Molded photosensitive component and camera module and manufacturing method thereof and electronic device

Abstract

A molded photosensitive component and a camera module, a manufacturing method thereof, and an electronic device, wherein the molded photosensitive component is used to be assembled with an optical lens to form the camera module, and includes a circuit board, a photosensitive element, and a molded base. The photosensitive element is conductively connected to the circuit board. The molded base is formed on the circuit board in a molding manner, and provides a flat chip mounting surface and a flat lens mounting surface, wherein the photosensitive element is correspondingly mounted on the chip mounting surface of the molded base, and the lens mounting surface of the molded base is used to correspondingly mount the optical lens, so that the optical lens is located in the light sensing path of the photosensitive element.

Description

Technical Field

[0001] The present invention relates to the field of optical imaging, and in particular to a molded photosensitive component and a camera module, a manufacturing method thereof, and an electronic device. Background Art

[0002] In recent years, electronic products and smart devices have increasingly been moving towards lighter, thinner and more high-performance directions. This development trend has put forward more stringent requirements on the size and imaging capabilities of camera modules, which are one of the standard configurations of electronic products and smart devices.

[0003] In the current camera module assembly process, the most difficult and challenging problem is how to find a feasible and effective solution to solve the problems of blurred pixels and poor quality of the camera module caused by circuit board deformation while controlling the assembly cost of the camera module.

[0004] Specifically, in the existing assembly process of the camera module, the photosensitive chip and the lens mount are usually first directly attached to the circuit board, and then the lens is installed on the lens mount. The relative position between the photosensitive chip and the lens needs to be adjusted to ensure that the photosensitive surface of the photosensitive chip and the optical axis of the lens are perpendicular to each other, thereby ensuring that the camera module has good imaging quality.

[0005] However, during the assembly process of the camera module, it will go through multiple baking and heating steps. Since the circuit board will deform greatly after being heated, that is, the circuit board is prone to warping after being heated, the photosensitive surface of the photosensitive chip on the circuit board and the mounting surface of the lens holder are not parallel to each other. Therefore, it will be difficult for the photosensitive surface of the photosensitive chip and the optical axis of the lens to remain perpendicular to each other, which will directly affect the imaging quality of the camera module.

[0006] In addition, as the imaging function of the camera module becomes more and more powerful, that is, the performance of the lens and the performance of the photosensitive chip are constantly upgraded, the vertical accuracy requirements between the optical axis of the lens and the photosensitive surface of the photosensitive chip are also getting higher and higher. Therefore, once the photosensitive chip or the lens is tilted, it will seriously affect the imaging quality of the camera module and may even cause the entire camera module to be scrapped. Summary of the invention

[0007] One object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device, wherein a molded base of the molded photosensitive component can stably keep a photosensitive surface of a photosensitive element mounted on a chip mounting surface of the molded base and an optical axis of an optical lens mounted on a lens mounting surface of the molded base perpendicular to each other, thereby ensuring that the camera module has good imaging quality.

[0008] Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device, wherein the molded base can prevent the photosensitive element mounted on the chip mounting surface of the molded base from tilting or warping, so as to ensure that the camera module has good imaging quality.

[0009] Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the molded base is integrally formed on a circuit board of the molded photosensitive component through a molding process, so as to provide a flatter and more stable chip mounting surface and lens mounting surface through the molded base.

[0010] Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the molded base can keep the chip mounting surface parallel to the lens mounting surface to ensure that the camera module has good imaging quality.

[0011] Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the molded base can enhance the anti-deformation ability of the circuit board to prevent the circuit board from deforming due to heat.

[0012] Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the molded base has an integrated structure, which is conducive to keeping the chip mounting surface and the lens mounting surface of the molded base parallel to each other, so as to ensure that the photosensitive surface of the photosensitive element mounted on the chip mounting surface and the optical axis of the optical lens mounted on the lens mounting surface are perpendicular to each other.

[0013] Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the molded base has an integrated structure, which is conducive to keeping the chip mounting surface and the lens mounting surface of the molded base parallel to each other, so as to adjust the relative position between the optical lens and the photosensitive element during the assembly process so that the optical axis of the optical lens is perpendicular to the photosensitive surface of the photosensitive element.

[0014] Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the thickness of a chip mounting portion of the molded base is smaller than the thickness of a lens mounting portion of the molded base, so as to reduce the distance between the photosensitive element and the circuit board, thereby reducing the height of the camera module.

[0015] Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, a connecting portion of the molded base can increase the connection strength between the chip mounting portion and the lens mounting portion, thereby enhancing the overall strength and deformation resistance of the molded base.

[0016] Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the chip mounting portion and the lens mounting portion are spaced apart on the circuit board to form a reserved space for the molded base between the chip mounting portion and the lens mounting portion, and a group of circuit board connectors of the circuit board correspond to the reserved space to prevent the molded base from covering the circuit board connectors, thereby facilitating electrical connection between the photosensitive element and the circuit board.

[0017] Another object of the present invention is to provide a molded photosensitive component and a camera module, a manufacturing method thereof, and an electronic device, wherein in some embodiments of the present invention, the chip mounting portion, the lens mounting portion, and the connecting portion of the molded base are formed simultaneously in one molding, that is, the molded base is molded integrally in the same mold to ensure that the upper surfaces of the chip mounting portion and the lens mounting portion maintain good consistency and parallelism.

[0018] Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the chip mounting portion of the molded base is provided with at least one separation gap to alleviate the stress exerted on the chip mounting portion of the molded base to prevent the chip mounting portion from being deformed due to heat deformation of the circuit board.

[0019] Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the separation gap separates the chip mounting portion into at least two sub-chip mounting portions so as to disperse the stress on the chip mounting portion to prevent the chip mounting portion from being deformed due to concentrated stress.

[0020] Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the chip mounting portion of the molded base is provided with at least one accommodating groove for accommodating a fluid adhesive material, so that the chip mounting surface of the molded base can directly support the photosensitive element to ensure that the photosensitive surface of the photosensitive element has a higher degree of flatness.

[0021] Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the receiving groove is located at the center of the chip mounting portion to optimize the fixing effect of the adhesive material contained in the receiving groove on the photosensitive element to prevent the photosensitive element from tilting due to uneven force.

[0022] Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, each of the receiving grooves is arranged in a "U" shape, and the center of the chip mounting portion is still the receiving groove, so as to reduce the amount of the adhesive material used while still maintaining a good fixing effect.

[0023] Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, each of the accommodating grooves is arranged in a surrounding manner on the chip mounting portion so that the photosensitive element is subjected to uniform adhesive force to prevent the photosensitive element from tilting due to uneven force.

[0024] Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the accommodating groove is arranged through the chip mounting portion to form a through-hole groove in the chip mounting portion, so that during the molding process, the accommodating groove corresponds to a pressure head of a molding mold, so that the pressure head of the molding mold can press the circuit board during the molding process to prevent the circuit board from deformation, thereby improving the flatness of the circuit board and the chip mounting portion.

[0025] In order to achieve at least one of the above-mentioned purposes or other purposes and advantages, the present invention provides a molded photosensitive component for assembly with an optical lens into a camera module, comprising:

[0026] a circuit board;

[0027] a photosensitive element, wherein the photosensitive element is conductively connected to the circuit board; and

[0028] A molded base, wherein the molded base is formed on the circuit board in a molding manner and provides a flat chip mounting surface and a flat lens mounting surface, wherein the photosensitive element is correspondingly mounted on the chip mounting surface of the molded base, and the lens mounting surface of the molded base is provided for correspondingly mounting the optical lens so that the optical lens is located in the light sensing path of the photosensitive element.

[0029] In some embodiments of the present invention, the chip mounting surface and the lens mounting surface provided by the mold base are parallel to each other.

[0030] In some embodiments of the present invention, the molded base includes a chip mounting portion having the chip mounting surface and a lens mounting portion having the lens mounting surface, and is provided with a reserved space, wherein the lens mounting portion is located around the chip mounting portion, and the reserved space is located between the chip mounting portion and the lens mounting portion.

[0031] In some embodiments of the present invention, the circuit board is provided with a chip molding area, a lens molding area, a non-molding area and at least one group of circuit board connectors, wherein the lens molding area is located around the chip molding area, the non-molding area is located between the chip molding area and the lens molding area, each group of circuit board connectors is arranged in the non-molding area of ​​the circuit board, and after molding on the circuit board, the chip mounting portion of the molding base is covered with the chip molding area of ​​the circuit board, the lens mounting portion of the molding base is covered with the lens molding area of ​​the circuit board, and the reserved space of the molding base corresponds to the non-molding area of ​​the circuit board.

[0032] In some embodiments of the present invention, the mold base further includes at least one connecting portion, wherein each of the connecting portions integrally extends from the lens mounting portion to the chip mounting portion to form the mold base having an integrated structure.

[0033] In some embodiments of the present invention, the circuit board is further provided with a connecting molding area, wherein the connecting molding area is located between the lens molding area and the chip molding area, and connects the lens molding area and the chip molding area. After molding on the circuit board, the connecting portion of the molding base is covered on the connecting molding area of ​​the circuit board to combine the lens mounting portion and the chip mounting portion into one through the connecting portion.

[0034] In some embodiments of the present invention, the connecting portion has a lens connecting end and a chip connecting end, wherein the lens connecting end of the connecting portion is integrally connected to the lens mounting portion, and the chip connecting end of the connecting portion is integrally connected to the chip mounting portion, wherein the connecting portion gradually extends from the lens connecting end to the chip connecting end.

[0035] In some embodiments of the present invention, the thickness of the chip mounting portion is smaller than the thickness of the lens mounting portion.

[0036] In some embodiments of the present invention, the chip mounting portion of the molded base includes at least two sub-chip mounting portions spaced apart from each other, and a separation gap is formed between adjacent sub-chip mounting portions, wherein each sub-chip mounting portion is integrally connected to the lens mounting portion through the corresponding connecting portion.

