Flux cleaning agent composition

Abstract

In one aspect, provided are a flux cleaning agent and a cleaning method, wherein when cleaning electronic components mounted using high-melting-point solder containing lead, it is possible to prevent lead from leaching into the cleaning agent.　In one aspect, disclosed is a flux cleaning agent composition containing component A, component B, and component C. Component A: organic solvent; Component B: aliphatic tertiary amine represented by formula (III); and Component C: phosphoric acid ester.

Description

Flux cleaning composition

[0001] The present disclosure relates to a flux cleaning composition, a cleaning method using the cleaning composition, and a method for producing electronic components.

[0002] 2. Description of the Related Art In order to reduce manufacturing costs, metals such as copper and copper alloys are used for electrodes forming circuits on electronic substrates such as semiconductor packages.

[0003] Surface mounting, which improves mounting density, is widely used as a mounting method for printed wiring boards. To improve mounting density, a known technique involves applying a nanometal paste between the wiring on the board and the terminals of the electronic device, melting and solidifying the nanometal by heating, and bonding the wiring on the board and the terminals of the electronic device.

[0004] Meanwhile, techniques for cleaning solder flux from electronic components after soldering are known. For example, Japanese Patent Laid-Open Publication No. 2013-53198 (Patent Document 1) proposes a cleaning composition for soldering flux containing a specific polycarboxylic acid compound, a phosphate ester surfactant, and an organic solvent. Japanese Patent Laid-Open Publication No. 2022-72721 (Patent Document 2) proposes a cleaning composition containing a glycol ether compound, a hydrophobic tertiary amine compound, a hydrophilic carboxylic acid, and water.

[0005] In one aspect, the present disclosure relates to a flux cleaning composition containing the following components A, B, and C: Component A: an organic solvent; Component B: an aliphatic tertiary amine represented by the following formula (III); and Component C: a phosphoric acid ester. In the above formula (III), R 4 , R 5 and R 6 are the same or different and represent a linear or branched alkyl or alkenyl group having from 1 to 24 carbon atoms; R 4 , R 5 and R 6 The sum of the carbon numbers of the above is 18 or more.

[0006] In one aspect, the present disclosure relates to a cleaning method including a cleaning step of cleaning an object having flux residue with the flux cleaning composition of the present disclosure.

[0007] In one aspect, the present disclosure relates to a method for producing electronic components, including a cleaning step of cleaning an object having flux residue with the flux cleaning composition of the present disclosure.

[0008] In one aspect, the present disclosure relates to a flux cleaning composition comprising the following components A, B, and C: Component A: an organic solvent; Component B: an aliphatic tertiary amine represented by the following formula (III); and Component C: a phosphoric acid ester. In the above formula (III), R 4 , R 5 and R 6 are the same or different and represent a linear or branched alkyl or alkenyl group having from 1 to 24 carbon atoms; R 4 , R 5 and R 6 The sum of the carbon numbers of the above is 18 or more.

[0009] Lead solder, particularly high-melting-point solder containing 90% or more by mass of lead, is often used in the assembly of electronic components. When cleaning (removing) flux (flux residue) remaining on electronic components mounted using such high-melting-point solder containing lead, cleaning agents containing organic solvents, such as those proposed in Patent Documents 1 and 2, can effectively remove the flux residue. However, lead may leach from the lead solder into the cleaning agent during the cleaning process or the rinsing process after the cleaning process, resulting in lead corrosion. Furthermore, lead leaching into the cleaning agent can precipitate insoluble lead compounds during the drying process after the rinsing process. These precipitated insoluble lead compounds can lead to reduced electrical reliability of electronic components, such as reduced insulation resistance and product performance. Therefore, there is a need for a flux cleaner that maintains flux removal (cleaning ability and flux residue removal) while minimizing lead leaching into the cleaning agent when cleaning electronic components mounted using high-melting-point solder containing lead.

[0010] Therefore, the present disclosure provides a flux cleaning agent composition, a cleaning method, and a method for manufacturing electronic components that can suppress the elution of lead into the cleaning agent when cleaning electronic components mounted with high-melting-point solder containing lead.

[0011] In one or more embodiments, the present disclosure can provide a flux cleaning agent composition, a cleaning method, and a method for manufacturing electronic components, which can suppress the elution of lead into a cleaning agent when cleaning electronic components mounted using high-melting-point solder containing lead.

[0012] The inventors discovered that the combined use of a specific aliphatic tertiary amine (component B) and phosphate ester (component C) as a cleaning agent can suppress lead elution into the cleaning agent while maintaining flux removal (flux residue removal) when cleaning electronic components mounted with high-melting-point solder containing lead.

[0013] That is, in one aspect, the present disclosure relates to a flux cleaning composition (hereinafter also referred to as the "cleaning composition of the present disclosure") containing the following components A, B, and C: Component A: an organic solvent; Component B: an aliphatic tertiary amine represented by the following formula (III); and Component C: a phosphoric acid ester. In the above formula (III), R 4 , R 5 and R 6 are the same or different and represent a linear or branched alkyl or alkenyl group having from 1 to 24 carbon atoms; R 4 , R 5 and R 6 The sum of the carbon numbers of the above is 18 or more.

[0014] According to the present disclosure, when cleaning electronic components mounted using high-melting-point solder containing lead, the elution of lead into the cleaning agent can be suppressed.

[0015] Although the details of the mechanism of action by which the effects of the present disclosure are exhibited are partially unclear, it is speculated as follows. It is speculated that the presence of two types of components in the cleaning composition of the present disclosure, a specific aliphatic tertiary amine (component B) and a phosphate ester (component C), promotes the formation of an organic film on lead. It is also speculated that components B and C interact, for example, by forming a salt. As a result, it is thought that damage to the lead surface is suppressed during the cleaning and rinsing steps while maintaining excellent flux removability (flux residue removability), i.e., elution and corrosion of lead metal are suppressed, which in turn suppresses the precipitation of insoluble lead compounds during the drying step. However, the present disclosure need not be interpreted as being limited to this mechanism.

