Evaporation substrate and evaporation device

Abstract

The embodiment of the present invention provides an evaporation carrier and an evaporation device, which are used in the field of evaporation technology and solve the problem of abnormal white spots when the substrate to be evaporated is lit. The evaporation carrier is used to carry the substrate to be evaporated, and the substrate to be evaporated includes multiple sub-evaporation substrates. The evaporation carrier includes: a bottom plate and multiple separately arranged support blocks arranged on the bottom plate, one of the support blocks corresponds to one sub-evaporation substrate, and the orthographic projection of the support block on the substrate to be evaporated overlaps with the display area of ​​the sub-evaporation substrate corresponding to the support block, and the overlapping area is greater than 1 / 3 of the display area and less than the area of ​​the sub-evaporation substrate; wherein the surface of the support block used to contact the substrate to be evaporated is a plane or a curved surface convex to the side away from the bottom plate. Used in the evaporation process.

Description

Technical Field

[0001] The present invention relates to the field of evaporation technology, and in particular to an evaporation carrier plate and an evaporation device. Background Art

[0002] Vacuum evaporation is a method in which the evaporation material is heated by an evaporation source in a vacuum evaporation chamber, so that the atoms or molecules of the evaporation material are vaporized and escape from its surface to form a vapor flow, which passes through the pattern on the mask and finally condenses on the substrate to be evaporated to form a patterned thin film. At present, vacuum evaporation has been widely used in the preparation of OLED devices.

[0003] Vacuum evaporation is performed using an evaporation device, and a evaporation carrier (Touch Plate, TP for short) is generally provided in the evaporation device. The evaporation carrier is used to carry the substrate to be evaporated. The evaporation carrier is often provided with a plurality of protrusions on one side of the evaporation carrier for carrying the substrate to be evaporated. Since the temperature and stress of the position in contact with the protrusion of the evaporation carrier and other positions of the substrate to be evaporated are different, when a vapor-deposited film layer is formed on the substrate to be evaporated and finally a display panel is formed, white spots will appear abnormally at the position opposite to the protrusion when the display panel is lit, thereby affecting the performance of the display panel. Summary of the invention

[0004] The embodiments of the present invention provide a vapor deposition carrier and a vapor deposition device, which solve the problem of abnormal white spots when a substrate to be vapor deposited is lit.

[0005] To achieve the above object, the embodiments of the present invention adopt the following technical solutions:

[0006] On the one hand, a vapor deposition carrier is provided for carrying a substrate to be vapor deposited, wherein the substrate to be vapor deposited includes a plurality of sub-vapor deposition substrates, and the vapor deposition carrier includes: a bottom plate and a plurality of separately arranged support blocks arranged on the bottom plate, wherein one support block corresponds to one sub-vapor deposition substrate, and the orthographic projection of the support block on the substrate to be vapor deposited overlaps with the display area of ​​the sub-vapor deposition substrate corresponding to the support block, and the overlapping area is greater than 1 / 3 of the area of ​​the display area and smaller than the area of ​​the sub-vapor deposition substrate; wherein the surface of the support block for contacting the substrate to be vapor deposited is a plane or a curved surface convex toward a side away from the bottom plate.

[0007] Preferably, the orthographic projection of the support block on the substrate to be evaporated completely overlaps with the display area of ​​the sub-evaporation substrate corresponding to the support block.

[0008] Preferably, the surface of the support block in contact with the substrate to be evaporated is a curved surface convex toward a side away from the bottom plate, and the curvature of the curved surface is 0 to π / 36.

[0009] Preferably, the arc surface is centrally symmetrical.

[0010] Preferably, the support block is made of magnetic material.

[0011] Preferably, a lug fixedly connected to the support block is provided on a side surface of the support block; the evaporation carrier further comprises a fixing component, and the fixing component fixes the lug to the base plate to fix the support block to the base plate.

[0012] Further preferably, the fixing component is a bolt or a screw.

[0013] Preferably, the support block is made of non-magnetic material.

