Force sensor module and display device including the force sensor module

Abstract

A force sensor module and a display device including the force sensor module are provided. The display device includes a display panel and the force sensor module, wherein the force sensor module overlaps the display panel and includes a circuit board and a force sensor, wherein the force sensor is partially attached to the circuit board and includes an attachment portion and a non-attachment portion, wherein the attachment portion has a surface facing the circuit board and attached to the circuit board, and the non-attachment portion has a surface spaced apart from the circuit board.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2018-0060443, filed on May 28, 2018, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates to a force sensor module and a display device including the force sensor module. Background Art

[0004] Electronic devices that provide images to users, such as smartphones, tablet PCs, digital cameras, notebook computers, navigation systems, and smart TVs, include display devices for displaying images. The display device includes various input devices and a display panel that generates and displays images.

[0005] Recently, touch panels that recognize touch inputs have been widely used in display devices, mainly in smart phones and tablet PCs. Due to the convenience of the touch method, touch panels are replacing existing physical input devices such as keypads.

[0006] The force sensor senses the force applied to the sensor, and mainly uses a piezoelectric element as a force sensor. One of the methods of measuring force using a piezoelectric element is to measure the amount of force by reading the voltage of the piezoelectric element generated by the force. However, if a constant force is continuously applied to the piezoelectric element, the voltage of the piezoelectric element becomes close to zero because no further change in the applied force is sensed. Therefore, continuous force measurement may not be easy. Summary of the invention

[0007] Aspects of the present disclosure provide a display device including a force sensor module with improved force sensing sensitivity. Aspects of the present disclosure also provide a force sensor module with improved force sensing sensitivity. However, the aspects of the present disclosure are not limited to those set forth herein. The above and other aspects of the present disclosure will become more apparent to those of ordinary skill in the art to which the present disclosure belongs by reference to the detailed description of the present disclosure given below.

[0008] An embodiment of the display device includes a display panel and a force sensor module, wherein the force sensor module overlaps the display panel and includes a circuit board and a force sensor, wherein the force sensor is partially attached to the circuit board and includes an attachment portion and a non-attachment portion, wherein the attachment portion has a surface facing the circuit board and attached to the circuit board, and the non-attachment portion has a surface spaced apart from the circuit board.

[0009] The force sensor module may further include an attachment layer located between the force sensor and the circuit board at the attachment portion.

[0010] The attachment layer may be an electrical connection layer.

[0011] The force sensor may be electrically connected to the circuit board via the attachment layer.

[0012] The attachment layer may be positioned along an edge of the surface facing the circuit board.

[0013] The force sensor may also include a piezoelectric element configured to be driven by alternating current (AC) power.

[0014] The AC power may have a resonant frequency, an anti-resonant frequency, or a frequency between adjacent resonant and anti-resonant frequencies.

[0015] An embodiment of a display device includes a display panel and a force sensor module, wherein the force sensor module overlaps the display panel and includes a force sensor and a base overlapping the force sensor in a thickness direction.

[0016] The force sensor module may further include a circuit board, wherein the force sensor is at least partially attached to the circuit board, the circuit board being located between the force sensor and the base.

[0017] The display apparatus may further include a support member, wherein the support member surrounds a side surface of the force sensor and is spaced apart from the force sensor.

[0018] The force sensor may include an attachment portion in which a surface of the force sensor facing the circuit board is attached to the circuit board, and a non-attachment portion that is spaced apart from the circuit board.

[0019] The force sensor module may also include a first circuit board defining a hole into which the force sensor is inserted, a second circuit board at least partially attached to the second circuit board, and connecting wiring electrically connecting the first circuit board and the second circuit board.

[0020] The force sensor module may further include an adhesive layer located between the first circuit board and the second circuit board and surrounding the force sensor.

[0021] The force sensor module may further include a circuit board, wherein the force sensor is at least partially attached to the circuit board, wherein the force sensor is located between the circuit board and the base.

[0022] An embodiment of the force sensor module includes a circuit board and a force sensor, wherein the force sensor is partially attached to the circuit board and includes an attachment portion and a non-attachment portion, wherein a surface of the force sensor facing the circuit board is attached to the circuit board in the attachment portion, and the non-attachment portion is spaced apart from the circuit board.

[0023] The force sensor module may further include an attachment layer located between the force sensor and the circuit board at the attachment portion.

[0024] The attachment layer may be an electrical connection layer for electrically connecting the force sensor to a circuit board.

[0025] The attachment layer may be positioned along an edge of the surface of the force sensor that faces the circuit board.

[0026] The force sensor module may further include a base overlapping the force sensor, wherein the circuit board is located between the force sensor and the base.

[0027] The force sensor module may further include a support, wherein the support surrounds a side surface of the force sensor and is spaced apart from the force sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] These and / or other aspects will become apparent and more readily understood through the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0029] Figure 1 is an exploded perspective view of a display device according to an embodiment;

[0030] Figure 2 is a cross-sectional view of a display device according to an embodiment;

[0031] Figure 3 is an operational circuit diagram of a force sensor module according to an embodiment;

[0032] Figure 4A is a side view of a force sensor according to an embodiment, and Figure 4B yes Figure 4A A plan view of a force sensor;

[0033] Figure 5 is a graph showing impedance change of a piezoelectric element according to an embodiment;

[0034] Figure 6 is an experimental design diagram for explaining impedance changes of a force sensor, such as a plan view showing a state where various examples of the force sensor are attached in whole or in part to a circuit board;

[0035] Figure 7 and Figure 8 is a plan view showing a pattern shape of an attachment portion according to various embodiments;

[0036] Fig. 9 shows the vibration displacement of a piezoelectric element at a resonant frequency and an anti-resonant frequency according to an embodiment;

[0037] Fig.10 Shown in Fig. 9 The location of the attachment portion in each mode;

[0038] Fig.11is a plan view showing a pattern shape of an attachment portion according to an embodiment;

[0039] Fig.12 is a cross-sectional view of a display device according to an embodiment;

[0040] Fig.13 is a plan view of a force sensor and a support according to an embodiment;

[0041] Fig.14 is a plan view of a force sensor and a support according to an embodiment;

[0042] Fig.15 is a cross-sectional view of a display device according to an embodiment;

[0043] Fig.16 is a cross-sectional view of a display device according to an embodiment; and