[0016] In one or more embodiments, the term "flux" used in the present disclosure refers to a flux used to bond two components together through a sintering process (e.g., a process of maintaining a high temperature of 200°C or higher), for example, to bond a heat sink to a semiconductor element or a substrate. In one or more embodiments, the flux is a bonding aid whose main component is acid. In one or more embodiments, the "flux" to be removed by cleaning in the present disclosure refers to a flux used in a soldering process (bonding) using lead-containing solder, or a flux used in a soldering process (bonding) using high-melting-point solder (e.g., Pb-5Sn, Pb-10Sn, etc.), which is referred to as "flux residue." In one or more embodiments, the term "flux residue" used in the present disclosure refers to flux remaining on an electronic component or a semi-finished product thereof that has been mounted using lead-containing solder or high-melting-point solder. Here, the semi-finished product refers to an item in the manufacturing stage of the electronic component. In one or more embodiments, the term "flux residue" in the present disclosure refers to flux remaining after joining two components by a sintering process. In one or more embodiments, the term "flux cleaning composition" in the present disclosure refers to a cleaning composition for removing flux residue from electronic components mounted by soldering or semi-finished products thereof. In one or more embodiments, the term "flux cleaning composition" in the present disclosure refers to a cleaning composition for removing flux residue from electronic components mounted using high-melting-point solder containing 90% by mass or more of lead or semi-finished products thereof. In one or more embodiments, the term "flux cleaning composition" in the present disclosure refers to a cleaning composition for removing flux residue remaining after joining two components by a sintering process (cleaning composition for removing flux residue).

[0017] [Component A: Organic Solvent] The organic solvent (hereinafter also referred to as "Component A") contained in the cleaning composition of the present disclosure may be one type or a combination of two or more types. In one or more embodiments, from the viewpoint of improving flux removability, Component A is preferably at least one type selected from the group consisting of a compound represented by the following formula (I) and a compound represented by the following formula (II):

[0018] <Compound represented by formula (I)> R 1 -O-(AO) n -R 2 (I) In the above formula (I), R 1 is a phenyl group or an alkyl group having 1 to 8 carbon atoms, and R 2 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; AO is an ethylene oxide group or a propylene oxide group; n is the number of moles of AO added and is an integer of 1 to 3.

[0019] In the above formula (I), R 1 From the viewpoint of improving flux removability, R is a phenyl group or an alkyl group having 1 to 8 carbon atoms, preferably a phenyl group or an alkyl group having 4 to 6 carbon atoms, and more preferably an alkyl group having 4 to 6 carbon atoms. 2 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, preferably a hydrogen atom or an alkyl group having 2 to 4 carbon atoms, and more preferably a hydrogen atom, from the viewpoint of improving flux removability. In the above formula (I), AO is an ethyleneoxy group (EO) or a propyleneoxy group (PO), preferably an ethyleneoxy group, from the viewpoint of improving flux removability. In the above formula (I), n is an integer of 1 to 3, preferably 1 or 2, and more preferably 2, from the viewpoint of improving flux removability.

[0020] Examples of the compound represented by formula (I) above include monophenyl ethers such as ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, and triethylene glycol monophenyl ether; monoalkyl ethers having an alkyl group having from 1 to 8 carbon atoms, such as ethylene glycol monoalkyl ether, diethylene glycol monoalkyl ether, and triethylene glycol monoalkyl ether; dialkyl ethers having an alkyl group having from 1 to 8 carbon atoms and an alkyl group having from 1 to 4 carbon atoms, such as ethylene glycol dialkyl ether, diethylene glycol dialkyl ether, and triethylene glycol dialkyl ether; phenyl alkyl ethers having a phenyl group and an alkyl group having from 1 to 4 carbon atoms, such as ethylene glycol phenyl alkyl ether, diethylene glycol phenyl alkyl ether, and triethylene glycol phenyl alkyl ether; and the like. Among these, from the viewpoint of improving flux removability, the compound represented by formula (I) is preferably at least one selected from ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, ethylene glycol monohexyl ether, diethylene glycol monohexyl ether, ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, propylene glycol monobutyl ether, dipropylene glycol monobutyl ether, tripropylene glycol monobutyl ether, ethylene glycol dibutyl ether, diethylene glycol dibutyl ether, diethylene glycol dibutyl ether and triethylene glycol dimethyl ether, more preferably at least one selected from diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, diethylene glycol monophenyl ether, dipropylene glycol monobutyl ether and diethylene glycol dibutyl ether, and even more preferably at least one selected from diethylene glycol monobutyl ether, dipropylene glycol monobutyl ether and diethylene glycol monohexyl ether.

[0021] <Compound represented by formula (II)> R 3 —CHOH (II) In the above formula (II), R 3 is a phenyl group, a benzyl group, a cyclohexyl group, a furyl group, a tetrahydrofuryl group, a furfuryl group, or a tetrahydrofurfuryl group.

[0022] In the above formula (II), R 3 is a phenyl group, a benzyl group, a cyclohexyl group, a furyl group, a tetrahydrofuryl group, a furfuryl group, or a tetrahydrofurfuryl group, preferably a phenyl group, a cyclohexyl group, or a tetrahydrofuryl group, more preferably a phenyl group or a tetrahydrofuryl group, and even more preferably a phenyl group, from the viewpoint of improving flux removability.

[0023] Examples of the compound represented by formula (II) include at least one selected from benzyl alcohol, phenethyl alcohol, cyclohexanemethanol, furfuryl alcohol, and tetrahydrofurfuryl alcohol. Among these, from the viewpoint of improving flux removability, the compound represented by formula (II) is preferably at least one selected from benzyl alcohol, furfuryl alcohol, and tetrahydrofurfuryl alcohol, more preferably at least one selected from benzyl alcohol and tetrahydrofurfuryl alcohol, and even more preferably benzyl alcohol.

[0024] From the viewpoint of improving flux removability, Component A is preferably at least one selected from diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, dipropylene glycol monobutyl ether, and benzyl alcohol.

[0025] The content of Component A during use of the cleaning composition of the present disclosure is preferably 35% by mass or more, more preferably 50% by mass or more, and even more preferably 75% by mass or more, from the viewpoint of improving flux removability, and is preferably 99.5% by mass or less, more preferably 97.5% by mass or less, and even more preferably 95.0% by mass or less or 90% by mass or less, from the viewpoint of lowering the flash point. More specifically, the content of Component A during use of the cleaning composition of the present disclosure is preferably 35% by mass or more and 99.5% by mass or less, more preferably 50% by mass or more and 97.5% by mass or less, and even more preferably 75% by mass or more and 95.0% by mass or less or 75% by mass or more and 90% by mass or less. When Component A is a combination of two or more types, the content of Component A refers to the total content of those components.

