Embedded circuit system monitoring equipment

Abstract

An embedded circuit system monitoring device includes: a monitoring interface for accessing the circuit system; a microcontroller module connected to the monitoring interface; and a network transmission module connected to the microcontroller module; wherein the microcontroller module is constructed based on a microcontroller, the network transmission module includes a hardware TCP / IP protocol stack chip, and the network transmission module is provided with a network interface for connecting to an external device. The solution provided in the present application can realize remote monitoring of the circuit system.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to an embedded circuit system monitoring device. Background Art

[0002] With the rapid development of electronic technology, the complexity of circuit systems is also increasing. Whether in daily life or in industrial production, in order to ensure the safety of electricity use, people pay more and more attention to monitoring the operation of circuit systems. Embedded technology is used in the monitoring of circuit systems due to its flexibility and customizable functions.

[0003] At present, embedded circuit system monitoring equipment is implemented based on a microcontroller unit (MCU) and a universal serial bus (USB) interface. The embedded circuit monitoring equipment is connected to a background management device (such as a computer) through a USB interface to transmit the monitored data to the background management device.

[0004] Since the USB interface allows a short communication distance, it is difficult to achieve long-distance monitoring of the circuit system based on traditional embedded circuit monitoring equipment. Summary of the invention

[0005] An embodiment of the present application provides an embedded circuit system monitoring device, which can realize remote monitoring of the circuit system.

[0006] A first aspect of an embodiment of the present application provides an embedded circuit system monitoring device, including: a monitoring interface for accessing a circuit system;

[0007] and, a microcontroller module connected to the monitoring interface;

[0008] and, a network transmission module connected to the microcontroller module;

[0009] Among them, the micro-control module is constructed based on a microcontroller, the network transmission module includes a hardware TCP / IP protocol stack chip, and the network transmission module is provided with a network interface for connecting to an external device.

[0010] Based on the first aspect of the present application, in a first possible implementation manner, the embedded circuit system monitoring device further includes: a first power supply module and a second power supply module respectively connected to the microcontroller module;

[0011] The first power module supplies power to the embedded circuit system monitoring device when the embedded circuit system monitoring device is externally connected to a power adapter.

[0012] Based on the first possible implementation of the first aspect of the present application, in a second possible implementation, the second power module is constructed based on a TPS2379 chip and a buck regulator.

[0013] Based on the second possible implementation of the first aspect of the present application, in a third possible implementation, a model of the buck regulator is TPS57060-Q1.

[0014] Based on the first possible implementation of the first aspect of the present application, or the second possible implementation of the first aspect of the present application, or the third possible implementation of the first aspect of the present application, in a fourth possible implementation, the first power module and / or the second power module is provided with an overcurrent and overvoltage protection circuit.

[0015] Based on the first aspect of the present application, or the first possible implementation of the first aspect of the present application, or the second possible implementation of the first aspect of the present application, or the third possible implementation of the first aspect of the present application, in a fifth possible implementation, the microcontrol module also includes: a current detection circuit connected to the microcontroller.

[0016] Based on the first aspect of the present application, or the first possible implementation of the first aspect of the present application, or the second possible implementation of the first aspect of the present application, or the third possible implementation of the first aspect of the present application, in a sixth possible implementation, the microcontrol module also includes: a voltage detection circuit connected to the microcontroller.

[0017] Based on the first aspect of the present application, or the first possible implementation of the first aspect of the present application, or the second possible implementation of the first aspect of the present application, or the third possible implementation of the first aspect of the present application, in a seventh possible implementation, the microcontrol module also includes: an integrated digital temperature sensor connected to the microcontroller.

[0018] Based on the first aspect of the present application, or the first possible implementation of the first aspect of the present application, or the second possible implementation of the first aspect of the present application, or the third possible implementation of the first aspect of the present application, in an eighth possible implementation, the network transmission module is constructed based on an Ethernet chip model W5500.

[0019] Based on the first aspect of the present application, or the first possible implementation of the first aspect of the present application, or the second possible implementation of the first aspect of the present application, or the third possible implementation of the first aspect of the present application, in a ninth possible implementation, the microcontroller is configured with more than two power control pins, and each power control pin has an associated timing value, and each power control pin outputs an enable signal when the timing of the internal timer of the microcontroller reaches the corresponding timing value; wherein, the timing values ​​associated with different power control pins are different.