[0044] Fig.17 is a graph showing a change in voltage with respect to a force applied to a force sensor according to an embodiment. DETAILED DESCRIPTION

[0045] By referring to the following detailed description and drawings of the embodiments, it is possible to more easily understand the features of the inventive concept and the methods for realizing the features of the inventive concept. Hereinafter, the embodiments will be described in more detail with reference to the drawings. However, the described embodiments can be implemented in various forms and should not be interpreted as being limited to the embodiments shown herein. More specifically, these embodiments are provided as examples so that the disclosure will be thorough and complete, and will fully convey the aspects and features of the inventive concept to those skilled in the art. Therefore, the processes, elements and methods that are unnecessary for a person of ordinary skill in the art to thoroughly understand the aspects and features of the inventive concept may not be described. Unless otherwise mentioned, the same reference numerals represent the same elements in all drawings and the described descriptions, and therefore their descriptions will not be repeated. In addition, in order to make the description clear, parts not related to the description of the embodiments may not be shown. In the drawings, for clarity, the relative sizes of elements, layers and regions may be enlarged.

[0046] Embodiments are described herein with reference to cross-sectional views as schematic diagrams of embodiments and / or intermediate structures. Thus, deformations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are contemplated. In addition, for the purpose of describing embodiments according to the concepts of the present disclosure, the specific structural or functional descriptions disclosed herein are illustrative only. Therefore, the embodiments disclosed herein should not be interpreted as being limited to the specific illustrated shapes of the regions, but rather include shape deviations caused by, for example, manufacturing. For example, an implanted region shown as a rectangle will typically have rounded or curved features, and / or have a gradient of implant concentration at its edges rather than a binary change from an implanted region to a non-implanted region. Similarly, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation is performed. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device and are not intended to be limiting. In addition, as will be appreciated by those skilled in the art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present invention.

[0047] In the following description, for the purpose of explanation, many specific details are set forth for a thorough understanding of the various embodiments. However, it is apparent that the various embodiments may be implemented without these specific details or with one or more equivalent arrangements. In other cases, in order to avoid unnecessary confusion of the various embodiments, well-known structures and devices are shown in block diagram form.

[0048] It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or cross-sections, these elements, components, regions, layers and / or cross-sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or cross-section from another element, component, region, layer or cross-section. Therefore, without departing from the spirit and scope of the present invention, the first element, component, region, layer or cross-section described below may be referred to as a second element, component, region, layer or cross-section.

[0049] For ease of explanation, spatially relative terms such as "below", "below", "lower", "down", "below", "above", "upper", etc. may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the accompanying drawings. It should be understood that in addition to the orientation drawn in the accompanying drawings, the spatially relative terms are also intended to cover different orientations of the device in use or operation. For example, if the device in the accompanying drawings is turned over, the elements described as being "below" or "below" or "below" other elements or features will be oriented to be "above" the other elements or features. Therefore, the exemplary terms "below" and "below" can cover both the above and below orientations. The device may be oriented otherwise (e.g., rotated 90 degrees or in other orientations) and the spatially relative descriptors used herein should be interpreted accordingly. Similarly, when a first component is described as being arranged "on" a second component, this means that the first component is arranged at the upper side or lower side of the second component, and is not limited to its upper side based on the direction of gravity.

[0050] It should be understood that when an element, layer, region or assembly is referred to as being on another element, layer, region or assembly, being connected to or being coupled to another element, layer, region or assembly, it can be directly on this other element, layer, region or assembly, being connected to or being coupled to this other element, layer, region or assembly, or one or more intermediate elements, layers, regions or assemblies can be present. However, "directly connected / directly coupled" represents that a component is directly connected or coupled to another component without intermediate components. On the other hand, other statements describing the relationship between components, such as "between", "immediately between" or "adjacent" and "closely adjacent" can be similarly interpreted. In addition, it should also be understood that when an element or layer is referred to as being between two elements or layers, it can be the only element or layer between these two elements or layers, or one or more intermediate elements or layers can also be present.

[0051] The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. Unless the context clearly indicates otherwise, as used herein, the singular forms "one" and "an" are intended to also include the plural forms. It should also be understood that the terms "comprises", "comprising", "have", "having", "includes" and "including" when used in this specification indicate the presence of the features, wholes, steps, operations, elements and / or components described, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0052] As used herein, the terms "substantially", "about", "approximately" and similar terms are used as approximate terms rather than as terms of degree, and are intended to account for the inherent deviations in the values ​​measured or calculated that will be appreciated by those of ordinary skill in the art. As used herein, "about" or "approximately" includes the stated value and the average value within the acceptable deviation range of the specific value, as determined by those of ordinary skill in the art taking into account the measurement being made and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations, or within ±30%, 20%, 10%, 5% of the stated value. In addition, when describing embodiments of the present disclosure, the use of "may" means "one or more embodiments of the present disclosure". As used herein, the terms "use", "using" and "used" may be considered synonymously with the terms "utilize", "utilizing" and "utilized", respectively. In addition, the term "exemplary" is intended to mean an example or illustration.

[0053] When a certain embodiment can be implemented differently, a specific process order can be performed differently from the described order. For example, two processes described in succession can be performed substantially simultaneously or in the reverse order of the described order.

[0054] In addition, any numerical range disclosed and / or recorded herein is intended to include all sub-ranges with the same numerical precision contained in the recorded range. For example, the range of "1.0 to 10.0" is intended to include all sub-ranges between the recorded minimum value 1.0 and the recorded maximum value 10.0 (and including this number), that is, having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, for example, 2.4 to 7.6. Any maximum numerical limit recorded herein is intended to include all smaller numerical limits contained therein, and any minimum numerical limit recorded in this specification is intended to include all larger numerical limits contained therein. Therefore, the applicant reserves the right to modify this specification (including claims) to explicitly record any sub-ranges contained in the range explicitly recorded herein.