[0026] [Component B: Aliphatic Tertiary Amine] In one or more embodiments, the aliphatic tertiary amine (hereinafter also referred to as "Component B") contained in the cleaning composition of the present disclosure is a compound represented by the following formula (III). Component B may be in the form of a salt of this compound. Component B may also form a salt with Component C in the cleaning composition. Component B may be one type, or two or more types may be combined. In the above formula (III), R 4 , R 5 and R 6 are the same or different and represent a linear or branched alkyl or alkenyl group having from 1 to 24 carbon atoms; R 4 , R 5 and R 6 The sum of the carbon numbers of the above is 18 or more.

[0027] In the above formula (III), R 4 , R 5 and R 6 are each independently a linear or branched alkyl or alkenyl group having 1 to 24 carbon atoms, more preferably a linear alkyl group having 1 to 24 carbon atoms, from the viewpoint of reducing the elution of lead into the cleaning agent. 4 , R 5 and R 6From the viewpoint of reducing the elution of lead into the cleaning agent, the sum of the carbon numbers of R is 18 or more, preferably 20 or more, and more preferably 22 or more, and from the viewpoint of solubility in water at the time of blending, the sum of the carbon numbers of R is preferably 30 or less, more preferably 28 or less, and even more preferably 26 or less. 4 , R 5 and R 6 The number of carbon atoms in R is determined from the viewpoint of reducing the elution of lead into the cleaning agent. 4 and R 5 Each of these is 1 and R 6 is 16 or more, or R 4 is 1 and R 5 and R 6 Each of these is 9 or more, or R 4 , R 5 and R 6 is preferably 6 or more, and R 4 and R 5 Each of these is 1 and R 6 is 18 or more, or R 4 is 1 and R 5 and R 6 Each of these is 10 or more, or R 4 , R 5 and R 6 It is more preferable that each of these is 8 or more.

[0028] Examples of Component B include dimethylpalmitylamine, dimethylstearylamine, didecylmonomethylamine, trioctylamine, trilaurylamine, etc. Among these, from the viewpoint of reducing elution of lead into the cleaning agent and from the viewpoint of solubility in water at the time of blending, Component B is preferably at least one selected from dimethylstearylamine, didecylmonomethylamine, and trioctylamine, and more preferably trioctylamine.

[0029] The content of component B during use of the cleaning composition of the present disclosure is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, and even more preferably 0.5% by mass or more, from the viewpoint of reducing lead elution into the cleaning agent, and from the viewpoint of solubility in water during blending, it is preferably 10% by mass or less, more preferably 7.5% by mass or less, and even more preferably 5.0% by mass or less. More specifically, the content of component B during use of the cleaning composition of the present disclosure is preferably 0.1% by mass or more and 10% by mass or less, more preferably 0.3% by mass or more and 7.5% by mass or less, and even more preferably 0.5% by mass or more and 5.0% by mass or less. When component B is a combination of two or more types, the content of component B refers to the total content thereof.

[0030] [Component C: Phosphate Ester] In one or more embodiments, the phosphate ester (hereinafter also referred to as "Component C") contained in the detergent composition of the present disclosure is a phosphate ester surfactant. In one or more embodiments, Component C of the present disclosure includes a compound represented by the following formula (IV). Component C of the present disclosure may be one type or a combination of two or more types. Component C may be in the form of a salt of the compound. Furthermore, Component C may form a salt with Component B in the detergent composition. In the above formula (IV), R 7 represents a linear or branched alkyl group having 1 to 20 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having 1 to 12 carbon atoms, p is an integer from 0 to 20, X is a hydroxyl group or R 8 -O-(CH2CH2O) q - indicates R 8 represents a linear or branched alkyl group having from 1 to 20 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having from 1 to 12 carbon atoms, and q represents an integer from 0 to 20.

[0031] In the above formula (IV), R 7From the viewpoint of reducing the elution of lead into the cleaning agent, R is a linear or branched alkyl group having 1 to 20 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having 1 to 12 carbon atoms, preferably a linear or branched alkyl group having 1 to 20 carbon atoms, and more preferably a linear alkyl group having 1 to 20 carbon atoms. 7 From the viewpoint of reducing the elution of lead into the detergent, the number of carbon atoms in R is preferably 4 or more, more preferably 8 or more, and from the same viewpoint, it is preferably 18 or less, more preferably 16 or less. 7 is a linear alkyl group having preferably 4 or more carbon atoms, more preferably 8 or more carbon atoms, from the viewpoint of reducing the elution of lead into the cleaning agent, and from the same viewpoint, is preferably 18 or less, more preferably 16 or less carbon atoms. In the above formula (IV), p is an integer of 0 to 20, preferably 10 or less, more preferably 5 or less, from the viewpoint of reducing the elution of lead into the cleaning agent. p may be 0. In the above formula (IV), X is a hydroxyl group or R 8 -O-(CH2CH2O) q - (However, R 8 represents a linear or branched alkyl group having 1 to 20 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having 1 to 12 carbon atoms, and q represents an integer of 0 to 20), and preferably R 8 -O-(CH2CH2O) q In the above formula (IV), R 8 From the viewpoint of reducing the elution of lead into the cleaning agent, R is a linear or branched alkyl group having 1 to 20 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having 1 to 12 carbon atoms, preferably a linear or branched alkyl group having 1 to 20 carbon atoms, and more preferably a linear alkyl group having 1 to 20 carbon atoms. 8 From the viewpoint of reducing the elution of lead into the detergent, the number of carbon atoms in R is preferably 4 or more, more preferably 8 or more, and from the same viewpoint, it is preferably 18 or less, more preferably 16 or less. 8is a linear alkyl group having preferably 4 or more carbon atoms, more preferably 8 or more carbon atoms, from the viewpoint of reducing the elution of lead into the cleaning agent, and from the same viewpoint, is preferably 18 or less, more preferably 16 or less carbon atoms. In the above formula (IV), q is an integer from 0 to 20, and is preferably 10 or less, more preferably 5 or less, and even more preferably 0, from the viewpoint of reducing the elution of lead into the cleaning agent.

[0032] Examples of Component C include at least one selected from methyl phosphate, monobutyl phosphate, dibutyl phosphate, 2-ethylhexyl acid phosphate, bis(2-ethylhexyl) acid phosphate, isotridecyl acid phosphate, laureth-2-phosphate, laureth-4-phosphate, and steareth-2-phosphate. Among these, from the viewpoint of reducing elution of lead into the cleaning agent, Component C is preferably at least one selected from 2-ethylhexyl acid phosphate, bis(2-ethylhexyl) acid phosphate, isotridecyl acid phosphate, laureth-2-phosphate, laureth-4-phosphate, and steareth-2-phosphate, and more preferably at least one selected from isotridecyl acid phosphate and steareth-2-phosphate.

