Light-emitting substrate and electronic device

Abstract

A light-emitting substrate and an electronic device. The light-emitting substrate includes a substrate, a first common electrode, at least one first power line, a first test pad, and a second test pad. The substrate includes a light-emitting region and a peripheral region surrounding the light-emitting region. The first common electrode is disposed on the substrate and at least partially located in the light-emitting region. At least one first power line is disposed on the substrate and located in the peripheral region, and is electrically connected to the first common electrode. The first test pad and the second test pad are disposed on the substrate and located in the peripheral region. The first power line is electrically connected to the first test pad and the second test pad, and the first test pad and the second test pad are configured to be used as test points to detect the resistance value of the first power line. The light-emitting substrate facilitates the testing and monitoring of the resistance value of the peripheral trace (such as the VSS power line), so as to facilitate finding out abnormal substrates as soon as possible, contribute to improving production efficiency, avoiding waste of production resources, and reducing production costs.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a light-emitting substrate and an electronic device. Background Art

[0002] With the development of display technology, various display screens have been more and more widely used. These display screens can provide users with rich and colorful pictures and good visual experiences. The display screens mainly include liquid crystal display (LCD) screens and organic light-emitting diode (OLED) display screens. The OLED display screen has the advantages of small driving current, low power consumption, long service life, etc. Moreover, the OLED display screen or the OLED panel can not only be used in the display field, but also be used as a light source to emit light, and has a wide application prospect in the field of lighting and the like. Summary of the Invention

[0003] At least one embodiment of the present disclosure provides a light-emitting substrate, including: a substrate, including a light-emitting region and a peripheral region surrounding the light-emitting region; a first common electrode disposed on the substrate and at least partially located in the light-emitting region; at least one first power line disposed on the substrate and located in the peripheral region, electrically connected to the first common electrode; and a first test pad and a second test pad disposed on the substrate and located in the peripheral region; wherein, the first power line is electrically connected to the first test pad and the second test pad, and the first test pad and the second test pad are configured to be used as test points to detect the resistance value of the first power line.

[0004] For example, in the light-emitting substrate provided in an embodiment of the present disclosure, the first test pad and / or the second test pad are further configured to be used as bonding pads to bond a circuit board.

[0005] For example, in the light-emitting substrate provided in an embodiment of the present disclosure, the first common electrode at least partially covers the first power line.

[0006] For example, in the light-emitting substrate provided in an embodiment of the present disclosure, the light-emitting region is located within the orthographic projection of the first common electrode on the substrate.

[0007] For example, the light-emitting substrate provided in an embodiment of the present disclosure further includes a pixel array, wherein the pixel array includes a plurality of pixel units, and the first common electrode is electrically connected to the plurality of pixel units as a common cathode.

[0008] For example, in the light-emitting substrate provided in an embodiment of the present disclosure, the first test pad and the second test pad are located on the same side or opposite sides of the light-emitting region.

[0009] For example, the light-emitting substrate provided by an embodiment of the present disclosure further includes a first test disk and a second test disk. Among them, the first test disk is electrically connected to the first test pad, and is located on the same side of the light-emitting area as the first test pad. The second test disk is electrically connected to the second test pad, and is located on the same side of the light-emitting area as the second test pad. The first test disk and the second test disk are configured as test points to detect the resistance value of the first power line.

[0010] For example, in the light-emitting substrate provided by an embodiment of the present disclosure, at least a part of the first power line surrounds the light-emitting area.

[0011] For example, in the light-emitting substrate provided by an embodiment of the present disclosure, the at least one first power line includes a first power line. The light-emitting area includes a first light-emitting area and a second light-emitting area spaced apart from each other. The first power line at least partially surrounds the first light-emitting area and the second light-emitting area.

[0012] For example, in the light-emitting substrate provided by an embodiment of the present disclosure, the at least one first power line includes two first power lines. The light-emitting area includes a first light-emitting area and a second light-emitting area spaced apart from each other. The two first power lines are respectively located on one side of the first light-emitting area away from the second light-emitting area and on one side of the second light-emitting area away from the first light-emitting area.

[0013] For example, the light-emitting substrate provided by an embodiment of the present disclosure further includes: a second common electrode provided on the substrate and at least partially located in the light-emitting area, wherein the second common electrode is located between the substrate and the first common electrode; at least one second power line provided on the substrate and located in the peripheral area, wherein the at least one second power line is located between the first power line and the display area and is electrically connected to the second common electrode; and a third test disk and a fourth test disk provided on the substrate and located in the peripheral area; wherein the second power line is electrically connected to the third test disk and the fourth test disk, and the third test disk and the fourth test disk are configured as test points to detect the resistance value of the second power line.

[0014] For example, in the light-emitting substrate provided by an embodiment of the present disclosure, the third test disk and / or the fourth test disk are further configured as bonding disks to bond a circuit board.

[0015] For example, in the light-emitting substrate provided by an embodiment of the present disclosure, the third test disk and the fourth test disk are located on the same side or opposite sides of the light-emitting area.

[0016] For example, in the light-emitting substrate provided in an embodiment of the present disclosure, the first test disk, the second test disk, the third test disk, and the fourth test disk are located on the same side of the light-emitting region.

[0017] For example, in the light-emitting substrate provided in an embodiment of the present disclosure, the at least one second power supply line includes two second power supply lines, the light-emitting region includes a first light-emitting region and a second light-emitting region spaced apart from each other, and the two second power supply lines are respectively located on one side of the first light-emitting region away from the second light-emitting region and on one side of the second light-emitting region away from the first light-emitting region.

[0018] For example, in the light-emitting substrate provided in an embodiment of the present disclosure, at least a part of the second common electrode includes grid lines, and the first power supply line, the second power supply line, and the grid lines are located on the same layer.

[0019] For example, the light-emitting substrate provided in an embodiment of the present disclosure further includes a pixel array, wherein the pixel array includes a plurality of pixel units, and the second common electrode is electrically connected to the plurality of pixel units as a common anode.

[0020] For example, in the light-emitting substrate provided in an embodiment of the present disclosure, the orthographic projection of the plurality of pixel units on the substrate is located within the orthographic projection of the grid of the grid lines on the substrate.

[0021] For example, the light-emitting substrate provided in an embodiment of the present disclosure further includes a metal layer, wherein the metal layer includes the first power supply line, the second power supply line, and the second common electrode, and the metal layer is a composite layer structure of titanium / aluminum / titanium.

[0022] At least one embodiment of the present disclosure further provides an electronic device, including the light-emitting substrate as described in any embodiment of the present disclosure. Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the accompanying drawings of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description only relate to some embodiments of the present disclosure and do not limit the present disclosure.

