Display Devices

Abstract

The present disclosure relates to a display device, which includes: a substrate on which a first indented portion indented inwardly along one side of the substrate is formed; a first pad unit and a second pad unit, the first pad unit and the second pad unit being spaced apart from each other along the one side on the substrate; a display unit, the display unit being above the substrate and having a shape indented inwardly between the first pad unit and the second pad unit; an encapsulation unit, the encapsulation unit encapsulating the display unit; and a wiring film, the wiring film being bent from the first surface of the substrate to the second surface of the substrate, the wiring film including a third pad unit and a fourth pad unit respectively connected to the first pad unit and the second pad unit and a second indented portion indented inwardly between the third pad unit and the fourth pad unit.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2018-0077320, filed on Jul. 3, 2018, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Exemplary embodiments of the present invention generally relate to a display apparatus, and more particularly, to a display apparatus including a display unit having an indented shape. Background Art

[0004] There has been an increasing demand for large screens for portable display devices including display units, such as mobile phones, tablet personal computers, and game consoles.

[0005] Meanwhile, in order to meet various consumer demands, various components for expanding and supporting functions of the portable display device, such as a camera module, a speaker, and a sensor, need to be mounted on the portable display device.

[0006] The above information disclosed in this Background section is only for understanding of the background of the inventive concept and therefore the above information may contain information that does not constitute the prior art. Summary of the invention

[0007] Implementing a large number of components while also meeting the needs of a large screen is not easy.

[0008] The device constructed according to the exemplary embodiment of the present invention can realize a large screen while being able to mount various components.

[0009] Additional features of the inventive concepts will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concepts.

[0010] According to one or more exemplary embodiments, a display device includes: a substrate on which a first indented portion indented inwardly along one side of the substrate is formed; a first pad unit and a second pad unit, the first pad unit and the second pad unit being spaced apart from each other along the one side on the substrate; a display unit, the display unit being above the substrate and having a shape indented inwardly between the first pad unit and the second pad unit; an encapsulation unit, the encapsulation unit encapsulating the display unit; and a wiring film, the wiring film being bent from a first surface of the substrate to a second surface of the substrate, the wiring film including a third pad unit and a fourth pad unit respectively connected to the first pad unit and the second pad unit and a second indented portion indented inwardly between the third pad unit and the fourth pad unit.

[0011] The encapsulation unit may include at least one inorganic layer and at least one organic layer.

[0012] The encapsulation unit may include at least one inorganic layer and at least one organic layer, an outermost layer of the encapsulation unit may include an inorganic layer, and the inorganic layer included in the outermost layer may cover a side surface of the at least one organic layer.

[0013] The encapsulation unit may include at least one inorganic layer and at least one organic layer, an outermost layer of the encapsulation unit may include an inorganic layer, and the inorganic layer included in the outermost layer may cover a side surface of the substrate in which the first recessed portion is formed.

[0014] A test dummy pixel may be further arranged outside the display unit along the first indented portion.

[0015] The wiring film may further include an integrated circuit chip, wherein the integrated circuit chip may be arranged so as not to overlap with the display unit.

[0016] The wiring film may further include a ground portion grounded to the wiring film along the second retracted portion.

[0017] A transparent substrate may also be arranged above the packaging unit.

[0018] A black matrix may be further arranged above the transparent substrate at a position corresponding to an outer edge of the display unit.

[0019] The black matrix may have a first opening at a position corresponding to the first recessed portion.

[0020] The transparent substrate may have a second opening at a position corresponding to the first opening.

[0021] The display device may further include a polarizer film between the encapsulation unit and the transparent substrate.

[0022] The display device may further include an adhesive layer between the polarizer film and the transparent substrate.

[0023] The display device may further include a filler between the substrate and the transparent substrate, the filler being spaced apart from the adhesive layer and surrounding an outer edge of the display unit.

[0024] The display device may further include a cover panel on the second surface of the substrate and including a buffer material.

[0025] In the first setback, an end of the cover panel may be aligned with an end of the substrate.

[0026] In the first recessed portion, an end portion of the cover panel may protrude from an end portion of the base to the outside of the display unit.

[0027] The first pad unit and the second pad unit may include a plurality of pad wirings, wherein the plurality of pad wirings may be obliquely formed so as to be symmetrical with respect to a center of the first recessed portion.

[0028] The third pad unit and the fourth pad unit may include a plurality of pad wirings, wherein the plurality of pad wirings may be obliquely formed so as to be symmetrical with respect to a center of the second recessed portion.

[0029] A maximum depth from an edge of a region in which the wiring film is bent to the second retracted portion may be not less than a maximum depth from an edge of the region in which the wiring film is bent to the first retracted portion.

[0030] A maximum depth from ends of the third and fourth pad units of the wiring film to the second retracted portion may be not less than a maximum depth from an end of the substrate to the first retracted portion.

[0031] According to one or more exemplary embodiments, a display device includes: a substrate on which a first indented portion indented inwardly along one side of the substrate is formed; a first pad unit and a second pad unit, the first pad unit and the second pad unit being spaced apart from each other along the one side on the substrate; a display unit, the display unit being above the substrate and having a shape indented inwardly between the first pad unit and the second pad unit; an encapsulation unit, the encapsulation unit encapsulating the display unit; and a wiring film, the wiring film being bent from a first surface of the substrate to a second surface of the substrate, the wiring film including a third pad unit and a fourth pad unit respectively connected to the first pad unit and the second pad unit, a dummy pad unit connecting the third pad unit and the fourth pad unit, and a through hole formed inwardly along the one side of the substrate.

[0032] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the inventive concept.

[0034] Figure 1A , Figure 1B and Figure 1C is a plan view of a connection process of a substrate and a wiring film in a display device according to an exemplary embodiment.

