Array substrate, display panel, display device and manufacturing method thereof

Abstract

The present invention provides an array substrate, a display panel, a display device and a manufacturing method thereof. The array substrate provided by the present invention comprises a display area and a non-display area, in which a data line and a passivation layer covering the data line are arranged, and in the non-display area of ​​the array substrate, a protective layer is also arranged above the passivation layer, and the arrangement of the protective layer effectively prevents the passivation layer and the data line from being squeezed by an external force, effectively prevents the problem of the data line being corroded by external water vapor due to damage of the passivation layer, and ensures the normal use of the data line.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to an array substrate, a display panel, a display device and a manufacturing method thereof. Background Art

[0002] With the development of display technology, organic light-emitting diodes (OLED) have been made into array substrates and applied to display devices due to their advantages such as self-luminescence, wide viewing angle, high contrast, low power consumption and high response speed.

[0003] The current array substrate includes a display area and a non-display area. A thin film transistor layer, a metal anode layer, a color film layer, an organic light-emitting material layer and a metal cathode layer are formed in the display area, and data lines and a passivation layer covering the data lines are formed in the non-display area. The passivation layer protects the data lines.

[0004] In the process of manufacturing the array substrate, it is necessary to form a packaging strip at the edge of the display area of ​​the array substrate. The attachment process and hot pressing process of the packaging strip will cause the array substrate to be subjected to greater pressure. The packaging strip in the display area of ​​the array substrate can buffer the external force, thereby protecting the normal use of the circuits in the display area; while the data lines and passivation layers in the non-display area will be subjected to greater pressure, and the passivation layer outside the data lines will be easily damaged, causing the data lines in the passivation layer to be corroded due to the intrusion of external water vapor, thereby affecting the normal use of the array substrate. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide an array substrate, which improves the anti-destruction and anti-corrosion capabilities of the non-display area of ​​the array substrate when subjected to external forces, thereby ensuring the normal use of the array substrate.

[0006] On the one hand, an array substrate is provided, which includes a display area and a non-display area, wherein data lines and a passivation layer covering the data lines are arranged in the display area and the non-display area; in the non-display area of ​​the array substrate, a protective layer is also arranged above the passivation layer to prevent the data lines from being squeezed by external force.

[0007] Further, at least a portion of an orthographic projection of the data line on the base substrate of the array substrate does not overlap with an orthographic projection of the protection layer on the base substrate.

[0008] Furthermore, the protection layer is arranged on both sides of the data line;

[0009] An orthographic projection of the data line on the base substrate does not overlap with an orthographic projection of the protection layer on the base substrate.

[0010] Furthermore, the array substrate further comprises a circuit board, on which a metal wire is arranged, and the metal wire is connected to the data wire through a conductive adhesive and a via hole arranged on the passivation layer;

[0011] The orthographic projection of the metal line on the base substrate is located between the orthographic projections of the protection layer on the base substrate.

[0012] Furthermore, the thickness of the protection layer is greater than the thickness of the data line.

[0013] Furthermore, a packaging layer is formed on the display area of ​​the array substrate, and the distance between a portion of the protection layer close to the display area and the packaging layer is greater than a preset distance.

[0014] Furthermore, an organic light emitting diode structure layer is arranged in the display area of ​​the array substrate, and the organic light emitting diode structure layer includes a pixel definition layer, and the pixel definition layer is arranged in the same layer as the protection layer.

[0015] Furthermore, a metal layer for discharging static electricity is provided in the non-display area of ​​the array substrate, an insulating layer is provided on the metal layer, the data line is provided on the insulating layer, and the passivation layer covers the data line and the insulating layer.

[0016] Furthermore, the protective layer is a sphere, a cylinder or a cuboid.

[0017] Furthermore, the protective layer is a resin layer.

[0018] On the other hand, a display panel is provided, comprising the above array substrate.

[0019] On the other hand, a display device is provided, comprising the above-mentioned display panel.

[0020] On the other hand, a method for manufacturing the array substrate is provided, the method comprising:

[0021] When forming an array substrate, data lines and a passivation layer covering the data lines are sequentially formed in a display area and a non-display area of ​​the array substrate;

[0022] In the non-display area of ​​the array substrate, a protection layer is formed above the passivation layer to prevent the data line from being squeezed by external force.

[0023] Further, forming a protective layer on the passivation layer includes:

[0024] A protection layer is formed on the passivation layer through patterning, and the protection layer is located on both sides of the data line.

