Semiconductor processing techniques configured for use of a flexible and malleable temperature probe

Abstract

Techniques for semiconductor processing including one or both of a showerhead and a pedestal configured for use of a flexible and malleable temperature probe are disclosed. The temperature probe is configured for installation into and removal from a serpentine channel provided in the showerhead, in some examples. In other examples, the temperature probe is configured for installation into and removal from a serpentine channel provided in the pedestal.

Description

Docket No. LAM1P021WO SEMICONDUCTOR PROCESSING TECHNIQUES CONFIGURED FOR USE OF A FLEXIBLE AND MALLEABLE TEMPERATURE PROBE CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] A PCT Request Form is filed concurrently with this specification as part of the present application. Each application that the present application claims benefit of or priority to as identified in the concurrently filed PCT Request Form is incorporated by reference herein in their entireties and for all purposes. BACKGROUND

[0002] Semiconductor processing systems are used to perform treatments such as deposition of films on substrates such as semiconductor wafers. For example, deposition may be performed to deposit conductive film, dielectric film, or other types of film using chemical vapor deposition (CVD), plasma enhanced CVD (PECVD), atomic layer deposition (ALD), plasma enhanced ALD (PEALD), and / or other deposition processes. In a PECVD or PEALD process, plasma is used to activate chemical reactions within the processing chamber during deposition. During deposition, the substrate may be arranged on a substrate support (that may be referred to herein as a pedestal) within a processing chamber. One or more precursor gases may be supplied to the processing chamber using a gas distribution device (that may be referred to herein as a showerhead) to distribute process gases across an exposed side of the substrate. The showerhead and / or pedestal may, in some cases, include temperature sensors and / or active cooling and / or heating arrangements.

[0003] The background description provided herein is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure. SUMMARY

[0004] Techniques for semiconductor processing configured for use of a flexible and malleable temperature probe are disclosed.

[0005] According to some implementations, an apparatus for semiconductor processing includes: a showerhead including a plurality of gas distribution ports arranged on a first side, proximal to a work piece, and a second side distal from the work piece, the gas distributionDocket No. LAM1P021WO ports fluidically connected within the showerhead to an internal plenum of the showerhead; a stem coupled with the second side and having a gas flow passage fluidically coupled with the internal plenum, the stem extending away from the second side along a longitudinal axis. The showerhead includes a first passage, and the stem includes a second passage, the first passage and the second passage being mutually adjoining at an interface between the showerhead and the stem and providing a channel from a distal end of the stem to a peripheral region of the showerhead, the channel being configured to accommodate installation and removal of a temperature probe. The first passage includes a first portion approximately parallel to the first side and the second passage includes a second portion approximately parallel to the longitudinal axis. Proximal to the interface, the channel has a curved portion, a distal end of the curved portion aligned with the second portion and a proximal end of the curved portion being aligned with the first portion.

[0006] In some examples, the apparatus may further include the temperature probe, the temperature probe being configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor. After installation of the temperature probe, the temperature sensor may be configured to sense a temperature of the peripheral region of the showerhead. In some examples, at least the elongated portion of the temperature probe may have a characteristic of being flexible and malleable. In some examples, the characteristic may include a low resistance to bending forces and a resistance to damage from bending. In some examples, the low resistance to bending forces may include the elongated portion of the temperature probe being bendable in response to an applied force as low as about 0.5 newtons. In some examples, the resistance to damage from bending may include being capable of repeated cycling between a straight and a bent or curved configuration. In some examples, the installation of the temperature probe may include inserting the proximal end of the temperature probe into the channel at the distal end of the stem, and urging the temperature probe along a length of the channel until the temperature sensor is proximal to the peripheral region of the showerhead. In some examples the urging the temperature probe along the length of the channel may include applying a force to the elongated portion. In some examples, the force may be manually applied. In some examples, the force may be in the range of 0.5-50 newtons. In some examples, the force may be applied proximal to the distal end of the stem. In some examples, the temperature probe may be configured to be removable from the showerhead by applying a tensile force to the elongated portion. In some examples, the tensile force may be manuallyDocket No. LAM1P021WO applied. In some examples, the tensile force may be in the range of 0.5-50 newtons. In some examples, the tensile force may be applied proximal to the distal end of the stem. In some examples, a characteristic cross-sectional dimension d1 of the channel may be greater than a characteristic cross-sectional dimension d2of the temperature probe. In some examples, in straight portions of the channel, d1 / d2 may be in the range of 1.05-2 and, in curved portions of the channel, d1 / d2 may be in the range of 1.5-3. In some examples, the temperature sensor may include one or more fiber optic sensors, thermocouples, resistive temperature devices, and / or acoustic sensors. In some examples, the one or more fiber optic sensors, thermocouples, resistive temperature devices, and / or acoustic sensors may be configured to measure thermal gradients. In some examples, the elongated portion may include an optical fiber or optical fiber bundle, and / or an electrical conductor, surrounded by an outer jacket. In some examples, the outer jacket may include a corrugated or braided metal sheath.

[0007] According to some implementations, an apparatus for semiconductor processing includes: a pedestal assembly comprising a pedestal base and a support column, the pedestal base having a first side proximal to a work piece, the work piece being disposed on and supported by the pedestal assembly underneath a showerhead, and a second side distal from the work piece; and a support column coupled with the second side, the support column extending away from the second side along a longitudinal axis. The pedestal base includes a first passage, and the support column includes a second passage, the first passage and the second passage being mutually adjoining at an interface between the pedestal base and the support column and providing a channel from a distal end of the support column to a peripheral region of the pedestal base, the channel being configured to accommodate installation and removal of a temperature probe. The first passage includes a first portion approximately parallel to the first side and the second passage includes a second portion approximately parallel to the longitudinal axis. Proximal to the interface, the channel has a curved portion, a distal end of the curved portion aligned with the second portion and a proximal end of the curved portion being aligned with the first portion.

[0008] In some examples, the apparatus may further include the temperature probe, the temperature probe being configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor. After installation of the temperature probe, the temperature sensor may be configured to sense a temperature of the peripheral region of the pedestal base. In some examples, at least the elongated portion of the temperature probe may have a characteristic ofDocket No. LAM1P021WO being flexible and malleable. In some examples, the installation of the temperature probe may include inserting the proximal end of the temperature probe into the channel at the distal end of the support column, and urging the temperature probe along a length of the channel until the temperature sensor is proximal to the peripheral region of the pedestal base. In some examples, the temperature probe may be configured to be removable from the pedestal base by applying a tensile force to the elongated portion. In some examples, a characteristic cross-sectional dimension d1of the channel may be greater than a characteristic cross-sectional dimension d2of the temperature probe. In some examples, the temperature sensor may include one or more fiber optic sensors, thermocouples, resistive temperature devices, and / or acoustic sensors. In some examples, the one or more fiber optic sensors, thermocouples, resistive temperature devices, and / or acoustic sensors may be configured to measure thermal gradients. In some examples, the elongated portion may include an optical fiber or optical fiber bundle, and / or an electrical conductor, surrounded by an outer jacket.

