Light source device and liquid crystal display device
The support member in the LED substrate maintains distances to prevent IC chip damage, reducing parts and assembly complexity in backlight devices, thus lowering costs and enhancing efficiency.
Patent Information
- Application Number
- JP2021167769
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-10-13
- Publication Date
- 2025-11-06
- Estimated Expiration
- 2041-10-13
AI Technical Summary
Existing backlight devices using LED substrates face the risk of IC chip damage due to contact with other components, and adding spacers to prevent this increases the number of parts and costs.
A support member is inserted into a through-hole in the LED substrate, maintaining distances between the optical sheet and the LED substrate, and between the LED substrate and the chassis, eliminating the need for separate spacers and reducing the number of parts.
This configuration prevents IC chip damage while reducing the number of parts and assembly steps, leading to cost savings and improved efficiency.
Smart Images

Figure 0007765240000001 
Figure 0007765240000002 
Figure 0007765240000003
Abstract
Description
[Technical Field]
[0001] The present disclosure relates to a light source device and a liquid crystal display device. [Background technology]
[0002] For example, Patent Document 1 discloses a backlight device having a light-transmitting diffusion plate and a housing in which a light source is provided. In this backlight device, a pin provided on the bottom of the housing maintains the distance between the light-transmitting diffusion plate and the bottom of the housing, preventing the light-transmitting diffusion plate from sagging down toward the bottom of the housing. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-186080 Summary of the Invention [Problem to be solved by the invention]
[0004] In the backlight device of Patent Document 1, for example, when an LED substrate, which is an LED formed on a substrate, is used as a light source, there is a risk that the IC chip provided on the side opposite to the light emitting side of the LED substrate may come into contact with other components such as the backlight chassis, causing damage to the LED substrate. One way to prevent this damage to the LED substrate is to provide a spacer between the LED substrate and the backlight chassis, but this increases the number of parts, which can lead to problems such as increased work hours and higher costs. A main object of the present disclosure is to provide a light source device that can reduce the number of parts and prevent damage to the LED substrate. [Means for solving the problem]
[0005] A light source device according to one embodiment of the present disclosure comprises an optical sheet, an LED substrate having LEDs provided on a surface facing the optical sheet, a chassis supporting the optical sheet and the LED substrate, a support portion maintaining a distance between the optical sheet and the LED substrate, a spacer portion maintaining a distance between the LED substrate and the chassis, and a support member having a connection portion connecting the support portion and the spacer portion, wherein the support member is inserted into a through hole provided in the LED substrate, the support portion protruding toward the side of the LED substrate on which the LEDs are provided, and the spacer portion protruding toward the side of the LED substrate opposite the side on which the LEDs are provided. [Brief explanation of the drawings]
[0006] [Figure 1] 1 is a perspective view of a liquid crystal display device according to a first embodiment. [Figure 2] 3 is a cross-sectional view of a main part of a backlight in the liquid crystal display device of the first embodiment. FIG. [Figure 3] FIG. 3 is a schematic perspective view showing a state in which a support member is fixed to the substrate in FIG. 2. [Figure 4] FIG. 10 is a cross-sectional view of a main part of a backlight according to a modified example. DETAILED DESCRIPTION OF THE INVENTION
[0007] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that in the drawings, identical or equivalent elements are denoted by the same reference numerals, and duplicate explanations will be omitted. Furthermore, the embodiments described below are merely examples of the present disclosure, and the present disclosure is not limited to the embodiments. Even if the embodiments are not limited to these, various modifications can be made depending on the design, etc., as long as they do not deviate from the technical concept of the present disclosure.
[0008] First Embodiment FIG. 1 is a perspective view of a liquid crystal display device 1 according to this embodiment.
[0009] The liquid crystal display device 1 includes a liquid crystal panel 10 and a backlight (light source device) 20.
[0010] In the liquid crystal display device 1, light from a backlight 20 is irradiated onto the rear surface of the liquid crystal panel 10, and the liquid crystal panel 10 modulates the incident light and transmits it, thereby displaying an image on the front surface of the liquid crystal panel 10.
[0011] The backlight 20 will be described in more detail below. Fig. 2 is a cross-sectional view of a main part of the backlight 20. Fig. 3 is a perspective view schematically showing a state in which a support member 60 is fixed to an LED substrate 40 in the backlight 20 of Fig. 2.
[0012] 2, the backlight 20 includes, for example, an optical sheet 30, an LED substrate 40, and a backlight chassis (chassis) 50. In the liquid crystal display device 1, the liquid crystal panel 10 is disposed on the optical sheet 30 side of the backlight 20. The backlight 20 irradiates the liquid crystal panel 10 with light emitted from LEDs provided on the LED (Light Emitting Diode) substrate 40 via the optical sheet 30.
[0013] The optical sheet 30 includes, for example, a light-transmitting diffusion plate or the like, and transmits light emitted from the LEDs of the LED substrate 40 so that the light is uniformly irradiated onto the liquid crystal panel 10 .