[0055] The electronic or electrical devices and / or any other related devices or components according to the embodiments of the present disclosure described herein may be implemented using any suitable hardware, firmware (e.g., application specific integrated circuits), software, or a combination of software, firmware, and hardware. For example, the various components of these devices may be formed on an integrated circuit (IC) chip or on separate IC chips. In addition, the various components of these devices may be implemented on a flexible printed circuit film, a tape carrier package (TCP), a printed circuit board (PCB), or formed on a substrate. In addition, the various components of these devices may be processes or threads running on one or more processors in one or more computing devices that execute computer program instructions and interact with other system components for performing the various functions described herein. Computer program instructions are stored in a memory that can be implemented in a computing device using a standard storage device (such as a random access memory (RAM)). Computer program instructions may also be stored in other non-temporary computer-readable media such as CD-ROMs, flash drives, etc. In addition, those skilled in the art should be aware that, without departing from the spirit and scope of the embodiments of the present disclosure, the functions of each computing device may be combined or integrated into a single computing device, or the functions of a particular computing device may be distributed to one or more other computing devices.

[0056] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the inventive concept belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and / or this specification, and should not be interpreted in an idealized or overly formal sense, unless explicitly defined as such herein.

[0057] Figure 1 is an exploded perspective view of the display device 1 according to the embodiment. Figure 2 is a cross-sectional view of a display device 1 according to an embodiment.

[0058] refer to Figure 1 and Figure 2 , the display device 1 includes a display panel 30, a window 10 located above the display panel 30, and a force sensor module 1000 located below the display panel 30. The display device 1 may further include a touch member 20 located between the display panel 30 and the window 10, a cover panel 40 below the display panel 30, and a bracket 50 for accommodating the above members. In an embodiment, the force sensor module 1000 may be located below the cover panel 40. However, the force sensor module 1000 may also be located on or at a side of the cover panel 40.

[0059] Unless otherwise defined, the terms "above" and "upper surface" in the thickness direction as used herein refer to the display surface side of the display panel 30; and the terms "below" and "lower surface" in the thickness direction as used herein refer to the side opposite to the display surface side of the display panel 30. In addition, in the plane direction, the terms "above (upper)", "below (lower)", "left" and "right" refer to the direction when the display surface placed in place is viewed from above.

[0060] The display panel 30 is a panel for displaying a picture, and may be, for example, an organic light-emitting display panel. In the following embodiments, a case where an organic light-emitting display panel is applied as the display panel 30 will be described as an example. However, other types of display panels, such as a liquid crystal display panel and an electrophoretic display panel, may also be applied. The display flexible circuit board may be coupled to the display panel 30.

[0061] The display panel 30 includes a plurality of organic light emitting elements on a substrate. The substrate may be a rigid substrate made of glass, quartz, etc., or may be a flexible substrate made of polyimide or other polymer resins. When a polyimide substrate is applied as the substrate, the display panel 30 may be bent or curved, folded or curled. Although the display panel 30 is bent in the drawings, the present disclosure is not limited to this case.

[0062] The touch member 20 is located on the display panel 30. The touch member 20 may be a rigid panel type, a flexible panel type, or a film type. The touch member 20 may have a size substantially the same as that of the display panel 30, and may overlap the display panel 30. The side surface of the touch member 20 may (but not necessarily) be aligned with the side surface of the display panel 30 on all sides, excluding the curved short side of the display panel 30. The display panel 30 and the touch member 20 may be bonded together by a transparent adhesive layer such as an optically clear adhesive (OCA) or an optically clear resin (OCR). A touch flexible circuit board may be connected to the touch member 20.

[0063] The touch member 20 may be omitted or may be provided inside the display panel 30. In this case, the display panel 30 may include a touch electrode part.

[0064] The window 10 is located above the display panel 30. As a cover plate, the window 10 overlaps the display panel 30 and / or the touch member 20 in a thickness direction to transmit light emitted from the display panel 30 while protecting the members located below the window 10. The window 10 may be made of glass or transparent plastic.

[0065] The cover panel 40 is located below the display panel 30. The cover panel 40 may overlap the display panel 30 in a thickness direction. The cover panel 40 may be attached to a lower surface of the display panel 30.

[0066] The cover panel 40 can perform a heat dissipation function, an electromagnetic wave shielding function, an anti-pattern detection function, a grounding function, a buffer function, a strength enhancement function and / or a digital function. The cover panel 40 may include a functional layer having at least one of the above functions. The functional layer may be arranged in various forms, such as a layer, a film layer, a film, a sheet, a plate and a panel. The cover panel 40 may include a functional layer or multiple functional layers. For example, the cover panel 40 may include a buffer sheet, a graphite sheet and a copper sheet stacked successively from top to bottom.

[0067] The force sensor module 1000 is located below the cover panel 40. The force sensor module 1000 includes a circuit board 200 and at least one force sensor 100 located on the circuit board 200. One force sensor 100 or a plurality of force sensors 100 may be located on an edge (or edges) of the circuit board 200, but the present disclosure is not limited to this case. The force sensor module 1000 will be described in detail later.

[0068] The bracket 50 is located below the force sensor module 1000. The bracket 50 may be a storage container or a protective container for accommodating other components. For example, the bracket 50 may accommodate the window 10, the touch member 20, the display panel 30, the cover panel 40, and the force sensor module 1000.

[0069] The bracket 50 may include a bottom portion 51 and a side wall 52 extending from a side of the bottom portion 51. The bottom portion 51 of the bracket 50 faces the circuit board 200 of the force sensor module 1000. The circuit board 200 may be attached to the bottom portion 51 of the bracket 50 by an adhesive layer such as an adhesive layer (e.g., a force-sensitive adhesive layer, etc.).

[0070] The sidewall 52 of the bracket 50 faces the respective side surfaces of the touch member 20, the display panel 30, the cover panel 40, and the force sensor module 1000. The upper end of the sidewall 52 of the bracket 50 may face the window 10. The window 10 may be attached to the bracket 50 using a waterproof tape.

[0071] Figure 3 is a circuit diagram of a force sensor module 1000 according to an embodiment.

[0072] The force sensor 100 of the force sensor module 1000 may be a resonant force sensor, a piezoelectric force sensor, a strain gauge force sensor, or a capacitive force sensor. In this embodiment, a piezoelectric force sensor will be described as an example.

[0073] The force sensor 100 of the force sensor module 1000 may be a piezoelectric element. The force sensor 100 is partially attached to the circuit board 200 and thus electrically connected to the circuit board 200 in the attached portion. The force sensor 100 operates by receiving power 104 from the circuit board 200.

