Electroencephalogram measuring device and electroencephalogram measuring method

Abstract

Provided is a brain wave measuring device (10) comprising: a support member (20) that is disposed along the head (99) of a subject; an electrode unit (30) that is attached to the support member (20) and contacts the scalp of the subject to acquire a brain wave signal; and a assisting member (attachment part (70)) that assists the placement of the support member (20) on the head (99). The support member (20) is configured from a ribbon-shaped or linear member.

Description

[Technical field]

[0001] The present invention relates to an electroencephalogram measuring device and an electroencephalogram measuring method. [Background technology]

[0002] Various developments have been made with respect to electroencephalogram measuring devices for measuring electroencephalograms. For example, a biosignal measuring device is known as this type of technology, which includes a support made of a shape-memory material and which is a headband to be worn on the user's head, and a vital sensor attached to the support for acquiring the user's biosignals (see, for example, Patent Document 1). According to the technology of Patent Document 1, when measuring biosignals, it is possible to easily restore the support to a shape that matches the user's body shape, which has been shape-memorized in advance. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5900167 Summary of the Invention [Problem to be solved by the invention]

[0004] When measuring EEG, it is important to make the electrodes fit the shape of the head in order to bring them into contact with the scalp. However, head shapes vary widely, and so technology that can accommodate this has been required.

[0005] The present invention has been made in consideration of the above circumstances, and aims to provide a technique for appropriately contacting an electroencephalogram measuring device, particularly electrodes, with the scalp when measuring electroencephalograms. [Means for solving the problem]

[0006] According to the present invention, the following techniques are provided. 1. An electroencephalogram measuring device comprising: a support member that is placed along the head of a subject; an electrode unit that is attached to the support member and contacts the scalp of the subject to acquire an electroencephalogram signal; and a support member that supports the placement of the support member on the head, An electroencephalogram measuring device in which the support member is composed of a ribbon-shaped or linear member. 2. The electroencephalogram measuring device described in 1., wherein the support member is made of a non-elastic material that has flexibility and can deform to conform to the shape of the head. 3. An electroencephalogram measuring device as described in 1. or 2., wherein when the support member is composed of a ribbon-shaped member, it has a film member stretched between adjacent electrode units. 4. 4. The electroencephalogram measuring device according to 3., wherein the film member is made of a material having a Poisson's ratio of 0.15 to 0.4. 5. 5. The electroencephalogram measuring device according to 3. or 4., wherein the product of the elastic modulus and thickness of a material constituting the film member is 0.4 to 9.1 GPa·mm. 6. An electroencephalogram measuring device as described in 1. or 2., wherein when the support member is composed of a linear member, the linear member is disposed between the electrode units. 7. 7. The electroencephalogram measuring device described in 6., wherein the linear member is provided as at least two extending members spaced apart from each other, and the electrode unit is provided between the two members. 8. The electroencephalogram measuring device described in any one of 1. to 7., wherein the electrode unit has a base, a plurality of convex portions provided on the base, and an electrode portion provided on the convex portions and in contact with the head. 9. 9. The electroencephalogram measuring device described in 8., wherein the convex portion is an elastic member. 10. An electroencephalogram measuring device described in any one of 1. to 9., wherein the support member is provided at an end of the support member, attached to the ear or chin, and assists in positioning the support member to the shape of the head. 11. An electroencephalogram measuring method for measuring electroencephalograms by attaching the electroencephalogram measuring device according to any one of 1. to 10. to the head of a subject. Effect of the Invention

[0007] According to the present invention, it is possible to provide a technique for appropriately contacting an electroencephalogram measuring device, particularly electrodes, with the scalp in electroencephalogram measurement. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic diagram showing a state in which an electroencephalogram measuring device is attached to a head according to a first embodiment. [Diagram 2] FIG. 2 is a schematic diagram showing a support member and an attachment portion according to the first embodiment. [Diagram 3] FIG. 2 is a diagram for explaining, by modeling, the force acting on the head when the electroencephalogram measuring device according to the first embodiment is worn (electrode pressing force F on the head). [Figure 4] FIG. 2 is a diagram for explaining the capstan principle (equation) used for modeling according to the first embodiment. [Diagram 5] FIG. 2 is a cross-sectional view of the electrode unit according to the first embodiment in a state where it is attached to a support member. [Figure 6] FIG. 11 is a schematic diagram showing a state in which an electroencephalogram measuring device according to a second embodiment is attached to a head. [Figure 7] FIG. 11 is a schematic diagram showing a support member and an attachment portion according to a second embodiment. [Figure 8] FIG. 11 is a cross-sectional view of an electrode unit according to a second embodiment in a state where it is attached to a support member. [Figure 9] FIG. 11 is a diagram illustrating an adjustment unit according to a second embodiment. [Figure 10] FIG. 13 is a plan view of an electroencephalogram measuring device according to a third embodiment. [Figure 11] FIG. 13 is a front view of an electroencephalogram measuring device according to a third embodiment. [Figure 12]FIG. 13 is a plan view focusing on the manner in which support members are attached to two electrode units at electrode positions Cz and C3 according to a third embodiment. [Figure 13] FIG. 11 is a cross-sectional view of an electrode unit according to a third embodiment in a state where it is attached to a support member. [Figure 14] 1 is a graph showing theoretical values ​​(calculated values) and actual measured values ​​of electrode pressing force F in the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In this embodiment, an electroencephalogram measuring device having an electrode unit and attached to the head of a subject to acquire electroencephalograms and an electroencephalogram measuring method using the electroencephalogram measuring device will be described.

[0010] <First embodiment> <General Structure of the Electroencephalogram Measuring Device 10> Fig. 1 is a schematic diagram showing a state in which an electroencephalogram measuring device 10 is attached to a person's head 99, as viewed from the front. Fig. 2 is a diagram showing a support member 20 and an attachment part 70 that support an electrode unit 30. In this embodiment, an electroencephalogram measuring device 10 that measures electroencephalograms at electrode positions Cz, C3, C4, T3, and T4 (international 10-20 system) is illustrated.

[0011] The electroencephalogram measuring device 10 is attached to a person's head 99, detects electroencephalograms as potential fluctuations from the living body, and outputs the detected electroencephalograms to an electroencephalogram display device (not shown). The electroencephalogram display device acquires the electroencephalograms detected by the electroencephalogram measuring device 10, displays them on a monitor, stores the data, and performs well-known electroencephalogram analysis processing (measurement processing).

[0012] The electroencephalogram measuring device 10 has a plurality of electrode units 30 that contact the measurement site of the subject (i.e., the head 99) to acquire electroencephalograms, which are biosignals, a long sheet-like (film base) support member 20 to which the electrode units 30 are attached and supported, and an attachment section 70 to fix the support member 20 to the head 99. In this embodiment, the electroencephalogram measuring device 10 is fixed to the head 99 by attaching the attachment section 70 to the ear of the subject.

[0013] The support member 20 is configured to be bendable to a certain degree at least in the thickness direction. In addition, no member (hard member such as a helmet) is provided to surround the support member 20 and give it a shape in advance. When not attached to the head 99, the support members 20 and the like can be arranged in a flat state without applying any particular external force, and when attached to the head 99, the shape changes mainly due to gravity to fit the shape of the head 99. Both ends of the electrode unit 30 may be floating from the head 99 due to the influence of the hair, etc., so the attachment parts 70 are used to support the electrode unit 30 in conforming to the shape of the head 99.

[0014] The support member 20 is provided with a concave snap button 25 for fixing the electrode unit 30, into which a convex snap button 35 of the electrode unit 30 fits. The position in the left-right direction of the support member 20 where the concave snap button 25 is provided is exactly at a bent portion 27 where the support member 20 is bent. If the support member 20 is sufficiently thin, the bent portion 27 is not necessary, but the presence of the bent portion 27 allows the support member 20 between the electrode units 30 to be linear.

[0015] The attachment portion 70 has an ear mounting portion 40 and an adjustment portion 50, which are connected by a non-stretchable member (here, a string 45).

[0016] When the electroencephalogram measuring device 10 is attached to the head 99, the positions of the electrode units 30 are roughly at the vertices of a polygon, and the electrode units 30 are spanned by the support members 20. In other words, the support members 20 are bent just at the portions (bending portions 27) where the electrode units 30 are attached.