[0024] Figure 1 A plan view of a light-emitting substrate provided in some embodiments of the present disclosure;

[0025] Figure 2 A plan view of another light-emitting substrate provided in some embodiments of the present disclosure;

[0026] Figure 3A A plan view of another light-emitting substrate provided in some embodiments of the present disclosure;

[0027] Figure 3BFor Figure 3A The schematic plan view of the light-emitting substrate shown does not show the first common electrode;

[0028] Figure 3C For Figure 3B The partial enlarged view of region B in;

[0029] Figure 4A The schematic plan view of another light-emitting substrate provided by some embodiments of the present disclosure;

[0030] Figure 4B For Figure 4A The schematic plan view of the light-emitting substrate shown does not show the first common electrode;

[0031] Figure 4C For Figure 4A The schematic cross-sectional view of the light-emitting substrate shown along Q-Q';

[0032] Figure 5 The schematic plan view of another light-emitting substrate provided by some embodiments of the present disclosure;

[0033] Figure 6 The schematic plan view of another light-emitting substrate provided by some embodiments of the present disclosure;

[0034] Figure 7A The schematic plan view of another light-emitting substrate provided by some embodiments of the present disclosure;

[0035] Figure 7B For Figure 7A The schematic plan view of the light-emitting substrate shown does not show the first common electrode;

[0036] Figure 8 The schematic block diagram of an electronic device provided by some embodiments of the present disclosure;

[0037] Figure 9 The schematic flow chart of a method for manufacturing a light-emitting substrate provided by some embodiments of the present disclosure; and

[0038] Figure 10 The schematic flow chart of another method for manufacturing a light-emitting substrate provided by some embodiments of the present disclosure. Detailed Description of the Embodiments

[0039] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Apparently, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts shall fall within the scope of protection of the present disclosure.

[0040] Unless otherwise defined, the technical terms or scientific terms used in this disclosure shall have the ordinary meanings as understood by those of ordinary skill in the art to which this disclosure pertains. The terms "first", "second" and similar words used in this disclosure do not denote any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "a", "an" or "the" do not denote a quantity limitation, but mean that there is at least one. Words such as "comprising" or "including" mean that the elements or items appearing before the word encompass the elements or items listed after the word and their equivalents, without excluding other elements or items. Words such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0041] When applying OLEDs to the lighting field, an OLED light-emitting substrate can be used to form a light source for emitting light. Of course, the light source can also include other components such as a cover plate, a packaging structure, a control circuit, a power supply, etc., so as to cooperate with the OLED light-emitting substrate to achieve the function of emitting light. For example, vehicle headlights usually use an OLED light-emitting substrate, and its working principle is similar to that of a Passive Matrix OLED (PMOLED). Since only monochromatic light emission is required and individual pixels do not need to be controlled separately, there is no need to provide switching elements (such as Thin Film Transistors (TFTs)). To avoid short circuits between the cathode and anode of the OLED during the production process, which may cause the entire product to malfunction, a structure in which each pixel is separated from each other is usually adopted. That is, there are a plurality of mutually separated pixels on the OLED light-emitting substrate. Since there is no need for display but only for light emission, the voltage signals applied to all pixels can be the same, or the voltage signals applied to some pixels can be the same. Therefore, the control method of the OLED light-emitting substrate is simpler than that of PMOLED, and correspondingly, the structure of each electrode in the substrate is also simpler.

[0042] Setting a plurality of pixels on the OLED light-emitting substrate makes the resistance value of the peripheral traces for transmitting high-voltage signals (such as VDD signals) and low-voltage signals (such as VSS signals) decisive for the brightness quality (such as uniformity) of the entire light-emitting substrate. In a top-emitting OLED light-emitting substrate, since the peripheral traces (especially the VSS power line) are easily affected by the etching solution during the etching process of the anode layer, the resistance value of the peripheral traces will be affected, which will increase the risk of product failure. Therefore, it is necessary to test the resistance value of the peripheral traces to detect faulty products as early as possible and as quickly as possible.

[0043] At least one embodiment of the present disclosure provides a light-emitting substrate and an electronic device. The light-emitting substrate facilitates the testing and monitoring of the resistance value of the peripheral trace (such as the VSS power line), thereby facilitating the quick identification of abnormal substrates, helping to improve production efficiency, avoid waste of production resources, and reduce production costs.

[0044] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. It should be noted that the same reference numerals in different drawings will be used to refer to the same elements that have been described.

[0045] At least one embodiment of the present disclosure provides a light-emitting substrate, which includes a substrate, a first common electrode, at least one first power line, a first test pad, and a second test pad. The substrate includes a light-emitting region and a peripheral region surrounding the light-emitting region. The first common electrode is disposed on the substrate and at least partially located in the light-emitting region. At least one first power line is disposed on the substrate and located in the peripheral region, and is electrically connected to the first common electrode. The first test pad and the second test pad are disposed on the substrate and located in the peripheral region. The first power line is electrically connected to the first test pad and the second test pad, and the first test pad and the second test pad are configured to be used as test points to detect the resistance value of the first power line.

[0046] Figure 1 FIG. is a plan view of a light-emitting substrate provided by some embodiments of the present disclosure. As Figure 1 shown, the light-emitting substrate 10 includes a substrate 110, a first common electrode 120, at least one first power line 130, a first test pad 131, and a second test pad 132.

[0047] For example, the substrate 110 includes a light-emitting region AA and a peripheral region Z surrounding the light-emitting region AA. For example, on the substrate 110, the region other than the light-emitting region AA is the peripheral region Z, and the peripheral region Z and the light-emitting region AA are, for example, complementary. For example, the light-emitting substrate 10 further includes a pixel array 140, and the pixel array 140 is located in the light-emitting region AA and includes a plurality of pixel units 141. For example, the pixel array 140 can be an OLED display array, a quantum dot light emitting diode (QLED) display array, or other types of display arrays, and the embodiments of the present disclosure are not limited thereto. For example, the substrate 110 functions as support, protection, etc., and can be a substrate made of a glass substrate, a plastic substrate, a quartz substrate, or other suitable materials.

[0048] The first common electrode 120 is disposed on the substrate 110 and at least partially located in the light-emitting region AA. For example, in some examples, the first common electrode 120 is a continuous plate-like or film-like electrode and is located at the uppermost layer of the pixel unit 141 in the direction perpendicular to the substrate 110. For example, the light-emitting region AA is located within the orthographic projection of the first common electrode 120 on the substrate 110, that is, the first common electrode 120 completely covers the light-emitting region AA. For example, the first common electrode 120 is electrically connected to a plurality of pixel units 141 as a common cathode. For example, the first common electrode 120 receives a low-voltage signal (such as a VSS signal), and the low-voltage signal is, for example, 0V (such as grounded) or other values. The first common electrode 120 uses the received VSS signal as the cathode signal of the pixel unit 141, so as to cooperate with the anode signal separately provided to the pixel unit 141 to drive the electroluminescent material in the pixel unit 141 to emit light.

