4dB attenuator with 100w power capacity
A technology of power capacity and attenuation sheet, which is applied in the direction of electrical components, circuits, waveguide devices, etc., can solve problems such as increased return loss, attenuation accuracy that cannot meet the requirements, and attenuation accuracy that is difficult to control, so as to improve standing waves, Effect of improving circuit structure and optimizing power capacity
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2014-12-17
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1
Abstract
Description
technical field
[0001] The invention relates to a power attenuation sheet, in particular to a 4dB attenuation sheet with a power capacity of 100 watts. Background technique
[0002] At present, most communication base stations use high-power ceramic load chips to absorb the reverse input power of communication components. High-power ceramic load chips can only simply consume and absorb excess power, but cannot monitor the working conditions of the base station in real time. When the base station fails, it cannot make a timely judgment and has no protective effect on the equipment. The attenuation sheet can not only absorb the reverse input power of the communication components in the communication base station, but also extract part of the signal in the communication components, and monitor the base station in real time, thus forming an effective protection for the equipment.
[0003] As a power consumption component, the attenuator cannot affect the circuits at both ends, ...
Examples
Embodiment Construction
[0012] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0013] like figure 1 As shown, the 4dB attenuator with a power capacity of 100 watts includes an aluminum nitride substrate 1, and a conductive layer is printed on the back of the aluminum nitride substrate 1, and the conductive layer is printed by printing silver paste. The front side of the aluminum nitride substrate 1 is printed with resistors R1, R2, R3, R4, R5 and silver paste wires 2. The resistors R1, R2, R3, R4, and R5 connect the silver paste wires 2 to form an attenuation circuit. The resistors R1, R2 , R3, R4, and R5 are all printed with a glass protective film 3, and the glass protective film 3 is used to protect the resistors R1, R2, R3, R4, and R5. Also be printed with one deck protective film 4 on the upper surface of whole circuit i.e. silver paste conductor 2 and glass protective film 3, on protective film 4, be printed with...