflects the laser light that passes through the second separator 47c and propagates toward the -X side. The laser light reflected by the second deflection mirror 48 is deflected so as to propagate toward the -Y side.

[0293] Moreover, the second deflection mirror 48 according to this embodiment is attached to the partition surface 15g in the same manner as the first reflection mirror 44, etc., and is thermally coupled to the first heat sink 81 via the first base plate 15. In this way, in order to improve the accuracy of the position at which the generated laser light is output, the second deflection mirror 48, which emits the laser light to the outside from the laser light output unit 4, is preferably positioned by the first base plate 15 in the same manner as the first reflection mirror 44, etc.

[0294] Finally, the laser light deflected by the second deflection mirror 48 passes through the second entrance window 92 and enters the first casing 50 from the laser light output unit 4. As shown in FIG. 11, the laser light entering the first casing 50 propagates toward the -Y side and reaches the third deflection mirror 56 of the laser light scanning unit 5.

[0295] (Laser light scanning unit 5) The laser light scanning unit 5 has, in addition to the first scanner 51, second scanner 52, first control board 53 and second control board 54 described above, an intermediate deflection unit 55, a third deflection mirror 56, a defocus lens 57 as an optical element, and a first casing 50 that houses at least the first mirror 51a of the first scanner 51 and the second mirror 52a of the second scanner 52.

[0296] These components will be described below in the order in which the laser light reaches them during laser oscillation.

[0297] -Third deflection mirror 56- 11, the third deflection mirror 56 is housed in the first casing 50, and is arranged to be aligned with the second deflection mirror 48 and the second entrance window 92 along the Y direction, and is located on the -Y side of these components. The third deflection mirror 56 is arranged between the second entrance window 92 and the light source control board 24 in the Y direction (in other words, on the -Y side of the second entrance window 92 and on the +Y side of the light source control board 24).

[0298] The third deflection mirror 56 is configured, for example, by a total reflection mirror, receives the laser light that enters the first casing 50 and propagates toward the -Y side, and reflects it toward the +X side. The laser light reflected by the third deflection mirror 56 reaches the second mirror 52a of the second scanner 52. Note that the third deflection mirror 56 may be configured by a mirror that transmits a portion of the laser light instead of a total reflection mirror. In that case, the output of the laser light entering the first casing 50 from the laser light output unit 4 may be detected using the partially transmitted laser light.

[0299] -Second scanner 52- 14, 15, and 16, the second scanner 52 has a second mirror 52a for scanning the laser light in a predetermined second direction, and a second motor 52b for rotatably supporting the second mirror 52a. Of these, the second mirror 52a is accommodated in the mirror accommodating section H11, and most of the second motor 52b is accommodated in the substrate accommodating section H13.

[0300] The second mirror 52a is configured as a so-called galvanometer mirror. The second mirror 52a receives the laser light generated by the solid-state laser crystal 41 via the third deflection mirror 56 shown in FIG. 11 and the like. The second mirror 52a reflects the received laser light to the +Z side, thereby deflecting the laser light. By rotating the second mirror 52a, the irradiation position of the laser light in the irradiation area R1 is scanned in the second direction.

[0301] Here, the second direction, which is the deflection direction by the second mirror 52a, is a direction perpendicular to both the first direction, which is the deflection direction by the first mirror 51a of the first scanner 51, and the -Z direction as the irradiation direction, and is set to coincide with the X direction in this embodiment.

[0302] Specifically, the second mirror 52a is a total reflection mirror having a substantially rectangular plate shape, and is accommodated in the mirror accommodation section H11 while being supported on the tip of the rotation shaft of the second motor 52b. The second mirror 52a rotates integrally with the shaft of the second motor 52b, and is configured to be rotated around a predetermined second rotation axis Ac2 by the second motor 52b. The amount of deflection by the second mirror 52a, and therefore the irradiation position of the laser light in the second direction, are determined based on the rotation angle of the second mirror 52a around the second rotation axis Ac2.

[0303] Here, as shown in Figures 14 and 15, the second rotation axis Ac2, which is the rotation center of the second mirror 52a, extends perpendicular to both the first rotation axis Ac1, which is the rotation center of the first mirror 51a, and the Z direction as the irradiation direction, and is set to extend along the Y direction in this embodiment.

[0304] The second mirror 52a is also disposed to be aligned with the third deflection mirror 56 along the X direction, and is located on the +X side of the third deflection mirror 56. The second mirror 52a is further located on the -Y side of the first mirror 51a and the defocus lens 57 in the Y direction, and is located on the -Z side of the first mirror 51a and the defocus lens 57 in the Z direction.

[0305] The second motor 52b is a galvano motor formed of a DC motor or the like, and is formed in a substantially cylindrical shape with the second rotation axis Ac2 as the central axis. A tip end (+Y side end) of the second motor 52b in the second rotation axis Ac2 direction (Y direction) is inserted into the sixth through hole 50c of the first casing 50. On the other hand, the other end (-Y side end of the second motor 52b) located on the opposite side of the tip end in the second rotation axis Ac2 direction protrudes from the sixth through hole 50c and is exposed in the substrate accommodation section H13.

[0306] The second scanner 52 reflects the laser light via the second mirror 52a. The laser light reflected by the second mirror 52a exits from the exit window 6 via the intermediate deflection unit 55, the first mirror 51a, and the defocus lens 57. At this time, the second scanner 52 can scan the laser light in the second direction (X direction) within the irradiation area R1 by adjusting the reflection angle of the laser light using the second motor 52b.

[0307] -Intermediate deflection section 55- 14, 15, and 16, the intermediate deflection unit 55 has an intermediate mirror 55a that relays the laser light between the second mirror 52a and the first mirror 51a, and a base portion 55b that supports the intermediate mirror 55a. Both the intermediate mirror 55a and the base portion 55b are housed in the mirror housing portion H11.

[0308] The intermediate mirror 55a is, for example, a total reflection mirror, and receives the laser light reflected by the second mirror 52a and reflects the laser light toward the first mirror 51a.

