A temperature control system for enclosed space

Abstract

The present invention discloses a temperature control device for adjusting the temperature of a kitchen, and relates to the field of kitchen electrical technology; the key points of the technical solution are: a housing, a power control device installed on the housing, a semiconductor refrigeration plate installed on the power control device and controlled, a heat preservation component for sealing, protecting and keeping the semiconductor refrigeration plate warm, an auxiliary component for assisting the semiconductor refrigeration plate in heat exchange, and a lighting component installed on the housing; the power control device is used to control the positive and negative pole switching between the semiconductor refrigeration plate and the power supply, thereby changing the flow direction of the current in the semiconductor refrigeration plate, and controlling the semiconductor refrigeration plate to cool or heat; there are multiple semiconductor refrigeration plates, multiple semiconductor refrigeration plates are connected in series, and the top surfaces of the semiconductor refrigeration plates are in the same plane, and the electrical connection mode of the multiple semiconductor refrigeration plates is series connection. The present invention achieves the effect of cooling or heating the kitchen by designing a new temperature control device.

Description

Technical Field

[0001] The present invention relates to the field of electrical technology for temperature regulation, and in particular to a temperature regulation system for a closed space (such as a kitchen). Background Art

[0002] In existing families, the kitchen is generally a place that is hot in summer and cold in winter, especially in southern China. Since there is no heating in winter, cooking in the kitchen will first make people feel cold, and secondly, the cooked food will easily get cold.

[0003] In the prior art, air conditioners are generally used for indoor heating or cooling in southern China. However, the existing air conditioner body is too large, including indoor and outdoor units, and requires a large installation space. Using an air conditioner in a small space in the kitchen is expensive and inconvenient to install. It is also very troublesome to clean the air conditioner indoor unit in a place with heavy oil pollution such as the kitchen. Summary of the invention

[0004] An object of the present invention is to provide a temperature regulation system for a closed space.

[0005] The above technical objectives of the present invention are achieved through the following technical solutions:

[0006] A temperature regulating system for a closed space, comprising: a housing, a power control device mounted on the housing, a semiconductor cooling plate mounted on the power control device and controlled by the semiconductor cooling plate, a heat preservation component for sealing, protecting and keeping the semiconductor cooling plate warm, an auxiliary component for assisting the semiconductor cooling plate in heat exchange, and a lighting component mounted on the housing;

[0007] The power supply control device is used to control the positive and negative pole switching between the semiconductor refrigeration chip and the power supply, thereby changing the flow direction of the current in the semiconductor refrigeration chip and controlling the semiconductor refrigeration chip to cool or heat;

[0008] There are multiple semiconductor refrigeration sheets, which are connected in series and the top surfaces of the semiconductor refrigeration sheets are in the same plane. The multiple semiconductor refrigeration sheets are electrically connected in series.

[0009] By adopting the above technical solution, first, the user can remove the electric light originally installed in the kitchen and install the temperature control device at the original position of the electric light, which saves space and is convenient to install. When the power is turned on, the two ends of the semiconductor refrigeration sheet will become the cold end and the hot end respectively, the hot end absorbs the energy of the cold end to increase the temperature, and the cold end absorbs the energy of the hot end to reduce the temperature, and the current flow direction and size inside the semiconductor refrigeration sheet will affect the position of the hot and cold ends of the semiconductor refrigeration sheet and the temperature of the hot and cold ends; so the user can change the flow direction in the semiconductor refrigeration sheet through the power control device, so that the semiconductor refrigeration sheet can cool or heat the side near the kitchen, and then the auxiliary component will transport the cold air or warm air generated by the semiconductor refrigeration sheet to the kitchen to form an internal circulation, so as to achieve the effect of cooling or heating. The use of semiconductor refrigerators for cooling and heating has the following advantages: first, the temperature difference range of semiconductor refrigerators can be achieved from positive temperature 70°C to negative temperature 15°C. Secondly, the number of semiconductor refrigerators in series can be selected according to the actual size of the space to form a stack, thus avoiding waste of resources and saving energy. Furthermore, semiconductor refrigerators do not require any refrigerant, can work continuously, have no pollution sources and no rotating parts, work at a voltage that is safe for human beings, will not produce a rotation effect, have no vibration or noise during operation, have a long life, and are easy to install. In addition, semiconductor refrigerators are current transducer type components, which can achieve high-precision temperature control by controlling the input current. Coupled with temperature detection and control methods, it is easy to achieve remote control, program control, and computer control, making it easy to form an automatic control system.