[0037] In some embodiments of the present invention, the separation gap is arranged in a straight line shape to separate the chip mounting portion into two sub-chip mounting portions.

[0038] In some embodiments of the present invention, the separation gap is arranged in a cross shape to separate the chip mounting portion into four sub-chip mounting portions.

[0039] In some embodiments of the present invention, the four sub-chip mounting parts are grouped in pairs, and each group of the sub-chip mounting parts is integrally connected to the lens mounting part through the same connecting part.

[0040] In some embodiments of the present invention, the molded photosensitive component also includes an adhesive layer, wherein the chip mounting portion of the molded base includes at least one accommodating groove, and each of the accommodating grooves is recessed downward from the chip mounting surface to form a groove for accommodating the adhesive layer, so that the photosensitive element can be fixedly mounted on the chip mounting surface of the chip mounting portion through the adhesive layer.

[0041] In some embodiments of the present invention, each of the receiving grooves is disposed on the chip mounting portion in an array arrangement.

[0042] In some embodiments of the present invention, each of the receiving grooves is disposed on the chip mounting portion in a surrounding arrangement. .

[0043] In some embodiments of the present invention, each of the accommodating grooves extends downward from the chip mounting surface to the circuit board to form a through-hole type groove, so as to bond the photosensitive element, the chip mounting portion and the circuit board together through the adhesive layer.

[0044] In some embodiments of the present invention, each of the accommodating grooves is arranged in a "U" shape, so that the chip mounting part is divided into two sub-chip mounting parts by the accommodating groove, wherein the two sub-chip mounting parts are integrally connected to form the chip mounting part with an integrated structure.

[0045] In some embodiments of the present invention, the molded photosensitive assembly further includes a group of electronic components, wherein the electronic components are mounted at intervals on the lens molding area of ​​the circuit board so as to be covered by the lens mounting portion of the molded base.

[0046] In some embodiments of the present invention, the molded photosensitive component also includes at least one group of leads, wherein the photosensitive element includes a photosensitive area, a non-photosensitive area and at least one group of chip connectors, wherein the non-photosensitive area is located around the photosensitive area, and each group of chip connectors is respectively arranged in the non-photosensitive area of ​​the photosensitive element to conductively connect the chip connectors with the corresponding circuit board connectors through the leads.

[0047] According to another aspect of the present invention, the present invention further provides a camera module, comprising:

[0048] an optical lens; and

[0049] The above-mentioned molded photosensitive component, wherein the optical lens is correspondingly mounted on the lens mounting surface of the molded photosensitive component, wherein the optical axis of the optical lens is perpendicular to the photosensitive surface of the photosensitive element.

[0050] According to another aspect of the present invention, the present invention further provides an electronic device, comprising:

[0051] an electronic device body; and

[0052] At least one camera module, wherein the camera module is arranged on the electronic device body for acquiring images, wherein the camera module is the camera module as described in claim 20.

[0053] According to another aspect of the present invention, the present invention further provides a method for manufacturing a molded photosensitive component, comprising the steps of:

[0054] A mold base is formed on a circuit board by a molding process, wherein the mold base provides a flat chip mounting surface and a flat lens mounting surface;

[0055] Mounting a photosensitive element to the chip mounting surface of the mold base; and

[0056] The photosensitive element and the circuit board are conductively connected to form a molded photosensitive component.

[0057] In some embodiments of the present invention, the step of forming a molded base on a circuit board by a molding process, wherein the molded base provides a flat chip mounting surface and a flat lens mounting surface, comprises the steps of:

[0058] Placing the circuit board in a second mold of a molding mold;

[0059] Clamping a first mold and the second mold of the molding mold to form a molding space of the molding mold between the first mold and the second mold; and

[0060] A molding material is added to the molding space of the molding mold to integrally form the molding base on the circuit board after the molding material is solidified.

[0061] In some embodiments of the present invention, the step of closing a first mold and a second mold of the molding mold to form a molding space of the molding mold between the first mold and the second mold comprises the steps of:

[0062] Pressing a non-molding area of ​​the circuit board with a pressing surface of the first mold;

[0063] Correspondingly forming a chip mounting portion forming space in a chip molding area of ​​the circuit board;

[0064] Correspondingly forming a lens mounting portion molding space in a lens molding area of ​​the circuit board, wherein the non-molding area is located between the chip molding area and the lens molding area; and

[0065] A connection part molding space is correspondingly formed in a connection molding area of ​​the circuit board, wherein the connection part molding space connects the chip mounting part molding space and the lens mounting part molding space to form the molding space with an integrated structure.

[0066] In some embodiments of the present invention, the step of adding a molding material to the molding space of the molding mold to integrally form the molding base on the circuit board after the molding material is cured comprises the steps of:

[0067] In the lens mounting portion molding space, a lens mounting portion is formed to cover the lens molding area of ​​the circuit board, so that the top surface of the lens mounting portion forms the lens mounting surface;

[0068] forming a chip mounting portion covering the chip molding area of ​​the circuit board in the chip mounting portion molding space, so that the top surface of the chip mounting portion forms the chip mounting surface; and

[0069] In the connection part molding space, a connection part covering the connection molding area of ​​the circuit board is formed, wherein the connection part is integrally connected to the chip mounting part and the lens mounting part to form the molding base with an integrated structure.

[0070] In some embodiments of the present invention, the method for manufacturing the molded photosensitive component further comprises the steps of:

[0071] A pressing head of the first mold is pressed on a central portion of the chip molding area of ​​the circuit board.

[0072] In some embodiments of the present invention, the method for manufacturing the molded photosensitive component further comprises the steps of:

[0073] After the molding material is solidified, a receiving groove is formed at the chip mounting portion.

[0074] In some embodiments of the present invention, the method for manufacturing the molded photosensitive component further comprises the steps of:

[0075] After the molding material is solidified, a separation gap is formed at the chip mounting portion, wherein the separation gap separates the chip mounting portion into at least two sub-chip mounting portions spaced apart from each other.

[0076] In some embodiments of the present invention, the step of adding a molding material to the molding space of the molding mold to integrally form the molding base on the circuit board after the molding material is cured comprises the steps of:

[0077] pouring the molding material into the lens mounting portion molding space of the molding space; and

[0078] The molding material is guided to flow from the lens mounting portion molding space into the chip mounting portion molding space through the connection portion molding space, so that the molding material fills the molding space.

[0079] In some embodiments of the present invention, the chip mounting surface and the lens mounting surface are parallel to each other.

[0080] In some embodiments of the present invention, in the method for manufacturing the molded photosensitive component, the chip mounting surface is lower than the lens mounting surface.

[0081] According to another aspect of the present invention, the present invention further provides a method for manufacturing a camera module, comprising the steps of:

[0082] A mold base is formed on a circuit board by a molding process, wherein the mold base provides a flat chip mounting surface and a flat lens mounting surface;

[0083] Mounting a photosensitive element to the chip mounting surface of the mold base;

[0084] Conductively connecting the photosensitive element and the circuit board to form a molded photosensitive assembly; and

[0085] An optical lens is mounted on the lens mounting surface of the molded base, and an optical axis of the optical lens is perpendicular to the photosensitive surface of the photosensitive element to form a camera module.

[0086] Further objects and advantages of the present invention will be fully apparent from an understanding of the following description and the accompanying drawings.

[0087] These and other objects, features and advantages of the present invention will be more fully understood from the following detailed description, accompanying drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0088] Figure 1 It is a three-dimensional schematic diagram of a camera module according to a first preferred embodiment of the present invention.

[0089] Figure 2 It is a three-dimensional cross-sectional schematic diagram of the camera module according to the above-mentioned first preferred embodiment of the present invention.

[0090] Figure 3 It is a three-dimensional schematic diagram of a molded photosensitive component of the camera module according to the above-mentioned first preferred embodiment of the present invention.

[0091] FIG. 4A to FIG. 4C It is a schematic diagram of the manufacturing steps of the molded photosensitive component according to the above-mentioned first preferred embodiment of the present invention.

[0092] Figure 5 It is a first variant implementation of the molded photosensitive component according to the above-mentioned first preferred embodiment of the present invention.

[0093] Fig. 6A and Figure 6B It is a second variant implementation of the molded photosensitive component according to the above-mentioned first preferred embodiment of the present invention.

[0094] Figure 7 It is a flow chart of the manufacturing method of the camera module according to the above-mentioned first preferred embodiment of the present invention.

[0095] Figure 8 It is a three-dimensional schematic diagram of a molded photosensitive component according to a second preferred embodiment of the present invention.

[0096] Fig. 9 It is a first variant implementation of the molded photosensitive component according to the above-mentioned second preferred embodiment of the present invention.

[0097] Fig.10 It is a second variant implementation of the molded photosensitive component according to the above-mentioned second preferred embodiment of the present invention.

[0098] Fig.11A It is a three-dimensional schematic diagram of a molded photosensitive component according to a third preferred embodiment of the present invention.

[0099] Fig. 11BIt is a schematic cross-sectional view of the molded photosensitive component according to the third preferred embodiment of the present invention.

[0100] Fig. 12A and Fig. 12B It is a first variant implementation of the molded photosensitive component according to the above-mentioned third preferred embodiment of the present invention.

[0101] FIG. 13A to FIG. 13C It is a second variant implementation of the molded photosensitive component according to the above-mentioned third preferred embodiment of the present invention.

[0102] Fig.14A and Fig. 14B It is a third variant implementation of the molded photosensitive component according to the above-mentioned third preferred embodiment of the present invention.

[0103] Fig.15A and Fig. 15B It is a three-dimensional schematic diagram of an electronic device with the camera module according to the present invention. DETAILED DESCRIPTION

[0104] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0105] Those skilled in the art should understand that, in the disclosure of the present invention, the orientation or position relationship indicated by the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0106] In the present invention, the term "one" in the claims and the specification should be understood as "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple. Unless it is clearly indicated in the disclosure of the present invention that the number of the element is only one, the term "one" cannot be understood as unique or single, and the term "one" cannot be understood as a limitation on the quantity.