[0074] The force sensor 100 may include a first electrode 101, a second electrode 103, and a piezoelectric layer 102 between the first and second electrodes 101 and 103. The first and second electrodes 101 and 103 are spaced apart from and face each other in a thickness direction, and the piezoelectric layer 102 is located between the first and second electrodes 101 and 103.

[0075] The first electrode 101 of the force sensor 100 receives power 104 from the circuit board 200 , and the second electrode 103 is connected to the resistor Rs and the amplifier 105 .

[0076] The power 104 is an alternating current (AC) power such as a sine wave or a square wave. Therefore, because the voltage applied to the force sensor 100 continuously changes, mechanical vibration occurs in the force sensor 100 as a force acts on the force sensor 100. When a force is applied to the vibrating force sensor 100, the force affects the vibration to thereby change the impedance of the force sensor 100. Therefore, even when a constant force is continuously applied to the force sensor 100, the force can be measured by sensing the impedance change of the force sensor 100.

[0077] The method of measuring the impedance of the force sensor 100 according to the embodiment includes measuring the current flowing through the force sensor 100. For example, the impedance change of the force sensor 100 may be sensed by identifying a voltage applied to the resistor Rs connected to the second electrode 103.

[0078] For example, if the voltage applied to the resistor Rs is large, it can be interpreted that the impedance of the force sensor 100 is small. If the voltage applied to the resistor Rs is small, it can be interpreted that the impedance of the force sensor 100 is large. Therefore, such a difference (impedance change of the force sensor 100) can be used to measure whether a force has been applied and the magnitude of the force. As will be described below with reference to Figure 5 As described, the impedance change of the force sensor 100 may be measured within a range between the resonant frequency and the anti-resonant frequency of the force sensor 100 .

[0079] The piezoelectric layer 102 is formed to a certain thickness (e.g., a predetermined thickness) between the first electrode 101 and the second electrode 103. For example, the piezoelectric layer 102 may be formed to a thickness of about 10 μm to about 1000 μm. The piezoelectric layer 102 may also be formed to various thicknesses depending on the size of an electronic device to which the force sensor 100 is applied.

[0080] The piezoelectric layer 102 may be formed using a polymer and a generally quadrilateral plate-shaped piezoelectric body having a certain thickness (e.g., a predetermined thickness). The piezoelectric body may be formed using a piezoelectric material based on Pb-Zr-Ti (PZT)-, Na-K-Nb (NKN)-, or Bi-Na-Ti (BNT)-. For example, the piezoelectric body may include barium titanate, lead titanate, lead zirconate titanate, potassium niobate, lithium niobate, lithium tantalate, sodium tungstate, zinc oxide, potassium sodium niobate, bismuth ferrite, sodium niobate, bismuth titanate, and the like. For example, the piezoelectric body may be made of a fluoride polymer or a copolymer of a fluoride polymer.

[0081] The piezoelectric layer 102 may also be formed by stacking a plurality of piezoelectric layers in each of which a piezoelectric plate is arranged (eg, arranged at predetermined intervals) on a thin polymer layer.

[0082] The polymer may include, but is not limited to, one or more of epoxy resins, polyimides, and liquid crystal polymers (LCPs). The polymer may be made of a thermosetting resin. Examples of thermosetting resins include novolac epoxy resins, novolac epoxy resins, BPA epoxy resins, BPF epoxy resins, hydrogenated BPA epoxy resins, dimer acid-modified epoxy resins, urethane-modified epoxy resins, rubber-modified epoxy resins, and DCPD-type epoxy resins.

[0083] In an embodiment, the polymer may be made of a compressible and recoverable material. For example, the polymer may be made of a compressible and recoverable material among the above materials. Instead of the polymer mentioned in the above materials, the piezoelectric body may also be mixed with a compressible and recoverable material. For example, silicon, rubber, gel, phorone, urethane, etc. may be used.

[0084] Figure 4A is a side view of a force sensor 100 according to an embodiment, and Figure 4B yes Figure 4A FIG. 1 is a plan view of a force sensor 100 .

[0085] refer to Figure 4A and Figure 4B , the force sensor module 1000 may further include an attachment layer 300 for attaching the force sensor 100 to the circuit board 200. The attachment layer 300 is formed on a portion of the lower surface of the force sensor 100 and exposes the other portion of the lower surface of the force sensor 100. In the lower surface of the force sensor 100, the area of ​​the portion attached to the circuit board 200 by the attachment layer 300 may be smaller than the area of ​​the portion not attached to the circuit board 200.

[0086] For example, the area of ​​the attachment layer 300 may be smaller than the area of ​​the lower surface of the force sensor 100. Therefore, only a portion of the total area of ​​the surface of the force sensor 100 facing the circuit board 200 may be attached to the circuit board 200. The lower surface of the force sensor 100 that is not attached to the circuit board 200 may be spaced apart from the circuit board 200 to face the circuit board 200.

[0087] The force sensor 100 may be attached to the circuit board 200 by thermal bonding, friction bonding, ultrasonic bonding, electrical bonding, or welding, or may be attached by an anisotropic conductive film (ACF) or a pressure sensitive adhesive (PSA) interposed between the force sensor 100 and the circuit board 200. The case where the force sensor 100 is attached to the circuit board 200 by thermal bonding will be described as an example below, but the present disclosure is not limited to this case. In the following embodiments, the attachment layer 300 represents a thermal bonding portion.

[0088] The attachment layer 300 may be made of a material capable of electrically connecting the circuit board 200 and the force sensor 100. Therefore, the force sensor 100 may receive power from the circuit board 200.

[0089] The force sensor 100 may be divided into an attachment portion 301 where the force sensor 100 is attached to the circuit board 200 through the attachment layer 300 and a non-attachment portion 302 where the force sensor 100 faces the circuit board 200 without the attachment layer 300 therebetween. In an embodiment, the attachment portion 301 may be located at the center of the force sensor 100, and the non-attachment portion 302 may surround the attachment portion 301.

[0090] Because only a portion of the force sensor 100 is attached to the circuit board 200 as described above, when a force is applied to the force sensor module 1000, the impedance change of the force sensor 100 may be greater. Figure 5 Describe this.

[0091] Figure 5 is a graph showing impedance changes of a force sensor according to an embodiment.