[0014] The LED substrate 40 has a plurality of LEDs arranged on it. The plurality of LEDs are provided on the surface of the LED substrate 40 facing the optical sheet 30. Furthermore, an LED lens 41 is provided on each of the light emitting surfaces of the plurality of LEDs.
[0015] On the other hand, a plurality of IC chips 42 are provided on the surface of the LED substrate 40 opposite to the surface on which the LEDs are arranged. The IC chips 42 control a plurality of LEDs. Therefore, the surface of the LED substrate 40 on which the IC chips 42 are provided has a relatively larger area that can come into contact with the LED substrate 40 without causing any problems, compared to the surface of the LED substrate 40 on which the LEDs are formed.
[0016] The backlight chassis 50 is, for example, a housing having an opening, and holds the optical sheet 30 in the opening, and supports the LED substrate 40 so as to face the optical sheet 30.
[0017] In addition, in the backlight 20, the support member 60 is fixed to the LED substrate 40 by being inserted into a through-hole 43 provided in the LED substrate 40. The support member 60 maintains the distance between the optical sheet 30 and the LED substrate 40, and the distance between the LED substrate 40 and the backlight chassis 50.
[0018] The support member 60 has support portions 61 that maintain a distance between the optical sheet 30 and the LED substrate 40, spacer portions 64 that maintain a distance between the LED substrate 40 and the backlight chassis 50, and connection portions 67 that connect the support portions 61 and the spacer portions 64. The support member 60 is inserted into through holes 43 provided in the LED substrate 40, with the support portions 61 protruding toward the surface of the LED substrate 40 on which the LEDs are provided, and the spacer portions 64 protruding toward the surface of the LED substrate 40 opposite to the surface on which the LEDs are provided. In the support member 60, at least one support portion 61 is connected to one spacer portion 64.
[0019] More specifically, the support member 60 includes, for example, a support portion 61, a spacer portion 64, and a connection portion 67 that connects the support portion 61 and the spacer portion 64 together.
[0020] The support portion 61 includes, for example, a tip portion 62 and a bottom portion 63. The tip portion 62 is smaller than the diameter of the through-hole 43 and contacts the optical sheet 30. The bottom portion 63 is larger than the diameter of the through-hole 43 and contacts the surface of the LED substrate 40 on which the LEDs are provided. That is, the support portion 61 is at least partially wider than the diameter of the through-hole 43. As a result, the portion of the support portion 61 that is wider than the diameter of the through-hole 43 bends inward when a force is applied from the outside. The support portion 61 maintains the distance between the optical sheet 30 and the LED substrate 40, suppresses bending of the optical sheet 30, and prevents the optical sheet 30 from contacting the LED lens 41, thereby preventing damage to the LED lens 41. The shape of the support portion 61 is, for example, conical or polygonal pyramidal. This makes it possible to suppress blocking of light incident from the LEDs on the optical sheet 30. The inside of the bottom portion 63 is hollow. The lower end portion 63 bends inward when an external force is applied inward from the outside, and returns to its original shape when the external force is released.
[0021] The spacer portion 64 includes, for example, a peripheral edge portion 65. The peripheral edge portion 65 is larger than the diameter of the through-hole 43 in the spacer portion 64. The width of the spacer portion 64 is at least partially wider than the diameter of the through-hole 43. The thickness of the spacer portion 64 is also thicker than the thickness of the IC (Integrated Circuit) chip 42. The spacer portion 64, particularly the peripheral edge portion 65, maintains the distance between the LED substrate 40 and the backlight chassis 50, and can prevent contact between the IC chip 42 and the backlight chassis 50 even if vibration occurs.
[0022] The connection portion 67 includes, for example, a first connection portion 68 and a second connection portion 69.
[0023] The first connecting portion 68 connects the tip portion 62 and the spacer portion 64, for example, so as to penetrate the cavity of the lower end portion 63. The first connecting portion 68 maintains the connection between the support member 60 and the spacer portion 64 between the optical sheet 30 and the backlight chassis 50, and mainly maintains the distance between the support portion 61 and the spacer portion 64.
[0024] The second connecting portion 69 connects the lower end portion 63 and the spacer portion 64. It is preferable that the second connecting portion 69 partially contacts the inner wall of the through hole 43 when the support member 60 is fixed to the LED substrate 40. This makes it possible to prevent the support member 60 from moving in the radial direction of the through hole 43.
[0025] According to the configuration of this embodiment, the distance between the optical sheet 30 and the LED substrate 40 and the distance between the LED substrate 40 and the backlight chassis 50 can be maintained by the support member 60. In other words, according to the configuration of this embodiment, by simply providing the support member 60, there is no need to provide separate spacers or the like between the optical sheet 30 and the LED substrate 40 and between the LED substrate 40 and the backlight chassis 50. This reduces the number of parts and the number of work steps, enabling cost reduction.