[0107] In the description of the present invention, it should be understood that "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through a medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0108] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0109] Referring to the accompanying drawings of the present invention Figures 1 to 7 , a camera module 1 according to a first preferred embodiment of the present invention is illustrated, wherein the camera module 1 comprises at least one optical lens 10 and a molded photosensitive component 20. Figures 1 to 4C As shown, the molded photosensitive component 20 includes a circuit board 21, at least one photosensitive element 22 and a molded base 23, wherein each of the photosensitive elements 22 is conductively connected to the circuit board 21, respectively, wherein the molded base 23 is integrally formed on the circuit board 21 in a molding manner, and provides at least one chip mounting surface 2301 and at least one lens mounting surface 2302 with high flatness, wherein each of the photosensitive elements 22 is mounted on the corresponding chip mounting surface 2301, each of the optical lenses 10 is mounted on the corresponding lens mounting surface 2302, and each of the optical lenses 10 is located in the photosensitive path of the corresponding photosensitive element 22.

[0110] It should be understood that the molding base 23 is manufactured by a molding process, that is, by injecting a molding material that is heated and melted into a liquid state into a mold and then cooling it to form a fixed shape corresponding to the mold. Figure 4A to Figure 4CAs shown, since the mold used in the molding process has a high flatness, the surface of the molding base 23 formed in the mold also has a high flatness, so the molding base 23 can provide a flatter chip mounting surface 2301, so as to flatly mount the photosensitive element 22 on the chip mounting surface 2301. At the same time, since the molding base 23 has a higher structural strength and stronger heat resistance than the circuit board, the molding base 23 formed by the molding process and combined with the circuit board 21 can improve the structural strength of the molded photosensitive component 20, and can prevent it from being deformed by heat, so that the photosensitive element 22 mounted on the chip mounting surface 2301 can be effectively prevented from tilting or warping.

[0111] Preferably, if Figure 2 and Figure 4C As shown, each chip mounting surface 2301 is parallel to the corresponding lens mounting surface 2302, so that when the photosensitive element 22 and the optical lens 10 are mounted on the molded base 23, it is more helpful to adjust the photosensitive element 22 and the optical lens 10, so as to calibrate the photosensitive surface 220 of each photosensitive element 22 and the optical axis 100 of the corresponding optical lens 10, so that the photosensitive surface 220 of each photosensitive element 22 and the optical axis 100 of the corresponding optical lens 10 remain perpendicular, further ensuring that the camera module 1 has good imaging quality. It should be understood that the shape and size of each chip mounting surface 2301 can be designed and planned based on the shape and size of the photosensitive element 22. Correspondingly, the shape and size of each lens mounting surface 2302 can be designed and planned based on the lateral shape and size of the lens barrel of the optical lens 10. For different photosensitive elements 22 and optical lenses 10, the shapes and sizes of the chip mounting surface 2301 and the lens mounting surface 2302 are also different, which will not be repeated in the present invention.

[0112] It is worth mentioning that although Figures 1 to 7 In the following description, the camera module 1 includes only one optical lens 10 and one photosensitive element 22 as an example to illustrate the features and advantages of the camera module 1 of the present invention. It can be understood by those skilled in the art that the attached Figures 1 to 7The camera module 1 disclosed in the following description is only an example, and does not constitute a limitation on the content and scope of the present invention. For example, in other examples of the camera module, the number of the optical lens 10 may be more than one, and accordingly, the number of the photosensitive element 22 may be more than one to form an array camera module. In addition, the type of the optical lens 10 may be adjusted accordingly according to the requirements of the camera module. For example, the optical lens 10 may be implemented as an integrated optical lens, a split optical lens, a bare lens, or an optical lens including a lens barrel, etc., and the present invention does not limit this.

[0113] Specifically, Figure 2 and Figure 4A As shown, the molded base 23 includes a chip mounting portion 231 having the chip mounting surface 2301 and a lens mounting portion 232 having the lens mounting surface 2302, and the lens mounting portion 232 is located around the chip mounting portion 231 so that the lens mounting surface 2302 is located around the chip mounting surface 2301, so that when the photosensitive element 22 is mounted on the lens mounting surface 2302 and the optical lens 10 is mounted on the lens mounting surface 2302, the optical lens 10 corresponds to the photosensitive path of the photosensitive element 22, that is, the optical axis 100 of the optical lens 10 and the photosensitive surface 220 of the photosensitive element 22 are perpendicular to each other, and the optical axis 100 of the optical lens 10 corresponds to the center of the photosensitive surface 220 of the photosensitive element 22.

[0114] More specifically, if Figure 3 As shown, the mold base 23 is further provided with a reserved space 233, wherein the reserved space 233 is provided between the chip mounting portion 231 and the lens mounting portion 232. In other words, the chip mounting portion 231 and the lens mounting portion 232 of the mold base 23 are arranged at intervals to form the reserved space 233 of the mold base 23 between the chip mounting portion 231 and the lens mounting portion 232.

[0115] It is worth noting that Figure 4AAs shown, the circuit board 21 includes a chip molding area 211, a lens molding area 212 and a non-molding area 213, wherein the non-molding area 213 is located between the chip molding area 211 and the lens molding area 212, and the lens molding area 212 is located around the chip molding area 211, so that when molding is performed on the circuit board 21 through a molding process, the chip mounting portion 231 of the molding base 23 is formed in the chip molding area 211 of the circuit board 21, so that the molding base 23 The chip mounting portion 231 is covered on the chip molding area 211 of the circuit board 21, and the lens mounting portion 232 of the molding base 23 is formed in the lens molding area 212 of the circuit board 21, so that the lens mounting portion 232 of the molding base 23 is covered on the lens molding area 212 of the circuit board 21, so as to form the reserved space 233 of the molding base 23 in the non-molding area 213 of the circuit board 21, so that the molding base 23 does not cover the non-molding area 213 of the circuit board 21. In other words, the chip molding area 211 of the circuit board 21 corresponds to the chip mounting portion 231 of the molding base 23, the lens molding area 212 of the circuit board 21 corresponds to the lens mounting portion 232 of the molding base 23, and the non-molding area 213 of the circuit board 21 corresponds to the reserved space 233 of the molding base 23.

[0116] Furthermore, if Figure 2 and Figure 3 As shown, the circuit board 21 also includes at least one group of circuit board connectors 214, wherein each group of the circuit board connectors 214 is respectively arranged in the non-molded area 213 of the circuit board 21 to prevent the molded base 23 from covering the circuit board connectors 214 of the circuit board 21 and thereby hindering the electrical connection between the photosensitive element 22 and the circuit board connectors 214, thereby facilitating conductive connection between the photosensitive element 22 and the circuit board 21.

[0117] Accordingly, if Figure 3 As shown, the photosensitive element 22 includes a photosensitive area 221, a non-photosensitive area 222 and at least one group of chip connectors 223, wherein the non-photosensitive area 222 is located around the photosensitive area 221, and each group of chip connectors 223 is respectively arranged in the non-photosensitive area 222 of the photosensitive element 22. In other words, the photosensitive area 221 is located in the middle of the photosensitive element 22, the non-photosensitive area 222 is located at the outer periphery of the photosensitive element 22, and the non-photosensitive area 222 is arranged around the photosensitive area 221, so that each group of chip connectors 223 is located at the outer periphery of the photosensitive element 22.

[0118] It is worth noting that Figure 2 As shown, the molded photosensitive component 20 further includes an adhesive layer 26, wherein the adhesive layer 26 is located between the photosensitive element 22 and the chip mounting surface 2301 of the mold base 23, so that the photosensitive element 22 is fixedly mounted on the chip mounting surface 2301 of the mold base 23 through the adhesive layer 26. It should be understood that in the process of mounting the photosensitive element 22 to the chip mounting surface 2301, an adhesive material such as glue, solid glue, etc. is first applied to the chip mounting surface 2301 of the mold base 23, and then the photosensitive element 22 is stacked on the chip mounting surface 2301, so that the adhesive layer 26 located between the photosensitive element 22 and the chip mounting surface 2301 is formed after the adhesive material is cured.

[0119] like Figure 3 As shown, the molded photosensitive component 20 also includes at least one group of leads 24, wherein each lead of each group of leads 24 has a circuit board connection terminal 241 and a chip connection terminal 242, wherein each lead of each group of leads 24 extends in a curved manner between the circuit board connection terminal 241 and the chip connection terminal 242, wherein the circuit board connection terminal 241 of each group of leads 24 is respectively connected to each group of circuit board connectors 214 of the circuit board 21, and the chip connection terminal 242 of each group of leads 24 is respectively connected to each group of chip connectors 223 of the photosensitive element 22, so as to conductively connect the photosensitive element 22 and the circuit board 21.

[0120] It is worth mentioning that the type of the lead 24 is not limited, for example, the lead 24 can be a gold wire, that is, after the photosensitive element 22 is mounted on the chip mounting surface 2301 of the mold base 23, the lead 24 can be connected to the photosensitive element 22 and the circuit board 21 through a gold wire punching process. Nevertheless, in other examples, the lead 24 can also be other types of leads, such as silver wires, copper wires, etc., as long as the lead 24 can connect the photosensitive element 22 and the circuit board 21.