[0025] Furthermore, an organic light emitting diode structure layer is formed in the display area of ​​the array substrate, and the organic light emitting diode structure layer includes a pixel definition layer;

[0026] The forming of a protective layer above the passivation layer comprises:

[0027] A protective layer is formed on the passivation layer in the non-display area while the pixel definition layer in the display area is formed through a single patterning process.

[0028] Compared with the prior art, the present invention has the following advantages:

[0029] The present invention provides an array substrate, a display panel, a display device and a manufacturing method thereof. In the array substrate provided by the embodiment of the present invention, the array substrate includes a display area and a non-display area, in which data lines and a passivation layer covering the data lines are arranged, and in the non-display area of ​​the array substrate, a protective layer is also arranged above the passivation layer, and the arrangement of the protective layer effectively prevents the passivation layer and the data lines from being squeezed by external force, effectively prevents the data lines from being corroded by external water vapor due to damage of the passivation layer, and ensures the normal use of the data lines. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the structure in the non-display area of ​​the array substrate in the prior art;

[0031] Figure 2 It is a schematic diagram of a packaging adhesive strip attaching process when manufacturing an array substrate in the prior art;

[0032] Figure 3 It is a schematic diagram of a hot pressing process of packaging rubber strips when manufacturing an array substrate in the prior art;

[0033] Figure 4 It is a schematic diagram of the structure of the non-display area of ​​the array substrate in the prior art after being damaged by external pressure;

[0034] Figure 5 is a schematic structural diagram of a non-display area of ​​an array substrate provided by an embodiment of the present invention;

[0035] Figure 6 yes Figure 5 The schematic diagram of the module structure of the array substrate and the circuit board shown;

[0036] Figure 7 is a first structural schematic diagram of a protective layer in a non-display area of ​​an array substrate provided by an embodiment of the present invention;

[0037] Figure 8is a second structural schematic diagram of a protective layer in a non-display area of ​​an array substrate provided by an embodiment of the present invention;

[0038] Fig. 9 is a third structural schematic diagram of a protective layer in a non-display area of ​​an array substrate provided by an embodiment of the present invention;

[0039] Fig.10 It is a method flow chart of a method for manufacturing an array substrate provided by an embodiment of the present invention.

[0040] Reference numerals

[0041] 1 substrate 2 gate insulation layer 3 data line 4 passivation layer

[0042] 5 packaging layer 6 protection layer 7 gate 8 circuit board

[0043] 9 Metal wire 10 Conductive glue A Display area B Non-display area

[0044] a roller b damaged part of the passivation layer c hot pressing device D distance between the protective layer and the passivation layer DETAILED DESCRIPTION

[0045] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0046] In the description of the present invention, unless otherwise specified, “plurality” means two or more than two; the directions or positional relationships indicated by the terms “upper”, “lower”, “left”, “right”, “inside”, “outside”, etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the machine or component referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0047] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0049] In order to reduce line corrosion occurring during high temperature and high humidity experiments or operations, an embodiment of the present invention provides an array substrate that can be applied to a display panel or a display device.

[0050] Figure 1 is a schematic diagram of the structure in the non-display area of ​​the array substrate in the prior art. Figure 1 It can be seen that the structure in the non-display area of ​​the array substrate includes a base substrate 1, a gate insulating layer 2 formed on the base substrate 1, a data line 3 located on the gate insulating layer 2, and a passivation layer 4 covering the data line 3. The base substrate 1 can be of various types, such as a glass rigid substrate and a flexible substrate. The passivation layer 4 can be of various types, such as a silicon nitride layer, a resin layer, etc.

[0051] Figure 2 is a schematic diagram of a packaging strip attaching process in the prior art when manufacturing an array substrate. Figure 2 It can be seen that the array substrate includes a display area A and a non-display area B. The display area A is provided with a packaging layer 5. During the packaging strip attaching process, the roller a will roll repeatedly on the array substrate. Figure 2 The horizontal arrow in the figure indicates the rolling direction of the roller a, and the vertical downward arrow indicates the force direction of the roller a on the array substrate. The data line 3 in the non-display area B will be affected by the external force. The passivation layer 4 outside the data line 3 in the non-display area B is easily damaged after being affected by the external force. The structure after damage is referenced Figure 4 As shown, Figure 4 The direction of the arrow is the invasion direction of external water vapor.

[0052] After the passivation layer 4 is damaged, external water vapor easily enters from the damaged portion b of the passivation layer 4 and contacts the data line 3, causing the data line 3 to be corroded. Since the encapsulation layer 5 is provided in the display area A, the encapsulation layer 5 can reduce the effect of external force on the circuits and devices in the display area A, thereby protecting the normal use of the circuits and devices in the display area A.