[0033] The content of component C during use of the cleaning composition of the present disclosure is preferably 0.05% by mass or more, more preferably 0.1% by mass or more, and even more preferably 0.3% by mass or more, from the viewpoint of reducing lead elution into the cleaning agent, and is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 3% by mass or less, from the viewpoint of solubility in water during blending. More specifically, the content of component C during use of the cleaning composition of the present disclosure is preferably 0.05% by mass or more and 10% by mass or less, more preferably 0.1% by mass or more and 5% by mass or less, and even more preferably 0.3% by mass or more and 3% by mass or less. When component C is a combination of two or more types, the content of component C refers to the total content thereof.

[0034] In the cleaning composition of the present disclosure, the molar ratio B / C of component B to component C is preferably 0.1 or more, more preferably 0.3 or more, and even more preferably 0.5 or more, from the viewpoint of reducing elution of lead into the cleaning agent, and from the same viewpoint, is preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. More specifically, the molar ratio B / C is preferably 0.1 or more and 10 or less, more preferably 0.3 or more and 5 or less, and even more preferably 0.5 or more and 3 or less.

[0035] In the cleaning composition of the present disclosure, the mass ratio B / C of component B to component C is preferably 0.01 or more, more preferably 0.1 or more, and even more preferably 0.3 or more, from the viewpoint of reducing lead elution into the cleaning agent, and is preferably 20 or less, more preferably 10 or less, and even more preferably 5 or less. More specifically, the mass ratio B / C is preferably 0.01 or more and 20 or less, more preferably 0.1 or more and 10 or less, and even more preferably 0.3 or more and 5 or less.

[0036] In the cleaning composition of the present disclosure, the mass ratio A / B of Component A to Component B is preferably 10 or more, more preferably 15 or more, and even more preferably 20 or more, from the viewpoint of reducing elution of lead into the cleaning agent, and is preferably 500 or less, more preferably 200 or less, even more preferably 100 or less, and even more preferably 50 or less. More specifically, the mass ratio A / B is preferably 10 or more and 500 or less, more preferably 15 or more and 200 or less, even more preferably 20 or more and 100 or less, and even more preferably 20 or more and 50 or less.

[0037] In the cleaning composition of the present disclosure, the mass ratio A / C of Component A to Component C is preferably 10 or more, more preferably 25 or more, and even more preferably 50 or more, from the viewpoint of reducing lead elution into the cleaning agent, and is preferably 500 or less, more preferably 200 or less, and even more preferably 100 or less, from the viewpoint of reducing lead elution into the cleaning agent. More specifically, the mass ratio A / C is preferably 10 or more and 500 or less, more preferably 25 or more and 200 or less, and even more preferably 50 or more and 100 or less.

[0038] [Component D: Water] In one or more embodiments, the cleaning composition of the present disclosure does not contain water. In one or more embodiments, the cleaning composition of the present disclosure may further contain water (hereinafter also referred to as "component D") from the viewpoint of lowering the flash point. Examples of component D include deionized water, RO water (water treated by a reverse osmosis membrane), distilled water, pure water, and ultrapure water. When the cleaning composition of the present disclosure contains component D, the content of component D during use of the cleaning composition of the present disclosure is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more from the viewpoint of lowering the flash point. Also, from the viewpoint of improving flux removability, the content of component D during use of the cleaning composition of the present disclosure is preferably 1% by mass or more and 15% by mass or less, more preferably 3% by mass or more and even more preferably 5% by mass or more. More specifically, the content of component D during use of the cleaning composition of the present disclosure is preferably 1% by mass or more and 15% by mass or less, more preferably 3% by mass or more and 14% by mass or less, and even more preferably 5% by mass or more and 13% by mass or less.

[0039] In the cleaning composition of the present disclosure, the mass ratio A / D of Component A to Component D is preferably 1 or more, more preferably 5 or more, and even more preferably 7 or more from the viewpoint of improving flux removability, and is preferably 50 or less, more preferably 20 or less, and even more preferably 10 or less from the viewpoint of lowering the flash point. More specifically, the mass ratio A / D is preferably 1 or more and 50 or less, more preferably 5 or more and 20 or less, and even more preferably 7 or more and 10 or less.

[0040] In the cleaning composition of the present disclosure, the mass ratio B / D of component B to component D is preferably 0.0001 or more, more preferably 0.005 or more, even more preferably 0.01 or more, and still more preferably 0.1 or more, from the viewpoint of reducing elution of lead into the cleaning agent, and from the viewpoint of solubility in water at the time of blending, is preferably 10 or less, more preferably 2 or less, and still more preferably 1 or less. More specifically, the mass ratio B / D is preferably 0.0001 or more and 10 or less, more preferably 0.005 or more and 2 or less, even more preferably 0.01 or more and 1 or less, and still more preferably 0.1 or more and 1 or less.

[0041] In the cleaning composition of the present disclosure, the mass ratio C / D of Component C to Component D is preferably 0.0001 or more, more preferably 0.005 or more, and even more preferably 0.01 or more from the viewpoint of reducing elution of lead into the cleaning agent, and from the viewpoint of solubility in water at the time of blending, is preferably 5 or less, more preferably 1 or less, and even more preferably 0.5 or less. More specifically, the mass ratio C / D is preferably 0.0001 or more and 5 or less, more preferably 0.005 or more and 1 or less, and even more preferably 0.01 or more and 0.5 or less.

[0042] From the viewpoint of reducing lead elution into the cleaning agent, the total content of Components A, B, and C in the cleaning composition of the present disclosure is preferably 40% by mass or more, more preferably 60% by mass or more, even more preferably 80% by mass or more, and preferably 99% by mass or less, more preferably 97% by mass or less, and even more preferably 95% by mass or less. More specifically, the total content of Components A, B, and C in the cleaning composition of the present disclosure is preferably 40% by mass or more and 99% by mass or less, more preferably 60% by mass or more and 97% by mass or less, and even more preferably 80% by mass or more and 95% by mass or less.

[0043] [Other Components] The cleaning composition of the present disclosure may contain, as needed, appropriate components typically used in cleaning agents, such as a chelating agent, a rust inhibitor, a thickener, a dispersant, a solvent other than Component A, a basic substance, a pH adjuster, a polymer compound, a surfactant other than Component C, a solubilizer, a preservative, a bactericide, an antibacterial agent, an antifoaming agent, and an antioxidant, within a range that does not impair the effects of the present disclosure. The content of other components in the cleaning composition of the present disclosure is preferably 0% by mass or more, and preferably 10% by mass or less, more preferably 8% by mass or less, and even more preferably 6% by mass or less.