[0092] Figure 5 The X-axis of the graph shown in represents power (e.g., Figure 3 The Y-axis represents the frequency [Hz] of the electric force 104), and the Y-axis represents the impedance [Ω] of the force sensor. Figure 5 Impedance with respect to frequency in a force applied state / no force applied state is shown when the entirety (eg, the entire surface) of the force sensor is attached to the circuit board and when only a portion of the force sensor is attached to the circuit board.

[0093] exist Figure 5The resonant frequency is a frequency at which the impedance of the force sensor 100 measured when the frequency of the electric power is changed reaches a valley point in a section where the impedance decreases rapidly, and the anti-resonant frequency is a frequency at which the impedance reaches a peak point in a section where the impedance increases rapidly.

[0094] refer to Figure 5 , the impedance of the force sensor is minimum at the resonant frequency and maximum at the anti-resonant frequency. In addition, the impedance of the force sensor changes greatly between the resonant frequency and the anti-resonant frequency. Therefore, by using power having a frequency in the range from the resonant frequency to the anti-resonant frequency, the sensitivity of force measurement can be improved.

[0095] Specifically, since the impedance change is the largest at the resonant frequency and at the anti-resonant frequency, a frequency close to the resonant frequency or the anti-resonant frequency can be used as the power frequency, thereby maximizing the force sensing. In other words, the resonant frequency ±α or the anti-resonant frequency ±β can be used as the most suitable power frequency.

[0096] It should be noted that the resonant frequency and the anti-resonant frequency may not be set as only one pair as shown in the drawings, but may also be set as a plurality of pairs.

[0097] Reference is obtained when power using the resonant frequency as the power frequency is supplied to the force sensor. Figure 5 , the difference between the impedance 154 when force is applied and the impedance 151 when no force is applied in the case where the force sensor is partially attached to the circuit board is relatively greater than the difference between the impedance 153 when force is applied and the impedance 152 when no force is applied in the case where the force sensor is entirely attached to the circuit board. In other words, the impedance change is greater when the force sensor is partially attached than when the force sensor is entirely attached. Here, the impedance change represents the difference in impedance between when force is applied and when force is not applied in the same state (for example, in the entirely attached state or in the partially attached state) when a voltage having a specific frequency between the resonant frequency and the anti-resonant frequency is applied to the force sensor.

[0098] The reason for the occurrence of the above phenomenon is understood to be that the degree to which the vibration of the force sensor is hindered changes according to the area of ​​the attached part of the force sensor. In other words, the force sensor vibrates according to the frequency of the power applied to the force sensor. Here, if the force sensor is strongly connected to the circuit board, the vibration of the force sensor is hindered or suppressed. Therefore, the vibration change rate caused by the applied force is reduced. On the other hand, if a part of the force sensor is not connected to the circuit board, the force sensor can fully vibrate when no force is applied due to the low vibration obstruction rate, and the vibration change rate caused by the applied force can be relatively larger. Therefore, compared with when the force sensor is attached as a whole, when the force sensor is partially attached, the impedance difference between when no force is applied and when force is applied is greater. Therefore, when the force sensor is partially attached, the sensitivity of the force sensor can be improved.

[0099] According to an embodiment, the area of ​​a portion of the force sensor attached to the circuit board may be reduced to increase the impedance change of the force sensor, thereby improving the sensitivity of the force sensor.

[0100] Figure 6 is an experimental design diagram for explaining impedance changes of a force sensor, for example, a plan view showing a state where various examples of the force sensor are wholly or partially attached to a circuit board.

[0101] refer to Figure 6 In order to compare a first case “Case I” in which the force sensor 100 is entirely attached to the circuit board with a second case “Case II” in which the force sensor 100 is partially attached to the circuit board, a plurality of force sensors 100 are attached to the same positions A and B on the circuit board. Thereafter, voltage according to frequency is measured before and after force is applied to the force sensor 100 at each position A or B to compare the case I of the entire attachment and the case II of the partial attachment,

[0102] The voltage measured is applied to the Figure 3 The voltage across the resistor Rs connected to the force sensor is measured. The greater the impedance of the force sensor, the smaller the voltage across the resistor Rs becomes, and the smaller the impedance of the force sensor, the larger the voltage across the resistor Rs becomes. In addition, the greater the difference between the initial voltage before the force is applied and the voltage when the force is applied (the greater the voltage change), the greater the impedance change of the force sensor (that is, the force sensor has a higher sensitivity).

[0103] For the force sensor located at position A, at the resonance point, the change between the initial voltage before force is applied and the voltage when force is applied is about 80 mV in the case of integral attachment I and about 90 mV in the case of partial attachment II. Therefore, it can be seen that the voltage change is larger in the case of partial attachment II than in the case of integral attachment I. In other words, it can be seen that the sensitivity of the force sensor at the resonance point in the case of partial attachment II is about 12% higher than the sensitivity of the force sensor at the resonance point in the case of integral attachment I.

[0104] The sensitivity of the force sensor at the anti-resonance point is also higher in the partially attached case II than in the overall thermally attached case I. For example, at both the resonant point and the anti-resonance point, the sensitivity of the force sensor at position A is about 6% higher, and the sensitivity of the force sensor at position B is about 8% higher.

[0105] Therefore, according to the implementation mode, Figure 4A and Figure 4B As shown in FIG. 1 , the attachment layer 300 for attaching the force sensor 100 to the circuit board 200 may be formed only on a portion of the force sensor 100 instead of on the entire surface thereof, thereby improving sensitivity to force.

[0106] Figure 7 and Figure 8 301 is a plan view showing a pattern shape of an attaching portion 301 according to various embodiments. Figure 7 and Figure 8 The pattern shape of the attachment portion 301 is not limited to Figure 4A and Figure 4B The shapes shown in the figure are not limited to the shapes shown in the figure, but various modifications may be made.

[0107] exist Figure 7 In a, the attachment portion 301 is formed along the edge of the force sensor. The attachment portion 301 can be positioned to the edge of the force sensor. The width of the attachment portion 301 can be (but is not limited to) constant.

[0108] The attachment portion 301 may also be formed as Figure 7 The shape of the inner edge shown in b, or it can be Figure 7 The bonding surface of the force sensor shown in c is formed at both ends.

[0109] like Figure 7 As shown in d and e, the attachment portion 301 may be formed in a quadrilateral island shape to attach the force sensor to a circuit board.

