Monitoring device, monitoring arrangement and monitoring method for determining processing parameters of a processing laser beam

Abstract

The invention relates to a monitoring device (16) for monitoring and adjusting processing parameters of a processing laser beam (12) of a laser processing machine (14), comprising an imaging unit (18) and a converter medium (20) for arrangement in a beam path (24) of the processing laser beam (12); wherein the converter medium (20) is designed to absorb laser radiation (38) of the processing laser beam (12) and to emit measurement radiation (40); wherein the imaging unit (18) is designed to at least partially detect the measurement radiation (40) and to generate a measurement radiation image (50). The invention further relates to a monitoring arrangement (10) and to a monitoring method (84).

Description

[0001] Monitoring device, monitoring arrangement and monitoring method for determining processing parameters of a processing laser beam

[0002] The invention relates to a monitoring device for determining processing parameters of a processing laser beam. The invention also relates to a monitoring arrangement and a monitoring method.

[0003] When processing materials using laser processing machines, it is crucial for high-quality processing to maintain production-relevant processing parameters within a narrow tolerance range. Of primary importance are typically the focus position of the processing laser beam and the beam position of the processing laser beam in the exit aperture of a processing head of the laser processing machine.

[0004] Therefore, laser processing machines often provide for the processing parameters, in particular the focus position and / or the beam position in the exit opening, to be monitored by an operator and, if necessary, adjusted by - often manually - adjusting the optical function groups.

[0005] EP 2 687 317 A1 describes a laser processing machine and a method for centering a focused laser beam in a nozzle opening. A primary beam is moved transversely to the nozzle opening until it strikes a beam treatment unit attached to the edge of the nozzle opening. A centered position of the nozzle opening can then be determined from the edge determination of the nozzle opening. The beam treatment unit is designed to convert the primary beam into a secondary electromagnetic beam, which is detected by a sensor.

[0006] DE 10 2007 013623 A1 describes a method and a device for aligning a laser beam in a nozzle bore. The laser beam is moved within the nozzle bore until it reaches an edge point. Reaching the edge point is detected by measuring reflected laser radiation. By repeatedly moving to the edge of the nozzle bore, a center of the nozzle bore is determined for central alignment of the laser beam.

[0007] The known devices and methods primarily use the edge of the nozzle opening to determine the processing parameters. However, this carries the risk of significant wear on the nozzle, especially with increasing laser power, resulting in increased maintenance effort and avoidable repair costs.

[0008] Furthermore, to determine the laser beam position in the nozzle, the laser beam must be moved relative to the nozzle. In other words, the processing parameter, in this case the beam position, must be changed for the measurement itself, which results in further measurement inaccuracies.

[0009] In addition, the nozzle of laser processing machines is a wear part. Attaching the measuring equipment to the nozzle increases operating costs. An alternative use of a calibration nozzle that can be mounted on the laser processing machine for measurement results in lost time and potential measurement inaccuracies, since the opening of the calibration nozzle must be in the same position as the opening of the processing nozzle.

[0010] Furthermore, the described prior art processes inherently involve a design of the nozzle geometry that generates significant back reflections. However, this contradicts the goal of a laser processing process that is as reflection-free as possible.

[0011] DE 10 2021 204 313 A1 describes a method and a system for manufacturing microstructured components, wherein laser beam properties are monitored using a separate analysis group below a processing plane. However, the known method and system are technically complex and cost-intensive. It is an object of the invention to provide a method and a device for quickly, reliably, and yet technically simple adjustment of processing parameters of the processing laser.

[0012] This object is achieved according to the invention by a monitoring device having the features of patent claim 1. The object is also achieved by a monitoring arrangement having the features of patent claim 8. Furthermore, the object is achieved by a monitoring method having the features of patent claim 11. The subclaims represent preferred embodiments of the invention.

[0013] According to the invention, a monitoring device is provided.

[0014] The monitoring device is designed to monitor and adjust processing parameters of a processing laser beam of a laser processing machine.