[0014] Preferably, the surface of the support block in contact with the substrate to be evaporated is a curved surface convex to a side away from the bottom plate, and the support block includes a stacked flat layer and a convex portion; the flat layer is closer to the bottom plate than the convex portion.

[0015] Further preferably, the lug is arranged on a side surface of the flat layer.

[0016] Preferably, the curved surface formed by the surfaces of the plurality of support blocks in contact with the substrate to be evaporated is a spherical cap.

[0017] On the other hand, a vapor deposition device is provided, comprising the vapor deposition carrier mentioned above.

[0018] Preferably, the evaporation device further comprises a magnetic plate or a plurality of magnetic blocks arranged on a side of the bottom plate away from the supporting block, and the magnetic block or the magnetic plate is used for adsorbing the mask.

[0019] An embodiment of the present invention provides an evaporation carrier and an evaporation device, wherein the evaporation carrier includes a base plate and a plurality of support blocks arranged on the base plate. Since the orthographic projection of the support block on the substrate to be evaporated overlaps with the display area of ​​the sub-evaporation substrate corresponding to the support block, and the overlapping area is greater than 1 / 3 of the display area area and smaller than the area of ​​the sub-evaporation substrate, and since the size of the support block is increased relative to the protrusion in the related art, the temperature distribution of the display area of ​​the sub-evaporation substrate is more uniform, and the stress distribution of the portion of the formed evaporation film layer located in the display area of ​​the sub-evaporation substrate is more uniform, so that the performance of the portion of the formed evaporation film layer located in the display area of ​​the sub-evaporation substrate is more uniform, such as the resistance of the portion of the formed evaporation film layer located in the display area of ​​the sub-evaporation substrate is more uniform, so that when the sub-evaporation substrate forms a display panel and the display panel is lit, the light emitted by the display panel is uniform, and no white spot phenomenon occurs, thereby significantly improving the display performance of the display panel such as luminous efficiency, brightness or color purity. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] FIG. 1( a ) is a schematic side view of a vapor deposition carrier and a substrate to be vapor deposited provided by the related art;

[0022] FIG. 1( b ) is a schematic diagram of a top view of a vapor deposition carrier and a substrate to be vapor deposited provided by the related art;

[0023] FIG. 2( a ) is a side view structural schematic diagram 1 of a vapor deposition carrier and a substrate to be vapor deposited provided by an embodiment of the present invention;

[0024] FIG2( b ) is a second side view structural schematic diagram of a vapor deposition carrier and a substrate to be vapor deposited provided by an embodiment of the present invention;

[0025] FIG2( c ) is a schematic diagram of a top view of a vapor deposition carrier and a substrate to be vapor deposited provided by an embodiment of the present invention;

[0026] FIG3( a ) is a schematic diagram of a force-bearing structure of a vapor-deposited film layer provided in an embodiment of the present invention;

[0027] FIG3( b ) is a second schematic diagram of a force-bearing structure of a vapor-deposited film layer provided in an embodiment of the present invention;

[0028] FIG. 4( a ) is a first structural diagram of a vapor deposition carrier plate and a support block fixed to each other according to an embodiment of the present invention;

[0029] FIG4( b ) is a second structural schematic diagram of a vapor deposition carrier plate fixed to a support block provided by an embodiment of the present invention;

[0030] Figure 5 A schematic structural diagram of a support block provided by an embodiment of the present invention;

[0031] Figure 6 A schematic structural diagram of an evaporation carrier provided by an embodiment of the present invention;

[0032] Figure 7 A schematic structural diagram of a vapor deposition carrier and a substrate to be vapor deposited provided in an embodiment of the present invention;

[0033] Figure 8 A schematic structural diagram of an evaporation device provided in an embodiment of the present invention.