[0010] It is further configured as follows: the insulation component includes multiple insulation parts with the same structure, and the insulation parts fix two adjacent semiconductor refrigeration plates in the same plane through an adhesive, and the top surfaces of the multiple semiconductor refrigeration plates and the multiple insulation parts are located in the same plane.

[0011] By adopting the above technical solution, the insulation part is used to connect and protect the semiconductor refrigeration plate to prevent it from being damaged. At the same time, the insulation part can reduce the energy cancellation between the cold end and the hot end of the semiconductor refrigeration plate when it is working, thereby enhancing the cooling or heating effect of the semiconductor refrigeration plate on the closed space.

[0012] It is further configured as follows: the auxiliary component includes a first fin installed on one side of the heat preservation part, a second fin arranged on the opposite side of the heat preservation part where the first fin is installed, a first blowing part arranged on the side of the first fin away from the second fin, and a second blowing part arranged on the side of the second fin away from the first fin, the blowing directions of the first blowing part and the second blowing part are arranged in opposite directions, the first fin and the second fin sandwich the heat preservation part and the semiconductor refrigeration fin between the first fin and the second fin and fix the heat preservation part and the semiconductor refrigeration fin, and the first fin and the second fin respectively contact the top surface and the bottom surface of the semiconductor refrigeration fin.

[0013] By adopting the above technical solution, the first fin and the second fin are directly connected to the semiconductor refrigeration sheet, and then the cold or heat generated in the semiconductor refrigeration sheet is transferred out by heat transfer. Finally, the first blower generates cold air or warm air from the cold or heat transferred from the semiconductor refrigeration sheet and blows it into the kitchen, and the second blower generates cold air or warm air from the cold or heat transferred from the semiconductor refrigeration sheet and blows it outside the kitchen, so as to achieve the effect of cooling or heating in the kitchen. Because the semiconductor refrigeration sheet cools on one side and heats on the other side, the heat preservation part and the second blower are used to reduce the cancellation of the cold or heat energy generated on the two sides of the semiconductor refrigeration sheet.

[0014] It is further configured as follows: a side of the first fin on which the first blowing part is installed is provided with foam cotton, the foam cotton seals the side of the first fin on which the first blowing part is installed, the first blowing part penetrates the foam cotton and contacts the first fin, and a ventilation part is provided on a side of the first fin adjacent to the foam cotton.

[0015] By adopting the above technical solution, the air in the kitchen is drawn to the first fin by the first blower through the ventilation part on the side of the first fin, and then absorbs the cold or heat on the first fin by heat exchange, and then is blown back to the kitchen by the first blower for cyclic cooling or heating. The foam cotton can keep the first fin warm, reduce the energy loss on the first fin, and enhance the cooling or heating effect of the semiconductor refrigeration plate.

[0016] It is further configured to include: a temperature control system for controlling the cooling or heating temperature of the semiconductor refrigeration plate;

[0017] The temperature control system comprises a relay switch, a single chip microcomputer connected to the relay switch, and a remote control module connected to the single chip microcomputer.

[0018] By adopting the above technical solution, the operator can input the cooling or heating command and the desired temperature through the remote control module, and then the remote control module sends the command to the single-chip microcomputer. The single-chip microcomputer controls the current direction and current size in the semiconductor refrigeration plate through the power control device, thereby controlling the cooling or heating temperature of the semiconductor refrigeration plate.

[0019] It is further configured as follows: the lighting assembly includes a plurality of groups of electric lamps installed on the housing, the electric lamps are installed at the bottom of the housing adjacent to the first blasting part, and the electric lamps are spaced apart from the first blasting part.

