Wire Circuit Board Welding Device

Abstract

The present invention discloses a wire circuit board welding device, comprising: a frame, a circulating conveying mechanism, a positioning die, a circuit board loading mechanism, a wire feeding mechanism, a first clamping release mechanism, a wire welding mechanism, a discharging mechanism, a wire clamping mechanism and a second clamping release mechanism. The circuit board to be welded is placed in the positioning die by the circuit board loading mechanism for positioning, and the circulating conveying mechanism conveys the circuit board to the wire feeding mechanism. The first clamping release mechanism opens the wire clamping mechanism located at the position of the wire feeding mechanism. The wire feeding mechanism clamps a wire and places it above the circuit board, and the wire clamping mechanism clamps the wire. The circulating conveying mechanism drives the positioning die to move, so that the positioning die equipped with the circuit board and the wire can move to the lower part of the wire welding mechanism, and the wire and the circuit board are welded by the wire welding mechanism. Finally, the second clamping release mechanism opens the wire clamping mechanism, and the discharging mechanism takes out the welded circuit board, thus realizing full-automatic and circulating welding and improving the welding efficiency.

Description

Technical Field

[0001] The present invention relates to the field of circuit board wire soldering machines, and particularly to a wire circuit board soldering device. Background Art

[0002] Circuit boards are widely used in electronic products and electronic devices in large quantities; and many circuit boards need to have wires soldered on them. For the traditional operation of soldering wires on circuit boards, it is manually done by workers. However, this manual soldering method has a huge workload and extremely low efficiency, unable to meet the production requirements. Currently, in order to improve the soldering efficiency, automated soldering is adopted during the production process. However, the existing automatic soldering structure uses a manipulator to clamp one end of the wire and extend it towards the circuit board. Then, the soldering tin module moves to the soldering position to solder one end of the wire on the circuit board. After the soldering is completed, the circuit board is taken out, and then another wire is clamped to solder with another circuit board. In this welding process and with this welding equipment, there are many idle running actions, resulting in low efficiency and high wire soldering costs. In view of the above defects, it is necessary to design a wire circuit board soldering device. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a wire circuit board soldering device to solve the problems of low soldering efficiency and high cost of the existing automated equipment for soldering wires on circuit boards.

[0004] To solve the above technical problem, the technical solution of the present invention is: A wire circuit board soldering device, comprising:

[0005] A frame;

[0006] A circulating conveying mechanism, arranged on the frame;

[0007] A positioning mold, multiple positioning molds are slidably arranged on the circulating conveying mechanism, the circulating conveying mechanism drives the positioning molds to run in a cycle, and a wire clamping mechanism is arranged on the outer side of the positioning mold;

[0008] A circuit board loading mechanism, which clamps the circuit board to be soldered and positions it in the positioning mold, and the circuit board loading mechanism is arranged on the frame;

[0009] An upper wire mechanism, fixedly arranged on the frame, and one end of the wire to be soldered is clamped and arranged on the circuit board of the corresponding positioning mold;

[0010] A first wire releasing mechanism, fixedly arranged on the frame. When the upper wire mechanism clamps the wire and arranges it on the circuit board of the positioning mold, the first wire releasing mechanism opens the wire clamping mechanism to enable the wire clamping mechanism to clamp the wire;

[0011] At least one wire bonding mechanism, which is arranged on the frame and is used for welding wires onto a circuit board;

[0012] A discharging mechanism, which is arranged on the frame and is used for discharging the welded circuit board;

[0013] And a second clip-opening mechanism, which is arranged on the frame and is used for opening the wire clamping mechanism of the discharged circuit board;

[0014] The circuit board loading mechanism, the loading mechanism, the wire bonding mechanism and the discharging mechanism are sequentially arranged along the conveying direction of the circulating conveying mechanism.

[0015] Furthermore, the circuit board loading mechanism includes: a suction cup manipulator and a bottom plate, which are arranged on the frame; a bracket, which is arranged on the bottom plate, and a guiding slideway is arranged at the top of the bracket; a material box, which is arranged at the top of the bracket, the material box has a cavity with an opening at the top end and the bottom end, and the bottom of the cavity is located above the guiding slideway; a push block, one end of which can slide into the guiding slideway, and the other end is connected with a pushing mechanism, the pushing mechanism is arranged on the bottom plate, and the pushing mechanism pushes the push block to slide in the guiding slideway to push out the circuit board at the bottom end of the cavity, and the suction cup manipulator sucks the circuit board and places it in the corresponding positioning mold.

[0016] Furthermore, a board-breaking mechanism is also arranged at one end of the bracket;

[0017] The board-breaking mechanism includes: a lifting cylinder, which is arranged on the bottom plate; a rotating mounting seat, which is arranged at the lifting movable end of the lifting cylinder, and two parallel side plates extending upward are arranged on the rotating mounting seat; a turning plate, with rotating connecting parts arranged at both ends, the rotating connecting parts are rotatably connected with the corresponding side plates, a clamping groove is arranged at the top of the turning plate near one end of the bracket; a turning mechanism, which is arranged on the rotating mounting seat and drives the turning plate to turn; a cylinder, which is arranged at the bottom of the turning plate; a limiting plate, which is connected with the moving end of the cylinder, and the pushing mechanism is a stepping pushing mechanism; the pushing mechanism pushes one end of the circuit board into the clamping groove, the cylinder pushes the limiting plate to move above the clamping groove to press one end of the circuit, and the turning mechanism drives the turning plate to turn so that the circuit board breaks along the breaking line, and the lifting cylinder drives the rotating mounting seat to move up and down to completely separate the broken circuit board from the main body.

[0018] Furthermore, the loading mechanism includes a support seat arranged on the frame, a translation mechanism arranged at the upper end of the support seat, a lifting member arranged on the sliding seat of the translation mechanism, and a pneumatic clamp arranged at the lifting end of the lifting member.