[0309] The intermediate mirror 55a is also arranged to be aligned with the second mirror 52a along the Z direction, and is located on the +Z side of the second mirror 52a. The intermediate mirror 55a is further arranged to be aligned with the first mirror 51a along the Y direction, and is located on the -Y side of the first mirror 51a.

[0310] The intermediate mirror 55a receives the laser light reflected by the second mirror 52a and propagating toward the +Z side, and reflects it toward the +Y side. The laser light reflected by the intermediate mirror 55a reaches the first mirror 51a of the first scanner 51.

[0311] Pedestal portion 55b is disposed at the bottom of first casing 50, and supports intermediate mirror 55a from the +Z side. Pedestal portion 55b according to this embodiment supports intermediate mirror 55a so that the mirror surface faces the +Y side and the -Z side.

[0312] -1st Scanner 51- 14, 15, and 16, the first scanner 51 has a first mirror 51a for scanning the laser light in a predetermined first direction, and a first motor 51b for rotatably supporting the first mirror 51a. Of these, the first mirror 51a is accommodated in the mirror accommodating section H11, and most of the first motor 51b is accommodated in the substrate accommodating section H13.

[0313] The first mirror 51a is configured as a so-called galvanometer mirror. The first mirror 51a receives the laser light reflected by the intermediate mirror 55a. The first mirror 51a reflects the received laser light to the +Z side, thereby deflecting the laser light. As the first mirror 51a rotates, the irradiation position of the laser light in the irradiation area R1 is scanned in the first direction.

[0314] Here, as shown in Figures 14 and 15, the first direction, which is the deflection direction by the first mirror 51a, is a direction perpendicular to both the second direction described above and the Z direction as the irradiation direction, and in this embodiment is set to coincide with the Y direction.

[0315] The first and second directions are not limited to the settings in this embodiment. The first direction may coincide with the X direction and the second direction may coincide with the Y direction, or the first and second directions may be inclined with respect to the X and Y directions, respectively.

[0316] Specifically, the first mirror 51a is a total reflection mirror having a substantially rectangular plate shape, and is accommodated in the mirror accommodation section H11 while being supported on the tip of the rotation shaft of the first motor 51b. The first mirror 51a rotates integrally with the shaft of the first motor 51b, and is configured to be rotated by the first motor 51b around a predetermined first rotation axis Ac1. The amount of deflection by the first mirror 51a, and therefore the irradiation position of the laser light in the first direction, are determined based on the rotation angle of the first mirror 51a around the second rotation axis Ac2.

[0317] Here, the first rotation axis Ac1, which is the rotation center of the first mirror 51a, extends perpendicular to both the second rotation axis Ac2, which is the rotation center of the second mirror 52a, and the -Z direction as the irradiation direction, and is set to extend along the X direction in this embodiment.

[0318] By setting in this way, the first rotation axis Ac1 and the second rotation axis Ac2 both extend in a direction different from the irradiation direction, for example, in a direction perpendicular to the irradiation direction (XY direction). Note that it is not essential to make the first rotation axis Ac1 and the second rotation axis Ac2 perpendicular to the irradiation direction, and they may have an inclination angle of, for example, 20 degrees or less with respect to the XY direction.

[0319] In addition, in this embodiment, the first rotation axis Ac1 is offset to the +Z side with respect to the second rotation axis Ac2. However, depending on the configuration of the intermediate mirror 55a, the first rotation axis Ac1 and the second rotation axis Ac2 can also be arranged on the same plane.

[0320] The first mirror 51a is also arranged to be aligned with the intermediate mirror 55a along the Y direction, and is located on the +Y side of the intermediate mirror 55a. The first mirror 51a is further arranged to be aligned with the cover glass 62 and the defocus lens 57 along the Z direction, and is located on the -Z side of the defocus lens 57. As a result of this configuration, the first mirror 51a according to this embodiment is arranged to face the workpiece W and the irradiation area R1 across the exit window 6. The first mirror 51a is located directly above the exit window 6, and no other reflecting mirror is interposed between the first mirror 51a and the exit window 6. In this embodiment, for convenience of explanation, the first mirror 51a is defined as one in which no reflecting mirror is interposed between the first mirror 51a and the exit window 6, but this does not exclude the presence of some reflecting mirror therebetween. When a reflecting mirror is interposed between the first mirror 51a and the exit window 6, the mirror that scans the irradiation position in the irradiation area R1 immediately before reaching the irradiation area R1 is regarded as the first mirror 51a. Note that, between the first mirror 51a and the exit window 6, the area through which the laser light passes is expanded due to the rotation of the second mirror 52a and the rotation of the first mirror 51a, so the interposed reflecting mirror has a size sufficient to cover the area through which the laser light passes. Therefore, in order to miniaturize the marker head 1, it is preferable that no reflecting mirror is interposed between the first mirror 51a and the exit window 6.

[0321] The first motor 51b is a galvano motor formed of a DC motor or the like, and is formed in a substantially cylindrical shape with the first rotation axis Ac1 as the central axis. A tip end (-X side end) of the first motor 51b in the first rotation axis Ac1 direction (X direction) is inserted into the seventh through hole 50d of the first casing 50. On the other hand, the other end (+Y side end of the first motor 51b) located on the opposite side to the tip end in the first rotation axis Ac1 direction protrudes from the seventh through hole 50d and is exposed in the substrate accommodation portion H13.

[0322] The first scanner 51 reflects the laser light via the first mirror 51a. The laser light reflected by the first mirror 51a passes through a defocus lens 57 and is emitted from the exit window 6. At this time, the first scanner 51 can scan the laser light in the first direction (Y direction) within the irradiation area R1 by adjusting the reflection angle of the laser light using the first motor 51b.

[0323] -Defocus Lens 57- The defocus lens 57 is configured to transmit the laser light deflected by the first mirror 51a and to diffuse the laser light in an outward direction perpendicular to the irradiation direction. In this embodiment, when the Z direction is the irradiation direction, the outward direction as the diffusion direction is a direction along the XY plane.

[0324] Specifically, the defocus lens 57 can be configured, for example, by one biconcave lens. In this case, the defocus lens 57 is fitted into the fifth through hole 50b with its central axis aligned in the Z direction.

