A semiconductor device and a method of manufacturing the semiconductor device.

Abstract

A method for manufacturing a semiconductor device is proposed, the method comprising: a) providing a lead frame structure with a first lead frame surface and an opposite second lead frame surface, where the lead frame structure comprises an outer frame, an at least one lead frame die pad, an at least one lead frame terminal, and the plurality of lead frame junctions. The at least one lead frame die pad and / or the at least one lead frame terminal are accommodated in a floating orientation within the lead frame structure; b) providing a pre-binding material for fixing the floating lead frame die pads and / or floating lead frame terminals within the lead frame structure; c) mounting an at least one semiconductor die on the at least one lead frame die pad; d) mounting an at least one connecting element for creating an electrical connection between the at least one semiconductor die and the at least one lead frame terminal, e) encapsulating by a mold compound the lead frame structure, the at least one semiconductor die, the at least one connecting element and the pre-binding material to form the semiconductor device, such that at least part of the at least one lead terminal is exposed and thereby forming an encapsulated semiconductor device. According to the second aspect of the disclosure, there is provided a semiconductor device as manufactured in accordance with the method according to the disclosure. Figure 1