[0015] Processing parameters are understood above and below to include, for example, a focus position of the processing laser beam, an orientation of the processing laser beam, and / or caustic parameters of the processing laser beam. Caustic parameters refer to parameters of the beam development in a propagation direction of the processing laser beam.

[0016] The monitoring device comprises a converter medium. The converter medium is designed for arrangement in a beam path of the processing laser. Furthermore, the converter medium is designed to absorb laser radiation from the processing laser beam and to emit measuring radiation. In other words, the converter medium is designed to emit measuring radiation when irradiated by the processing laser. The measuring radiation typically has a wavelength that differs from the wavelength of the laser radiation from the processing laser beam. The converter medium can be designed, for example, as a photosensitive ceramic. A photosensitive ceramic typically has a ceramic carrier structure with a photosensitive coating. The photosensitive coating is typically designed to emit measuring radiation when excited by laser radiation.

[0017] The converter medium is typically designed for placement and / or attachment in or near a processing area of ​​the processing laser beam. In other words, the converter medium can be designed for placement in front of a processing nozzle of the laser processing machine. Preferably, the converter medium is movable in an arrangement at the processing area.

[0018] This allows the transducer medium to be placed and processing parameters to be determined particularly quickly.

[0019] The monitoring device also comprises at least one imaging unit. The imaging unit is designed to at least partially capture the measurement radiation emitted by the converter medium. Furthermore, the imaging unit is designed to generate a measurement radiation image based on the captured measurement radiation.

[0020] In summary, the underlying problem is solved in a particularly simple manner by a monitoring device. Using a converter medium positioned directly in the beam path of the processing laser beam, the processing laser beam can be imaged and the processing parameters can be determined. The monitoring device thus reduces the time required to determine the processing parameters.

[0021] Furthermore, the monitoring device is technically simple, which helps keep integration costs low. In particular, by converting laser radiation from a wavelength range that is only inadequately detectable into measurement radiation in a wavelength range that is easily detectable, a technically more cost-effective imaging unit can be used. Furthermore, existing sensors or sensor groups can be used for the imaging unit, further reducing costs.

[0022] The monitoring device is further designed to automatically perform a processing parameter determination, thereby reducing the dependence on human operators and increasing the degree of automation of laser processing machines while maintaining high manufacturing quality.

[0023] A preferred embodiment of the monitoring device provides that the imaging unit has at least one photodiode for detecting the absolute radiation intensity of the measuring radiation. This allows the focal position of the processing laser beam to be determined using particularly simple technical means.

[0024] In a particularly preferred embodiment of the monitoring device, the imaging unit has at least one camera chip for imaging a spatially resolved radiation intensity profile. This allows the beam position and / or other beam parameters, in particular caustic parameters, of the processing laser beam to be determined. To determine the beam position, position information about a nozzle edge of a processing nozzle of the laser processing machine can be provided. This allows the spatially resolved radiation intensity profile to be evaluated relative to the nozzle edge. This enables the centering of the processing laser beam within the processing nozzle. In a special embodiment, the nozzle edge can be determined from the image of the spatially resolved radiation intensity profile, e.g., an imaging edge.

[0025] Further preferred is an embodiment of the monitoring device in which the converter medium is designed to absorb infrared laser radiation. This allows the monitoring device to be used on high-performance laser processing machines.

[0026] Also preferred is an embodiment of the monitoring device in which the converter medium is designed to emit measuring radiation in the visible or near-infrared wavelength range. By emitting measuring radiation in the visible or near-infrared wavelength range, particularly inexpensive and high-quality components can be used to detect the measuring radiation in the imaging unit.

[0027] In a preferred embodiment of the monitoring device, the converter medium is designed as a converter card. A converter card can be positioned particularly quickly in the beam path of the processing laser beam and replaced cost-effectively if necessary.