[0019] Furthermore, the wire clamping mechanism includes a first clamping plate, a second clamping plate, a tension spring, a first clamping block, and a second clamping block. The first clamping plate and the second clamping plate are symmetrically pivotally connected to the outside of the positioning die. Meshing teeth are provided on the opposite sides of the first clamping plate and the second clamping plate. The first clamping block is fixedly provided at the upper end of the first clamping plate, and the second clamping block is fixedly provided at the upper end of the second clamping plate. The two ends of the tension spring are respectively connected to the first clamping plate and the second clamping plate, and pull the first clamping block and the second clamping block to clamp each other.

[0020] Furthermore, "V"-shaped notches are provided at the opposite ends of the first clamping block and the second clamping block. A first clearance groove is provided on one side of the notch of the first clamping block, and a second clearance groove is provided on the notch side of the second clamping block. The first clearance groove forms two first side plates on the first clamping block, and the second clearance groove forms two second side plates on the second clamping block. When the tension spring is tightened, one of the first side plates extends into the second clearance groove, and one of the second side plates extends into the first clearance groove.

[0021] Furthermore, the first clamping release mechanism includes a first telescopic cylinder provided on the frame and a first inclined dial block provided on the first telescopic cylinder. The first telescopic cylinder pushes the first inclined dial block to rise, so that the first inclined dial block pushes the first clamping plate or the second clamping plate to swing, causing the wire clamping mechanism to release the clamp.

[0022] The second clamping release mechanism includes a second telescopic cylinder provided on the frame and a second inclined dial block provided on the second telescopic cylinder. The second telescopic cylinder pushes the second inclined dial block to rise, so that the second inclined dial block pushes the first clamping plate or the second clamping plate to swing, causing the wire clamping mechanism to release the clamp.

[0023] Furthermore, a wire turning mechanism is further included. The wire turning mechanism is provided on the frame and is located between the wire feeding mechanism and the wire soldering mechanism arranged along the direction of the circular conveying mechanism. The wire turning mechanism adjusts the orientation angle of the wire terminals conveyed to the position of the wire turning mechanism.

[0024] Further, the wire steering mechanism includes: a third wire clamping and releasing mechanism disposed on the frame. When the wire angle needs to be adjusted, the third wire clamping and releasing mechanism opens the wire clamping mechanism corresponding to the outside of the positioning die; a second translation mechanism disposed on the frame; a transverse movement mechanism disposed on the moving seat of the second translation mechanism, the transverse movement mechanism being perpendicular to the second translation mechanism; a mounting seat disposed on the transverse movement mechanism; a clamping and rotating mechanism and a CCD industrial camera disposed on the mounting seat; the CCD industrial camera detects the terminal position of the wire, the transverse movement mechanism pushes the clamping and rotating mechanism to the front end of the wire, the second translation mechanism drives the clamping and rotating mechanism to move, so that the end of the wire extends into the clamping end of the clamping and rotating mechanism for clamping, and the clamping and rotating mechanism drives the wire to rotate.

[0025] Further, the clamping and rotating mechanism includes two support plates arranged front and back, a rotating member rotatably connected to one of the support plates, a pneumatic clamp disposed at the end of the rotating member, and a motor disposed on the other support plate, the motor driving the rotating member to rotate.

[0026] Further, an auxiliary clamping mechanism is further disposed above the wire steering mechanism; the auxiliary clamping mechanism includes a support frame, a third translation mechanism disposed on the support frame, a second pneumatic clamp disposed on the moving seat of the third translation mechanism, and V-shaped clamping blocks disposed on two clamping jaws of the second pneumatic clamp. When the second pneumatic clamp clamps, the two V-shaped clamping blocks clamp the wire.

[0027] Further, the number of wire welding mechanisms is two groups.

[0028] Further, a positioning block is fixedly disposed inside the positioning die, and a positioning mechanism disposed inside the circulating conveyor mechanism positions the positioning block conveyed below the wire welding mechanism.

[0029] Further, the circulating conveyor mechanism is a runway-type conveyor mechanism, which includes: a runway-shaped support table disposed on the frame; a track disposed on the support table, which includes two arc segments and two straight segments, and the two arc segments and the two straight segments form a runway-shaped structure; mounting plates, two mounting plates are fixedly disposed opposite to each other at both ends of the inner support of the runway-shaped support table; a driving pulley rotatably connected to one of the mounting plates; a driven pulley rotatably connected to the other mounting plate; a synchronous belt connecting the driving pulley and the driven pulley; a driving motor driving the driving pulley to rotate; the positioning die is slidably connected to the track; the inside of the positioning die is fixedly connected to the synchronous belt, and the driving motor drives the driving pulley to rotate, so that the synchronous belt drives the positioning die to slide along the track.

[0030] Furthermore, the positioning mechanism is arranged inside the straight-line section of the support platform close to the wire bonding mechanism; the positioning mechanism includes at least two rotary mounting seats fixedly arranged inside the support platform, a rotating shaft rotatably connected to the rotary mounting seats, at least two swing arms arranged on the rotating shaft, a limiting member arranged on the swing arms, and a driving member for driving the rotating shaft to rotate; the driving member drives the rotating shaft to rotate, so that the limiting member limits the positioning block inside the positioning mold located below the wire bonding mechanism.

[0031] Furthermore, a steering mechanism is also arranged on the frame, and the steering mechanism is located between the circuit board feeding mechanism and the upper line mechanism; the steering mechanism includes a support column and a second support seat arranged on the frame, a second CCD camera arranged at the upper end of the support column, a second transverse movement mechanism arranged on the second support seat, a seat body arranged on the second transverse movement mechanism, a lifting mechanism arranged at one end of the seat body close to the circulating conveying mechanism, a connecting plate arranged at the bottom end of the lifting mechanism, a rotating motor arranged on the connecting plate, a carrier plate arranged on the rotating shaft of the rotating motor, and a suction cup arranged at the bottom of the carrier plate.