[0044] In one or more embodiments, the cleaning composition of the present disclosure may be substantially free of a water-insoluble polycarboxylic acid. For example, the content of the water-insoluble polycarboxylic acid in the cleaning composition of the present disclosure is preferably less than 0.05% by mass, more preferably 0.01% by mass or less, and even more preferably 0% by mass (i.e., no content). In one or more embodiments, the cleaning composition of the present disclosure may be substantially free of a hydrophilic carboxylic acid. For example, the content of the hydrophilic carboxylic acid in the cleaning composition of the present disclosure is preferably less than 0.01% by mass, and more preferably 0% by mass (i.e., no content). In one or more embodiments, the cleaning composition of the present disclosure may be substantially free of a phosphonic acid compound. For example, the content of the phosphonic acid compound in the cleaning composition of the present disclosure is preferably less than 0.2% by mass, preferably 0.01% by mass or less, and even more preferably 0% by mass (i.e., no content).

[0045] [Method for Producing Detergent Composition] The detergent composition of the present disclosure can be produced, for example, by blending component A, component B, component C, and, as needed, optional components (component D and other components) using a known method. In one or more embodiments, the detergent composition of the present disclosure can be produced by blending at least component A, component B, and component C. Accordingly, in one aspect, the present disclosure relates to a method for producing a detergent composition, the method including a step of blending at least component A, component B, and component C. In the present disclosure, the term "blending" includes mixing component A, component B, component C, and, as needed, optional components (component D and other components) simultaneously or in any order. In the method for producing a detergent composition of the present disclosure, the blending amount of each component can be the same as the content of each component when the detergent composition of the present disclosure is used as described above. In the present disclosure, the "content of each component when the detergent composition is used" refers to the content of each component at the time of cleaning, i.e., at the time when the detergent composition is first used for cleaning. In one or more embodiments, the content of each component when the detergent composition of the present disclosure is used can be considered to be the blending amount of each component in the detergent composition of the present disclosure. However, if the product is affected by neutralization, the blending amount and content may differ.

[0046] [pH of Detergent Composition] From the viewpoint of reducing elution of lead into the detergent, the pH of the detergent composition of the present disclosure is preferably 5 or more, more preferably 6 or more, and from the same viewpoint, preferably 12 or less, more preferably 11 or less, and even more preferably 10 or less. More specifically, the pH of the detergent composition of the present disclosure is preferably 5 or more and 12 or less, more preferably 6 or more and 11 or less, and even more preferably 6 or more and 10 or less. If necessary, the pH can be adjusted using inorganic acids such as nitric acid and sulfuric acid, organic acids such as oxycarboxylic acids, polycarboxylic acids, aminopolycarboxylic acids, and amino acids, as well as metal salts or ammonium salts thereof, ammonia, sodium hydroxide, potassium hydroxide, amines, carboxylic acids having 8 or more carbon atoms, etc. In the present disclosure, the pH of the detergent composition is the pH at 25°C when the detergent composition is in use, and can be measured by the method described in the Examples.

[0047] [Object to be Cleaned] In one or more embodiments, the object to be cleaned is an object to be cleaned that has flux residue. In one or more embodiments, the object to be cleaned that has flux residue is an electronic component that has flux residue. In one or more embodiments, the electronic component can be an electronic component mounted by soldering or a semi-finished product thereof. Here, in one or more embodiments, the semi-finished product refers to an electronic component in the manufacturing stage. In one or more embodiments, the object to be cleaned that has flux residue can be an electronic component that has lead-containing solder and flux residue. Examples of the electronic component that has lead-containing solder and flux residue include electronic components that are mounted using high-melting-point solder containing 90% by mass or more and that have flux residue attached thereto. Therefore, in one or more embodiments, the cleaning composition of the present disclosure is suitable for removing (cleaning) flux residue from electronic components that are mounted by soldering or semi-finished products thereof, particularly electronic components that are mounted using high-melting-point solder containing 90% by mass or more and that have flux residue attached thereto. That is, in one or more embodiments, the cleaning composition of the present disclosure is a cleaning agent for removing flux residue remaining on electronic components mounted with high-melting-point solder containing 90 mass % or more of lead, or on semi-finished electronic components.

[0048] In one or more embodiments, the cleaning composition of the present disclosure is used to clean an object having flux residue, particularly an object having flux residue remaining after joining two members by a sintering process. In one or more embodiments, the object to be cleaned may be a substrate having flux residue that has undergone a heating process to 200°C or higher. In one or more embodiments, the substrate may have a copper-containing metal member thereon. In one or more embodiments, the heating process to 200°C or higher is a process of maintaining the substrate at a high temperature of 200°C or higher (sintering process). In one or more embodiments, the object to be cleaned having flux residue may be a substrate having flux residue that has undergone a process of applying a flux-containing slurry between the substrate and a metal member or between two metal members on the substrate and then heating the substrate to 200°C or higher (sintering process). Therefore, in one aspect, the present disclosure relates to use of the cleaning composition of the present disclosure in cleaning a substrate having flux residue, which has undergone a step of applying a flux-containing slurry between a substrate and a metal member or between two metal members on a substrate and then heating the slurry to 200°C or higher (sintering step). In the sintering step, the heating temperature can be, for example, 200°C to 350°C. The heating time can be, for example, 3 minutes to 5 hours. From the viewpoint of exhibiting cleaning properties against thermal denaturation of the flux, the object to be cleaned is preferably an object to be cleaned that has been heated for 1 hour or more. In one or more embodiments, the substrate surface and / or metal member of the object to be cleaned contains lead or a lead alloy. In one or more embodiments, the flux contains an acid as a main component. Examples of the acid include organic acids such as abietic acid. In one or more embodiments, the flux-containing slurry can further contain metal particles. Examples of the metal particles include tin, lead, copper, silver, or a mixture of these metals. In one or more embodiments, the metal particles serve as a bonding material capable of bonding between a substrate and a metal member or between two metal members on a substrate. In one or more embodiments, the slurry containing the flux can be used as a die attach paste.When the flux-containing slurry further contains metal particles, the slurry can be used as a conductive die-attach paste in one or more embodiments. In one or more embodiments, the metal member is fixed on a substrate. In one or more embodiments, the metal of the metal member includes copper, iron, or another metal. Examples of the metal member include a heat sink, an electric circuit, and the like. In one or more embodiments, the substrate includes a substrate having a metal surface, such as a copper plate, a steel plate, a stainless steel plate, or a copper-wiring printed circuit board.