[0034] Reference numerals:

[0035] 01-evaporation carrier; 10-bottom plate; 20-protrusion; 30-substrate to be evaporated; 301-sub-evaporation substrate; 40-support block; 401-flat layer; 402-protrusion; 50-evaporation film layer; 60-lug; 70-fixing component; 80-baffle; 90-magnetic block. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] When vacuum evaporation is performed using an evaporation device, during evaporation, the evaporation carrier, the substrate to be evaporated, the mask, and the evaporation source are sequentially arranged. Since the evaporation carrier and the substrate to be evaporated are often adsorbed together in a vacuum environment and are not easy to separate, in order to solve this problem, the relevant evaporation carrier 01 often adopts a structure as shown in Figures 1(a) and 1(b). The evaporation carrier 01 includes a base plate 10 and a plurality of protrusions (Emboss) 20 arranged on the side of the base plate 10 close to the evaporation source, and each sub-evaporation substrate 301 on the substrate to be evaporated 30 corresponds to the plurality of protrusions 20. In this way, since the contact area between the evaporation carrier 01 and the substrate to be evaporated 30 is reduced, the evaporation carrier 01 and the substrate to be evaporated 30 are easy to separate after the evaporation is completed.

[0038] However, since the temperature and stress at the position in contact with the protrusion 20 of the vapor deposition carrier 01 in the vapor deposition substrate 30 are different from those at other positions, the conductive vapor deposition film layers formed at the position in contact with the protrusion 20 and other positions in the vapor deposition substrate 30 are different, and the resistance of the vapor deposition film layer at the position in contact with the protrusion 20 is less than the resistance of the vapor deposition film layers at other positions. Therefore, after the sub-evaporation substrate 301 forms a display panel, white spot abnormalities will appear when the display panel is turned on, that is, the brightness of the position in contact with the protrusion 20 in the vapor deposition substrate 30 is greater than that of other areas, thereby affecting the performance of the display panel.

[0039] Based on the above, an embodiment of the present invention provides an evaporation carrier 01 for carrying a substrate to be evaporated 30, wherein the substrate to be evaporated 30 includes a plurality of sub-evaporation substrates 301, as shown in FIG. 2(a), FIG. 2(b) and FIG. 2(c), the evaporation carrier 01 includes: a base plate 10 and a plurality of separately arranged support blocks (Emboss) 40 arranged on the base plate 10, one support block 40 corresponds to one sub-evaporation substrate 301, and the orthographic projection of the support block 40 on the substrate to be evaporated 30 overlaps with the display area of ​​the sub-evaporation substrate 301 corresponding to the support block 40, and the overlapping area is greater than 1 / 3 of the area of ​​the display area and smaller than the area of ​​the sub-evaporation substrate 301; wherein the surface of the support block 40 for contacting with the substrate to be evaporated 30 is a plane as shown in FIG. 2(a) or is an arc surface convex toward the side away from the base plate 10 as shown in FIG. 2(b).

[0040] It should be noted that, first, the substrate to be evaporated 30 is a motherboard, including multiple sub-evaporation substrates 301. After a film layer is evaporated on the substrate to be evaporated 30 to form a display panel motherboard, the display panel motherboard is cut to obtain multiple display panels. Generally, a substrate to be evaporated 30 includes more than 100 sub-evaporation substrates 301.

[0041] Second, the display area of ​​the sub-evaporation substrate 301 is the display area of ​​the display panel after the sub-evaporation substrate 301 forms a display panel.

[0042] Third, there is no limitation on the material of the bottom plate 10, which can be an organic material or an inorganic material. For example, the material of the bottom plate 10 is glass or metal.

[0043] On this basis, there is no limitation on the thickness of the bottom plate 10 . Preferably, the thickness of the bottom plate 10 is 0 to 10 mm, and more preferably, the thickness of the bottom plate 10 is 2 mm.

[0044] Fourth, there is no limitation on the material of the support block 40 , as long as it has a certain hardness. In addition, the material of the support block 40 may be the same as that of the base plate 10 , or may be different.

[0045] Here, when the surface of the support block 40 used to contact the substrate to be evaporated 30 is a curved surface convex to the side away from the bottom plate 10 as shown in FIG. 2( b ), the curvature of the curved surface is not limited and can be set accordingly according to the size of the display area of ​​the sub-evaporation substrate 301 and the degree of deformation of the substrate to be evaporated 30 due to gravity. On this basis, the curvatures of the curved surfaces of the multiple support blocks 40 can also be the same or different.