[0049] For example, at least some of the pixel units 141 share the first common electrode 120, that is, at least some of the pixel units 141 are electrically connected to the same first common electrode 120. It should be noted that in the embodiments of the present disclosure, some of the pixel units 141 may share the first common electrode 120, or all of the pixel units 141 may share the first common electrode 120, that is, some or all of the pixel units 141 are electrically connected to the first common electrode 120 to form a common cathode structure.

[0050] At least one first power supply line 130 is disposed on the substrate 110 and located in the peripheral region Z, and is electrically connected to the first common electrode 120. The first power supply line 130 at least partially surrounds the light-emitting region AA. For example, the first power supply line 130 is a VSS power supply line, and can transmit a VSS signal (for example, a VSS power supply voltage) to the first common electrode 120, so as to provide a cathode signal for each pixel unit 141. The first common electrode 120 at least partially covers the first power supply line 130. For example, in some examples, as Figure 1 shown, the first common electrode 120 not only is located in the light-emitting region AA, but also extends beyond the light-emitting region AA and covers at least a part of the first power supply line 130. For example, the first common electrode 120 covers the portions of the first power supply line 130 located on the upper side and the lower side of the light-emitting region AA. This way can facilitate the electrical connection between the first power supply line 130 and the first common electrode 120 to be achieved by means of lapping, or by means of vias or other structures. Of course, the embodiments of the present disclosure are not limited thereto, and the relative positions and connection manners of the first power supply line 130 and the first common electrode 120 can be determined according to actual needs.

[0051] It should be noted that in the embodiments of the present disclosure, the number of the first power supply lines 130 is not limited and may be one or more. For example, when all the pixel units 141 share a first common electrode 120, the first power supply line 130 may be set to one and electrically connected to the first common electrode 120. When a part of the pixel units 141 share a first common electrode 120 and another part of the pixel units 141 share another first common electrode 120, the first power supply line 130 may be set to two and electrically connected to the two first common electrodes 120 respectively.

[0052] The first test pad 131 and the second test pad 132 are disposed on the substrate 110 and located in the peripheral region Z. The first power supply line 130 is electrically connected to the first test pad 131 and the second test pad 132, and the first test pad 131 and the second test pad 132 are configured to be used as test points to detect the resistance value of the first power supply line 130. For example, the first power supply line 130 at least partially surrounds the light-emitting region AA, and the first test pad 131 and the second test pad 132 are located on the same side of the light-emitting region AA (for example, both are located on the right side in the figure). For example, the first common electrode 120 at least partially covers the first power supply line 130, and the first test pad 131 and the second test pad 132 are not covered by the first common electrode 120. This way can facilitate the electrical connection between the first power supply line 130 and the first common electrode 120, and at the same time facilitate the measurement of the resistance value of the first power supply line 130 itself.

[0053] For example, the first test pad 131 and the second test pad 132 are respectively located at both ends of the first power supply line 130. The first power supply line 130 surrounds the light-emitting region AA, and both ends of the first power supply line 130 are located on the same side of the light-emitting region AA (for example, the right side in the figure). Of course, the embodiments of the present disclosure are not limited thereto, and the setting positions of the first test pad 131 and the second test pad 132 can be determined according to actual needs, and the embodiments of the present disclosure do not limit this. For example, the first test pad 131 and the second test pad 132 may be located on the same side or opposite sides of the light-emitting region AA.

[0054] The first test pad 131 and the second test pad 132 are not covered by other film layers and are exposed to the air. Therefore, any applicable resistance test device (such as a multimeter, a DC single-arm bridge circuit, etc.) can be used to measure the resistance value between the first test pad 131 and the second test pad 132, that is, the resistance value of the first power supply line 130 can be conveniently measured. For example, in some examples, when using a multimeter for measurement, the multimeter is adjusted to the ohm range, and the two test leads of the multimeter are respectively contacted with the first test pad 131 and the second test pad 132, so that the resistance value of the first power supply line 130 can be quickly read.

[0055] After obtaining the resistance value of the first power supply line 130, it is possible to further determine whether the resistance value is within a reasonable range to determine whether there is a fault in the light-emitting substrate 10. If the first power supply line 130 is affected by the etching solution during the etching process of the anode layer, for example, is accidentally etched, its resistance value will increase significantly. Therefore, by determining whether the resistance value is within a reasonable range, it is possible to determine whether the first power supply line 130 is accidentally etched, and thus determine whether there is a fault in the light-emitting substrate 10. For example, the reasonable range of the resistance value can be determined according to experience, such as by testing, calculating, or statistically analyzing the product.

[0056] If the resistance value is within a reasonable range, it is determined that the light-emitting substrate 10 has no obvious fault, and subsequent bonding operations can be performed. If the resistance value is not within a reasonable range, it is determined that the light-emitting substrate 10 has a fault and cannot emit light normally. Therefore, subsequent bonding operations are no longer performed on the light-emitting substrate 10.

[0057] Thus, the light-emitting substrate 10 facilitates the testing and monitoring of the resistance value of the first power supply line 130 (such as the VSS power supply line), thereby facilitating the quick identification of abnormal substrates, helping to improve production efficiency, avoid waste of production resources, and reduce production costs.

[0058] It should be noted that in the embodiments of the present disclosure, no bonding operation is performed on the light-emitting substrate 10 during the resistance test. At this time, the first power supply line 130 cannot receive the VSS signal, so it will not affect the test result. Only when the measured resistance value is within a reasonable range will subsequent bonding operations be performed, enabling the first power supply line 130 to be connected to other circuits through a connecting component (such as a flexible circuit board), so that the first power supply line 130 receives and transmits the VSS signal.

[0059] It should be noted that the first power supply line 130 is electrically connected to the first common electrode 120, and the measured resistance value is substantially the resistance value after the parallel connection of the first power supply line 130 and the first common electrode 120. In some embodiments, since the first common electrode 120 is made of, for example, a transparent conductive oxide material and the first power supply line 130 is made of a metal material, the resistance value of the first common electrode 120 is much larger than that of the first power supply line 130. Therefore, the influence of the resistance value of the first common electrode 120 on the resistance value after their parallel connection can be ignored and will not affect the judgment of the test result.

[0060] It should be noted that in the embodiments of the present disclosure, the shapes and sizes of the first test disk 131 and the second test disk 132 are not limited and can be determined according to actual requirements, for example, according to the actual production process and test conditions. For example, the shapes of the first test disk 131 and the second test disk 132 can be rectangular, square, circular or any other shape. The sizes of the first test disk 131 and the second test disk 132 can be greater than or equal to the sizes of the test components of the resistance test equipment to facilitate the test operation. For example, the first test disk 131 and the second test disk 132 can be integrally formed with the first power line 130 (for example, the routing part of the first power line 130), or can be installed on the substrate 110 as independent components. The embodiments of the present disclosure do not limit this.