[0049] [Cleaning Method] In one aspect, the present disclosure relates to a cleaning method (hereinafter also referred to as the "cleaning method of the present disclosure") including a cleaning step of cleaning an object having flux residue with the cleaning composition of the present disclosure. Examples of the object include the objects described above. In one or more embodiments, the cleaning step includes contacting the object having flux residue with the cleaning composition of the present disclosure. The cleaning method of the present disclosure can reduce lead elution into the cleaning agent while maintaining flux removability. In another aspect, the present disclosure relates to use of the cleaning composition of the present disclosure for suppressing lead elution into the cleaning agent and removing flux residue. Examples of methods for cleaning an object with the cleaning composition of the present disclosure or for contacting the object with the cleaning composition of the present disclosure include a method of immersing the object in a bathtub of an ultrasonic cleaning device for contact, and a method of spraying the cleaning composition (shower method) for contact. In one or more embodiments, the cleaning composition of the present disclosure can be used for cleaning as is without dilution. In one or more embodiments, the cleaning step is a step of immersing the object to be cleaned in the cleaning composition of the present disclosure. The immersion temperature is preferably 20°C or higher, more preferably 30°C or higher, and even more preferably 40°C or higher from the viewpoint of improving flux removability. From the viewpoints of reducing lead elution into the cleaning agent, handling safety, and reducing equipment load, the immersion temperature is preferably 80°C or lower, more preferably 70°C or lower, and even more preferably 60°C or lower. From the same viewpoints, the immersion time is preferably 1 minute or longer, more preferably 3 minutes or longer, and even more preferably 5 minutes or longer, and preferably 3 hours or shorter, more preferably 2 hours or shorter, and even more preferably 1 hour or shorter. In one or more embodiments, the cleaning method of the present disclosure preferably includes a step of rinsing the object to be cleaned with water and / or an alcohol such as methanol or a halogenated solvent (rinsing step) and a drying step (drying step) after contacting the object to be cleaned with the cleaning composition (after the cleaning step). In the cleaning method of the present disclosure, it is preferable to irradiate the cleaning composition of the present disclosure with ultrasonic waves when the cleaning composition comes into contact with the object to be cleaned, since this makes it easier for the cleaning power of the cleaning composition of the present disclosure to be exerted. It is more preferable that the ultrasonic waves be relatively strong.

[0050] [Method for Manufacturing Electronic Components] In one aspect, the present disclosure relates to a method for manufacturing electronic components (hereinafter also referred to as the "method for manufacturing electronic components of the present disclosure"), which includes a cleaning step of cleaning an object having flux residue with the cleaning composition for flux of the present disclosure. Examples of the object to be cleaned include the objects described above. In one or more embodiments, the cleaning step includes contacting the object having flux residue with the cleaning composition of the present disclosure. Examples of cleaning methods in the cleaning step include methods similar to the cleaning method of the present disclosure described above. In one or more embodiments, the cleaning step is a step of cleaning electronic components or semi-finished products thereof, which are mounted using high-melting-point solder containing 90% by mass or more of lead and to which flux residue is attached, with the cleaning composition of the present disclosure. Here, in one or more embodiments, the semi-finished products refer to the electronic components in the manufacturing stage.

[0051] The present disclosure further relates to one or more of the following embodiments: <1> A flux cleaning composition containing the following components A, B, and C: Component A: an organic solvent; Component B: an aliphatic tertiary amine represented by the following formula (III); and Component C: a phosphoric acid ester. In the above formula (III), R 4 , R 5 and R 6 are the same or different and represent a linear or branched alkyl or alkenyl group having from 1 to 24 carbon atoms; R 4 , R 5 and R 6 The sum of the carbon numbers of the above is 18 or more. <2> The flux cleaning composition according to <1>, wherein Component C is a compound represented by the following formula (IV): In the above formula (IV), R 7 represents a linear or branched alkyl group having 1 to 20 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having 1 to 12 carbon atoms, p is an integer from 0 to 20, X is a hydroxyl group or R 8 -O-(CH2CH2O) q - indicates R 8represents a linear or branched alkyl group having from 1 to 20 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having from 1 to 12 carbon atoms, and q represents an integer from 0 to 20. <3> The flux cleaning composition according to <1> or <2>, wherein Component A is at least one selected from the group consisting of a compound represented by the following formula (I) and a compound represented by the following formula (II): 1 -O-(AO) n -R 2 (I) In the above formula (I), R 1 is a phenyl group or an alkyl group having 1 to 8 carbon atoms, and R 2 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, AO is an ethylene oxide group or a propylene oxide group, and n is the number of moles of AO added, which is an integer of 1 to 3. 3 —CHOH (II) In the above formula (II), R 3represents a phenyl group, a benzyl group, a cyclohexyl group, a furyl group, a tetrahydrofuryl group, a furfuryl group, or a tetrahydrofurfuryl group. <4> The flux cleaning composition according to any one of <1> to <3>, wherein the molar ratio B / C of component B to component C is 0.1 or more and 10 or less, or 0.3 or more and 5 or less, or 0.5 or more and 3 or less. <5> The flux cleaning composition according to any one of <1> to <4>, wherein the mass ratio B / C of component B to component C is 0.01 or more and 20 or less, or 0.1 or more and 10 or less, or 0.3 or more and 5 or less. <6> The flux cleaning composition according to any one of <1> to <5>, wherein the mass ratio A / B of component A to component B is 10 or more and 500 or less, or 15 or more and 200 or less, or 20 or more and 100 or less, or 20 or more and 50 or less. <7> The flux cleaning composition according to any one of <1> to <6>, wherein the mass ratio A / C of component A to component C is 10 or more and 500 or less, or 25 or more and 200 or less, or 50 or more and 100 or less. <8> The flux cleaning composition according to any one of <1> to <7>, wherein the cleaning composition further contains water (component D). <9> The flux cleaning composition according to <8>, wherein the mass ratio A / D of component A to component D is 1 or more and 50 or less, or 5 or more and 20 or less, or 7 or more and 10 or less. <10> The flux cleaning composition according to <8> or <9>, wherein the mass ratio B / D of component B to component D is 0.0001 or more and 10 or less, or 0.005 or more and 2 or less, or 0.01 or more and 1 or less, or 0.1 or more and 1 or less. <11> The flux cleaning composition according to any one of <8> to <10>, wherein the mass ratio C / D of component C to component D is 0.0001 to 5, or 0.005 to 1, or 0.01 to 0.5. <12> The flux cleaning composition according to any one of <1> to <11>, wherein the total content of components A, B, and C in the cleaning composition is 40 to 99% by mass, or 60 to 97% by mass, or 80 to 95% by mass.<13> The flux cleaning composition according to any one of <1> to <12>, wherein the content of component A is 35% by mass or more and 99.5% by mass or less, or 50% by mass or more and 97.5% by mass or less, or 75% by mass or more and 95% by mass or less, or 75% by mass or more and 90% by mass or less. <14> The flux cleaning composition according to any one of <1> to <13>, wherein the content of component B is 0.1% by mass or more and 10% by mass or less, or 0.3% by mass or more and 7.5% by mass or less, or 0.5% by mass or more and 5.0% by mass or less. <15> The flux cleaning composition according to any one of <1> to <14>, wherein the content of component C is 0.05% by mass or more and 10% by mass or less, or 0.1% by mass or more and 5% by mass or less, or 0.3% by mass or more and 3% by mass or less. <16> The flux cleaning composition according to any one of <8> to <15>, wherein the content of component D is 1% by mass or more and 15% by mass or less, or 3% by mass or more and 14% by mass or less, or 5% by mass or more and 13% by mass or less. <17> The flux cleaning composition according to any one of <1> to <16>, which is a cleaning agent for removing flux residue remaining on electronic components mounted using high-melting-point solder containing 90% by mass or more of lead. <18> A cleaning method comprising a cleaning step of cleaning an object to be cleaned having flux residue with the flux cleaning composition according to any one of <1> to <17>. <19> A method for producing electronic components, comprising a cleaning step of cleaning an object to be cleaned having flux residue with the flux cleaning composition according to any one of <1> to <17>. <20> A flux cleaning composition comprising the following components A, B, and C: Component A: an organic solvent; Component B: an aliphatic tertiary amine represented by the following formula (III); and Component C: a phosphoric acid ester. In the above formula (III), R 4 , R 5 and R 6 are the same or different and represent a linear or branched alkyl or alkenyl group having from 1 to 24 carbon atoms; R 4 , R 5 and R 6The sum of the carbon numbers of the above is 18 or more. <21> A flux cleaning composition containing the following components A, B, and C, wherein the molar ratio B / C of component B to component C is 0.1 or more and 10 or less. Component A: at least one organic solvent selected from the group consisting of a compound represented by the following formula (I) and a compound represented by the following formula (II): Component B: an aliphatic tertiary amine represented by the following formula (III): Component C: a phosphate ester R 1 -O-(AO) n -R 2 (I) In the above formula (I), R 1 is a phenyl group or an alkyl group having 1 to 8 carbon atoms, and R 2 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, AO is an ethylene oxide group or a propylene oxide group, and n is the number of moles of AO added, which is an integer of 1 to 3. 3 —CHOH (II) In the above formula (II), R 3 is a phenyl group, a benzyl group, a cyclohexyl group, a furyl group, a tetrahydrofuryl group, a furfuryl group, or a tetrahydrofurfuryl group. In the above formula (III), R 4 , R 5 and R 6 are the same or different and represent a linear or branched alkyl or alkenyl group having from 1 to 24 carbon atoms; R 4 , R 5 and R 6 The sum of the carbon numbers of the above is 18 or more.

