Dielectric ink compositions and uses thereof

Abstract

The disclosure relates to compositions, methods and systems for inkjet printing of dielectric materials. Specifically, the disclosure is directed to compositions, methods and systems for the inkjet printing of three-dimensional (3D) of high-performance printed circuit boards (PCBs), high-density interconnect PCBs (HDIPs), large-scale integrated systems (LSI) and other high- performance additively manufactured electronics (AME), each having low stress, low thermal expansion, low dielectric constant, capable of being cured at relatively low temperature and once cured, undergo reflow at typical processing temperatures.

Description

DIELECTRIC INK COMPOSITIONS AND USES THEREOFBACKGROUND

[0001] The disclosure is directed to compositions, methods and systems for inkjet printing of dielectric materials. Specifically, the disclosure is directed to compositions, methods and systems for the inkjet printing of three-dimensional (3D) of high-performance printed circuit boards (PCBs), high- density interconnect PCBs (HDIPs), large-scale integrated systems (LSI) and other high-performance additively manufactured electronics (AME), each having low stress, low thermal expansion, low dielectric constant, capable of being cured at relatively low temperature and once cured, undergo reflow at typical processing temperatures.

[0002] High power electronic components such as central processing units (CPU) and graphics processing units (GPU), and power supply units (PSU), generate a large amount of heat during operation and usually are provided with their own cooling units. However, to increase computing performance for example by overclocking (in other words increasing clock frequency above the standard frequency that the manufacturer used), while still under stringent packaging constraint, many of these components generate extra heat that cannot be adequately dissipated by the cooling systems provided (e.g., cooling fans).

[0003] Typically, composite materials are used in production of printed circuit boards (PCB), flexible printed circuits (FPCs), high-density interconnect PCBs (HDIPs), large-scale integrated systems (LSI) and other high-performance additively manufactured electronics (AME). PCBs can be produced for example, by a multistep process that involves photolithography and subtractive processes. One of the most common materials used to fabricate PCBs for these applications is FR-4, a composite material made of an epoxy polymer matrix in which woven fiberglass is embedded. This combination makes the material flame and impact resistant to a certain degree and provides good strength-to- weight ratios, and a considerable mechanical strength.

[0004] Certain additive manufacturing techniques, such as three-dimensional (3D) inkjet printing allow for highly complex geometries to be created directly (without tooling) from 3D CAD data, thereby permitting the creation of articles exhibiting high-resolution surfaces. To date it has been hard to duplicate the properties of composite materials used for large-scale integrated (LSI) circuits that would nevertheless possess low stress, with low thermal expansion, low dielectric constant, and be curable at relatively low temperature.

[0005] The present disclosure is directed toward overcoming one or more of the aboveidentified shortcomings.SUMMARY

[0006] Disclosed, in various exemplary implementations, are compositions, methods and systems for the inkjet printing of three-dimensional (3D) of printed circuit boards (PCBs), high- density interconnect PCBs (HD IPs), large-scale integrated systems (LSI) and other high-performance additively manufactured electronics (AME), each having low stress, low thermal expansion, low dielectric constant, capable of being cured at relatively low temperature and once cured, undergo reflow at temperatures of between about 220 °C and about 240 °C.

[0007] In an exemplary implementation provided herein is a dielectric ink composition comprised of: a linear oligomer; a crosslinking composition comprising a first crosslinking agent, and a second crosslinking agent at a predetermined concentration (v / v) ratio; and a photoinitiator.

[0008] These and other features of the compositions, methods and systems for the inkjet printing of three-dimensional (3D) of high-performance PCBs, HDIPs, LSIs and AMEs, having low stress, low thermal expansion, low dielectric constant, capable of being cured at relatively low temperature, and once cured, capable of undergoing reflow processes at commercial reflow temperature, will become apparent from the following detailed description when read in conjunction with the figures and examples, which are exemplary, not limiting.BRIEF DESCRIPTION OF THE FIGURES

[0009] For a better understanding of the dielectric ink compositions having low coefficient of thermal expansion (CTE), as well as the systems and methods for their implementation, with regard to exemplary implementations thereof, reference is made to the accompanying examples and figures, in which:

[0010] FIG. 1, is a TMA temperature sweep of an exemplary implementation of the cured dielectric composition showing the thermal expansion as a function of temperature;

[0011] FIG. 2, is a strain scan of the cured composition, showing the flexural strength of the cured composition; and

[0012] FIGs. 3A, and 3B, depict PCBs made with the compositions disclosed following reflow and soldering of cured board.DETAILED DESCRIPTION

[0013] Provided herein are exemplary implementations of compositions, methods and systems for the inkjet printing of three-dimensional (3D) of high-performance PCBs, HDIPs, LSIs and AMEs, having low stress, low thermal expansion, low dielectric constant, capable of being cured at relatively low temperature, and once cured, capable of undergoing reflow processes at commercial reflow temperature.

[0014] In an exemplary implementation, provided herein is an acrylic resin with low CTE values and that can be adapted to inkjet drop-on-demand printing. Also provided herein is a material having good mechanical properties.

[0015] In an exemplary implementation, use of relatively short highly functional materials with high hydrogen bonding capability leads to low coefficient of thermal expansion (CTE), and high glass transition temperature (Tg). For example, using rigid linear oligomers with high intramolecular bonding increase the Young Modulus and provides good impact resistance properties. Mechanical properties can be further improved by addition of additives such as impact modifiers and other filling materials, for example, silica nano-particles. The choice of the materials to be added should be highly functional materials with relatively low molecular weight. Addition of oligomers capable of internal hydrogen bonding systems achieves a two-fold objective: increase the impact strength of the system without affecting the low CTE imparted by the highly functional molecules (e.g., by achieving more highly ordered sections in the polymeric network structure formed following curing).

[0016] Accordingly and in an exemplary implementation, provided herein is a dielectric ink composition comprised of: a linear oligomer; a crosslinking composition comprising a first crosslinking agent, and a second crosslinking agent at a predetermined concentration (v / v) ratio; and a photoinitiator.

[0017] In the context of the disclosure, the term “coefficient of thermal expansion” (CTE) refers to a linear coefficient of thermal expansion, unless otherwise noted to be in only two (area coefficient of thermal expansion) or three (volume coefficient of thermal expansion) dimensions. As used in the claims, the coefficient of thermal expansion should be determined by thermomechanical analysis as detailed in ASTM E831- 14 “Standard Test Method for Linear Thermal Expansion of Solid Materials by Thermomechanical Analysis”, or in the Institute for Interconnecting and Packaging Electronic Circuits, Z-Axis Thermal Expansion detailed in IPC-TM-6502.4.24 (See e.g., FIG. 1).