[0032] Furthermore, the unloading mechanism includes a third support seat arranged on the frame, a fourth translation mechanism arranged at the upper end of the third support seat, and a material taking mechanism arranged on the fourth translation mechanism; the fourth translation mechanism drives the material taking mechanism to translate above the positioning mold and take out the circuit board in the positioning mold.

[0033] Furthermore, a back glue peeling mechanism and a pushing mechanism are also arranged on the frame. The back glue peeled by the back glue peeling mechanism is adsorbed on the pushing mechanism, and the pushing mechanism pushes the back glue to the bottom of the material taking mechanism, so that the material taking mechanism sucks the back glue and pastes it on the circuit board.

[0034] Compared with the prior art, the wire threading and tin dipping integrated machine has the following beneficial effects:

[0035] 1. The circuit board feeding mechanism places the circuit board to be welded in the positioning mold for positioning. The circulating conveying mechanism conveys the circuit board to the upper line mechanism. The first clip opening mechanism opens the wire clamping mechanism at the position of the upper line mechanism. The upper line mechanism clamps the wire and places it above the circuit board, and makes the wire clamping mechanism clamp the wire; the circulating conveying mechanism drives the positioning mold to move, so that the positioning mold equipped with the circuit board and the wire can move below the wire bonding mechanism, and the wire bonding mechanism welds the wire and the circuit board; finally, the second clip opening mechanism opens the wire clamping mechanism, and the unloading mechanism takes out the welded circuit board. Therefore, full-automatic and cyclic welding is realized, and the welding efficiency is improved. Description of the Drawings

[0036] Figure 1It is the front three-dimensional structure diagram of the wire circuit board welding device of the present invention;

[0037] Figure 2 It is the reverse three-dimensional structure diagram of the wire circuit board welding device of the present invention;

[0038] Figure 3 It is the front view of the circuit board feeding mechanism of the wire circuit board welding device of the present invention;

[0039] Figure 4 It is the front structure diagram of the part of the circuit board feeding mechanism of the wire circuit board welding device of the present invention;

[0040] Figure 5 It is the reverse structure diagram of the part of the circuit board feeding mechanism of the wire circuit board welding device of the present invention;

[0041] Figure 6 It is the exploded view of the part of the circuit board feeding mechanism of the wire circuit board welding device of the present invention;

[0042] Figure 7 It is the structure diagram of the suction cup type manipulator of the wire circuit board welding device of the present invention;

[0043] Figure 8 It is the structure diagram of the online mechanism of the wire circuit board welding device of the present invention;

[0044] Figure 9 It is the structure diagram of the positioning mold and wire clamping mechanism of the wire circuit board welding device of the present invention;

[0045] Figure 10 It is the structure diagram of the first clamping block and the second clamping block of the wire circuit board welding device of the present invention;

[0046] Figure 11 It is the structure diagram of the first clip-opening mechanism of the wire circuit board welding device of the present invention;

[0047] Figure 12 It is the structure diagram of the second clip-opening mechanism of the wire circuit board welding device of the present invention;

[0048] Figure 13 It is the structure diagram of another embodiment of the wire circuit board welding device of the present invention;

[0049] Figure 14 It is the structure diagram of the wire turning mechanism of the wire circuit board welding device of the present invention;

[0050] Figure 15 It is the structure diagram of the clamping and rotating mechanism of the wire circuit board welding device of the present invention;

[0051] Figure 16It is the structural diagram of the solder joint mechanism of the wire circuit board soldering device of the present invention, where the solder joint mechanism is a laser soldering mechanism;

[0052] Figure 17 It is the structural diagram of the circulating conveying mechanism of the wire circuit board soldering device of the present invention;

[0053] Figure 18 It is the structural diagram of the positioning mechanism part of the wire circuit board soldering device of the present invention;

[0054] Figure 19 It is the structural diagram of the steering mechanism of the wire circuit board soldering device of the present invention;

[0055] Figure 20 It is the front view of the unloading mechanism of the wire circuit board soldering device of the present invention;

[0056] Figure 21 It is the structural diagram of the part for pasting back glue of the wire circuit board soldering device of the present invention. Detailed implementation manners

[0057] The following detailed implementation manners will be further described in conjunction with the above-mentioned drawings.

[0058] In the following text, a variety of specific details are set forth in order to provide a thorough understanding of the concepts underlying the described embodiments. However, it will be apparent to those skilled in the art that the described embodiments may be practiced without some or all of these specific details. In other instances, well-known processing steps are not specifically described.

[0059] Refer to Figure 1 and Figure 2, a wire circuit board welding device, comprising: a frame 1, a circulating conveying mechanism 2, a positioning mold 3, a circuit board loading mechanism 4, a wire feeding mechanism 5, a first clamping release mechanism 6, a wire welding mechanism 7, a discharging mechanism 8, a wire clamping mechanism 9 and a second clamping release mechanism 10. The circuit board loading mechanism 4, the wire feeding mechanism 5, the wire welding mechanism 7 and the discharging mechanism 8 are arranged in sequence along the conveying direction of the circulating conveying mechanism 2. Among them: the circulating conveying mechanism 2 is arranged on the frame 1; a plurality of the positioning molds 3 are slidably arranged on the circulating conveying mechanism 2, the circulating conveying mechanism 2 drives the positioning molds 3 to circulate, and a wire clamping mechanism 9 is arranged on the outer side of the positioning molds 3. The circuit board loading mechanism 4 clamps the circuit board to be welded and positions it in the positioning mold 3, and the circuit board loading mechanism 4 is arranged on the frame 1. The wire feeding mechanism 5 is fixedly arranged on the frame 1, and one end of the wire to be welded is clamped and arranged on the circuit board of the corresponding positioning mold 3. The first clamping release mechanism 6 is fixedly arranged on the frame 1. When the wire feeding mechanism 5 clamps the wire and arranges it on the circuit board of the positioning mold 3, the first clamping release mechanism 6 opens the wire clamping mechanism 9 so that the wire clamping mechanism 9 clamps the wire. At least one group of wire welding mechanisms 7 is arranged on the frame 1 for welding the wire to the circuit board. The discharging mechanism 8 is arranged on the frame 1 for unloading the welded circuit board; the second clamping release mechanism 10 is arranged on the frame 1 for opening the wire clamping mechanism 9 of the unloaded circuit board.