[0061] For example, the first test disk 131 and / or the second test disk 132 are also configured to be used as bonding pads to bond a circuit board. That is, any one or both of the first test disk 131 and the second test disk 132 can be reused as bonding pads, so as to be used for bonding connection with a separately provided circuit board. For example, when the measured resistance value meets the requirements, a bonding operation is performed on the reused first test disk 131 and / or the second test disk 132.

[0062] Figure 2 It is a schematic plan view of another light-emitting substrate provided by some embodiments of the present disclosure. As Figure 2 shown, except that the overlapping parts of the first common electrode 120 and the first power line 130 are different, and the light-emitting area AA includes a first light-emitting area AA1 and a second light-emitting area AA2, the light-emitting substrate 20 provided in this embodiment is Figure 1 basically the same as the light-emitting substrate 10 shown.

[0063] In this embodiment, as Figure 2 shown, the first common electrode 120 not only covers the parts of the first power line 130 on the upper side and the lower side of the light-emitting area AA, but also covers the part of the first power line 130 on the left side of the light-emitting area AA. The first common electrode 120 and the first power line 130 overlap at the covered parts, thereby making the connection area between the first common electrode 120 and the first power line 130 larger and the signal transmission more stable.

[0064] For example, the light-emitting area AA includes a first light-emitting area AA1 and a second light-emitting area AA2 that are spaced apart from each other. The pixel units 141 in the first light-emitting area AA1 and the second light-emitting area AA2 are all electrically connected to the first common electrode 120. There is one first power line 130, and this one first power line 130 at least partially surrounds the first light-emitting area AA1 and the second light-emitting area AA2.

[0065] In this embodiment, the first light-emitting region AA1 and the second light-emitting region AA2 are independent of each other. Therefore, the light-emitting brightness of the first light-emitting region AA1 and the second light-emitting region AA2 can be controlled separately, so that a light source (such as a vehicle headlight) using the light-emitting substrate 20 has the function of adjustable brightness, and the structure is simple and easy to implement.

[0066] Figure 3A FIG. is a plan view of another light-emitting substrate provided by some embodiments of the present disclosure. Figure 3B is Figure 3A FIG. shows a plan view of the light-emitting substrate without showing the first common electrode. As Figure 3A and Figure 3B shown, the light-emitting substrate 30 further includes a second common electrode 160, at least one second power line 150, a third test pad 151, and a fourth test pad 152. Other structures are substantially the same as those of the light-emitting substrate 10 shown in Figure 1 and will not be described in detail here.

[0067] The second common electrode 160 is disposed on the substrate 110 and at least partially located in the light-emitting region AA. For example, in a direction perpendicular to the substrate 110, the second common electrode 160 is located between the substrate 110 and the first common electrode 120, that is, the second common electrode 160 is closer to the substrate 110 than the first common electrode 120. Therefore, in Figure 3A , the second common electrode 160 is not shown in the figure because it is blocked by the first common electrode 120. For example, the second common electrode 160 is electrically connected to a plurality of pixel units 141 as a common anode. For example, the second common electrode 160 receives a high-voltage signal (such as a VDD signal), and the high-voltage signal can be an appropriate value. The second common electrode 160 uses the received VDD signal as the anode signal of the pixel unit 141, so as to cooperate with the cathode signal provided to the pixel unit 141 through the first common electrode 120 to drive the electroluminescent material in the pixel unit 141 to emit light.

[0068] The second power line 150 is disposed on the substrate 110 and located in the peripheral region Z. For example, the second power line 150 at least partially surrounds the light-emitting region AA, and the first power line 130 at least partially surrounds the second power line 150. The second power line 150 is located between the first power line 130 and the display region AA and is electrically connected to the second common electrode 160. For example, the second power line 150 is a VDD power line, and can transmit a VDD signal (for example, a VDD power supply voltage) to the second common electrode 160, so as to provide an anode signal for each pixel unit 141. For example, in some examples, the second power line 150 is electrically connected to the second common electrode 160 through a connection line disposed on the substrate 110.

[0069] For example, the extending directions of the second power supply line 150 and the first power supply line 130 are substantially the same and insulated from each other, the first power supply line 130 at least partially surrounds the second power supply line 150, and the second power supply line 150 is closer to the light-emitting region AA than the first power supply line 130. This way can avoid signal interference and facilitate the electrical connection between the second power supply line 150 and the second common electrode 160.

[0070] For example, the second common electrode 160 at least partially includes grid lines. For example, in some examples, the second common electrode 160 is a grid line, which is electrically connected to the second power supply line 150 and transmits the VDD signal to each pixel unit 141. For example, the grid line and the second power supply line 150 can be electrically connected through a plurality of connection points. In this way, the resistance of the second common electrode 160 can be effectively reduced, thereby reducing the voltage drop (IR Drop) of the circuit and avoiding affecting the light-emitting effect.

[0071] For example, the first power supply line 130, the second power supply line 150, and the grid lines (i.e., the second common electrode 160) are located on the same layer. For example, the first power supply line 130, the second power supply line 150, and the grid lines can be formed in the same process, and only need to make each component connected or insulated from each other in the aforementioned manner during patterning. This way can simplify the production process and reduce the production cost.

[0072] The third test pad 151 and the fourth test pad 152 are disposed on the substrate 110 and located in the peripheral region Z. The second power supply line 150 is electrically connected to the third test pad 151 and the fourth test pad 152, and the third test pad 151 and the fourth test pad 152 are configured as test points to detect the resistance value of the second power supply line 150. For example, the third test pad 151 and / or the fourth test pad 152 are also configured as bonding pads to bond a circuit board.

[0073] For example, the third test pad 151 and the fourth test pad 152 are located on the same side of the light-emitting region AA (e.g., on the right side in the figure), and are located on the same side of the light-emitting region AA as the first test pad 131 and the second test pad 132. For example, the third test pad 151 and the fourth test pad 152 are respectively located at both ends of the second power supply line 150, so as to facilitate the test of the resistance value of the second power supply line 150 itself. It should be noted that in the embodiments of the present disclosure, the third test pad 151 and the fourth test pad 152 can be located on the same side or opposite sides of the light-emitting region AA, and the embodiments of the present disclosure do not limit this.

[0074] For example, the third test disk 151 and the fourth test disk 152 are not covered by other film layers and are exposed to the air. For the relevant descriptions of the third test disk 151 and the fourth test disk 152, reference can be made to the descriptions of the first test disk 131 and the second test disk 132 in the above text. For the relevant descriptions of testing the resistance value of the second power line 150 itself, reference can be made to the descriptions of testing the resistance value of the first power line 130 itself in the above text, which will not be elaborated here.