[0110] The attachment portion 301 may also be Figure 7As shown in FIGS. f to j of FIG. 3 , the attachment portion 301 may be formed in a circular shape or an elliptical shape instead of an angular shape. For example, the attachment portion 301 may be formed only in the edge portion of the force sensor and retain a circular shape in the center (see FIG. 3 ). Figure 7 f), can be formed only in the circular portion at the center ( Figure 7 h), or may be positioned along a circular edge (eg, as an annular circle or elliptical shape) inside the bonding surface of the force sensor (see Figure 7 g).

[0111] In addition, Figure 7 The attachment portion 301 shown in k and l forms or defines a plurality of quadrilaterals or a plurality of circles.

[0112] Figure 8 It is shown that the attachment portions 301 may be positioned in a stripe shape.

[0113] In other words, if Figure 8 As shown in a to h of FIG. 1 , the attachment portion 301 can be formed in the shape of a single stripe across the bonding surface of the force sensor to attach the force sensor to the circuit board. The length of the stripe can be (but is not limited to) equal to the length or width of the bonding surface, or even equal to the diagonal length of the bonding surface. The stripe can also have various widths.

[0114] The stripe-shaped attachment portion 301 may be formed parallel to the horizontal or vertical surface of the force sensor, but may also be formed as Figure 8 are formed diagonally as shown in g and h.

[0115] Alternatively, the attachment portion 301 may be Figure 8 As shown in i to l in FIG. 1 , it may be formed into a plurality of stripes, or it may be formed into a plurality of stripes as shown in FIG. Figure 8 As shown in m to p, a plurality of stripes are formed to cross each other.

[0116] like Figure 8 As shown in qt of FIG. 1 , the attachment portion 301 may also be formed only in an area excluding the stripe shape (eg, the attachment portion 301 may define one or more stripe shapes). In this case, the portion of the force sensor that is not attached to the circuit board may be a stripe shape.

[0117] As described above, the attachment portion 301 may be formed in various patterns and is not limited to Figure 7 and Figure 8 The shapes shown in .

[0118] In the above-described embodiment, the entirety of the piezoelectric element has a rectangular shape. However, the piezoelectric element may also have various shapes such as an elliptical shape, a circular shape, and a polygonal shape.

[0119] Fig. 9The vibration displacement of the piezoelectric element at the resonant frequency and the anti-resonant frequency according to the embodiment is shown. Fig.10 Shown in Fig. 9 The position of the attachment portion 301 in each mode.

[0120] As described above, when an AC voltage is applied to the force sensor, the surface of the force sensor vibrates. Here, the surface of the force sensor may vibrate in different forms depending on the frequency. As described above, there may be a plurality of resonant frequencies and a plurality of anti-resonant frequencies, and Fig. 9 and Fig.10 Each frequency f1, f2, or f3 shown in may be any one of a resonant frequency and an anti-resonant frequency.

[0121] As per Fig. 9 As is apparent from the simulation results shown in , when voltages having different resonant or anti-resonant frequencies are applied to the force sensor, the form of surface vibration of the force sensor may vary depending on the frequency.

[0122] exist Fig. 9 In FIG. 1 , the dark area is the area where the force sensor vibration is relatively strong, and the bright area is the area where the force sensor vibration is not so strong. In other words, the bright area is the area where the vibration displacement of the force sensor is the smallest.

[0123] Fig.10 The position of the attachment portion 301 shown in FIG. Fig. 9 In other words, the force sensor is attached to the circuit board only in the portion of the force sensor where the vibration displacement according to the frequency is limited or minimized.

[0124] For example, when applying Fig. 9 When a voltage with a frequency f1 is applied, the region where the vibration displacement of the force sensor is large is in the shape of a semicircle located at both ends of the force sensor, and the region where the vibration displacement of the force sensor is limited or minimized is a portion excluding the semicircle and is in the shape of an hourglass / waterglass. Fig.10 At the frequency f1 of , the attachment portion 301 may be formed in a columnar shape having upper and lower portions wider than a middle portion.

[0125] like Fig.10 As shown in , the circuit board is attached only to the area of ​​the force sensor where the vibration displacement of the force sensor is small, which can improve or maximize the sensitivity of the force sensor by reducing or minimizing the influence on the vibration action of the force sensor. If the circuit board is attached to the area where the vibration displacement of the force sensor is relatively large, the vibration action of the force sensor may be hindered. Therefore, the impedance change between the state where the force is applied and the initial state may be small.

[0126] In this regard, according to an embodiment, the attachment portion 301 may be formed in a region in which the vibration displacement of the force sensor is relatively small to increase or maximize the impedance change of the force sensor, thereby improving the sensitivity of the force sensor.

[0127] Fig.11 is a plan view showing a pattern shape of an attaching portion according to an embodiment.

[0128] Fig.11 The attachment portion 301 shown in FIG. 1 has a pattern that maximizes the sensitivity of the force sensor at various frequencies. In other words, it is possible to Fig. 9 and Fig.10 The shape and configuration of the force sensor are shown in Figure 1 to improve or maximize the sensitivity of the force sensor at all of the various resonant and anti-resonant frequencies shown in Figure 2. Fig.10 The common intersection area of ​​the shape of the attachment portion 301 at the frequencies f1 to f3 corresponds to. Fig.11 If the shape of the attachment portion 301 shown in FIG. 1 is attached to a circuit board, it is applicable even when power is supplied at various frequencies.

[0129] Fig.12 is a cross-sectional view of a display device 2 according to an embodiment.

[0130] In addition to the configuration of the force sensor module 2000, according to Fig.12 The display device 2 of the embodiment according to Figure 2 Therefore, a redundant description of the display device 2 will be omitted, and the current embodiment will now be described with a focus mainly on the differences from the previous embodiment.

[0131] refer to Fig.12 The force sensor module 2000 according to the present embodiment is different from the force sensor module 2000 according to the present embodiment. Figure 2 The force sensor module 1000 of the embodiment is different in that, in addition to the force sensor 100 and the circuit board 200 attached to the force sensor 100, it also includes a support member 400 positioned along the periphery of the force sensor 100 and spaced apart from the force sensor 100, and also includes a base 500 overlapping with the force sensor 100 in the thickness direction and located below the circuit board 200.