[0018] Likewise, in the context of the disclosure, the term “oligomer” is used in its usual sense to indicate an intermediate that is comprised of monomers polymerized to a low molecular weight and adapted to be subsequently further polymerized, cross-linked, or otherwise treated to produce an end product. In an exemplary implementation, the term is used with reference to formulation components that are reacted and cured to provide the desired low CTE resin.

[0019] Furthermore, and in another exemplary implementation, crosslinking composition refers to a composition adapted and configured for joining moieties together by covalent bonding using a crosslinking agent, i.e., forming a linking group, or by the radical polymerization of monomers such as, but not limited to methacrylates, methacrylamides, acrylates, or acrylamides. In some exemplary implementation, the linking groups are grown to the end of the polymer arms.

[0020] In another exemplary implementation, at least two crosslinkers, a bi-functional and trifunctional cross-linking agents are co-solvated at a predetermined ratio, followed by admixing oligomers, and photoinitiators, in the presence of organic solvents, such as, for example, cyclohexane, THF and the like. Optionally surfactants, impact modifiers, and adhesion promoters (e.g., to metals, such as silver (Ag) and copper (Cu)). The process is later followed by post processing the ink at a temperature configured to evaporate the solvent (e.g., about 150 °C ± 30°C for between about 0.5 hours to about 2.0 hours). The combination of the oligomers’ backbone, the crosslinking composition and the photoinitiators are the factors affecting the low CTE. In essence, the ink composition is adapted such that hardening of the matrix takes place during the printing process, by creating a three- dimensional network of relatively short chain length curable polymer.

[0021] The linear oligomers are exposed to bi-functional and tri-functional cross-linking molecules. The cross-linking molecules can be for example in a state of, but are not limited to, pure liquid or solution in an inert solvent. The inert solvent can be, for example, but not limited to, hexane or cyclohexane. For a bi-functional and tri-functional cross-linking molecule, all functionalities can undergo, for example, radical initiation, propagation and termination, as well as chain condensation reactions with the linear oligomers backbone. After the bi-functional and tri-functional cross-linking molecules covalently bonded to linear oligomers backbone some or all of these bi-functional and tri- functional cross-linking molecules are in a state that, for each bi-functional cross-linking molecule, only one functionality is reacted, while for tri-functional cross-linking molecule only two functionalities are reacted, and the other functionality remains un-reacted. The linear oligomers’ backbone are thus attached with bi-functional cross-linking molecules through covalent surface bonds.

[0022] In an exemplary implementation, the crosslinking composition used in the formulations of the dielectric ink disclosed can comprises bi functional cross-linking molecules and tri-functional cross-linking molecules such as, for example: tricyclodecane dimethanol diacrylate (e.g., bi-functional cross-linking molecule), tricyclodecane dimethanol dimethacrylate, tricyclodecane dimethanol dimethacrylate, tris (2-hydroxy ethyl) isocyanurate triacrylate, polythyleneglycol diacrylate, polythyleneglycol dimethacrylate, 1,6 hexanediol diacrylate, tetraethylene glycol diacrylate, tripropylene glycol diacrylate, polybutadiene diacrylate, 3 methyl 1,5-pentanediol diacrylate, ethoxylated bisphenol-A diacrylate, dipropylene glycol diacrylate, ethoxylated bisphenol A / F hexanediol diacrylated, 1,10 decanediol diacrylate, esterdiol diacrylate, alkoxylated diacrylate, propoxylated neopentyl glycol diacrylate, pentaerythritol tetraacrylate, trimethyloolpropane triacrylate, di-trimethylopropane tetraacrylate, di-pentaerythritol pentaacrylate, ethoxylated trimethylolpropane triacrylate (e.g., tri-functional cross-linking molecule), ethoxyated trimethylopropane triacrylate, propoxylated trymethylpropane triacrylate, ethoxylated pentaerythritol tetraacrylate, ethoxylated trimethylopropane triacrylate, ethoxylated trimethylopropane triacrylate, propoxylated glyceryl troacrylate, ethoxylated trimethylopropane, triethylene glycol dimethacrylate, ethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, 1,4 butanediol dimethacrylate, diethylene glycol dimethacrylate, 1,6 - hexanediol dimethacrylate, polyethylene glycol dimethacrylate, 1,10 - decanediol dimethacrylate, 1,3-butylene glycol dimethacrylate, trimethylolpropane trimethacrylate, or a composition configured to maintain the predetermined ratio between the first crosslinking agent and the second crosslinking agent. In certain exemplary implementations, the predetermined concentration ratio between the bi-functional crosslinking agent and the tri-functional crosslinking agent is between 1:2 and 3:1.

[0023] Likewise, the linear oligomer has a backbone comprising between about 8 and about 60 monomers having a molecular weight of between about 600 g / mol and about 6000 g / mol. Examples of the oligomers can be, for example, aliphatic urethane diacrylate, aliphatic urethane hexaacrylate, aliphatic urethane triacrylate, aliphatic urethane tetraacrylate, polyester acrylate, polyester hexaacrylate, hyperbranched polyester acrylate, epoxy acrylate, epoxy novolac acrylate, monofunctional aromatic epoxy acrylate, aliphatic epoxy acrylate, modified epoxy acrylate, acrylated amine, amine modified polyether acrylate, aliphatic urethane dimethacrylate, chlorinated polyester acrylate, aliphatic silicone acrylate, or a composition comprising one or more of the foregoing linear oligomers. An example of the oligomers used is illustrated in the following formula:where n is between about 6 and about 58.

[0024] The term “aliphatic” refers in an exemplary implementation, to an organic compound characterized by a straight or branched chain structure that contains saturated carbon bonds and may also contain one or more unconjugated carbon-carbon double bonds. Aliphatic compounds include paraffins, in which all carbon bonds are saturated, and olefins, in which one or more unconjugated C =C double bonds are present.