[0121] In an example of the camera module 1 of the present invention, each of the circuit board connectors 214 of the circuit board 21 and each of the chip connectors 223 of the photosensitive element 22 can be connection disks, that is, each of the circuit board connectors 214 of the circuit board 21 and each of the chip connectors 223 of the photosensitive element 22 can be disk-shaped, so that the circuit board connection end 241 and the chip connection end 242 of the lead 24 are respectively connected to the circuit board connector 214 of the circuit board 21 and the chip connector 223 of the photosensitive element 22. In another example of the camera module of the present invention, the circuit board connector 214 of the circuit board 21 and the chip connector 223 of the photosensitive element 22 may be spherical, for example, solder paste or other welding materials are applied to the non-molding area 213 of the circuit board 21 and the non-photosensitive area 222 of the photosensitive element 22 to form the circuit board connector 214 of the circuit board 21 and the chip connector 223 of the photosensitive element 22, respectively. Nevertheless, it can be understood by those skilled in the art that the types of the circuit board connector 214 of the circuit board 21 and the chip connector 223 of the photosensitive element 22 do not constitute a limitation on the type and scope of the camera module of the present invention, that is, in other examples of the camera module, the circuit board connector 214 of the circuit board 21 and the chip connector 223 of the photosensitive element 22 may also have other shapes not listed above.

[0122] It is worth mentioning that Figure 2 As shown, the molded photosensitive component 20 also includes a group of electronic components 25, wherein each of the electronic components 25 can be mounted on the lens molding area 212 of the circuit board 21 at intervals from each other through a process such as SMT (Surface Mount Technology), so that after the molding base 23 is formed, the lens mounting portion 232 of the molding base 23 covers each of the electronic components 25, so as to isolate adjacent electronic components 25 through the lens mounting portion 232. It should be understood that since the lens mounting portion 232 of the molded base 23 covers each of the electronic components 25, there will be no adverse interference between adjacent electronic components 25. The imaging quality of the camera module can be guaranteed even when the distance between adjacent electronic components 25 is relatively close. Therefore, a larger number of electronic components 25 can be mounted on a small area of ​​the circuit board 21, thereby making the structure of the molded photosensitive component 20 more compact, which is beneficial to improving the imaging quality of the camera module 1 on the basis of controlling the size of the camera module 1.

[0123] It is worth noting that in some other embodiments of the present invention, each of the electronic components 25 can also be mounted at intervals on the non-molded area 213 of the circuit board 21, so that after the molding base 23 is formed, each of the electronic components 25 is located in the reserved space 233 of the molding base 23, so that the electronic components 25 are exposed outside the molding base 23 to facilitate subsequent repair and maintenance of the electronic components 25.

[0124] Preferably, if Figure 2 As shown, the chip mounting surface 2301 of the mold base 23 is lower than the lens mounting surface 2302, that is, the thickness of the chip mounting portion 231 of the mold base 23 is less than the thickness of the lens mounting portion 232 of the mold base 23, so that the lens mounting portion 232 can completely cover the electronic component 25, so as to avoid the height of the electronic component 25, and can also provide a flat lens mounting surface 2302 for mounting the optical lens 10. At the same time, due to the small thickness of the chip mounting portion 231, the distance between the chip mounting surface 2301 and the circuit board 21 is small, so that the distance between the photosensitive element 22 mounted on the chip mounting surface 2301 and the circuit board 21 can be shortened, which is not only conducive to shortening the length of the lead 24 required for conductively connecting the photosensitive element 22 and the circuit board 21, but also can reduce the overall height of the camera module 1.

[0125] Further, in the first preferred embodiment of the present invention, if Figure 3 and Figure 4AAs shown, the mold base 23 also includes at least one connecting portion 234, wherein each of the connecting portions 234 extends integrally from the lens mounting portion 232 to the chip mounting portion 231, so that the chip mounting portion 231 and the lens mounting portion 232 are combined into one through the connecting portion 234, thereby forming the mold base 23 with an integrated structure, so as to enhance the overall strength and deformation resistance of the mold base 23, and prevent the mold base 23 from being deformed due to heat or external force, thereby providing a flatter and more stable mounting surface. In other words, the circuit board 21 is further provided with a connection molding area 215, and the connection molding area 215 is respectively connected with the chip molding area 211 and the lens molding area 212, so that when the molding base 23 is formed by a molding process, the chip mounting portion 231, the lens mounting portion 232 and the connection portion 234 of the molding base 23 are integrally formed on the circuit board 21, wherein the connection portion 234 corresponds to the connection molding area 215 of the circuit board 21, and the The connecting portion 234 combines the chip mounting portion 231 and the lens mounting portion 232 into one, so that the chip mounting surface 2301 located at the chip mounting portion 231 and the lens mounting surface 2302 located at the lens mounting portion 232 can be stably maintained in parallel, to prevent the chip mounting portion 231 or the lens mounting portion 232 from tilting or slightly deforming, thereby preventing the parallelism between the chip mounting surface 2301 and the lens mounting surface 2302 from being reduced, thereby affecting the imaging quality of the camera module 1.

[0126] It is worth noting that although the connecting portion 234 is located between the chip mounting portion 231 and the lens mounting portion 232, that is, the connecting portion 234 corresponds to the reserved space 233 of the molded base 23, each of the connecting portions 234 avoids the circuit board connector 214 located in the non-molded area 213 of the circuit board 21 to prevent the connecting portion 234 from covering or shielding the circuit board connector 214 and thereby hindering the conductive connection between the circuit board connector 214 and the chip connector 223 of the photosensitive element 22.

[0127] For example, Figure 2 and Figure 3As shown, the circuit board connector 214 of the circuit board 21 is arranged on both sides of the chip molding area 211, that is, the non-molding area 213 is distributed on both sides of the chip molding area 211. At this time, the number of the connecting parts 234 of the molding base 23 is two, which are symmetrically arranged on the front and rear sides of the chip mounting part 231, so as to separate the reserved space 233 of the molding base 23 into left and right parts, so that the left and right parts of the reserved space 233 correspond to the corresponding two parts of the non-molding area 213 of the circuit board 21, so that the circuit board connector 214 arranged in the left and right parts of the non-molding area 213 is exposed to the left and right sides of the chip mounting part 231, so as to be electrically connected to the chip connector 223 of the photosensitive element 22, so as to conduct the photosensitive element 22 and the circuit board 21.

[0128] Preferably, if Figure 3 As shown, the width of each of the connecting portions 234 is smaller than the width of the chip mounting portion 231, so that while reducing the space occupied by the connecting portion 234 (i.e. reducing the area of ​​the connecting molded area 215 of the circuit board 21), the area of ​​the non-molded area 213 of the circuit board 21 can also be correspondingly increased to provide sufficient space for arranging the circuit board connectors 214, so as to prevent the circuit board connectors 214 from being too crowded and contacting each other to cause a short circuit accident. More preferably, the width of the connecting portion 234 is not less than 1 / 10 of the width of the chip mounting portion 231, so as to prevent the connection strength of the connecting portion 234 from being too weak due to the small width of the connecting portion 234, thereby reducing the overall strength of the molded base 23.

[0129] It should be understood that in some other examples of the present invention, the width of each connecting portion 234 can also be equal to or greater than the width of the chip mounting portion 231, so as to increase the connection strength between the connecting portion 234 and the chip mounting portion 231 and the lens mounting portion 232 respectively, while also increasing the anti-deformation performance of the connecting portion 234 itself, so as to ensure good parallelism between the chip mounting surface 2301 and the lens mounting surface 2302.

[0130] More preferably, in the first preferred embodiment of the present invention, Figure 3 and Figure 4A As shown, the thickness of the connection portion 234 is equal to the thickness of the chip mounting portion 231. Of course, in some other embodiments of the present invention, the thickness of the connection portion 234 may be greater than the thickness of the chip mounting portion 231, or may be less than the thickness of the chip mounting portion 231.

[0131] In the first preferred embodiment of the present invention, FIG. 4A to FIG. 4C As shown, the chip mounting portion 231 and the lens mounting portion 232 of the molding base 23 are molded simultaneously in one molding, that is, the circuit board 21 is correspondingly placed in a molding mold 400 to perform a molding process by the molding mold 400, thereby forming the molding base 23 for covering the chip molding area 211 and the lens molding area 212 of the circuit board 21, so that the upper surfaces of the chip mounting portion 231 and the lens mounting portion 232 of the molding base 23 have good consistency, so as to ensure that the chip mounting surface 2301 and the lens mounting surface 2302 have a high degree of parallelism, which helps to make the photosensitive surface 220 of the photosensitive element 22 mounted on the chip mounting surface 2301 perpendicular to the optical axis 100 of the optical lens 10 mounted on the lens mounting surface 2302.

[0132] Specifically, if Figure 4B and Figure 4C As shown, the molding mold 400 includes a first mold 401 and a second mold 402, wherein at least one of the first mold 401 and the second mold 402 can be moved so that the first mold 401 and the second mold 402 can be molded and demolded, and a molding space 403 is formed between the first mold 401 and the second mold 402, wherein the molding base 23 is formed by the molding material being added into the molding space 403 and after curing.

[0133] For example, in one embodiment, the second mold 402 may be fixed, and the first mold 401 may be moved relative to the second mold 402 along the guide column, so that the first mold 401 is molded when it is moved toward the second mold 402, and the first mold 401 is demolded when it is moved away from the second mold 402. When the first mold 401 and the second mold 402 are molded, the molding space 403 is formed between the first mold 401 and the second mold 402. In another embodiment, the first mold 401 may be fixed, and the second mold 402 may be moved relative to the first mold 401 along the guide column, so that the second mold 402 is molded when it is moved toward the first mold 401, and the second mold 402 is demolded when it is moved away from the first mold 401.

[0134] Furthermore, if Figure 4CAs shown, the molding die 400 further includes a covering film 404, wherein the covering film 404 is overlappedly disposed on a pressing surface 4011 of the first die 401 of the molding die 400, and the covering film 404 corresponds to the non-molding area 213 of the circuit board 21, wherein after the circuit board 21 is placed in the first die 401 and / or the second die 402, the first die 401 and the second die 402 of the molding die 400 are operated to perform a mold closing operation , so that the circuit board 21 is located in the molding space 403 of the molding mold 400, wherein the pressing surface 4011 of the first mold 401 applies pressure to the non-molding area 213 of the circuit board 21, and the covering film 404 is located between the pressing surface 4011 of the first mold 401 and the non-molding area 213 of the circuit board 21 to prevent the pressing surface 4011 of the first mold 401 from scratching the circuit board connector 214 located in the non-molding area 213. It should be understood that in some other embodiments of the present invention, the molding mold 400 may not include the covering film 404, so that when the mold is closed, the pressing surface 4011 of the first mold 401 directly presses the non-molding area 213 of the circuit board 21.

