Electronic equipment casing structure with double-layer casing
A technology of electronic equipment and double-layer housing, applied in the direction of cabinet/cabinet/drawer parts, etc., can solve problems such as electromagnetic interference, electromagnetic radiation, dust pollution, etc., to improve connection strength, improve user experience, volume reduced effect
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2016-09-07
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention relates to a casing, in particular to a casing structure of electronic equipment used for double-layer casings of computers, instruments, communication equipment and the like. Background technique
[0002] The casing usually refers to the casing used by various electronic products or electronic equipment. According to the use, it can be divided into: computer casing, TV casing, mobile phone casing, instrument casing, motor casing, etc. According to the material, it can be divided into plastic casing, alloy casing, composite material casing and so on.
[0003] At present, there are generally two ways to connect and assemble host electronic components and embedded functional modules of existing electronic equipment or electronic products with the casing. The first connection and assembly method is to install the host electronic components in the casing, and The embedded function module is installed outside the case, and the embedded funct...
Examples
Embodiment Construction
[0024] In order to make the object, technical solution and advantages of the present invention clearer, various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. However, those of ordinary skill in the art can understand that, in each implementation manner of the present invention, many technical details are provided for readers to better understand the present application. However, even without these technical details and various changes and modifications based on the following implementation modes, the technical solution claimed in each claim of the present application can be realized.
[0025] The first embodiment of the present invention relates to a casing structure of electronic equipment with a double-layer casing, such as Figure 1 to Figure 3 As shown, it includes an outer shell 1 for placing host electronic components, and an inner shell 2 with an opening 3 on one side for inserting an embedded funct...