[0028] A further preferred embodiment is one in which the monitoring device comprises a beam attenuation unit, wherein the beam attenuation unit is arranged upstream of the converter medium in the direction of propagation of the processing laser beam. This allows the monitoring device to be used to determine processing parameters of high-energy processing laser beams.

[0029] The underlying task is also solved by a monitoring order.

[0030] The monitoring arrangement is designed to monitor and adjust processing parameters of a processing laser beam of a laser processing machine.

[0031] The monitoring arrangement comprises a monitoring device as described above and below. Furthermore, the monitoring arrangement comprises a processing head for a laser processing machine. Typically, the processing head comprises an exit opening defined by a processing nozzle, through which the processing laser beam is directed onto a process area.

[0032] According to the invention, the imaging unit of the monitoring device is arranged or formed in the processing head. In other words, the monitoring device is arranged or formed at least partially within the processing head. Typically, a sensor system of the processing head present in the processing head can be used to form the imaging unit.

[0033] In a preferred embodiment of the monitoring arrangement, the converter medium is arranged downstream of the exit opening of the processing head in a propagation direction of the processing laser beam. The imaging unit of the monitoring device is designed to image the measuring radiation delimited by the exit opening. In other words, the imaging unit can detect the emitted measuring radiation reflected through the exit opening, thereby imaging the exit opening and / or the processing laser beam on the converter medium in the measuring radiation image.

[0034] In a preferred embodiment, the monitoring arrangement comprises a process illumination arranged within the processing head. The process illumination is typically directed toward the exit opening of the processing nozzle, with the processing nozzle reflecting the process illumination radiation and preferably at least partially redirecting it toward the imaging unit.

[0035] The imaging unit is typically designed to image the process illumination radiation reflected by the processing nozzle.

[0036] This allows both the measurement radiation and the process illumination radiation to be captured by the imaging unit. This enables the evaluation of the position of the nozzle edge or exit opening relative to the position of the laser beam. Centering of the processing laser beam within the processing nozzle can thus be carried out with exceptional reliability.

[0037] A preferred embodiment of the monitoring arrangement is one in which the processing head has at least one partially transmissive deflection mirror for aligning the processing laser beam onto the transducer medium. The imaging unit of the monitoring device is typically arranged behind the partially transmissive deflection mirror, and the partially transmissive deflection mirror is designed to transmit the measuring radiation.

[0038] The underlying task is further solved by a monitoring procedure.

[0039] The monitoring method is designed to monitor and adjust processing parameters of a processing laser beam of a laser processing machine.

[0040] Preferably, the monitoring method is carried out using a monitoring arrangement described above and below with a monitoring device described above and below.

[0041] The monitoring procedure includes at least the following procedural steps:

[0042] In a method step a) of the monitoring method, the processing laser beam is aligned to a converter medium, whereby laser radiation of the processing laser beam is absorbed by the converter medium and measuring radiation is emitted by the converter medium.

[0043] A subsequent method step b) of the monitoring method provides for generating a measurement radiation image using an imaging unit by detecting the measurement radiation emitted by the converter medium. A further method step c) of the monitoring method provides for determining at least one processing parameter of the processing laser beam by evaluating the measurement radiation image. Preferably, several processing parameters are determined.

[0044] In particular, process steps a) to c) can be performed multiple times by varying the position of optical elements in the processing head relative to each other or to the transducer medium. This can increase measurement accuracy.

[0045] In a method step d) of the monitoring method, the at least one determined processing parameter is output. The output can be made, for example, to an operator. Preferably, the output is made to a machine control system of the laser processing machine, with the processing parameters particularly preferably being set automatically.

[0046] In a preferred embodiment of the monitoring method, a beam position of the processing laser beam in the exit opening of the processing head is determined by evaluating the measurement radiation image. The evaluation is preferably carried out graphically using suitable image analysis algorithms.

[0047] Further preferred is an embodiment of the monitoring method in which a focus position of the processing laser beam is determined from the measuring radiation image, in particular by determining the absolute radiation intensity and / or the spatial extent of the measuring radiation image.