[0052] The present disclosure will be specifically described below using examples, but the present disclosure is not limited to these examples in any way.

[0053] 1. Preparation of Detergent Compositions (Examples 1 to 14, Comparative Examples 1 and 2) The components were blended in a 100 mL glass beaker to give the compositions shown in Table 1, and mixed under the following conditions to prepare detergent compositions (pH: 7.2) of Examples 1 to 14 and Comparative Examples 1 and 2. Unless otherwise specified, the numerical value of each component in the table indicates the content (mass%) in the prepared detergent composition. The molar ratio B / C in Comparative Example 1 was calculated assuming that polyoxyethylene stearylamine was component B. <Mixing Conditions> Liquid temperature: 60°C Stirrer: Magnetic stirrer (50 mm rotor) Rotation speed: 300 rpm Stirring time: 1 hour

[0054] The following components are used in the cleaning composition: (Component A) Diethylene glycol monobutyl ether [manufactured by Nippon Nyukazai Co., Ltd.] Dipropylene glycol monobutyl ether [manufactured by Nippon Nyukazai Co., Ltd.] Diethylene glycol monohexyl ether [manufactured by Nippon Nyukazai Co., Ltd.] Benzyl alcohol [manufactured by Tokyo Chemical Industry Co., Ltd.] (Component B) Tri-n-octylamine [manufactured by Tokyo Chemical Industry Co., Ltd.] Didecyl monomethylamine [manufactured by Tokyo Chemical Industry Co., Ltd.] Dimethyl stearylamine [manufactured by Tokyo Chemical Industry Co., Ltd.] (Non-Component B) Polyoxyethylene stearylamine [Kao Corporation] (Component C) Methyl phosphate (mono- and di-mixture) [manufactured by Tokyo Chemical Industry Co., Ltd.] Dibutyl phosphate [manufactured by Tokyo Chemical Industry Co., Ltd.] 2-Ethylhexyl acid phosphate (mono- and di-mixture) [Johoku Chemical Industry Co., Ltd.] Isotridecyl acid phosphate (mono- and di-mixture) [Johoku Chemical Industry Co., Ltd.] Laureth-2-phosphate [Toho Chemical Industry Co., Ltd.] Laureth-4-phosphate [Toho Chemical Industry Co., Ltd.] Steareth-2-phosphate [Toho Chemical Industry Co., Ltd.] (Component D) Water [pure water of 1 μS / cm or less produced using a water purification system G-10DSTSET manufactured by Organo Corporation]

[0055] [pH Measurement] The pH of each cleaning composition was measured at 25°C, and the electrode of a pH meter (HM-30G, manufactured by Toa Denpa Kogyo Co., Ltd.) was immersed in the cleaning composition and the value was measured 3 minutes later.

[0056] 2. Evaluation of Cleaning Compositions The cleaning compositions of Examples 1 to 14 and Comparative Examples 1 and 2 were evaluated as follows.