[0135] In addition, if Figure 4C As shown, the covering film 404 is preferably made of a material with a certain elasticity such as plastic, rubber, polymer material, etc., so that the covering film 404 can also absorb the impact force generated at the moment when the pressing surface 4011 of the first mold 401 contacts the circuit board 21 when the first mold 401 and the second mold 402 are closed, thereby avoiding damage to the circuit board 21 caused by the closing of the first mold 401 and the second mold 402.

[0136] It should be understood that since the circuit board connector 214 located in the non-molded area 213 usually protrudes from the upper surface of the circuit board 21, the pressing surface 4011 of the first mold 401 cannot be tightly pressed on the non-molded area 213 of the circuit board 21, and the covering film 404 can be deformed to prevent a gap from being generated between the pressing surface 4011 of the first mold 401 and the non-molded area 213 of the circuit board 21, so as to avoid the molding material entering between the pressing surface 4011 of the first mold 401 and the non-molded area 213 of the circuit board 21 and covering the non-molded area 213 of the circuit board 21 during the molding process.

[0137] It is worth noting that in some other embodiments of the present invention, the molding mold 400 also has a receiving groove arranged on the pressing surface 4011 of the first mold 401, wherein the receiving groove corresponds to the circuit board connector 214 located in the non-molding area 213, so that when the molding mold 400 is in the mold closing state, the circuit board connector 214 is accommodated in the receiving groove, so that the pressing surface 4011 of the first mold 401 can be tightly pressed on the non-molding area 213 of the circuit board 21 to prevent the molding material from entering between the pressing surface 4011 and the non-molding area 213 and covering the non-molding area 213 of the circuit board 21.

[0138] It is worth mentioning that the fluid molding material involved in the present invention can be a liquid material or a solid particle material or a liquid and solid particle mixed material. It can be understood that no matter the molding material is implemented as a liquid material or a solid particle material or a liquid and solid particle mixed material, it can be solidified to form the molding base 23 after being added to the molding space 403 of the molding mold 400. For example, in this specific example of the present invention, the fluid molding material is implemented as a thermosetting material such as a liquid, wherein the molding material is solidified to form the molding base 23 after being added to the molding space 403 of the molding mold 400. It is worth mentioning that when the fluid molding material is added to the molding space 403 of the molding mold 400, the curing method of the fluid molding material does not limit the content and scope of the present invention.

[0139] In addition, the molding space 403 of the molding mold 400 corresponds to the chip molding area 211, the lens molding area 212 and the connection molding area 215 of the circuit board 21, so that after the molding material added to the molding space 403 is solidified, the chip mounting portion 231 covering the chip molding area 211 of the circuit board 21 is formed, the lens mounting portion 232 covering the lens molding area 212 of the circuit board 21 is formed, and the connection portion 234 covering the connection molding area 215 of the circuit board 21 is formed, so that the connection portion 234 integrally connects the chip mounting portion 231 and the lens mounting portion 232, and the top surface of the chip mounting portion 231 is defined as the chip mounting surface 2301, and the top surface of the lens mounting portion 232 is defined as the lens mounting surface 2302.

[0140] More specifically, if Figure 4B and Figure 4CAs shown, during the molding process, the pressing surface 4011 of the first mold 401 of the molding mold 400 is pressed against the non-molding area 213 of the circuit board 21, and the non-molding area 213 is located between the lens molding area 212 and the chip molding area 211 of the circuit board 21, so as to flatten the circuit board 21, thereby ensuring the flatness of the circuit board 21, and also ensuring the flatness of the entire molding base surface during the molding process. It should be understood that in order to further flatten the circuit board 21, in the embodiment described later, the first mold 401 also has a pressing head (not shown in the figure), wherein the pressing head of the first mold 401 corresponds to the center position of the circuit board 21 (that is, corresponds to the center part of the chip molding area 211 of the circuit board 21), so that when the mold is in the closed state, the pressing head of the first mold 401 is pressed against the center position of the circuit board 21 to ensure the overall flatness of the circuit board 21, thereby ensuring the flatness of the molding base surface.

[0141] In addition, if Figure 4A and Figure 4BAs shown, the molding space 403 of the molding mold 400 includes a chip mounting part molding space 4031, a lens mounting part molding space 4032 and two connection part molding spaces 4033, wherein in the mold closing state, the chip mounting part molding space 4031 corresponds to the chip molding area 211 of the circuit board 21, the lens mounting part molding space 4032 corresponds to the lens molding area 212 of the circuit board 21, each connection part molding space 4033 corresponds to the connection molding area 215 of the circuit board 21, and each connection part molding space 4033 is connected to the chip mounting part molding space 4031 and the lens mounting part molding space 4032, so that the connection part molding space 4033 forms a connecting channel between the chip mounting part molding space 4031 and the lens mounting part molding space 4032. Therefore, when the molding material is injected into the molding space 403, the molding material can flow from the lens mounting part molding space 4032 into the chip mounting part molding space 4031 through the connecting part molding space 4033 to fill the molding space 403, and form the molding base 23 with an integrated structure after the molding material is solidified. That is to say, the chip mounting part 231 and the lens mounting part 232 of the molding base 23 can be manufactured by only one molding to ensure that the chip mounting surface 2301 and the lens mounting surface 2302 of the molding base 23 are parallel to each other. It should be understood that if the chip mounting portion 231 and the lens mounting portion 232 of the molding base 23 are made separately by two moldings, due to the inevitable differences in the degree of pressing of the circuit board each time, the pressing position, the material of the molding material and other factors, the chip mounting surface 2301 and the lens mounting surface 2302 of the molding base 23 will not be able to remain parallel to each other, which will cause great trouble and inconvenience to the subsequent assembly process.

[0142] Furthermore, the first mold 401 of the molding mold 400 is also provided with at least one escaping hole (not shown in the figure) to discharge the gas in the molding space 403 of the molding mold 400, so as to prevent the molding material from failing to fill the molding space 403 due to the inability to discharge the gas in the molding space 403. In particular, the escaping hole is provided on the outside of the chip mounting portion 231 of the first mold 401 to discharge the gas in the molding space 4031 of the chip mounting portion and the molding space 4033 of the connection portion, thereby ensuring that the molding material fills the molding space 4031 of the chip mounting portion and the molding space 4033 of the connection portion. Preferably, the escaping hole is located at a position away from the circuit board connector 214 of the circuit board 21, so as to prevent the molding material from rushing out of the escaping hole and covering the circuit board connector 214.

[0143] It is worth noting that since the top surface of the chip mounting portion 231 and the top surface of the lens mounting portion 232 of the molding base 23 both correspond to the inner surface of the first mold 401, that is, the chip mounting surface 2301 and the lens mounting surface 2302 of the molding base 23 both correspond to the inner surface of the first mold 401, the flatness and parallelism of the inner surface of the first mold 401 can ensure that the chip mounting surface 2301 and the lens mounting surface 2302 of the molding base 23 have high flatness and parallelism for subsequent assembly and calibration.

[0144] Attached Figure 5 FIG. 2 shows a first variant implementation of the molded photosensitive component 20 according to the first preferred embodiment of the present invention, wherein the molded base 23 of the molded photosensitive component 20 includes only one connecting portion 234. Figure 5 As shown, the connection portion 234 integrally connects the chip mounting portion 231 and the lens mounting portion 232, and the connection portion 234 is located on one side (e.g., the front side) of the chip mounting portion 231, so that the reserved space 233 of the mold base 23 is located on the remaining three sides (e.g., the left side, the right side, and the rear side) of the chip mounting portion 231. In other words, the non-molding area 213 of the circuit board 21 is located on the left side, the right side, and the rear side of the chip mounting portion 231.

[0145] Attached Fig. 6A and Figure 6B A second variant implementation of the molded photosensitive component 20 according to the first preferred embodiment of the present invention is shown, wherein the connecting portion 234 of the molded base 23 of the molded photosensitive component 20 has a chip connecting end 2341 and a lens connecting end 2342, wherein the chip connecting end 2341 of the connecting portion 234 is integrally connected to the chip mounting portion 231, the lens connecting end 2342 of the connecting portion 234 is integrally connected to the lens mounting portion 232, and the connecting portion 234 gradually extends from the lens connecting end 2342 to the chip connecting end 2341, so that the thickness of the connecting portion 234 at the lens connecting end 2342 is greater than the thickness of the chip connecting end 2341 of the connecting portion 234, so as to prevent the connecting portion 234 from protruding from the chip mounting surface 2301 while enhancing the connection strength and anti-deformation ability of the connecting portion 234, so as to stably maintain the chip mounting surface 2301 and the lens mounting surface 2302 with good parallelism.

[0146] In addition, since the connecting portion 234 gradually extends from the lens connecting end 2342 to the chip connecting end 2341, that is, the thickness of the connecting portion 234 at the lens connecting end 2342 is greater than the thickness of the chip connecting end 2341 of the connecting portion 234, the portion of the molding space 403 of the molding mold 400 corresponding to the connecting portion 234 is also gradually contracted, so that the molding material injected into the molding space 403 flows from the portion corresponding to the lens mounting portion 232 to the portion corresponding to the chip mounting portion 231, so that the molding material can easily fill the entire molding space 403 and solidify on the circuit board 21 to form the molding base 23.