[0048] Further advantages of the invention will become apparent from the description and the drawings. Likewise, the above-mentioned and further-described features can be used individually or in combination in any desired manner. The embodiments shown and described are not intended to be exhaustive, but rather are exemplary in nature for describing the invention.

[0049] Detailed description of the invention and drawing

[0050] Fig. 1 shows a schematic representation of a monitoring arrangement with a monitoring device and a processing laser beam directed onto a transducer medium.

[0051] Fig. 2 schematically shows a wavelength spectrum of the processing laser beam and a detectable wavelength spectrum of the monitoring device.

[0052] Fig. 3 shows schematically a wavelength spectrum detectable by the converter medium as well as an emitted wavelength spectrum.

[0053] Fig. 4 shows a schematic representation of a measurement radiation image created by the monitoring device.

[0054] Fig. 5 shows a schematic diagram of a monitoring method for monitoring and adjusting processing parameters of a processing laser beam.

[0055] Fig. 1 shows a monitoring arrangement 10 according to the invention.

[0056] The monitoring arrangement 10 is designed to monitor and adjust processing parameters of a processing laser beam 12 of a laser processing machine 14.

[0057] The monitoring arrangement 10 has at least one monitoring device 16 designed to monitor and adjust processing parameters of the processing laser beam 12. The monitoring device 16 comprises at least one imaging unit 18 and a converter medium 20.

[0058] The monitoring device 16, in particular the imaging unit 18, can, as shown, be arranged in the laser processing machine 14, in particular in a processing head 22 of the laser processing machine 14 and / or be formed integrally in the laser processing machine 14 or the processing head 22.

[0059] The converter medium 20 is designed for arrangement in a beam path 24 of the processing laser beam 12 and, as shown, is arranged in the beam path 24 of the processing laser beam 12 of the monitoring arrangement 10. As shown, the beam path 24 of the processing laser beam 12 extends from a beam generator unit 26 through the processing head 22 to the converter medium 20. In other words, according to the monitoring arrangement 10 shown, the converter medium 20 is arranged downstream of an exit opening 27 of the processing head 22 in a propagation direction of the processing laser beam 12.

[0060] Typically, the processing head 22 comprises, in addition to a first deflection mirror 28 and a second deflection mirror 30 for deflecting the processing laser beam 12, a collimation unit 32 for parallel alignment of the processing laser beam 12 and a focusing unit 34 for focusing the processing laser beam 12 in a focus position 36.

[0061] The converter medium 20 is designed to absorb laser radiation 38 (see Fig. 2) of the processing laser beam 12 and to emit measuring radiation 40. As shown, the converter medium 20 is designed as a converter card 42. Typically, the converter medium 20 is positioned near a designated processing position for a workpiece to be processed (not shown). As shown, the converter medium 20 is arranged on a workpiece support 44. This allows for particularly precise adjustment of the processing parameters with respect to a subsequent processing position.

[0062] Alternatively or additionally, the converter medium can be placed outside the typical processing area of ​​the laser or, in particular, can be designed to be movable into and out of the processing area, in an automated manner. This can further reduce manual intervention and increase the level of automation.

[0063] The converter medium 20 is configured to absorb laser radiation 38 and emit measuring radiation 40 when irradiated by the processing laser beam 12. The imaging unit 18 is, as shown, designed to at least partially capture the measuring radiation 40 reflected back—here through the exit opening 27 of the processing head 22. In other words, the measuring radiation 40, which is limited by the aperture effect of a processing nozzle 46 having the exit opening 27, is captured by the imaging unit 18.

[0064] Typically, the measuring radiation 40 radiates through the focusing unit 34 and the partially transmissive second deflection mirror 30 along the measuring beam path 48. The partially transmissive second deflection mirror 30 is thus designed to deflect the processing laser beam 12 and to transmit the measuring radiation 40. The measuring beam path 48 is typically opposite the beam path 24 of the processing laser beam 12.