[0020] As can be seen from the above, the embedded circuit system monitoring device provided by the present application is centered on a microcontroller module and a network transmission module. On the one hand, since the embedded circuit system monitoring device integrates the network transmission module, the embedded circuit system can perform long-distance data transmission with external devices via Ethernet, so that users can remotely view the data monitored by the embedded circuit system through external devices, thereby realizing long-distance monitoring of the circuit system; on the other hand, since the network transmission module integrated in the embedded circuit system monitoring device includes a hardware TCP / IP protocol stack chip, the network transmission module can assist the microprocessor in the microcontroller module in processing almost all TCP / IP protocol tasks, thereby reducing the number of microprocessor interrupts and allowing the microprocessor to free up more space to handle other tasks. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of an embodiment of the embedded circuit system monitoring device provided by the present application;

[0022] Figure 2 A schematic diagram of the kernel of the hardware TCP / IP protocol stack chip provided in the embodiment of the present application;

[0023] Figure 3 A schematic diagram of data interaction between a W5500 chip and a computer in an application scenario provided by an embodiment of the present application;

[0024] Figure 4 A schematic diagram of a circuit structure of a second power supply module provided in an embodiment of the present application;

[0025] Figure 5 A schematic diagram of the circuit structure of an overcurrent and overvoltage protection circuit provided in an embodiment of the present application;

[0026] Figure 6 A schematic diagram of a circuit structure including a current detection circuit and a voltage detection circuit provided in an embodiment of the present application;

[0027] Figure 7 A schematic diagram of temperature detection flow direction in an application scenario provided by an embodiment of the present application;

[0028] Figure 8 A schematic diagram of a program structure for realizing multi-channel power supply control provided in an embodiment of the present application;

[0029] Fig. 9 A schematic diagram of the circuit structure of an embedded circuit system monitoring device in an application scenario provided in an embodiment of the present application. DETAILED DESCRIPTION

[0030] In order to make the purpose, features, and advantages of the invention of this application more obvious and easy to understand, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0031] The present application embodiment provides an embedded circuit system monitoring device. Figure 1 , the embedded circuit system monitoring device comprises:

[0032] A monitoring interface 11 for accessing a circuit system;

[0033] and, a microcontroller module 12 connected to the monitoring interface 11;

[0034] and, a network transmission module 13 connected to the micro control module 12;

[0035] Among them, the monitoring interface 11 can be a connector, the microcontroller module 12 is constructed based on a microcontroller 121 (for example, it can be a microcontroller unit (MCU) with a model of stm32F103), the network transmission module 13 includes a hardware transmission control protocol (TCP) / Internet protocol (IP) protocol stack, and the network transmission module 13 is provided with a network interface for connecting to an external device.

[0036] In the embodiment of the present application, the hardware TCP / IP protocol stack chip is a chip that implements the traditional software TCP / IP protocol stack using hardware logic gate circuits. Figure 2 This is a schematic diagram of the core of the hardware TCP / IP protocol stack chip, such as Figure 2As shown, the core of the hardware TCP / IP protocol stack chip is composed of TCP, User Datagram Protocol (UDP), Internet Control Message Protocol (ICMP), Internet Group Management Protocol (IGMP) and other protocols of the transport layer, IP, Address Resolution Protocol (ARP), Point to Point Protocol over Ethernet (PPPoE) and other protocols of the network layer, and Media Access Control (MAC) of the link layer. Through the hardware TCP / IP protocol stack, plus the physical layer (PHY) and peripheral registers, memory, and serial peripheral interface (SPI), a hardware Ethernet solution can be formed. The microcontroller can only process user-oriented application layer data.

[0037] In the embodiment of the present application, the network interface of the network transmission module 13 can be used to connect to an external device, and the data monitored by the micro-control module 12 (such as the working status of the circuit system, task data, current size, voltage size, temperature size, etc. of the monitored circuit) can be transmitted to the external device (such as a PC) through the network transmission module 13, so that the staff can view and process the received data through the above-mentioned external device. Furthermore, the staff can send control commands to the above-mentioned embedded circuit system monitoring device through the above-mentioned external device.

[0038] Optional, such as Figure 1 As shown, the microcontroller module 12 may further include the following functional modules: at least one of an analog-to-digital conversion module 122, a temperature detection module 123, a current detection module 124, a voltage detection module 125, and a power management module 126. The microcontroller module 12 is used to receive the original signal input from the monitoring interface 11, process the original signal through the microcontroller 121 in combination with relevant functional modules to form a target signal, and output the target signal through the network transmission module 13.