[0325] The defocus lens 57 is also disposed on a straight line connecting the first mirror 51a and the center of the cover glass 62 at the exit window 6. The defocus lens 57 is disposed between the first mirror 51a and the cover glass 62 in the Z direction (in other words, on the +Z side of the first mirror 51a and on the -Z side of the cover glass 62).

[0326] The defocus lens 57 is further disposed so that the optical axis of the defocus lens 57 is coaxial with the optical axis of the cover glass 62. Hereinafter, the optical axes of the defocus lens 57 and the cover glass 62 are collectively referred to as the "laser emission axis" and are denoted by the symbol Al (see also FIG. 4). This laser emission axis Al extends along the Z direction and is offset to the +Y side with respect to the second mirror 52a and the intermediate mirror 55a, while intersecting with the mirror surface of the first mirror 51a.

[0327] The configuration of the defocus lens 57 as an optical element is not limited to one using one biconcave lens. The optical element may be configured using multiple lenses, or may be configured using lenses other than a biconcave lens. In addition, the laser light scanning unit 5 may be configured without using the defocus lens 57.

[0328] -Second control board 54- The second control board 54 is electrically connected to the marker controller 100 and the second scanner 52, and is configured to control the second scanner 52. More specifically, the second control board 54 can control the rotation angle of the second mirror 52a by driving the second motor 52b in accordance with a control signal input from the marker controller 100.

[0329] The second control board 54 according to this embodiment is configured as a circuit board in the shape of a substantially rectangular thin plate. The second control board 54 is accommodated in the board accommodation section H13 with both its front and back surfaces aligned along the Z and X directions, and is fastened to, for example, the vertical side 17a of the third base plate 17 from the -Y side.

[0330] 12, the second control board 54 is disposed on the +X side of the light source control board 24 in the X direction, and on the -Y side of the first casing 50 and the light source control board 24 in the Y direction. The second control board 54 is also electrically connected to the second motor 52b by wiring (not shown).

[0331] -First control board 53- The first control board 53 is electrically connected to the marker controller 100 and the first scanner 51, and is configured to control the first scanner 51. More specifically, the first control board 53 can control the rotation angle of the first mirror 51a by driving the first motor 51b in accordance with a control signal input from the marker controller 100.

[0332] The first control board 53 according to this embodiment is configured as a circuit board in the shape of a substantially rectangular thin plate. The first control board 53 is accommodated in the board accommodation section H13 with both its front and back sides aligned along the Z and X directions, and is fastened to, for example, the vertical side 17a of the third base plate 17 from the -Y side.

[0333] 12, the first control board 53 is arranged alongside the second control board 54 along the X direction, and is located on the +X side of the light source control board 24 and the second control board 54. The first control board 53 is also electrically connected to the first motor 51b by wiring (not shown).

[0334] <Main operations and processes of the laser processing device S> 19 is a flow chart illustrating a basic control process of the laser processing apparatus L. Below, main operations and main processes of the laser processing apparatus L will be described with reference to FIG.

[0335] First, in step S1 of Fig. 19, input of a processing pattern Pp to be printed on the setting plane R2 displayed on the display unit 303 is received. This input is received by the reception unit 103 and read by the control unit 103. The control unit 103 generates print data based on the input processing pattern Pp. This print data is composed of the trajectory of the laser light on the workpiece W (so-called scanning line) and the like, which is set corresponding to the processing pattern Pp.

[0336] In the following step S2, the control unit 103 sets a voltage (supply voltage) to be supplied to the excitation light source 21. Details of this setting will be described later with reference to FIGS.

[0337] In the next step S3, the control unit 103 inputs a control signal to the light source control board 24, etc., thereby supplying power to the excitation light source 21. As a result, excitation light is generated in the excitation light generation unit 2, and the excitation light is input to the laser light output unit 4.

[0338] In the next step S4, the control unit 103 inputs a control signal to the Q switch driver 49 etc., thereby controlling the on / off of the Q switch 43 to pulse oscillate the UV laser light. This laser light is output from the laser light output unit 4 and input to the laser light scanning unit 5.

[0339] In the next step S5, the control unit 103 inputs control signals to the first control board 53 and the second control board 54, etc., so that the UV laser light is scanned two-dimensionally. The two-dimensional scanning here means moving the irradiation position of the laser light in two-dimensional directions, that is, in the direction along the XY plane in this embodiment. Note that the shape of the workpiece W irradiated with the laser light is not limited to a two-dimensional shape along the XY plane, and may be a three-dimensional shape having different positions in the Z direction (a shape in which the height in the Z direction changes).

[0340] At this time, in the laser light scanning unit 5, the UV laser light deflected by the second mirror 52a is reflected by the intermediate mirror 55a and then deflected again by the first mirror 51a. As shown in Figs. 10 and 18, the UV laser light deflected by the first mirror 51a passes through the defocus lens 57 and the cover glass 62 in sequence, and then passes through the above-mentioned light path partition H3, and is emitted outside the housing 10. The UV laser light emitted outside the housing 10 is irradiated onto an irradiation area R1 set on the workpiece W. The UV laser light irradiated onto the workpiece W is two-dimensionally scanned within the irradiation area R1 so as to trace a scanning line according to the print data.

[0341] <Measures to prevent heat generation in the excitation light source 21> Fig. 20 is a block diagram for explaining the circuit structure of the power supply unit 104, and Fig. 21 is a flowchart illustrating a control process of the power supply unit 104. As described above, the excitation light source 21 is configured to receive power from the power supply unit 104 as a power supply unit.

[0342] In detail, the power supply unit 104 according to this embodiment includes a DC power supply 104a that converts AC power supplied from outside into DC power and outputs the DC power, and a DC / DC converter 104b that performs DC / DC conversion of the power output from the DC power supply 104a, as shown in Fig. 20. The power (particularly the DC power) converted by the DC / DC converter 104b is input to the excitation light source 21 constituted by an LD.

[0343] Here, a relay 25 is interposed between the DC / DC converter 104b and the excitation light source 21. This relay 25 opens and closes an electrical contact between the DC / DC converter 104b and the excitation light source 21.