[0035] Figure 2 It is along Figure 1C A cross-sectional view of a portion of the display device taken along line A1-A2.

[0036] Figure 3 It is along Figure 1C A cross-sectional view of a portion of the display device taken along line B1-B2.

[0037] Figure 4 yes Figure 1A A cross-sectional view of part IV.

[0038] Figure 5A , Figure 5B and Figure 5C is a plan view comparing a display area of ​​a display device according to the inventive concept with a display area of ​​a display device according to a comparative example.

[0039] Figure 6 is a cross-sectional view of a portion of a display device according to another exemplary embodiment.

[0040] Figure 7 is a cross-sectional view of a portion of a display device according to another exemplary embodiment.

[0041] Fig. 8A , Figure 8B , Figure 8C , Fig.8D and Fig. 8E is a plan view illustrating an exemplary embodiment in which the inclination of the wirings of the first and second pad units and the third and fourth pad units increases as the distance of the wirings from the center increases.

[0042] Fig. 9 is a cross-sectional view of a portion of a display device according to another exemplary embodiment.

[0043] Fig.10 is a cross-sectional view of a portion of a display device according to another exemplary embodiment.

[0044] Fig.11 is a cross-sectional view of a portion of a display device according to another exemplary embodiment.

[0045] Fig.12 is a cross-sectional view of a portion of a display device according to another exemplary embodiment.

[0046] Fig.13 is a cross-sectional view of a portion of a display device according to another exemplary embodiment.

[0047] Fig.14 is a cross-sectional view of a portion of a display device according to another exemplary embodiment.

[0048] Fig.15 are views of various shapes of the first indentation.

[0049] Fig.16 are views of various shapes of the second indentation. DETAILED DESCRIPTION

[0050] In the following description, for the purpose of illustration, many specific details are set forth to provide a full understanding of various exemplary embodiments or implementations of the present invention. As used herein, "embodiment" and "implementation" are interchangeable words as non-limiting examples of devices or methods using one or more inventive concepts disclosed herein. However, it is apparent that various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other cases, well-known structures and devices are shown in the form of block diagrams to avoid making various exemplary embodiments unnecessarily obscure. In addition, various exemplary embodiments may be different, but need not be exclusive. For example, without departing from the inventive concept, the specific shape, configuration and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0051] Unless otherwise specified, the illustrated exemplary embodiments will be understood as providing exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects, etc. (hereinafter, individually or collectively referred to as "elements") of the various embodiments may be combined, separated, interchanged and / or rearranged in other ways without departing from the inventive concept.

[0052] The use of cross hatching and / or shading in the drawings is generally provided to make the boundaries between adjacent elements clear. Thus, unless otherwise specified, the presence or absence of cross hatching or shading does not convey or indicate any preference or requirement for the specific material, material properties, size, ratio, commonality between the elements shown, and / or any other characteristics, attributes, or performance of the elements. In addition, in the drawings, the size and relative size of the elements can be magnified for the purpose of clarity and / or description. When the exemplary embodiments can be implemented differently, the specific process sequence can be performed differently from the described order. For example, two continuously described processes can be performed substantially simultaneously or in an order opposite to the described order. In addition, the same reference numerals represent the same elements.

[0053] When an element or layer is described as being "on" another element or another layer, "connected to" another element or another layer, or "bonded to" another element or another layer, the element or layer may be directly on the other element or another layer, directly connected to the other element or another layer, or directly bonded to the other element or another layer, or there may be an intermediate element or intermediate layer. However, when an element or layer is described as being "directly on" another element or another layer, "directly connected to" another element or another layer, or "directly bonded to" another element or another layer, there is no intermediate element or intermediate layer. For this purpose, the term "connection" may refer to a physical connection, an electrical connection, and / or a fluid connection with or without an intermediate element. In addition, the D1 axis, the D2 axis, and the D3 axis are not limited to the three axes of a rectangular coordinate system such as an x-axis, a y-axis, and a z-axis, and may be interpreted in a broader sense. For example, the D1 axis, the D2 axis, and the D3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z such as XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the listed associated items.

[0054] Although the terms "first" and "second" etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, without departing from the teachings of the present disclosure, the first element discussed below may be referred to as the second element.

[0055] For descriptive purposes, spatially relative terms such as "under," "below," "below," "down," "above," "up," "above," "higher," "side" (e.g., as in "sidewall"), etc. may be used herein to describe the relationship of one element to another (or other) elements as shown in the figures. In addition to the orientations depicted in the figures, the spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture. For example, if the device in the figure is turned over, an element described as "under" or "beneath" other elements or other features will subsequently be positioned as "above" the other elements or other features. Thus, the exemplary term "under" may include both above and below orientations. In addition, the device may be otherwise positioned (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0056] The terms used in the text are for the purpose of describing specific embodiments, rather than being intended to be restrictive. As used in the text, unless the context clearly indicates otherwise, the singular forms "one", "a kind of" and "said" are also intended to include plural forms. Moreover, when the term "comprising" is used in this specification, the term description has stated features, integral bodies, steps, operations, elements, assemblies and / or their groups, but does not exclude the existence or addition of one or more other features, other integral bodies, other steps, other operations, other elements, other assemblies and / or their groups. It is also noted that, as used in the text, the terms "substantially", "approximately" and other similar terms are used as approximate terms rather than degree terms, so that the terms "substantially", "approximately" and other similar terms are used to explain the measured values, calculated values ​​and / or the inherent deviations of the values ​​that will be recognized by those of ordinary skill in the art.

[0057] In the text, various exemplary embodiments are described with reference to cross-sectional views and / or exploded views that are schematic diagrams of idealized exemplary embodiments and / or intermediate structures. As such, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances are expected. Therefore, the exemplary embodiments disclosed herein should not necessarily be interpreted as being limited to the specific illustrated shapes of the regions, but will include deviations in shapes due to, for example, manufacturing. In this manner, the regions shown in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and as such, are not necessarily intended to be limiting.