[0132] The force sensor module 2000 may be attached and fixed to the lower surface of the cover panel 40 through the adhesive layer 41. The adhesive layer 41 may be made of an insulating material (e.g., an electrically insulating material). Therefore, the force sensor module 2000 is not electrically connected to the display panel 30 and the cover panel 40 located on the adhesive layer 41.

[0133] The support 400 of the force sensor module 2000 is positioned to surround the side surface of the force sensor 100. The support 400 may surround the side surface of the force sensor 100. The support 400 includes or defines an open portion, and the force sensor 100 may be located in the open portion. The inner wall of the open portion of the support 400 may be spaced apart from the force sensor 100. The height of the support 400 may be substantially the same as the sum of the height of the force sensor 100 and the thickness of the attachment layer 300.

[0134] The lower surface of the attachment layer 300 of the force sensor module 2000 and the lower surface of the support member 400 of the force sensor module 2000 may be located on the plane of the circuit board 200. The support member 400 may increase the surface area of ​​the force sensor 100 located on the circuit board 200, thereby performing the function of flattening the force sensor module 2000. If the force sensor 100 is located between the cover panel 40 and the circuit board 200 without the support member 400, the force sensor 100 will likely be easily detached from the cover panel 40 and the circuit board 200 due to the small bonding area. However, because the support member 400 positioned around the force sensor 100 in the current embodiment is also attached to the cover panel 40 and the circuit board 200, the detachment of the force sensor 100 can be avoided. The upper surface of the support member 400 may be in contact with the adhesive layer 41.

[0135] The support member 400 may be made of a soft material. The support member 400 may be made of a material having a lower hardness than the force sensor 100. Therefore, when the force sensor 100 receives a force from the window 10 and / or the circuit board 200, the received force may be concentrated on the force sensor 100 without being dispersed to the support member 400.

[0136] The base 500 may be located below the circuit board 200. The base 500 may overlap the force sensor 100 in the thickness direction. The base 500 may have, but is not limited to, a column shape. The base 500 may be located between the circuit board 200 and the bracket 50. The base 500 may be made of a ductile material having elasticity.

[0137] When the force sensor 100 is pressed by the force, the base 500 can be used to increase the force F2 received from the bracket 50 (for example, because the base 500 has a smaller area than the support 400 in a plan view). In other words, the force transmitted to the force sensor 100 can be doubled or increased by the force F1 transmitted from the window 10 and the force F2 transmitted from the base 500.

[0138] Therefore, since the force transmitted to the force sensor 100 is greater when the base 500 is present than when the base 500 is not present, the vibration of the force sensor 100 can be effectively suppressed when the force is applied. If the vibration of the force sensor 100 is effectively suppressed when the force is applied (for example, conversely, it is not suppressed when the force is not applied), since the impedance change of the force sensor 100 can be increased or maximized at the resonant frequency and the anti-resonant frequency described above, the sensitivity of the force sensor 100 can be improved.

[0139] Furthermore, the base 500 may also be used to absorb shocks on the entire display device 2 .

[0140] Although the attachment layer 300 is formed on the entire lower surface of the force sensor 100 in the figure, Figure 4A It may alternatively be formed only on a portion of the lower surface of the force sensor 100 as in the embodiment of FIG. 1 , thereby dividing the force sensor 100 into the attachment portion 301 and the non-attachment portion 302 .

[0141] Fig.13 is a plan view of the force sensor 100 and the support 400 according to the embodiment.

[0142] refer to Fig.13 In a plan view, the support member 400 may be formed in an annular ring shape surrounding the outer surface of the force sensor 100. Fig.13 As shown in , the planar shape of the force sensor 100 may be a quadrangular shape. However, the planar shape of the force sensor 100 is not limited to the quadrangular shape, and the force sensor 100 may also have various planar shapes such as a circular shape and an elliptical shape.

[0143] Fig.14 is a plan view of a force sensor 100 and a support member 400 according to an embodiment. Fig.14 , in a plan view, the support member 400 may be formed into a plurality of rectangles.

[0144] refer to Fig.13 and Fig.14 , the support 400 may surround the force sensor 100 with a space between the support 400 and the force sensor 100. The support 400 may be formed around the force sensor 100 in a shape for increasing the surface area of ​​the force sensor module 2000 or 2001, and may be a structure for increasing or maximizing a planarization function.

[0145] When AC power is supplied to the force sensor 100 , the space between the force sensor 100 and the support 400 may prevent vibration of the force sensor 100 from being hindered.

[0146] In other words, according to the embodiment, the force sensor modules 2000 and 2001 can be configured not to hinder the vibration of the force sensor 100 when no force is applied to the force sensor 100, and can also be configured to suppress the vibration of the force sensor 100 when force is applied to the force sensor 100 (for example, as much as reasonably possible), thereby improving the sensitivity of the force sensor 100.

[0147] Fig.15 is a cross-sectional view of a display device 3 according to an embodiment.

[0148] according to Fig.15 The display device 3 of the embodiment according to Fig.12 The display device 2 of the embodiment of FIG. 2 is different in that the force sensor module 2002 further includes a second circuit board 310 in addition to the first circuit board 200 , and the force sensor module 2002 includes a second adhesive layer 42 instead of the support member 400 .

[0149] For example, the second circuit board 310 is located below the first adhesive layer 41, and the second adhesive layer 42 and the force sensor 100 are located below the second circuit board 310. The first circuit board 200 is located below the second adhesive layer 42. The first circuit board 200 includes or defines a hole, and the force sensor 100 is located inside the hole. Fig.12 The support member 400 includes a second adhesive layer 42 surrounding the force sensor 100 . The upper surface of the second adhesive layer 42 is bonded to the second circuit board 310 , and the lower surface of the second adhesive layer 42 is bonded to the upper surface of the first circuit board 200 .

[0150] The upper surface of the force sensor 100 is electrically connected to the second circuit board 310 through the attachment layer 300. The lower surface of the force sensor 100 may be connected to the base 500.

[0151] The first circuit board 200 and the second circuit board 310 may be electrically connected to each other through the connection wiring 320. Therefore, the force sensor 100 may be electrically connected to the first circuit board 200 through the attachment layer 300, the second circuit board 310, and the connection wiring 320. Therefore, the force sensor 100 may receive driving power from the first circuit board 200.