[0009] According to some implementations, a method includes: installing a temperature probe into an apparatus for semiconductor processing, the apparatus including a showerhead including a plurality of gas distribution ports arranged on a first side, proximal to a work piece, and a second side distal from the work piece, the gas distribution ports fluidically connected within the showerhead to an internal plenum of the showerhead; and a stem coupled with the second side and having a gas flow passage fluidically coupled with the internal plenum, the stem extending away from the second side along a longitudinal axis. The showerhead includes a first passage, and the stem includes a second passage, the first passage and the second passage being mutually adjoining at an interface between the showerhead and the stem and providing a channel from a distal end of the stem to a peripheral region of the showerhead, the channel being configured to accommodate installation and removal of a temperature probe. The first passage includes a first portion approximately parallel to the first side and the second passage includes a second portion approximately parallel to the longitudinal axis. Proximal to the interface, the channel has a curved portion, a distal end of the curved portion aligned with the second portion and a proximal end of the curved portion being aligned with the first portion. The temperature probe is configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor, wherein after installation of the temperature probe, the temperature sensor is configured to sense a temperature of the peripheral region of the showerhead. Installing the temperature probe comprises inserting the proximal end of the temperature probe into theDocket No. LAM1P021WO channel at the distal end of the stem, and urging the temperature probe along a length of the channel until the temperature sensor is proximal to the peripheral region of the showerhead.

[0010] In some examples, urging the temperature probe along the length of the channel may include applying a force to the elongated portion. In some examples, the force may be manually applied. In some examples, the force may be applied proximal to the distal end of the stem. In some examples, the method further includes removing the temperature probe from the showerhead by applying a tensile force to the elongated portion. In some examples, the tensile force may be manually applied. In some examples, the tensile force may be applied proximal to the distal end of the stem.

[0011] According to some implementations, a method includes installing a temperature probe into an apparatus for semiconductor processing, the apparatus including: a pedestal assembly comprising a pedestal base and a support column, the pedestal base having a first side proximal to a work piece, the work piece being disposed on and supported by the pedestal assembly underneath a showerhead, and a second side distal from the work piece; a support column coupled with the second side, the support column extending away from the second side along a longitudinal axis. The pedestal base includes a first passage, and the support column includes a second passage, the first passage and the second passage being mutually adjoining at an interface between the pedestal base and the support column and providing a channel from a distal end of the support column to a peripheral region of the pedestal base, the channel being configured to accommodate installation and removal of a temperature probe. The first passage includes a first portion approximately parallel to the first side and the second passage includes a second portion approximately parallel to the longitudinal axis. Proximal to the interface, the channel has a curved portion, a distal end of the curved portion aligned with the second portion and a proximal end of the curved portion being aligned with the first portion. The temperature probe is configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor, wherein, after installation of the temperature probe, the temperature sensor is configured to sense a temperature of the peripheral region of the pedestal base. Installing the temperature probe comprises inserting the proximal end of the temperature probe into the channel at the distal end of the support column, and urging the temperature probe along a length of the channel until the temperature sensor is proximal to the peripheral region of the pedestal base.

[0012] In some examples, the method further includes removing the temperature probe fromDocket No. LAM1P021WO the pedestal assembly by applying a tensile force to the elongated portion.

[0013] According to some implementations, a system for semiconductor processing includes a controller, a temperature probe, a showerhead including a plurality of gas distribution ports arranged on a first side, proximal to a work piece, and a second side distal from the work piece, the gas distribution ports fluidically connected within the showerhead to an internal plenum of the showerhead, and a stem coupled with the second side and having a gas flow passage fluidically coupled with the internal plenum, the stem extending away from the second side along a longitudinal axis. The showerhead includes a first passage, and the stem includes a second passage, the first passage and the second passage being mutually adjoining at an interface between the showerhead and the stem and providing a channel from a distal end of the stem to a peripheral region of the showerhead, the channel being configured to accommodate installation and removal of the temperature probe. The first passage includes a first portion approximately parallel to the first side and the second passage includes a second portion approximately parallel to the longitudinal axis. Proximal to the interface, the channel has a curved portion, a distal end of the curved portion aligned with the second portion and a proximal end of the curved portion being aligned with the first portion. The temperature probe is configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor, wherein after installation of the temperature probe, the temperature sensor is configured to sense a temperature of the peripheral region of the showerhead. Responsive to outputs from the temperature probe, the controller is configured to control the showerhead.

[0014] In some examples, the controller, responsive to outputs from the temperature probe, may be configured to control the showerhead by adjusting deposition parameters to compensate for variations in showerhead temperature. In some examples, the deposition parameters may include one or both of a deposition process time or rate. In some examples, the controller, responsive to outputs from the temperature probe, may be configured to control a heating and / or cooling arrangement of the showerhead.

[0015] According to some implementations, a method for semiconductor processing includes operating a semiconductor processing system, the system comprising; a controller; a temperature probe; a showerhead including a plurality of gas distribution ports arranged on a first side, proximal to a work piece, and a second side distal from the work piece, the gas distribution ports fluidically connected within the showerhead to an internal plenum of the showerhead; and a stem coupled with the second side and having a gas flow passage fluidicallyDocket No. LAM1P021WO coupled with the internal plenum, the stem extending away from the second side along a longitudinal axis. The showerhead includes a first passage, and the stem includes a second passage, the first passage and the second passage being mutually adjoining at an interface between the showerhead and the stem and providing a channel from a distal end of the stem to a peripheral region of the showerhead, the channel being configured to accommodate installation and removal of the temperature probe. The first passage includes a first portion approximately parallel to the first side and the second passage includes a second portion approximately parallel to the longitudinal axis. Proximal to the interface, the channel has a curved portion, a distal end of the curved portion aligned with the second portion and a proximal end of the curved portion being aligned with the first portion. The temperature probe is configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor, wherein after installation of the temperature probe, the temperature sensor is configured to sense a temperature of the peripheral region of the showerhead. The method includes controlling, with the controller, the showerhead responsive to outputs from the temperature probe.

[0016] In some examples, controlling the showerhead responsive to outputs from the temperature probe may include adjusting deposition parameters to compensate for variations in showerhead temperature. In some examples, the deposition parameters may include one or both of a deposition process time or rate. In some examples, controlling the showerhead responsive to outputs from the temperature probe may include controlling a heating and / or cooling arrangement of the showerhead.

[0017] According to some implementations, a system for semiconductor processing includes: a controller; a temperature probe; a pedestal assembly comprising a pedestal base and a support column, the pedestal base having a first side, proximal to a work piece, the work piece being disposed on and supported by the pedestal assembly underneath a showerhead, and a second side distal from the work piece; and a support column coupled with the second side, the support column extending away from the second side along a longitudinal axis. The pedestal base includes a first passage, and the support column includes a second passage, the first passage and the second passage being mutually adjoining at an interface between the pedestal base and the support column and providing a channel from a distal end of the support column to a peripheral region of the pedestal base, the channel being configured to accommodate installation and removal of a temperature probe. The first passage includes a first portion approximately parallel to the first side and the second passage includes a second portionDocket No. LAM1P021WO approximately parallel to the longitudinal axis. Proximal to the interface, the channel has a curved portion, a distal end of the curved portion aligned with the second portion and a proximal end of the curved portion being aligned with the first portion. The temperature probe is configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor, wherein after installation of the temperature probe, the temperature sensor is configured to sense a temperature of the peripheral region of the pedestal base. Responsive to outputs from the temperature probe, the controller is configured to control a heating and / or a cooling arrangement of the pedestal assembly.