[0039] Optionally, the network transmission module in the embodiment of the present application can be constructed based on an Ethernet chip of model W5500 (hereinafter referred to as W5500 chip). Figure 3 The figure shows a schematic diagram of data interaction between the W5500 chip and a computer in an application scenario. Figure 3As shown, the W5500 chip is connected to the computer through a network interface, and the W5500 is connected to the MCU through SPI. The Ethernet configuration and processing program in the MCU is used to configure registers related to the Ethernet, and the data management program is used to manage data transmitted based on the Ethernet.

[0040] Optionally, the embedded circuit system monitoring device of the present application provides a dual power supply module, and the above-mentioned current management module 126 may include: a first power supply module and a second power supply module respectively connected to the micro-control module. Among them, the above-mentioned first power supply module supplies power to the embedded circuit system monitoring device when the embedded circuit system monitoring device is externally connected to a power adapter, and the above-mentioned second power supply module supplies power to the above-mentioned embedded circuit system monitoring device when the embedded circuit system monitoring device is externally connected to a switch that supports Ethernet power supply (i.e., an active Ethernet (POE, Power Over Ethernet) switch). In practical applications, the POE power supply can be used as a backup power supply, and POE power supply can be achieved through the above-mentioned second power supply module when the wiring is cumbersome or the distance between the power socket is limited. The above-mentioned second power supply module is also the PD module in the POE power supply system.

[0041] Optionally, the second power module can be constructed based on a TPS2379 chip and a buck regulator. Figure 4 As shown, in Figure 4 In the figure, the buck regulator is TPS57060-Q1, RJ45 is the network interface for connecting to the POE switch, T1 and T2 represent transformers, TX represents the signal sending end, RX represents the signal receiving end, ZD1 and ZD2 represent bridge rectifier diodes, C 1 ~C 5 Represents non-polarized capacitor, C BULK , C 6 and C 7 Indicates polarized capacitor, D 1 and D 2 Represents the Zener diode, R DEN , R CLS , R BLST , R UVLO1 , R UVLO2 , R 1 ~R 4 All represent resistors, and Q1 represents an N-MOS tube. It should be noted that Figure 4 The circuit structure shown is only one implementation method. In practical applications, the second power supply module only needs to be able to realize the functions of the second power supply module. The combination and connection relationship of its various components may not be limited to Figure 3 The circuit structure shown.

[0042] Optionally, the current management module 126 also includes an overcurrent and overvoltage protection circuit. Specifically, the overcurrent and overvoltage protection circuit can be implemented by the microprocessor in conjunction with a current detection amplifier circuit and two switch circuits (hereinafter described as a first switch circuit and a second switch circuit). The input end of the first switch circuit is connected to the output end of the first power module, and the input end of the second switch circuit is connected to the output end of the second power module. The current detection amplifier circuit is used to detect the output current of the first power module and the second power module and transmit it to the internal ADC (i.e., analog-to-digital converter) of the MCU for processing (such as sampling and quantization) to output a control signal according to the current value obtained after processing. For example, when the current value obtained after processing by the internal ADC of the MCU is greater than a preset threshold, the MCU outputs a corresponding control signal to control Q2 or Q4 to disconnect, so that the power supply can be cut off in the event of overvoltage or overcurrent. Figure 5 The figure shows a circuit structure diagram of an over-current and over-voltage protection circuit. Figure 5 In the example, MCU is the microprocessor mentioned above, and the first switch circuit is composed of Q2, Q3, R 5 ~R 7 The second switch circuit is constructed by Q4, Q5, R 9 ~R 11 In the above structure, Q2 is an N-MOS tube with a voltage-stabilizing diode, Q3 is a P-MOS tube with a voltage-stabilizing diode, and R 5 ~R 11 is the resistance, the output power U 1 and U 2 The above-mentioned embedded circuit system monitoring device and other external circuits can be powered separately.

[0043] The above-mentioned current detection module 124 may include: a current detection circuit connected to the above-mentioned microcontroller. The above-mentioned embedded multifunctional circuit monitoring device can perform current detection on the circuit system connected to the above-mentioned monitoring interface through the above-mentioned current detection circuit. It should be noted that the above-mentioned current detection circuits can also be more than two, so as to perform current detection on multiple locations in the circuit system connected to the above-mentioned monitoring interface through multiple current detection circuits. Of course, the above-mentioned current detection circuit can also be one, which is not limited here.