[0025] In yet another exemplary implementation, the photoinitiator used in the formulations of the dielectric ink disclosed can is 2,4,6-trimethylbenzoyldiphenyl phosphine oxide, 1- Hydroxycyclohexyl-phenyl ketone,Phenylbis (2,4,6-trimethylbenzoyl) phosphine oxide, 2,2-Dimethoxy-2-phenylacetophenone, 2 Hydroxy-2-Methyl- 1 -Phenylpropanone, 2-Hydroxy- 1 - [4- [4-(2-Hydroxy-2-Methylpropionyl)Benzyl)Phenyl)-2-Methylpropan-l-One, l-[4-(2-Hydroxyethoxyl)-Phenyl]-2-Hydroxy-2-Methylpropanone, 2-benzyl-2-(dimethylamino)-4, 1-Butanone, 2-(dimethylamino)-2-[(4- methylphenyl)methyl]-l-[4-(4-morpholinyl)phenyl], bis(2,6-dimethoxybenzoyl)-2,4,4 trimethylpentylphosphine oxide, 2-ethylhexyl 2-([ 1,1’ -biphenyl] -4-ylcarbonyl)benzoate, 2-methyl-l- [4-(methylthio)phenyl]-2-morpholinopropan- 1 -one, 2,2,-dimethoxy-2-phenylacetophenone, oxyphenyl-acetic acid 2-[2-oxo-2-phnyl-acetoxy-ethoxy]ethyl ester, oxy-phenyl acetic acid 2-[2hydroxy- ethoxy] -ethyl ester, or a photoinitiator composition comprising one or more of the foregoing.

[0026] In an exemplary implementation, the dielectric ink composition is comprised of the linear oligomer, which comprises between about 9.0 % (w / w) and about 20.0% (w / w) of the uncured dielectric ink composition; the crosslinking composition comprises between about 5.0 % (w / w) and about 86.0% (w / w) of the uncured dielectric ink composition; and the photoinitiator comprises between about 0.1 % (w / w) and about 5.0% (w / w) of the dielectric uncured ink composition, wherein the fractional concentration of the linear oligomer, the crosslinking composition, and the photoinitiator are configured to complete to 100%. In other words, and as will be readily recognized by the skilledartisan, the fractional concentration of each of the components, once established will limit the fractional concentration of every other component.

[0027] As indicated, in certain exemplary implementations, the dielectric ink compositions disclosed, can further potentially comprise additional components. For example, a filler, such as Coreshell Butadiene Styrene - poly(methylmethacrylate) nanoparticles, Core-shell butyl acrylate - poly(methylmethacrylate) nanoparticles, thermoplastic homo / co polymers of butyl acrylate, thermoplastic homo / co polymers of polybutadiene, Silica nanoparticles, Alumina nanoparticles, nanoclay, or a filler composition comprising one or more of the foregoing. The filler can be incorporated at a concentration of between about 0.1 % (w / w) and about 20.0% (w / w) of the uncured dielectric ink composition. Likewise, the dielectric ink composition can comprise an adhesion promoter, referring to a compound that operable to modify the surface properties of the cured ink making it more amenable to adhere to metals such as silver and copper deposited on the cured dielectric ink. For example, the adhesion promoter can be, for example; acid based adhesion promoter, amine modified acrylates, poly(vinyl pyrrolidone) (PVP), acrylated amine, polyester acrylate, or an adhesion promoter composition comprising one or more of the foregoing. Consequentially, the adhesion promoter can be incorporated at a concentration of between about 0.1 % (w / w) and about 10.0% (w / w) of the uncured dielectric ink composition.

[0028] In an exemplary implementation, the properties of the cured dielectric ink, used to form layers of a printed circuit board, or packaging for an integrated circuits can be tuned by adjusting the amount of the cross-linking composition relative to the amount of oligomer, and the ratio between the bi-functional cross-linking agent and the tri-functional cross-linking agent. These ratios will affect the CTE and impact resistance values. For example, in an exemplary implementation, the higher the fractional concentration of the oligomer, the higher is the impact strength, and the higher the CTE value. Conversely, substantially increasing the fractional concentration of the cross-linking composition will typically lead to a brittle material. Accordingly, and in another exemplary implementation, the fractional concentration of the linear oligomer, the crosslinking composition, and the photoinitiator are configured to impart on the uncured dielectric a set of predetermined physicochemical properties. These properties are shown in the following table:

[0029] TABLE I: UNCURED DIELECTRIC INK PROPERTIES:

[0030] In yet another exemplary implementation, the fractional concentration of the linear oligomer, the crosslinking composition, and the photoinitiator are configured to impart on the cured dielectric a set of predetermined physico-chemical properties. These properties are shown in the following table, as well as FIG.s 1, and 2):TABLE IL CURED DIELECTRIC INK PROPERTIES:

[0031] Accordingly, the fractional concentration of the components is adapted in an exemplary implementation to impart the dielectric ink with physico-chemical characteristics whereby the density ( ?) is about 1.2 g / ml, and the dynamic viscosity (77) of between about 5.0 mPa-s and about 30 mPa-s. In another exemplary implementation, the dynamic viscosity of the dielectric ink composition can each be between about 0.1 and about 30 cP-s (mPa-s), for example the final ink formulation can have a viscosity of 8-12 cP-s at the working temperature, which can be controlled. For example, the dielectric inkjet ink can be between about 5 cP-s and about 25 cP-s, or between about 7 cP-s and about 20 cP s, specifically, between about 8 cP-s and about 15 cP s. Further, the surface energy ( y ) can be configured through formulation to have a dynamic surface tension (referring to a surface tension when an ink-jet ink droplet is formed at the print-head aperture) of between about 25mN / m and about 35 mN / m, for example between about 29 mN / m and about 31 mN / m measured by the du noiiy ring method at 25°C. The dynamic surface tension can be formulated to provide a contact angle with the peelable substrate, the support material, the resin layer(s), or their combination, of between about 1000and about 165°.

[0032] In an exemplary implementation, following curing of the dielectric ink, the cured resin is configured to exhibit a dielectric constant (x) of 2.6-3.0; and a loss factor (Df) of 0.01-0.02.

[0033] In an exemplary implementation, the cured material undergoes reflow processing in order to couple chips, integrated circuits (ICs), or IC packages. The term “chip” refers to an unpackaged, singulated, IC device.

[0034] Reflow typically involves the precise application of heat to solder paste, typically a mixture of solder alloy particles suspended in a flux carrier, deposited onto the pads of the PCB. The PCB (or HDIP, LSI, AME, ICs and the like), with the components already placed on it, is then subjected to controlled heating in a reflow oven. As the temperature rises, the flux activates, removing any oxide layers from the metal surfaces and promoting solder wetting (in other words, reduction in the contact angle) of the pads. Initially, the solder paste transitions to a liquid phase, enabling the solder to flow and adhere to both the component leads and the pads. As the temperature continues to increase, the solder transitions into a solid phase, creating permanent joints. The entire process occurs within carefully controlled thermal profiles, typically consisting of preheat, soak, and reflow zones, ensuring that the components are subjected to the appropriate temperatures for the required duration without exceeding their thermal limits. Proper reflow soldering results in uniform, reliable solder joints with minimal voiding and defects, facilitating the electrical and mechanical integrity of the assembled PCB.