[0046] In addition, when the surface of the support block 40 used to contact the substrate 30 to be evaporated is a curved surface that bulges toward the side away from the bottom plate 10, due to the curvature of the curved surface and the existence of gravity, the distribution of the friction force between the substrate 30 to be evaporated and the curved surface at the position where the substrate 30 to be evaporated and the support block 40 contact is weaker than the distribution of the friction force between the substrate 30 to be evaporated and the plane, which is conducive to reducing the static electricity generated by the separation of the substrate 30 to be evaporated and the evaporation carrier 01. On this basis, when the substrate 30 to be evaporated is in contact with the support block 40, the curved surface improves the temperature distribution on the surface of the sub-evaporation substrate 301, which is conducive to forming a temperature gradient, thereby making the resistance of the evaporated film layer 50 formed on the sub-evaporation substrate 301 more uniform. Therefore, in the embodiment of the present invention, it is preferred that the surface of the support block 40 used to contact the substrate 30 to be evaporated is a curved surface that bulges toward the side away from the bottom plate 10.

[0047] Fifth, the bottom plate 10 and the support block 40 may be fixedly connected together by integral molding, or may be fixed together by fixing components or other methods, and this is not limited.

[0048] The following is an analysis of the internal stress on the evaporated film layer 50 during the evaporation process. As shown in FIG3(a), after the substrate 30 to be evaporated is attached to the support block 40 on the evaporation carrier 01, due to the support of the support block 40, the stress on the position where the substrate 30 to be evaporated and the support block 40 are in contact is directed outward (as shown by the arrow in FIG3(a)). After the evaporation is completed, as shown in FIG3(b), the substrate 30 to be evaporated will be restored to flatness. Under the action of the stress, the evaporated film layer 50 gathers toward the middle, increasing the density of the evaporated film layer 50. If the size of the support block 40 is too small, the contact area between the support block 40 and the substrate 30 to be evaporated is small. In this way, after the evaporated film layer 50 is formed by evaporation on the substrate 30 to be evaporated, the evaporated film layer 50 formed at the position in contact with the support block 40 in the substrate 30 to be evaporated will be subjected to great stress, resulting in a great difference in the structure of the evaporated film layer 50 formed at the position in contact with the substrate 30 to be evaporated and at other positions. In the related art, since the protrusions 20 arranged on the base plate 10 are point-shaped and small in size, the vapor-deposited film layer 50 formed on the vapor-deposited substrate 30 in contact with the protrusions 20 is subjected to large stress and has a lower temperature due to contact with the protrusions 20. Therefore, the performance of the vapor-deposited film layer 50 formed on the vapor-deposited substrate 30 in contact with the protrusions 20 is very different from that of other positions. For example, the resistance of the vapor-deposited film layer 50 formed on the vapor-deposited substrate 30 in contact with the protrusions 20 is smaller than that of other positions.

[0049] Based on the above, an embodiment of the present invention provides an evaporation carrier 01, which includes a base plate 10 and a plurality of support blocks 40 arranged on the base plate 10. Since the orthographic projection of the support block 40 on the substrate to be evaporated 30 overlaps with the display area of ​​the sub-evaporation substrate 301 corresponding to the support block 40, and the overlapping area is greater than 1 / 3 of the area of ​​the display area and smaller than the area of ​​the sub-evaporation substrate 301, after the evaporation film layer 50 is formed on the substrate to be evaporated 30, the portion of the evaporation film layer 50 corresponding to the support block 40 is subjected to greater stress. Since the size of the support block 40 is large, the area of ​​the portion of the evaporation film layer 50 located in the display area in the embodiment of the present invention that is subjected to greater stress increases, while in the evaporation film layer 50 formed in the related art, only the position in contact with the protrusion 20 is subjected to greater stress. Therefore, compared with the related art, the stress distribution of the portion of the evaporation film layer 50 formed in the embodiment of the present invention that is located in the display area is more uniform. In addition, the support block 40 will reduce the temperature of the substrate to be evaporated 30 in contact with it. Since the contact area between the support block 40 and the display area of ​​the sub-evaporation substrate 301 is increased compared to the related art, the portion of the display area of ​​the sub-evaporation substrate 301 where the temperature is reduced is increased, so that the temperature distribution of the display area of ​​the sub-evaporation substrate 301 is more uniform. Since the temperature distribution of the display area of ​​the sub-evaporation substrate 301 is more uniform, and the stress distribution of the portion of the formed evaporation film layer 50 located in the display area of ​​the sub-evaporation substrate 301 is more uniform, the performance of the portion of the formed evaporation film layer 50 located in the display area of ​​the sub-evaporation substrate 301 is more uniform, such as the resistance of the portion of the formed evaporation film layer 50 located in the display area of ​​the sub-evaporation substrate 301 is more uniform. In this way, when the sub-evaporation substrate 301 forms a display panel and the display panel is lit, the light emitted by the display panel is uniform, and there is no white spot phenomenon, which significantly improves the display performance of the display panel such as luminous efficiency, brightness or color purity.