[0017] <Electrode pressing force on the head F> Here, the features of this embodiment will be described with reference to Fig. 3 and Fig. 4. Fig. 3 is a diagram for explaining a model of the force (electrode pressing force F on the head) acting on the head 99 when the electroencephalogram measuring device 10 is worn. Fig. 4 is a diagram for explaining the capstan principle (equation) used for the modeling.

[0018] 3, when the electroencephalogram measuring device 10 is attached to the head 99, a polygon is formed with the electrode units 30 as vertices and the electrode units 30 connected by the support members 20. If it is assumed that the electrode units 30 are pressed against the head 99 by the tension of the support members 20, the force pressing the electrode units 30 against the head 99 (electrode pressing force F) can be expressed by the following formula 1. F = 2 T1 cos(θ) Equation 1 That is, the difference in θ caused by individual differences in head irregularities appears as a difference in the electrode pressing force F.

[0019] Furthermore, the minimum curvature of the inscribed circle is obtained from the height and interval of the electrode units 30. The maximum curvature is also obtained from the electrode pressing force F required for the electrode unit 30 and the capstan principle. Note that the electrode pressing force F on the head 99 follows the capstan equation, so it is greater on the side of the head than on the top of the head.

[0020] Here, it is assumed that the support member 20 (film substrate) is approximately wrapped around the head 99. Since there is friction between the head 99 and the support member 20, the tension of each electrode unit 30 is considered to follow the capstan equation shown in the following Equation 2. T1=T2·e^(μ·φ) Equation 2 μ: Friction coefficient φ: Central angle

[0021] From the above formulas 1 and 2, the relational expression between the tension T1 applied to the end of the support member 20 (film substrate) and the load (electrode pressing force F) that the electrode unit 30 applies to the head 99 can be understood. The load values ​​calculated from the above theoretical calculations and the load values ​​actually measured will be shown in the examples described later (see FIG. 6).

[0022] <Electrode unit 30> The electrode units 30 are detachably provided only at the sites required for EEG measurement. The electrode units 30 are attached at positions corresponding to, for example, T3, C3, Cz, C4, and T4 in the international 10-20 electrode placement method, and are arranged symmetrically in front view as shown in FIG.

[0023] 5 shows a cross-sectional view of the electrode unit 30 attached to the concave snap button 25 of the support member 20. The electrode unit 30 is configured as a button electrode and has a convex snap button 35 provided as a connection terminal, and the convex snap button 35 is detachably attached to the concave snap button 25 provided at a predetermined position of the support member 20. In other words, the concave snap button 25 functions as a mounting portion for attaching the electrode unit 30 by a fitting structure.

[0024] The electrode unit 30 may be made of a conductive metal as a whole, or may be made of a rubber-like elastic material as a base on which a conductive material is provided. The following describes an example of a configuration based on a rubber-like elastic material.

[0025] The detailed structure and materials of the electrode unit 30 will be described below, but the electrode unit 30 of this embodiment is an electrode (dry electrode) that does not use so-called electroencephalogram electrode paste to ensure conductivity. However, a method of forming a gel on the tip of the dry electrode (the tip of the protrusion 32) and soaking it in a wetting liquid or the like to ensure moisture may be applied. Also, instead of paste or grease, a method of wetting the tip of the dry electrode with a conductive auxiliary liquid made by mixing a small amount of electrolyte such as salt with a low-viscosity liquid such as lotion may be applied. In other words, the dry electrode of this embodiment is not limited to being completely dry, but is intended not to use auxiliary agents such as paste that leave significant stains.

[0026] The electrode unit 30 has a cylindrical base 31, a protrusion 32 integrally provided on one end (here, the base bottom surface 36) of the base 31, a conductive contact portion 33, a signal line portion 34, and a convex snap button 35 provided on the other end (here, the base top surface 37) of the base 31. In the following, the base 31 and the protrusion 32 are referred to as an electrode body 39 for convenience.

[0027] The electrode body 39 is integrally formed from a rubber-like elastic member. Specific materials for the elastic member will be described later. The electrode body 39 (i.e., the base 31 and the protrusion 32) are not limited to being integrally formed, and may be formed by assembling separately formed parts with an adhesive or a fitting structure.

[0028] <Shapes of base portion 31 and protrusion portion 32> The base 31 is generally cylindrical. A circular base underside 36 at one end (the lower side in the figure) of the base 31 is provided with a plurality of generally conical protrusions 32 protruding downward in the figure. The base 31 may be cylindrical, and the cross section may be a circle or other shape such as a polygon. The shape of the protrusions 32 is not limited to a cone shape, and various shapes such as a pyramid such as a triangular pyramid or a cylinder may be used.

[0029] A conductive contact portion 33 is provided on at least the tip side surface of the protrusion 32. The conductive contact portion 33 may be provided on the entire surface of the protrusion 32. The conductive contact portion 33 is formed in a thin film, and the state in which the conductive contact portion 33 is provided on the protrusion 32 can be considered to have substantially the same shape as the shape of the protrusion 32 alone.

[0030] The outer diameter of the base 31 is, for example, 10 mm to 50 mm. The height (thickness) of the base 31 is, for example, 0.1 mm to 30 mm. The height of the protrusion 32 is, for example, 1 mm to 20 mm. The width of the protrusion 32 (outer diameter of the base portion) is, for example, 1 mm to 10 mm.

[0031] <Material of electrode body 39 (base 31 and protrusion 32)> The material of the electrode body 39 will be described. As described above, the electrode body 39 can be a rubber-like elastic body. Specific examples of the rubber-like elastic body include rubber and thermoplastic elastomers (also simply called "elastomers (TPE)"). Examples of rubber include silicone rubber. Examples of thermoplastic elastomers include styrene-based TPE (TPS), olefin-based TPE (TPO), vinyl chloride-based TPE (TPVC), urethane-based TPE (TPU), ester-based TPE (TPEE), and amide-based TPE (TPAE).

[0032] When the material of the electrode body 39 is silicone rubber, when the type A durometer hardness on the surface of the electrode body 39 measured at 37°C in accordance with JIS K 6253 (1997) is defined as rubber hardness A, the rubber hardness A is, for example, 15 or more and 55 or less.

[0033] Here, the silicone rubber-based hardening composition will be described. The silicone rubber can be a cured product of a silicone rubber-based curable composition. The curing process of the silicone rubber-based curable resin composition is carried out, for example, by heating at 100 to 250°C for 1 to 30 minutes (first curing) and then post-baking at 100 to 200°C for 1 to 4 hours (second curing).

[0034] The insulating silicone rubber is a silicone rubber that does not contain a conductive filler, and the conductive silicone rubber is a silicone rubber that contains a conductive filler.

[0035] The silicone rubber-based hardening composition according to the present embodiment can contain a vinyl group-containing organopolysiloxane (A). The vinyl group-containing organopolysiloxane (A) is a polymer that is the main component of the silicone rubber-based hardening composition according to the present embodiment.

[0036] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of vinyl group-containing linear organopolysiloxane. The same type of vinyl group-containing linear organopolysiloxane may be different in the amount of vinyl groups in the molecule, the molecular weight distribution, or the amount of vinyl groups added, as long as it contains at least the same vinyl groups as functional groups and has a linear shape. The insulating silicone rubber-based hardenable composition and the conductive silicone rubber-based hardenable composition may further contain different vinyl group-containing organopolysiloxanes.

[0037] The vinyl group-containing organopolysiloxane (A) can contain a vinyl group-containing linear organopolysiloxane (A1) having a linear structure.

[0038] The vinyl group-containing linear organopolysiloxane (A1) has a linear structure and contains vinyl groups, and these vinyl groups become crosslinking points during curing.

[0039] The vinyl group content of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but for example, it is preferable that the vinyl group has two or more vinyl groups in the molecule and is 15 mol% or less, and more preferably 0.01 to 12 mol%. This optimizes the amount of vinyl groups in the vinyl group-containing linear organopolysiloxane (A1), and ensures the formation of a network with each component described below. In this embodiment, the symbol "to" means that the numerical values ​​at both ends are included.

[0040] In this specification, the vinyl group content refers to the mol % of vinyl group-containing siloxane units when all units constituting the vinyl group-containing linear organopolysiloxane (A1) are taken as 100 mol %, where it is considered that there is one vinyl group per vinyl group-containing siloxane unit.

[0041] The degree of polymerization of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is, for example, preferably within the range of about 1000 to 10000, and more preferably about 2000 to 5000. The degree of polymerization can be determined, for example, as the polystyrene-equivalent number average degree of polymerization (or number average molecular weight) measured by GPC (gel permeation chromatography) using chloroform as a developing solvent.