[0065] The imaging unit 18 preferably comprises at least one photodiode for detecting an absolute radiation intensity of the measuring radiation 40. A photodiode enables the particularly cost-effective determination of the focus position 36 of the processing laser beam 12. The imaging unit 18 particularly preferably comprises at least one camera chip for imaging a spatially resolved radiation intensity profile of the measuring radiation 40. This allows the determination of the beam position and other beam parameters, for example, caustic parameters of the processing laser beam 12. The beam position can preferably be determined by providing the position of the exit opening 27. The position of the exit opening 27 can be provided, for example, by illuminating the processing nozzle 26 and detecting reflected process illumination radiation at the imaging unit 18.

[0066] The imaging unit 18 is designed to generate a measuring radiation image 50 (see Fig. 4) from the detected emitted measuring radiation 40.

[0067] Typically, the monitoring device 16 includes an evaluation unit 52. The evaluation unit 52 can be formed integrally in the imaging device 18 or as a separate device. The evaluation unit 52 is typically designed to exchange data with the imaging unit 18. The data exchange can be wired and / or wireless.

[0068] The evaluation unit 52 is preferably designed to evaluate the measurement radiation image 50. Particularly preferably, the evaluation unit 52 is designed to adjust processing parameters. This allows the degree of automation to be increased.

[0069] In a particular embodiment, the monitoring device 16 comprises a beam attenuation unit 54. The beam attenuation unit 54 is typically designed to reduce the energy intensity of the processing laser beam 12 in order to prevent damage or increased wear of the converter medium 20. The beam attenuation unit 54 is typically arranged in the beam path 28, in particular directly in front of the converter medium 20.

[0070] The beam attenuation unit 54 may include a beam splitter (not shown) and a beam trap (not shown) configured to divert a predetermined radiation portion from the processing laser beam 12. Fig. 2 shows a spectrum 56, wherein a radiation emission 58 and a radiation sensitivity 60 are plotted against a wavelength 62.

[0071] The spectrum 56 illustrates the different wavelength ranges of the laser radiation 38 emitted by the processing laser 12 and the measuring radiation 40 detectable by the imaging unit 18. While a processing laser beam 12 emits laser radiation 38 in a first wavelength range 64, the imaging unit 18 is typically designed to detect measuring radiation 40 in a second wavelength range 66. This allows the deflection mirror 30 to completely reflect the radiation of the processing laser beam 12, allowing the radiation to be fully utilized in the processing process. Direct detection of the laser radiation 38 by an imaging unit 18 is technically complex.

[0072] Fig. 3 shows a spectrum 68 of the converter medium 20 (see Fig. 1 ).

[0073] As illustrated, the converter medium 20 is typically configured to absorb laser radiation 38 in a first wavelength range 64. Furthermore, the converter medium 20 is configured to emit measurement radiation 40 in the second wavelength range 66 by absorbing the laser radiation 38. In other words, the converter medium 20 is configured to transform laser radiation 38, which cannot be detected by the imaging unit 18, into measurement radiation 40, which can be detected by the imaging unit 18.

[0074] Preferably, the converter medium 20 is configured to absorb infrared laser radiation 38 and / or to emit measurement radiation 40 in the visible or near-infrared wavelength range. By emitting measurement radiation 40 in the visible or near-infrared wavelength range, detecting the measurement radiation 40 can be kept particularly simple from a technical perspective. Fig. 4 shows a measurement radiation image 50 created by the imaging unit 18. The measurement radiation image 50 can be created in a monitoring arrangement 10 according to Fig. 1.

[0075] The measurement radiation image 50 has an image boundary 72, which can be formed, for example, by limiting the measurement radiation 40 (see Fig. 1) by the processing nozzle 46 (see Fig. 1). An evaluation can provide for the image boundary 72 to be determined as a reference line for the edge of the outlet opening 27. The position of the image boundary 72 can be determined, for example, using a process illumination integrated into the processing head 14 in the imaging unit 18.