[0344] The relay 25 can be configured, for example, by a field effect transistor (FET). The relay 25 according to the present embodiment is configured by this FET, and opens and closes the electrical contacts based on control signals input from the PLC 902, the control unit 103, etc. via the light source control board 24.

[0345] Conventionally, the output voltage input from the DC / DC converter 104b to the excitation light source 21 via a relay has been set to a fixed value. Variations in the forward voltage (so-called Vf) in the excitation light source 21 are made to generate heat by the relay 25. Incidentally, the cause of variations in Vf is, for example, the existence of variations in quality in the excitation light source 21 itself, which results in different Vfs required for a certain laser light output. For this reason, in order to ensure a minimum laser light output even in the worst case, it is necessary to provide a margin in the output of the DC / DC converter 104b (in other words, to set the output voltage of the DC / DC converter 104b to be higher).

[0346] However, when such a conventional configuration is used, the amount of heat generated in the relay 25 tends to be large. This leads to an increase in the size of the heat generating structure, such as a heat sink, and may cause problems when attempting to incorporate the excitation light source 21 into the marker head 1.

[0347] Therefore, the control unit 103 according to this embodiment controls the output voltage output from the power supply unit 104 as a power supply unit and input to the excitation light source 21. To this end, in this embodiment, as shown in Fig. 20, the control unit 103 and the DC / DC converter 104b are electrically connected, and the output (the output voltage) from the DC / DC converter 104b is adjusted based on a control signal output from the control unit 103.

[0348] Furthermore, the control unit 103 according to this embodiment detects a voltage drop occurring in the relay 25 and controls the output voltage based on the detected voltage drop. Specifically, the control unit 103 controls the output voltage so that the detected voltage drop becomes a predetermined value. To this end, in this embodiment, as shown in FIG. 20, a first monitor circuit 26 that monitors the voltage on the upstream side of the relay 25 and a second monitor circuit 27 that monitors the voltage on the downstream side of the relay 25 are provided. The control unit 103 can estimate the voltage drop occurring in the relay 25 by calculating the difference between the voltage monitored by the first monitor circuit 26 and the voltage monitored by the second monitor circuit 27.

[0349] Moreover, the "predetermined value" that is the criterion for determining the voltage drop can be set to, for example, 2.5 V when 1 ampere is applied to the excitation light source 21. The setting of the predetermined value is stored in advance in the storage unit 102, and is configured to be read by the control unit 103 as necessary.

[0350] As described above, when the predetermined value is set to 2.5 V, the control unit 103 adjusts the output voltage of the DC / DC converter 104b so that the voltage drop occurring in the relay 25 becomes 2.5 V. With this configuration, it is no longer necessary to provide a margin in the output voltage of the DC / DC converter 104b, and therefore the output voltage can be suppressed, thereby making it possible to suppress heat generation in the relay 25.

[0351] 21 is a flowchart illustrating an example of a control process for the power supply unit 104. This control process can be executed, for example, in step S2 in the control process of FIG.

[0352] 21, the control unit 103 inputs a control signal to the relay 25 via the light source control board 24, and electrically connects the DC / DC converter 104b and the excitation light source 21. Then, the control unit 103 inputs a control signal to the power supply unit 104, and supplies the output voltage of the DC / DC converter 104b to the excitation light source 21 via the relay 25.

[0353] In the next step S102, the control unit 103 detects a voltage drop occurring in the relay 25 based on the detection signals of the first monitor circuit 26 and the second monitor circuit 27.

[0354] In the next step S103, the control unit 103 judges whether or not the voltage drop detected in step S102 matches the predetermined value set as described above. If this judgment is NO, the control unit 103 advances the control process to step S105, adjusts the output voltage from the DC / DC converter 104, and returns to step S101. That is, the control unit 103 is configured to repeat the processes related to steps S101 to S103 and step S105 until the voltage drop matches the predetermined value. In this embodiment, the control unit 103 judges whether or not the voltage drop occurring in the relay 25 matches the predetermined value (step S103 in FIG. 21), but the present disclosure is not limited to this. For example, it may be judged whether or not the voltage drop falls within a certain range above and below the predetermined value. In short, the control unit 103 may control the output voltage based on the detected voltage drop.

[0355] On the other hand, if the determination in step S103 is YES, the control unit 103 advances the control process to step S104 and ends the output adjustment of the DC / DC converter 104 (output determination). In this case, the control unit 103 ends the process shown in Fig. 21, and advances the control process from step S2 to step S3 in Fig. 19. The subsequent processes are as described above.

[0356] <Indicator 11 lighting control> As described above, the first lamp 11a, the second lamp 11b, and the third lamp 11c constituting the indicator 11 are turned on in response to a control signal input from the marker controller 100. For example, the first lamp 11a emits light when the power is turned on to the marker head 1. On the other hand, the second lamp 11b is turned on in response to the standard requirements of the UV laser light, and the third lamp 11c is turned on in response to the state of the laser processing device L, such as the irradiation state of the UV laser light and the presence or absence of an error in the marker head 1. Details of the lighting states are as shown in Table 1.

[0357] Specifically, when the key switch is in the "OFF" state (KSW: OFF), the marker controller 100 turns off all of the first lamp 11a, the second lamp 11b, and the third lamp 11c.

[0358] When the key switch is in the "POWER ON" state (KSW: POWER ON), the marker controller 100 causes only the first lamp 11a to emit blue light and turns off both the second lamp 11b and the third lamp 11c.

[0359] When the key switch is in the "LASER ON" state (KSW: LASER ON), the marker controller 100 causes the first lamp 11a to emit blue light and the second lamp 11b to emit green light, while keeping the third lamp 11c in an off state.

[0360] When the marker head 1 is ready to emit UV laser light (ready state), the marker controller 100 causes the first lamp 11a to emit blue light, and causes the second lamp 11b and the third lamp 11c to both emit green light.

[0361] While the marker head 1 is emitting UV laser light (during laser irradiation), the marker controller 100 causes the first lamp 11a to emit blue light, the second lamp 11b to emit yellow light, and the third lamp 11c to emit green light.