[0042] Furthermore, the specific gravity of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is preferably in the range of about 0.9 to 1.1.

[0043] By using a vinyl group-containing linear organopolysiloxane (A1) having a degree of polymerization and specific gravity within the above ranges, it is possible to improve the heat resistance, flame retardancy, chemical stability, etc. of the resulting silicone rubber.

[0044] As the vinyl group-containing linear organopolysiloxane (A1), those having a structure represented by the following formula (1) are particularly preferred.

[0045] [ka]

[0046] In formula (1), R 1 is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, or a hydrocarbon group consisting of a combination thereof, each having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, with a methyl group being preferred. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, and a butenyl group, with a vinyl group being preferred. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

[0047] Also, R 2is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, or a hydrocarbon group consisting of a combination thereof, each having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, and a butenyl group. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

[0048] Also, R 3 is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group consisting of a combination thereof. Examples of the alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group.

[0049] Furthermore, R in formula (1) 1 and R 2 Examples of the substituent of R include a methyl group and a vinyl group. 3 Examples of the substituent include a methyl group.

[0050] In addition, in formula (1), multiple R 1 are independent of each other and may be different or the same. 2 , and R 3 The same applies to.

[0051] Furthermore, m and n are the numbers of repeating units constituting the vinyl group-containing linear organopolysiloxane (A1) represented by formula (1), where m is an integer of 0 to 2000 and n is an integer of 1000 to 10000. m is preferably 0 to 1000 and n is preferably 2000 to 5000.

[0052] A specific example of the structure of the vinyl group-containing linear organopolysiloxane (A1) represented by formula (1) is that represented by the following formula (1-1).

[0053] [ka]

[0054] In formula (1-1), R 1 and R 2 are each independently a methyl group or a vinyl group, and at least one of them is a vinyl group.

[0055] Furthermore, the vinyl group-containing linear organopolysiloxane (A1) preferably contains a first vinyl group-containing linear organopolysiloxane (A1-1) having two or more vinyl groups in the molecule and a vinyl group content of 0.4 mol% or less, and a second vinyl group-containing linear organopolysiloxane (A1-2) having a vinyl group content of 0.5 to 15 mol%. By combining the first vinyl group-containing linear organopolysiloxane (A1-1) having a general vinyl group content as a raw rubber that is a raw material for silicone rubber, and the second vinyl group-containing linear organopolysiloxane (A1-2) having a high vinyl group content, the vinyl groups can be unevenly distributed, and the crosslinking density can be more effectively formed in the crosslinked network of the silicone rubber. As a result, the tear strength of the silicone rubber can be more effectively increased.

[0056] Specifically, the vinyl group-containing linear organopolysiloxane (A1) may be, for example, a vinyl group-containing linear organopolysiloxane represented by the above formula (1-1), 1 is a vinyl group and / or R 2 a first vinyl group-containing linear organopolysiloxane (A1-1) having two or more units in the molecule each of which is a vinyl group and containing 0.4 mol % or less of a unit represented by R 1 is a vinyl group and / or R 2 It is preferable to use a second vinyl group-containing linear organopolysiloxane (A1-2) containing 0.5 to 15 mol % of units in which the vinyl group is present.

[0057] The first vinyl group-containing linear organopolysiloxane (A1-1) preferably has a vinyl group content of 0.01 to 0.2 mol %, and the second vinyl group-containing linear organopolysiloxane (A1-2) preferably has a vinyl group content of 0.8 to 12 mol %.

[0058] Furthermore, when the first vinyl group-containing linear organopolysiloxane (A1-1) and the second vinyl group-containing linear organopolysiloxane (A1-2) are combined and blended, the ratio of (A1-1) to (A1-2) is not particularly limited, but for example, the weight ratio of (A1-1):(A1-2) is preferably 50:50 to 95:5, and more preferably 80:20 to 90:10.

[0059] The first and second vinyl group-containing linear organopolysiloxanes (A1-1) and (A1-2) may each be used alone or in combination of two or more.

[0060] The vinyl group-containing organopolysiloxane (A) may also contain a vinyl group-containing branched organopolysiloxane (A2) having a branched structure.

[0061] <<Organohydrogenpolysiloxane (B)>> The silicone rubber-based hardenable composition of the present embodiment may contain a crosslinking agent. The crosslinking agent may contain an organohydrogenpolysiloxane (B). The organohydrogenpolysiloxane (B) is classified into a linear organohydrogenpolysiloxane (B1) having a linear structure and a branched organohydrogenpolysiloxane (B2) having a branched structure, and may contain either one or both of these.

[0062] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of crosslinking agent. The same type of crosslinking agent may have at least a common structure such as a linear structure or a branched structure, and may have different molecular weight distributions in the molecule or different functional groups, or may be added in different amounts. The insulating silicone rubber-based hardenable composition and the conductive silicone rubber-based hardenable composition may further contain different crosslinking agents.

[0063] The linear organohydrogenpolysiloxane (B1) has a linear structure and a structure in which hydrogen is directly bonded to Si (≡Si-H), and is a polymer that undergoes a hydrosilylation reaction with the vinyl groups of the vinyl group-containing organopolysiloxane (A) and with vinyl groups of components blended into the silicone rubber-based curable composition, thereby crosslinking these components.

[0064] The molecular weight of the linear organohydrogenpolysiloxane (B1) is not particularly limited, but for example, the weight average molecular weight is preferably 20,000 or less, and more preferably 1,000 or more and 10,000 or less.

[0065] The weight average molecular weight of the linear organohydrogenpolysiloxane (B1) can be measured, for example, by polystyrene conversion in gel permeation chromatography (GPC) using chloroform as a developing solvent.

[0066] Furthermore, it is usually preferred that the linear organohydrogenpolysiloxane (B1) does not have a vinyl group, which can reliably prevent the crosslinking reaction from proceeding within the molecule of the linear organohydrogenpolysiloxane (B1).

[0067] As the linear organohydrogenpolysiloxane (B1) as described above, for example, one having a structure represented by the following formula (2) is preferably used.

[0068] [ka]

[0069] In formula (2), R 4 is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, a hydrocarbon group combining these groups, or a hydride group having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group, etc., and among these, a methyl group is preferable. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, a butenyl group, etc. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

[0070] Also, R 5 is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, a hydrocarbon group combining these groups, or a hydride group having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, and a butenyl group. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

[0071] In addition, in formula (2), multiple R 4 are independent of each other and may be different or the same. 5 The same applies to R. 4 and R 5 At least two of these are hydride groups.

[0072] Also, R 6 is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group combining these. Examples of the alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group. 6 are independent of each other and may be different from each other or may be the same.

[0073] In addition, R in formula (2) 4 ,R 5 ,R 6 Examples of the substituent include a methyl group and a vinyl group, and from the viewpoint of preventing an intramolecular crosslinking reaction, a methyl group is preferred.

[0074] Furthermore, m and n are the numbers of repeating units constituting the linear organohydrogenpolysiloxane (B1) represented by formula (2), where m is an integer of 2 to 150 and n is an integer of 2 to 150. Preferably, m is an integer of 2 to 100 and n is an integer of 2 to 100.

[0075] The linear organohydrogenpolysiloxane (B1) may be used alone or in combination of two or more kinds.

[0076] Since the branched organohydrogenpolysiloxane (B2) has a branched structure, it forms regions with high crosslink density, and is a component that greatly contributes to the formation of a sparsely-dense structure of crosslink density in the silicone rubber system. Also, like the linear organohydrogenpolysiloxane (B1), it has a structure in which hydrogen is directly bonded to Si (≡Si-H), and undergoes a hydrosilylation reaction with the vinyl groups of the vinyl group-containing organopolysiloxane (A) and with the vinyl groups of the components blended in the silicone rubber-based hardening composition, forming a polymer that crosslinks these components.

[0077] The specific gravity of the branched organohydrogenpolysiloxane (B2) is in the range of 0.9 to 0.95.

[0078] Furthermore, it is usually preferred that the branched organohydrogenpolysiloxane (B2) does not have a vinyl group, which can reliably prevent the crosslinking reaction from proceeding within the molecule of the branched organohydrogenpolysiloxane (B2).

[0079] As the branched organohydrogenpolysiloxane (B2), one represented by the following average composition formula (c) is preferred.