[0076] In addition, the measurement radiation image 50 has a concentration region 74 with a high measurement radiation intensity. An evaluation may provide for the concentration region 74 to be determined as the processing region of the processing laser beam 12.

[0077] Furthermore, an evaluation of the measurement radiation image 50 can provide for the determination of a center point 76 of the concentration region 74. Preferably, a center point 78 of the image boundary 72 is also determined. This allows a deflection of the concentration region 74 from the center of the image boundary 72 to be determined, which typically corresponds to a displacement of the processing laser beam 12 from the center of the exit opening 27.

[0078] In addition, an evaluation can provide for the area 80 of the concentration region 74 to be determined with varying focus settings in the processing head 14 or with varying distances between the processing head 14 and the converter medium 20. This allows, for example, the focus position 36 (see Fig. 1) of the processing laser beam 12 to be determined relative to the position of the converter medium 20. Knowing the distance between the processing head 14 and the converter medium 20, the focus position 36 can thus be determined relative to the position of the exit opening 27 of the processing head 14. Furthermore, an evaluation can provide for an ideal concentration region 82 to be determined in the measurement radiation image 50 and compared with the concentration region 74. Knowing the deviation of the concentration region 74 from the ideal concentration region 82 allows a beam deformation, or at least one caustic parameter, of the processing laser beam 12 to be determined.

[0079] Fig. 5 shows schematically a monitoring method 84.

[0080] The monitoring method 84 is designed to monitor and adjust processing parameters of a processing laser beam 12 (see Fig. 1) of a laser processing machine 14 (see Fig. 1). Preferably, the monitoring method 84 is designed to monitor and adjust processing parameters using a monitoring arrangement 10 (see Fig. 1) described above and below.

[0081] The monitoring procedure 84 comprises at least the following procedural steps:

[0082] In a method step 86 of the monitoring method 10, the processing laser beam 12 is aligned with a converter medium 20 (see Fig. 1). Typically, by irradiating the converter medium 20, laser radiation 38 (see Fig. 2) of the processing laser beam 12 is absorbed by the converter medium 20, and measuring radiation 40 (see Figs. 1 and 3) is emitted from the converter medium 20.

[0083] A further method step 88 of the monitoring method 84 provides for the generation of a measuring radiation image 50 (see Fig. 4) by means of an imaging unit 18 (see Fig. 1) by detecting the measuring radiation 40 emitted by the converter medium 20. In addition, a method step 90 of the monitoring method 84 provides for determining at least one processing parameter of the processing laser beam 12 by evaluating the measuring radiation image 50. Preferably, a beam position of the processing laser beam 12 in the exit opening 27 (see Fig. 1) of the processing head 22 (see Fig. 1) is determined by evaluating the measuring radiation image 50.

[0084] Further preferably, a focus position 36 (see Fig. 1 ) of the processing laser beam 12 is determined by determining the absolute radiation intensity from the measuring radiation image 50.

[0085] In a further method step 92, the output of the at least one determined processing parameter is provided. Output can be performed, for example, by graphical output to an operator. Preferably, output is performed, in particular automatically, to the laser processing machine, allowing the processing parameters to be adjusted, in particular automatically.

[0086] List of reference symbols

[0087] Monitoring arrangement Processing laser beam Laser processing machine Monitoring device Imaging unit Converter medium Processing head Beam path Beam generator unit First deflection mirror Second deflection mirror Collimation unit Focusing unit Focus position Laser radiation Measuring radiation Converter card Workpiece support Processing nozzle Measuring beam path Measuring radiation imaging Evaluation unit Beam attenuation unit Spectrum Radiation emission

[0088] Radiation sensitivity Wavelength first wavelength range second wavelength range