[0058] As is customary in the art, some exemplary embodiments are described and shown in the accompanying drawings in terms of functional blocks, units and / or modules. It will be appreciated by those skilled in the art that these blocks, units and / or modules are physically implemented by electronic (or optical) circuits such as logic circuits, discrete components, microprocessors, hard-wired circuits, storage elements or wiring connectors, and these blocks, units and / or modules can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. In the case where blocks, units and / or modules are implemented by microprocessors or other similar hardware, software (e.g., microcode) can be used to program and control the blocks, units and / or modules to perform the various functions discussed herein, and the blocks, units and / or modules can be optionally driven by firmware and / or software. It is also contemplated that each block, each unit and / or each module can be implemented by dedicated hardware, or as a combination of dedicated hardware that performs some functions and processors (e.g., one or more programmed microprocessors and associated circuits) that perform other functions. In addition, without departing from the scope of the inventive concept, each block, each unit and / or each module of some exemplary embodiments can be physically separated into two or more interactive and discrete blocks, units and / or modules. In addition, without departing from the scope of the inventive concept, the blocks, units and / or modules of some exemplary embodiments can be physically combined into more complex blocks, units and / or modules.

[0059] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure is a part. Unless explicitly defined as such herein, terms such as those defined in general dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense.

[0060] Figure 1A , Figure 1B and Figure 1C is a plan view of a connection process of a substrate 10 and a wiring film 80 in a display device according to an exemplary embodiment, Figure 2 It is along Figure 1C A cross-sectional view of a portion of the display device taken along line A1-A2 of Figure 3 It is along Figure 1C A cross-sectional view of a portion of the display device taken along line B1-B2 of Figure 4 yes Figure 1A A cross-sectional view of part IV.

[0061] Reference Figures 1A to 4According to an exemplary embodiment, a display device 1 includes: a substrate 10, on which a first indentation IP1 indented inwardly along one side of the substrate 10 is formed; a first pad unit 11 and a second pad unit 12, which are spaced apart from each other along the one side on the substrate 10; a display unit 20, which is above the substrate 10 and has a shape indented inwardly between the first pad unit 11 and the second pad unit 12; an encapsulation unit 30, which is used to encapsulate the display unit 20; a third pad unit 81 and a fourth pad unit 82, which are connected to the first pad unit 11 and the second pad unit 12, respectively; a second indentation IP2, which is indented inwardly between the third pad unit 81 and the fourth pad unit 82; and a wiring film 80, which is bent from one surface of the substrate 10 to the other surface of the substrate 10.

[0062] The substrate 10 may be formed of various materials such as a glass material, a metal material, or a plastic material. For example, the substrate 10 may be a flexible substrate including a polymer resin such as polyethersulfone (PES), polyacrylate (PA), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate (PAR), polyimide (PI), polycarbonate (PC), or cellulose acetate propionate (CAP).

[0063] The substrate 10 has a first setback IP1 formed to be setback into the substrate 10 at one side of the substrate 10. The first setback IP1 may be a setback obtained by cutting the substrate 10 using, for example, a cutting method using a laser beam.

[0064] Various components 110 capable of extending the functions of the display device 1, such as a camera module 111, a speaker 112, and a sensor 113, may be arranged in the space in which the substrate 10 is cut. The sensor 113 may include various sensors necessary to extend the functions of the portable display device, such as a proximity sensor, an illumination sensor, an acceleration sensor, and a biosensor.

[0065] On the substrate 10, the first pad unit 11 and the second pad unit 12 are spaced apart from each other along one side of the substrate 10. The first pad unit 11 and the second pad unit 12 are located at both sides of a region in which the first indentation IP1 is formed.

[0066] The first pad unit 11 and the second pad unit 12 include a plurality of wirings including a conductive material. The first pad unit 11 and the second pad unit 12 can transmit signals to the display unit 20 by connecting to various wirings (not shown) such as scan wirings, data wirings, or power wirings, and connecting to a plurality of pixels (not shown) in the display unit 20.

[0067] The display unit 20 may include a plurality of pixels (not shown) capable of displaying an image. Each pixel may include various display devices, such as an organic light emitting device, a liquid crystal device, an electrophoretic device, or a micro inorganic light emitting device. The present exemplary embodiment discloses a display device including ( Figure 4 A display device of an organic light emitting device (OLED).

[0068] In the present exemplary embodiment, the display unit 20 has a display screen in a shape in which one side is indented, rather than a rectangular display screen in which four sides are formed in substantially straight lines. The first indented portion IP1 is formed to maintain a predetermined interval from the edge of the display unit 20 .

[0069] The encapsulation unit 30 is above the display unit 20. The encapsulation unit 30 is formed to be wider than the display unit 20 to cover the edge of the display unit 20 in order to reduce or prevent foreign matter from penetrating into the display unit 20 from the outside of the display apparatus 1.

[0070] exist Figure 1A In the embodiment, the first pad unit 11 and the second pad unit 12 of the substrate 10 and the third pad unit 81 and the fourth pad unit 82 of the wiring film 80 are aligned to correspond to each other, and in Figure 1C In the embodiment, the wiring film 80 is bent from one surface of the substrate 10 to the other surface of the substrate 10 .

[0071] The wiring film 80 may include a flexible resin such as a polyimide resin or an epoxy resin to facilitate bending. The third pad unit 81 and the fourth pad unit 82 of the wiring film 80 include a plurality of wirings including a conductive material.

[0072] A conductive bonding layer (not shown) such as an anisotropic conductive film is provided between the first pad unit 11 of the substrate 10 and the third pad unit 81 of the wiring film 80, and between the second pad unit 12 of the substrate 10 and the fourth pad unit 82 of the wiring film 80, wherein the substrate 10 and the wiring film 80 are physically and firmly bonded and electrically connected to each other by pressing.