[0080] Average composition formula (c) (H a (R 7 ) 3-a SiO 1 / 2 ) m (SiO 4 / 2 ) n (In formula (c), R 7 is a monovalent organic group, a is an integer ranging from 1 to 3, and m is H a (R 7 ) 3-a SiO 1 / 2 The number of units, n, is SiO 4 / 2 (the number of units)

[0081] In formula (c), R 7 is a monovalent organic group, preferably a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, an aryl group, or a hydrocarbon group consisting of a combination thereof. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferred. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

[0082] In formula (c), a is the number of hydride groups (hydrogen atoms directly bonded to Si) and is an integer ranging from 1 to 3, and preferably 1.

[0083] In addition, in formula (c), m is H a (R 7 ) 3-a SiO 1 / 2 The number of units, n, is SiO 4 / 2 It is the number of units.

[0084] The branched organohydrogenpolysiloxane (B2) has a branched structure. The linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) differ in that their structures are linear or branched, and the number of alkyl groups R bonded to Si (R / Si) when the number of Si is 1 is in the range of 1.8 to 2.1 for the linear organohydrogenpolysiloxane (B1) and 0.8 to 1.7 for the branched organohydrogenpolysiloxane (B2).

[0085] Since the branched organohydrogenpolysiloxane (B2) has a branched structure, for example, when heated in a nitrogen atmosphere to 1000° C. at a heating rate of 10° C. / min, the amount of residue is 5% or more. In contrast, since the linear organohydrogenpolysiloxane (B1) is linear, the amount of residue after heating under the above conditions is almost zero.

[0086] Specific examples of the branched organohydrogenpolysiloxane (B2) include those having a structure represented by the following formula (3).

[0087] [ka]

[0088] In formula (3), R 7 R is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group combining these, or a hydrogen atom. Examples of the alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group. 7 Examples of the substituent include a methyl group.

[0089] In addition, in formula (3), multiple R 7 are independent of each other and may be different from each other or may be the same.

[0090] In addition, in formula (3), "-O-Si≡" indicates that Si has a branched structure extending three-dimensionally.

[0091] The branched organohydrogenpolysiloxane (B2) may be used alone or in combination of two or more kinds.

[0092] In addition, the amount of hydrogen atoms (hydride groups) directly bonded to Si in the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) is not particularly limited. However, in the silicone rubber-based curable composition, the total amount of hydride groups in the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) is preferably 0.5 to 5 moles, more preferably 1 to 3.5 moles, per mole of vinyl group in the vinyl group-containing linear organopolysiloxane (A1). This ensures that a crosslinked network is formed between the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) and the vinyl group-containing linear organopolysiloxane (A1).

[0093] <<Silica particles (C)>> The silicone rubber-based hardening composition according to the present embodiment contains a non-conductive filler. The non-conductive filler may contain silica particles (C) as necessary. This can improve the hardness and mechanical strength of the elastomer.

[0094] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of non-conductive filler. The non-conductive fillers of the same type may have at least a common constituent material, and may differ in particle size, specific surface area, surface treatment agent, or the amount of the surface treatment agent added. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different silane coupling agents.

[0095] The silica particles (C) are not particularly limited, but for example, fumed silica, calcined silica, precipitated silica, etc. may be used. These may be used alone or in combination of two or more kinds.

[0096] The silica particles (C) have a specific surface area, as measured by the BET method, of, for example, 50 to 400 m 2 / g, and 100 to 400m 2 / g is more preferable. The average primary particle size of the silica particles (C) is, for example, preferably from 1 to 100 nm, and more preferably from about 5 to 20 nm.

[0097] By using silica particles (C) having a specific surface area and average particle size within this range, it is possible to improve the hardness and mechanical strength, particularly the tensile strength, of the silicone rubber that is formed.

[0098] <<Silane coupling agent (D)>> The silicone rubber-based hardenable composition of this embodiment may contain a silane coupling agent (D). The silane coupling agent (D) may have a hydrolyzable group. The hydrolyzable group is hydrolyzed by water to become a hydroxyl group, and the hydroxyl group undergoes a dehydration condensation reaction with the hydroxyl group on the surface of the silica particles (C), thereby modifying the surface of the silica particles (C).

[0099] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of silane coupling agent. The same type of silane coupling agent may have at least a common functional group, but may have different other functional groups in the molecule or different amounts added. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different silane coupling agents.

[0100] In addition, the silane coupling agent (D) may contain a silane coupling agent having a hydrophobic group. This provides the surface of the silica particles (C) with this hydrophobic group, so that the cohesive force of the silica particles (C) in the silicone rubber-based curable composition and thus in the silicone rubber is reduced (there is less cohesion due to hydrogen bonds caused by silanol groups), and as a result, it is presumed that the dispersibility of the silica particles (C) in the silicone rubber-based curable composition is improved. This increases the interface between the silica particles (C) and the rubber matrix, and the reinforcing effect of the silica particles (C) is enhanced. Furthermore, it is presumed that the slipperiness of the silica particles (C) in the matrix is ​​improved during deformation of the rubber matrix. And, due to the improvement in the dispersibility and slipperiness of the silica particles (C), the mechanical strength (for example, tensile strength, tear strength, etc.) of the silicone rubber due to the silica particles (C) is improved.

[0101] Furthermore, the silane coupling agent (D) may contain a silane coupling agent having a vinyl group. This allows the vinyl group to be introduced onto the surface of the silica particles (C). Therefore, when the silicone rubber-based curable composition is cured, that is, when the vinyl group of the vinyl group-containing organopolysiloxane (A) and the hydride group of the organohydrogenpolysiloxane (B) undergo a hydrosilylation reaction to form a network (crosslinked structure), the vinyl group of the silica particles (C) also participates in the hydrosilylation reaction with the hydride group of the organohydrogenpolysiloxane (B), so that the silica particles (C) are also incorporated into the network. This allows the formed silicone rubber to have a low hardness and a high modulus.

[0102] As the silane coupling agent (D), a silane coupling agent having a hydrophobic group and a silane coupling agent having a vinyl group can be used in combination.

[0103] An example of the silane coupling agent (D) is one represented by the following formula (4).

[0104] Yn -Si-(X) 4-n (4) In the above formula (4), n represents an integer of 1 to 3. Y represents any functional group having a hydrophobic group, a hydrophilic group, or a vinyl group, and when n is 1, it is a hydrophobic group, and when n is 2 or 3, at least one of them is a hydrophobic group. X represents a hydrolyzable group.

[0105] The hydrophobic group is an alkyl group having 1 to 6 carbon atoms, an aryl group, or a hydrocarbon group formed by combining these groups, and examples thereof include a methyl group, an ethyl group, a propyl group, and a phenyl group, with a methyl group being particularly preferred.

[0106] In addition, the hydrophilic group may be, for example, a hydroxyl group, a sulfonic acid group, a carboxyl group, or a carbonyl group, and among these, a hydroxyl group is particularly preferred. Note that, although a hydrophilic group may be included as a functional group, it is preferable that the hydrophilic group is not included from the viewpoint of imparting hydrophobicity to the silane coupling agent (D).

[0107] Further, examples of the hydrolyzable group include alkoxy groups such as methoxy and ethoxy groups, chloro groups, and silazane groups. Among these, silazane groups are preferred because of their high reactivity with the silica particles (C). In addition, those having a silazane group as a hydrolyzable group can be easily obtained by adding (Y n -Si-) structures.

[0108] Specific examples of the silane coupling agent (D) represented by the above formula (4) are as follows. Examples of the functional group having a hydrophobic group include alkoxysilanes such as methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, and decyltrimethoxysilane; chlorosilanes such as methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, and phenyltrichlorosilane; and hexamethyldisilazane.Among these, the silane coupling agent having a trimethylsilyl group, which includes one or more selected from the group consisting of hexamethyldisilazane, trimethylchlorosilane, trimethylmethoxysilane, and trimethylethoxysilane, is preferred.

[0109] Examples of the functional group having a vinyl group include alkoxysilanes such as methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, and vinylmethyldimethoxysilane; chlorosilanes such as vinyltrichlorosilane and vinylmethyldichlorosilane; and divinyltetramethyldisilazane.Among these, preferred is a silane coupling agent having a vinyl group-containing organosilyl group, including one or more selected from the group consisting of methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, divinyltetramethyldisilazane, vinyltriethoxysilane, vinyltrimethoxysilane, and vinylmethyldimethoxysilane.

[0110] Furthermore, when the silane coupling agent (D) contains two types of silane coupling agents, a silane coupling agent having a trimethylsilyl group and a silane coupling agent having a vinyl group-containing organosilyl group, it is preferable that the silane coupling agent having the hydrophobic group is hexamethyldisilazane, and the silane coupling agent having the vinyl group is divinyltetramethyldisilazane.