[0020] By adopting the above technical solution, the kitchen can be illuminated. The electric light and the first blowing part are arranged at a distance, which can avoid mutual interference between the first blowing part and the electric light during operation.

[0021] It is further configured as follows: four groups of mounting parts are symmetrically mounted on the side wall of the shell near the top, the mounting parts extend horizontally outward along the side wall of the shell, and a mounting hole is opened at one end of the mounting part away from the shell.

[0022] By adopting the above technical solution, when the temperature control device is installed in the kitchen, the lighting in the kitchen can be removed, and then the shell can be installed in the ceiling by using bolts to pass through the installation holes, which is convenient and quick.

[0023] It is further configured as follows: a ventilation pipe is provided on the top of the shell, the area of ​​one side of the ventilation pipe adjacent to the shell is larger than the area of ​​the second fin and wraps it inside, the ventilation pipe includes an outer tube and an inner tube located inside the outer tube, the outer tube and the inner tube are spaced apart, a plurality of groups of connecting rods are provided between the outer side wall of the inner tube and the inner side wall of the outer tube, and the inner tube is fixedly connected to the second blowing part and wraps it inside.

[0024] By adopting the above technical solution, the second blower draws air outside the kitchen through the gap between the outer tube and the inner tube to exchange heat with the second fin, and then discharges the air after heat exchange out of the space through the inner tube. The connecting rod is used to fix the inner tube to the inside of the outer tube.

[0025] In summary, the present invention has the following beneficial effects: by designing a new temperature control device, the effect of cooling or heating the kitchen is achieved, and the installation is convenient, as long as it is installed on the ceiling. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a cross-sectional view of the overall structure of the embodiment, wherein the arrow direction is the air flow direction;

[0027] Figure 2 : is a structural diagram of the semiconductor refrigeration sheet, the heat preservation component and the auxiliary component in the embodiment, wherein the arrow direction is the air flow direction;

[0028] Figure 3 2 is a structural diagram of the mounting portion in the embodiment.

[0029] In the figure, 1. shell; 11. mounting part; 12. mounting hole; 13. ventilation pipe; 14. inner tube; 15. outer tube; 16. connecting rod; 2. power control device; 3. semiconductor refrigeration plate; 4. insulation component; 41. insulation part; 5. auxiliary component; 51. first fin; 52. second fin; 53. first blowing part; 54. second blowing part; 55. foam cotton; 56. ventilation part; 6. lighting component; 7. temperature control system. DETAILED DESCRIPTION

[0030] The present invention is further described in detail below in conjunction with the accompanying drawings.

[0031] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "up", "down", "left", "right", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0032] Embodiment: A temperature control system for a closed space, such as Figure 1 As shown, it includes: a shell 1, a power control device 2 installed on the shell 1, a semiconductor refrigeration plate 3 installed on the power control device 2 and controlled, an insulation component 4 for sealing, protecting and keeping the semiconductor refrigeration plate 3 warm, an auxiliary component 5 for assisting the semiconductor refrigeration plate 3 in heat exchange, a lighting component 6 installed on the shell 1 and a temperature control system 7 for controlling the cooling or heating temperature of the semiconductor refrigeration plate 3.

[0033] Reference Figure 1-2 The semiconductor cooling sheet 3 includes two ceramic sheets, between which there are N-type and P-type semiconductor materials (bismuth telluride), and the semiconductor element is connected in series in the circuit. When current flows through a thermocouple formed by a piece of N-type semiconductor material and a piece of P-type semiconductor material, heat transfer will occur between the two ends, and the heat will be transferred from one end to the other end, thereby generating a temperature difference to form a cold and hot end. The semiconductor cooling sheet 3 is provided with multiple semiconductor cooling sheets and is electrically connected in series. The top surfaces of the multiple semiconductor cooling sheets 3 are in the same plane, and the bottom surfaces are also in the same plane; wherein each semiconductor cooling sheet 3 is set at a certain distance. The power supply control device 2 is an intermediate relay, which is mainly used to change the current flow direction and current size in the semiconductor cooling sheet 3, so as to control the cooling or heating of the semiconductor cooling sheet 3 and the cooling or heating temperature.