[0050] Preferably, the orthographic projection of the support block 40 on the to-be-evaporated substrate 30 completely overlaps with the display area of ​​the sub-evaporation substrate 301 corresponding to the support block 40 .

[0051] In the embodiment of the present invention, since the orthographic projection of the support block 40 on the substrate to be evaporated 30 completely overlaps with the display area of ​​the sub-evaporation substrate 301 corresponding to the support block 40, when the evaporated film layer 50 is formed on the substrate to be evaporated 30, the stress distribution on the portion of the evaporated film layer 50 located in the display area of ​​the sub-evaporation substrate 301 is uniform, so that the performance of the portion of the evaporated film layer 50 located in the display area of ​​the sub-evaporation substrate 301 is the same, thereby improving the uniformity of the display panel performance when the substrate to be evaporated 30 is used to form a display panel.

[0052] When the surface of the support block 40 used to contact the substrate 30 to be evaporated is a curved surface that bulges away from the bottom plate 10, if the curvature of the curved surface is too small, the contact between the support block 40 and the substrate 30 to be evaporated is point contact, which will cause uneven stress on the substrate 30 to be evaporated, and uneven temperature distribution on the substrate 30 to be evaporated, so that the performance of the evaporated film layer 50 formed in the display area of ​​the sub-evaporation substrate 301 is uneven; if the curvature of the curved surface is too large, the area of ​​contact between the support block 40 and the substrate 30 to be evaporated is too large, which is not conducive to the separation of the substrate 30 to be evaporated and the evaporation carrier 01. Based on this, the embodiment of the present invention preferably has a curvature of 0 to π / 36.

[0053] Further preferably, the surface of the support block 40 for contacting the substrate 30 to be evaporated is a curved surface convex toward the side away from the bottom plate 10, and the curved surface is centrally symmetrical.

[0054] In the embodiment of the present invention, since the arc surface is centrally symmetrical, after the vapor-deposited substrate 30 contacts the support block 40, the stress applied to the vapor-deposited substrate 30 is uniform during the vapor-depositing process, thereby ensuring that the stress applied to the vapor-deposited film layer 50 is also uniform, thereby improving the performance uniformity of the vapor-deposited substrate 30.

[0055] In the embodiment of the present invention, since the orthographic projection of the support block 40 on the substrate to be evaporated 30 overlaps with the display area of ​​the sub-evaporation substrate 301 corresponding to the support block 40, and the overlapping area is greater than 1 / 3 of the area of ​​the display area and smaller than the area of ​​the sub-evaporation substrate 301, when the size or shape of the sub-evaporation substrate 301 in the substrate to be evaporated 30 changes, in order to improve the performance uniformity of the evaporated film layer 50 formed on the substrate to be evaporated 30, the evaporation carrier 01 is generally replaced. The process of replacing the evaporation carrier 01 in the evaporation device is very complicated and time-consuming, which seriously affects industrial production. Therefore, in the embodiment of the present invention, the bottom plate 10 and the support block 40 in the evaporation carrier 01 are preferably detachably connected. In this way, when the size or shape of the sub-evaporation substrate 301 in the substrate to be evaporated 30 changes, there is no need to remove the entire evaporation carrier 01 from the evaporation device, and only the support block 40 needs to be replaced, thereby saving steps and improving production efficiency.