[0044] The voltage detection module 125 may include: a voltage detection circuit connected to the microcontroller. The embedded multifunctional circuit monitoring device may perform voltage detection on the circuit system connected to the monitoring interface through the voltage detection circuit. It should be noted that there may be more than two voltage detection circuits, so that voltage detection may be performed on multiple locations in the circuit system connected to the monitoring interface through multiple voltage detection circuits. Of course, there may also be one voltage detection circuit, which is not limited here.

[0045] like Figure 6 The figure shows a circuit structure diagram including a current detection circuit and a voltage detection circuit. Figure 6 The voltage detection circuit consists of a resistor R 12 and R 13 The current sensing circuit consists of a current sensing amplifier and a resistor R 14 The measured voltage and current are transmitted to the internal ADC (analog-to-digital converter) of the MCU for processing (such as sampling and quantization), and can be Figure 1 The network transmission module 13 shown transmits the data to an external device (eg, a PC) for viewing and processing by staff.

[0046] The temperature detection module 123 may include: an integrated digital temperature sensor connected to the microcontroller, so that the embedded multifunctional circuit monitoring device can detect the temperature of the circuit system connected to the monitoring interface through the integrated digital temperature sensor. It should be noted that there may be more than two integrated digital temperature sensors, so that the temperature of multiple locations (such as modules and chassis of the circuit system) in the circuit system connected to the monitoring interface can be detected through multiple integrated digital temperature sensors. Of course, there may be only one integrated digital temperature sensor, which is not limited here. Figure 7 A schematic diagram of the temperature detection flow in an application scenario is given. The temperature of the monitored circuit system is obtained through an integrated digital temperature sensor, and then the integrated digital temperature sensor sends the collected temperature to the temperature detection program in the MCU for processing, such as uploading it to a computer connected to the embedded multi-function circuit monitoring device to detect whether the measured temperature exceeds the set threshold.

[0047] Optionally, the microcontroller is configured with more than two power control pins, and each power control pin has an associated timing value, and each power control pin outputs an enable signal when the timing of the internal timer of the microcontroller reaches a corresponding timing value, so as to realize multi-way power control. Among them, the timing values ​​associated with different power control pins are different. In this application scenario, the two or more power control pins can be respectively connected to the enable ends of the modules that need to be powered on in the monitored circuit system. After the microcontroller is started, the internal timer of the microcontroller starts timing. When the timing reaches the timing value corresponding to a certain power control pin, the microcontroller controls the power control pin to output an enable signal (low level or high level) to enable the module in the circuit system connected to the power control pin. Since the timing values ​​associated with different power control pins are different, through this scheme, the power-on sequence of each module in the circuit system can be controlled to avoid the spike phenomenon caused by powering on multiple modules in the circuit system at the same time. Specifically, it can be achieved through Figure 8The program structure shown in the figure realizes the above multi-channel power supply control. Figure 8 As shown, a timing program, a power control program, and a polarity control program can be configured for the MCU. The timing program is used to perform timing when the MCU is started, and the power control program is used to detect whether the timing of the timing program reaches the timing value corresponding to a certain power control pin. When the timing of the timing program reaches the timing value corresponding to a certain power control pin, the corresponding power control pin is controlled to output a high-level enable signal or a low-level enable signal in combination with the polarity control program. Among them, the polarity control program is used to determine the polarity of the enable signal that the power control pin should output corresponding to the timing value reached by the current timing, that is, to determine whether the power control pin outputs a high level or a low level.

[0048] Optionally, the embedded circuit system monitoring device in the embodiment of the present application may also include: an indicator light module and / or a buzzer module connected to the microcontroller, and the microcontroller may trigger the indicator light of the above-mentioned indicator light module to light up or flash according to the working condition of the monitored circuit system, or the microcontroller may also trigger the buzzer of the above-mentioned buzzer module to emit an alarm sound according to the working condition of the monitored circuit system.