[0018] According to some implementations, a method for semiconductor processing includes operating a semiconductor processing system, the system comprising; a controller; a temperature probe; a pedestal assembly comprising a pedestal base and a support column, the pedestal base having a first side, proximal to a work piece, the work piece being disposed on and supported by the pedestal assembly underneath a showerhead, and a second side distal from the work piece; and a support column coupled with the second side, the support column extending away from the second side along a longitudinal axis. The pedestal base includes a first passage, and the support column includes a second passage, the first passage and the second passage being mutually adjoining at an interface between the pedestal base and the support column and providing a channel from a distal end of the support column to a peripheral region of the pedestal base, the channel being configured to accommodate installation and removal of a temperature probe. The first passage includes a first portion approximately parallel to the first side and the second passage includes a second portion approximately parallel to the longitudinal axis. Proximal to the interface, the channel has a curved portion, a distal end of the curved portion aligned with the second portion and a proximal end of the curved portion being aligned with the first portion. The temperature probe is configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor, wherein after installation of the temperature probe, the temperature sensor is configured to sense a temperature of the peripheral region of the pedestal base. The method includes controlling, with the controller, a heating and / or a cooling arrangement of the pedestal assembly.Docket No. LAM1P021WO BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 shows a simplified schematic example of an apparatus for a substrate processing system including a showerhead assembly and temperature probe, in accordance with some embodiments.

[0020] Figure 2 provides an expanded view of the showerhead assembly, with the temperature probe omitted for clarity, according to some implementations.

[0021] Figure 3 provides an expanded view of the showerhead assembly, including the temperature probe, according to some implementations.

[0022] Figures 4A-4C illustrate examples of a flexible and malleable temperature probe, according to some implementations.

[0023] Figures 5A-5G illustrate an example of a temperature probe installation procedure as contemplated by some implementations of the present disclosure.

[0024] Figures 6A-6G illustrate an example of a temperature probe removal procedure as contemplated some implementations of the present disclosure.

[0025] Figure 7 illustrates an example of a prior art arrangement.

[0026] Figure 8 illustrates an example of a prior art arrangement.

[0027] Figures 9A-9B illustrate an example of a pedestal assembly according to a yet further embodiment.

[0028] Figure 10 shows a process flow diagram, according to some implementations.

[0029] Figure 11 shows a process flow diagram, according to some implementations. DETAILED DESCRIPTION

[0030] In the following description, numerous specific details are set forth to provide a thorough understanding of the presented embodiments. The disclosed embodiments may be practiced without some or all these specific details. In other instances, well-known process operations have not been described in detail to not unnecessarily obscure the disclosed embodiments. While the disclosed embodiments will be described in conjunction with the specific embodiments, it will be understood that it is not intended to limit the disclosed embodiments.

[0031] Semiconductor wafer processing operations may be performed on semiconductor wafers while such wafers are supported within a processing chamber on a pedestal, e.g., a structure typically designed to support a semiconductor wafer from below in an evenly distributed manner. Process gases are usually flowed through a showerhead and then distributed across the semiconductor wafer via gas distribution ports distributed across anDocket No. LAM1P021WO underside of the showerhead.

[0032] In some configurations contemplated by the present disclosure, the showerhead may be supported within the processing chamber by a stem, which may be configured as a column- like structure having a longitudinal axis that passes through an aperture in the processing chamber ceiling. The stem may have a characteristic cross-sectional dimension (e.g., diameter of a circular cross-section, or width of a square cross-section) smaller than a characteristic cross-sectional dimension of the showerhead. For example, showerheads may typically be sized to exceed the diameters of the wafers that are processed using such showerheads, so a showerhead for processing a 300 mm wafer will generally be over 300 mm in diameter. In some implementations the showerhead diameter may be about 400 mm. In contrast, a stem for such a showerhead may have a nominal diameter on the order of several tens of millimeters, e.g., 30 to 50 mm. The stem may be configured with one or more flow passages through which process gases may flow from an inlet of the stem (outside the processing chamber) to the showerhead.

[0033] In some instances, the showerhead and pedestal may reach elevated temperatures (e.g., 300-400°C) during processing operations. For example, heat generated by process conditions within the chamber during processing operations, heat generated through the use of the showerhead as an electrode for producing and maintaining a plasma within the processing chamber, or heat provided by a heater located within the showerhead that may be used to actively maintain the showerhead at an elevated temperature during processing operations may result in such elevated temperatures. Moreover, the pedestal and showerhead, over life, must endure numerous temperature cycles and are exposed to highly corrosive, high temperature, reactive gases and plasmas, necessitating periodic replacement of such equipment.

[0034] As indicated above, the showerhead and / or pedestal may, in some cases, include temperature sensors and / or active cooling and / or heating arrangements. For example, a temperature of the showerhead may be actively temperature controlled to maintain desired process uniformity. In some implementations, a showerhead may be heated with embedded heaters and / or cooled with a gas or liquid coolant to control the temperature based on a predetermined temperature control strategy to compensate for known process variations. In any of the above examples, temperature sensors may, advantageously provide temperature data used by a controller to manage active cooling and / or heating arrangements.

[0035] In other examples, a showerhead temperature may be passively controlled. For example, the showerhead may be heated by generating plasma using RF power provided to an electrode of the showerhead. In such implementations, knowledge of showerhead temperatureDocket No. LAM1P021WO is still desirable. For example, as disclosed in Wang, et al., WO2023003768 (hereinafter Wang, assigned to the assignee of the present invention), deposition parameters such as process time (e.g., a deposition, time, period, or duration) may be adjusted to compensate for variations in showerhead temperature without actively controlling the showerhead temperature. Thus, instead of adjusting the showerhead temperature, the deposition time may be increased or decreased to compensate for changes in deposition rates caused by variations in the showerhead temperature.

[0036] A showerhead or pedestal may be configured to include temperature sensors that are disposed within the showerhead or pedestal and, accordingly, are at least largely protected from the hostile operating conditions within a processing chamber. Thus, the temperatures sensors will generally be expected to have a longer useful life than the showerhead or pedestal, and it would be desirable to remove and reuse the temperature sensors when a worn showerhead or pedestal requires replacement. Similarly, it may sometimes be desirable to remove and / or replace the temperature sensors (e.g. in case of a sensor failure, or obsolescence) whether or not the showerhead or pedestal requires replacement. As will be explained in more detail hereinbelow, in the absence of the present teachings, removal and reinstallation of temperature sensors is possible only in limited circumstances.

