Testing core die through a scribe lane with mechanical stress-free access from a seal ring
The use of a seal ring with bridge interconnect structures for core die testing addresses the challenge of restricted test pad placement, enabling stress-free and effective circuit testing in fine-pitch stacking structures.
Patent Information
- Application Number
- PCT/US2025/050372
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-13
- Filing Date
- 2025-10-09
- Publication Date
- 2026-06-18
AI Technical Summary
Fine-pitch stacking structures in core dies restrict test pad placement for wafer-level testing, and conventional methods like hybrid bonding and fusion bonding hinder effective circuit testing due to topographical changes and narrow scribe lanes, leading to parasitic loading and area losses.
A die with a seal ring and bridge interconnect structures across it allows mechanical, stress-free access for testing, using BEOL metal interconnects to route signals from test pads outside the seal ring to core circuits, ensuring moisture-blocking and damage resistance during singulation.
Enables effective circuit testing of core dies at the wafer-level without mechanical stress, maintaining seal ring integrity and preventing damage during singulation, while allowing for fine-pitch stacking structures.