[0152] The height of the base 500 may correspond to, but is not limited to, Fig.15 The distance between the first circuit board 200 and the position of the bracket 50 is shown in FIG.

[0153] In the current embodiment, the sensitivity of the force sensor 100 can be improved by the second adhesive layer 42 and the base 500. In addition, because the force sensor 100 is located inside the hole of the first circuit board 200, the thickness of the display device 3 can be reduced.

[0154] Fig.16is a cross-sectional view of a display device 4 according to an embodiment.

[0155] according to Fig.16 The display device 4 of the embodiment according to Fig.12 The display device 2 of the embodiment is different in the stacking order of the force sensor 100 and the circuit board 200 of the force sensor module 2003.

[0156] For example, the circuit board 200 may be located below the cover panel 40, and the attachment layer 300, the force sensor 100, and the base 500 may be successively located below the circuit board 200. Fig.12 and Fig.15 As in the embodiment of FIG. 1 , since the force sensor 100 is electrically connected to the circuit board 200 through the attachment layer 300 and since the bottom of the force sensor 100 is supported by the base 500 , the sensitivity of the force sensor 100 can be improved. Fig.12 and Fig.15 The force sensor modules 2000 and 2002 shown in FIG. Fig.16 The force sensor module 2003 shown in FIG. 2 may have fewer components and may be manufactured in a simpler assembly process.

[0157] exist Fig.16 In the display device 4, only the cover panel 40 is located between the circuit board 200 and the display panel 30. Therefore, the display panel 30 including the curved portion may be curved to have a greater curvature.

[0158] Fig.17 is a graph showing a change in voltage with respect to a force applied to a force sensor according to an embodiment. Fig.17 A voltage change when a force corresponding to a load is applied to each of a display device having a force sensor module including the base 500 and a display device having a force sensor module not including the base 500 is shown.

[0159] exist Fig.17 , the X-axis represents the force as the applied load [g], and the Y-axis represents the voltage change [mV].

[0160] Voltage change indication Figure 2 The resistor Rs shown in FIG. 1 shows the voltage change between the case when force is applied and the case when no force is applied at the resonant frequency. In other words, the voltage change represents the impedance change of the force sensor when force is applied to the force sensor.

[0161] As per Fig.17As is apparent, in the structure with the base (indicated by reference numeral 71), as the load (which is a physical stimulus) increases, the voltage change exhibits a significant linear characteristic. In addition, a larger voltage change is observed in the structure with the base compared to the structure without the base (indicated by reference numeral 72). Here, the large voltage change indicates a relatively large impedance change of the force sensor due to the applied force, and thus indicates a relatively large sensitivity to the force.

[0162] Therefore, from Fig.17 It can be seen that by installing a base in the force sensor module, the sensitivity of the display device to force can be further improved.

[0163] Therefore, the force sensor according to the embodiment can have improved force sensing sensitivity. In addition, a display device including such a force sensor according to the embodiment can more accurately recognize the input of force.

[0164] However, the effects of the embodiments are not limited to the effects set forth herein. The above and other effects of the embodiments will become more apparent to those skilled in the art by referring to the claims.

[0165] Although the present disclosure has been specifically shown and described with reference to the exemplary embodiments of the present disclosure, it should be understood by those skilled in the art that various changes in form and details may be made without departing from the spirit and scope of the present disclosure as defined in the appended claims, including functional equivalents thereof. The exemplary embodiments should be considered in a descriptive sense only and not for purposes of limitation.

Claims

1. Display equipment, including: Display panel; Force sensor module, including: a first circuit board defining a hole; a second circuit board; and a force sensor inserted in the hole, overlapping the display panel, partially attached to the second circuit board, and comprising: an attachment portion having a surface facing the second circuit board and attached to the second circuit board; and The non-attachment portion has a surface spaced apart from the second circuit board.

2. The display device according to claim 1, wherein: The force sensor module further includes: An attachment layer is located between the force sensor and the second circuit board at the attachment portion.

3. The display device according to claim 2, wherein: The attachment layer is an electrical connection layer.

4. The display device according to claim 3, wherein: The force sensor is electrically connected to the second circuit board through the attachment layer.

5. The display device according to claim 4, wherein: The attachment layer is positioned along an edge of the surface facing the second circuit board.

6. The display device according to claim 1, wherein: The force sensor further comprises: A piezoelectric element is configured to be driven by AC power.

7. The display device according to claim 6, wherein: The AC power has a resonant frequency, an anti-resonant frequency, or a frequency between the adjacent resonant frequency and the anti-resonant frequency.

8. Display equipment, including: Display panel; as well as a force sensor module overlapping the display panel and comprising a force sensor, a base overlapping the force sensor in a thickness direction, and a circuit board, the force sensor being at least partially attached to the circuit board, wherein the force sensor comprises an attachment portion and a non-attachment portion, in which a surface of the force sensor facing the circuit board is attached to the circuit board, and the non-attachment portion is spaced apart from the circuit board, Wherein, the circuit board is between the force sensor and the base, or the force sensor is between the circuit board and the base.

9. The display device according to claim 8, further comprising: A support member surrounds a side surface of the force sensor and is spaced apart from the force sensor.

10. The display device according to claim 8, wherein: The force sensor module further includes: an additional circuit board defining a hole for inserting the force sensor; and Connecting wiring electrically connects the additional circuit board and the circuit board.

11. The display device according to claim 10, wherein: The force sensor module further includes: An adhesive layer is located between the additional circuit board and the circuit board and surrounds the force sensor.

12. Force sensor module, including: Circuit boards; A force sensor is partially attached to the circuit board and includes: an attachment portion in which a surface of the force sensor facing the circuit board is attached to the circuit board; and a non-attachment portion spaced apart from the circuit board, and a base, overlapping with the force sensor, Wherein, the circuit board is between the force sensor and the base.

13. The force sensor module of claim 12, further comprising: An attachment layer is located between the force sensor and the circuit board at the attachment portion.

14. The force sensor module of claim 13, wherein: The attachment layer is an electrical connection layer for electrically connecting the force sensor to the circuit board.

15. The force sensor module of claim 14, wherein: The attachment layer is positioned along an edge of the force sensor that faces the surface of the circuit board.

16. The force sensor module of claim 12, further comprising: A support member surrounds a side surface of the force sensor and is spaced apart from the force sensor.

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