[0037] Referring now to Figure 1, the present invention contemplates a system 100 for semiconductor processing, including a showerhead assembly 110 and a pedestal assembly 120. The showerhead assembly 110 includes a showerhead 112 disposed within an interior volume of a semiconductor processing chamber 102. The pedestal assembly 120 includes a pedestal base 121, coupled with a support column 123, and disposed underneath the showerhead 112, that supports a workpiece 101. The workpiece 101 may be a silicon substrate or wafer to be processed within the semiconductor processing chamber 102. In the illustrated example, the showerhead 112 includes a plurality of gas distribution ports arranged on a first (lower) side, proximal to the work piece 101, and a second (upper) side distal from the work piece. The gas distribution ports are fluidically connected within the showerhead to an internal plenum of the showerhead.

[0038] The showerhead assembly 110 includes a stem 114 coupled with the second side of the showerhead 112 and having a gas flow passage fluidically coupled with the internal plenum. As illustrated, the stem extends upward along a longitudinal axis from the second side in a direction generally orthogonal to the second side.

[0039] The showerhead assembly 110 may include one or more of a resistive heater, one or more gas passages for delivering corresponding process gas(es) to the showerhead 112, and / orDocket No. LAM1P021WO one or more temperature sensors. In the illustrated example, the showerhead assembly 110 includes a temperature probe 116, a distal end of which provides an electrical interface configured to carry signals from the temperature probe 116 to a controller 103 (directly to the controller 103, as illustrated, or, in some implementations, by way of an intermediate temperature probe controller)

[0040] The controller 103 may also be communicatively connected with a gas distribution system 105, which may include one or more computer-controllable valves, flow meters, or other devices and which may be connected with one or more gas sources such that the controller, in causing the valves or other components of the gas distribution system 105 to operate in a particular manner, may cause one or more process gases to flow into a gas passage within stem 114 and then onto the workpiece 101 via the gas distribution ports on the underside of the showerhead 112.

[0041] The controller 103 may also be communicatively connected with a power source 107 that may be electrically connected with a resistive heater located within the showerhead assembly 110. The controller 103 may, for example, be configured to cause the power source 107 to provide a desired level of electrical power to the resistive heater or other heating system in order to maintain portions of the showerhead assembly 110 at a desired temperature level during wafer processing operations.

[0042] The controller 103 may also be communicatively connected with a radio-frequency (RF) power source 109 which may be configured to provide radio-frequency electrical power to the showerhead assembly 110 or, alternatively or in addition, to the pedestal assembly 120, in order to allow a plasma to be generated and maintained within the semiconductor processing chamber in order to support wafer processing operations. Finally, the controller 103 may also be communicatively connected with and configured to control heating and / or cooling arrangements of the pedestal assembly 120.

[0043] It will be appreciated that the showerhead assembly 110 may be used in a system such as that shown in Figure 1, but may also be generally usable in other semiconductor processing systems, including, for example, multi-station semiconductor processing tools in which a single chamber contains multiple sets of wafer supports and showerhead assemblies, e.g., four wafer support / showerhead assembly sets arranged in a circular array within a single, large semiconductor processing chamber.

[0044] Figure 2 presents an expanded view of showerhead assembly 110, with the temperature probe 116 omitted for clarity. It may be observed that each of the showerhead 112 and the stem 114 include a respective passage. The showerhead 112 includes first passage 113Docket No. LAM1P021WO and the stem 114 includes a second passage 115. The first passage 113 and the second passage 115 are mutually adjoining at an interface between the showerhead and the stem and are configured to provide a serpentine channel from a distal end 221 of the stem 113 to a peripheral region 222 of the showerhead 112. The serpentine channel may be configured to accommodate installation and removal of the temperature probe 116, as explained in more detail hereinbelow.

[0045] The first passage 113 of the showerhead 112 includes a first portion 223 approximately orthogonal to a longitudinal axis 118 and the second passage 115 of the stem 114 includes a second portion 225 approximately parallel to the longitudinal axis 118 of the stem 114. As a result, when temperature probe 116 is disposed along the respective passages 113 and 115, a proximal end of the temperature probe 116 may be located along an axis orthogonal to longitudinal axis 118 at a considerable distance from the longitudinal axis. For example, a proximal end of the temperature probe, which may include a temperature sensor, may be located near to the peripheral region 222 of the showerhead 112. In the illustrated example, the first passage 113 and the second passage 115 are configured to form a curved channel portion 227 that provides a smooth transition between the first portion 223 and the second portion 225. As illustrated, a distal end of the curved channel portion channel 227 is aligned with the second portion 225 and a proximal end of the curved channel portion channel 227 is aligned with the first portion 223. In the illustrated example, a second curved channel portion 229 provides a transition between the first portion 223 and a third portion 228 that terminates near to the peripheral region 222.

[0046] Figure 3 presents an expanded view of the showerhead assembly 110, including the temperature probe 116. The temperature probe 116 includes, at a proximal end, a temperature sensor 1161, at a distal end, an electrical conductor 1163, and, disposed therebetween, a central elongated portion 1162 (that may be referred to herein as the temperature probe body). The sensor 1161 may be or include a fiber optic sensor, a thermocouple or resistive temperature device configured to sense a temperature of the showerhead at a location distal from the stem.

[0047] At least the temperature probe body 1162 is flexible and malleable, meaning that with a minimal applied force (e.g., as little as about 0.5 newtons) the probe body 1162 may be bent or unbent. For example, referring to Figures 4A-4C, the temperature probe 116, as a result of the flexible and malleable temperature probe body 1162, may be readily and reversibly reformed from a straight configuration, as shown in Figure 4A, to a coiled configuration (e.g., as shown in Figure 4B) or an installed configuration (e.g., as shown in Figure 4C). In some implementations, the probe body 1162 may include, surrounded by an outer jacket, an optical fiber or optical fiber bundle, and / or an electrical conductor. The outer jacket may include aDocket No. LAM1P021WO corrugated or braided metal sheath, in some implementations.

[0048] Moreover, by appropriately configuring the respective passages 113 and 115, installation of the temperature probe 116, in showerhead assembly 110 may be performed by inserting the proximal end of the temperature probe (including temperature sensor 1161) into the channel formed by respective passages 113 and 115 at the distal end of the stem, and urging the temperature probe along a length of the channel until the temperature sensor is proximal to the peripheral region of the showerhead.

[0049] Figures 5A-5G illustrate an example of an installation procedure as contemplated by the present disclosure. In Figures 5A and 5B, the proximal end of the temperature probe 116 is shown as being inserted into the passage 115 and being urged by an applied pushing force 'F' from a first position illustrated in Figure 5A to a second position illustrated in Figure 5B. The force F may be manually applied, for example, and may be in the range of approximately 0.5- 50 newtons, for example. It may be observed in Detail A, that a characteristic cross-sectional dimension, d2, (which may be, e.g., a diameter of a circular cross-section, or width of a square cross-section) of the temperature probe 116 is smaller than a characteristic cross-sectional dimension d1 of the passage 115. In some implementations, the ratio d1 / d2 may be in the range of 1.05-2, for example.

[0050] In Figure 5C the proximal end of the temperature probe 116 is shown as having reached curved channel portion 227, and now being urged forward by the force F from a third location illustrated in Figure 5C to a fourth position illustrated in Figure 5D. It may be observed in Detail B, that a characteristic cross-sectional dimension, d3, of the curved channel portion 227 may be larger than d1 to facilitate movement of the temperature probe 116 through the curved channel portion 227. In some implementations, the ratio d3 / d2 may be in the range of 1.5-3, for example.