[0034] Reference Figure 1-2 The heat preservation assembly 4 includes a plurality of heat preservation parts 41 of the same structure, and the plurality of heat preservation parts 41 are placed on the sides of two adjacent semiconductor cooling sheets 3 and connect the two adjacent semiconductor cooling sheets 3, so that the top and bottom surfaces of the plurality of semiconductor cooling sheets 3 and the plurality of heat preservation parts 41 are respectively in the same plane. And each heat preservation part 41 is coated with adhesive on the side facing the semiconductor cooling sheet 3, so that the two adjacent semiconductor cooling sheets 3 can be connected together. The heat preservation part 41 is mainly used to reduce the energy cancellation between the cold end and the hot end of the semiconductor cooling sheet 3.

[0035] Reference Figure 1-2The auxiliary component 5 includes a first fin 51 installed on one side of the heat preservation part 41 and the semiconductor refrigeration plate 3, and a second fin 52 is installed on the opposite side of the heat preservation part 41 and the semiconductor refrigeration plate 3 to which the first fin 51 is installed, and the first fin 51 and the second fin 52 are arranged opposite to each other; a first blowing part 53 is installed on the side of the first fin 51 away from the second fin 52, and a second blowing part 54 is installed on the side of the second fin 52 away from the first fin 51, and the blowing directions of the first blowing part 53 and the second blowing part 54 are arranged in opposite directions, wherein the first blowing part 53 and the second blowing part 54 can be components that generate airflow relative to movement, such as fans and blowers, and the area of ​​the first blowing part 53 and the second blowing part 54 that are in contact with the first fin 51 and the second fin 52 is smaller than the area of ​​the first fin 51 and the second fin 52 that are in contact with the first blowing part 53 and the second blowing part 54.

[0036] Reference Figure 1-2 , the first fin 51 and the second fin 52 are connected to the semiconductor refrigeration sheet 3, and then the cold or heat generated by the energy transfer of the semiconductor refrigeration sheet 3 is transferred out by heat transfer, and finally the first blower 53 transfers the cold or heat of the semiconductor refrigeration sheet 3 to the first fin 51 to generate cold air or warm air and blows it into the kitchen for internal circulation, and the second blower 54 transfers the cold or heat of the semiconductor refrigeration sheet 3 to the second fin 52 opposite to the first fin 51 to generate cold air or warm air, and then blows it out of the kitchen. The first blower 53 makes the air in the kitchen flow and absorbs the cold or heat transferred from the first fin 51 to form cold air or warm air, so as to cool or heat the kitchen. The second blower 54 draws air outside the kitchen and absorbs the cold or heat on the second fin 52 which is opposite to that on the first fin 51 to generate cold air or warm air, and then discharges it out of the kitchen, so that the air inside and outside the kitchen are not exchanged; this can effectively reduce the energy cancellation between the cold end and the hot end of the semiconductor refrigeration plate 3, and enhance the cooling or heating effect of the semiconductor refrigeration plate 3.

[0037] Reference Figure 1-2 A foam 55 is installed on one side of the first fin 51 where the first blower 53 is installed. The foam 55 completely covers the one side of the first fin 51 where the first blower 53 is installed, and the first blower 53 penetrates the foam 55 and contacts the first fin 51; a ventilation part 56 is arranged on the side of the first fin 51 where the foam 55 is installed. The air in the kitchen can be drawn to the first fin 51 by the first blower 53 through the ventilation part 56 on the side of the first fin 51, and then absorb the cold or heat on the first fin 51 by heat exchange, and then be blown back to the kitchen by the first blower 53 for circulating cooling or heating. The foam 55 can keep the first fin 51 warm, reduce the energy loss on the first fin 51, and enhance the cooling or heating effect of the semiconductor refrigeration plate 3.