[0111] When the silane coupling agent (D1) having a trimethylsilyl group and the silane coupling agent (D2) having a vinyl-containing organosilyl group are used in combination, the ratio of (D1) to (D2) is not particularly limited, but for example, the weight ratio of (D1):(D2) is 1:0.001 to 1:0.35, preferably 1:0.01 to 1:0.20, more preferably 1:0.03 to 1:0.15. By setting the weight ratio in such a range, the desired physical properties of the silicone rubber can be obtained. Specifically, the dispersibility of silica in the rubber and the crosslinking property of the rubber can be balanced.

[0112] In this embodiment, the lower limit of the content of the silane coupling agent (D) is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more, based on 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A). The upper limit of the content of the silane coupling agent (D) is preferably 100% by mass or less, more preferably 80% by mass or less, and even more preferably 40% by mass or less, based on 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A). By making the content of the silane coupling agent (D) equal to or greater than the lower limit, the adhesion between the columnar portion containing the elastomer and the conductive resin layer can be improved. This also contributes to improving the mechanical strength of the silicone rubber. Furthermore, by making the content of the silane coupling agent (D) equal to or less than the upper limit, the silicone rubber can have appropriate mechanical properties.

[0113] <<Platinum or platinum compounds (E)>> The silicone rubber-based curable composition according to this embodiment may contain a catalyst. The catalyst may contain platinum or a platinum compound (E). The platinum or platinum compound (E) is a catalyst component that acts as a catalyst during curing. The amount of platinum or platinum compound (E) added is a catalytic amount.

[0114] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of catalyst. The same type of catalyst may have at least a common component material, and may contain different compositions in the catalyst, and the amounts of the catalyst added may be different. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different catalysts.

[0115] As the platinum or platinum compound (E), known substances can be used, such as platinum black, platinum supported on silica or carbon black, chloroplatinic acid or an alcohol solution of chloroplatinic acid, a complex salt of chloroplatinic acid and an olefin, and a complex salt of chloroplatinic acid and a vinylsiloxane.

[0116] The platinum or platinum compound (E) may be used alone or in combination of two or more kinds.

[0117] In this embodiment, the content of platinum or platinum compound (E) in the silicone rubber-based curable composition means a catalytic amount and can be set as appropriate, but specifically, the amount is such that the platinum group metal is 0.01 to 1000 ppm by weight, and preferably 0.1 to 500 ppm, per 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A), the silica particles (C), and the silane coupling agent (D). By making the content of platinum or platinum compound (E) equal to or greater than the lower limit, the silicone rubber-based hardening composition can be hardened at an appropriate rate. In addition, by making the content of platinum or platinum compound (E) equal to or less than the upper limit, it is possible to reduce the production cost.

[0118] <<Water(F)>> Furthermore, the silicone rubber-based hardenable composition according to this embodiment may contain water (F) in addition to the above components (A) to (E).

[0119] Water (F) functions as a dispersion medium for dispersing each component contained in the silicone rubber-based hardening composition, and is also a component that contributes to the reaction between the silica particles (C) and the silane coupling agent (D). Therefore, the silica particles (C) and the silane coupling agent (D) can be more reliably linked to each other in the silicone rubber, and uniform properties can be exhibited overall.

[0120] (Other Ingredients) Furthermore, the silicone rubber-based hardening composition of the present embodiment may further contain other components in addition to the above components (A) to (F), such as inorganic fillers other than the silica particles (C), such as diatomaceous earth, iron oxide, zinc oxide, titanium oxide, barium oxide, magnesium oxide, cerium oxide, calcium carbonate, magnesium carbonate, zinc carbonate, glass wool, and mica, as well as additives such as reaction inhibitors, dispersants, pigments, dyes, antistatic agents, antioxidants, flame retardants, and thermal conductivity improvers.

[0121] The conductive solution (conductive silicone rubber composition) according to this embodiment contains the above-mentioned conductive filler and a solvent in addition to the above-mentioned silicone rubber-based hardenable composition that does not contain a conductive filler.

[0122] As the solvent, various known solvents can be used, including, for example, high boiling point solvents. These may be used alone or in combination of two or more kinds.

[0123] Examples of the solvent include aliphatic hydrocarbons such as pentane, hexane, cyclohexane, heptane, methylcyclohexane, ethylcyclohexane, octane, decane, dodecane, and tetradecane; aromatic hydrocarbons such as benzene, toluene, ethylbenzene, xylene, trifluoromethylbenzene, and benzotrifluoride; ethers such as diethyl ether, diisopropyl ether, dibutyl ether, cyclopentyl methyl ether, cyclopentyl ethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, 1,4-dioxane, 1,3-dioxane, and tetrahydrofuran; haloalkanes such as dichloromethane, chloroform, 1,1-dichloroethane, 1,2-dichloroethane, 1,1,1-trichloroethane, and 1,1,2-trichloroethane; carboxylic acid amides such as N,N-dimethylformamide and N,N-dimethylacetamide; and sulfoxides such as dimethyl sulfoxide and diethyl sulfoxide. These may be used alone or in combination of two or more.

[0124] The conductive solution can have a viscosity suitable for various coating methods such as spray coating and dip coating by adjusting the solid content in the solution.

[0125] In addition, when the conductive solution contains the conductive filler and the silica particles (C), the lower limit of the content of the silica particles (C) contained in the electrode body 39 can be, for example, 1% by mass or more, preferably 3% by mass or more, and more preferably 5% by mass or more, based on 100% by mass of the total amount of the silica particles (C) and the conductive filler. This can improve the mechanical strength of the electrode body 39. On the other hand, the upper limit of the content of the silica particles (C) contained in the electrode body 39 is, for example, 20% by mass or less, preferably 15% by mass or less, and more preferably 10% by mass or less, based on 100% by mass of the total amount of the silica particles (C) and the conductive filler. This can balance the conductivity of the electrode body 39 with the mechanical strength and flexibility.

[0126] The conductive solution is dried by heating as necessary to obtain a conductive silicone rubber. The conductive silicone rubber may be configured not to contain silicone oil, which can prevent the silicone oil from bleeding out onto the surface of the electrode body 39 and thus reducing the conductivity.

[0127] <Material of the conductive contact portion 33> The conductive member of the conductive contact 33 is, for example, a paste containing a good conductive metal (so-called conductive paste). The good conductive metal includes one or more selected from the group consisting of copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, and alloys thereof. In particular, silver, silver chloride, and copper are preferable from the viewpoints of availability and conductivity.

[0128] When the conductive contact portion 33 is formed from a paste containing a highly conductive metal, the top of the protrusion portion 32 made of a rubber-like elastic body is dipped (dipped and coated) into a paste-like conductive solution containing a highly conductive metal. This forms the conductive contact portion 33 on the surface of the protrusion portion 32.

[0129] The conductive contact portion 33 may be formed as a conductive resin layer by applying a conductive solution containing a conductive filler and a solvent to the protrusion portion 32. In this case, by using the same material (silicone rubber) as the protrusion portion 32 as the solvent, the adhesion of the conductive contact portion 33 (conductive resin layer) can be improved.

[0130] The conductive solution is dried by heating as necessary to obtain a conductive silicone rubber. The conductive silicone rubber may be configured not to contain silicone oil, which can prevent the silicone oil from bleeding out onto the surface of the conductive contact portion 33 and thus reducing the conductivity.

[0131] This improves the ability to push aside hair when the electroencephalogram measuring device 1 is attached to the head 99. In addition, it is possible to ensure a sufficient contact area of ​​the conductive contact portion 33 when the electroencephalogram measuring device 1 is attached.

[0132] <Structure of signal line portion 34> The electrode unit 30 is provided with a signal line portion 34 as a signal path connected to the conductive contact portion 33. The signal line portion 34 may have various wiring structures as long as it is in a form that provides electrical continuity via the base portion 31 and the protrusion portion 32. Here, the signal line portion 34 is provided so as to pass from the conductive contact portion 33 at the tip of the protrusion portion 32 through the inside of the protrusion portion 32 and the base portion 31 and be exposed on the base upper surface 37. Of the signal line portion 34, a portion protruding from the base upper surface 37 (here, the end portion 34a) is sandwiched between the convex snap button 35 (more specifically, the disk portion 35a described later) and the base upper surface 37, ensuring electrical continuity with the convex snap button 35.