[0075] In this embodiment, not only can the resistance value of the first power line 130 be tested, but also the resistance value of the second power line 150 can be tested. Therefore, it is convenient to test and monitor the resistance values of the VSS power line and the VDD power line simultaneously, so as to facilitate finding out abnormal substrates as soon as possible, which helps to improve production efficiency, avoid waste of production resources, and reduce production costs.

[0076] Figure 3C For Figure 3B a partial enlarged view of region B in the Figure 3C As shown, the orthographic projections of multiple pixel units 141 on the substrate 110 are located in the orthographic projections of the grids of the grid lines (i.e., the second common electrode 160) on the substrate 110. In this way, the uniformity of the VDD signal applied to each pixel unit 141 can be better. For example, the light-emitting region AA includes multiple light-emitting units 142 located between the first common electrode 120 and the second common electrode 160 and corresponding to the multiple pixel units 141. For example, the light-emitting unit 142 is prepared by using an organic electroluminescent material, so it can emit light under the action of the VSS signal applied to the first common electrode 120 and the VDD signal applied to the second common electrode 160.

[0077] Figure 4A This is a schematic plan view of another light-emitting substrate provided by some embodiments of the present disclosure. Figure 4B For Figure 4A a schematic plan view of the light-emitting substrate shown without showing the first common electrode. Except that the overlapping part of the first common electrode 120 and the first power line 130 is different, the light-emitting region AA includes a first light-emitting region AA1 and a second light-emitting region AA2, and further includes a first test disk 001 and a second test disk 002, the light-emitting substrate 40 provided in this embodiment is Figure 3A and Figure 3B substantially the same as the light-emitting substrate 30 shown.

[0078] In this embodiment, the overlapping part of the first common electrode 120 and the first power line 130, and the setting manners of the first light-emitting region AA1 and the second light-emitting region AA2 are Figure 2 substantially the same as those of the light-emitting substrate 20 shown, and reference can be made to the relevant descriptions, which will not be elaborated here.

[0079] AsFigure 4A and Figure 4B As shown, in this embodiment, the light-emitting substrate 40 further includes a first test standby disk 001 and a second test standby disk 002. The first test standby disk 001 is electrically connected to the first test disk 131 and is on the same side of the light-emitting area AA as the first test disk 131. The second test standby disk 002 is electrically connected to the second test disk 132 and is on the same side of the light-emitting area AA as the second test disk 132. For example, the first test standby disk 001 and the second test standby disk 002 are configured as test points to detect the resistance value of the first power supply line 130. For example, the first test standby disk 001 and the second test standby disk 002 are not covered by other film layers and are exposed to the air.

[0080] By providing the first test standby disk 001 and the second test standby disk 002, when the first test disk 131 and the second test disk 132 are blocked due to process condition limitations, the resistance value of the first power supply line 130 can still be tested. For example, in the case of bonding the first test disk 131 and the second test disk 132 to a circuit board, it is difficult to test the resistance value through the first test disk 131 and the second test disk 132. At this time, using the first test standby disk 001 and the second test standby disk 002 as test points and using any applicable resistance testing equipment (such as a multimeter, a DC single-arm bridge circuit, etc.) to test the resistance value between the first test standby disk 001 and the second test standby disk 002, that is, the resistance value of the first power supply line 130 can be conveniently tested.

[0081] It should be noted that in the embodiments of the present disclosure, the shape, size, position, etc. of the first test standby disk 001 and the second test standby disk 002 are not limited and can be determined according to actual needs, for example, according to actual production processes and test conditions. For example, the shape of the first test standby disk 001 and the second test standby disk 002 can be rectangular, square, circular or any other shape. The size of the first test standby disk 001 and the second test standby disk 002 can be greater than or equal to the size of the test components of the resistance testing equipment to facilitate the testing operation. For example, the first test standby disk 001 and the second test standby disk 002 can be formed in the same process as the first test disk 131 and the second test disk 132, or can be installed on the substrate 110 as independent components, and the embodiments of the present disclosure do not limit this.

[0082] For example, in this embodiment, the second common electrode 160 includes two parts spaced apart from each other, namely 160a and 160b. In this way, by only providing the second common electrodes 160a and 160b at the positions corresponding to the AA area, materials can be saved. Of course, the embodiments of the present disclosure are not limited to this, and the setting manner of the second common electrode 160 as shown in Figure 3B can also be adopted, which can be determined according to actual needs, and the embodiments of the present disclosure do not limit this.

[0083] Figure 4C As shown Figure 4A in the cross-sectional schematic view of the light-emitting substrate along Q-Q'. As Figure 4C shown, the light-emitting substrate 40 includes a metal layer 170, an insulating layer 180, an anode layer 190, a pixel defining layer 210, and an electroluminescent material layer 220 that are sequentially disposed on a substrate 110.

[0084] For example, the metal layer 170 is disposed on the substrate 110 and includes a first power line 130, a second power line 150, and a second common electrode 160. For example, the metal layer 170 is formed by sputtering and etching. That is, first, a layer of metal is sputtered on the substrate 110, and then the first power line 130, the second power line 150, and the second common electrode 160 are formed by exposure, development, and etching. The setting method and connection relationship of the first power line 130, the second power line 150, and the second common electrode 160 can refer to the foregoing content and will not be elaborated here. Setting the first power line 130, the second power line 150, and the second common electrode 160 on the same layer, that is, all disposed in the metal layer 170, can simplify the production process and reduce the production cost.

[0085] For example, the metal layer 170 can adopt a single-layer structure or a composite-layer structure, and can adopt any suitable metal materials such as copper and copper alloys, aluminum and aluminum alloys, titanium and titanium alloys, etc. The embodiments of the present disclosure do not limit this.

[0086] For example, in some examples, the metal layer 170 is a composite-layer structure of titanium / aluminum / titanium (Ti / Al / Ti). In the subsequent etching process of the anode layer 190, the aluminum in the first power line 130 in the metal layer 170 is easily affected by the etching solution and there is a risk of mis-etching. Therefore, by detecting the resistance value of the first power line 130 in the metal layer 170, abnormal substrates can be found as soon as possible, which helps to improve the production efficiency, avoid waste of production resources, and reduce the production cost.

[0087] For example, the insulating layer 180 covers the second common electrode 160 and the second power line 150. The insulating layer 180 does not cover the third test pad 151 and the fourth test pad 152, so as to expose the third test pad 151 and the fourth test pad 152 to the air, thereby facilitating resistance testing and bonding operations. For example, the insulating layer 180 can be prepared from inorganic or organic insulating materials.

[0088] For example, the anode layer 190 is disposed on the insulating layer 180. The anode layer 190 is electrically connected to the second common electrode 160 through the connection portion 191 and the via 181 in the insulating layer 180, so that the VDD signal transmitted from the second power supply line 150 to the second common electrode 160 can be received. For example, the anode layer 190 can be prepared using a metal material or a transparent conductive material (such as Indium Tin Oxide (ITO)).