[0057] [Evaluation of Dissolved Lead Amount] The amount of dissolved lead was evaluated according to the following procedure. First, an ultrasonic cleaning tank was prepared under the following conditions. The ultrasonic cleaning tank was prepared by setting the frequency to 40 kHz and the output to 400 W. 20 g of each cleaning composition was added to a 100 mL glass beaker, which was then placed in the ultrasonic cleaning chamber and heated to 60°C. Next, 0.1 g of lead powder (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) was added to the beaker, which was then inserted into the ultrasonic tank and immersed at 60°C for 1 hour. The cleaning composition was sampled from the beaker, filtered (manufactured by ADVANTEC, 25HP020AN), and then diluted 100-fold with ultrapure water. Using the obtained sample, the amount of dissolved lead in each cleaning composition was calculated by ICP atomic emission spectroscopy (manufactured by Agilent Technologies, Agilent 5100 / 5110 ICP-OES). To calculate the amount of dissolved lead, a lead standard solution (Pb1000) (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) was used, and a calibration curve method was employed. The results are shown in Table 1. The values ​​in the table are converted values ​​before dilution, and it can be evaluated that the lower the value, the more suppressed damage to lead (elution and corrosion) is.

[0058] [Evaluation of Lead Corrosion Resistance and Deposition] The evaluation of lead corrosion resistance was performed as follows. First, an ultrasonic cleaning tank and a rinsing tank were prepared under the following conditions. The ultrasonic cleaning tank was prepared by setting the frequency to 40 kHz and the output to 400 W, adding 20 g of each cleaning composition to a 100 mL glass beaker, placing it in the ultrasonic cleaning chamber, and heating it to 60°C. The rinsing tank was prepared by setting the frequency to 40 kHz and the output to 400 W, adding 20 mL of ultrapure water to a 100 mL glass beaker, placing it in the rinsing tank, and heating it to 40°C. Next, a 1 cm x 1 cm lead test piece (manufactured by Taiyu Kizai Co., Ltd.) was placed in the beaker while held with tweezers, and then inserted into the ultrasonic tank and immersed at 60°C for 1 hour. Before use, the test pieces were wiped with Kimwipes (manufactured by Nippon Paper Crecia Co., Ltd.) coated with acetone (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) and ethanol (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) to remove the rust-preventing components. Next, the test pieces were held with tweezers and inserted into a rinse bath, where they were immersed for 5 minutes. Finally, the test pieces were purged with nitrogen and dried. Before and after the above evaluation, the test pieces were observed using a scanning electron microscope (manufactured by JEOL Ltd., JCM-7000 NeoScope), visually inspected, and compared in appearance before and after storage under constant temperature and humidity conditions. The corrosion resistance (corrosion of lead metal and precipitation of insoluble lead compounds) was evaluated according to the following criteria. The results are shown in Table 1. <Evaluation Criteria> A: No change in appearance before and after cleaning. B: Pitting corrosion less than 1 μm in diameter was observed in some areas after cleaning. C: Pitting corrosion greater than 1 μm in diameter was observed in some areas after cleaning. D: After cleaning, pitting corrosion with a diameter of 1 μm or more and deposits of insoluble lead compounds are observed throughout the surface.

[0059]

[0060] As shown in Table 1 above, the cleaning compositions of Examples 1 to 14 were able to suppress the elution and corrosion of lead metal and the precipitation of insoluble lead compounds compared to Comparative Examples 1 and 2. Therefore, it is considered that the cleaning compositions of Examples 1 to 14 can suppress the elution of lead into the cleaning compositions when cleaning electronic components mounted with high-melting-point solder containing lead.

[0061] The cleaning composition of the present disclosure can, for example, shorten the flux cleaning step in the semiconductor device manufacturing process and improve the performance and reliability of the manufactured semiconductor device, thereby improving the productivity of semiconductor devices.

Claims

1. A flux cleaning composition containing the following components A, B, and C: Component A: organic solvent; Component B: aliphatic tertiary amine represented by the following formula (III); and Component C: phosphoric acid ester. In the above formula (III), R 4 , R 5 and R 6 are the same or different and represent a linear or branched alkyl or alkenyl group having from 1 to 24 carbon atoms; R 4 , R 5 and R 6 The sum of the carbon numbers of the above is 18 or more.

2. The flux cleaning composition according to claim 1, wherein component C is a compound represented by the following formula (IV): In the above formula (IV), R 7 represents a linear or branched alkyl group having 1 to 20 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having 1 to 12 carbon atoms, p is an integer from 0 to 20, X is a hydroxyl group or R 8 -O-(CH2CH2O) q - indicates R 8 represents a linear or branched alkyl group having from 1 to 20 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having from 1 to 12 carbon atoms, and q represents an integer from 0 to 20.

3. The flux cleaning composition according to claim 1 or 2, wherein component A is at least one selected from the group consisting of compounds represented by the following formula (I) and compounds represented by the following formula (II): 1 -O-(AO) n -R 2 (I) In the above formula (I), R 1 is a phenyl group or an alkyl group having 1 to 8 carbon atoms, and R 2 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, AO is an ethylene oxide group or a propylene oxide group, and n is the number of moles of AO added, which is an integer of 1 to 3. 3 —CHOH (II) In the above formula (II), R 3 is a phenyl group, a benzyl group, a cyclohexyl group, a furyl group, a tetrahydrofuryl group, a furfuryl group, or a tetrahydrofurfuryl group.

4. The flux cleaning composition according to any one of claims 1 to 3, wherein the molar ratio B / C of component B to component C is 0.1 or more and 10 or less.

5. A flux cleaning composition according to any one of claims 1 to 4, wherein the mass ratio A / B of component A to component B is 10 or more and 500 or less.

6. The flux cleaning composition according to any one of claims 1 to 5, wherein the mass ratio A / C of component A to component C is 10 or more and 500 or less.

7. The flux cleaning composition according to any one of claims 1 to 6, further comprising water (component D).

8. The flux cleaning composition according to claim 7, wherein the mass ratio A / D of component A to component D is 1 or more and 50 or less.

9. The flux cleaning composition according to any one of claims 1 to 8, which is a cleaning agent for removing flux residue remaining on electronic components mounted using high-melting-point solder containing 90 mass % or more of lead.

10. A cleaning method comprising a cleaning step of cleaning an object having flux residue with the flux cleaning composition according to any one of claims 1 to 9.

11. A method for producing electronic components, comprising a cleaning step of cleaning an object having flux residue with the flux cleaning composition according to any one of claims 1 to 9.

12. A flux cleaning composition comprising the following components A, B, and C: Component A: organic solvent; Component B: aliphatic tertiary amine represented by the following formula (III); and Component C: phosphoric acid ester. In the above formula (III), R 4 , R 5 and R 6 are the same or different and represent a linear or branched alkyl or alkenyl group having from 1 to 24 carbon atoms; R 4 , R 5 and R 6 The sum of the carbon numbers of the above is 18 or more.

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