[0362] When a warning that should be notified to the user occurs in the laser processing device L (a warning error occurs), the marker controller 100 causes the first lamp 11a to emit blue light, the second lamp 11b to emit green light, and the third lamp 11c to emit orange light.

[0363] When some abnormality occurs in the laser processing device L (occurrence of an abnormality error), the marker controller 100 causes the first lamp 11a to emit blue light, the second lamp 11b to emit green light, and the third lamp 11c to emit red light.

[0364] When the laser processing device L is in an interlock state (for example, when the safety terminal block is in an off state), the marker controller 100 causes the first lamp 11a to emit blue light, turns off the second lamp 11b, and causes the third lamp 11c to emit red light.

[0365] In this way, by controlling the lighting state of the indicator 11 provided on the front surface 10f of the housing 10, the user can intuitively visually recognize the state of the laser processing device L.

[0366] [Table 1]

[0367] <Setting of processing equipment 500 and marker head 1> Fig. 18 is a diagram for explaining various dimensions of the marker head 1 and the support member 501. As shown in Fig. 17A and Fig. 17B, the marker head 1 is attached to the support member 501 of the processing equipment 500 by replacing a printing device 1001 such as a TTO. The marker head 1 attached to the support member 501 irradiates UV laser light toward the workpiece W made of a sheet-like film, and causes a chemical reaction in a UV reaction layer contained in the workpiece W, thereby performing printing processing on the workpiece W.

[0368] The processing equipment 500 and the marker head 1 according to this embodiment are configured to be suitable for such a usage mode. The settings of the processing equipment 500 and the marker head 1, and the relative positional relationship between the processing equipment 500 and the marker head 1 will be described below in order.

[0369] First, the processing equipment 500 of this embodiment has, in addition to the conveying roller 502 that is driven to convey the workpiece W, a first driven roller 504l that is arranged on the +Y side of the conveying roller 502 and around which the workpiece W is wrapped from the +Z side, and a second driven roller 504r that is arranged on the -Y side of the conveying roller 502 and around which the workpiece W is wrapped from the -Z side.

[0370] The conveying roller 504 as a drive roller conveys the workpiece W at a speed of 1500 mm / s or more and 2000 mm / s or less along the Y direction as the conveying direction At. The workpiece W conveyed by the conveying roller 504 moves along a movement path defined by the conveying roller 502, the first driven roller 504l, and the second driven roller 504r.

[0371] Here, the path of movement of the workpiece W that corresponds to the irradiation area R1 includes a portion that has a different distance from the exit window 6. That is, as shown in Fig. 18, the movement path of the workpiece W is configured to have different heights within the range of the irradiation area R1.

[0372] In addition, in the movement path of the workpiece W, the first driven roller 504l as the roller immediately above the conveying roller 502 and closest to the conveying roller 502 among the rollers that contact the workpiece W upstream of the conveying roller 502, and the second driven roller 504r as the roller immediately below the conveying roller 502 and closest to the conveying roller 502 among the rollers that contact the workpiece W downstream of the conveying roller 502 are both driven rollers that rotate with the conveyance of the workpiece W. The rollers immediately above and below the conveying roller 502 are not limited to driven rollers, but even when driven by a separately provided driving source, it is preferable that the rollers have a large amount of slippage of the workpiece W relative to the conveying roller 502. For example, if the material has a large frictional force against the workpiece W, the amount of slippage is small. Also, when the surface material of each roller is the same, the greater the amount of contact with the workpiece W, the smaller the amount of slippage. When the rollers immediately above and below are comprised of driven rollers or rollers with a large amount of slippage relative to the conveying roller 502, an error is unlikely to occur in the amount of movement of the workpiece W relative to the rotation of the conveying roller 502. Therefore, print quality can be improved by controlling printing based on the rotation of the transport roller W. In particular, compared to TTO, the marker head 1 of this embodiment prints on the workpiece W in a non-contact manner, and therefore the print position is likely to shift if slippage occurs on the transport roller 502. Therefore, it is preferable to arrange the marker head 1 so that the transport roller with the smallest amount of slippage relative to the rollers immediately before and after it is located in the irradiation area R1.

[0373] Here, the area of ​​the movement path of the workpiece W where the UV laser light is irradiated corresponding to the irradiation area R1 is positioned so as to be farther away from the cover glass 62 as an optical member in the protruding direction of the second storage section H2 than the end of the second storage section H2 in the protruding direction.

[0374] Here, the protruding direction of the second housing part H2 corresponds to the irradiation direction of the UV laser light (i.e., the +Z direction) in this embodiment. Also, the end of the second housing part H2 in the protruding direction corresponds to the +Z side end of the housing 10 in this embodiment.

[0375] In other words, the area on the movement path of the workpiece W where the UV laser light is irradiated is arranged to be on the +Z side of the +Z end of the housing 10. In other words, the area on the movement path of the workpiece W where the UV laser light is irradiated does not enter the optical path dividing section H3 (it is arranged to be on the +Z side of the optical path dividing section H3). This configuration makes it easy to insert the workpiece W into the movement path of the workpiece W from the front of the movement path of the workpiece W. This makes it easy to set the workpiece W on the movement path.

[0376] Also, as shown in FIG. 18, the apex 502a of the conveying roller 502 on the cover glass 62 side (-Z side) is offset to the upstream side (+Y side) or downstream side (-Y side) of the conveying direction At that is approximately aligned with the Y direction with respect to the center line (laser emission axis Al) that passes through the center of the cover glass 62 (offset to the +Y side in the illustrated example).

[0377] In other words, the center line Ar that passes through the rotation axis of the conveying roller 502 and extends in the Z direction is offset upstream or downstream with respect to the laser emission axis Al. In other words, the laser emission axis Al that extends in the Z direction and the rotation axis of the conveying roller 502 that extends in the X direction are laid out so as not to intersect with each other.