[0051] In Figures 5E-5G, it is shown how continued application of the applied force F urges the temperature probe along a length of the channel until the temperature sensor is proximal to the peripheral region of the showerhead. It may be observed in Detail C of Figure 5F that a characteristic cross-sectional dimension, d4, of the curved channel portion 228 may be larger than d1 to facilitate movement of the temperature probe 116 through the curved channel portion 227. In some implementations, the ratio d4 / d2may be in the range of 1.5-3, for example.

[0052] Figures 6A-6G illustrate how the foregoing disclosed operation may be conducted in reverse, in order to remove an installed temperature probe 116. Removing an installed temperature probe 116 may include applying a pulling force F′. The pulling force F′ may be manually applied, for example, and may be in the range of approximately 0.5-50 newtons, forDocket No. LAM1P021WO example. As a result, the temperature probe 116 may be removed from a first showerhead assembly (that, for example, has reached the end of its useful life) and be ready for installation in a second showerhead assembly. Similarly, if the temperature probe 116 needs to be replaced for any reason, the presently disclosed techniques facilitate that operation.

[0053] Features and benefits of the presently disclosed techniques may be better appreciated by referring to Figures 7 and 8, which are representative of known prior art techniques. In Figure 7, derived from Wang, it may be observed that a showerhead assembly 710, including showerhead 712 and stem 714, also includes a temperature probe 716. The temperature probe 716 is straight and rigid, and although the probe 716 is removable it is incapable of measuring temperatures at locations of the showerhead outboard of the stem (e.g., in a peripheral region of the showerhead).

[0054] In Figure 8, derived from Linebarger, et al., US Provisional Patent Application S / N 63 / 593,229 (hereinafter, Linebarger, assigned to the assignee of the present invention), it may be observed that a showerhead assembly 810, including showerhead 812 and stem 814, also includes a temperature probe 816. A temperature sensor 8161 of the temperature probe 816 is disposed in a peripheral region of the showerhead. Detail D of Figure 8 presents an exploded view of the showerhead assembly 810 (with stem 814 omitted for clarity). The temperature probe 816 is rigid with preformed bends and, although capable of measuring temperatures at locations of the showerhead outboard of the stem (e.g., in a peripheral region of the showerhead), it is not removable from the assembled showerhead.

[0055] As indicated above, a pedestal may also include temperature sensors and / or active cooling and / or heating arrangements. For example, a temperature of the pedestal may be actively temperature controlled to maintain desired process uniformity. In such cases, a flexible and malleable temperature probe may be advantageous for the reasons indicated above. Figure 9A illustrates an example of a pedestal assembly 920 supporting a workpiece 101 under showerhead assembly 910. The pedestal assembly 920 includes a pedestal base 921, coupled with a support column 923. The pedestal base 921 and support column 923 include, respectively, passages 922 and 924providing a serpentine channel that may be configured to accommodate installation and removal of a temperature probe 916. Figure 9B shows the pedestal 903 with the temperature probe 916 installed. In the illustrated example, a proximal end of the temperature probe, which may include a temperature sensor, is located near to a peripheral region pedestal base 921, but it will be understood that the passage 922 may be configured such that the proximal end of the temperature probe 916 is located at any radial distance from the support column 923. Outputs from the temperature probe may be used by theDocket No. LAM1P021WO controller 103 to actively monitor and control heating and / or cooling of the pedestal base 121.

[0056] Similarly to the temperature probe 116 described in detail above, temperature probe 916, advantageously, may be configured for installation and removal. As a result, the temperature probe 916 may be removed from a first pedestal assembly (that, for example, has reached the end of its useful life) and be ready for installation in a second pedestal assembly. Similarly, if the temperature probe 916 needs to be replaced for any reason, the presently disclosed techniques facilitate that operation.

[0057] Thus, according to some implementations, an apparatus for semiconductor processing includes: the pedestal assembly 920 having a first side, proximal to the work piece 101, the work piece 101 being disposed on and supported by the pedestal assembly 920 underneath the showerhead assembly 910, and a second side distal from the work piece; the support column 923 coupled with the second side, the support column 923 extending away from the second side along a longitudinal axis. The pedestal base 921 includes a first passage 922, and the support column 923 includes a second passage 924, the first passage 922 and the second passage 924 being mutually adjoining at an interface between the pedestal base 921 and the support column 923 and providing a channel from a distal end of the support column 923 to a peripheral region of the pedestal base 921, the channel being configured to accommodate installation and removal of a temperature probe. The first passage includes a first portion approximately parallel to the first side and the second passage includes a second portion approximately parallel to the longitudinal axis. Proximal to the interface, the channel has a curved portion, a distal end of the curved portion aligned with the second portion and a proximal end of the curved portion being aligned with the first portion.

[0058] The apparatus may include the temperature probe 916, the temperature probe 916 being configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor, wherein after installation of the temperature probe, the sensor is configured to sense a temperature of the peripheral region of the pedestal base.

[0059] Referring now to Fig. 10, a method 1000 for semiconductor processing will be described. At block 1001, in the illustrated example, the method includes installing a temperature probe into an apparatus for semiconductor processing by inserting a proximal end of the temperature probe into a channel and urging the temperature probe along a length of the channel. As indicated hereinabove, the apparatus may include a showerhead including a plurality of gas distribution ports arranged on a first side, proximal to a work piece, and aDocket No. LAM1P021WO second side distal from the work piece, the gas distribution ports fluidically connected within the showerhead to an internal plenum of the showerhead and a stem coupled with the second side and having a gas flow passage fluidically coupled with the internal plenum, the stem extending away from the second side along a longitudinal axis. The showerhead may include a first passage, and the stem may include a second passage, the first passage and the second passage being mutually adjoining at an interface between the showerhead and the stem and providing the channel, from a distal end of the stem to a peripheral region of the showerhead, into which the proximal end of the temperature probe is inserted. The first passage may include a first portion approximately parallel to the first side and the second passage may include a second portion approximately parallel to the longitudinal axis. The temperature probe may be configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor. After installation of the temperature probe, the sensor may be configured to sense a temperature of the peripheral region of the showerhead.

[0060] In some implemenations, the apparatus may include a pedestal assembly having a first side, proximal to a work piece, the work piece being disposed on and supported by a pedestal assembly underneath a showerhead, and a second side distal from the work piece, and a support column coupled with the second side, the support column extending away from the second side along a longitudinal axis. The pedestal base may include a first passage, and the support column may include a second passage, the first passage and the second passage being mutually adjoining at an interface between the pedestal base and the support column and providing a channel from a distal end of the support column to a peripheral region of the pedestal base, the channel being configured to accommodate installation and removal of a temperature probe. The first passage may include a first portion approximately parallel to the first side and the second passage may include a second portion approximately parallel to the longitudinal axis. The temperature probe may be configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor. After installation of the temperature probe, the sensor may be configured to sense a temperature of the peripheral region of the pedestal base.