[0035] Typically, reflow soldering involves heating the solder paste to temperatures typically ranging from 200°C to 250°C (392°F to 482°F). In an exemplary implementation, the components printed using the compositions disclosed herein, are configured to undergo soldering reflow at temperatures of between about 200 ° and about 250 °C, for example, between about 220 °C and about 245 °C or at or about 240 °C (see e.g., FIG.s 3A, 3B)

[0036] The term “chip package” may particularly denote a housing that chips come in for plugging into (socket mount) or soldering onto (surface mount) a circuit board such as the high- performance PCBs, HDIPs, ESIs and AMEs, disclosed herein, thus creating a mounting for a chip. Inelectronics, the term chip package or chip carrier may denote the material added around a component or integrated circuit to allow it to be handled without damage and incorporated into a circuit.

[0037] In certain exemplary implementations, a soldering paste can be deposited on the printed and cured components disclosed herein, then undergo soldering and / or reflow without significant warpage. The soldering paste or soldering balls can, for example, be arranged in a grid array pattern wherein the conductive elements or solder balls are of a preselected size or sizes and are spaced apart from each other at one or more preselected distances, or pitches. Hence, the term “fine ball grid array” (FBGA) merely refers to a particular ball grid array pattern having what are considered to be relatively small conductive elements or solder balls being spaced at very small distances from each other resulting in dimensionally small spacing or pitch. As generally used herein, the term “ball grid array” (BGA) encompasses fine ball grid arrays (FBGA) as well as ball grid arrays. Accordingly and in an exemplary implementation, the pattern representative of the conductive ink printed using the methods described herein, is configured to fabricate interconnect (in other words, solder) balls.

[0038] In the context of the disclosure, the term “warpage” means a strain-induced nonplanarity or curvature of an integrated circuit (IC) package (e.g., SMT), a PCB, HDIP, LSI or AME, their surfaces or combination thereof, which may occur during or after assembly, for example, during the reflow process (in other words, the vertical deflection from a horizontal seating plane). The IC package, PCB, HDIP, or AME, or their combination, bows into a concave or convex (or partially convex and concave) profile, where “convex” is generally defined as bowing upward, or toward an attached die and / or stiffener, and where “concave” is generally defined as bowing downward, or away from an attached die and / or stiffener.

[0039] In an exemplary implementation, the dielectric ink composition disclosed herein, is used to form a layer using an inkjet 3D printing system. Accordingly in an exemplary implementation, provided herein is a method for forming a printed circuit board using inkjet printer comprising: providing an ink jet printing system comprising: a first print head, sized and configured to dispense the dielectric ink compositions disclosed herein; a second print head sized and configured to dispense a conductive ink composition; a conveyor, operably coupled to the first, and the second print heads configured to convey a substrate to each of the first, and the second print heads; and a computer aided manufacturing (“CAM”) module having a central processing module (CPM), in communication with the conveyor, and each of the first, and second print heads, the CPM further comprising: at least one processor in communication with a non-transitory computer readable storage medium storing thereoninstructions that, when executed by the at least one processor cause the CPM to control the ink-jet printing system, by carrying out steps that comprise: receiving a 3D visualization file representing the printed circuit board (PCB), or a package for an integrated circuit; generating the library of files representing the substantially 2D layer for printing; providing the dielectric ink composition disclosed, and the conductive ink composition; obtaining from the library a first file, the first file comprising printing instructions for a pattern representative of at least one of: the dielectric ink, and the conductive ink; using the first print head, forming the pattern corresponding to the dielectric ink in the first layer; curing the pattern corresponding to the dielectric ink in the first layer; using the second print head, forming the pattern corresponding to the conductive ink in the first layer; sintering the pattern corresponding to the conductive ink in the first layer; obtaining from the library a subsequent file; the subsequent file comprising printing instructions for a pattern representative of at least one of: the dielectric ink, and the conductive ink in the subsequent layer; repeating the steps of: using the first print head, forming the pattern corresponding to the dielectric ink in the subsequent layer, to the step of sintering the pattern corresponding to the conductive ink in the subsequent layer, to curing and / or sintering the final layer; and removing the substrate.

[0040] The term “forming” (and its variants "formed", etc.) refers in an exemplary implementation to pumping, injecting, pouring, releasing, displacing, spotting, circulating, or otherwise placing a fluid or material (e.g., the dielectric composition ink) in contact with another material (e.g., the substrate, or another layer) using any suitable manner known in the ail.

[0041] Curing the dielectric ink pattern deposited by the appropriate print head as described herein, can be achieved by, for example, heating, photopolymerizing, drying, depositing plasma, annealing, facilitating redox reaction, irradiation by ultraviolet beam or a combination comprising one or more of the foregoing. Curing does not need to be carried out with a single process and can involve several processes either simultaneously or sequentially, (e.g., drying and heating and depositing crosslinking agent with an additional print head)

[0042] Likewise, other functional heads may be located before, between or after the dielectric ink print head. These may include a source of electromagnetic radiation configured to emit electromagnetic radiation at a predetermined wavelength (X), for example, between 190 nm and about 400nm, e.g. 395 nm which in an exemplary implementation, can be used to accelerate and / or modulate and / or facilitate a photopolymerizable constituent used in the dielectric composition ink. Other functional heads can be heating elements, additional printing heads with various inks (e.g., support,label printing of various components for example capacitors, transistors and the like) and a combination of the foregoing.

[0043] Other similar functional steps (and therefore means for affecting these steps) may be taken before or after the dielectric composition polymer ink print head (e.g., for initiating hydrolysis). These steps may include (but not limited to): a heating step (affected by a heating element, or hot air); photobleaching (of a photoresist mask support pattern), photocuring, or exposure to any other appropriate actinic radiation source (using e.g., a UV light source); drying (e.g., using vacuum region, or heating element); (reactive) plasma deposition (e.g., using pressurized plasma gun and a plasma beam controller); prior to coating; annealing, or facilitating redox reactions and their combination regardless of the order in which these processes are utilized. In certain exemplary implementation, a laser, or electron-beam can be used on the dielectric ink compositions disclosed herein.