[0056] When the bottom plate 10 and the support block 40 in the vapor deposition carrier 01 are detachably connected, two specific implementation methods are provided below.

[0057] The first type is that the material of the support block 40 is a magnetic material

[0058] In the evaporation device, the evaporation carrier 01, the substrate 30 to be evaporated, the mask plate and the evaporation source are sequentially arranged for evaporation. Among them, in order to fix the substrate 30 to be evaporated and the mask plate, a magnetic block or a magnetic plate is often arranged on the evaporation carrier 01 to adsorb the mask plate, so that the substrate 30 to be evaporated and the mask plate can be fixed to the evaporation carrier 01. When the material of the support block 40 is a magnetic material, the magnetic block or the magnetic plate will adsorb the support block 40, so that the support block 40 can be fixed on the bottom plate 10. Based on this, the embodiment of the present invention preferably uses a magnetic material as the material of the support block 40, and further preferably uses a soft magnetic material.

[0059] In the embodiment of the present invention, when the material of the support block 40 is a magnetic material, the support block 40 can be adsorbed on the base plate 10 by the magnetic force generated by the magnetic block or magnetic plate arranged on the evaporation carrier 01. When the size or shape of the sub-evaporation substrate 301 in the substrate 30 to be evaporated changes, it is only necessary to replace the corresponding support block 40, so that the base plate 10 can be suitable for sub-evaporation substrates 301 of different sizes and shapes.

[0060] The second type, as shown in Figures 4(a) and 4(b), a lug 60 fixedly connected to the support block 40 is provided on the side of the support block 40; the evaporation carrier also includes a fixing component 70, which fixes the lug 60 to the base plate 10 to fix the support block 40 on the base plate 10.

[0061] The side surface of the support block 40 refers to the other surfaces of the support block 40 except the surface in contact with the bottom plate 10 and the surface for contacting the substrate to be evaporated 30. The lug 60 and the support block 40 can be fixedly connected by integral molding or connected together by other connecting components, which is not limited.

[0062] Here, the type of the fixing member 70 is not limited, as long as the support block 40 can be fixed on the bottom plate 10. For example, the fixing member 70 is a bolt or a screw.

[0063] In the embodiment of the present invention, since the support block 40 and the base plate 10 are fixed by the fixing component 70, when the size or shape of the sub-evaporation substrate 301 in the substrate to be evaporated 30 changes, it is only necessary to replace the corresponding support block 40, so that the base plate 10 can be suitable for sub-evaporation substrates 301 of different sizes and shapes.

[0064] Based on the above, since the support block 40 and the base plate 10 are fixed by the fixing member 70, the material of the support block 40 can be a magnetic material or a non-magnetic material. When the substrate 30 to be evaporated and the mask are fixed on the evaporation carrier 01 by the magnetic block or magnetic plate set on the evaporation carrier 01, in order to avoid the magnetic field generated by the support block 40 affecting the magnetic field generated by the magnetic block or magnetic plate, the material of the support block 40 is preferably a non-magnetic material in the embodiment of the present invention. For example, the material of the support block 40 can be aluminum (Al), copper (Cu), titanium (Ti), etc.

[0065] Preferably, Figure 5 As shown, the surface of the support block 40 for contacting the substrate 30 to be evaporated is a curved surface convex to the side away from the base plate 10, and the support block 40 includes a stacked flat layer 401 and a convex portion 402; the flat layer 401 is closer to the base plate 10 relative to the convex portion 402.

[0066] Among them, the flat layer 401 and the raised portion 402 of the support block 40 can be formed simultaneously through an integrated molding process; or the flat layer 401 can be formed first, and then the raised portion 402 is formed on the flat layer 401, but at this time the flat layer 401 and the raised portion 402 are connected together.

[0067] Here, the thickness of the flat layer 401 is not limited. Preferably, the thickness of the flat layer 401 is 0 to 5 mm. More preferably, the thickness of the flat layer 401 is 1.5 mm.