[0061] In some implementations, urging the temperature probe along the length of the channel comprises applying a force to the elongated portion. The force may be manually applied, and, in some implementations, the force may be applied proximal to the distal end ofDocket No. LAM1P021WO the stem or pedestal base.

[0062] Optionally, at block 1003, the method may include removing the temperature probe from the apparatus by applying a tensile force to the elongated portion of the temperature probe. The force may be manually applied, and, in some implementations, the force may be applied proximal applied proximal to the distal end of the stem or pedestal base.

[0063] Referring now to Fig. 11, a method 1100 for semiconductor processing will be described. At block 1101, in the illustrated example, the method includes operating a semiconductor processing system. As indicated hereinabove, the system may include a showerhead including a plurality of gas distribution ports arranged on a first side, proximal to a work piece, and a second side distal from the work piece, the gas distribution ports fluidically connected within the showerhead to an internal plenum of the showerhead and a stem coupled with the second side and having a gas flow passage fluidically coupled with the internal plenum, the stem extending away from the second side along a longitudinal axis. The showerhead may include a first passage, and the stem may include a second passage, the first passage and the second passage being mutually adjoining at an interface between the showerhead and the stem and providing the channel, from a distal end of the stem to a peripheral region of the showerhead, into which the proximal end of the temperature probe is inserted. The first passage may include a first portion approximately parallel to the first side and the second passage may include a second portion approximately parallel to the longitudinal axis. The temperature probe may be configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor. After installation of the temperature probe, the sensor may be configured to sense a temperature of the peripheral region of the showerhead.

[0064] In some implemenations, the apparatus may include a pedestal assembly having a first side, proximal to a work piece, the work piece being disposed on and supported by a pedestal assembly underneath a showerhead, and a second side distal from the work piece, and a support column coupled with the second side, the support column extending away from the second side along a longitudinal axis. The pedestal base may include a first passage, and the support column may include a second passage, the first passage and the second passage being mutually adjoining at an interface between the pedestal base and the support column and providing a channel from a distal end of the support column to a peripheral region of the pedestal base, the channel being configured to accommodate installation and removal of a temperature probe. The first passage may include a first portion approximately parallel to theDocket No. LAM1P021WO first side and the second passage may include a second portion approximately parallel to the longitudinal axis. The temperature probe may be configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor. After installation of the temperature probe, the sensor may be configured to sense a temperature of the peripheral region of the pedestal base.

[0065] At block 1103, in the illustrated example, the method proceeds with controlling the showerhead and / or heating and / or cooling arrangements of the showerhead or the pedestal assembly responsive to outputs from the temperature probe.

[0066] In some embodiments, the techniques described herein may include a controller that is configured to control various aspects of the apparatus in order to perform the techniques described herein. For example, referring back to Figure 1, the system 100 includes the controller 103 (which may include one or more physical and / or logical controllers) that is communicatively connected with and that controls some or all of the operations of a processing chamber. The system controller 103 may include one or more memory devices and one or more processors communicatively coupled with the temperature probe 116 or 916, for example. In some embodiments, the controller may be configured to control, responsive to outputs from the temperature probe 116, one or more of the showerhead and heating and / or cooling arrangements associated with the showerhead and / or the pedestal.

[0067] In some implementations, a controller is part of a system, which may be part of the above-described examples. Such systems can comprise semiconductor processing equipment, including a processing tool or tools, chamber or chambers, a platform or platforms for processing, and / or specific processing components (a wafer pedestal, a gas flow system, etc.). These systems may be integrated with electronics for controlling their operation before, during, and after processing of a semiconductor wafer or substrate. The electronics may be referred to as the “controller,” which may control various components or subparts of the system or systems. The controller, depending on the processing requirements and / or the type of system, may be programmed to control any of the processes disclosed herein, including the delivery of processing gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, positional and operation settings, wafer transfers into and out of a tool and other transfer tools and / or load locks connected to or interfaced with a specific system.

[0068] Broadly speaking, the controller may be defined as electronics having variousDocket No. LAM1P021WO integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operation, enable cleaning operations, enable endpoint measurements, and the like. The integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files), defining operational parameters for carrying out a particular process on or for a semiconductor wafer or to a system. The operational parameters may, in some embodiments, be part of a recipe defined by process engineers to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0069] The controller, in some implementations, may be a part of or coupled to a computer that is integrated with, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the “cloud” or all or a part of a fab host computer system, which can allow for remote access of the wafer processing. The computer may enable remote access to the system to monitor current progress of fabrication operations, examine a history of past fabrication operations, examine trends or performance metrics from a plurality of fabrication operations, to change parameters of current processing, to set processing steps to follow a current processing, or to start a new process. In some examples, a remote computer (e.g. a server) can provide process recipes to a system over a network, which may include a local network or the Internet. The remote computer may include a user interface that enables entry or programming of parameters and / or settings, which are then communicated to the system from the remote computer. In some examples, the controller receives instructions in the form of data, which specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control. Thus as described above, the controller may be distributed, such as by comprising one or more discrete controllers that are networked together and working towards a common purpose, such as the processes and controls described herein. An example of a distributed controller for such purposes would be one or more integrated circuits on a chamber in communication with one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer) that combine to control a process on the chamber.Docket No. LAM1P021WO

[0070] Without limitation, example systems may include a plasma etch chamber or module, a deposition chamber or module, a spin-rinse chamber or module, a metal plating chamber or module, a clean chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a deposition chamber or module, an etch chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing systems that may be associated or used in the fabrication and / or manufacturing of semiconductor wafers.

[0071] As noted above, depending on the process step or steps to be performed by the tool, the controller might communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout a factory, a main computer, another controller, or tools used in material transport that bring containers of wafers to and from tool locations and / or load ports in a semiconductor manufacturing factory. CONCLUSION

[0072] Although the foregoing embodiments have been described in some detail for purposes of clarity of understanding, it will be apparent that certain changes and modifications may be practiced within the scope of the appended claims. It should be noted that there are many alternative ways of implementing the processes, systems, and apparatus of the present embodiments. Accordingly, the present embodiments are to be considered as illustrative and not restrictive, and the embodiments are not to be limited to the details given herein.

Claims

Docket No. LAM1P021WO CLAIMS What is claimed is:

1. An apparatus for semiconductor processing, the apparatus comprising: a showerhead including a plurality of gas distribution ports arranged on a first side, proximal to a work piece, and a second side distal from the work piece, the gas distribution ports fluidically connected within the showerhead to an internal plenum of the showerhead; a stem coupled with the second side and having a gas flow passage fluidically coupled with the internal plenum, the stem extending away from the second side along a longitudinal axis, wherein: the showerhead includes a first passage, and the stem includes a second passage, the first passage and the second passage being mutually adjoining at an interface between the showerhead and the stem and providing a channel from a distal end of the stem to a peripheral region of the showerhead, the channel being configured to accommodate installation and removal of a temperature probe; the first passage includes a first portion approximately parallel to the first side and the second passage includes a second portion approximately parallel to the longitudinal axis; and proximal to the interface, the channel has a curved portion, a distal end of the curved portion aligned with the second portion and a proximal end of the curved portion being aligned with the first portion.