[0044] In an exemplary implementation, the dielectric ink-jet ink compositions, systems and methods allowing for a direct, continuous or semi-continuous ink-jet printing of dielectric pattem(s) can be patterned by expelling droplets of the liquid ink-jet ink provided herein from an orifice one-at- a-time, as the print-head (or the substrate) is maneuvered, for example in two (X-Y) (it should be understood that the print head can also move in the Z axis) dimensions at a predetermined distance above the removable substrate or any subsequent layer. The height of the print head can be changed with the number of layers, maintaining for example a fixed distance. Each droplet can be configured to take a predetermined trajectory to the substrate on command by, for example a pressure impulse, via a deformable piezo-crystal in an exemplary implementation, from within a well operably coupled to the orifice. The printing of the first inkjet dielectric composition ink can be additive and can accommodate a greater number of layers. The ink-jet print heads provided used in the methods described herein can provide a minimum layer film thickness equal to or less than about 0.3 pm- 10,000 pm

[0045] Similarly, the term "contacting" is used in an exemplary implementation to refer to materials which may be blended, mixed, slurried, dissolved, reacted, treated, or otherwise contacted in some other manner. Therefore, the term "contacting" encompasses the "reacting" of two or more components, and it also encompasses the "mixing" or "blending" of two or more components that do not react with one another.

[0046] The conveyor maneuvering among the various print heads used in the methods described and implementable in the systems described can be configured to move at a velocity ofbetween about 5 mm / sec and about lOOOmm / sec. The velocity of the e.g., chuck can depend, for example, on: the desired throughput, the number of print heads used in the process, the number and thickness of layers of the printed dielectric pattem(s) described herein printed, the curing time of the ink, the evaporation rate of the ink solvents, the distance between the print head(s)

[0047] In an exemplary implementation, the volume of each droplet of the dielectric ink, can range from 0.5 to 300 picoLiter (pL), for example 1-4 pL and depended on the strength of the driving pulse and the properties of the ink. The waveform to expel a single droplet can be a 10V to about 70 V pulse, or about 16V to about 20V, and can be expelled at frequencies between about 2 kHz and about 500 kHz.

[0048] The use of the term “module” does not imply that the components or functionality described or claimed as part of the module are all configured in a (single) common package. Indeed, any or all of the various components of a module, whether control logic or other components, can be combined in a single package or separately maintained and can further be distributed in multiple groupings or packages or across multiple (remote) locations and devices.

[0049] The CAM module can comprise : a 2D file library storing the files converted from the 3D visualization files of the printed circuit board; a processor in communication with the library; a memory device storing a set of operational instructions for execution by the processor; a micromechanical inkjet print head or heads in communication with the processor and with the library; and a print head (or, heads’) interface circuit in communication with the 2D file library, the memory and the micromechanical inkjet print head or heads , the 2D file library configured to provide printer operation parameters specific to a functional layer; pre-processing Computer-Aided Design / Computer- Aided Manufacturing (CAD / CAM) generated information associated with the 3D printed ceramic pattem(s) to be fabricated, thereby obtaining a plurality of 2D file; loading the plurality of 2D file(s) processed in the step of pre-processing from the printed pattem(s) 3D visualization files onto the 2D file library; and using the 2D file library, instructing the processor to print the predetermined layer of the dielectric ink compositions disclosed and their pattem(s) in a predetermined order.

[0050] The 3D visualization file representing the dielectric ink compositions disclosed and their pattem(s) used for the fabrication, can be: an ODB, an ODB++, an. asm, an STL, an IGES, a STEP, a Catia, a SolidWorks, a Autocad, a ProE, a 3D Studio, a Gerber, a Rhino a Altium, an Oread, an or a file comprising one or more of the foregoing; and wherein file that represents at leastone, substantially 2D layer (and uploaded to the library) can be, for example at least one of a JPEG, a GIF, a TIFF, a BMP, a PDF file, or a combination comprising one or more of the foregoing.

[0051] In certain exemplary implementations, the CAM module further comprises a computer program product for fabricating one or more composite objects comprising dielectric pattem(s), for example, an electronic component, machine part, a connector and the like. The printed component / object(s) can comprise at least one of a discrete metallic (conductive) components, and a discrete resinous components that are each and being printed optionally simultaneously or sequentially and continuously. The term “continuous” and its variants are intended to mean printing in a substantially unbroken process. In another exemplary implementation, continuous refers to a layer, member, or structure in which no significant breaks in the layer, member, or structure lie along its length.

[0052] In addition, the computer program, can comprise program code means for carrying out the steps of the methods described herein, as well as a computer program product comprising program code means stored on a medium that can be read by a computer, such as a floppy disk, a hard disk, CD-ROM, DVD, USB memory stick, or a storage medium that can be accessed via a data network, such as the Internet or Intranet, when the computer program product is loaded in the main memory of a computer and is carried out by the computer.

[0053] Memory device(s) as used in the methods described herein can be any of various types of non-volatile memory devices or storage devices (in other words, memory devices that do not lose the information thereon in the absence of power). The term “memory device” is intended to encompass an installation medium, e.g., a CD-ROM, floppy disks, or tape device or a non-volatile memory such as a magnetic media, e.g., a hard drive, optical storage, or ROM, EPROM, FEASH, etc. The memory device may comprise other types of memory as well, or combinations thereof. In addition, the memory medium may be located in a first computer in which the programs are executed (e.g., the 3D inkjet printer provided), and / or may be located in a second different computer which connects to the first computer over a network, such as the Internet. In the latter instance, the second computer may further provide program instructions to the first computer for execution. The term “memory device” can also include two or more memory devices which may reside in different locations, e.g., in different computers that are connected over a network. Accordingly, for example, the bitmap library can reside on a memory device that is remote from the CAM module coupled tothe 3D inkjet printer provided, and be accessible by the 3D inkjet printer provided (for example, by a wide area network).

[0054] Unless specifically stated otherwise, as apparent from the following discussions, it is appreciated that throughout the specification discussions utilizing terms such as “processing,” “loading,” “in communication,” “detecting,” “calculating,” “determining”, “analyzing,” or the like, refer to the action and / or processes of a computer or computing system, or similar electronic computing device, that manipulate and / or transform data represented as physical, such as a transistor architecture into other data similarly represented as physical structural (in other words, PCIN) layers.

[0055] Furthermore, as used herein, the term “2D file library” refers to a given set of files that together define a single PCB or a packaged component, part thereof and the like, used for a given purpose. It is noted that the 2D file library is of the substantially 2D representation image of the 2D layer. The term “2D file library” can also be used to refer to a set of 2D files or any other raster graphic file format (the representation of images as a collection of pixels, generally in the form of a rectangular grid, e.g., BMP, PNG, TIFF, GIF, or a vector map), capable of being indexed, searched, and reassembled to provide the structural layers of a given component not including dielectric pattern(s) whether the search is for the dielectric ink compositions disclosed and their pattern described herein , or a given specific layer without the dielectric ink compositions disclosed and their pattern.