[0038] Reference Figure 1-3 The lighting assembly 6 includes an electric lamp installed on the bottom of the shell 1 near the first blast part 53, and multiple groups of electric lamps are installed on the shell 1. A certain distance is set between the electric lamp and the first blast part 53, so that it can be used for lighting in the kitchen and avoid mutual interference between the first blast part 53 and the electric lamp when working. A mounting part 11 is fixedly connected to the top of the two opposite side walls of the shell 1. The mounting part 11 extends horizontally from the side wall of the shell 1, and a mounting hole 12 is opened on the extended end of the mounting part 11. When installing the temperature control device, the temperature control device can be used to directly replace the original electric lamp in the kitchen, and then the shell 1 is fixedly connected to the ceiling with bolts passing through the mounting hole 12, which is convenient and quick to install.

[0039] Reference Figure 1-3 A vent pipe 13 is installed on the top of the shell 1 by screws, and the area of ​​one side of the vent pipe 13 adjacent to the top of the shell 1 is larger than the area of ​​the second fin 52, that is, the bottom of the vent pipe 13 wraps the second fin 52 inside. The vent pipe 13 includes an outer pipe 15, and an inner pipe 14 is installed inside the outer pipe 15 and is spaced from the inner wall of the outer pipe 15, and a connecting rod 16 is fixedly connected between the outer wall of the inner pipe 14 and the inner wall of the outer pipe 15, and the inner pipe 14 is fixedly connected to the inner wall of the outer pipe 15, wherein the inner pipe 14 wraps the second blower 54 inside. When working, the second blower 54 draws air outside the kitchen through the gap between the outer pipe 15 and the inner pipe 14 to exchange heat with the second fin 52, and then discharges the air after heat exchange outside the space through the inner pipe 14.

[0040] The temperature control system 7 includes a relay switch, a single-chip microcomputer connected to the relay switch, and a remote control module connected to the single-chip microcomputer; when in use, the operator can input a cooling or heating command and the desired temperature through the remote control module, and then the remote control module sends the instruction to the single-chip microcomputer, and the single-chip microcomputer controls the current direction and current size in the semiconductor refrigeration plate 3 through the power supply control device 2, thereby controlling the cooling or heating temperature of the semiconductor refrigeration plate 3.

[0041] This specific embodiment is only an explanation of the present invention, and it is not a limitation of the present invention. After reading this specification, those skilled in the art can make non-creative modifications to this embodiment as needed, but as long as it is within the protection scope of the present invention, it will be protected by the patent law.