[0147] According to another aspect of the present invention, the present invention further provides a method for manufacturing a camera module. Specifically, Figure 7 As shown, the manufacturing method of the camera module 1 includes the steps of:

[0148] S1: forming a mold base 23 on a circuit board 21 by a molding process, wherein the mold base 23 provides a flat chip mounting surface 2301 and a lens mounting surface 2302;

[0149] S2: Mounting a photosensitive element 22 on the chip mounting surface 2301 of the mold base 23, and keeping the photosensitive surface 220 of the photosensitive element 22 parallel to the lens mounting surface 2302; and

[0150] S3: conductively connecting the photosensitive element 22 and the circuit board 21 to form the molded photosensitive component 20.

[0151] Preferably, in the step S1 , the chip mounting surface 2301 and the lens mounting surface 2302 of the molding base 23 are parallel to each other.

[0152] More specifically, the step S1 comprises the steps of:

[0153] Placing the circuit board 21 in a second mold 402 of a molding mold 400;

[0154] Clamping a first mold 401 and a second mold 402 of the molding mold 400 to form a molding space 403 of the molding mold 400 between the first mold 401 and the second mold 402; and

[0155] A molding material is added into the molding space 403 of the molding mold 400 to form the molding base 23 located on the circuit board 21 after the molding material is solidified.

[0156] It is worth noting that, in the step S1, the following steps are also included:

[0157] The first mold 401 is pressed onto a non-molding area 213 of the circuit board 21 by means of a pressing surface 4011 of the first mold 401;

[0158] Correspondingly, a chip mounting portion forming space 4031 is formed in a chip molding area 211 of the circuit board 21;

[0159] Correspondingly, a lens mounting portion molding space 4032 is formed in a lens molding area 212 of the circuit board 21 , wherein the non-molding area 213 is located between the chip molding area 211 and the lens molding area 212 ; and

[0160] Correspondingly, a connection portion molding space 4033 is formed in a connection molding area 215 of the circuit board 21, wherein the connection portion molding space 4033 connects the chip mounting portion molding space 4031 and the lens mounting portion molding space 4032 to form the molding space 403 with an integrated structure.

[0161] Preferably, in said step S1, the steps of:

[0162] In the lens mounting portion molding space 4032 , a lens mounting portion 232 is formed to cover the lens molding area 212 of the circuit board 21 , so that the top surface of the lens mounting portion 232 forms the lens mounting surface 2302 ;

[0163] In the chip mounting portion molding space 4031 , a chip mounting portion 231 covering the chip molding area 211 of the circuit board 21 is formed, so that the top surface of the chip mounting portion 231 forms the chip mounting surface 2301 ; and

[0164] In the connection molding space 4033 , a connection portion 234 covering the connection molding area 215 of the circuit board 21 is formed, wherein the connection portion 234 is integrally connected to the chip mounting portion 231 and the lens mounting portion 232 to form the molding base 23 with an integrated structure.

[0165] More preferably, in said step S1, the steps of:

[0166] pouring the molding material into the lens mounting portion molding space 4032 of the molding space 403; and

[0167] Through the connection part molding space 4033, the molding material is guided to flow from the lens mounting part molding space 4032 into the chip mounting part molding space 4031, so that the molding material fills the molding space 403. Further, as Figure 7 As shown, the manufacturing method of the camera module 1 also includes the steps of:

[0168] S4: Install an optical lens 10 to the lens mounting surface 2302 of the molding base 23, and make the optical axis of the optical lens 10 perpendicular to the photosensitive surface 220 of the photosensitive element 22 to manufacture the camera module 1.

[0169] Specifically, referring to the accompanying drawings Figure 8 As shown, a molded photosensitive component 20A according to a second preferred embodiment of the present invention is shown. Compared with the first preferred embodiment according to the present invention, the difference of the molded photosensitive component 20A according to the second preferred embodiment of the present invention is that the chip mounting portion 231A of the molded base 23A of the molded photosensitive component 20A includes at least two sub-chip mounting portions 2311A spaced apart from each other, and a separation gap 2312A is formed between adjacent sub-chip mounting portions 2311A, so as to alleviate the stress applied by the circuit board 21 to the chip mounting portion 231A through the separation gap 2312A, and disperse the stress exerted on the chip mounting portion 231A to the at least two sub-chip mounting portions 2311A, so as to reduce the stress exerted on each sub-chip mounting portion 2311A, thereby avoiding deformation of each sub-chip mounting portion 2311A, so that the chip mounting portion 231A of the molded base 23A will not deform with the deformation of the circuit board 21, so as to ensure that the chip mounting surface 2301 remains parallel to the lens mounting surface 2302. In addition, each of the sub-chip mounting portions 2311A is integrally connected to the lens mounting portion 232 via the corresponding connecting portion 234 , so that the molding base 23A has an integrated structure, which facilitates forming the molding base 23A through one-time molding.

[0170] For example, Figure 8 As shown, the separation gap 2312A of the chip mounting portion 231A is arranged in an "I" shape to separate the chip mounting portion 231A into two front and rear sub-chip mounting portions 2311A, wherein the circuit board 21 can be deformed in a concentrated manner at the separation gap 2312A to reduce the concentrated stress applied by the circuit board 21 to the sub-chip mounting portion 2311A, so that the sub-chip mounting portion 2311A will not be deformed due to the smaller concentrated stress, thereby effectively preventing the chip mounting portion 231A from being deformed due to the larger stress.

[0171] Furthermore, Fig. 9A first variant implementation of the molded photosensitive component 20A according to the second preferred embodiment of the present invention is shown, wherein the separation gap 2312A of the chip mounting portion 231A of the molded base 23A of the molded photosensitive component 20A is arranged in a "cross" shape to separate the chip mounting portion 232A into four sub-chip mounting portions 2311A, wherein the molded base 23A has two connecting portions 234, wherein the four sub-chip mounting portions 2311A are grouped in pairs, and each group of sub-chip mounting portions 231A is integrally connected to the lens mounting portion 232 through one of the connecting portions 234, thereby increasing the volume of the separation gap 2312A of the molded base 23A to further alleviate the stress applied by the circuit board 21 to the chip mounting portion 231A, while also ensuring that the molded base 23A still has an integrated structure to keep the chip mounting surface 2301 and the lens mounting surface 2302 parallel.

[0172] In addition, Fig.10 A second variant implementation of the molded photosensitive component 20A according to the second preferred embodiment of the present invention is shown, wherein the molded base 23A of the molded photosensitive component 20A has four connecting parts 234, wherein each of the connecting parts 234 integrally connects the corresponding sub-chip mounting part 2311A and the lens mounting part 232 to ensure that the molded base 23A has an integrated structure.

[0173] It is worth noting that since the separation gap 2312A of the chip mounting portion 231A of the molding base 23A is a gap or a blank space, that is, during the molding process, the separation gap 2312A is not filled with the molding material, and the separation gap 2312A corresponds to the chip molding area 211 of the circuit board 21, therefore, during the molding process, the first mold 401 of the molding mold 400 is directly pressed on the chip molding area 211 of the circuit board 21 through the separation gap 2312A, so as to keep the circuit board 21 stably and flatly in the molding mold 400, thereby effectively preventing the circuit board 21 from tilting or deforming due to uneven force, so as to obtain a higher quality molding base 23A.

[0174] Of course, in some other embodiments of the present invention, the separation gap 2312A can also be set in an "X" shape or a "M" shape to separate the chip mounting portion 231A into a plurality of sub-chip mounting portions 2311A, and reduce the stress applied by the circuit board 21 to the chip mounting portion 231A in other directions through the separation gap 2312A. It should be understood that the shape of the first mold 401 is designed and manufactured according to the shape of the molding base 23A. The corresponding first mold 401 is manufactured and used according to the desired molding base 23A. In the present invention, the shape of the first mold 401 is not limited.

[0175] It is worth noting that in the second preferred embodiment of the present invention, except for the above-mentioned structural differences, the other structures of the molded photosensitive component 20A are the same as the structures of the molded photosensitive component 20 according to the first preferred embodiment of the present invention, and the molded photosensitive component 20A also has various deformation implementations that are similar to or the same as the various deformation implementations of the molded photosensitive component 20 of the first preferred embodiment, which will not be repeated here.

[0176] Since the adhesive material has a certain fluidity before being cured to form the adhesive layer 26, the thickness of the adhesive layer 26 is uneven due to the flow of the adhesive material, which can easily cause the photosensitive surface 220 of the photosensitive element 22 to tilt, thereby reducing the parallelism between the photosensitive surface 220 of the photosensitive element 22 and the chip mounting surface 2301. Therefore, in order to ensure that the photosensitive surface 220 of the photosensitive element 22 maintains a good parallel relationship with the chip mounting surface 2301, the present invention prevents the photosensitive surface 220 of the photosensitive element 22 from tilting by providing a receiving groove for accommodating the adhesive material to suppress the flow of the adhesive material.

[0177] Specifically, Fig.11A and Fig. 11BA molded photosensitive component 20B according to a third preferred embodiment of the present invention is shown. Compared with the first preferred embodiment according to the present invention, the difference of the molded photosensitive component 20B according to the second preferred embodiment of the present invention is that the chip mounting portion 231B of the molded base 23B of the molded photosensitive component 20B has at least one accommodating groove 2313B, wherein each of the accommodating grooves 2313B is recessed downward from the chip mounting surface 2301 to form a groove for accommodating the adhesive layer 26, so that the photosensitive element 22 can be fixedly mounted on the chip mounting portion 231B through the adhesive layer 26, so that the photosensitive element 22 is tightly attached to the chip mounting surface 2301 of the chip mounting portion 231B, so as to stably keep the photosensitive surface 220 of the photosensitive element 22 parallel to the chip mounting surface 2301, so as to prevent the photosensitive surface 220 of the photosensitive element 22 mounted on the chip mounting surface 2301 from tilting due to the flow of the viscous material forming the adhesive layer 26. In other words, when the photosensitive element 22 is mounted on the chip mounting portion 231B, the adhesive layer 26 bonds the photosensitive element 22 to the chip mounting portion 231B, and the chip mounting surface 2301 of the chip mounting portion 231B supports the photosensitive element 22. Since the chip mounting portion 231B has strong rigidity and flatness, it can ensure that the photosensitive surface 220 of the photosensitive element 22 remains parallel to the chip mounting surface 2301.