[0053] Figure 3 is a schematic diagram of a hot pressing process for a packaging layer when manufacturing an array substrate in the prior art. Figure 3 It can be seen that the array substrate includes a display area A and a non-display area B, and a packaging layer 5 is provided on the display area A. During the hot pressing process of the packaging layer, the hot pressing device c applies pressure on the array substrate. Figure 3 The arrows in show the moving direction of the heat pressing device c and the direction in which the pressure is applied to the array substrate.

[0054] During the hot pressing process of the encapsulation layer, the data line 3 in the non-display area B is subjected to external force, and the passivation layer 4 outside the data line 3 in the non-display area B is easily damaged after being subjected to external force, forming a damaged portion b of the passivation layer 4. The structure after damage is shown in FIG. Figure 4 shown.

[0055] In order to solve the problem in the prior art that the passivation layer outside the data lines in the non-display area of ​​the array substrate is easily damaged and the data lines are easily corroded during the manufacturing process, the embodiment of the present invention provides a new array substrate.

[0056] The array substrate provided by the embodiment of the present invention includes a display area and a non-display area, in which a data line and a passivation layer covering the data line are arranged, and in the non-display area of ​​the array substrate, a protective layer is arranged above the passivation layer to prevent the data line from being squeezed by an external force. The provision of the protective layer effectively prevents the passivation layer outside the data line from being damaged due to being squeezed by an external force, effectively prevents the data line from being squeezed by an external force and corroded by external water vapor, and ensures the normal use of the data line.

[0057] A variety of devices are arranged on the non-display area of ​​the array substrate, and the positions of the passivation layer and the protective layer in the non-display area can be arranged accordingly according to the actual position of the data line in the non-display area. For example, a metal layer for discharging static electricity can be arranged in the non-display area of ​​the array substrate, and an insulating layer is arranged on the metal layer. In this case, the data line can be arranged on the insulating layer outside the metal layer, and the passivation layer can cover the data line and the insulating layer accordingly, and the protective layer is arranged on the passivation layer. Other applicable positions of the data line, the passivation layer and the protective layer are all feasible.

[0058] The passivation layer covers the data line, and the protective layer is arranged on the passivation layer. The protective layer and the data line may have various positional relationships. For example, at least part of the orthographic projection of the data line on the base substrate of the array substrate does not overlap with the orthographic projection of the protective layer on the base substrate. A via may be arranged on the passivation layer outside the data line not covered by the protective layer, and the data line may be connected to other metal layer structures through the via.

[0059] Furthermore, the protection layer may be disposed on both sides of the data line, and the orthographic projection of the data line on the base substrate does not overlap with the orthographic projection of the protection layer on the base substrate. Figure 5 is a schematic structural diagram of a non-display area of ​​an array substrate provided by an embodiment of the present invention, Figure 5 As shown, the protective layer 6 is disposed on both sides of the data line 3, the orthographic projection of the protective layer 6 on the base substrate 1 does not overlap with the orthographic projection of the data line 3 on the base substrate 1, the height of the protective layer 6 is higher than the height of the passivation layer 4, and the protective layer 6 on both sides of the data line 3 and the passivation layer 4 outside the data line 3 form a groove. When preparing the array substrate, since the protective layer 6 on both sides of the data line 3 in the non-display area is higher than the passivation layer 4 outside the data line 3, the protective layer 6 can buffer the external force applied during the process, protect the structural safety of the passivation layer 4, and ensure the normal use of the data line 3 in the passivation layer 4.

[0060] The array substrate may further include a circuit board 8, on which a metal wire 9 is arranged. The metal wire 9 of the circuit board 8 may be fixed in the groove formed by the protective layer 6 and the passivation layer 4 by means of a conductive adhesive 10, and at this time, the orthographic projection of the metal wire on the base substrate 1 is located between the orthographic projection of the protective layer 6 on the base substrate 1. A via is arranged on the passivation layer 4 outside the data line 3, and the metal wire 9 fixed in the groove is connected to the data line 3 through the conductive adhesive 10 and the via on the passivation layer 4. The above structure realizes the alignment of the metal wire 9 of the circuit board 8 with the groove, and effectively prevents the circuit board 8 from moving.

[0061] The module structure formed by the array substrate and the above circuit board refers to Figure 6 As shown, during bonding, the gold finger, i.e., the metal wire 9 and the conductive adhesive 10 of the circuit board, will be blocked by the protective layer 6 on both sides of the data line 3. The protective layer 6 plays a fixing role to prevent the gold finger 9 from deviating from the data line 3, thereby improving the offset and misalignment during bonding and ensuring the position accuracy during bonding.