Claims

1. A temperature control system for a closed space, characterized in that: include: A housing (1), a power control device (2) mounted on the housing (1), a semiconductor cooling plate (3) mounted on the power control device (2) and controlled by the power control device (2), a heat preservation component (4) for sealing, protecting and heat-insulating the semiconductor cooling plate (3), an auxiliary component (5) for assisting the semiconductor cooling plate (3) in heat exchange, and a lighting component (6) mounted on the housing (1); The power control device (2) is used to control the switching of the positive and negative poles between the semiconductor refrigeration chip (3) and the power supply, thereby changing the flow direction of the current in the semiconductor refrigeration chip (3) and controlling the semiconductor refrigeration chip (3) to cool or heat; the power control device (2) is an intermediate relay, which is used to change the flow direction and current size of the current in the semiconductor refrigeration chip (3), thereby controlling the semiconductor refrigeration chip (3) to cool or heat and the cooling or heating temperature; The semiconductor refrigeration sheet (3) is provided with a plurality of semiconductor refrigeration sheets (3), the plurality of semiconductor refrigeration sheets (3) are connected in series and the top surfaces of the semiconductor refrigeration sheets (3) are located in the same plane, and the plurality of semiconductor refrigeration sheets (3) are electrically connected in series; the semiconductor refrigeration sheet (3) comprises two ceramic sheets, and there are N-type and P-type semiconductor materials between the two ceramic sheets. When current flows through a thermocouple pair formed by connecting a piece of N-type semiconductor material and a piece of P-type semiconductor material, heat transfer occurs between the two ends, and heat is transferred from one end to the other end, thereby generating a temperature difference to form a cold end and a hot end: The heat-insulating assembly (4) comprises a plurality of heat-insulating parts (41) of identical structure, wherein the heat-insulating parts (41) are used to fix two adjacent semiconductor cooling sheets (3) in the same plane by means of an adhesive, and the top surfaces of the plurality of semiconductor cooling sheets (3) and the plurality of heat-insulating parts (41) are located in the same plane; The auxiliary component (5) comprises a first fin (51) mounted on one side of the heat-insulating portion (41), a second fin (52) arranged on the side of the heat-insulating portion (41) opposite to the first fin (51), a first blowing portion (53) arranged on the side of the first fin (51) away from the second fin (52), and a second blowing portion (54) arranged on the side of the second fin (52) away from the first fin (51), wherein the blowing directions of the first blowing portion (53) and the second blowing portion (54) are opposite to each other, the first fin (51) and the second fin (52) sandwich the heat-insulating portion (41) and the semiconductor cooling fin (3) between the first fin (51) and the second fin (52) and fix the heat-insulating portion (41) and the semiconductor cooling fin (3), and the first fin (51) and the second fin (52) respectively contact the top surface and the bottom surface of the semiconductor cooling fin (3); A foam cotton (55) is installed on one side of the first fin (51) on which the first blowing part (53) is installed, the foam cotton (55) seals the side of the first fin (51) on which the first blowing part (53) is installed, the first blowing part (53) penetrates the foam cotton (55) and contacts the first fin (51), and a ventilation part (56) is provided on one side of the first fin (51) adjacent to the foam cotton (55); It also includes a temperature control system (7) for controlling the cooling or heating temperature of the semiconductor refrigeration plate (3); the temperature control system (7) includes a relay switch, a single-chip microcomputer connected to the relay switch, and a remote control module connected to the single-chip microcomputer; The lighting assembly (6) comprises a plurality of groups of electric lamps mounted on the housing (1), the electric lamps being mounted on the bottom of the housing (1) adjacent to a side of the first blasting portion (53), the electric lamps being spaced apart from the first blasting portion (53); Four groups of mounting parts (11) are symmetrically mounted on the side wall of the shell (1) near the top, the mounting parts (11) extending horizontally outward along the side wall of the shell (1), and a mounting hole (12) is provided at one end of the mounting part (11) away from the shell (1); a vent pipe (13) is provided on the top of the shell (1), the area of ​​one side of the vent pipe (13) near the shell (1) is larger than the area of ​​the second fin (52) and wraps it inside, the vent pipe (13) comprises an outer pipe (15) and an inner pipe (14) located inside the outer pipe (15), the outer pipe (15) and the inner pipe (14) are spaced apart, a plurality of groups of connecting rods (16) are provided between the outer side wall of the inner pipe (14) and the inner side wall of the outer pipe (15), and the inner pipe (14) is fixedly connected to the second blast part (54) and wraps it inside; The first fin (51) and the second fin (52) are connected to the semiconductor cooling plate (3), and then the cold or heat generated by the semiconductor cooling plate (3) through energy movement is transferred out by means of heat transfer. Finally, the first air blowing part (53) transfers the cold or heat of the semiconductor cooling plate (3) to the first fin (51) to generate cold air or warm air, which is blown into the kitchen for internal circulation. The second air blowing part (54) transfers the cold or heat of the semiconductor cooling plate (3) to the second fin (52) opposite to the first fin (51) to generate cold air or warm air, which is then blown out of the kitchen. The first blower (53) makes the air in the kitchen flow and absorbs the cold or heat transferred from the first fin (51) to form cold air or warm air, thereby cooling or heating the kitchen; the second blower (54) draws air outside the kitchen to absorb the cold or heat on the second fin (52) opposite to that on the first fin (51) to form cold air or warm air, and then discharges it outside the kitchen, so that the air inside and outside the kitchen are not exchanged.

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