[0056] The Computer-Aided Design / Computer- Aided Manufacturing (CAD / CAM) generated information associated with the dielectric ink compositions disclosed and their pattern(s) described herein to be fabricated, which is used in the methods, programs and libraries can be based on converted CAD / CAM data packages can be, for example, IGES, DXF, DWG, DMIS, NC files, GERBER® files, EXCELLON®, STL, EPRT files, an ODB, an ODB++, an.asm, an STL, an IGES, a STEP, a Catia, a SolidWorks, a Autocad, a ProE, a 3D Studio, a Gerber, a Rhino a Altium, an Oread, an Eagle file or a package comprising one or more of the foregoing. Additionally, attributes attached to the graphics objects transfer the meta-information needed for fabrication and can precisely define the dielectric ink compositions disclosed and their pattern(s) described herein, resulting in an efficient and effective transfer of fabrication data from design (3D visualization CAD e.g.,) to fabrication (CAM e.g.,). Accordingly and in an exemplary implementation, using pre-processing algorithm, GERBER®, EXCELLON®, DWG, DXF, STL, EPRT ASM, and the like as described herein, arc converted to 2D files.

[0057] The term "comprising" and its derivatives, as used herein, are intended to be open ended terms that specify the presence of the stated features, elements, components, groups, integers, and / or steps, but do not exclude the presence of other unstated features, elements, components, groups, integers and / or steps. The foregoing also applies to words having similar meanings such as the terms, "including", "having" and their derivatives.

[0058] All ranges disclosed herein are inclusive of the endpoints, and the endpoints are independently combinable with each other. “Combination” is inclusive of blends, mixtures, alloys, reaction products, and the like. The terms “a”, “an” and “the” herein do not denote a limitation of quantity, and are to be construed to cover both the singular' and the plural, unless otherwise indicated herein or clearly contradicted by context. The suffix “(s)” as used herein is intended to include both the singular and the plural of the term that it modifies, thereby including one or more of that term (e.g., the print head(s) includes one or more print head).

[0059] Reference throughout the specification to “one exemplary implementation”, “another exemplary implementation”, “an exemplary implementation”, and so forth, when present, means that a particular' element (e.g., feature, structure, and / or characteristic) described in connection with the exemplary implementation is included in at least one exemplary implementation described herein, and may or may not be present in other exemplary implementations. In addition, it is to be understood that the described elements may be combined in any suitable manner in the various exemplary implementations .

[0060] Likewise, the term "about" means that amounts, sizes, formulations, parameters, and other quantities and characteristics are not and need not be exact, but may be approximate and / or larger or smaller, as desired, reflecting tolerances, conversion factors, rounding off, measurement error and the like, and other factors known to those of skill in the art. In general, an amount, size, formulation, parameter or other quantity or characteristic is "about" or "approximate" whether or not expressly, stated to be such. It is used to denote an acceptable range higher or lower than the stated figure and no greater than 10% higher or lower in any event. It may also allow for a level of uncertainty or imprecision in devices or instruments used to measure the stated figure. In addition, the term “about” is not meant to limit the disclosed implementations to a strict numerical interpretation and includesranges of the relevant parameter, which does not materially affect the basic characteristics of the exemplary implementation.

[0061] In the context of the disclosure, the term “composite component” refers to components that are composed of at least two components, wherein at least two of the components are of different physical and / or chemical composition. In certain exemplary implementations, more than two components are used to form the composite component. For example, that the composite component can be formed of two dielectric inks, each with different CTE, or one dielectric component and one conductive component and the like. Also contemplated as a composite component is a material containing a reinforcement such as fibers or particles supported in a binder or matrix material formed in an exemplary implementation with the dielectric ink compositions described herein.