[0378] In other words, the above-mentioned relationship is offset to the upstream side (+Y side) or downstream side (-Y side) of the conveying direction At with respect to the top 502a (offset to the -Y side in the illustrated example). In detail, as shown in FIG. 18, the workpiece W on the upstream side of the top 502a and the workpiece W on the downstream side have a smaller inclination with respect to the plane (XY plane) perpendicular to the laser emission axis Al. In other words, the workpiece W on the downstream side of the top 502a has a more gentle inclination than the workpiece W on the upstream side. The laser emission axis Al according to this embodiment is offset to the side of the workpiece W on the upstream side and downstream side of the conveying direction At, where the inclination of the workpiece W with respect to the plane perpendicular to the laser emission axis Al is smaller, like the workpiece W on the downstream side.

[0379] The size of the irradiation area R1 is set to be larger than the printable area (printing area) of the printing device 1001 before replacement configured as the TTO. The TTO prints on the work W by bringing the printing part 1006 extending in the short dimension of the work W into contact with the work W. Therefore, even if the printing area on the work W has a constant length in the long dimension of the work W, if the printable range of the printing part 1006 is in a positional relationship in the short dimension of the work W such that it includes the printing area on the work W, it is possible to print on the entire printing area on the work W by passing the work W over the printing part 1006. In contrast, the part of the marker head 1 that is irradiated with the laser light at a certain moment has a constant area but is dot-like. Therefore, when the printing area on the work W is an area that has a constant length in the long dimension of the work W, it is preferable that the irradiation area R1 irradiated with the laser light has a constant length (dimension) in the direction corresponding to the long dimension of the work W. Specifically, the dimension of the irradiation area R1 in the conveying direction At (see symbol L5 in FIG. 17A) is set to be 120 mm or more when the workpiece W is parallel to the XY plane. Note that the irradiation area R1 in this embodiment refers to an area on the surface of the workpiece W that can be irradiated with laser light by the first scanner 51 and the second scanner 52.

[0380] Moreover, the size of the irradiation area R1 when the workpiece W is parallel to the XY plane is set so that the irradiation area R1 is covered by the bottom surface 10d of the housing 10 on the XY plane. That is, the entire irradiation area R1 overlaps the bottom surface 10d when viewed in the Z direction perpendicular to the XY plane, the dimension L5 of the irradiation area R1 in the Y direction is smaller than the dimension in the Y direction of the bottom surface 10d of the housing 10, and the dimension L6 of the irradiation area R1 in the X direction is smaller than the dimension in the X direction of the housing 10d. With this configuration, the laser light irradiated to the workpiece W is less likely to leak to the surroundings. In particular, when the distance from the +Z side end of the housing 10 to the workpiece W (see distance L2 in FIG. 18) is set to 0 mm or more and 20 mm or less, the leakage of the laser light is reduced. Furthermore, when the workpiece W is a sheet-like workpiece W that is wound around a plurality of conveying rollers and conveyed, the user can easily set the workpiece W on the moving path of the workpiece W by inserting the workpiece W from the front of the conveying rollers. Therefore, since the front of the movement path of the workpiece W is open, the work of setting the workpiece W on the movement path becomes easier. Therefore, according to a configuration in which the entire length of the irradiation area R1 in the X direction fits within the bottom surface 10d, it is possible to reduce leakage of laser light while maintaining the ease of opening the front of the movement path to set the workpiece W. Note that in a configuration in which the leakage of laser light is reduced by using a member covering the front side of the workpiece W, there is a risk that the workpiece W will be soiled by contacting the member when the workpiece W is tilted, so a configuration in which the front of the workpiece W is open reduces the risk of the workpiece W being soiled.

[0381] These settings are particularly effective when printing eight characters on the workpiece W by irradiating a 3 mm x 2 mm square with UV laser light for 10 ms per character. Here, the parameters related to the UV laser light are suitable for a case where a line width of 0.2 to 0.35 mm (corresponding to a target line width of 100 to 150 μm per scan line) is achieved by printing a thick line with three scan lines.

[0382] By setting the irradiation area R1 to be larger than the printable area of ​​the TTO, it becomes possible to perform printing within the irradiation area R1 while making the irradiation position of the UV laser light follow the transport of the workpiece W. This makes it possible to secure a printable area similar to that of the TTO.

[0383] On the other hand, the output of the laser light generated in the marker head 1 and passing through the exit window 6 is set to 1 W or more and 2 W or less. This setting was determined in order to realize a compact marker head 1. The color of the print when the laser light is irradiated for a certain period of time varies depending on the power density of the irradiated laser light. When the output of the laser light is 1 W or more and 2 W or less, the spot diameter of the laser light is preferably 160 μm or less in order to obtain sufficient color development.

[0384] More preferably, the spot diameter of the laser light in the irradiation area R1 is set to 60 μm or more and 80 μm or less. This spot diameter can be set so that the focal depth of the laser light corresponds to the part of the irradiation area R1 where the optical path length of the laser light is the longest (the end of the irradiation area R1) and the part of the irradiation area R1 where the optical path length is the shortest (the center of the irradiation area R1).

[0385] For example, the lower limit of the spot diameter is set to correspond to the number of scanning lines and the line width described above. This setting is effective in suppressing the influence of the optical path length difference between the center and end of the irradiation area R1 without adjusting the focus along the Z direction when the distance from the +Z side end of the housing 10 to the workpiece W (see distance L2 in FIG. 18) is set to 0 mm or more and 20 mm or less, and further when the dimension of the irradiation area R1 is set to 120 mm or more.

[0386] On the other hand, the upper limit of the spot diameter is effective when printing thick lines with a thickness of 200 μm (0.2 mm) or more, such as the line width of 0.2 to 0.35 mm described above. In this case, there is a concern that the processing time required for thick line processing will be relatively long, but by setting the upper limit of the spot diameter as described above, the irradiation area R1 of the UV laser light can be enlarged and the irradiation time can be extended.

[0387] The upper limit of the spot diameter (=80 μm) is the optimal value when the UV laser light is irradiated parallel to the irradiation direction and the distance L2 is set to 10 mm. When the distance L2 is changed within the range of 0 mm to 20 mm, the upper limit of the spot diameter becomes 120 μm.

[0388] If there is a concern about the optical path length difference in the irradiation area R1, the focal depth can be made deeper by providing the above-mentioned defocus lens 57. Increasing the focal depth is effective in suppressing the influence of the optical path length difference.