2. The apparatus of claim 1, further comprising the temperature probe, the temperature probe being configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor, wherein after installation of the temperature probe, the temperature sensor is configured to sense a temperature of the peripheral region of the showerhead.

3. The apparatus of claim 2, wherein at least the elongated portion of the temperature probe has a characteristic of being flexible and malleable.

4. The apparatus of claim 3, wherein the characteristic includes a low resistance to bending forces and a resistance to damage from bending.Docket No. LAM1P021WO 5. The apparatus of claim 4, wherein the low resistance to bending forces includes the elongated portion of the temperature probe being bendable in response to an applied force as low as about 0.5 newtons.

6. The apparatus of claim 4, wherein the resistance to damage from bending includes being capable of repeated cycling between a straight and a bent or curved configuration.

7. The apparatus of claim 3, wherein the installation of the temperature probe comprises inserting the proximal end of the temperature probe into the channel at the distal end of the stem, and urging the temperature probe along a length of the channel until the temperature sensor is proximal to the peripheral region of the showerhead.

8. The apparatus of claim 7, wherein the urging the temperature probe along the length of the channel comprises applying a force to the elongated portion.

9. The apparatus of claim 8, wherein the force is manually applied.

10. The apparatus of claim 8, wherein the force is in the range of 0.5-50 newtons.

11. The apparatus of claim 8, wherein the force is applied proximal to the distal end of the stem.

12. The apparatus of claim 2, wherein the temperature probe is configured to be removable from the showerhead by applying a tensile force to the elongated portion.

13. The apparatus of claim 12, wherein the tensile force is manually applied.

14. The apparatus of claim 12, wherein the tensile force is in the range of 0.5-50 newtons.

15. The apparatus of claim 12, wherein the tensile force is applied proximal to the distal end of the stem.Docket No. LAM1P021WO 16. The apparatus of claim 2, wherein a characteristic cross-sectional dimension d1of the channel is greater than a characteristic cross-sectional dimension d2 of the temperature probe.

17. The apparatus of claim 16, wherein, in straight portions of the channel, d1 / d2 is in the range of 1.05-2 and, in curved portions of the channel, d1 / d2 is in the range of 1.5-3.

18. The apparatus of claim 2, wherein the temperature sensor includes one or more fiber optic sensors, thermocouples, resistive temperature devices, and / or acoustic sensors.

19. The apparatus of claim 18, wherein the one or more fiber optic sensors, thermocouples, resistive temperature devices, and / or acoustic sensors are configured to measure thermal gradients.

20. The apparatus of claim 2, wherein the elongated portion includes an optical fiber or optical fiber bundle, and / or an electrical conductor, surrounded by an outer jacket.

21. The apparatus of claim 20, wherein the outer jacket includes a corrugated or braided metal sheath.

22. An apparatus for semiconductor processing, the apparatus comprising: a pedestal assembly comprising a pedestal base and a support column, the pedestal base having a first side proximal to a work piece, the work piece being disposed on and supported by the pedestal assembly underneath a showerhead, and a second side distal from the work piece; and a support column coupled with the second side, the support column extending away from the second side along a longitudinal axis, wherein: the pedestal base includes a first passage, and the support column includes a second passage, the first passage and the second passage being mutually adjoining at an interface between the pedestal base and the support column and providing a channel from a distal end of the support column to a peripheral region of the pedestal base, the channel being configured to accommodate installation and removal of a temperature probe; the first passage includes a first portion approximately parallel to the first side and the second passage includes a second portion approximately parallel to the longitudinal axis; andDocket No. LAM1P021WO proximal to the interface, the channel has a curved portion, a distal end of the curved portion aligned with the second portion and a proximal end of the curved portion being aligned with the first portion.

23. The apparatus of claim 22, further comprising the temperature probe, the temperature probe being configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor, wherein after installation of the temperature probe, the temperature sensor is configured to sense a temperature of the peripheral region of the pedestal base.

24. The apparatus of claim 23, wherein at least the elongated portion of the temperature probe has a characteristic of being flexible and malleable.

25. The apparatus of claim 24, wherein the installation of the temperature probe comprises inserting the proximal end of the temperature probe into the channel at the distal end of the support column, and urging the temperature probe along a length of the channel until the temperature sensor is proximal to the peripheral region of the pedestal base.

26. The apparatus of claim 23, wherein the temperature probe is configured to be removable from the pedestal base by applying a tensile force to the elongated portion.

27. The apparatus of claim 23, wherein a characteristic cross-sectional dimension d1of the channel is greater than a characteristic cross-sectional dimension d2of the temperature probe.

28. The apparatus of claim 23, wherein the temperature sensor includes one or more fiber optic sensors, thermocouples, resistive temperature devices, and / or acoustic sensors.

29. The apparatus of claim 28, wherein the one or more fiber optic sensors, thermocouples, resistive temperature devices, and / or acoustic sensors are configured to measure thermal gradients.Docket No. LAM1P021WO 30. The apparatus of claim 23, wherein the elongated portion includes an optical fiber or optical fiber bundle, and / or an electrical conductor, surrounded by an outer jacket.

31. A method comprising: installing a temperature probe into an apparatus for semiconductor processing, the apparatus comprising: a showerhead including a plurality of gas distribution ports arranged on a first side, proximal to a work piece, and a second side distal from the work piece, the gas distribution ports fluidically connected within the showerhead to an internal plenum of the showerhead; and a stem coupled with the second side and having a gas flow passage fluidically coupled with the internal plenum, the stem extending away from the second side along a longitudinal axis, wherein: the showerhead includes a first passage, and the stem includes a second passage, the first passage and the second passage being mutually adjoining at an interface between the showerhead and the stem and providing a channel from a distal end of the stem to a peripheral region of the showerhead, the channel being configured to accommodate installation and removal of a temperature probe; the first passage includes a first portion approximately parallel to the first side and the second passage includes a second portion approximately parallel to the longitudinal axis; proximal to the interface, the channel has a curved portion, a distal end of the curved portion aligned with the second portion and a proximal end of the curved portion being aligned with the first portion; the temperature probe is configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor, wherein after installation of the temperature probe, the temperature sensor is configured to sense a temperature of the peripheral region of the showerhead; and installing the temperature probe comprises inserting the proximal end of the temperature probe into the channel at the distal end of the stem, and urging the temperature probe along a length of the channel until the temperature sensor is proximal to the peripheral region of the showerhead.Docket No. LAM1P021WO 32. The method of claim 31, wherein the urging the temperature probe along the length of the channel comprises applying a force to the elongated portion.

33. The method of claim 32, wherein the force is manually applied.

34. The method of claim 32, wherein the force is applied proximal to the distal end of the stem.

35. The method of claim 31, further comprising removing the temperature probe from the showerhead by applying a tensile force to the elongated portion.