[0060] The specific working principle is as follows: The circuit board loading mechanism 4 places the circuit board to be welded in the positioning mold 3 for positioning. The circulating conveying mechanism 2 conveys the circuit board to the wire feeding mechanism 5. The first clamping release mechanism 6 opens the wire clamping mechanism 9 located at the position of the wire feeding mechanism 5. The wire feeding mechanism 5 clamps the wire and places it above the circuit board, and makes the wire clamping mechanism 9 clamp the wire. The circulating conveying mechanism 2 drives the positioning mold 3 to move, so that the positioning mold 3 equipped with the circuit board and the wire can move to the lower part of the wire welding mechanism 7, and the wire welding mechanism 7 welds the wire and the circuit board. Finally, the second clamping release mechanism 10 opens the wire clamping mechanism 9, and the discharging mechanism 8 takes out the welded circuit board. Therefore, full-automatic and circulating welding is realized, and the welding efficiency is improved.

[0061] Further, referring to Figures 3 - 6, the circuit board loading mechanism 4 includes: a suction cup manipulator 40 and a bottom plate 41, which are arranged on the frame 1; a bracket 42, which is arranged on the bottom plate 41, and a guiding slideway 420 is arranged at the top of the bracket 42; a material box 43, which is arranged at the top of the bracket 42, the material box 43 has a cavity with openings at the top and bottom for storing circuit boards, and the bottom of the cavity is located above the guiding slideway 420; a push block 44, one end of which can slide into the guiding slideway 420, and the other end is connected to a pushing mechanism 45, the pushing mechanism 45 is arranged on the bottom plate 41, and the pushing mechanism 45 pushes the push block 44 to slide in the guiding slideway 420 to push out the circuit board at the bottom end of the cavity, and the suction cup manipulator 40 sucks the circuit board and places it in the corresponding positioning mold 3.

[0062] Further, referring to Figure 7 , the suction cup manipulator 40 includes a support seat 400 arranged on the frame 1, a linear module 401 arranged on the support seat 400, a material taking cylinder 402 at one end of a moving seat arranged on the linear module 401, a suction cup 403 arranged on the material taking cylinder 402, and the suction cup 403 is connected to a negative pressure mechanism through a pipeline; the material taking cylinder 402 drives the suction cup 403 to move up and down.

[0063] Furthermore, in order to meet the requirement when the circuit board and the wire are welded at a certain angle (specifically referring to Figure 7 ), a corner motor 404 is arranged on one side of the material taking cylinder 402, a mounting plate 405 is arranged on the rotating shaft of the corner motor 404, and the suction cup 403 is arranged at the bottom of the mounting plate 405; and the positioning cavity of the positioning mold 3 can be set at a certain angle to meet the positioning of the circuit board; the circuit board is sucked by the suction cup 403 and rotated by a certain angle to be positioned in the cavity of the positioning mold 3.

[0064] Further, a board breaking mechanism 46 is also arranged at one end of the bracket 42, please refer to Figure 4 and Figure 5 . The board breaking mechanism 46 breaks a whole circuit board along the breaking line into single circuit boards.

[0065] The board breaking mechanism 46 includes: a lifting cylinder 460, a rotating mounting seat 461, a flipping plate 463, a flipping mechanism 464, a cylinder 465 and a limiting plate 466.

[0066] Among them, the lifting cylinder 460 is arranged on the bottom plate 41; the rotary mounting seat 461 is arranged at the lifting movable end of the lifting cylinder 460, and there are two parallel side plates 462 extending upward on the rotary mounting seat 461; both ends of the turning plate 463 are provided with rotary connecting parts, and the rotary connecting parts are rotatably connected to the corresponding side plates 462. A clamping groove 4630 is arranged at the top of the turning plate 463 near one end of the bracket 42; the turning mechanism 464 is arranged on the rotary mounting seat 461 to drive the turning plate 463 to turn; the cylinder 465 is arranged at the bottom of the turning plate 463; the limiting plate 466 is connected to the movable end of the cylinder 465, and the cylinder 465 drives the limiting plate 466 to move above the clamping groove 4630. The pushing mechanism 45 is a stepping pushing mechanism. The pushing mechanism 45 gradually pushes one end of the circuit board into the clamping groove 4630, the cylinder 465 drives the limiting plate 466 to move above the clamping groove 4630 to press one end of the circuit, the turning mechanism 464 drives the turning plate 463 to turn, so that the circuit board breaks along the breaking line, and the lifting cylinder 460 drives the rotary mounting seat 461 to move up and down, so that the broken circuit board is completely separated from the main body. After separation, the turning plate 463 turns to the original horizontal position, and the cylinder 465 drives the limiting plate 466 to leave the circuit board; therefore, the suction cup manipulator 40 can suck the broken circuit board and place it in the positioning die 3.

[0067] Further, the turning mechanism 464 includes a synchronous pulley arranged on one of the rotary connecting parts, a turning motor arranged on the rotary mounting seat 461, a synchronous pulley arranged on the main shaft of the turning motor, and a synchronous belt connecting the two synchronous pulleys.

[0068] Still further, the pushing mechanism 45 is an electric screw linear module 450 arranged on the bottom plate 41.