[0389] Furthermore, among the relative positions of the workpiece W with respect to the housing 10, in particular, the relative positions at which printing can be performed on the workpiece W are set so that the distance from the first mirror 51a to the surface of the workpiece W (in particular, the distance as viewed along the irradiation direction, which corresponds to the sum of distance L2 and distance L3 in Figure 19) is 150 mm or less.

[0390] In addition to the above, in this embodiment, the distance from the top surface 10u of the housing 10 to the workpiece W is set to 195 mm or less. The TTO as the printing device 1001 before replacement is often used in an environment where the distance from the top surface to the workpiece W is about 200 mm, and can be used in the same environment as the printing device 1001 before replacement. Specifically, in this embodiment, the distance L1 from the top surface 10u of the housing 10 to the +Z side end of the bottom surface 10d is set to 165 mm. And the distance L2 from the +Z side end of the bottom surface 10d to the workpiece W is set to preferably 30 mm or less, more preferably 20 mm or less.

[0391] Here, by setting the distance L2 to 30 mm or less, the specular reflected light of the laser light irradiated to the irradiation area R1 by the workpiece W can be guided to the region between the first plate member 18l and the second plate member 18r, i.e., the optical path partition section H3. This is effective in suppressing leakage of the specular reflected light to the outside of the housing 10.

[0392] In this embodiment, distance L3 from first mirror 51a to the +Z end of bottom surface 10d is set to 123 mm. Distance L4 from the lower surface of defocus lens 57 to the +Z end of bottom surface 10d is set to 100 mm. Considering that the thickness of defocus lens 57 is 2 mm, the distance (not shown) from the upper surface of defocus lens 57 to the +Z end of bottom surface 10d is set to 102 mm.

[0393] Here, the distance (=L1-L3) from the top surface 10u to the first mirror 51a is 42 mm, and the distance (=L1-L4) from the top surface 10u to the defocus lens 57 is 65 mm. Meanwhile, the center of the housing 10 in the Z direction corresponds to a location of approximately 82 mm (=L1 / 2) when viewed from the top surface 10u. Therefore, both the first mirror 51a and the defocus lens 57 according to this embodiment are located on the -Z side of the center of the housing 10 in the Z direction.

[0394] <Positional Relationship Between the Housing 10, the Support Member 501, and the Workpiece W> As described above, according to this embodiment, the mounting surface of the housing 10 is formed on the side opposite the exit window 6 (see the lower diagram of FIG. 17A). By configuring the housing 10 so that the top surface 10u facing the opposite side, rather than the bottom surface 10d where the exit window 6 is formed, is used as the mounting surface and the housing 10 is attached to the mounting position, the housing 10 can be supported so as to be suspended from the mounting position. This eliminates the need to interpose the support member 501 between the housing 10 and the workpiece W, and therefore the housing 10 and the workpiece W can be placed close to each other.

[0395] At that time, the support member 501 for supporting the housing 10 is located on the opposite side of the exit window 6, similar to the attachment position, and can be sufficiently separated from the workpiece W. This makes it possible to suppress interference between the support member 501 and the workpiece W while keeping the housing 10 and the workpiece W close to each other.

[0396] 10 and 13, a gap is provided between the first base plate 15 and the top surface 10u as the mounting surface, thereby suppressing the influence of distortion, vibration, and the like that occurs on the mounting surface at the mounting position on the solid-state laser crystal 41. This allows good generation of laser light even when the case 10 is configured to be supported at the mounting position.

[0397] 17A and other figures, instead of directly connecting the support member 501 and the mounting surface, the support member 501 is connected via an attachment 7, so that the housing 10 can be attached to the support member 501, which can take various forms, without any special modifications to the structure of the housing 10 itself. This is effective in facilitating replacement of various processing devices with the laser processing device L according to the present disclosure.

[0398] 3A and 3B, by configuring the front surface 10f as an open surface to be openable and closable, instead of the emission surface (i.e., bottom surface 10d) facing the workpiece W and the mounting surface (i.e., top surface 10u) mounted at the mounting position, it becomes possible to access the emission window 6 without causing interference with the workpiece W, the support member 501, etc. This makes it possible to improve the maintainability of the laser processing device L.

[0399] 4 and other figures, the front surface 10f as an open surface on which the cover member 13 is provided and the back surface 10b as a connection surface to which the electric cable 200 is connected are located on opposite sides, so that interference between the cover member 13 and the electric cable 200 is suppressed when opening / closing or attaching / detaching the cover member 13. This can improve the maintainability of the laser processing device L.

[0400] Other Embodiments In the embodiment, the second housing portion H2 is configured in the housing 10, but this second housing portion H2 is not essential. The first heat sink 81 and the second heat sink 82 may be housed in the first housing portion H1, for example. Also, the optical path partition portion H3 may be omitted as appropriate.

[0401] In the above embodiment, the excitation light source 21 is accommodated in the housing 10 of the marker head 1, but the present disclosure is not limited to such a configuration. For example, the excitation light source 21 may be provided in the marker controller 100.

[0402] In the above embodiment, the crystal housing section H12, the mirror housing section H11, and the substrate housing section H13, which are formed by dividing the first housing section H1 in the housing 10 into thirds, are arranged in this order along the Y direction perpendicular to the irradiation direction, but the present disclosure is not limited to such a configuration. For example, the order of the crystal housing section H12, the mirror housing section H11, and the substrate housing section H13 may be reversed, or any two of the crystal housing section H12, the mirror housing section H11, and the substrate housing section H13 may be arranged side by side along the irradiation direction.

[0403] In the above embodiment, the top surface 10u facing the bottom surface 10d on which the exit window 6 is formed is set as the mounting surface among the six surfaces of the housing 10, but the present disclosure is not limited to such a setting. Any one of the six surfaces, excluding the bottom surface 10d on which the exit window 6 is formed, can be regarded as the mounting surface. For example, if the right side surface 10r is set as the mounting surface, the support member 501 supports the housing 10 from the left side.