36. The method of claim 35, wherein the tensile force is manually applied.

37. The method of claim 35, wherein the tensile force is applied proximal to the distal end of the stem.

38. A method comprising: installing a temperature probe into an apparatus for semiconductor processing, the apparatus comprising: a pedestal assembly comprising a pedestal base and a support column, the pedestal base having a first side proximal to a work piece, the work piece being disposed on and supported by the pedestal assembly underneath a showerhead, and a second side distal from the work piece; a support column coupled with the second side, the support column extending away from the second side along a longitudinal axis, wherein: the pedestal base includes a first passage, and the support column includes a second passage, the first passage and the second passage being mutually adjoining at an interface between the pedestal base and the support column and providing a channel from a distal end of the support column to a peripheral region of the pedestal base, the channel being configured to accommodate installation and removal of a temperature probe; the first passage includes a first portion approximately parallel to the first side and the second passage includes a second portion approximately parallel to the longitudinal axis;Docket No. LAM1P021WO proximal to the interface, the channel has a curved portion, a distal end of the curved portion aligned with the second portion and a proximal end of the curved portion being aligned with the first portion; the temperature probe being configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor, wherein, after installation of the temperature probe, the temperature sensor is configured to sense a temperature of the peripheral region of the pedestal base; and installing the temperature probe comprises inserting the proximal end of the temperature probe into the channel at the distal end of the support column, and urging the temperature probe along a length of the channel until the temperature sensor is proximal to the peripheral region of the pedestal base.

39. The method of claim 38, further comprising removing the temperature probe from the pedestal assembly by applying a tensile force to the elongated portion.

40. A system for semiconductor processing, the system comprising: a controller; a temperature probe; a showerhead including a plurality of gas distribution ports arranged on a first side, proximal to a work piece, and a second side distal from the work piece, the gas distribution ports fluidically connected within the showerhead to an internal plenum of the showerhead; and a stem coupled with the second side and having a gas flow passage fluidically coupled with the internal plenum, the stem extending away from the second side along a longitudinal axis, wherein: the showerhead includes a first passage, and the stem includes a second passage, the first passage and the second passage being mutually adjoining at an interface between the showerhead and the stem and providing a channel from a distal end of the stem to a peripheral region of the showerhead, the channel being configured to accommodate installation and removal of the temperature probe; the first passage includes a first portion approximately parallel to the first side and the second passage includes a second portion approximately parallel to the longitudinal axis; andDocket No. LAM1P021WO proximal to the interface, the channel has a curved portion, a distal end of the curved portion aligned with the second portion and a proximal end of the curved portion being aligned with the first portion; the temperature probe is configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor, wherein after installation of the temperature probe, the temperature sensor is configured to sense a temperature of the peripheral region of the showerhead; and responsive to outputs from the temperature probe, the controller is configured to control the showerhead.

41. The system of claim 40, wherein the controller, responsive to outputs from the temperature probe, is configured to control the showerhead by adjusting deposition parameters to compensate for variations in showerhead temperature.

42. The system of claim 41, wherein the deposition parameters include one or both of a deposition process time or rate.

43. The system of claim 40, wherein the controller, responsive to outputs from the temperature probe, is configured to control a heating and / or cooling arrangement of the showerhead.

44. A method for semiconductor processing, the method comprising: operating a semiconductor processing system, the system comprising; a controller; a temperature probe; a showerhead including a plurality of gas distribution ports arranged on a first side, proximal to a work piece, and a second side distal from the work piece, the gas distribution ports fluidically connected within the showerhead to an internal plenum of the showerhead; and a stem coupled with the second side and having a gas flow passage fluidically coupled with the internal plenum, the stem extending away from the second side along a longitudinal axis, wherein:Docket No. LAM1P021WO the showerhead includes a first passage, and the stem includes a second passage, the first passage and the second passage being mutually adjoining at an interface between the showerhead and the stem and providing a channel from a distal end of the stem to a peripheral region of the showerhead, the channel being configured to accommodate installation and removal of the temperature probe; the first passage includes a first portion approximately parallel to the first side and the second passage includes a second portion approximately parallel to the longitudinal axis; and proximal to the interface, the channel has a curved portion, a distal end of the curved portion aligned with the second portion and a proximal end of the curved portion being aligned with the first portion; the temperature probe is configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor, wherein after installation of the temperature probe, the temperature sensor is configured to sense a temperature of the peripheral region of the showerhead; and with the controller, controlling the showerhead responsive to outputs from the temperature probe.

45. The method of claim 44, wherein controlling the showerhead responsive to outputs from the temperature probe comprises adjusting deposition parameters to compensate for variations in showerhead temperature.

46. The method of claim 45, wherein the deposition parameters include one or both of a deposition process time or rate.

47. The method of claim 44, wherein controlling the showerhead responsive to outputs from the temperature probe comprises controlling a heating and / or cooling arrangement of the showerhead.

48. A system for semiconductor processing, the system comprising: a controller; a temperature probe; a pedestal assembly comprising a pedestal base and a support column, the pedestal base having a first side, proximal to a work piece, the work piece being disposed on and supportedDocket No. LAM1P021WO by the pedestal assembly underneath a showerhead, and a second side distal from the work piece; and a support column coupled with the second side, the support column extending away from the second side along a longitudinal axis, wherein: the pedestal base includes a first passage, and the support column includes a second passage, the first passage and the second passage being mutually adjoining at an interface between the pedestal base and the support column and providing a channel from a distal end of the support column to a peripheral region of the pedestal base, the channel being configured to accommodate installation and removal of a temperature probe; the first passage includes a first portion approximately parallel to the first side and the second passage includes a second portion approximately parallel to the longitudinal axis; and proximal to the interface, the channel has a curved portion, a distal end of the curved portion aligned with the second portion and a proximal end of the curved portion being aligned with the first portion, wherein: the temperature probe is configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor, wherein after installation of the temperature probe, the temperature sensor is configured to sense a temperature of the peripheral region of the pedestal base; and responsive to outputs from the temperature probe, the controller is configured to control a heating and / or a cooling arrangement of the pedestal assembly.

49. A method for semiconductor processing, the method comprising: operating a semiconductor processing system, the system comprising; a controller; a temperature probe; a pedestal assembly comprising a pedestal base and a support column, the pedestal base having a first side, proximal to a work piece, the work piece being disposed on and supported by the pedestal assembly underneath a showerhead, and a second side distal from the work piece; and a support column coupled with the second side, the support column extending away from the second side along a longitudinal axis, wherein: the pedestal base includes a first passage, and the support column includes a second passage, the first passage and the second passage being mutually adjoining at an interfaceDocket No. LAM1P021WO between the pedestal base and the support column and providing a channel from a distal end of the support column to a peripheral region of the pedestal base, the channel being configured to accommodate installation and removal of a temperature probe; the first passage includes a first portion approximately parallel to the first side and the second passage includes a second portion approximately parallel to the longitudinal axis; and proximal to the interface, the channel has a curved portion, a distal end of the curved portion aligned with the second portion and a proximal end of the curved portion being aligned with the first portion, wherein: the temperature probe is configured to include a temperature sensor disposed at a proximal end of the temperature probe, an electrical conductor disposed at a distal end of the temperature probe and an elongated portion extending between the temperature sensor and the electrical conductor, wherein after installation of the temperature probe, the temperature sensor is configured to sense a temperature of the peripheral region of the pedestal base; and with the controller, controlling a heating and / or a cooling arrangement of the pedestal assembly.

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