[0089] For example, the connection portion 191 can be prepared using ITO to prevent short - circuit of the entire substrate. For example, when a certain pixel unit 141 experiences a short - circuit due to process defects or other factors, the instantaneous current on the connection portion 191 corresponding to the pixel unit 141 will increase sharply, releasing a relatively high amount of heat, which can cause the connection portion 191 to fuse, thereby cutting off the connection between the pixel unit 141 and the second common electrode 160 and avoiding affecting the normal operation of other pixel units 141.

[0090] For example, the pixel defining layer 210 is disposed on the connection portion 191 to define a plurality of pixel units 141. The electroluminescent material layer 220 is disposed on the anode layer 190 and within the area defined by the pixel defining layer 210. For example, the electroluminescent material layer 220 can be prepared using an organic electroluminescent material or other suitable materials, and can emit white light, red light, yellow light, or any other color of light under the action of voltage. The embodiments of the present disclosure are not limited thereto.

[0091] For example, the first common electrode 120 is disposed as a common cathode on the pixel defining layer 210, the electroluminescent material layer 220, and the insulating layer 180, and is overlapped with the first power supply line 130. For example, the first common electrode 120 does not cover the first test pad 131 and the second test pad 132, so as to expose the first test pad 131 and the second test pad 132 to the air, thereby facilitating resistance testing and bonding operations. For example, the first common electrode 120 can be prepared using a transparent conductive material, such as ITO, Indium Zinc Oxide (IZO), etc. The embodiments of the present disclosure are not limited thereto.

[0092] For example, as Figure 4CAs shown, the first common electrode 120 covers the electroluminescent material layer 220 and extends all the way to the first power supply line 130, thereby overlapping with the first power supply line 130 to achieve electrical connection. During operation, the first power supply line 130 transmits the VSS signal to the first common electrode 120, and the second power supply line 150 transmits the VDD signal to the anode layer 190 through the second common electrode 160 and the connection part 191 in sequence, so that the electroluminescent material layer 220 can emit light under the action of the VSS signal and the VDD signal. For example, in this light-emitting substrate 40, each film layer constitutes a top-emitting structure, thereby improving the light-emitting efficiency.

[0093] It should be noted that in the embodiments of the present disclosure, the light-emitting substrate 40 is not limited to Figure 4C the structure shown, and may further include other film layers and components. The setting methods of each film layer and component can refer to the conventional design or be determined according to actual needs, and the embodiments of the present disclosure do not limit this.

[0094] Figure 5 This is a schematic plan view of another light-emitting substrate provided by some embodiments of the present disclosure. As Figure 5 shown, the first power supply line 130 at least partially surrounds the light-emitting area AA, and the first test pad 131 and the second test pad 132 are located on opposite sides of the light-emitting area AA (for example, on the left and right sides in the figure respectively). The other structures of this light-emitting substrate 50 are basically the same as those of Figure 1 the light-emitting substrate 10 shown, and will not be described in detail here.

[0095] Figure 6 This is a schematic plan view of another light-emitting substrate provided by some embodiments of the present disclosure. As Figure 6 shown, this light-emitting substrate 60 includes two first power supply lines 130, namely the first power supply line 130a and the first power supply line 130b. Correspondingly, the light-emitting area AA includes a first light-emitting area AA1 and a second light-emitting area AA2 that are spaced apart from each other, and the first common electrode 120 includes two first common electrodes 121 and 122.

[0096] For example, the first power supply line 130a and the first power supply line 130b are respectively located on one side of the first light-emitting area AA1 away from the second light-emitting area AA2 and on one side of the second light-emitting area AA2 away from the first light-emitting area AA1 (for example, on the upper and lower sides in the figure respectively). The first power supply line 130a located on one side of the first light-emitting area AA1 away from the second light-emitting area AA2 is electrically connected to the first common electrode 121 covering the first light-emitting area AA1; the first power supply line 130b located on one side of the second light-emitting area AA2 away from the first light-emitting area AA1 is electrically connected to the first common electrode 122 covering the second light-emitting area AA2. For example, the first common electrode 121 and the first common electrode 122 are insulated from each other.

[0097] For example, the structure formed by the first power supply line 130a, the first common electrode 121, and the first light-emitting region AA1 is symmetric to the structure formed by the first power supply line 130b, the first common electrode 122, and the second light-emitting region AA2, for example, axially symmetric about the horizontal central axis of the light-emitting substrate 60. Of course, the embodiments of the present disclosure are not limited thereto, and the above two structures may also adopt other asymmetric setting methods, which can be determined according to actual needs.

[0098] For example, in this embodiment, the light-emitting substrate 60 includes two first test disks and two second test disks, namely the first test disks 131 and 133, and the second test disks 132 and 134 respectively. The first test disk 131 and the first test disk 133 are located on the same side of the light-emitting substrate 60 (the same side of the light-emitting region AA), and the second test disk 132 and the second test disk 134 are located on the other side of the light-emitting substrate 60 (the other side of the light-emitting region AA). This setting method is beneficial to performing test and bonding operations.

[0099] In this embodiment, the first light-emitting region AA1 and the second light-emitting region AA2 are independent of each other. Therefore, the light-emitting brightness of the first light-emitting region AA1 and the second light-emitting region AA2 can be controlled separately, so that the light source (such as a vehicle headlight) using the light-emitting substrate 60 has the function of adjustable brightness, and the structure is simple and easy to implement.

[0100] The features of the first power supply line 130a / 130b, the first common electrode 121 / 122, the first light-emitting region AA1, the second light-emitting region AA2, the first test disk 131 / 133, and the second test disk 132 / 134 in this embodiment are basically the same as the corresponding structures in the light-emitting substrate of the foregoing embodiment. For a detailed description, reference may be made to the above description, and details are not described herein again.

[0101] Figure 7A A schematic plan view of another light-emitting substrate provided in some embodiments of the present disclosure. Except that it further includes a second power supply line 150, the light-emitting substrate 70 of this embodiment is Figure 6 substantially the same as the shown light-emitting substrate 60.

[0102] In this embodiment, the light-emitting substrate 70 further includes two second power supply lines 150, namely the second power supply line 150a and the second power supply line 150b. For example, in some examples, the second power supply line 150 is electrically connected to the second common electrode through a connection line provided on the substrate 110.

[0103] For example, two second power supply lines 150a and 150b are respectively located on one side of the first light-emitting region AA1 away from the second light-emitting region AA2 and on one side of the second light-emitting region AA2 away from the first light-emitting region AA1 (for example, on the upper side and the lower side in the figure respectively). The second power supply line 150 at least partially surrounds the light-emitting region AA. For example, the second power supply line 150a at least partially surrounds the first light-emitting region AA1, and the second power supply line 150b at least partially surrounds the second light-emitting region AA2.