[0133] The lower end of the signal line portion 34 may have a protruding structure, a structure that is substantially flush with the tip portion of the protrusion 32 or its vicinity, i.e., a structure that is buried in the area where the conductive contact portion 33 is formed. A protruding structure may be used from the viewpoint of connection stability with the conductive contact portion 33. The protruding portion at the tip of the signal line portion 34 is covered in part or in whole with the conductive contact portion 33. The protruding structure at the tip of the signal line portion 34 may be a structure that is not folded back, that is folded back, or that is wrapped around the surface of the tip portion of the protrusion 32.

[0134] As another wiring structure of the signal line portion 34, it may be a structure provided on the surfaces of the protrusion portion 32 and the base portion 31, or a wiring structure in which a part of it is provided inside and a part of it is provided on the surface. In other words, it is sufficient that the signal detected by the conductive contact portion 33 is finally transmitted to the convex snap button 35.

[0135] <Material of the signal line portion 34> The signal line portion 34 may be made of a known material, for example, a conductive fiber. The conductive fiber may be one or more selected from the group consisting of metal fiber, metal-coated fiber, carbon fiber, conductive polymer fiber, conductive polymer-coated fiber, and conductive paste-coated fiber. These may be used alone or in combination of two or more.

[0136] The metal material of the metal fiber and metal-coated fiber is not limited as long as it has electrical conductivity, and examples thereof include copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, stainless steel, aluminum, silver / silver chloride, and alloys thereof. These may be used alone or in combination of two or more. Among these, silver can be used from the viewpoint of electrical conductivity. In addition, it is preferable that the metal material does not contain metals that put a burden on the environment, such as chromium.

[0137] The fiber materials of the above-mentioned metal-coated fiber, conductive polymer-coated fiber, and conductive paste-coated fiber are not particularly limited, and may be any of synthetic fibers, semi-synthetic fibers, and natural fibers. Among these, polyester, nylon, polyurethane, silk, cotton, etc. are preferably used. These may be used alone or in combination of two or more.

[0138] Examples of the carbon fiber include PAN-based carbon fiber and pitch-based carbon fiber.

[0139] The conductive polymer material of the above-mentioned conductive polymer fibers and conductive polymer coated fibers is, for example, a mixture of conductive polymers such as polythiophene, polypyrrole, polyaniline, polyacetylene, polyphenylenevinylene, polynaphthalene, and derivatives thereof, and binder resin, or an aqueous solution of a conductive polymer such as PEDOT-PSS ((3,4-ethylenedioxythiophene)-poly(styrenesulfonic acid)).

[0140] The resin material contained in the conductive paste of the conductive paste-coated fiber is not particularly limited, but preferably has elasticity, and may contain, for example, one or more selected from the group consisting of silicone rubber, urethane rubber, fluororubber, nitrile rubber, acrylic rubber, styrene rubber, chloroprene rubber, and ethylene propylene rubber. These may be used alone or in combination of two or more.

[0141] The conductive filler contained in the conductive paste of the conductive paste-coated fiber is not particularly limited, and may be any known conductive material, but may include one or more selected from the group consisting of metal particles, metal fibers, metal-coated fibers, carbon black, acetylene black, graphite, carbon fibers, carbon nanotubes, conductive polymers, conductive polymer-coated fibers, and metal nanowires.

[0142] The metal constituting the conductive filler is not particularly limited, but may include, for example, at least one of copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, silver / silver chloride, or an alloy thereof, or two or more of these. Among these, silver or copper is preferred because of its high conductivity and high availability.

[0143] The signal line portion 34 may be made of a twisted yarn made by twisting together a plurality of linear conductive fibers, which can prevent the signal line portion 34 from breaking when the signal line portion 34 is deformed.

[0144] In this embodiment, the coating of conductive fibers does not simply mean covering the outer surface of the fiber material, but also includes, in the case of a twisted yarn made by twisting together single fibers, impregnating the gaps between the fibers in the twisted yarn with a metal, conductive polymer, or conductive paste to coat each of the single fibers that make up the twisted yarn.

[0145] The tensile elongation at break of the signal line portion 34 is, for example, 1% to 50%, and preferably 1.5% to 45%. By setting it within such a numerical range, excessive deformation of the protrusion portion 32 can be suppressed while suppressing breakage during deformation.

[0146] <Convex snap button 35 and concave snap button 25> The convex snap button 35 is made of, for example, a conductive metal, and has a disk-shaped disk portion 35a and a convex button-shaped button portion 35b extending from the center of the upper surface of the disk portion 35a. Examples of the conductive metal that can be used include stainless steel, copper alloy, aluminum alloy, and brass.

[0147] The disk portion 35a is attached to the base upper surface 37 of the base 31 with a conductive adhesive or the like. At this time, as described above, the end portion 34a of the signal line portion 34 is sandwiched between the disk portion 35a and the base upper surface 37, and electrical continuity with the convex snap button 35 is ensured. The button portion 35b is attached so as to fit into a recessed snap button 25 provided on the support member 20. The concave snap button 25, like the convex snap button 35, is made of a metal having good electrical conductivity, and outputs the electroencephalogram acquired by the electrode unit 30 to an electroencephalogram display device or the like via a predetermined wiring structure (not shown).

[0148] <Support member 20> The support member 20 has a ribbon-shaped member. More specifically, the support member 20 is configured to have a long strip-shaped film base material. The support member 20 may be composed of one type of film base material, or may be a composite member composed of multiple film base materials. In any case, the support member 20 is configured to have sufficient strength for attaching the electrode unit 30. That is, when the electrode unit 30 is attached by providing the recessed snap button 25, the support member 20 has sufficient strength not to be broken. In addition, the support member 20 has a physical property of not stretching (non-stretching) so that the multiple electrode units 30 are pressed against the head 99 with an appropriate pressure, that is, so that a certain tension acts. The non-stretching property means, for example, that the Poisson's ratio described later is within a predetermined range.

[0149] The vertical width (depth length) of the support member 20 depends on the size of the electrode unit 30 to be attached, but can be, for example, 5 mm to 50 mm. The width (length in the left-right direction) of the support member 20 depends on the size of the head 99 and the electrode positions, but can be, for example, 200 mm to 400 mm. The thickness of the support member 20 depends on the material, but can be, for example, 0.01 mm to 5 mm. By setting the thickness of the support member 20 within the above range, the electrode unit 30 can be pressed with a constant tension. The support member 20 may be curved to the extent that the tension does not substantially change depending on the shape of the head 99 and the condition of the hair.

[0150] The material of the support member 20 (film member) may be, for example, a resin member, a metal member, or a glass film. Examples of the resin member include polyimide resin film, polyetherimide resin film, polyamideimide resin film, and other polyimide resin-based resin films, polyamide resin film, and other polyamide resin films, polyester resin films, such as polyester resin film, PET (polyethylene terephthalate) resin film, and PS (polystyrene) resin film. Among these, polyimide resin films are particularly preferred from the viewpoint of improving flexibility, elasticity, and heat resistance. Examples of the metal member may be aluminum foil or copper foil.

[0151] <Physical properties of the support member 20> The physical properties (Poisson's ratio, Young's modulus, maximum thickness, Young's modulus×thickness) of the support member 20 are defined as follows, for example. (Poisson's ratio) The Poisson's ratio of the support member 20 is 0.15 to 0.4. The lower limit of the Poisson's ratio is preferably 0.2 or more, and more preferably 0.25 or more. The upper limit of the Poisson's ratio is preferably 0.38 or less, and more preferably 0.35 or less. By setting the Poisson's ratio of the support member 20 within the above range, the support member 20 is less likely to deform. That is, when the electroencephalogram measuring device 10 is attached to the head 99, a force acts in the direction in which the support member 20 extends when the electrode unit 30 is pressed against the head 99. That is, tension acts. At this time, if the support member 20 is an elastic member such as rubber, the support member 20 may extend inappropriately, and the tension of the electrode unit 30 on the head 99 may change, causing the pressing force to become uneven. As a result, the signal quality of the obtained electroencephalogram may decrease. However, by setting the Poisson's ratio of the support member 20 within the above range, the force with which the electrode unit 30 presses against the head 99 can be controlled within a certain range, enabling stable electroencephalogram measurement.