[0089] Spectrum of the third wavelength range

[0090] Image border

[0091] Concentration range

[0092] Center

[0093] Center

[0094] Area of ​​ideal concentration range

[0095] Monitoring procedures

[0096] Process step

[0097] Process step

[0098] Process step

[0099] Process step

Claims

Patent claims 1. Monitoring device (16) for monitoring and adjusting processing parameters of a processing laser beam (12) of a laser processing machine (14), comprising an imaging unit (18) and a converter medium (20) for arrangement in a beam path (24) of the processing laser beam (12), wherein the converter medium (20) is designed to absorb laser radiation (38) of the processing laser beam (12) and to emit measuring radiation (40), and the imaging unit (18) is designed to at least partially detect the measuring radiation (40) and to generate a measuring radiation image (50).

2. Monitoring device (16) according to claim 1, wherein the imaging unit (18) has at least one photodiode for detecting an absolute radiation intensity of the measuring radiation (40).

3. Monitoring device (16) according to claim 1 or 2, wherein the imaging unit (18) has at least one camera chip for imaging a spatially resolved radiation intensity profile of the measuring radiation (40).

4. Monitoring device (16) according to one of the preceding claims, wherein the converter medium (20) is designed to absorb infrared laser radiation (38).

5. Monitoring device (16) according to one of the preceding claims, wherein the converter medium (20) is designed to emit measuring radiation (40) in the visible or near-infrared wavelength range.

6. Monitoring device (16) according to one of the preceding claims, wherein the converter medium (20) is designed as a converter card (42).

7. Monitoring device (16) according to one of the preceding claims, comprising a beam attenuation unit (54), wherein the beam attenuation unit (54) is arranged in front of the converter medium (20) in the propagation direction of the processing laser beam (12).

8. Monitoring arrangement (10) for monitoring and adjusting processing parameters of a processing laser beam (12) of a laser processing machine (14), comprising a monitoring device (16) according to one of the preceding claims and a processing head (22) of a laser processing machine (14), wherein the imaging unit (18) of the monitoring device (16) is arranged or formed in the processing head (22).

9. Monitoring arrangement (10) according to claim 8, wherein the converter medium (20) is arranged in a propagation direction of the processing laser beam (12) after an exit opening (27) of a processing nozzle (46) of the processing head (22), wherein the imaging unit (18) is designed to image the measuring radiation (40) delimited by the exit opening (27).

10. Monitoring arrangement (10) according to claim 9, further comprising a process illumination arranged within the processing head (22), wherein the process illumination is directed towards the exit opening (27), and wherein the imaging unit (18) is designed to image process illumination radiation reflected by the processing nozzle (46).

11. Monitoring arrangement (10) according to claim 8 to 10, wherein the processing head (22) has at least one partially transparent deflection mirror (28, 30) for aligning the processing laser beam (12) onto the converter medium (20), wherein the imaging unit (18) is arranged behind the partially transparent deflection mirror (28, 30), wherein the partially transparent Deflecting mirror (28, 30) is designed to transmit the measuring radiation (40).

12. Monitoring method (84) for monitoring and adjusting processing parameters of a processing laser beam (12) of a laser processing machine (14), in particular with a monitoring arrangement (10) according to one of claims 8 to 11, comprising the method steps: a) aligning (86) the processing laser beam (12) onto a converter medium (20), wherein the laser radiation (38) of the processing laser beam (12) is at least partially absorbed by the converter medium (20) and measuring radiation (40) is emitted by the converter medium (20); b) generating (88) a measuring radiation image (50) by means of an imaging unit (18) by detecting the measuring radiation (40) emitted by the converter medium (20); c) determining (90) at least one processing parameter of the processing laser beam (12) by evaluating the measuring radiation image (50); d) outputting (92) the at least one determined processing parameter.

13. Monitoring method (84) according to claim 12, wherein a beam position of the processing laser beam (12) in the exit opening (27) of the processing head (22) is determined by evaluating the measuring radiation image (50).

14. Monitoring method (84) according to claim 12 or 13, wherein a focus position (36) of the processing laser beam (12) is determined from the measuring radiation image (50).

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