[0104] For example, the extending directions of the second power supply line 150a and the first power supply line 130a are substantially the same and insulated from each other. The first power supply line 130a at least partially surrounds the second power supply line 150a, and the second power supply line 150a is closer to the first light-emitting region AA1 than the first power supply line 130a. Similarly, the extending directions of the second power supply line 150b and the first power supply line 130b are substantially the same and insulated from each other. The first power supply line 130b at least partially surrounds the second power supply line 150b, and the second power supply line 150b is closer to the second light-emitting region AA2 than the first power supply line 130b. This way can avoid signal interference and facilitate the electrical connection between the second power supply line 150a / 150b and the corresponding second common electrode.

[0105] For example, the third test pads 151 and the fourth test pads 152 are respectively located on opposite sides of the first light-emitting region AA1 (for example, on the left side and the right side in the figure respectively). For example, the third test pads 151 and the fourth test pads 152 are respectively located at both ends of the second power supply line 150a, so as to facilitate the test of the resistance value of the second power supply line 150a itself. Similarly, the third test pads 153 and the fourth test pads 154 are also arranged in a similar way, which will not be elaborated here.

[0106] For example, the third test pads 151 / 153 and the fourth test pads 152 / 154 are not covered by other film layers and are exposed to the air. For the relevant descriptions of the third test pads 151 / 153 and the fourth test pads 152 / 154, reference can be made to the descriptions of the first test pads 131 / 133 and the second test pads 132 / 134 in the above text. For the relevant descriptions of the test of the resistance value of the second power supply line 150 itself, reference can be made to the descriptions of the test of the resistance value of the first power supply line 130 itself in the above text, which will not be elaborated here.

[0107] For example, the first test pads 131 / 133 and the third test pads 151 / 153 are located on the same side of the light-emitting substrate 70 (the same side of the light-emitting region AA), the second test pads 132 / 134 and the fourth test pads 152 / 154 are located on the same side of the light-emitting substrate 70 (the same side of the light-emitting region AA), and the first test pads 131 / 133 and the second test pads 132 / 134 are located on different sides of the light-emitting substrate 70 (different sides of the light-emitting region AA). This setting method is beneficial for testing and bonding operations.

[0108] It should be noted that, in the embodiment of the present disclosure, the number of the second power lines 150 can be any number, such as 1, 3, 4, etc. Figure 7A Only the case where there are two second power lines 150 is shown, but this does not constitute a limitation on the embodiments of the present disclosure. For example, in other examples, only one second power line 150 may be provided, and the second power line 150 may be provided in the following manner: Figure 5 In the array substrate 50 shown in FIG. 1 , the second power line 150 is arranged in the same manner as in FIG. Figure 7A The second power lines 150a / 150b shown are similar.

[0109] It should be noted that in the embodiments of the present disclosure, the third test trays 151 / 153 and the fourth test trays 152 / 154 may not be provided. That is, there is no need to test the resistance value of the second power line 150, and only the resistance value of the first power line 130 may be tested. In a top-emission OLED light-emitting substrate, the risk of mis-etching the second power line 150 is low due to the influence of the process sequence. Therefore, the resistance value of the second power line 150 can be omitted to simplify the production process.

[0110] Figure 7B for Figure 7A The light emitting substrate shown in FIG. 1 does not show a plan view of the first common electrode. Figure 7B As shown, the light emitting substrate 70 further includes a second common electrode 160 , and the first power line 130 , the second power line 150 and the second common electrode 160 are all disposed on the base substrate 110 .

[0111] For example, the second power line 150 is electrically connected to the second common electrode 160, that is, the second power line 150a is electrically connected to the second common electrode 160a, and the second power line 150b is electrically connected to the second common electrode 160b. The second power line 150 transmits the received VDD signal to the second common electrode 160, and the second common electrode 160 transmits the VDD signal to each pixel unit 141 as an anode signal, thereby cooperating with the cathode signal provided to the pixel unit 141 via the first power line 130 and the first common electrode 120 to drive the electroluminescent material in each pixel unit 141 to emit light.

[0112] It should be noted that Figure 7B The light emitting substrate 70 includes two second common electrodes 160, but this does not constitute a limitation on the embodiments of the present disclosure. For example, in other examples, when the light emitting substrate is Figure 5When the light-emitting substrate 50 shown is used, a second common electrode 160 can also be provided. For example, the number of the second common electrodes 160 can be determined according to the number of the second power lines 150 and the number of the light-emitting regions AA, and the embodiments of the present disclosure do not limit this.

[0113] The second common electrode 160 is located in the light-emitting region AA. That is, the second common electrode 160a is located in the first light-emitting region AA1, and the second common electrode 160b is located in the second light-emitting region AA2. For example, the second common electrode 160 is disposed opposite to the first common electrode 120 in a direction perpendicular to the substrate 110.

[0114] At least one embodiment of the present disclosure further provides an electronic device, including the light-emitting substrate as described in any embodiment of the present disclosure. This electronic device facilitates the testing and monitoring of the resistance value of the peripheral traces (such as the VSS power line) in the light-emitting substrate, so as to facilitate quickly finding out the abnormal substrate, helping to improve production efficiency, avoiding waste of production resources, and reducing production costs.

[0115] Figure 8 It is a schematic block diagram of an electronic device provided by some embodiments of the present disclosure. As Figure 8 shown, the electronic device 80 includes a light-emitting substrate 810, and the light-emitting substrate 810 can be the aforementioned light-emitting substrate 10 / 20 / 30 / 40 / 50 / 60 / 70. For example, the electronic device 80 can be a vehicle headlight, an indoor lighting lamp or other forms of light sources, or can also be a display device with a simple display function, and the embodiments of the present disclosure do not limit this. For example, the electronic device 80 can further include other components, such as a control circuit, a power supply, etc., which can be determined according to actual needs, and the embodiments of the present disclosure do not limit this.

[0116] For example, the resistance test is performed on the light-emitting substrate 810 in the electronic device 80 during the production process and meets the requirements, that is, the resistance value of the first power line 130 and / or the second power line 150 is within a reasonable range. Therefore, the light-emitting substrate 810 is bonded, packaged, and assembled with other components to form the electronic device 80. For the detailed description and technical effects of the electronic device 80, reference can be made to the description of the light-emitting substrate 10 / 20 / 30 / 40 / 50 / 60 / 70 above, and details are not described herein again.

[0117] At least one embodiment of the present disclosure further provides a preparation method of a light-emitting substrate, which can be used to prepare the light-emitting substrate as described in any embodiment of the present disclosure. By using this preparation method, the resistance value of the peripheral traces (such as the VSS power line) in the light-emitting substrate can be tested and monitored, so as to facilitate quickly finding out the abnormal substrate, helping to improve production efficiency, avoiding waste of production resources, and reducing production costs.