[0069] Further, referring to Figure 7 , the wire feeding mechanism 5 includes a support seat 50 arranged on the frame 1, a translation mechanism 51 arranged at the upper end of the support seat 50, a lifting member 52 arranged on the sliding seat of the translation mechanism 51, and a pneumatic clamp 53 arranged at the lifting end of the lifting member 52. Among them, the translation mechanism 51 is a linear module, and the lifting member 52 is a pneumatic slide or a multi-axis telescopic cylinder. The pneumatic clamp 53 is driven by the translation mechanism 51 to translate, and the pneumatic clamp 53 is driven by the lifting member 52 to move up and down. Therefore, the pneumatic clamp 53 can place single wires one by one into the positioning die 3 at the position of the wire feeding mechanism 5.

[0070] Further, referring to Figure 9The wire clamping mechanism 9 includes a first clamping plate 90, a second clamping plate 91, a tension spring 92, a first clamping block 93 and a second clamping block 94. The first clamping plate 90 and the second clamping plate 91 are symmetrically pivoted on the outer side of the positioning mold 3, and the opposite sides of the first clamping plate 90 and the second clamping plate 91 are provided with mutually meshing gear teeth; the first clamping block 93 is fixedly arranged at the upper end of the first clamping plate 90, and the second clamping block 94 is fixedly arranged at the upper end of the second clamping plate 91; the two ends of the tension spring 92 are respectively connected to the first clamping plate 90 and the second clamping plate 91, and pull the first clamping block 93 and the second clamping block 94 to clamp each other. When clamping or releasing the wire, the first clamping plate 90 is rotated around the pivot by the first opening clamping mechanism 6 or the second opening clamping mechanism 10, and the upper ends of the first clamping plate 90 and the second clamping plate 91 are swung outward under the meshing of the gear teeth, overcoming the elastic force of the tension spring 92, so that the first clamping block 93 and the second clamping block 94 are opened to each other.

[0071] Further, refer to Figure 9 and Figure 10 , the first clamping block 93 and the second clamping block 94 are provided with a "V" notch at the opposite ends; a first avoidance groove 930 is provided on one side of the notch of the first clamping block 93, and a second avoidance groove 940 is provided on the notch side of the second clamping block 94; the first avoidance groove 930 forms two first side plates 931 of the first clamping block 93, and the second avoidance groove 940 forms two second side plates 941 of the second clamping block 94; the tension spring 92 is tightened to make a first side plate 931 extend into the second avoidance groove 940, and a second side plate 941 extend into the first avoidance groove 930. Since the "V" notch has a self-centering effect, when clamping the wire, it can ensure that the center height of the wire is consistent; and by the first side plate 931 extending into the second avoidance groove 940, the wire is subjected to uniform force to avoid being bent during the clamping process.

[0072] Further, refer to Figure 11 The first clamping mechanism 6 includes a first telescopic cylinder 60 arranged on the frame 1 and a first oblique shift block 61 arranged on the first telescopic cylinder 60; the first telescopic cylinder 60 pushes the first oblique shift block 61 to rise, so that the first oblique shift block 61 pushes the first clamping plate 90 or the second clamping plate 91 to swing, so that the wire clamping mechanism 9 opens.

[0073] Reference Figure 12, the second clamping mechanism 10 includes a second telescopic cylinder 100 disposed on the frame 1 and a second inclined dial block 101 disposed on the second telescopic cylinder 100; the second telescopic cylinder 100 pushes the second inclined dial block 101 to rise, so that the second inclined dial block 101 pushes the first clamping plate 90 or the second clamping plate 91 to swing, so that the wire clamping mechanism 9 opens the clamp.

[0074] Further, in this embodiment, terminals are provided at the non-welded ends of the wires welded to the circuit board. For example, when an RF wire is welded to the circuit board, since the orientation of the terminal of the RF wire is perpendicular to the axis of the wire; when there are specific requirements for the orientation of the terminal after welding; the wire and cable board welding device further includes a wire turning mechanism 11 (please refer to Figure 13 ), the wire turning mechanism 11 is disposed on the frame 1 and is located between the wire feeding mechanism 5 and the wire welding mechanism 7 disposed along the direction of the circulating conveying mechanism 2. The wire turning mechanism 11 adjusts the orientation angle of the wire terminals conveyed to the position of the wire turning mechanism 11.

[0075] Further, referring to Figure 14 and Figure 15 , the wire turning mechanism 11 includes: a third clamping mechanism 110, a second translation mechanism 111, a transverse movement mechanism 112, a mounting seat 113, a clamping and rotating mechanism 114, and a CCD industrial camera 115.

[0076] The third clamping mechanism 110 is disposed on the frame 1. When the wire angle needs to be adjusted, the third clamping mechanism 110 opens the wire clamping mechanism 9 corresponding to the outside of the positioning die 3. The second translation mechanism 111 is disposed on the frame 1. Specifically, the second translation mechanism 111 is a ball screw linear module; the transverse movement mechanism 112 is disposed on the moving seat of the second translation mechanism 111. The transverse movement mechanism 112 is perpendicular to the second translation mechanism 111. Specifically, the transverse movement mechanism 112 is a pneumatic slide; the mounting seat 113 is disposed on the transverse movement mechanism 112; the clamping and rotating mechanism 114 and the CCD industrial camera 115 are disposed on the mounting seat 113. Specifically, the CCD industrial camera 115 detects the position of the terminal of the wire. The transverse movement mechanism 112 pushes the clamping and rotating mechanism 114 to the front end of the wire. The second translation mechanism 111 drives the clamping and rotating mechanism 114 to move, so that the end of the wire extends into the clamping end of the clamping and rotating mechanism 114 for clamping, and the clamping and rotating mechanism 114 drives the wire to rotate a certain angle.

[0077] Further, referring to Figure 15, the clamping and rotating mechanism 114 includes two support plates 1140 arranged front and back, a rotating member 1141 rotatably connected to one of the support plates 1140, a pneumatic clamp 1142 provided at the end of the rotating member 1141, and a motor 1143 provided on the other support plate 1140. The motor 1143 drives the rotating member 1141 to rotate.