[0062] Accordingly and in an exemplary implementation, provided herein is a dielectric ink composition comprised of: a linear oligomer; a crosslinking composition comprising a first crosslinking agent, and a second crosslinking agent at a predetermined concentration (v / v) ratio; and a photoinitiator, wherein (i) the first crosslinking agent is bifunctional and the second crosslinking agent is trifunctional, wherein (ii) the crosslinking composition comprises tricyclodecane dimethanol diacrylate, tricyclodecane dimethanol dimethacrylate, tricyclodecane dimethanol dimethacrylate, tris (2-hydroxy ethyl) isocyanurate triacrylate, polythyleneglycol diacrylate, polythyleneglycol dimethacrylate, 1,6 hexanediol diacrylate, tetraethylene glycol diacrylate, tripropylene glycol diacrylate, polybutadiene diacrylate, 3 methyl 1,5 -pentanediol diacrylate, ethoxylated bisphenol- A diacrylate, dipropylene glycol diacrylate, ethoxylated bisphenol A / F hexanediol diacrylated, 1,10 decanediol diacrylate, esterdiol diacrylate, alkoxylated diacrylate, propoxylated neopentyl glycol diacrylate, pentaerythritol tetraacrylate, trimethyloolpropane triacrylate, di-trimethylopropane tetraacrylate, di-pentaerythritol pentaacrylate, ethoxylated trimethylolpropane triacrylate, ethoxyated trimethylopropane triacrylate, propoxylated trymethylpropane triacrylate, ethoxylated pentaerythritol tetraacrylate, ethoxylated trimethylopropane triacrylate, ethoxylated trimethylopropane triacrylate, propoxylated glyceryl troacrylate, ethoxylated trimethylopropane, triethylene glycol dimethacrylate, ethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, 1,4 butanediol di meth aery I ate, diethylene glycol dimethacrylate, 1,6 - hexanediol dimethacrylate, polyethylene glycol dimethacrylate, 1,10 - decanediol dimethacrylate, 1,3-butylene glycol dimethacrylate, trimethylolpropane trimethacrylate, or a composition configured to maintain the predetermined ratio between the first crosslinking agent and the second crosslinking agent, wherein (iii) the predeterminedconcentration ratio between the bifunctional crosslinking agent and the trifunctional crosslinking agent is between 1:2 and 3:1, wherein (iv) the linear oligomer has a backbone comprising between about 8 and about 60 monomers, (v) the linear oligomer is aliphatic urethane diacrylate, aliphatic urethane hexaacrylate, aliphatic urethane triacrylate, aliphatic urethane tetraacrylate, polyester acrylate, polyester hexaacrylate, hyperbranched polyester acrylate, epoxy acrylate, epoxy novolac acrylate, monofunctional aromatic epoxy acrylate, aliphatic epoxy acrylate, modified epoxy acrylate, acrylated amine, amine modified polyether acrylate, aliphatic urethane dimethacrylate, chlorinated polyester acrylate, aliphatic silicone acrylate, or a composition comprising one or more of the foregoing linear oligomers, wherein (vi) the photoinitiator is 2,4,6-trimethylbenzoyldiphenyl phosphine oxide, 1 -Hydro xycyclohexyl-phenyl ketone,Phenylbis(2,4,6-trimethylbenzoyl) phosphine oxide, 2,2-Dimethoxy-2-phenylacetophenone, 2 Hydroxy-2-Methyl- 1 -Phenylpropanone, 2-Hydroxy- 1 - [4- [4-(2-Hydroxy-2-Methylpropionyl)Benzyl)Phenyl)-2-Methylpropan-l-One, l-[4-(2-Hydroxyethoxyl)-Phenyl]-2- Hydroxy-2-Methylpropanone, 2-BENZYL-2-(DIMETHYLAMINO)-4, 1-Butanone, 2- (dimethylamino)-2-[(4-methylphenyl)methyl]-l-[4-(4-morpholinyl)phenyl], bis(2,6- dimethoxybenzoyl)-2,4,4 trimethylpentylphosphine oxide, 2-ethylhexyl 2-( [1,1’ -biphenyl] -4- ylcarbonyl)benzoate, 2-methyl- l-[4-(methylthio)phenyl]-2-morpholinopropan- 1 -one, 2,2,- dimethoxy-2phenylacetophenone, oxy-phenyl-acetic acid 2-[2-oxo-2-phnyl-acetoxy-ethoxy]ethyl ester, oxy-phenyl acetic acid 2-[2hydroxy-ethoxy]-ethyl ester, or a photoinitiator composition comprising one or more of the foregoing, wherein (vii) the linear oligomer comprises between about 1.0 % (w / w) and about 20.0% (w / w) of the dielectric ink composition; the crosslinking composition comprises between about 5.0 % (w / w) and about 86.0% (w / w) of the dielectric ink composition; and the photoinitiator comprises between about 0.1 % (w / w) and about 5.0% (w / w) of the dielectric ink composition; and water and / or solvent and optionally other auxiliaries are configured to complete to 100% by weight, and (viii) further comprising an optional auxiliary constituent, such as at least one of a filler, an adhesion promoter, a viscosity diluent and the like, for example, (ix) the filler is Coreshell Butadiene Styrene - poly(methylmethacrylate) nanoparticles, Core-shell butyl acrylate - poly (methylmethacrylate) nanoparticles, thermoplastic homo / co polymers of butyl acrylate, thermoplastic homo / co polymers of poly butadiene, Silica nanoparticles, Alumina nanoparticles, nanoclay, or a filler composition comprising one or more of the foregoing, wherein (x) the filler comprises between about 0.1 % (w / w) and about 20.0% (w / w) of the dielectric ink composition, wherein (xi) theadhesion promoter is acid-based adhesion promoter, amine modified acrylates, acrylated amine, polyester acrylate, or an adhesion promoter composition comprising one or more of the foregoing, comprising (xii) between about 0.1 % (w / w) and about 10.0% (w / w) of the dielectric ink composition, wherein (xiii) the fractional concentration of the linear oligomer, the crosslinking composition, and the photoinitiator are configured to impart on the dielectric ink a set of predetermined physicochemical properties once cured, (xiv) the predetermined physico-chemical properties are at least one of: a density ( / ?) of about 1.2 g / ml, and a dynamic viscosity (77) of between about 5.0 mPa-s and about 30 mPa-s, wherein (xv) the fractional concentration of the linear oligomer, the crosslinking composition, and the photoinitiator are configured, when cured to impart on the dielectric ink a set of predetermined physico-chemical properties, and wherein (xvi) the predetermined physico-chemical properties are at least one of: a coefficient of thermal expansion of below 80 ppm / °C at temperature range of between 140°C and 230 °C, a glass transition temperature (Tg) of between about 160° and about 200°C, for example, 190 °C, a flexural strength of about 140 N / mm2, impact strength of about 300, and a Young modulus of 3.5 GPa.

[0063] In another exemplary implementation, provided herein is a composite component comprising the dielectric pattern formed by the dielectric ink compositions disclosed herein, (xv) being at least one of: a printed circuit board (PCB), a flexible printed circuit (FPC), a high-density interconnect PCB (HDIP), and a large-scale integrated systems (LSIS), wherein the at least one of: the PCB, the FPC, the HDIP, and the LSIS further comprises an integrated circuit coupled thereto using a reflow process, and wherein (xvi) the reflow process is carried out at a temperature between 220 °C and 240 °C.

[0064] Although the foregoing disclosure for compositions of dielectric ink composition having certain physico-chemical properties has been described in terms of some exemplary implementations, other exemplary implementations will be apparent to those of ordinary skill in the art from the disclosure herein. Moreover, the described exemplary implementations have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel methods, programs, libraries and systems described herein may be embodied in a variety of other forms without departing from the spirit thereof. Accordingly, other combinations, omissions, substitutions and modifications will be apparent to the skilled artisan in view of the disclosure herein.

Claims

What is claimed:

1. A dielectric ink composition comprised of: a) a linear oligomer; b) a crosslinking composition comprising a first crosslinking agent, and a second crosslinking agent at a predetermined concentration (v / v) ratio; and c) a photoinitiator.2 The dielectric ink composition of claim 1, wherein the first crosslinking agent is bifunctional and the second crosslinking agent is trifunctional.3 The dielectric ink composition of claim 2, wherein the crosslinking composition comprises tricyclodecane dimethanol diacrylate, tricyclodecane dimethanol dimethacrylate, tricyclodecane dimethanol dimethacrylate, tris (2-hydroxy ethyl) isocyanurate triacrylate, polythyleneglycol diacrylate, polythyleneglycol dimethacrylate, 1,6 hexanediol diacrylate, tetraethylene glycol diacrylate, tripropylene glycol diacrylate, polybutadiene diacrylate, 3 methyl 1,5 -pentanediol diacrylate, ethoxylated bisphenol-A diacrylate, dipropylene glycol diacrylate, ethoxylated bisphenol A / F hexanediol diacrylated, 1,10 decanediol diacrylate, esterdiol diacrylate, alkoxylated diacrylate, propoxylated neopentyl glycol diacrylate, pentaerythritol tetraacrylate, trimethyloolpropane triacrylate, di-trimethylopropane tetraacrylate, di-pentaerythritol pentaacrylate, ethoxylated trimethylolpropane triacrylate, ethoxyated trimethylopropane triacrylate, propoxylated trymethylpropane triacrylate, ethoxylated pentaerythritol tetraacrylate, ethoxylated trimethylopropane triacrylate, ethoxylated trimethylopropane triacrylate, propoxylated glyceryl troacrylate, ethoxylated trimethylopropane, triethylene glycol dimethacrylate, ethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, 1 ,4 butanediol dimethacrylate, diethylene glycol dimethacrylate, 1,6 - hexanediol dimethacrylate, polyethylene glycol dimethacrylate, 1,10 - decanediol dimethacrylate, 1,3-butylene glycol dimethacrylate, trimethylolpropane trimethacrylate, or a composition configured to maintain the predetermined ratio between the first crosslinking agent and the second crosslinking agent.4 The dielectric ink composition of claim 1, wherein the predetermined concentration ratio between the bifunctional crosslinking agent and the trifunctional crosslinking agent is between 1:2 and 3:1.