[0062] The protective layer is formed on both sides of the data line. The protective layer can be in various pattern shapes, such as a sphere, a column or a cuboid; multiple protective layers can be continuous or island-shaped; multiple protective layers can be arranged regularly or irregularly. Figure 7-Figure 9 is a schematic diagram of the structure of the protective layer 6 in the non-display area of ​​the array substrate, Figure 7-Figure 9 The protective layer 6 shown is formed on both sides of the data line 3 and is arranged regularly. Figure 7 The protective layer 6 shown is a column structure. Figure 8 The protective layer 6 shown is a continuous rectangular parallelepiped structure. Fig. 9 The protective layer 6 shown is a rectangular parallelepiped structure.

[0063] In the array substrate provided by the embodiment of the present invention, the thickness of the protection layer may be greater than the thickness of the data line, so that no matter what positional relationship the protection layer has with the data line, the protection layer will protect the data line.

[0064] When manufacturing the array substrate, an encapsulation layer is provided on the display area of ​​the array substrate. Preferably, the distance between the portion of the protective layer close to the display area and the encapsulation layer is greater than a preset distance. The above-mentioned structure can ensure the encapsulation effect of the encapsulation layer and the array substrate in the display area, and prevent external water vapor from entering the display area to corrode the circuit structure. The preset distance can be set according to actual conditions. Figure 7-Figure 9 As shown, the distance between the protective layer 6 and the encapsulation layer 5 is D. At this distance, the encapsulation layer 5 can form a well-sealed encapsulation structure with the array substrate, thereby effectively preventing external water vapor from entering the display area A, thereby ensuring the safety of the circuits and devices in the display area A.

[0065] The array substrate provided in an embodiment of the present invention includes a display area and a non-display area. An organic light-emitting diode structure layer can be arranged in the display area of ​​the array substrate. For example, an organic light-emitting diode structure layer is arranged in the display area of ​​the array substrate of an OLED display. The organic light-emitting diode structure layer includes a pixel definition layer, and the pixel definition layer can be arranged on the same layer as the protective layer in the non-display area.

[0066] Specifically, when manufacturing the structure in the display area of ​​the array substrate, a TFT control layer, an anode layer, a color film, an organic light-emitting layer and a cathode layer are formed on the base substrate. When preparing the color film, a pixel definition layer needs to be formed, and the pixel definition layer is used to separate the RGB pixels. When forming the pixel definition layer in the display area, a protective layer can be formed in the non-display area at the same time through a single patterning process. Compared with the existing array substrate manufacturing process, the embodiment of the present invention only needs to change the pattern of the mask plate of the pixel definition layer, and does not increase the manufacturing process.

[0067] In the array substrate provided by the embodiment of the present invention, the protective layer and the passivation layer can be made of a variety of materials, such as the protective layer can be a resin layer. When the protective layer in the non-display area and the pixel definition layer in the display area are formed by a single patterning process and the pixel definition layer is a polyimide (PDL) material layer, the protective layer is also a PDL layer; the passivation layer can be a silicon nitride layer or a resin layer.

[0068] The embodiment of the present invention further provides a display panel, comprising the array substrate provided by the embodiment of the present invention. The display panel has the advantages of the array substrate, which will not be described in detail in the present invention.

[0069] The embodiment of the present invention further provides a display device, including the display panel provided by the embodiment of the present invention. The display device has the advantages of the display panel, which will not be described in detail in the present invention.

[0070] The embodiment of the present invention further provides a method for manufacturing the array substrate. Fig.10 is a flowchart of a method for manufacturing an array substrate provided by an embodiment of the present invention, referring to Fig.10 , the manufacturing method of the array substrate comprises:

[0071] 101. When forming an array substrate, data lines and a passivation layer covering the data lines are sequentially formed in a display area and a non-display area of ​​the array substrate.

[0072] 102. In a non-display area of ​​the array substrate, a protection layer is formed above the passivation layer to prevent the data line from being squeezed by external force.

[0073] In the embodiment of the present invention, the provision of the protective layer effectively prevents the passivation layer and the data line from being squeezed by external force, effectively prevents the data line from being corroded by external water vapor due to damage of the passivation layer, and ensures the normal use of the data line.

[0074] The step of forming a protective layer on the passivation layer may include:

[0075] A protection layer is formed on the passivation layer through patterning, and the protection layer is located on both sides of the data line.