[0078] Further, the structure of the third clamp-opening mechanism 110 is the same as that of the first clamp-opening mechanism 6 and the second clamp-opening mechanism 10.

[0079] In order to adapt to the turning of wires with a longer length, an auxiliary clamping mechanism 12 is further provided above the wire turning mechanism 11. Refer to Figure 14 . The auxiliary clamping mechanism 12 includes a support frame 120, a third translation mechanism 121 provided on the support frame 120, a second pneumatic clamp 122 provided on the moving seat of the third translation mechanism 121, and V-shaped clamping blocks 123 provided on the two clamping jaws of the second pneumatic clamp 122. When the second pneumatic clamp 122 clamps, the two V-shaped clamping blocks 123 clamp the wire. When turning the wire, the wire is supported by the auxiliary clamping mechanism 12 to prevent the wire from sagging during rotation due to its excessive length, and the front and back positions of the wire can also be adjusted. In this embodiment, the third translation mechanism 121 is a ball screw linear module.

[0080] Further, in this embodiment, refer to Figures 1 - 14 , the wire soldering mechanism 7 is an automatic soldering iron type soldering machine; and the number of the wire soldering mechanisms 7 is two groups. One of the two groups of wire soldering mechanisms 7 solders the wire conductor to the circuit board, and the other wire soldering mechanism 7 solders the wire shield to the circuit board, so the efficiency can be improved. In this embodiment, since the wire soldering mechanism 7 is a prior art, its structure is not described in detail in this embodiment.

[0081] Another embodiment of the wire soldering mechanism 7, refer to Figure 16 , the wire soldering mechanism 7 is an automatic laser soldering machine provided on the frame 1; the wire conductor and shield are soldered to the corresponding positions on the circuit board by the automatic laser soldering mechanism. In this embodiment, since the automatic laser soldering mechanism is a prior art, its structure is not described in detail in this embodiment.

[0082] Further, refer to Figure 16, in order to better ensure the accuracy of wire welding during the soldering process of the automatic laser soldering machine, a connecting plate 70 is also provided at the bottom of the front and rear moving seats of the automatic laser soldering machine. A lifting slide 71 is provided at the lower end of the connecting plate 70, and a clamping positive pneumatic clamp 72 is provided at the bottom of the lifting slide 71. During welding, the wire is clamped straight by the clamping positive pneumatic clamp 72 to ensure the accuracy of welding, and the distance between the clamping positive pneumatic clamp 72 and the laser head of the automatic laser soldering machine is always the same, thus further ensuring the welding precision.

[0083] Further, referring to Figure 17 , a positioning block 30 is also fixedly provided inside the positioning die 3. The positioning mechanism 13 provided inside the circulating conveying mechanism 2 positions the positioning block 30 conveyed below the wire welding mechanism 7. The positioning mechanism 13 plays a role of secondary positioning for the positioning die 3, making the welding more accurate.

[0084] Further, referring to Figure 17 , the circulating conveying mechanism 2 is a runway-type conveying mechanism, which includes: a runway-shaped support table 20 provided on the frame 1; a track 21 provided on the support table 20, which includes two arc segments and two straight segments, and the two arc segments and the two straight segments form a runway-shaped structure; mounting plates 22 fixedly provided at both ends of the inner support of the runway-shaped support table 20 relatively; a driving pulley 23 rotatably connected to one of the mounting plates 22; a driven pulley 24 rotatably connected to the other mounting plate 22; a synchronous belt 25 connecting the driving pulley 23 and the driven pulley 24; a driving motor 26 driving the driving pulley 23 to rotate; the positioning die 3 is slidably connected to the track 21; the inner side of the positioning die 3 is fixedly connected to the synchronous belt 25, and the driving motor 26 drives the driving pulley 23 to rotate, so that the synchronous belt 25 drives the positioning die 3 to slide along the track 21. Specifically, two sets of symmetric limit rollers are provided at the bottom of the positioning die 3, and the limit rollers are located on both sides of the track 21.

[0085] Further, referring to Figure 17 and Figure 18, the positioning mechanism 13 is arranged inside the straight-line segment of the support table 20 close to the wire bonding mechanism 7. The positioning mechanism 13 includes at least two rotary mounting seats 130 fixedly arranged inside the support table 20, a rotating shaft 131 rotatably connected to the rotary mounting seats 130, at least two swing arms 132 arranged on the rotating shaft 131, a limiting member 133 arranged on the swing arms 132, and a driving member 134 for driving the rotating shaft 131 to rotate; the driving member 134 drives the rotating shaft 131 to rotate, so that the limiting member 133 limits the positioning block 30 inside the positioning die 3 below the wire bonding mechanism 7. Specifically, a clamping groove is provided on the side wall of the positioning 30, and the limiting member 133 is a cylindrical clamping post.

[0086] Further, the driving member 134 is a cylinder arranged on the inner side surface of the track 21, and the piston rod of the cylinder is pivotally connected to the eccentric block on the rotating shaft 131.

[0087] Further, referring to Figure 13 and Figure 19 , a steering mechanism 14 is further arranged on the machine frame 1, and the steering mechanism 14 is located between the circuit board loading mechanism 4 and the upper line mechanism 5; the steering mechanism 14 includes a support column 140 and a second support seat 141 arranged on the machine frame 1, a second CCD camera 149 arranged at the upper end of the support column 140, a second transverse movement mechanism 142 arranged on the second support seat 141, a seat body 143 arranged on the second transverse movement mechanism 142, a lifting mechanism 144 arranged at one end of the seat body 143 close to the circulating conveying mechanism 2, a connecting plate 145 arranged at the bottom end of the lifting mechanism 144, a rotating motor 146 arranged on the connecting plate 145, a carrier plate 147 arranged on the rotating shaft of the rotating motor 146, and a suction cup 148 arranged at the bottom of the carrier plate 147. Therefore, when the position of the circuit board is detected to be misaligned by the second CCD camera 149, the position can be adjusted by the steering mechanism 14.