[0073] In the present exemplary embodiment, the wiring film 80 includes a second retracted portion IP2 retracted into the wiring film 80 between the third pad unit 81 and the fourth pad unit 82 .

[0074] The second indentation IP2 of the wiring film 80 is formed so as not to interfere with a space in which the component 110 may be arranged when the wiring film 80 is bent after the wiring film 80 is connected to the substrate 10. Figure 1B and Figure 3 , a maximum depth H1 from the edge L0 of the bending area of ​​the wiring film 80 to the second setback IP2 may be formed to be not less than a maximum depth H22 from the edge L0 of the bending area of ​​the wiring film 80 to the first setback IP1 formed in the substrate 10 .

[0075] The integrated circuit chip 100 is mounted in the wiring film 80. Since the integrated circuit chip 100 is further back than the second indentation IP2, the integrated circuit chip 100 is in a region overlapping the display unit 20 even when bent and does not interfere with a space in which the component 110 may be arranged.

[0076] The integrated circuit chip 100 may include at least one of a scan driving circuit chip, a data driving circuit chip, and a power driving circuit chip.

[0077] A plurality of wirings (not shown) are between the integrated circuit chip 100 and the third and fourth pad units 81 and 82 so that the signal of the integrated circuit chip 100 is supplied to the display unit 20 through the first and second pad units 11 and 12 .

[0078] The cover panel 70 for supporting the substrate 10 is between the substrate 10 and the wiring film 80. The wiring film 80 is bent to the rear surface of the cover panel 70 on the rear surface of the substrate 10.

[0079] The cover panel 70 may include a buffer tape layer (not shown) for absorbing impact on the rear surface of the substrate 10 and a black tape layer (not shown) for preventing light leakage from the rear surface of the substrate 10 .

[0080] Although Figure 3 The present exemplary embodiment shows that the end of the cover panel 70 is aligned with the end of the substrate 10 at the first indentation IP1, but the inventive concept is not limited thereto. At the first indentation IP1, the end of the cover panel 70 may be more inwardly indented than the end of the substrate 10, or may protrude more outwardly than the end of the substrate 10. This will be described later below.

[0081] In the present exemplary embodiment, when the end of the cover panel 70 is aligned with the end of the substrate 10 at the first indentation IP1 , the space in which the component 110 may be arranged may be maximized while stably supporting the substrate 10 .

[0082] The wiring film 80 may further include a fifth pad unit 83 and a sixth pad unit 84 at a side opposite to the third pad unit 81 and the fourth pad unit 82 .

[0083] The fifth pad unit 83 and the sixth pad unit 84 may be connected to a flexible printed circuit board (not shown). The wiring film 80 is formed of a material more flexible than the flexible printed circuit board (not shown) and may be manufactured thinner than the flexible printed circuit board to reduce bending stress.

[0084] Figure 4 1 is a cross-sectional view of the structure of the substrate 10 , the display unit 20 , the packaging unit 30 , and the cover panel 70 around the first indentation IP1 .

[0085] Disclosed is an exemplary embodiment in which the display unit 20 includes an organic light emitting device OLED and the encapsulation unit 30 includes a first inorganic layer 31 , a first organic layer 33 , and a second inorganic layer 35 .

[0086] The first thin film transistor TFT1 including the semiconductor layer 212 , the gate electrode 14 , the source electrode 16 a and the drain electrode 16 b is on the substrate 10 .

[0087] Buffer layer 211 is formed between substrate 10 and semiconductor layer 212, and gate insulating layer 13 is formed between semiconductor layer 212 and gate electrode 14. Interlayer insulating layer 15 is between gate electrode 14 and source and drain electrodes 16a and 16b, and planarization layer 17 covers source and drain electrodes 16a and 16b.

[0088] The buffer layer 211 , the gate insulating layer 13 , and the interlayer insulating layer 15 may include an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride. The planarization layer 17 may include an inorganic layer and / or an organic layer.

[0089] Figure 4 The structure of the first thin film transistor TFT1 and the structure and material of the insulating layer shown in are examples of applying the inventive concept, and the inventive concept is not limited thereto.

[0090] The first thin film transistor TFT1 functions as a driving transistor and is connected to the pixel electrode 21 to transmit a driving signal to the pixel electrode 21. The end of the pixel electrode 21 is surrounded by a pixel defining layer 18 including an organic insulating layer. The pixel defining layer 18 reduces or prevents arcing at the end of the pixel electrode 21.

[0091] The second thin film transistor TFT2 may be used as a transistor for testing performance of a device instead of being used as a driving transistor, and the structure of the second thin film transistor TFT2 may be the same as that of the first thin film transistor TFT1 .

[0092] An intermediate layer (not shown) including an organic emission layer 22 is above the pixel electrode 21. The organic emission layer 22 may include a low-molecular organic light-emitting material or a high-molecular organic light-emitting material. When the organic emission layer 22 includes a low-molecular organic light-emitting material, the intermediate layer (not shown) may further include a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL). When the organic emission layer 22 includes a high-molecular organic light-emitting material, the intermediate layer (not shown) may further include an HTL.

[0093] The counter electrode 23 formed in common for the plurality of pixels PXL1 and PXL2 is on the organic emission layer 22 .

[0094] An organic light-emitting device OLED as a self-luminous display device may include a pixel electrode 21, an organic emission layer 22, and a counter electrode 23. In the self-luminous display device, excitons generated by combining holes injected from a hole injection electrode and electrons injected from an electron injection electrode in the organic emission layer generate light while transitioning from an excited state to a ground state, and the organic light-emitting device OLED can be formed in a lightweight and thin shape. Therefore, the application range of the organic light-emitting device OLED is expanded to portable display devices.