[0152] (Young's Modulus) The Young's modulus (elastic modulus) of the support member 20 is 0.4 GPa to 150 GPa. The lower limit of the Young's modulus is preferably 3 GPa or more, and more preferably 5 GPa or more. The upper limit is preferably 140 GPa or less, and more preferably 135 GPa or less. By setting the Young's modulus of the support member 20 within the above range, the strength of the support member 20 can be maintained and deformation can be prevented.

[0153] (Young's modulus x thickness) The product of Young's modulus (elastic modulus) and thickness of the material constituting the film member is 0.4 to 9.1 GPa mm. Even if the material is easily deformed (i.e., a material with a small Young's modulus), so long as the thickness is at least to a certain level, the force with which the electrode unit 30 presses against the head 99 can be controlled within a certain range without substantial deformation. Furthermore, in the case of a hard material (i.e., a material with a large Young's modulus), unless the thickness is thinned to a certain extent, the characteristic of the electroencephalogram measuring device 10 to conform to the shape of the head 99 is significantly reduced. Therefore, by setting the product of the Young's modulus (elastic modulus) and the thickness within the above range, the force with which the electrode unit 30 attached to the support member 20 presses against the head 99 can be controlled within a certain range, and stable electroencephalogram measurement can be achieved.

[0154] <Mounting part 70> The mounting parts 70 are attached to both longitudinal ends of the support member 20 (both left and right ends in Figures 1 and 2), and are placed between the support member 20 and a part of the subject other than the measurement part (here, the ear), and press the electrode unit 30 against the head 99 with a predetermined electrode pressing force F.

[0155] Specifically, the attachment portion 70 includes an adjustment portion 50 and an ear attachment portion 40, and has a string 45 connecting them.

[0156] The ear mounting unit 40 is attached to the ear of the subject. In this embodiment, the ear mounting unit 40 is attached by wrapping around the ear.

[0157] The adjustment units 50 are attached to both ends of the support member 20. The adjustment unit 50 has a plate-shaped member 52 attached to the support member 20, and a lock unit 51 for fixing the length of the plate-shaped member 52.

[0158] The plate-like member 52 is a long strip with a number of teeth arranged in a row. The locking portion 51 has an opening with a claw formed therein, through which the plate-like member 52 is inserted to lock it at a desired position. The locking portion 51 also has a release portion that releases the locked state in conjunction with the claw. The material of the adjustment portion 50 is not particularly limited, but various types of plastics can be used. From the viewpoints of physical properties, processability, cost, etc., 66 nylon is preferably used.

[0159] As described above, according to this embodiment, in the electroencephalogram measuring device 10, the electrode unit 30 is fixed to the support member 20 made of a film base material, and forms a polygon with the electrode units 30 attached only to necessary parts as vertices. This allows the electrode unit 30 to have good conformability to the head shape. In addition, the wearing state of the electroencephalogram measuring device 10 is modeled using a capstan equation, so that the electrode pressing force F by the electrode unit 30 can be appropriately grasped.

[0160] <Second embodiment> The second embodiment will be described with reference to Figures 6 to 9. The present embodiment differs from the first embodiment in (1) that the mounting structure of the electrode unit 30 to the support member 20 is a screw-fitting structure, (2) that an electrode mounting portion 160 is provided instead of the recessed snap button 25 as a structure for mounting the electrode unit 30 in accordance with the adoption of the screw-fitting structure, and (3) the structure and installation position of the adjustment portion 150. Below, the differences from the first embodiment will be mainly described, and similar configurations will be appropriately denoted with the same reference numerals and description thereof will be omitted.

[0161] Fig. 6 is a schematic diagram showing the electroencephalogram measuring device 110 as viewed from the front when it is attached to a person's head 99. Fig. 7 is a plan view showing the electroencephalogram measuring device 110 when it is not attached to the head 99. Fig. 8 is a cross-sectional view showing the electrode unit 30 attached to the electrode attachment part 160 of the support member 20.

[0162] <Electrode attachment portion 160> The support member 20 is provided with an electrode attachment portion 160 for attaching the electrode unit 30. The electrode attachment portion 160 has a circular attachment portion main body 161 when viewed from above, and a female screw 162 provided in the center of the attachment portion main body 161.

[0163] The outer diameter of the attachment main body 161 is set to be approximately the same as the outer diameter of the electrode unit 30. On the upper surface of the attachment main body 161, a circuit section 163 (preamplifier) ​​is mounted, which is formed of a hard insulating substrate and which primarily amplifies the brain waves acquired by the electrode unit 30. The upper surface of the attachment main body 161 is covered with an insulating cover member as necessary.

[0164] A female screw 162 made of a conductive material is attached to the center of the attachment body 161. The male screw type connection terminal 135 (protrusion 135b) of the electrode unit 30 is screw-fitted into the female screw 162.

[0165] <Male screw type connection terminal 135> On the upper surface of the electrode unit 30, instead of the convex snap button 35 of the first embodiment, A male screw type connection terminal 135 made of a conductive material is provided.

[0166] Male screw type connection terminal 135 has disk-shaped disk portion 135a and protruding portion 135b extending from the center of the upper surface of disk portion 135a. Protruding portion 135b is formed in a cylindrical shape and has a male screw with a thread formed on its circumferential surface. Female screw 162 is connected to circuit portion 163.

[0167] The electrode unit 30 is attached to the support member 20 by screwing the female screw 162 into the male screw type connection terminal 135 (i.e., the convex portion 135b). The electroencephalogram signal acquired by the electrode unit 30 is transmitted to the circuit section 163 from the male screw type connection terminal 135 via the female screw 162. The electroencephalogram signal primarily amplified by the circuit section 163 is output to an electroencephalogram display device or the like via a signal path not shown.

[0168] By using screw fitting as the attachment method for the electrode unit 30 and the support member 20, the attachment portion can be stabilized and the generation of noise can be suppressed.

[0169] <Adjustment section 150> Figure 9 shows the adjustment unit 150. Figure 9(a) is a side view, and Figure 9(b) is a plan view. As shown in FIG. 6, the adjustment portion 150 is sewn to the support member 20 between the electrode positions C3 and T3 and between the electrode positions C4 and T4.

[0170] The adjustment portion 150 has a plate-like member 152 attached to the support member 20, and a lock portion 151 that slides the plate-like member 152 and fixes it at a desired position. The lock portion 151 is provided with a string attachment portion 154 for attaching the string 45.

[0171] A convex string guide portion 126 is provided on both longitudinal ends of the support member 20. The string guide portion 126 is provided with an opening communicating in the left-right direction, through which the string 45 is inserted. This ensures that the string 45 always passes through both ends of the base material 21, and the electroencephalogram measuring device 10 can be worn properly.

[0172] The plate-like member 152 is a long, rail-like band with multiple protrusions 152a arranged in a row. The locking portion 151 is slidably fitted into the rail formed by the protrusions 152a. The locking portion 151 has a locking mechanism 156 that holds the locking portion 151 in an unslidable state. The unslidable state is released by performing a predetermined operation on the locking mechanism 156 (for example, an operation of pushing the locking portion 151 in the lateral direction).

[0173] By sliding the locking portion 151 on the plate-like member 152, the distance between the ear mounting portion 40 attached to the string 45 and the support member 20 can be adjusted.

[0174] <Third embodiment> The third embodiment will be described with reference to Figures 10 to 13. The present embodiment differs from the first and second embodiments in that (1) the support member 220 is replaced with a linear member 221, and (2) the linear member 221 is configured to be removable. Below, the differences from the first and second embodiments will be mainly described.

[0175] Fig. 10 is a plan view of the electroencephalogram measuring device 210 of this embodiment. Fig. 11 is a front view of the electroencephalogram measuring device 210. Figs. 10 and 11 show the electroencephalogram measuring device 210 in a state where it is not attached to the head 99. Fig. 12 is a plan view focusing on the attachment mode of the support member 220 for the two electrode units 30 at electrode positions Cz and C3. Fig. 13 shows a cross-sectional view of the electrode unit 30 in a state where it is attached to the electrode attachment part 260.

[0176] The electrode unit 30 is attached to an electrode attachment section 260 having a similar configuration to the electrode attachment section 160 shown in the second embodiment, and is supported by a support member 220. The support member 220 is provided having two parallel linear members 221 extending between adjacent electrode units 30 (i.e., electrode attachment sections 260). In addition, attachment sections 270 are attached to the left and right end sides of the electrode attachment section 260 (electrode positions T3, T4), respectively.

[0177] <Electrode attachment portion 260> As in the second embodiment, the electrode attachment portion 260 has an attachment portion main body 261 that is circular when viewed from above, a female screw 262 provided in the center of the attachment portion main body 261, and a circuit portion 163 that primarily amplifies the acquired brain waves.