[0088] Further, referring to Figure 20 , the unloading mechanism 8 includes a third support seat 80 arranged on the machine frame 1, a fourth translation mechanism 81 arranged at the upper end of the third support seat 80, and a material taking mechanism 82 arranged on the fourth translation mechanism 81; the fourth translation mechanism 81 drives the material taking mechanism 82 to translate above the positioning die 3 to take out the circuit board in the positioning die 3. Among them, the fourth translation mechanism 81 is a linear module, and the material taking mechanism 82 is a manipulator.

[0089] Further, referring to Figure 21, a back glue peeling mechanism 15 and a pushing mechanism 16 are further arranged on the rack 1. The back glue peeled by the back glue peeling mechanism 15 is adsorbed on the pushing mechanism 16, and the pushing mechanism 16 pushes the back glue to the bottom of the material taking mechanism 82, so that the material taking mechanism 82 sucks the back glue and pastes it on the circuit board. Among them, the pushing mechanism 16 includes a fifth translation mechanism arranged on the rack 1 and a vacuum adsorption seat arranged on the fifth translation mechanism.

[0090] The present invention is not limited to the above specific embodiments. Those of ordinary skill in the art starting from the above concepts and making various transformations without creative labor fall within the protection scope of the present invention.

Claims

1. Wire circuit board welding device, Characterized in that: Comprising: Frame; Circular conveying mechanism, arranged on the frame; Positioning molds, a plurality of positioning molds are slidably arranged on the circular conveying mechanism, the circular conveying mechanism drives the positioning molds to run in a cycle, and a wire clamping mechanism is arranged on the outer side of the positioning molds; Circuit board feeding mechanism, clamping the circuit board to be wire-welded and positioning it in the positioning mold, the circuit board feeding mechanism is arranged on the frame, the circuit board feeding mechanism includes a suction cup manipulator and a bottom plate arranged on the frame; a bracket arranged on the bottom plate, a guiding slideway is arranged at the top of the bracket; a material box arranged at the top of the bracket, the material box has a cavity with openings at the top and bottom, and the bottom of the cavity is located above the guiding slideway; a push block with one end slidably extending into the guiding slideway, the other end of the push block is connected to a pushing mechanism, the pushing mechanism is arranged on the bottom plate, and the pushing mechanism pushes the push block to slide in the guiding slideway to push out the circuit board at the bottom end of the cavity, and the suction cup manipulator sucks the circuit board and places it in the corresponding positioning mold; Wire feeding mechanism, fixedly arranged on the frame, and one end clamping the wire to be welded is arranged on the circuit board of the corresponding positioning mold; First wire-opening mechanism, fixedly arranged on the frame, when the wire feeding mechanism clamps the wire and arranges it on the circuit board of the positioning mold, the first wire-opening mechanism opens the wire clamping mechanism to enable the wire clamping mechanism to clamp the wire; At least one set of wire welding mechanisms, arranged on the frame, for welding the wire on the circuit board; Unloading mechanism, arranged on the frame, for unloading the welded circuit board; And, a second wire-opening mechanism, arranged on the frame, for opening the wire clamping mechanism of the unloaded circuit board; the wire clamping mechanism includes a first clamping plate, a second clamping plate, a tension spring, a first clamping block and a second clamping block; the first clamping plate and the second clamping plate are symmetrically pivotally connected to the outside of the positioning mold, and meshing teeth are arranged on the opposite sides of the first clamping plate and the second clamping plate; the first clamping block is fixedly arranged at the upper end of the first clamping plate, and the second clamping block is fixedly arranged at the upper end of the second clamping plate; both ends of the tension spring are respectively connected to the first clamping plate and the second clamping plate, and pull the first clamping block and the second clamping block to clamp each other; The first wire-opening mechanism includes a first telescopic cylinder arranged on the frame and a first inclined dial block arranged on the first telescopic cylinder; the first telescopic cylinder pushes the first inclined dial block to rise, so that the first inclined dial block pushes the first clamping plate or the second clamping plate to swing, so that the wire clamping mechanism opens the clamp; The second wire-opening mechanism includes a second telescopic cylinder arranged on the frame and a second inclined dial block arranged on the second telescopic cylinder; the second telescopic cylinder pushes the second inclined dial block to rise, so that the second inclined dial block pushes the first clamping plate or the second clamping plate to swing, so that the wire clamping mechanism opens the clamp; The circuit board feeding mechanism, the wire feeding mechanism, the wire welding mechanism and the unloading mechanism are arranged in sequence along the conveying direction of the circular conveying mechanism; One end of the bracket is also provided with a board-breaking mechanism; The board-breaking mechanism includes: a lifting cylinder disposed on the bottom plate; a rotating mounting seat disposed on the lifting movable end of the lifting cylinder, and the rotating mounting seat has two parallel side plates extending upward; a turning plate, with rotating connecting portions provided at both ends, and the rotating connecting portions are rotatably connected to the corresponding side plates, and a card slot is provided at the top of the turning plate near one end of the bracket; A turning mechanism is disposed on the rotating mounting seat to drive the turning plate to turn; a cylinder is disposed at the bottom of the turning plate; a limiting plate is connected to the movable end of the cylinder, and the pushing mechanism is a step-by-step pushing mechanism; the pushing mechanism pushes one end of the circuit board into the card slot, the cylinder pushes the limiting plate to move above the card slot to press one end of the circuit, the turning mechanism drives the turning plate to turn, so that the circuit board breaks along the breaking line, and the lifting cylinder drives the rotating mounting seat to move up and down, so that the broken circuit board is completely separated from the main body.

2. The wire circuit board welding device according to claim 1, wherein, The wire feeding mechanism includes a support seat disposed on the frame, a translation mechanism disposed at the upper end of the support seat, a lifting member disposed on the sliding seat of the translation mechanism, and a pneumatic clamp disposed at the lifting end of the lifting member.