[0095] exist Figure 4 The first pixel PXL1 close to the inside of the display unit 20 is a region for realizing an image of the display device 1 by emitting light in the above working principle. However, the second pixel PXL2 closest to the first indentation IP1 at the edge of the substrate 10 is a dummy pixel that does not realize an image.

[0096] The second thin film transistor TFT2 may be connected to the second pixel PXL2. The dummy pixel as a pixel to be used for a signal test or an aging test may be used to reduce defects of the display device 1.

[0097] Since the second pixel PXL2 may be damaged in the process of cutting the first indentation IP1 , the second pixel PXL2 may be used as a space for testing rather than as a pixel for displaying an image.

[0098] The encapsulation unit 30 for encapsulating the display unit 20 may include a plurality of thin film layers. For example, in the present exemplary embodiment, the encapsulation unit 30 may have a structure in which a first inorganic layer 31, a first organic layer 33, and a second inorganic layer 35 are sequentially stacked. However, the encapsulation unit 30 is not limited to the above three layers, and may be implemented in various embodiments including at least one inorganic layer and at least one organic layer.

[0099] The first inorganic layer 31 and the second inorganic layer 35 may include silicon oxide, silicon nitride and / or silicon oxynitride. The first organic layer 33 may include at least one selected from the group consisting of PET, PEN, PC, PI, PES, polyoxymethylene (POM), PAR, and polyacrylate hexamethyldisiloxane (HMDSO).

[0100] The first inorganic layer 31 is bent along the lower structure of the first inorganic layer 31, so that the surface of the first inorganic layer 31 is uneven. The first organic layer 33 may cover the uneven first inorganic layer 31, thereby making the upper surface of the encapsulation unit 30 flat. The second inorganic layer 35 covers the first organic layer 33.

[0101] In this manner, since the encapsulation unit 30 has a multilayer structure including the first inorganic layer 31, the first organic layer 33, and the second inorganic layer 35, even if a crack is generated in the encapsulation unit 30 due to the multilayer structure, the crack may not be connected to a crack between the first inorganic layer 31 and the first organic layer 33 or a crack between the first organic layer 33 and the second inorganic layer 35. Therefore, formation of a path through which impurities such as external moisture and oxygen may penetrate into the display unit 20 may be prevented or reduced.

[0102] Meanwhile, the outermost layer of the encapsulation unit 30 may include an inorganic layer to reduce or prevent external moisture penetration. For example, an end portion of the first organic layer 33 may be covered with the second inorganic layer 35 . Figure 4 An example is shown in which the second inorganic layer 35 covers the side surface of the substrate 10 at the first indentation IP1 .

[0103] Therefore, according to the present exemplary embodiment described above, the second pixel PXL2 is arranged in the display unit 20 near the first indentation IP1, so that the pixel for displaying an image is not directly exposed to the cutting surface. In addition, the encapsulation unit 30 is formed by a thin film encapsulation including both an inorganic layer and an organic layer, the outermost film of the encapsulation unit 30 is used as an inorganic layer, and the outermost inorganic layer of the encapsulation unit 30 covers the end of the organic layer. Therefore, the end of the organic layer can be prevented from being directly exposed to the outside during the cutting process, thereby reducing or preventing the side moisture penetration.

[0104] Figure 5A , Figure 5B and Figure 5C is a plan view comparing a display area of ​​a display device according to the present exemplary embodiment with a display area of ​​a display device according to a comparative example.

[0105] Figure 5A is a display device according to a first comparative example. Figure 5AThe display device includes components 110 capable of extending the functions of the display device such as a camera module 111 , a speaker 112 , and a sensor 113 over a substrate 10 , and also includes a wiring film 80 in which an integrated circuit chip 100 is mounted under the substrate 10 .

[0106] An exemplary display region of the display device according to the first comparative example is a first region D1 excluding upper and lower end portions of the substrate 10 .

[0107] Strictly speaking, the first area D1 is an area of ​​the display unit 20 below the transparent substrate 60 formed slightly inward from the substrate 10, but the first area D1 is used to illustrate the schematic difference of the display area. Therefore, for convenience, the figure showing the substrate 10 is replaced by the description.

[0108] Figure 5B is a display device according to a second comparative example. Figure 5B The display device includes a first indentation IP1 above the substrate 10, and also includes components 110 capable of expanding the functions of the display device such as a camera module 111, a speaker 112, and a sensor 113 in a space where the substrate 10 is cut. In addition, a wiring film 80 including an integrated circuit chip 100 is below the substrate 10.

[0109] The schematic display area of ​​the display device of the second comparative example is the sum of the first area D1 and the second area D2 where the first indentation IP1 is not formed over the substrate 10. Therefore, the display device of the second comparative example has a larger display area than that of the display device of the first comparative example.

[0110] Figure 5C is a display device according to the present exemplary embodiment. Figure 5C The display device includes a first indentation IP1 above the substrate 10, and also includes a component 110 capable of expanding the function of the display device such as a camera module 111, a speaker 112, and a sensor 113 in a space where the substrate 10 is cut. In addition, a wiring film 80 including a second indentation IP2 and an integrated circuit chip 100 is above the substrate 10.

[0111] Therefore, the schematic display area of ​​the display device is the sum of the first area D1, the second area D2 in which the first indentation IP1 is not formed above the substrate 10, and the third area D3 extending from the lower end of the substrate 10. Therefore, the display device of the present exemplary embodiment has a display area larger than that of the display devices of the first comparative example and the second comparative example.

[0112] Therefore, the display device of the present exemplary embodiment can provide the display device 1 having an enlarged display area to mount various components while maintaining a large screen.

[0113] Meanwhile, the polarizer film 40 may also be disposed above the encapsulation unit 30 .