[0178] <Connector 225> The electrode attachment portion 260 has a plurality of connectors 225 for attaching the support member 220 (linear member 221).

[0179] On the upper surface of the electrode mounting portions 260 of the three in the center (i.e., electrode positions Cz, C3, and C4), two connectors 265 are provided on the front and back sides of the right side in the illustration, at the same position in the left-right direction, and two connectors 265 are provided on the front and back sides of the left side in the illustration, at the same position in the left-right direction.

[0180] The two connectors 265 on the right side have openings facing rightward, allowing the connectors 225 provided on the linear member 221 to be inserted and removed, respectively. The two connectors 265 on the left side have openings facing leftward, allowing the connectors 225 provided on the linear member 221 to be inserted and removed, respectively.

[0181] On the upper surface of the electrode attachment part 260 at the right end (electrode position T3), two connectors 265 are lined up on the left side in the figure, one on the front side and one on the back side, and an attachment part 270 (adjustment part 250) is provided near the center on the right side. The two connectors 265 have openings facing the left side, and each of them is capable of inserting and removing the connectors 225 provided on the linear member 221.

[0182] On the upper surface of electrode attachment section 260 at the left end (electrode position T4), two connectors 265 are lined up on the front and back sides on the right side in the figure, and attachment section 270 (adjustment section 250) is provided near the center on the left side. The two connectors 265 have openings facing the right side, and connectors 225 provided on linear member 221 can be inserted and removed, respectively.

[0183] <Mounting portion 270> Similar to the attachment section 70 of the second embodiment, the attachment section 270 has an ear attachment section 240, an adjustment section 250, and a string 245. In this embodiment, the adjustment section 250 is attached to the electrode attachment section 260.

[0184] The adjustment section 250 has a locking section 251 attached to the electrode attachment section 260, and a plate-like member 252 whose position is fixed by the locking section 251. A string 245 is attached to the plate-like member 252.

[0185] By sliding the plate-like member 252, the distance between the ear attachment part 240 attached to the string 245 and the electrode attachment part 260 can be adjusted.

[0186] <Support member 220> The support member 220 includes a linear member 221 and connectors 225 provided on both ends of the linear member 221 .

[0187] The linear member 221 refers to a linear member such as a string or wire. For example, an electric cable (such as a multi-core cable or a flat cable) can be used as the linear member 221. The length of the linear member 221 is set according to the electroencephalogram measurement position. The thickness of the linear member 221 may be flexible enough to appropriately follow the shape of the head when the electroencephalogram measuring device 210 is attached to the head 99 and electroencephalograms are measured, and may be strong enough not to break even with continuous use.

[0188] Connectors 225 on both ends of the linear member 221 are attached to connectors 265 of the electrode attachment parts 260, and connect adjacent electrode attachment parts 260 (ie, electrode units 30).

[0189] By using the linear member 221 as an electric cable, the acquired electroencephalogram signal can be collected at a predetermined external output terminal (not shown). In addition, by using two parallel linear members 221 between adjacent electrode units 30, the posture of the electrode unit 30 in contact with the head 99 can be stabilized. In addition, by making the linear member 221 detachable from the electrode attachment section 260, it is possible to replace the linear member 221 or the electrode attachment section 260 when it is damaged. In addition, by preparing linear members 221 of different lengths, it is possible to set the inter-electrode distance according to the size of the subject's head 99, that is, the optimal electrode position. The support member 220 may be fixed to the electrode attachment section 260 by soldering or the like.

[0190] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various configurations other than those described above can also be adopted. EXAMPLES

[0191] The present embodiment will be described in detail below with reference to examples. However, the present embodiment is not limited to the description of these examples. The following examples correspond to the first and second embodiments, and confirmation was carried out regarding "Verification of the support member (film substrate)" and "Verification of modeling based on the capstan equation."

[0192] <<Verification of supporting material (film substrate)>> A total of seven samples of Examples 1 to 7 were evaluated as to whether they were suitable as the support member 20. The evaluation criteria were based on three levels as follows: Grade A: When a certain tension (0.6N) is applied, the electrode position does not shift much (5mm or less) Grade B: When a certain tension (0.6N) is applied, the electrode position deviation is within the allowable range (10mm or less) Grade C: When a certain tension (0.6 N) is applied, the electrode position deviation is outside the allowable range (greater than 10 mm)

[0193] The materials of the samples in Examples 1 to 7 are as follows: Table 1 shows the physical properties (Poisson's ratio, Young's modulus, maximum thickness, Young's modulus×thickness). Example 1: PET (polyethylene terephthalate) resin Example 2…PI (polyimide) resin Example 3: Aluminum foil Example 4: Copper foil Example 5: PS (polystyrene) resin Example 6: PE (polyethylene) resin Example 7: Glass film

[0194] In Examples 1 to 6, the positional deviation of the electrodes when a certain tension was applied was small, and electroencephalograms could be stably obtained at the target position. In Example 7, the Young's modulus of the support member was smaller than those of Examples 1 to 6, and the thickness was made larger than those of the other samples to aim at suppressing deformation, but the displacement of the electrodes when a certain tension was applied was slightly large.

[0195] [Table 1]

[0196] <<Verification of modeling based on the capstan equation>> The electroencephalogram measuring device shown in the embodiment was attached to a head model, and the electrode pressing force F was measured using a pressure sensor placed on the surface of the head model, and the measured value was compared with the calculated value obtained from a model based on the capstan equation.

[0197] The specific specifications of the electroencephalogram measuring device 10 are as follows. EEG measurement locations: 5 locations: T3, C3, Cz, C4, and T4 Electrode unit: Base diameter 10mm Base thickness 5mm Protrusion height 5mm Number of protrusions: 7 Interelectrode distance 70mm Support material (film substrate): PI resin Poisson's ratio 0.3 Young's modulus 3.4GPa Maximum thickness 0.225mm In addition, instead of fixing the device to the ear with the ear attachment, a 200 g weight was attached to each end to simulate the wearing condition of an EEG measuring device.

[0198] A graph of the theoretical (calculated) and measured values ​​of the electrode pressing force F at five points, T3, C3, Cz, C4, and T4, is shown in Figure 14. As can be seen from the figure, the theoretical and measured values ​​are almost identical, confirming the validity of the modeling.

[0199] This application claims priority based on Japanese Patent Application No. 2023-077092, filed on May 9, 2023, the disclosure of which is incorporated herein in its entirety. [Explanation of symbols]

[0200] 10, 110, 210 Electroencephalography device 20 Supporting member (film substrate) 25 Concave snap button 30 Electrode Unit 31 Base 32 Protrusion 33 Conductive contact 34 Signal line section 35 Convex snap button 40 Ear attachment part 50, 150 adjustment section 70 Mounting part 135 Male screw type connection terminal 160, 260 Electrode attachment part 161, 261 Mounting body 162, 262 Female thread 220 Support member 221 Linear members 225, 265 Connectors

Claims

1. An electroencephalogram measuring device comprising: a support member that is placed along the head of a subject; an electrode unit that is attached to the support member and contacts the scalp of the subject to acquire an electroencephalogram signal; and a support member that supports the placement of the support member on the head, The support member is configured as a ribbon-shaped member and has a film member stretched between adjacent electrode units, The product of the elastic modulus and thickness of the material constituting the film member is 0.4 to 9.1 GPa mm; The elastic modulus is a Young's modulus, and is 0.4 GPa or more and 129.8 GPa or less, The thickness is 0.03 mm or more and 1 mm or less, The Poisson's ratio of the material constituting the film member is 0.2 to 0.

4. Brain wave measuring device.

2. The electroencephalogram measuring device according to claim 1 , wherein the support member is made of a non-stretchable material having flexibility such that it can deform to conform to the shape of the head.

3. 3. The electroencephalogram measuring device according to claim 1, wherein the electrode unit has a base, a plurality of protrusions provided on the base, and an electrode portion provided on the protrusions and adapted to come into contact with a head.

4. The electroencephalogram measuring device according to claim 3 , wherein the convex portion is an elastic member.

5. 3. The electroencephalogram measuring device according to claim 1, wherein the support member is provided at an end of the support member, attached to the ear or chin, and supports the positioning of the support member to the shape of the head.

6. 3. An electroencephalogram measuring method for measuring electroencephalograms by attaching the electroencephalogram measuring device according to claim 1 or 2 to the head of a subject.

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