3. The wire circuit board welding device according to claim 1, wherein, "V”-shaped notches are provided at the opposite ends of the first clamping block and the second clamping block; a first clearance groove is provided on one side of the notch of the first clamping block, and a second clearance groove is provided on the notch side of the second clamping block; the first clearance groove forms two first side plates on the first clamping block, and the second clearance groove forms two second side plates on the second clamping block; when the tension spring is tightened, one of the first side plates extends into the second clearance groove, and one of the second side plates extends into the first clearance groove.

4. The wire circuit board welding device according to claim 1, wherein, It further includes a wire turning mechanism, the wire turning mechanism is disposed on the frame and is located between the wire feeding mechanism and the wire welding mechanism arranged along the direction of the circulating conveying mechanism; the wire turning mechanism adjusts the orientation angle of the wire terminals conveyed to the position of the wire turning mechanism.

5. The wire circuit board welding device according to claim 4, wherein, The wire turning mechanism includes: a third clamp-opening mechanism disposed on the frame, when the wire angle needs to be adjusted, the third clamp-opening mechanism opens the wire clamping mechanism outside the corresponding positioning die; a second translation mechanism is disposed on the frame; a transverse movement mechanism is disposed on the moving seat of the second translation mechanism, and the transverse movement mechanism is perpendicular to the second translation mechanism; a mounting seat is disposed on the transverse movement mechanism; a clamping and rotating mechanism and a CCD industrial camera are disposed on the mounting seat; the CCD industrial camera detects the position of the wire terminal, the transverse movement mechanism pushes the clamping and rotating mechanism to the front end of the wire, the second translation mechanism drives the clamping and rotating mechanism to move, so that the end of the wire extends into the clamping end of the clamping and rotating mechanism to be clamped, and the clamping and rotating mechanism drives the wire to rotate.

6. The wire circuit board welding device according to claim 5, characterized in that, the clamping and rotating mechanism includes two support plates arranged front and back, a rotating member rotatably connected to one of the support plates, a pneumatic clamp provided at the end of the rotating member, and a motor provided on the other support plate, and the motor drives the rotating member to rotate.

7. The wire circuit board welding device according to any one of claims 4-6, characterized in that, an auxiliary clamping mechanism is further provided above the wire steering mechanism; the auxiliary clamping mechanism includes a support frame, a third translation mechanism provided on the support frame, a second pneumatic clamp provided on the moving seat of the third translation mechanism, and V-shaped clamping blocks provided on the two clamping jaws of the second pneumatic clamp. When the second pneumatic clamp clamps, the two V-shaped clamping blocks clamp the wire.

8. The wire circuit board welding device according to claim 1, characterized in that, the number of wire welding mechanisms is two groups.

9. The wire circuit board welding device according to claim 8, characterized in that, a positioning block is further fixedly provided inside the positioning mold, and the positioning mechanism provided inside the circulating conveying mechanism positions the positioning block conveyed below the wire welding mechanism.

10. The wire circuit board welding device according to claim 9, characterized in that, the circulating conveying mechanism is a runway-type conveying mechanism, which includes: a runway-shaped support table provided on the frame; a track provided on the support table, which includes two arc segments and two straight segments, and the two arc segments and the two straight segments form a runway-shaped structure; mounting plates, two mounting plates are fixedly provided at both ends of the inner support of the runway-shaped support table relatively; a driving pulley rotatably connected to one of the mounting plates; a driven pulley rotatably connected to the other mounting plate; a synchronous belt connecting the driving pulley and the driven pulley; a driving motor driving the driving pulley to rotate; the positioning mold is slidably connected to the track; the inner side of the positioning mold is fixedly connected to the synchronous belt, and the driving motor drives the driving pulley to rotate, so that the synchronous belt drives the positioning mold to slide along the track.

11. The wire circuit board welding device according to claim 10, characterized in that, the positioning mechanism is provided inside the straight segment of the support table close to the wire welding mechanism; the positioning mechanism includes at least two rotating mounting seats fixedly provided inside the support table, a rotating shaft rotatably connecting the rotating mounting seats, at least two swing arms provided on the rotating shaft, a limiting member provided on the swing arm, and a driving member driving the rotating shaft to rotate; the driving member drives the rotating shaft to rotate, so that the limiting member limits the positioning block inside the positioning mold located below the wire welding mechanism.

12. The wire circuit board welding device according to claim 1, characterized in that, A steering mechanism is further arranged on the frame, and the steering mechanism is located between the circuit board loading mechanism and the online mechanism; the steering mechanism includes a support column and a second support seat arranged on the frame, a second CCD camera arranged at the upper end of the support column, a second transverse movement mechanism arranged on the second support seat, a seat body arranged on the second transverse movement mechanism, a lifting mechanism arranged at one end of the seat body close to the circulating conveying mechanism, a connecting plate arranged at the bottom end of the lifting mechanism, a rotating motor arranged on the connecting plate, a carrier plate arranged on the rotating shaft of the rotating motor, and a suction cup arranged at the bottom of the carrier plate.

13. The wire circuit board welding device according to claim 1, characterized in that the unloading mechanism includes a third support seat arranged on the frame, a fourth translation mechanism arranged at the upper end of the third support seat, and a material taking mechanism arranged on the fourth translation mechanism; the fourth translation mechanism drives the material taking mechanism to translate above the positioning die and take out the circuit board in the positioning die.

14. The wire circuit board welding device according to claim 13, characterized in that a back glue peeling mechanism and a pushing mechanism are further arranged on the frame, the back glue peeled by the back glue peeling mechanism is adsorbed on the pushing mechanism, and the pushing mechanism pushes the back glue to the bottom of the material taking mechanism, so that the material taking mechanism sucks the back glue and pastes it on the circuit board.

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