[0114] The polarizer film 40 may be a circular polarizer film produced by bonding a plurality of linear polarizer films and a phase difference film.

[0115] Although Figure 3 The end of the polarizer film 40 is shown to be further inward than the end of the substrate 10 in the first retracted portion IP1 , but the inventive concept is not limited thereto. In the first retracted portion IP1 , the end of the polarizer film 40 may be aligned with the end of the substrate 10 or protrude from the end of the substrate 10 .

[0116] The transparent substrate 60 may be over the polarizer film 40 , and the adhesive layer 50 may be between the polarizer film 40 and the transparent substrate 60 .

[0117] The transparent substrate 60 may be formed of a transparent material. The transparent substrate 60 is arranged to cover not only the display unit 20 but also a region in which the component 110 is arranged. The transparent substrate 60 may be a touch screen panel that performs a touch screen function for the display unit 20.

[0118] In the present exemplary embodiment, after the cutting process for the first indentation IP1, the polarizer film 40 may be formed on the packaging unit 30. The polarizer film 40 may be pre-cut to reflect the shape of the first indentation IP1 to some extent, and then disposed over the packaging unit 30.

[0119] In the present exemplary embodiment, after the cutting process for the first indentation IP1, the adhesive layer 50 may be formed on the polarizer film 40. The adhesive layer 50 may be pre-cut or coated to reflect the shape of the first indentation IP1 to some extent, and then the adhesive layer 50 may be arranged over the polarizer film 40. In addition, the adhesive layer 50 may first be applied to a transparent substrate 60 to be described later below, and then the adhesive layer 50 may be arranged over the polarizer film 40 together with the transparent substrate 60.

[0120] Figure 6 is a cross-sectional view of a portion of a display device 2 according to another exemplary embodiment. Figure 3 The difference between the display device 1 of the present exemplary embodiment.

[0121] Reference Figure 6, the end of the cover panel 70 protrudes further toward the outside of the display device 2 than the end of the substrate 10. In addition, the shape of the end of the cover panel 70 is not necessarily substantially the same as the shape of the first indented portion IP1. Since the end of the cover panel 70 protrudes further toward the outside of the display device 2 than the end of the substrate 10, the cover panel 70 stably supports the substrate 10 when the wiring film 80 is bonded to the substrate 10.

[0122] In the present exemplary embodiment, the maximum depth H1 from the edge L0 of the region where the wiring film 80 is bent to the second indentation IP2 is formed to be not less than the maximum depth H21 from the edge L0 of the region where the wiring film 80 is bent to the end of the cover panel 70. Figure 1A The component 110 may be in a space between an edge L0 of a region where the wiring film 80 is bent and an end of the cover panel 70.

[0123] Figure 7 is a cross-sectional view of a portion of a display device 3 according to another exemplary embodiment. Figure 6 The difference between the display device 2 of the present exemplary embodiment.

[0124] Reference Figure 7 The black matrix BM is also arranged over the surface of the transparent substrate facing the display unit 20. The black matrix BM is at the outer edge of the display unit 20, and a module opening MO is formed in which a ( Figure 1A The black matrix BM can be formed to reduce or prevent the formation of the black matrix BM. Figure 1A ) light leakage in the area of ​​component 110.

[0125] The maximum depth H1 from the edge L0 of the region where the wiring film 80 is bent to the second setback IP2 is formed to be not less than the maximum depth H23 from the edge L0 of the region where the wiring film 80 is bent to the point closest to the black matrix BM and the module opening MO to the display unit 20. Figure 1A The) component 110 can be arranged in the space formed by the module opening MO.

[0126] The cover panel 70 can be freely designed within a range not overlapping with the module opening MO.

[0127] Although in Figure 7 Although not shown, a second opening (not shown) may also be formed in the transparent substrate 60 in a region corresponding to the module opening 140. Unlike the camera module 111 and the sensor 113, components 110 such as the speaker 112 require a second opening (not shown) to be formed in the transparent substrate 60 for sound propagation.

[0128] Fig. 8A , Figure 8B , Figure 8C , Fig.8D and Fig. 8E 1 and 2 are plan views of various shapes of the first and second pad units 11 and 12 and the third and fourth pad units 81 and 82 of the inventive concept.

[0129] Reference Fig. 8A , the wiring of the first pad unit 11 of the substrate 10 and the third pad unit 81 of the wiring film 80 are arranged symmetrically with respect to the respective center lines C2. The wiring of the second pad unit 12 of the substrate 10 and the fourth pad unit 82 of the wiring film 80 are arranged symmetrically with respect to the respective center lines C2. The wiring close to the center line C2 has a zero-degree inclination θ0 with respect to the center line C2, and the wiring spaced apart from the center line C2 is tilted obliquely from the center line C2 to have a predetermined inclination θ1 greater than zero degrees.

[0130] When the substrate 10 and the wiring film 80 are aligned and bonded to each other, a conductive bonding layer such as an anisotropic conductive film (not shown) is between the first pad unit 11 of the substrate 10 and the third pad unit 81 of the wiring film 80 and between the second pad unit 12 of the substrate 10 and the fourth pad unit 82 of the wiring film 80, wherein the substrate 10 and the wiring film 80 are physically and firmly bonded and electrically connected to each other by pressing.

[0131] like Figure 8B As shown in , when pressure is applied to the center line C2 during bonding, the substrate 10 and the wiring film 80 may bend around the center line C2, and due to this bending and pressure, the anisotropic conductive film may not be aligned in a straight line, resulting in disconnection from the pad wiring.

[0132] In this exemplary embodiment, the wiring is arranged symmetrically relative to the center line C2 of the first pad unit 11 and the third pad unit 81 and the second pad unit 12 and the fourth pad unit 82, and the wiring spaced apart from the center line C2 is tilted obliquely from the center line C2 to have a constant inclination θ1 relative to the center line C2, so that the disconnection between the anisotropic conductive film and the pad wiring can be prevented.