[0404] In addition, two or more of the six surfaces of the housing 10, excluding the bottom surface 10d, can be regarded as mounting surfaces. For example, if the left side surface 10l and the top surface 10u are regarded as mounting surfaces, the attachment 7 may be attached to either the left side surface 10l or the top surface 10u, or may be attached to both the left side surface 10l and the top surface 10u as in the marker head 1' shown in FIG.

[0405] 22 has a first portion 2007a attached to the top surface 10u and a second portion 2007b attached to the left side surface 10l, and the support member 501' also has a shape that matches the attachment 2007. In this way, the attachment surface can be set according to the shape of the support member 501', and an attachment 2007 corresponding to the setting can be used.

[0406] Furthermore, the attachment 7 is not essential in the first place. As in the case of the housing 10" of the marker head 1" shown in Figure 23, the support member 501 can be attached directly to the mounting surface (top surface 10u" in the example) without using the attachment 7. In this case, a portion of the mounting surface may be considered as the attachment. Also, a portion of the mounting surface may be made to protrude in the opposite direction to the exit window 6, and the protruding portion may be used as the attachment. [Explanation of symbols]

[0407] S Laser Processing System L Laser processing equipment 1 Marker head 2. Excitation light generation section 21 Excitation light source 23 Temperature control section 25 Relay 3. Excitation light guide section (light guide optical system) 31 Fiber optic cable 32 Fiber Guide 4 Laser light output section 41 Solid-state laser crystal 43 Q-Switch 45 Nonlinear Optical Crystals 49 Q-switch driver 5 Laser light scanning unit (laser light deflection unit) 51 First Scanner 51a 1st mirror 52 Second Scanner 52a 2nd mirror 53 First control board 55 Intermediate deflection section 55a Middle mirror 57 Defocus lens (optical element) 6 Exit window 62 Cover glass (optical component) 7 Attachment 81 First heat sink (heat sink) 82 Second heat sink (heat sink) 83 First blower fan (blower section) 84 Second blower fan (blower section) 10. Chassis 10u Top surface (mounting surface) 10d Bottom 10f front (open side) 10b Rear (connection surface) 13 Cover member 14 Connection cover 15 First base plate (support plate) 15g Partition surface 18l First plate-shaped member (plate-shaped member) 18r Second plate-shaped member (plate-shaped member) 100 Marker Controller 101 Reception 103 Control section 104 Power supply section (power supply section) 200 Electrical Cable 500 Processing equipment 501 Support member 502 Transport roller 502a Top of conveyor roller Ac1 First rotation axis Ac2 Second rotation axis Ae Extension direction At conveying direction H1 First storage section H11 Mirror storage section H12 Crystal storage unit H13 Board storage section H2 Second storage section H21 Crystal side storage section H22 Light source side housing H3 Optical path section M1 1st Mark (Mark) M2 2nd Mark (Mark) M3 3rd Mark (Mark) Pp processing pattern R1 Irradiation area Double work

Claims

1. A laser processing device that performs printing on a sheet-like film containing a UV reactive layer by irradiating the film with UV laser light, a controller that stores processing conditions including a character string to be printed on the film and outputs a control signal based on the processing conditions; a marker head having a housing connected to the controller via an electric cable and configured to irradiate the film with UV laser light based on the control signal; The marker head includes: An excitation light generating unit that generates excitation light; a laser light output unit that generates and outputs a UV laser light based on the excitation light generated by the excitation light generating unit; a galvanometer scanner that is disposed within the housing so as to form an irradiation area for printing the character string on the film located in proximity to a bottom end of the housing, and that two-dimensionally scans the UV laser light output from the laser light output unit on the surface of the film based on a control signal output from the controller; an optical element that is disposed in the optical path of the UV laser light within the housing and adjusts a spot diameter of the UV laser light so that a chemical reaction is induced in the UV reactive layer within the irradiation area formed on the film located in the vicinity of the bottom end of the housing; A laser processing device characterized by:

2. The optical element adjusts the spot diameter of the UV laser light so that a chemical reaction is induced in the UV reactive layer of the film at the center and end portions of the irradiation area.

2. The laser processing apparatus according to claim 1.

3. The optical element adjusts the spot diameter of the UV laser light in the irradiation area to 160 μm or less.

3. The laser processing apparatus according to claim 1 or 2.

4. The optical element adjusts the spot diameter of the UV laser light in the irradiation area to be 60 μm or more and 80 μm or less.

4. The laser processing apparatus according to claim 3.

5. The galvanometer scanner is configured by a two-axis galvanometer scanner that scans the UV laser light in an X direction and a Y direction, The two-axis galvanometer scanner is disposed in the housing such that the X-direction dimension of the irradiation area is smaller than the X-direction dimension of the bottom surface of the housing, and the Y-direction dimension of the irradiation area is smaller than the Y-direction dimension of the bottom surface of the housing.

5. The laser processing apparatus according to claim 1, wherein the laser processing apparatus is a laser processing apparatus having a laser beam.

6. The two-axis galvanometer scanner is disposed in the housing so that the dimension of the irradiation area is 120 mm or more.

6. The laser processing apparatus according to claim 5.

7. An optical member is provided on the bottom surface of the housing to cover a space through which a laser optical path connecting the galvano scanner and the irradiation area passes.

7. The laser processing apparatus according to claim 1, wherein the laser processing apparatus is a laser processing apparatus having a laser beam.

8. The position close to the bottom end of the housing is a position that is 0 mm or more and 20 mm or less away from the bottom end of the housing.

8. The laser processing apparatus according to claim 1, wherein the laser processing apparatus is a laser processing apparatus having a laser beam.

9. The laser processing apparatus is configured to be mounted at a mounting position, The housing has a mounting surface formed on a top surface opposite to a bottom end thereof, the mounting surface being adapted to be mounted at the mounting position.

9. The laser processing apparatus according to claim 1, wherein the laser processing apparatus is a laser processing apparatus having a laser beam.

10. The galvano scanner is disposed in the housing closer to the top surface than a central portion between a top surface facing the bottom surface of the housing in an irradiation direction of the UV laser light and the bottom surface.

10. The laser processing apparatus according to claim 1, wherein the laser processing apparatus is a laser processing apparatus having a laser beam passing through the ...

Images