Semiconductor device and package with Kelvin source connection

Abstract

A semiconductor device and a semiconductor package including such semiconductor device are presented. The semiconductor device includes one or more dies, a power source clip, a signal source clip, a signal gate clip and a power drain clip, with each clip electrically connected to each of the dies. A Kelvin source connection is integrated on the signal source clip. At at least one of the dies an angle between a path of a power source current between the power source clip and a die and a path of a signal source current between the signal source clip and the die is equal to or larger than 90°. [Fig. ZB]