[0178] It is worth noting that despite the Fig.11A and Fig. 11B In the following description, the shape of the cross section of the receiving groove 2313B is a circle, and the features and advantages of the receiving groove 2313B of the present invention are explained. It can be understood by those skilled in the art that the following Fig.11A and Fig. 11B The shape of the receiving groove 2313B disclosed in the following description is only an example and does not constitute a limitation on the content and scope of the present invention. For example, in other examples of the molded photosensitive component 20B of the third preferred embodiment of the present invention, the shape of the cross section of each of the receiving grooves 2313B can be implemented as various shapes such as square, rectangle, trapezoid, triangle, ellipse, ring or polygon.

[0179] For example, Fig.11A and Fig. 11BAs shown, the chip mounting portion 231B is provided with a receiving groove 2313B. When the photosensitive element 22 is mounted on the chip mounting surface 2301, the adhesive layer 26 is received in the receiving groove 2313B of the chip mounting portion 231B. The photosensitive element 22 is supported on the chip mounting portion 231B with strong rigidity, so that the adhesive layer 26 will not affect the flatness of the photosensitive surface 220 of the photosensitive element 22, so as to ensure that the photosensitive surface 220 of the photosensitive element 22 remains parallel to the chip mounting surface 2301.

[0180] Preferably, if Fig. 11B As shown, the receiving groove 2313B is located at the center of the chip mounting portion 231B, so that the adhesive layer 26 received in the receiving groove 2313B applies a uniform adhesive force to the photosensitive element 22 to prevent the photosensitive element 22 from warping due to uneven force.

[0181] It is worth noting that since the receiving groove 2313B of the chip mounting portion 231A of the molding base 23A is a through-hole groove, and the receiving groove 2313B corresponds to the center position of the chip molding area 211 of the circuit board 21, that is, during the molding process, the receiving groove 2313B is not filled with the molding material. Therefore, during the molding process, the first mold 401 of the molding mold 400 is directly pressed on the center position of the chip molding area 211 of the circuit board 21 through the receiving groove 2313B, so as to keep the circuit board 21 stably and flatly in the molding mold 400, thereby effectively preventing the circuit board 21 from tilting or deforming due to uneven force, so as to obtain a higher quality molding base 23A.

[0182] It should be understood that in some other embodiments of the present invention, the chip mounting portion 231B is provided with two or more receiving grooves 2313B, and all of the receiving grooves 2313B are evenly arranged in an array to ensure that the adhesive layer 26 accommodated in the receiving grooves 2313B applies a uniform adhesive force to the photosensitive element 22.

[0183] Attached Fig. 12A and Fig. 12BA first variant implementation of the molded photosensitive component 20B according to the third preferred embodiment of the present invention is shown, wherein the chip mounting portion 231B of the molded base 23B of the molded photosensitive component 20B includes two receiving grooves 2313B, and each of the receiving grooves 2313B is arranged in concentric rings, that is, the two receiving grooves 2313B are arranged in a surrounding manner (one receiving groove 2313B surrounds the other receiving groove 2313B, that is, forming a ring-shaped structure) on the chip mounting portion 231B, so that while the adhesive layer 26 accommodated in the receiving groove 2313B applies a uniform adhesive force to the photosensitive element 22, the chip mounting surface 2301 of the chip mounting portion 231B applies a uniform supporting force to the photosensitive element 22 to prevent the photosensitive element 22 from warping due to uneven force.

[0184] It should be understood that although the Fig. 12A and Fig. 12B In the description of the modified embodiment, the chip mounting portion 231B including two receiving grooves 2313B is taken as an example to illustrate the features and advantages of the chip mounting portion 231B of the present invention. It can be understood by those skilled in the art that the attached Fig. 12A and Fig. 12B The chip mounting portion 231B disclosed in the description of the variant embodiment is for example only and does not constitute a limitation on the content and scope of the present invention. For example, in other examples of the molded photosensitive component 20B of the first variant embodiment of the third preferred embodiment of the present invention, the number of the accommodating grooves 2313B may also exceed two to form grooves that are nested in annular shapes.

[0185] Attached FIG. 13A to FIG. 13C A second variant implementation of the molded photosensitive component 20B according to the third preferred embodiment of the present invention is shown, wherein the receiving groove 2313B is recessed downward from the chip mounting surface 2301 to the circuit board 21 to form a through-hole groove for accommodating the adhesive layer 26, wherein when the photosensitive element 22 is mounted on the chip mounting portion 231B, the adhesive layer 26 bonds the photosensitive element 22, the chip mounting portion 231B and the circuit board 21 together, so as to fix the photosensitive element 22 on the chip mounting surface 2301. In other words, Fig. 13BAs shown, the receiving groove 2313B is disposed through the chip mounting portion 231B, and the upper opening of the receiving groove 2313B is located at the chip mounting surface 2301, and the lower opening of the receiving groove 2313B corresponds to the circuit board 21, so that the adhesive layer 26 accommodated in the receiving groove 2313B can contact the photosensitive element 22, the chip mounting portion 231B and the circuit board 21 at the same time, so as to bond the photosensitive element 22, the chip mounting portion 231B and the circuit board 21 together.

[0186] It is worth noting that since the receiving groove 2313B is implemented as a through-hole groove, Fig. 13C As shown, during the molding process, a pressing head 4012 of the first mold 401 of the molding mold 400 will press a portion of the chip molding area 211 of the circuit board 21, so that the pressing head 4012 of the first mold 401 and the pressing surface 4011 cooperate with each other to ensure the overall flatness of the circuit board 21, so as to provide a flat molding base surface for the molding process of the molding base 23, and ensure that the chip mounting surface 2301 of the molding base 23 has good flatness.

[0187] Preferably, the accommodating groove 2313B is located in a central area of ​​the chip mounting portion 231B, that is, the accommodating groove 2313B corresponds to a central part of the chip molding area 211 of the circuit board 21, so that during the molding process, the pressing head 4012 of the first mold 401 is pressed on the central part of the chip molding area 211 of the circuit board 21, and is pressed on the outer side of the chip molding area 211 of the circuit board 21 through the pressing surface 4011 of the first mold 401, so as to further ensure the flatness of the circuit board 21. It should be understood that, since the pressing head 4012 of the first mold 401 is pressed against the central part of the chip molding area 211 during the molding process, and the pressing head 4012 is located in the chip mounting portion molding space 4031, while the molding material is solidified to form the chip mounting portion 231B, the space corresponding to the pressing head 4012 in the chip mounting portion molding space 4031 forms the accommodating groove 2313B of the chip mounting portion 231B due to the absence of molding material. That is, a chip unmolded area is formed in the central part of the chip molding area 211 of the circuit board 21 due to the fact that it is not molded.

[0188] It is worth mentioning that, compared with the first preferred embodiment according to the present invention, in this embodiment of the present invention, the manufacturing method of the molded photosensitive component 20B further includes the steps of:

[0189] A pressing head 4012 of the first mold 401 is pressed against a central portion of the chip molding area 211 of the circuit board 21 to form a receiving groove 2313B located at the chip mounting portion 231B after the molding material is solidified. Fig.14A and Fig. 14B A third variant embodiment of the molded photosensitive component 20B according to the third preferred embodiment of the present invention is shown, wherein the chip mounting portion 231B includes two through-hole type receiving grooves 2313B, and each of the receiving grooves 2313B is arranged in a "U" shape, so that the chip mounting portion 231B is divided into two sub-chip mounting portions 2311B which are nested in a ring through the two receiving grooves 2313B, wherein the two sub-chip mounting portions 2311B are integrally connected to form a chip mounting portion 231B with an integrated structure. In other words, one of the two accommodating grooves 2313B is located at the center of the chip mounting portion 231B, the other of the two accommodating grooves 2313B is located around one of the two accommodating grooves 2313B, and a sub-chip mounting portion 2311B is formed between the two accommodating grooves 2313B, and another sub-chip mounting portion 2311B is formed at the periphery of the other accommodating groove 2313B, wherein the other of the two accommodating grooves 2313B has a "C" shape structure, so that the sub-chip mounting portion 2311B located between the two accommodating grooves 2313B is integrally connected with the other sub-chip mounting portion 2311B, ensuring that the chip mounting portion 231B has an integrated structure so that the chip mounting portion 231B can be formed by one-time molding, thereby ensuring that the chip mounting portion 231B provides a flat chip mounting surface 2301.

[0190] It is worth noting that in the third preferred embodiment of the present invention, except for the above-mentioned structural differences, the other structures of the molded photosensitive component 20B are the same as the structures of the molded photosensitive component 20 according to the first preferred embodiment of the present invention, and the molded photosensitive component 20B also has various deformation implementations that are similar to or the same as the various deformation implementations of the molded photosensitive component 20 of the first preferred embodiment, which will not be repeated here.

[0191] Reference Fig.15A and Fig. 15BAccording to another aspect of the present invention, the present invention further provides an electronic device, wherein the electronic device comprises an electronic device body 500 and at least one camera module 1, wherein each of the camera modules is respectively arranged on the electronic device body 500 for acquiring images. It is worth mentioning that the type of the electronic device body 500 is not limited, for example, the electronic device body 500 can be any electronic device that can be configured with the camera module 1, such as a smart phone, a tablet computer, a laptop computer, an e-book, a personal digital assistant, a camera, etc. It can be understood by those skilled in the art that although the attached Fig.15A and attached Fig. 15B The electronic device body 500 is implemented as a smart phone as an example, but it does not constitute a limitation on the content and scope of the present invention.