[0049] The following is an explanation of an embedded circuit system monitoring device using a specific application scenario. Please refer to Fig. 9 , Fig. 9 In the example, the first connector is Figure 1 The monitoring interface shown, the measured current and / or the measured voltage can be collected by the aforementioned current detection circuit and / or voltage detection circuit. The temperature sensor signal can be collected by the aforementioned digital temperature sensor. The MCU is configured with more than two power control pins, and each power control pin has an associated timing value, and each power control pin outputs an enable signal when the timing of the internal timer of the above microcontroller reaches the corresponding timing value. Fig. 9 The embedded circuit system monitoring device shown also includes: an LED light module and / or a buzzer module (not shown in the figure) connected to the MCU. The MCU can trigger the LED light of the above-mentioned LED light module to light up or flash according to the working condition of the monitored circuit system, and / or the MCU can also trigger the buzzer of the above-mentioned buzzer module to emit an alarm sound according to the working condition of the monitored circuit system. Fig. 9 The first power module, the second power module, the overcurrent and overvoltage protection circuit, and the network transmission module shown can refer to the description in the above embodiments, and will not be described in detail here. Fig. 9 In the embodiment, a second connector is provided for connecting with a power adapter, an external power interface and other circuit modules. When the second connector is connected with the external power interface, the embedded circuit system monitoring device can provide power for the connected devices.

[0050] In the several embodiments provided in the present application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the modules is only a logical function division. There may be other division methods in actual implementation, such as multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or modules, which can be electrical, mechanical or other forms.

[0051] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical modules, that is, they may be located in one place or distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0052] In addition, each functional module in each embodiment of the present application can be integrated into a processing module, or each module can exist physically separately, or two or more modules can be integrated into one module. The above integrated modules can be implemented in the form of hardware or software functional modules.

[0053] The above is a description of the embedded circuit system monitoring device provided by the present application. For technicians in this field, according to the ideas of the embodiments of the present application, there may be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. An embedded circuit system monitoring device, characterized in that: include: A monitoring interface for accessing a circuit system; and, a microcontroller module connected to the monitoring interface; and, a network transmission module connected to the microcontroller module; Among them, the microcontroller is built based on a microcontroller, the network transmission module includes a hardware TCP / IP protocol stack chip, and the network transmission module is provided with a network interface for connecting to an external device, transmitting data of the circuit system monitored by the microcontroller module to the external device, so that the staff can view and process the data through the external device, and the staff can send control commands to the embedded circuit system monitoring device through the external device, and the data includes the working status of the circuit system, task data, current size, voltage size, and temperature size of the monitored circuit. The hardware TCP / IP protocol stack chip is a chip that implements the traditional software TCP / IP protocol stack with hardware logic gate circuits.

2. The embedded circuit system monitoring device according to claim 1, characterized in that: The embedded circuit system monitoring device further comprises: a first power supply module and a second power supply module respectively connected to the micro control module; The first power module supplies power to the embedded circuit system monitoring device when the embedded circuit system monitoring device is connected to an external power adapter; When the embedded circuit system monitoring device is externally connected to a switch supporting Ethernet power supply, the second power supply module supplies power to the embedded circuit system monitoring device.

3. The embedded circuit system monitoring device according to claim 2, characterized in that: The second power supply module is constructed based on the TPS2379 chip and a buck regulator.

4. The embedded circuit system monitoring device according to claim 3, characterized in that: The model of the buck regulator is TPS57060-Q1.

5. The embedded multifunctional circuit monitoring device according to any one of claims 2 to 4, characterized in that: The first power module and / or the second power module is provided with an overcurrent and overvoltage protection circuit.

6. The embedded multifunctional circuit monitoring device according to any one of claims 1 to 4, characterized in that: The microcontroller module further comprises: A current detection circuit is connected to the microcontroller.

7. The embedded multifunctional circuit monitoring device according to any one of claims 1 to 4, characterized in that: The microcontroller module further comprises: A voltage detection circuit is connected to the microcontroller.

8. The embedded multifunctional circuit monitoring device according to any one of claims 1 to 4, characterized in that: The microcontroller module further comprises: An integrated digital temperature sensor is connected to the microcontroller.

9. The embedded multifunctional circuit monitoring device according to any one of claims 1 to 4, characterized in that: The network transmission module is constructed based on an Ethernet chip of model W5500.

10. The embedded multifunctional circuit monitoring device according to any one of claims 1 to 4, characterized in that: The microcontroller is configured with more than two power control pins, and each power control pin has an associated timing value, and each power control pin outputs an enable signal when the timing of an internal timer of the microcontroller reaches a corresponding timing value; Among them, different power control pins are associated with different timing values.

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