[0133] Figure 8C An exemplary embodiment is shown in which the respective wirings of the first pad unit 11 and the second pad unit 12 of the substrate 10 and the third pad unit 81 and the fourth pad unit 82 of the wiring film 80 are arranged symmetrically relative to the virtual center line C1, and the wirings spaced apart from the center line C1 are inclined obliquely from the center line C1 and are formed at a predetermined inclination θ2 greater than zero degrees.

[0134] According to the present exemplary embodiment, disconnection between the anisotropic conductive film and the pad wiring, which may occur when pressure is applied to the center line C1 when the anisotropic conductive film is pressed, can be prevented.

[0135] Reference Fig.8D , the wiring of the first pad unit 11 of the substrate 10 and the third pad unit 81 of the wiring film 80 are arranged symmetrically with respect to their respective center lines C2. The wiring of the second pad unit 12 of the substrate 10 and the fourth pad unit 82 of the wiring film 80 are arranged symmetrically with respect to their respective center lines C2. The wiring close to the center line C2 has a zero-degree inclination θ0 relative to the center line C2, and the wiring spaced apart from the center line C2 is inclined obliquely from the center line C2, so that the inclination increases as the distance from the center line C2 increases (θ3<θ4). Similar to Fig. 8A According to an exemplary embodiment of the present invention, disconnection between the anisotropic conductive film and the pad wiring, which may occur when bonding is performed under pressure on the center line C2, can be prevented.

[0136] exist Fig. 8E , the wirings of the first pad unit 11 and the second pad unit 12 in the substrate 10 and the third pad unit 81 and the fourth pad unit 82 in the wiring film 80 are arranged symmetrically with respect to the virtual center line C1, and the wirings spaced apart from the center line C1 are tilted obliquely from the center line C1, so that the inclination increases as the distance from the center line C1 increases (θ5<θ6). Similar to Figure 8C According to the exemplary embodiment, disconnection between the anisotropic conductive film and the pad wiring, which may occur when bonding is performed under pressure on the center line C1, can be prevented.

[0137] Fig. 9 is a cross-sectional view of a portion of a display device 4 according to another exemplary embodiment. Figure 1B The difference between the display device 1 of the present exemplary embodiment.

[0138] In the present exemplary embodiment, the maximum depth H3 from the end L3 of the third pad unit 81 and the fourth pad unit 82 of the wiring film 80 to the end L1 of the second setback portion IP2 formed in the wiring film 80 can be formed to be no less than the maximum depth H4 from the end L2 of the substrate 10 to the end L4 of the first setback portion IP1 formed in the substrate 10.

[0139] Fig.10 is a cross-sectional view of a portion of a display device 5 according to another exemplary embodiment. Figure 1B The difference between the display device 1 of the present exemplary embodiment.

[0140] In this exemplary embodiment, the maximum width W1 of the second indentation portion IP2 from the center axis C0 to the wiring film 80 can be formed to be no less than the maximum value of the maximum width W2 from the center axis C0 to the component 110 at the leftmost side and the maximum width W3 from the center axis C0 to the component 110 at the rightmost side.

[0141] Fig.11 6 is a cross-sectional view of a portion of a display device 6 according to another exemplary embodiment. Figure 1B The difference between the display device 1 of the present exemplary embodiment.

[0142] In the present exemplary embodiment, the maximum width W5 from one end of the first indentation IP1 formed in the substrate 10 to the edge of the substrate 10 can be formed to be no less than the maximum width W4 from one end of the first indentation IP1 to the central axis C0, so that a pad unit forming a space can be provided.

[0143] Fig.12 is a cross-sectional view of a portion of a display device 7 according to another exemplary embodiment. Figure 1B The difference between the display device 1 of the present exemplary embodiment.

[0144] In the present exemplary embodiment, the wiring film 80 is further provided with a dummy pad unit 80C between the third pad unit 81 and the fourth pad unit 82. The dummy pad unit 80C and the second indentation IP2 of the wiring film 80 may form a through hole H0, and the component 110 may be arranged in a space corresponding to the through hole H0. The dummy pad unit 80C contacts the substrate 10 between the first pad unit 11 and the second pad unit 12 of the substrate 10, so that the bonding strength between the substrate 10 and the wiring film 80 may be improved.

[0145] Fig.13 FIG. 8 is a cross-sectional view of a portion of a display device 8 according to another exemplary embodiment. Figure 1B The difference between the display device 1 of the present exemplary embodiment.

[0146] In the present exemplary embodiment, the wiring film 80 further includes a grounding portion 80E formed around the second indentation IP2. The grounding portion 80E may be formed of a conductive material. The grounding portion 80E is formed to be grounded to the wiring film 80 so that static electricity of the wiring film 80 can be prevented and electrical noise can be blocked.

[0147] Fig.14 9 is a cross-sectional view of a portion of a display device 9 according to another exemplary embodiment. Figure 2 The difference between the display device 1 of the present exemplary embodiment.

[0148] In the present exemplary embodiment, a filler 120 is further arranged between the substrate 10 and the transparent substrate 60. The filler 120 can disperse the impact applied to the substrate 10 and the transparent substrate 60. The filler 120 is spaced apart from the adhesive layer 50 by a predetermined distance and is arranged to surround the display unit 20. A chemical reaction between the filler 120 and the adhesive layer 50 can be prevented, and the intrusion of the filler 120 into the display unit 20 can be reduced or prevented.

[0149] Fig.15 are views of various shapes of the first retracted portion according to the present exemplary embodiment. Fig.15 A semicircular first indentation IP11, a semi-elliptical first indentation IP12, an arcuate first indentation IP13, and a trapezoidal first indentation IP14 are disclosed. The shape of the first indentation formed in the substrate 10 according to the inventive concept is not limited to Fig.15 The shapes shown in .