5. The dielectric ink composition of claim 1 , wherein the linear oligomer has a backbone comprising between about 8 and about 60 monomers.

6. The dielectric ink composition of claim 5, wherein the linear oligomer is aliphatic urethane diacrylate, aliphatic urethane hexaacrylate, aliphatic urethane triacrylate, aliphatic urethane tetraacrylate, polyester acrylate, polyester hexaacrylate, hyperbranched polyester acrylate, epoxy acrylate, epoxy novolac acrylate, monofunctional aromatic epoxy acrylate, aliphatic epoxy acrylate, modified epoxy acrylate, acrylated amine, amine modified polyether acrylate, aliphatic urethane dimethacrylate, chlorinated polyester acrylate, aliphatic silicone acrylate, or a composition comprising one or more of the foregoing linear oligomers.7 The dielectric ink composition of claim 5, wherein the photoinitiator is 2,4,6- trimethylbenzoyldiphenyl phosphine oxide, 1-Hydroxycyclohexyl-phenyl ketone, Phenylbis(2,4,6-trimethylbenzoyl) phosphine oxide, 2,2-Dimethoxy-2-phenylacetophenone, 2 Hydroxy-2-Methyl- 1 -Phenylpropanone, 2-Hydroxy- 1 - [4- [4-(2-Hydroxy-2- Methylpropionyl)Benzyl)Phenyl)-2-Methylpropan- 1 -One, 1 - [4-(2-Hydroxyethoxyl)-Phenyl] -2- Hydroxy-2-Methylpropanone, 2-BENZYL-2-(DIMETHYLAMINO)-4, 1-Butanone, 2- (dimethylamino)-2-[(4-methylphenyl)methyl]-l-[4-(4-morpholinyl)phenyl], bis(2,6- dimethoxybenzoyl)-2,4,4 trimethylpentylphosphine oxide, 2-ethylhexyl 2-([l,l’-biphenyl]-4- ylcarbonyl)benzoate, 2-methyl-l-[4-(methylthio)phenyl]-2-morpholinopropan-l-one, 2,2,- dimethoxy-2phenylacetophenone, oxy-phenyl-acetic acid 2-[2-oxo-2-phnyl-acetoxy-ethoxy]ethyl ester, oxy-phenyl acetic acid 2-[2hydroxy-ethoxy]-ethyl ester, or a photoinitiator composition comprising one or more of the foregoing.8 The dielectric ink composition of claim 1, wherein: a) the linear oligomer comprises between about 1.0 % (w / w) and about 20.0% (w / w) of the dielectric ink composition; b) the crosslinking composition comprises between about 5.0 % (w / w) and about 86.0% (w / w) of the dielectric ink composition; and c) the photoinitiator comprises between about 0.1 % (w / w) and about 5.0% (w / w) of the dielectric ink composition; and d) water and / or solvent and optionally other auxiliaries are configured to complete to 100% by weight.9 The dielectric ink composition of claim 8, further comprising a filler.

10. The dielectric ink composition of claim 9, wherein the filler is Core-shell Butadiene Styrene - poly(mcthylmcthacrylatc) nanoparticlcs, Core-shell butyl acrylate - poly (methylmethacrylate) nanoparticles, thermoplastic homo / co polymers of butyl acrylate, thermoplastic homo / co polymers of polybutadiene, Silica nanoparticles, Alumina nanoparticles, nano-clay, or a filler composition comprising one or more of the foregoing.

11. The dielectric ink composition of claim 10, wherein the filler comprises between about 0.1 % (w / w) and about 20.0% (w / w) of the dielectric ink composition.

12. The dielectric ink composition of claim 8, further comprising an adhesion promoter.

13. The dielectric ink composition of claim 12, wherein the adhesion promoter is acid-based adhesion promoter, amine modified acrylates, acrylated amine, polyester acrylate, or an adhesion promoter composition comprising one or more of the foregoing.

14. The dielectric ink composition of claim 13, wherein the adhesion promoter comprises between about 0.1 % (w / w) and about 10.0% (w / w) of the dielectric ink composition.

15. The dielectric ink composition of claim 8, wherein the fractional concentration of the linear oligomer, the crosslinking composition, and the photoinitiator are configured to impart on the dielectric ink a set of predetermined physico-chemical properties once cured.

16. The dielectric ink composition of claim 15, wherein the predetermined physico-chemical properties are at least one of: a density ( / ?) of about 1.2 g / ml, and a dynamic viscosity ( ) of between about 5.0 mPa-s and about 30 mPa-s.

17. The dielectric ink composition of claim 8, wherein the fractional concentration of the linear oligomer, the crosslinking composition, and the photoinitiator are configured, when cured to impart on the dielectric ink a set of predetermined physico-chemical properties.

18. The dielectric ink composition of claim 15, wherein the predetermined physico-chemical properties are at least one of: a coefficient of thermal expansion of below 80 ppm / °C at temperature range of between 140°C and 230 °C, a glass transition temperature of between about 160° and about 200°C, a flexural strength of about 140 N / mm2, impact strength of about 300, and a Young modulus of 3.5 GPa.

19. A composite component comprising the dielectric pattern formed by the dielectric ink compositions of any one of claims 1-18.

20. The composite component of claim 19, being at least one of: a printed circuit board (PCB), a flexible printed circuit (FPC), a high-density interconnect PCB (HDIP), and a large-scale integrated systems (LSIS).

21. The composite component of claim 20, wherein the at least one of: the PCB, the FPC, the HDIP, and the LSIS further comprises an integrated circuit coupled thereto using a reflow process.

22. The composite component of claim 21, wherein the reflow process is carried out at a temperature between 220 °C and 240 °C.

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