[0068] On this basis, when the support block 40 includes a flat layer 401 and a protruding portion 402 , in the embodiment of the present invention, the lug 60 is preferably disposed on a side surface of the flat layer 401 .

[0069] In the embodiment of the present invention, since the support block 40 includes the flat layer 401 and the protrusion 402, on the one hand, it is beneficial to set the lug 60 on the side of the flat layer 401; on the other hand, compared with the support block 40 only including the protrusion 402, the support block 40 including the flat layer 401 and the protrusion 402 can increase the distance between the substrate 30 to be evaporated and the bottom plate 10, thereby preventing the substrate 30 to be evaporated from being excessively bent and contacting the bottom plate 10.

[0070] When the size and shape of each sub-deposition substrate 301 in the to-be-deposited substrate 30 are determined, the position of the support block 40 on the base plate 10 is also determined. When the support block 40 is fixed to the base plate 10 by the fixing member 70, in order to facilitate the accurate alignment of the support block 40, so as to accurately fix the support block 40 at the corresponding position on the base plate 10, the embodiment of the present invention is preferably as follows: Figure 6 As shown, a baffle 80 is provided at the edge of the base plate 10 .

[0071] Preferably, Figure 7As shown, the curved surface formed by the surfaces of the plurality of support blocks 40 in contact with the substrate 30 to be evaporated is a spherical cap.

[0072] Among them, the spherical cap refers to the curved surface remaining after a sphere is cut by a plane.

[0073] Here, the curvature of the spherical cap is not limited, and can be designed accordingly according to the bending state of the substrate 30 to be evaporated under gravity.

[0074] In the embodiment of the present invention, when the substrate 30 to be evaporated is in contact with the evaporation carrier 01, the forces acting on the substrate 30 to be evaporated include its own gravity and the supporting force of the evaporation carrier 01 on the substrate 30 to be evaporated (when the evaporation carrier 01 and the substrate 30 to be evaporated are fixed by a magnetic block or a magnetic plate arranged on the evaporation carrier 01, the supporting force is a magnetic force). In order to prevent the substrate 30 to be evaporated from being deformed into a wavy shape under the action of these forces, the embodiment of the present invention preferably adopts a spherical cap as the curved surface formed by the surface of the plurality of support blocks 40 in contact with the substrate 30 to be evaporated. In this way, when the surface of the plurality of support blocks 40 in contact with the substrate 30 to be evaporated is in contact with the substrate 30 to be evaporated, the bending state of the spherical cap is most similar to the bending state of the substrate 30 to be evaporated and the mask plate, thereby avoiding the uneven formation of the evaporated film layer 50 caused by the uneven deformation of the mask plate. In addition, since the surfaces of the supporting blocks 40 that are in contact with the substrate 30 to be evaporated are curved surfaces, the substrate 30 to be evaporated and the evaporation carrier 01 are easily separated, and static electricity problems caused by the complete contact between the substrate 30 to be evaporated and the evaporation carrier 01 can be avoided.

[0075] An embodiment of the present invention further provides an evaporation device, comprising the above-mentioned evaporation carrier plate 01.

[0076] The evaporation device includes not only the evaporation carrier 01 but also an evaporation source. The substrate to be evaporated 30 and the mask are arranged between the evaporation carrier 01 and the evaporation source, and the mask is closer to the evaporation source relative to the substrate to be evaporated 30.

[0077] Here, the substrate 30 to be evaporated and the mask plate can be fixed on the evaporation carrier 01 by a magnetic field or a fixing member such as a clamping slot.