[0150] Fig.16 2 are views of various shapes of the second retracted portion according to the present exemplary embodiment. Fig.16 A semicircular second setback IP21, a semi-elliptical second setback IP22, an arcuate second setback IP23, and a trapezoidal second setback IP24 are disclosed. The shape of the second setback formed in the wiring film 80 according to the inventive concept is not limited to Fig.16 The shapes shown in .

[0151] According to the exemplary embodiments of the inventive concept as described above, a display device in which various components are installed and a large screen can be provided.

[0152] Although specific exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to these embodiments, but is limited to a wider range of various obvious modifications and equivalent arrangements as are apparent to those of ordinary skill in the art.

Claims

1. A display device, wherein: The display device comprises: A base, on which a first indented portion is formed and indented inwardly along one side of the base; a first pad unit and a second pad unit, the first pad unit and the second pad unit being spaced apart from each other along the one side on the substrate; a display unit, the display unit being above the substrate and having an inwardly indented shape between the first pad unit and the second pad unit, the first pad unit and the second pad unit being respectively located between top edges of both sides of the inwardly indented shape of the display unit and a top edge of the substrate on both sides of the first indented portion of the substrate; a packaging unit, the packaging unit packaging the display unit; and a wiring film bent from the first surface of the substrate toward the second surface of the substrate, the wiring film comprising a third pad unit and a fourth pad unit connected to the first pad unit and the second pad unit, respectively, and a second retracted portion retracted inwardly between the third pad unit and the fourth pad unit, The wiring film further includes a grounding portion, and the grounding portion is grounded to the wiring film along the second indented portion.

2. The display device according to claim 1, wherein: The encapsulation unit includes at least one inorganic layer and at least one organic layer.

3. The display device according to claim 1, wherein: The encapsulation unit includes at least one inorganic layer and at least one organic layer, The outermost layer of the encapsulation unit includes an inorganic layer, and The inorganic layer included in the outermost layer is configured to cover a side surface of the at least one organic layer.

4. The display device according to claim 1, wherein: The encapsulation unit includes at least one inorganic layer and at least one organic layer, The outermost layer of the encapsulation unit includes an inorganic layer, and The inorganic layer included in the outermost layer is configured to cover a side surface of the substrate in which the first recessed portion is formed.

5. The display device according to claim 1, wherein: A test dummy pixel is further arranged outside the display unit along the first indented portion.

6. The display device according to claim 1, wherein: The wiring film also includes an integrated circuit chip, Wherein, the integrated circuit chip is arranged not to overlap with the display unit.

7. The display device according to claim 1, wherein: A transparent substrate is also arranged above the packaging unit.

8. The display device according to claim 7, wherein: A black matrix is ​​further arranged above the transparent substrate at a position corresponding to an outer edge of the display unit.

9. The display device according to claim 8, wherein: The black matrix has a first opening at a position corresponding to the first recessed portion.

10. The display device according to claim 9, wherein: The transparent substrate has a second opening at a position corresponding to the first opening.

11. The display device according to claim 7, wherein: The display device further includes: A polarizer film is between the packaging unit and the transparent substrate.

12. The display device according to claim 11, wherein: The display device further includes: An adhesive layer is between the polarizer film and the transparent substrate.

13. The display device according to claim 7, wherein: The display device further includes: A filler is between the substrate and the transparent substrate, the filler is spaced apart from the adhesive layer and surrounds an outer edge of the display unit.

14. The display device according to claim 1, wherein: The display device further includes: A cover panel is on the second surface of the substrate, the cover panel comprising a cushioning material.

15. The display device according to claim 14, wherein: In the first setback, an end of the cover panel is aligned with an end of the substrate.

16. The display device according to claim 14, wherein: In the first retracted portion, an end portion of the cover panel protrudes from an end portion of the base to the outside of the display unit.

17. The display device according to claim 1, wherein: The first pad unit and the second pad unit include a plurality of pad wirings, The plurality of pad wirings are formed obliquely so as to be symmetrical with respect to a center of the first recessed portion.

18. The display device according to claim 1, wherein: The third pad unit and the fourth pad unit include a plurality of pad wirings, The plurality of pad wirings are formed obliquely so as to be symmetrical with respect to a center of the second recessed portion.

19. The display device according to claim 1, wherein: The maximum depth from the edge of the region where the wiring film is bent to the second retracted portion is not less than the maximum depth from the edge of the region where the wiring film is bent to the first retracted portion.

20. The display device according to claim 1, wherein: A maximum depth from ends of the third pad unit and the fourth pad unit of the wiring film to the second setback is not less than a maximum depth from an end of the substrate to the first setback.

21. A display device, wherein: The display device comprises: A base, on which a first indented portion is formed and indented inwardly along one side of the base; a first pad unit and a second pad unit, the first pad unit and the second pad unit being spaced apart from each other along the one side on the substrate; a display unit, the display unit being above the substrate and having an inwardly indented shape between the first pad unit and the second pad unit, the first pad unit and the second pad unit being respectively located between top edges of both sides of the inwardly indented shape of the display unit and a top edge of the substrate on both sides of the first indented portion of the substrate; a packaging unit, the packaging unit packaging the display unit; and a wiring film, the wiring film being bent from the first surface of the substrate toward the second surface of the substrate, the wiring film comprising a third pad unit and a fourth pad unit respectively connected to the first pad unit and the second pad unit, a second indentation portion indented inwardly between the third pad unit and the fourth pad unit, a dummy pad unit configured to connect the third pad unit and the fourth pad unit, and a through hole formed through the dummy pad unit and the second indentation portion of the wiring film, The wiring film further includes a grounding portion, and the grounding portion is grounded to the wiring film along the second indented portion.

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