[0026] Next, a method for attaching the support member 60 to the LED substrate 40 will be described.
[0027] The support member 60 is inserted and pushed into the through-hole 43 with the tip portion 62 from the side of the LED substrate 40 where no LEDs are provided. As a result, the support member 60 is fixed and attached to the LED substrate 40. When the support member 60 is pushed in, the lower end portion 63 is pushed inward by the inner wall of the through-hole 43 and deformed, then passes through the through-hole 43, and returns to its original shape after passing through the through-hole 43. As a result, the LED substrate 40 is sandwiched between the underside of the lower end portion 63 and the peripheral end portion 65 of the spacer portion 64, and the support member 60 can be fixed to the LED substrate 40.
[0028] Furthermore, in the backlight 20, the spacer portions 64 may or may not be in contact with the backlight chassis 50. For example, if the spacer portions 64 are in contact with the backlight chassis 50, the support member 60 can be made less likely to come off the LED substrate 40. Furthermore, for example, if the spacer portions 64 are not in contact with the backlight chassis 50, chattering between the support member 60 and the backlight chassis 50 can be suppressed, and the spacer portions 64 can be prevented from pushing up the LED substrate 40.
[0029] Furthermore, in the backlight 20, the spacer portion 64 may be fixed to the backlight chassis 50 with an adhesive member such as double-sided tape. This makes it possible to easily assemble the LED substrate 40 and the backlight chassis 50 without using fixing members such as screws.
[0030] When manufacturing the backlight 20, the support member 60 may be attached to the LED substrate 40, and then the backlight chassis 50 and the optical sheet 30 may be attached. Alternatively, the support member 60 may be installed on the backlight chassis 50 with an adhesive such as double-sided tape, and then the LED substrate 40 and the optical sheet 30 may be attached in this order.
[0031] Here, a modified backlight will be further described. Fig. 4 is a cross-sectional view of a main part of a modified backlight 201. In the modified backlight 201, the support member 60 in the above-described backlight 20 is changed to a support member 601.
[0032] As shown in FIG. 4 , the support member 601 has a configuration in which a plurality of support portions 61 are connected to a spacer portion 641. More specifically, a plurality of pairs of a support portion 61 and a connection portion 67 are connected to the spacer portion 641. Furthermore, the spacer portion 641 corresponds to an area of the LED substrate 40 where the IC chip 42 is not formed. In other words, when the support member 601 is fixed to the LED substrate 40, the spacer portion 641 is configured to avoid the IC chip 42 provided on the LED substrate 40. As a result, for example, the plurality of support portions 61 can be installed simply by attaching the support member 601 to the LED substrate 40, which prevents contact between the IC chip 42 and the backlight chassis 50 and improves work efficiency.
[0033] Although the light source device has been described above as a backlight for a liquid crystal display device, the light source device is not limited to this, and may be, for example, a lighting device.
[0034] The present disclosure is not limited to the above embodiments, and may be replaced with a configuration that is substantially the same as the configuration shown in the above embodiments, a configuration that has the same effect, or a configuration that can achieve the same purpose. [Explanation of symbols]
[0035] 1 liquid crystal display device, 10 liquid crystal panel, 20 backlight (light source device), 30 optical sheet, 40 LED substrate, 41 LED lens, 42 IC chip, 43 through hole, 50 backlight chassis (chassis), 60-601 support member, 61 support portion, 64-641 spacer portion, 67 connection portion
Claims
1. an optical sheet; an LED substrate having an LED provided on a surface facing the optical sheet; a chassis supporting the optical sheet and the LED substrate; a support member including a support portion for maintaining a distance between the optical sheet and the LED substrate, a spacer portion for maintaining a distance between the LED substrate and the chassis, and a connection portion for connecting the support portion and the spacer portion; Equipped with The support member is inserted into a through hole provided in the LED substrate, the support portion protruding toward a surface of the LED substrate on which the LEDs are provided, and the spacer portion protruding toward a surface of the LED substrate opposite to the surface on which the LEDs are provided, the spacer portion and the support portion are at least partially wider than the diameter of the through hole; A light source device, wherein a portion of the support part having a width greater than the diameter of the through hole bends inward when a force is applied from outside.
2. The light source device according to claim 1 , wherein the LED substrate is provided with an IC chip on a surface opposite to a surface on which the LEDs are provided.
3. The light source device according to claim 1 , wherein the support member has a plurality of the support portions connected to one of the spacer portions.
4. 4. The light source device according to claim 1, further comprising an adhesive member that bonds the spacer portion and the chassis together.
5. A liquid crystal display device comprising a liquid crystal panel and the light source device according to any one of claims 1 to 4.
Citation Information
Patent Citations
Backlight device
JP2004186080A
Heat dissipator and display device
JP2006058485A
Backlight device, and liquid crystal display device
JP2009094017A
Illuminating device, electro-optical device, and electronic equipment
JP2010009950A
Backlight device and liquid crystal module
JP2012038519A