[0192] For example, Fig.15A As shown, the camera module 1 is arranged on the electronic device body 500 and faces the front side of the electronic device body 500, so that the camera module 1 serves as a front camera of the electronic device for photographing spatial objects in front of the electronic device body 500.

[0193] In addition, if Fig. 15B As shown, the camera module 1 is arranged on the electronic device body 500 and faces the rear side of the electronic device body 500, so that the camera module 1 serves as a rear camera of the electronic device for photographing spatial objects behind the electronic device body 500.

[0194] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A molded photosensitive component, for assembly with an optical lens into a camera module, characterized in that: include: a circuit board; a photosensitive element, wherein the photosensitive element is conductively connected to the circuit board; as well as A molded base, wherein the molded base is formed on the circuit board in a molding manner and provides a flat chip mounting surface and a flat lens mounting surface, wherein the photosensitive element is correspondingly mounted on the chip mounting surface of the molded base, and the lens mounting surface of the molded base is provided for correspondingly mounting the optical lens so that the optical lens is located in the photosensitive path of the photosensitive element, wherein the molded base comprises a chip mounting portion having the chip mounting surface, a lens mounting portion having the lens mounting surface, and a plurality of connecting portions, wherein the connecting portion has a lens connecting end and a chip connecting end, wherein the lens connecting end of the connecting portion is integrally connected to the lens mounting portion, and the chip connecting end of the connecting portion is integrally connected to the chip mounting portion, wherein the connecting portion gradually extends from the lens connecting end to the chip connecting end.

2. The molded photosensitive component according to claim 1, wherein: The chip mounting surface and the lens mounting surface provided by the mold base are parallel to each other.

3. The molded photosensitive component as described in claim 2, wherein the lens mounting portion is located around the chip mounting portion.

4. The molded photosensitive component according to claim 3, wherein: The circuit board is provided with a chip molding area, a lens molding area, a non-molding area and at least one group of circuit board connectors, wherein the lens molding area is located around the chip molding area, the non-molding area is located between the chip molding area and the lens molding area, each group of circuit board connectors is arranged in the non-molding area of ​​the circuit board, and after molding on the circuit board, the chip mounting portion of the molding base is covered on the chip molding area of ​​the circuit board, and the lens mounting portion of the molding base is covered on the lens molding area of ​​the circuit board.

5. The molded photosensitive component according to claim 4, wherein: The circuit board is also provided with a connection molding area, wherein the connection molding area is located between the lens molding area and the chip molding area, and connects the lens molding area and the chip molding area. After molding on the circuit board, the connection portion of the molding base is covered on the connection molding area of ​​the circuit board to combine the lens mounting portion and the chip mounting portion into one through the connection portion.

6. The molded photosensitive component according to claim 3, wherein: The chip mounting portion has a thickness smaller than that of the lens mounting portion.

7. The molded photosensitive component according to claim 4, wherein: The chip mounting portion has a thickness smaller than that of the lens mounting portion.

8. The molded photosensitive component according to claim 5, wherein: The chip mounting portion has a thickness smaller than that of the lens mounting portion.

9. The molded photosensitive component according to claim 5, wherein: The chip mounting portion of the mold base includes at least two sub-chip mounting portions spaced apart from each other, and a separation gap is formed between adjacent sub-chip mounting portions, wherein each sub-chip mounting portion is integrally connected to the lens mounting portion through the corresponding connecting portion.

10. The molded photosensitive component according to claim 9, wherein: The separation gap is arranged in a straight line shape to separate the chip mounting portion into two sub-chip mounting portions.

11. The molded photosensitive component according to claim 9, wherein: The separation gap is arranged in a "cross" shape to separate the chip mounting part into four sub-chip mounting parts.

12. The molded photosensitive component according to claim 11, wherein: The four sub-chip mounting parts are grouped in pairs, and each group of the sub-chip mounting parts is integrally connected to the lens mounting part through the same connecting part.

13. The molded photosensitive component as described in any one of claims 3 to 5, further comprising an adhesive layer, wherein the chip mounting portion of the molded base comprises at least one accommodating groove, and each of the accommodating grooves is recessed downward from the chip mounting surface to form a groove for accommodating the adhesive layer, so that the photosensitive element can be fixedly mounted on the chip mounting surface of the chip mounting portion through the adhesive layer.

14. The molded photosensitive component of claim 13, wherein: Each of the receiving grooves is arranged in an array on the chip mounting portion.

15. The molded photosensitive component of claim 13, wherein: Each of the receiving grooves is disposed on the chip mounting portion in a surrounding arrangement.

16. The molded photosensitive component of claim 13, wherein: Each of the accommodating grooves extends downward from the chip mounting surface to the circuit board to form a through-hole type groove, so as to bond the photosensitive element, the chip mounting portion and the circuit board together through the adhesive layer.

17. The molded photosensitive component of claim 16, wherein: Each of the accommodating grooves is arranged in a "U" shape, so that the chip mounting part is divided into two sub-chip mounting parts through the accommodating groove, wherein the two sub-chip mounting parts are integrally connected to form the chip mounting part with an integrated structure.

18. The molded photosensitive assembly as described in claim 4 or 5 further includes a group of electronic components, wherein the electronic components are mounted at intervals on the lens molding area of ​​the circuit board so as to be covered by the lens mounting portion of the molded base.

19. The molded photosensitive component as described in claim 4 or 5 further includes at least one group of leads, wherein the photosensitive element includes a photosensitive area, a non-photosensitive area and at least one group of chip connectors, wherein the non-photosensitive area is located around the photosensitive area, and each group of chip connectors is respectively arranged in the non-photosensitive area of ​​the photosensitive element to conductively connect the chip connectors with the corresponding circuit board connectors through the leads.

20. The molded photosensitive component according to any one of claims 1 to 5, wherein: The chip mounting surface of the mold base is lower than the lens mounting surface.

21. A camera module, characterized in that: include: an optical lens; and A molded photosensitive component as described in any one of claims 1 to 20, wherein the optical lens is correspondingly mounted on the lens mounting surface of the molded photosensitive component, wherein the optical axis of the optical lens is perpendicular to the photosensitive surface of the photosensitive element.

22. An electronic device, characterized in that: include: an electronic device body; and At least one camera module, wherein the camera module is arranged on the electronic device body for acquiring images, wherein the camera module is the camera module as described in claim 21.

23. A method for manufacturing a molded photosensitive component, characterized in that: Includes steps: A mold base is formed on a circuit board by a molding process, wherein the mold base provides a flat chip mounting surface and a flat lens mounting surface; Mounting a photosensitive element to the chip mounting surface of the mold base; as well as Conductively connecting the photosensitive element and the circuit board to form a molded photosensitive component, The step of forming a molded base on a circuit board by a molding process, wherein the molded base provides a flat chip mounting surface and a flat lens mounting surface, comprises the following steps: Placing the circuit board in a second mold of a molding mold; Clamping a first mold and the second mold of the molding mold to form a molding space of the molding mold between the first mold and the second mold; and adding a molding material into the molding space of the molding mold to integrally form the molding base on the circuit board after the molding material is solidified, The step of closing a first mold and a second mold of the molding mold to form a molding space of the molding mold between the first mold and the second mold comprises the following steps: Pressing a non-molding area of ​​the circuit board with a pressing surface of the first mold; Correspondingly forming a chip mounting portion forming space in a chip molding area of ​​the circuit board; Correspondingly forming a lens mounting portion molding space in a lens molding area of ​​the circuit board, wherein the non-molding area is located between the chip molding area and the lens molding area; and A connection part molding space is correspondingly formed in a connection molding area of ​​the circuit board, wherein the connection part molding space connects the chip mounting part molding space and the lens mounting part molding space to form the molding space with an integrated structure. The step of adding a molding material to the molding space of the molding mold to integrally form the molding base on the circuit board after the molding material is solidified comprises the following steps: In the lens mounting portion molding space, a lens mounting portion is formed to cover the lens molding area of ​​the circuit board, so that the top surface of the lens mounting portion forms the lens mounting surface; forming a chip mounting portion covering the chip molding area of ​​the circuit board in the chip mounting portion molding space, so that the top surface of the chip mounting portion forms the chip mounting surface; and In the connection part molding space, a plurality of connection parts are formed which are covered in the connection molding area of ​​the circuit board, wherein the connection parts are integrally connected to the chip mounting part and the lens mounting part to form the molding base with an integrated structure, wherein the connection parts have a lens connection end and a chip connection end, wherein the lens connection end of the connection part is integrally connected to the lens mounting part, and the chip connection end of the connection part is integrally connected to the chip mounting part, wherein the connection part gradually extends from the lens connection end to the chip connection end.

24. The method for manufacturing a molded photosensitive component as claimed in claim 23, further comprising the steps of: A pressing head of the first mold is pressed on a central portion of the chip molding area of ​​the circuit board.

25. The method for manufacturing a molded photosensitive component as claimed in claim 24, further comprising the steps of: After the molding material is solidified, a receiving groove is formed at the chip mounting portion.

26. The method for manufacturing a molded photosensitive component as claimed in claim 24, further comprising the steps of: After the molding material is solidified, a separation gap is formed at the chip mounting portion, wherein the separation gap separates the chip mounting portion into at least two sub-chip mounting portions spaced apart from each other.

27. The method for manufacturing a molded photosensitive component according to claim 23, wherein: The step of adding a molding material to the molding space of the molding mold to integrally form the molding base on the circuit board after the molding material is solidified comprises the steps of: pouring the molding material into the lens mounting portion molding space of the molding space; and The molding material is guided to flow from the lens mounting portion molding space into the chip mounting portion molding space through the connection portion molding space, so that the molding material fills the molding space.

28. The method for manufacturing a molded photosensitive component according to claim 23, wherein: The chip mounting surface and the lens mounting surface are parallel to each other.

29. The method for manufacturing a molded photosensitive component according to claim 23, wherein: The chip mounting surface is lower than the lens mounting surface.

Images