[0118] Figure 9 Schematic flow chart of a method for preparing a light-emitting substrate provided by some embodiments of the present disclosure. For example, as Figure 9 shown, in some examples, the preparation method includes the following operations:

[0119] Step S10: Form at least one first power line 130, a first test pad 131, and a second test pad 132 on the substrate 110;

[0120] Step S20: Form at least a part of the first common electrode 120 located in the light-emitting region AA on the substrate 110;

[0121] Step S30: Use the first test pad 131 and the second test pad 132 as test points to detect the resistance value of the first power line 130.

[0122] Figure 10 Schematic flow chart of another method for preparing a light-emitting substrate provided by some embodiments of the present disclosure. For example, in some examples, as Figure 10 shown, in addition to including steps similar to steps S10 - S30 shown in Figure 9 shown, the preparation method further includes:

[0123] Step S40: If the resistance value meets the requirements (for example, within a reasonable range), perform a bonding operation on the light-emitting substrate.

[0124] Through the above method, the resistance value of the first power line 130 (such as the VSS power line) in the light-emitting substrate can be tested and monitored, so as to quickly find out abnormal substrates during the preparation process of the light-emitting substrate, prevent abnormal substrates from entering the subsequent production process, thereby helping to improve production efficiency, avoid waste of production resources, and reduce production costs.

[0125] It should be noted that in the embodiments of the present disclosure, the preparation method is not limited to the steps and sequences described above, and may further include more steps. The execution sequence of these steps can be determined according to actual needs, and the embodiments of the present disclosure do not limit this. For example, the preparation method may further include steps such as testing the resistance value of the second power line 150, so as to monitor the resistance value of the second power line 150. For the detailed description and technical effects of the preparation method, reference can be made to the description of the light-emitting substrate 10 / 20 / 30 / 40 / 50 / 60 / 70 above, which will not be elaborated here.

[0126] The following points need to be noted:

[0127] (1) The drawings of the embodiments of the present disclosure only relate to the structures involved in the embodiments of the present disclosure, and other structures can refer to the general design.

[0128] (2) Without conflict, the embodiments of the present disclosure and the features in the embodiments may be combined with each other to obtain new embodiments.

[0129] As described above, it is only the specific implementation manner of the present disclosure, but the protection scope of the present disclosure is not limited thereto. The protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A light-emitting substrate, comprising: A substrate, including a light-emitting region and a peripheral region surrounding the light-emitting region; A first common electrode disposed on the substrate and at least partially located in the light-emitting region; At least one first power line disposed on the substrate and located in the peripheral region, electrically connected to the first common electrode; And A first test pad and a second test pad disposed on the substrate and located in the peripheral region; Wherein, the first power line is electrically connected to the first test pad and the second test pad, and the first test pad and the second test pad are configured to be used as test points to detect the resistance value of the first power line.

2. The light-emitting substrate according to claim 1, wherein, The first test pad and / or the second test pad are further configured to be used as bonding pads to bond a circuit board.

3. The light-emitting substrate according to claim 1, wherein, The first common electrode at least partially covers the first power line.

4. The light-emitting substrate according to claim 1, wherein, The light-emitting region is located within the orthographic projection of the first common electrode on the substrate.

5. The light-emitting substrate according to claim 1, further comprising a pixel array, Among them, The pixel array includes a plurality of pixel units, and the first common electrode is used as a common cathode and electrically connected to the plurality of pixel units.

6. The light-emitting substrate according to any one of claims 1-4, wherein, The first test pad and the second test pad are located on the same side or opposite sides of the light-emitting region.

7. The light-emitting substrate according to claim 6, further comprising a first standby test pad and a second standby test pad, Among them, The first standby test pad is electrically connected to the first test pad and is located on the same side of the light-emitting region as the first test pad, The second standby test pad is electrically connected to the second test pad and is located on the same side of the light-emitting region as the second test pad, The first standby test pad and the second standby test pad are configured to be used as test points to detect the resistance value of the first power line.

8. The light-emitting substrate according to any one of claims 1-4, wherein, The first power line at least partially surrounds the light-emitting region.

9. The light-emitting substrate according to claim 8, wherein, The at least one first power line includes one first power line, The light-emitting region includes a first light-emitting region and a second light-emitting region spaced apart from each other, The one first power line at least partially surrounds the first light-emitting region and the second light-emitting region.

10. The light-emitting substrate according to claim 8, wherein, The at least one first power line includes two first power lines, The light-emitting region includes a first light-emitting region and a second light-emitting region spaced apart from each other, The two first power lines are respectively located on one side of the first light-emitting region away from the second light-emitting region and on one side of the second light-emitting region away from the first light-emitting region.

11. The light-emitting substrate according to any one of claims 1-4, further comprising: A second common electrode disposed on the substrate and at least partially located in the light-emitting region, wherein the second common electrode is located between the substrate and the first common electrode; At least one second power line disposed on the substrate and located in the peripheral region, wherein the at least one second power line is located between the first power line and the light-emitting region and is electrically connected to the second common electrode; and A third test pad and a fourth test pad disposed on the substrate and located in the peripheral region; Wherein, the second power line is electrically connected to the third test disk and the fourth test disk, and the third test disk and the fourth test disk are configured as test points to detect the resistance value of the second power line.

12. The light-emitting substrate according to claim 11, wherein, The third test disk and / or the fourth test disk are further configured as bonding disks to bond a circuit board.

13. The light-emitting substrate according to claim 11, wherein, The third test disk and the fourth test disk are located on the same side or opposite sides of the light-emitting region.

14. The light-emitting substrate according to claim 11, wherein, The first test disk, the second test disk, the third test disk and the fourth test disk are located on the same side of the light-emitting region.

15. The light-emitting substrate according to claim 11, wherein, The at least one second power line includes two second power lines. The light-emitting region includes a first light-emitting region and a second light-emitting region spaced apart from each other. The two second power lines are respectively located on one side of the first light-emitting region away from the second light-emitting region and on one side of the second light-emitting region away from the first light-emitting region.

16. The light-emitting substrate according to claim 11, wherein, The second common electrode at least partially includes grid lines. The first power line, the second power line and the grid lines are located on the same layer.

17. The light-emitting substrate according to claim 16, further comprising a pixel array. Among them, The pixel array includes a plurality of pixel units, and the second common electrode is electrically connected to the plurality of pixel units as a common anode.

18. The light-emitting substrate according to claim 17, wherein, The orthographic projection of the plurality of pixel units on the substrate is located within the orthographic projection of the grid of the grid lines on the substrate.

19. The light-emitting substrate according to claim 11, further comprising a metal layer. Among them, The metal layer includes the first power line, the second power line and the second common electrode, and the metal layer has a composite layer structure of titanium / aluminum / titanium.

20. An electronic device, comprising the light-emitting substrate according to any one of claims 1-19.

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