[0076] At this time, the protective layers on both sides of the data line and the passivation layer outside the data line form a groove structure. The array substrate may also include a circuit board with metal wires formed on it. The metal wires of the circuit board may be placed in the groove to prevent the circuit board from shifting.

[0077] When an organic light emitting diode structure layer is formed in the display area of ​​the array substrate, and the organic light emitting diode structure layer includes a pixel definition layer, the step of forming a protective layer on the passivation layer may include: forming the pixel definition layer in the display area by a single patterning process, and forming the protective layer on the passivation layer in the non-display area. The protective layer may be a layer of various materials, such as a resin layer.

[0078] Compared with the existing array substrate manufacturing process, the embodiment of the present invention only needs to change the pattern of the mask plate of the pixel definition layer, and does not increase the manufacturing process. When forming the protective layer, a whole layer of the protective layer can be first formed in the non-display area, and then the whole layer of the protective layer is processed by an exposure and etching process to obtain a protective layer structure with a desired pattern.

[0079] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0080] The array substrate, display panel, display device and preparation method thereof provided by the present invention are introduced in detail above. Specific examples are used herein to illustrate the principle and implementation mode of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation mode and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. An array substrate, characterized in that: The array substrate comprises a display area and a non-display area, wherein data lines and a passivation layer covering the data lines are arranged in the display area and the non-display area; a protective layer is further arranged above the passivation layer in the non-display area of ​​the array substrate to prevent the passivation layer from being squeezed by external force; An organic light emitting diode structure layer is disposed in the display area of ​​the array substrate, and the organic light emitting diode structure layer includes a pixel definition layer, and the pixel definition layer is disposed in the same layer as the protective layer; wherein when the pixel definition layer is formed in the display area, the protective layer is simultaneously formed in the non-display area through a single patterning process; and the protective layer is formed above the passivation layer through a patterning process; The protective layer is arranged on both sides of the data line; the protective layer on both sides of the data line and the passivation layer outside the data line form a groove; At least part of the orthographic projection of the data line on the base substrate of the array substrate does not overlap with the orthographic projection of the protection layer on the base substrate; The array substrate further comprises a circuit board, on which a metal wire is arranged, and the metal wire is fixed in a groove formed by the protection layer and the passivation layer through a conductive adhesive; a via hole is arranged on the passivation layer outside the data line, and the metal wire fixed in the groove is connected to the data line through the conductive adhesive and the via hole arranged on the passivation layer; The orthographic projection of the metal line on the base substrate is located between the orthographic projections of the protection layer on the base substrate.

2. The array substrate according to claim 1, characterized in that: An orthographic projection of the data line on the base substrate does not overlap with an orthographic projection of the protection layer on the base substrate.

3. The array substrate according to claim 1, characterized in that: The thickness of the protection layer is greater than the thickness of the data line.

4. The array substrate according to claim 1, characterized in that: An encapsulation layer is disposed on the display area of ​​the array substrate, and a distance between a portion of the protection layer close to the display area and the encapsulation layer is greater than a preset distance.

5. The array substrate according to claim 1, characterized in that: A metal layer for discharging static electricity is further provided in the non-display area of ​​the array substrate, an insulating layer is provided on the metal layer, the data line is provided on the insulating layer, and the passivation layer covers the data line and the insulating layer.

6. The array substrate according to claim 1, characterized in that: The protective layer is a sphere, a column or a cuboid.

7. The array substrate according to claim 1, characterized in that: The protective layer is a resin layer.

8. A display panel, characterized in that: The invention comprises the array substrate according to any one of claims 1 to 7.

9. A display device, characterized in that: Comprising the display panel as claimed in claim 8.

10. A method for manufacturing an array substrate according to any one of claims 1 to 7, characterized in that: The method comprises: When forming an array substrate, data lines and a passivation layer covering the data lines are sequentially formed in a display area and a non-display area of ​​the array substrate; In the non-display area of ​​the array substrate, a protection layer is formed above the passivation layer to prevent the passivation layer from being pressed by external force.

11. The method according to claim 10, characterized in that The forming of a protective layer above the passivation layer comprises: A protection layer is formed on the passivation layer through patterning, and the protection layer is located on both sides of the data line.

12. The method according to claim 10, characterized in that An organic light emitting diode structure layer is formed in the display area of ​​the array substrate, and the organic light emitting diode structure layer includes a pixel definition layer; The forming of a protective layer above the passivation layer comprises: A protective layer is formed on the passivation layer in the non-display area while the pixel definition layer in the display area is formed through a single patterning process.

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