[0078] An embodiment of the present invention provides an evaporation device, which includes the above-mentioned evaporation carrier 01. Since the size of the support block 40 is increased compared to the protrusion 20 in the related art, the temperature distribution of the display area of ​​the sub-evaporation substrate 301 is more uniform, and the stress distribution of the portion of the formed evaporation film layer 50 located in the display area of ​​the sub-evaporation substrate 301 is more uniform. Therefore, the performance of the portion of the formed evaporation film layer 50 located in the display area of ​​the sub-evaporation substrate 301 is more uniform, such as the resistance of the portion of the formed evaporation film layer 50 located in the display area of ​​the sub-evaporation substrate 301 is more uniform. In this way, when the sub-evaporation substrate 301 forms a display panel and the display panel is lit, the light emitted by the display panel is uniform, and no white spot phenomenon occurs, thereby significantly improving the display performance of the display panel such as luminous efficiency, brightness or color purity.

[0079] Preferably, Figure 8 As shown, the evaporation device further includes a plurality of magnetic blocks 90 or magnetic plates (attached) arranged on the side of the bottom plate 10 away from the support block 40. Figure 8 The magnetic block 90 is used as an example for illustration), and the magnetic block 90 or magnetic plate is used to adsorb the mask.

[0080] In an embodiment of the present invention, the evaporation device also includes a plurality of magnetic blocks 90 or magnetic plates arranged on the side of the base plate 10 away from the support block 40. Since the magnetic blocks 90 or magnetic plates can be used to adsorb the mask plate, and the substrate 30 to be evaporated is located between the mask plate and the evaporation carrier 01, the substrate 30 to be evaporated and the mask plate can be fixed on the evaporation carrier 01 under the action of the magnetic field generated by the magnetic blocks 90 or magnetic plates.

[0081] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A vapor deposition carrier, used for carrying a substrate to be vapor deposited, wherein the substrate to be vapor deposited comprises a plurality of sub-vapor deposition substrates, characterized in that: The evaporation carrier comprises: a bottom plate and a plurality of separately arranged support blocks arranged on the bottom plate, one of the support blocks corresponds to one of the sub-evaporation substrates, the orthographic projection of the support block on the substrate to be evaporated overlaps with the display area of ​​the sub-evaporation substrate corresponding to the support block, and the overlapping area is greater than 1 / 3 of the area of ​​the display area and less than the area of ​​the sub-evaporation substrate; the support block is detachably connected to the bottom plate; The surface of the support block in contact with the substrate to be evaporated is a curved surface convex toward a side away from the bottom plate, and the curvature of the curved surface is greater than 0 and less than or equal to π / 36.

2. The vapor deposition carrier according to claim 1, characterized in that: The orthographic projection of the support block on the substrate to be evaporated completely overlaps with the display area of ​​the sub-evaporation substrate corresponding to the support block.

3. The vapor deposition carrier according to claim 2, characterized in that: The arc surface is centrally symmetrical.

4. The evaporation carrier according to any one of claims 1 to 3, characterized in that: The support block is made of magnetic material.

5. The vapor deposition carrier according to claim 1, characterized in that: The side surface of the support block is provided with a lug fixedly connected to the support block; The evaporation carrier further includes a fixing component, and the fixing component fixes the lug to the bottom plate, so as to fix the support block on the bottom plate.

6. The vapor deposition carrier according to claim 5, characterized in that: The fixing component is a bolt or a screw.

7. The vapor deposition carrier according to claim 5 or 6, characterized in that: The support block is made of non-magnetic material.

8. The vapor deposition carrier according to claim 5, characterized in that: The surface of the support block in contact with the substrate to be evaporated is a curved surface convex to the side away from the bottom plate, and the support block includes a stacked flat layer and a convex portion; the flat layer is closer to the bottom plate than the convex portion.

9. The vapor deposition carrier according to claim 8, characterized in that: The lugs are arranged on the side surfaces of the flat layer.

10. The vapor deposition carrier according to any one of claims 1 to 3, characterized in that: The curved surface formed by the surfaces of the plurality of support blocks in contact with the substrate to be evaporated is a spherical cap.

11. A vapor deposition device, characterized in that: It comprises the vapor deposition carrier plate as described in any one of claims 1 to 10.

12. The evaporation device according to claim 11, characterized in that: The evaporation device further comprises a magnetic plate or a plurality of magnetic blocks arranged on a side of the bottom plate away from the supporting block, and the magnetic block or the magnetic plate is used for adsorbing the mask.

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